CN106568342B - Composite structure and heat conducting device of flat heat pipe - Google Patents
Composite structure and heat conducting device of flat heat pipe Download PDFInfo
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- CN106568342B CN106568342B CN201510669080.4A CN201510669080A CN106568342B CN 106568342 B CN106568342 B CN 106568342B CN 201510669080 A CN201510669080 A CN 201510669080A CN 106568342 B CN106568342 B CN 106568342B
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- 239000002131 composite material Substances 0.000 title claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000012530 fluid Substances 0.000 claims abstract description 8
- 238000005096 rolling process Methods 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 150000001875 compounds Chemical group 0.000 claims 2
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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Abstract
本发明公开一种平板热管的复合式结构及导热装置，该复合式结构包括管体、密封段、绝热段及导热段。管体包含金属壳板及容腔；密封段通过碾压金属壳板而使管体的相对的二内壁面紧密结合，并区隔容腔为第一腔室及第二腔室；绝热段位在密封段的一侧，为包含第一腔室的中空腔室；导热段位在密封段的另一侧，导热段包含第二腔室、毛细组织及工作流体；导热装置包括散热壳体、发热组件及平板热管，平板热管设置在散热壳体内并热导接发热组件；据此，发热组件的热不会聚集在散热壳体，以避免使用者触及高温壳体。
The present invention discloses a composite structure of a flat heat pipe and a heat conduction device, the composite structure includes a pipe body, a sealing section, an insulating section and a heat conduction section. The pipe body includes a metal shell plate and a cavity; the sealing section tightly combines two opposite inner wall surfaces of the pipe body by rolling the metal shell plate, and separates the cavity into a first chamber and a second chamber; the insulating section is located on one side of the sealing section, and is a hollow chamber including the first chamber; the heat conduction section is located on the other side of the sealing section, and the heat conduction section includes a second chamber, a capillary structure and a working fluid; the heat conduction device includes a heat dissipation shell, a heating component and a flat heat pipe, the flat heat pipe is arranged in the heat dissipation shell and is thermally connected to the heating component; accordingly, the heat of the heating component will not be gathered in the heat dissipation shell, so as to avoid the user from touching the high-temperature shell.
Description
技术领域technical field
本发明有关于一种热管，尤指一种平板热管的结构。The invention relates to a heat pipe, in particular to a structure of a flat heat pipe.
背景技术Background technique
由于热管(Heat pipe)有高热传能力、重量轻及结构简单等特性，并可传递大量的热量又不消耗电力，现已广泛地应用于手持式通讯装置的导热上，以借由热管来快速导离电子发热的热量。另外，由于平板热管(Plate Heat Pipe)较不占空间，因此更适于设置在薄型化的电子产品中。Due to the high heat transfer capacity, light weight and simple structure of the heat pipe, and the ability to transfer a large amount of heat without consuming power, it has been widely used in the heat conduction of handheld communication devices, so that the heat pipe can be used to quickly Dissipate heat generated by electrons. In addition, since the plate heat pipe takes up less space, it is more suitable for being disposed in thinner electronic products.
一般来说，平板热管在使用时，通常是一端作为蒸发部、另一端作为冷凝部。将蒸发部贴在发热电子组件上，遇热后内部的工作流体能快速汽化，并朝向较低温的冷凝部传递，以通过散热组件(如壳体或鳍片)释放热量。然而，当平板热管应用在薄型化的手持式电子装置(如行电话或平板计算机等)时，由于薄型化的电子产品的厚度较薄，平板热管的蒸发部的另一侧面较接近壳体表面。因此，平板热管对发热电子组件传热时会导致壳体表面温度较高。在此状况下，当使用者触及到高温壳体时极可能会受伤。Generally speaking, when the flat heat pipe is used, one end is usually used as the evaporation part, and the other end is used as the condensation part. The evaporating part is pasted on the heat-generating electronic component, and the internal working fluid can quickly vaporize after being heated, and transfer to the lower-temperature condensing part to release heat through the heat-dissipating component (such as the shell or fins). However, when the flat heat pipe is applied to a thinned handheld electronic device (such as a line phone or a tablet computer, etc.), the other side of the evaporation part of the flat heat pipe is closer to the shell surface due to the thinner electronic product. . Therefore, when the flat heat pipe transfers heat to the heat-generating electronic components, the surface temperature of the shell will be higher. In this situation, the user is likely to be injured when touching the high-temperature casing.
