JP2019016763A - Light-emitting device and method for manufacturing the same - Google Patents

Abstract

To provide a light-emitting device hard to cause degradation of a light-emission face, and a method for manufacturing the light-emitting device.SOLUTION: A light-emitting device 100 comprises: a light-emitting element 30 having an upper face 31 serving as a light-extraction face; a first translucent member 1 provided to be brought into contact with the upper face of the light-emitting element and formed by a phosphor-containing a resin material; and a second translucent member 2 provided to be brought into contact with an upper face of the first translucent member and formed by a glass material. The first translucent member has a lower face 7 of which a peripheral edge is located outside a peripheral edge of the upper face 31 of the light-emitting element in a plan view. The second translucent member has a lower face 8 of which a peripheral edge coincides with or is located inside a peripheral edge of the upper face 5 of the first translucent member in the plan view. The second translucent member has an upper face 3 of which a peripheral edge is located inside the peripheral edge of the upper face 5 of the first translucent member in the plan view.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  Light-emitting devices using light-emitting elements are widely used as vehicle headlights and indoor / outdoor lighting. As an example, a light emitting device includes a circuit board, a light emitting element mounted on the upper surface of the circuit board, a phosphor resin layer disposed on the upper surface of the light emitting element, and an upper surface of the phosphor resin layer. A diffusion resin layer for diffusing the irradiated light; a first reflection material provided on the upper surface of the circuit board for sealing the side surface of the light emitting element; and a second reflection material surrounding the side surface of the diffusion resin layer. (See Patent Document 1). In the light emitting device configured as described above, a part of the light emitted from the light emitting element is wavelength-converted by the phosphor in the phosphor resin layer, and other light from the light emitting element is fluorescent in the phosphor resin layer. Without being wavelength-converted by the body, it is directly emitted to the outside as emitted light.

  Note that the above-described light emitting device has a configuration in which both the phosphor resin layer and the diffusion resin layer are formed of resin. The phosphor resin layer has a larger area than the diffusion resin layer, and is formed so as to exceed the area of the upper surface of the light emitting element. Further, a part of the second reflecting material is disposed above the upper surface of the light emitting element. Therefore, it has a configuration that can irradiate light in a narrower upper range.

International Publication No. 2014/081042

  However, in the light emitting device proposed in Patent Document 1, since the light emitting surface of the light emitting device is formed of resin, there is a possibility that the resin member that becomes the light emitting surface is deteriorated by long-term use.

  An object of an embodiment of the present invention is to provide a light emitting device in which deterioration of a light emitting surface hardly occurs and a method for manufacturing the same.

  A light-emitting device according to an embodiment of the present invention includes a light-emitting element having an upper surface as a light extraction surface, and a first light-transmitting property that is provided by being bonded to the upper surface of the light-emitting element and formed of a resin material containing a phosphor. And a second translucent member formed of a glass material and bonded to the upper surface of the first translucent member, and the lower surface periphery of the first translucent member in plan view The light emitting element is located outside the upper surface periphery of the light emitting element, and the lower surface periphery of the second light transmissive member coincides with the upper surface periphery of the first light transmissive member in plan view or the upper surface of the first light transmissive member. The configuration is such that the peripheral edge of the upper surface of the second light transmissive member is positioned inside the peripheral edge of the upper surface of the first light transmissive member in plan view.

  In addition, the light emitting device according to the embodiment of the present invention includes a light emitting element having an upper surface as a light extraction surface, and a first transparent member formed by bonding with the upper surface of the light emitting element and made of a resin material containing a phosphor. A light-transmitting member, and a second light-transmitting member that is provided by being bonded to the upper surface of the first light-transmitting member and is made of a glass material, and the upper surface periphery of the first light-transmitting member is: In plan view, it coincides with the peripheral edge of the lower surface of the second light transmissive member, the area of the lower surface of the first light transmissive member is larger than the area of the upper surface of the light emitting element, and the surface of the upper surface of the second light transmissive member. The area is smaller than the area of the upper surface of the light emitting element.

