CN103874386A - heat sink - Google Patents

Abstract

A heat dissipating double-fuselage, including a first body, a second body and a working fluid, the first body has a first plate and covers a second plate correspondingly, and define a first cavity together, the second body connects the first body, and it has a second cavity and said first cavity communicates correspondingly, said working fluid is packed in the first, cavity; through the design of the structure of the invention, the working fluid circularly flows in the first and second chambers, so that the heat dissipation device has the effect of remote heat dissipation.

Description

heat sink

technical field

The invention relates to a heat dissipation device, in particular to a heat dissipation device with remote heat dissipation effect and increased heat dissipation range.

Background technique

With the rapid progress of the technology industry, the functions of electronic devices are becoming more and more powerful, such as the central processing unit (Central Processing Unit, CPU), the computing speed of the electronic components of the chipset or display unit is also increasing, resulting in the unit time of electronic components The generated heat will be relatively increased; therefore, if the heat emitted by the electronic components cannot be dissipated in time, it will affect the overall operation of the electronic device or cause damage to the electronic components.

Most of the electronic component cooling devices used in the industry dissipate heat through cooling elements such as fans, heat sinks, or heat pipes, and contact the heat source through the heat sink, and then conduct the heat to the remote side through the heat pipe for heat dissipation, or force the airflow to be guided by the fan. The radiator is forced to dissipate heat, and for heat sources with narrow spaces or large areas, the chamber is used as a heat conduction element as a conduction heat source.

The traditional temperature chamber is made by covering two plates correspondingly, and the corresponding sides of the plates are provided with any one of grooves and capillary structures (such as Mesh, sintered body) or the sum of any of them, Correspondingly cover the plates to form a closed chamber, which is in a vacuum state and filled with a working fluid inside, and in order to increase the capillary limit, use copper pillar coating sintering, sintering pillars, foaming pillars and other capillary structures. With the support as the return channel, when the working fluid in the aforementioned vapor chamber is heated by the evaporation zone and evaporates, the working fluid is converted from a liquid state to a vapor state, and the vapor state of the working fluid is condensed into Liquid state, and then flow back to the evaporation area through the copper column to continue the circulation. After the vapor state working fluid is condensed into liquid droplets in the condensation area, the working fluid can flow back to the evaporation area due to gravity or capillary action, so as to effectively To achieve uniform temperature cooling effect.

However, due to the heat dissipation characteristics of the traditional vapor chamber, it is only able to uniformly dissipate the heat of the electronic components attached to the vapor chamber or the heat around the electronic components, and cannot conduct the heat of the electronic components to the remote end for heat dissipation, making its The cooling range is narrow.

As mentioned above, known technology has following shortcoming:

1. There is no remote cooling effect;

2. Narrow heat dissipation range;

3. The heat dissipation speed is poor.

Therefore, how to solve the above common problems and deficiencies is the direction that the inventors of this case and related manufacturers engaged in this industry want to study and improve.

Contents of the invention

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation device with a remote heat dissipation effect.

A secondary objective of the present invention is to provide a heat dissipation device capable of increasing the heat dissipation range.

A secondary objective of the present invention is to provide a heat dissipation device that improves heat dissipation speed.

To achieve the above object, the present invention provides a heat dissipation device, which includes a first body, a second body and a working fluid, the first body has a first plate and a second plate opposite to the first plate body, the first and second plates correspond to the cover and jointly define a first chamber, the inner wall of the first chamber is provided with a first capillary structure, the second body is connected to the first body, and opposite to the Extending in the direction of the first body, the second body has a second chamber communicating with the first chamber, the inner wall of the second chamber is provided with a second capillary structure, and the working fluid is filled in the first chamber One and two chambers.

Through the design of this structure of the present invention, the first chamber of the first body communicates with the second chamber of the second body, when the first body is heated, the liquid working fluid will be heated Then, part of the vapor working fluid in the first chamber will flow toward the second chamber of the second body due to the communication structure between the first and second chambers, so that the vapor state The working fluid circulates in the first and second chambers to achieve the effect of remote heat dissipation; in addition, the heat dissipation range can be expanded and the heat dissipation speed can be improved.