发明内容Contents of the invention
本发明的一目的在于提供一种平板热管的复合式结构及导热装置，以使发热组件的热不致聚集在散热壳体的表面，避免使用者触及到高温壳体。An object of the present invention is to provide a composite structure of a flat heat pipe and a heat conduction device, so that the heat of the heating element does not accumulate on the surface of the heat dissipation housing and prevents users from touching the high temperature housing.
为了达成上述的目的，本发明为一种平板热管的复合式结构，包括管体、密封段、绝热段及导热段。管体包含金属壳板及由金属壳板所围合形成的容腔；密封段通过碾压金属壳板而使管体的相对的二内壁面紧密结合所形成，密封段区隔容腔为第一腔室及第二腔室；绝热段位在管体的密封段的一侧，绝热段为包含第一腔室的中空腔室；导热段位在管体的密封段的另一侧，导热段包含第二腔室、设置在第二腔室的内壁面的毛细组织及填入在第二腔室中的工作流体。In order to achieve the above objectives, the present invention is a composite structure of a flat heat pipe, which includes a pipe body, a sealing section, a heat insulating section and a heat conducting section. The pipe body includes a metal shell plate and a cavity enclosed by the metal shell plate; the sealing section is formed by rolling the metal shell plate so that the two opposite inner walls of the pipe body are tightly combined, and the sealing section separates the cavity as the second A chamber and a second chamber; the heat-insulating section is on one side of the sealing section of the pipe body, and the heat-insulating section is a hollow chamber containing the first chamber; the heat-conducting section is on the other side of the sealing section of the pipe body, and the heat-conducting section includes The second chamber, the capillary tissue arranged on the inner wall of the second chamber, and the working fluid filled in the second chamber.
为了达成上述的目的，本发明为一种导热装置，包括散热壳体、发热组件及平板热管。散热壳体具有安装空间；发热组件放置在安装空间中；平板热管设置在安装空间中并热导接发热组件，包括管体、密封段、绝热段及导热段。管体包含金属壳板及由金属壳板所围合形成的容腔；密封段通过碾压金属壳板而使管体的相对的二内壁面紧密结合所形成，密封段区隔容腔为第一腔室及第二腔室；绝热段位在管体的密封段的一侧，绝热段为包含第一腔室的中空腔室；导热段位在管体的密封段的另一侧，导热段包含第二腔室、设置在第二腔室的内壁面的毛细组织及填入在第二腔室中的工作流体。In order to achieve the above object, the present invention is a heat conduction device, which includes a heat dissipation housing, a heat generating component and a flat heat pipe. The heat dissipation shell has an installation space; the heating component is placed in the installation space; the flat heat pipe is arranged in the installation space and thermally connected to the heating component, including a pipe body, a sealing section, a heat insulating section and a heat conducting section. The pipe body includes a metal shell plate and a cavity enclosed by the metal shell plate; the sealing section is formed by rolling the metal shell plate so that the two opposite inner walls of the pipe body are tightly combined, and the sealing section separates the cavity as the second A chamber and a second chamber; the heat-insulating section is on one side of the sealing section of the pipe body, and the heat-insulating section is a hollow chamber containing the first chamber; the heat-conducting section is on the other side of the sealing section of the pipe body, and the heat-conducting section includes The second chamber, the capillary tissue arranged on the inner wall of the second chamber, and the working fluid filled in the second chamber.
本发明的另一目的，在于提供一种导热装置，其将发热组件部分贴接绝热段、部分贴接导热段，借由导热段 (热管结构)的传导效率较快而提升导热速率，且不致聚集在散热壳体而产生局部高温。Another object of the present invention is to provide a heat conduction device, which attaches the heat-generating component partly to the heat insulating section and partly to the heat conduction section, and improves the heat conduction rate by virtue of the faster conduction efficiency of the heat conduction section (heat pipe structure) without causing Gather in the heat dissipation shell to generate local high temperature.
本发明具有的优点在于：The present invention has the advantage that:
相较于现有技术，本发明的平板热管的复合式结构包含绝热段及导热段，其中，绝热段为中空腔室，导热段为热管。本发明的平板热管应用在导热装置时，其将绝热段的一侧面贴接发热组件，但由于中空腔室具有绝热效果，进一步可辅以抽真空或填入其他材料增强绝热效果，因此发热组件的热大部分会通过管体传导至导热段，故发热组件的热不会聚集在绝热段的另一面(接近散热壳体的一面)，据此，散热壳体的表面不致特别高热，以避免在散热壳体的表面出现局部高温的现象，以避免让使用者触及到高温壳体。Compared with the prior art, the composite structure of the flat heat pipe of the present invention includes a heat insulation section and a heat conduction section, wherein the heat insulation section is a hollow chamber, and the heat conduction section is a heat pipe. When the flat heat pipe of the present invention is applied to a heat conduction device, one side of the heat-insulating section is attached to the heat-generating component. However, since the hollow chamber has a heat-insulating effect, it can be further supplemented by vacuuming or filling other materials to enhance the heat-insulating effect. Therefore, the heat-generating component Most of the heat will be conducted to the heat-conducting section through the tube body, so the heat of the heating component will not gather on the other side of the heat-insulating section (the side close to the heat-dissipating shell). A phenomenon of local high temperature appears on the surface of the heat dissipation housing, so as to prevent the user from touching the high temperature housing.
附图说明Description of drawings
图1为本发明的平板热管的复合式结构的剖视图﹔Fig. 1 is the sectional view of the composite structure of flat heat pipe of the present invention;
图2为本发明的导热装置的剖面示意图﹔Fig. 2 is a schematic cross-sectional view of the heat conduction device of the present invention;
图3为本发明的导热装置的另一设置样态图；Fig. 3 is another configuration diagram of the heat conduction device of the present invention;
图4为本发明的平板热管第二实施例的剖视图。Fig. 4 is a cross-sectional view of the second embodiment of the flat heat pipe of the present invention.
图中：In the picture:
1、1a…平板热管；1. 1a... flat heat pipe;
2…导热装置；2... heat conduction device;
10、10a…管体；10, 10a... pipe body;
100…容腔；100... cavity;
101…第一腔室；101...the first chamber;
102…第二腔室；102... second chamber;
11…金属壳板；11... metal shell plate;
20、20a…密封段；20, 20a... sealing section;
30、30a…绝热段；30, 30a... adiabatic section;
40、40a…导热段；40, 40a... heat conduction section;
41…毛细组织；41… capillary tissue;
42…工作流体；42 ... working fluid;
50…散热壳体；50...radiating shell;
500…间隙；500 ... clearance;
60…发热组件。60...Heating components.
具体实施方式Detailed ways
下面结合附图和具体实施例对本发明作进一步说明，以使本领域的技术人员可以更好的理解本发明并能予以实施，但所举实施例不作为对本发明的限定。The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.
请参照图1，为本发明的平板热管的复合式结构的剖视图。本发明的平板热管1的复合式结构包括一管体10、一密封段20、一绝热段30及一导热段40。该密封段20、绝热段30及导热段40分别形成在该管体10上，据以构成该平板热管1。Please refer to FIG. 1 , which is a cross-sectional view of the composite structure of the flat heat pipe of the present invention. The composite structure of the flat heat pipe 1 of the present invention includes a pipe body 10 , a sealing section 20 , a heat insulating section 30 and a heat conducting section 40 . The sealing section 20 , the heat insulating section 30 and the heat conducting section 40 are respectively formed on the tube body 10 to form the flat heat pipe 1 .
该管体10包含一金属壳板11及由该金属壳板11所围合形成的一容腔100。较佳地，该管体10为一扁平管体，该金属壳板11为一金属铜板。The tube body 10 includes a metal shell 11 and a cavity 100 enclosed by the metal shell 11 . Preferably, the tube body 10 is a flat tube body, and the metal shell plate 11 is a metal copper plate.
该密封段20通过碾压该金属壳板11而形成，其主要使该管体10的相对的二内壁面紧密结合并形成在该管体10上。该密封段20区隔该容腔100为一第一腔室101及一第二腔室102。The sealing section 20 is formed by rolling the metal shell plate 11 , which mainly makes two opposite inner wall surfaces of the pipe body 10 tightly combined and formed on the pipe body 10 . The sealing section 20 partitions the cavity 100 into a first chamber 101 and a second chamber 102 .