Description of drawings

FIG. 1A is a three-dimensional assembled view of the first embodiment of the heat sink of the present invention;

1B is a cross-sectional view of the first embodiment of the heat sink of the present invention;

2 is a three-dimensional combined view of the second embodiment of the heat sink of the present invention;

3 is a cross-sectional view of a third embodiment of the heat sink of the present invention;

4 is a cross-sectional view of a fourth embodiment of the heat sink of the present invention;

FIG. 5 is a cross-sectional view of a fifth embodiment of the heat dissipation device of the present invention.

Description of main component symbols

First ontology 1

First plate body 10

Second plate body 11

First chamber 101

First capillary structure 102

Orifice 103

Second Body 2

Upper tube surface 21

Down tube face 22

Second chamber 211

Second capillary structure 212

Open end 213

working fluid 3

Support structure 4

Detailed ways

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Fig. 1A and Fig. 1B, which are the three-dimensional combined view and the sectional view of the first embodiment of the heat dissipation device of the present invention. A heat dissipation device includes a first body 1, a second body 2 and a working fluid 3, the first body A body 1 has a first plate body 10 and a second plate body 11 opposite to the first plate body 10, the first and second plate bodies 10, 11 correspond to the cover and jointly define a first chamber 101, the The inner wall of the first chamber 101 is provided with a first capillary structure 102, the first capillary structure 102 can be any one of sintered powder body, grid body, fiber body, foam material and porous material, and the first The body 1 also has an orifice 103;

The aforementioned second body 2 is connected to the first body 1 and extends toward the opposite direction of the first body 1 . The second body 2 has a second chamber 211 correspondingly communicated with the first chamber 101 . The inner wall of the second chamber 211 is provided with a second capillary structure 212, the second capillary structure 212 is any one of sintered powder body, grid body, fiber body and groove, and one end of the second body 2 also has a The open end 213 (the other end is a closed end (not shown in the figure) is set away from the first body 1), which is correspondingly connected to the aforementioned first and second plate bodies 10, 11, and the open end 213 extends into the first Inside the chamber 101 of the body 1 and correspondingly engaged with the orifice 103;

The aforementioned working fluid 3 is filled in the first chamber 101 of the first body 1 and the second chamber 211 of the second body 2 .

In this embodiment, the first body 1 is illustrated by a heat plate, and the second body 2 is illustrated by a heat pipe, but they are not limited thereto;

Therefore, through the design of the heat dissipation device of the present invention, the opening 103 of the first body 1 is correspondingly engaged with the opening end 213 of the second body 2, so that the first chamber 101 of the first body 1 is in contact with the second body 1. The second chamber 211 of the main body 2 communicates correspondingly. When the first main body 1 is heated, the liquid working fluid 3 will evaporate into a vapor working fluid 3 due to the heat. Then, part of the vapor in the first chamber 101 Due to the interconnected structure of the first and second chambers 101, 211, the working fluid 3 in the gaseous state will flow toward the second chamber 211 of the second body 2, so that a part of the working fluid 3 in the gaseous state will flow from the first The chamber 101 is brought to the second chamber 211 for heat dissipation, and the working fluid 3 forms a continuous circulation in the first and second chambers 101, 211, so that it not only has the effect of uniform temperature through the first body 1 , the second body 2 can be used to achieve a remote heat dissipation effect; in addition, the heat dissipation range can be expanded and the heat dissipation speed can be increased.

Please refer to FIG. 2 and also refer to FIG. 1A, which is a three-dimensional combined view of the second embodiment of the heat sink of the present invention. Some components of the heat sink and the corresponding relationship between the components are the same as the aforementioned heat sink, so in This will not be repeated here, but the main difference between this cooling device and the aforementioned is that the second body 2 also has an upper tube surface 21 and a lower tube surface 22, and the upper and lower tube surfaces 21, 22 jointly define the The second chamber 211, the second body 2 is flat, through the above-mentioned first chamber 101 and the second chamber 211 corresponding communication structure, can make part of the gaseous state of the first chamber 101 The working fluid 3 flows toward the second chamber 211 of the second body 2, so that the working fluid 3 forms a continuous circulating flow in the first and second chambers 101, 211, so that it not only has the effect of temperature uniformity, but also has Remote cooling effects.