再者，该绝热段30位在该管体10的密封段20的一侧。该绝热段30为包含该第一腔室101的一中空腔室。Furthermore, the heat insulating section 30 is located on one side of the sealing section 20 of the pipe body 10 . The insulating section 30 is a hollow chamber including the first chamber 101 .
该导热段40位在该管体10的密封段20的另一侧。该导热段40包含该第二腔室102、设置在该第二腔室102的内壁面的一毛细组织41及填入在该第二腔室102中的一工作流体42。较佳地，该导热段40的长度大于该绝热段30的长度。The heat conducting section 40 is located on the other side of the sealing section 20 of the tube body 10 . The heat conducting section 40 includes the second chamber 102 , a capillary 41 disposed on the inner wall of the second chamber 102 , and a working fluid 42 filled in the second chamber 102 . Preferably, the length of the heat conducting section 40 is greater than the length of the heat insulating section 30 .
于本发明的一实施例中，该平板热管1用于对一手持式电子装置进行导热。更详细说明于后。In an embodiment of the present invention, the flat heat pipe 1 is used to conduct heat to a handheld electronic device. More details are given below.
请续参照图2，为使用本发明的导热装置的剖面示意图。本发明的导热装置2包括如前述的一平板热管1、一散热壳体50及一发热组件60。使用时，该平板热管1贴接该发热组件60，用以对该发热组件60进行导热。另外，该平板热管1所导出的热会再通过该散热壳体50而逸散。Please continue to refer to FIG. 2 , which is a schematic cross-sectional view of the heat conduction device of the present invention. The heat conduction device 2 of the present invention includes a flat heat pipe 1 , a heat dissipation housing 50 and a heat generating component 60 as mentioned above. When in use, the flat heat pipe 1 is attached to the heating component 60 for conducting heat to the heating component 60 . In addition, the heat dissipated by the flat heat pipe 1 will dissipate through the heat dissipation case 50 .
于本发明的一实施例中，该散热壳体50具有一安装空间，该发热组件60放置在该安装空间中。又，该平板热管1设置在该安装空间中并热导接该发热组件60。该平板热管1如前述所述，于此不再赘述。In an embodiment of the present invention, the heat dissipation housing 50 has an installation space, and the heating component 60 is placed in the installation space. Moreover, the flat heat pipe 1 is disposed in the installation space and is thermally connected to the heat generating component 60 . The flat heat pipe 1 is as described above, and will not be repeated here.
于本实施例中，该平板热管1的一侧贴接该发热组件60、另一侧面向该散热壳体50的内壁面。此外，该平板热管1与该散热壳体50的内壁面留有一间隙500。另外，该发热组件60贴接该平板热管1的绝热段30，实际实施时不以此为限制。In this embodiment, one side of the flat heat pipe 1 is attached to the heating component 60 , and the other side faces the inner wall of the heat dissipation housing 50 . In addition, there is a gap 500 between the flat heat pipe 1 and the inner wall of the heat dissipation housing 50 . In addition, the heating component 60 is attached to the heat insulating section 30 of the flat heat pipe 1 , which is not limited in actual implementation.
据此，该发热组件60所产生的热会传导至该绝热段30，再通过该绝热段30而传导至该密封段20及该导热段40。最后，热会再通过该散热壳体50而逸散至外界，借以达到散热的目的。Accordingly, the heat generated by the heating element 60 is conducted to the heat insulating section 30 , and then conducted to the sealing section 20 and the heat conducting section 40 through the heat insulating section 30 . Finally, the heat will dissipate to the outside through the heat dissipation housing 50 to achieve the purpose of heat dissipation.
要说明的是，本发明的绝热段30设置为中空腔室而具有绝热效果。因此，当该绝热段30的一侧面贴接该发热组件60时，该发热组件60所产生的热大部分会通过该管体10传导至该密封段20，再通过该密封段20传导至该导热段40。借此，该发热组件60的热会均匀地传递至该平板热管1，而不会聚集在该绝热段30的另一面(接近该散热壳体50的一面)，据此，该散热壳体50的表面不致特别高热，以避免在该散热壳体50的表面出现局部高温的现象。It should be noted that the heat insulation section 30 of the present invention is set as a hollow chamber and has heat insulation effect. Therefore, when one side of the heat insulating section 30 is attached to the heating element 60, most of the heat generated by the heating element 60 will be conducted to the sealing section 20 through the pipe body 10, and then conducted to the sealing section 20 through the sealing section 20. Heat conduction section 40. In this way, the heat of the heating element 60 will be evenly transferred to the flat heat pipe 1, and will not be gathered on the other side of the heat insulating section 30 (the side close to the heat dissipation shell 50). Accordingly, the heat dissipation shell 50 The surface of the heat dissipation shell 50 is not particularly hot, so as to avoid local high temperature on the surface of the heat dissipation housing 50 .
请另参照图3，为本发明的导热装置的另一设置样态。如图3所示的导热装置与图2大致相同，不同的地方在于平板热管与该发热组件60的热导接位置。于本实施例中，该发热组件60部分贴接该绝热段30、部分贴接该导热段40。该发热组件60所产生的热会部分通过该管体10而传导至该密封段20，部分会直接传导至该导热段40。由于该导热段40(热管结构)的传导效率较快，因此，该发热组件60所产生的热直接通过该导热段40的传递可提升导热速率，使该发热组件60的热可较为快速地传递至该平板热管1，且不致聚集在该散热壳体50而产生局部高温。Please also refer to FIG. 3 , which shows another configuration of the heat conduction device of the present invention. The heat conduction device shown in FIG. 3 is substantially the same as that in FIG. 2 , the difference lies in the heat conduction position between the flat heat pipe and the heating component 60 . In this embodiment, the heating component 60 is partially attached to the heat insulating section 30 and partially attached to the heat conducting section 40 . Part of the heat generated by the heating element 60 is conducted to the sealing section 20 through the tube body 10 , and part is directly conducted to the heat conducting section 40 . Since the conduction efficiency of the heat-conducting section 40 (heat pipe structure) is relatively fast, the heat generated by the heat-generating component 60 can be directly transferred through the heat-conducting section 40 to increase the heat conduction rate, so that the heat of the heat-generating component 60 can be transferred relatively quickly. To the flat heat pipe 1 , and not gather in the heat dissipation shell 50 to generate local high temperature.
请再参照图4，为本发明的平板热管第二实施例的剖视图。本实施例的结构及使用方式与前一实施例大致相同，平板热管1a包括一管体10a、一密封段20a、一绝热段30a及一导热段40a。该密封段20a、绝热段30a及导热段40a分别形成在该管体10a上，据以构成该平板热管1a。本实施例不同的地方在于该密封段20a呈波浪状，其中，波浪状的密封段20a设置借以提供更密合的密封效果，以完全隔绝该绝热段30a及该导热段40a，使该绝热段30a及该导热段40a可保持各自的结构功能。Please refer to FIG. 4 again, which is a cross-sectional view of the second embodiment of the flat heat pipe of the present invention. The structure and usage of this embodiment are substantially the same as those of the previous embodiment. The flat heat pipe 1a includes a tube body 10a, a sealing section 20a, a heat insulating section 30a and a heat conducting section 40a. The sealing section 20a, the heat insulating section 30a and the heat conducting section 40a are respectively formed on the tube body 10a to form the flat heat pipe 1a. The difference of this embodiment is that the sealing section 20a is wave-shaped, wherein the wave-shaped sealing section 20a is set to provide a tighter sealing effect, so as to completely isolate the heat-insulating section 30a and the heat-conducting section 40a, making the heat-insulating section 30a and the heat conducting section 40a can maintain their respective structural functions.
以上所述实施例仅是为充分说明本发明而所举的较佳的实施例，本发明的保护范围不限于此。本技术领域的技术人员在本发明基础上所作的等同替代或变换，均在本发明的保护范围之内。本发明的保护范围以权利要求书为准。The above-mentioned embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present invention shall be determined by the claims.
Claims (10)
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| TWM469730U (en) * | 2013-07-23 | 2014-01-01 | Asia Vital Components Co Ltd | Heat dissipation structure and heat dissipation structure having the same |
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| US6958912B2 (en) * | 2003-11-18 | 2005-10-25 | Intel Corporation | Enhanced heat exchanger |
| TW201348671A (en) * | 2012-05-22 | 2013-12-01 | Foxconn Tech Co Ltd | Heat pipe |
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| TWM469730U (en) * | 2013-07-23 | 2014-01-01 | Asia Vital Components Co Ltd | Heat dissipation structure and heat dissipation structure having the same |
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