Please refer to Fig. 3 and Fig. 1A together, which is a cross-sectional view of the third embodiment of the heat dissipation device of the present invention. Some elements of the heat dissipation device and the corresponding relationship between the elements are the same as the aforementioned heat dissipation device, so it will not be described here. To repeat, the main difference between this cooling device and the above is that the first body 1 also has at least one supporting structure 4, and the supporting structure 4 is any one of copper pillars, sintered powder pillars and annular pillars, Both ends of the support structure 4 are respectively connected to the first and second plate bodies 10, 11. Through the aforementioned support structure 4, when the second plate body 11 is heated, the liquid working fluid 3 evaporates into a vapor state working fluid 3, The gaseous working fluid 3 will face the first plate 10 and condense into a liquid working fluid 3 after contacting the inner wall of the first plate 10, and then pull the liquid working fluid 3 back to the second plate by the support structure 4 Body 11.

Please refer to FIG. 4 and also refer to FIG. 1A, which is a sectional view of a fourth embodiment of the heat sink of the present invention. Some elements of the heat sink and the corresponding relationship between the elements are the same as the aforementioned heat sink, so it will not be described here. To repeat, the main difference between this cooling device and the above is that the second body 2 also has at least one supporting structure 4, and the supporting structure 4 is any one of copper pillars, sintered powder pillars and annular pillars, Two ends of the supporting structure 4 are respectively connected to the upper and lower pipe surfaces 21 and 22 .

Please refer to Fig. 5 and Fig. 1A together, which is a cross-sectional view of the fifth embodiment of the heat dissipation device of the present invention. Some elements of the heat dissipation device and the corresponding relationship between the elements are the same as the aforementioned heat dissipation device, so it will not be described here. Again, the main difference between this cooling device and the aforementioned is that the first body 1 and the second body 2 respectively have at least one supporting structure 4, and through the supporting structure 4, when the second plate body 11 is heated When the liquid working fluid 3 is evaporated into a vapor working fluid 3, it is converted into a liquid working fluid 3 after being condensed in the first and second chambers 101 and 211, and then the liquid working fluid 3 is pulled back by the support structure 4 The second plate body 11 and the lower pipe surface 22 .

Moreover, the material of the first body 1 and the second body 2 of the present invention can be any one of copper, aluminum and high thermal conductivity materials.

In addition, the application of the present invention (not shown in the figure) can be implemented by connecting multiple second bodies 2 with one first body 1 or connecting two second bodies 1 with one second body 2, or having multiple first bodies at the same time A body 1 and a second body 2 are connected in series.

As described above, the present invention has the following advantages compared to known technologies:

1. Has the effect of remote heat dissipation;

2. Large heat dissipation range;

3. Improve heat dissipation speed.

The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and should not limit the implementation scope of the present invention. All changes and modifications made according to the application scope of the present invention should still fall within the scope of the patent of the present invention.

Claims (10)

1. A cooling device, characterized in that, comprising: A first body has a first plate body and a second plate body opposite to the first plate body, the first and second plate bodies correspond to the cover and jointly define a first chamber, the inner wall of the first chamber having a first capillary structure; A second body, one end of which is connected to the first body, and the other end extends in the direction opposite to the first body, and the second body has a second chamber communicating with the first chamber correspondingly, the second chamber The inner wall is provided with a second capillary structure; and A working fluid is filled in the first and second chambers. 2. The heat dissipation device according to claim 1, wherein the second body further has an upper tube surface and a lower tube surface, and the upper and lower tube surfaces jointly define the second chamber. 3. The heat dissipation device according to claim 2, wherein one end of the second body further has an open end correspondingly connected to the first and second boards. 4 . The heat dissipation device according to claim 3 , wherein the first body further has an opening corresponding to the opening end. 5 . The heat dissipation device according to claim 1 , wherein the first capillary structure is any one of sintered powder body, mesh body, fiber body, foam material, and porous material. 6 . The heat dissipation device according to claim 1 , wherein the second capillary structure is any one of a sintered powder body, a mesh body, a fiber body, and a groove. 7. The heat dissipation device according to claim 1, wherein the first body further has at least one support structure, the support structure is any one of a copper column, a sintered powder column, and an annular column, and the support Both ends of the structure are respectively connected to the first and second plates. 8 . The heat dissipation device according to claim 2 , wherein the second body further has at least one supporting structure, and the supporting structure is any one of copper pillars, sintered powder pillars, and annular pillars. 9. The heat dissipation device according to claim 1, wherein the first body is a heat plate. 10. The heat dissipation structure according to claim 1, wherein the second body is a heat pipe.

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