  The manufacturing method of the light-emitting device according to the embodiment of the present invention is harder than the upper surface of the flat plate-like first light transmissive member assembly made of a resin material containing a phosphor and the first light transmissive member assembly. A step of preparing a plate-like light-transmitting member assembly in which a lower surface of a plate-like second light-transmitting member assembly made of a material is joined; and in the light-transmitting member assembly, the second light-transmitting member assembly A step of forming a groove portion on the upper surface of the transparent member assembly, and a plurality of the transparent members having the first and second transparent members by dividing the transparent member assembly by the groove portions. And a lower surface of the first light-transmissive member and an upper surface of the light-emitting element so that a lower surface periphery of the first light-transmitting member in the light-transmitting member is positioned outside an upper surface periphery of the light-emitting element. And a step of joining the two. The second light transmissive member can be formed of a glass material.

  According to the light emitting device according to the embodiment of the present invention, the light emitting surface is hardly deteriorated. Moreover, according to the manufacturing method of the light-emitting device which concerns on embodiment of this invention, the light-emitting device which a light emitting surface does not produce deterioration easily can be provided.

It is a top view which shows typically the light-emitting device which concerns on embodiment. It is sectional drawing in the II-II line of the light-emitting device of FIG. 1 is an exploded perspective view schematically showing a light emitting device according to an embodiment. It is sectional drawing which shows typically the light emission state of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the translucent member aggregate | assembly by which the 1st translucent member assembly and the 2nd translucent member assembly were joined in the manufacturing method of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the state which forms a groove part in the upper surface of a 2nd translucent member assembly in the manufacturing method of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the state which formed the groove part in the upper surface of the 2nd translucent member assembly in the manufacturing method of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the state which cut | disconnects a 1st translucent member aggregate in the groove part formed in the process of the manufacturing method of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the state by which the translucent member was separated into pieces in the manufacturing method of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the state which joined the light emitting element and the translucent member in the manufacturing method of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the state which provided the light reflection member around the light emitting element and the translucent member in the manufacturing method of the light-emitting device which concerns on embodiment. It is explanatory drawing which shows typically the state cut | disconnected for every light-emitting device in the manufacturing method of the light-emitting device which concerns on embodiment. It is a flowchart which shows the manufacturing method of the light-emitting device which concerns on embodiment. It is a top view which shows typically the light-emitting device showing the modification of embodiment. It is a top view which shows typically the light-emitting device showing the other modification of embodiment. It is explanatory drawing of the manufacturing process which shows the modification of the translucent member in the light-emitting device of embodiment. It is sectional drawing which shows the modification of the translucent member in the light-emitting device of embodiment. It is sectional drawing which shows typically the modification of the division position of the 1st translucent member and the 2nd translucent member in the light-emitting device of embodiment. It is sectional drawing which shows typically the other modification of the division position of the 1st translucent member and the 2nd translucent member in the light-emitting device of embodiment. It is a top view which shows typically the positional relationship of a translucent member and a light emitting element in the light-emitting device of embodiment. It is the expanded sectional view in the XB-XB line | wire of FIG. 10A. It is the expanded sectional view in the XC-XC line | wire of FIG. 10A.

  Hereinafter, a light emitting device according to an embodiment will be described with reference to the drawings. Note that the drawings referred to in the following description schematically show the embodiment, and therefore, the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There is a case. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and shall omit detailed description suitably. Furthermore, the directions shown in each figure indicate relative positions between components, and are not intended to indicate absolute positions.

An example of the configuration of the light emitting device according to the embodiment will be described with reference to FIGS.
The light-emitting device 100 includes a light-emitting element 30 having an upper surface as a light extraction surface, a first light-transmissive member 1 that is provided by being bonded to the upper surface of the light-emitting element 30 and formed of a resin material containing a phosphor, A second translucent member 2 formed of a glass material, which is provided to be joined to the upper surface of the first translucent member 1. The lower surface periphery of the first translucent member 1 is located outside the upper surface periphery of the light emitting element 30 in a plan view, and the lower surface periphery of the second translucent member 2 is the first translucent member 1 in the plan view. The upper surface periphery of the second translucent member 2 is positioned on the inner side of the upper surface periphery of the first light transmissive member in plan view. To do.
In the present embodiment, the first translucent member 1 and the second translucent member 2 are formed as an integral translucent member 10. The translucent member 10 includes a first translucent member 1 and a second translucent member 2 each having an upper surface and a lower surface, and the upper surface 5 of the first translucent member and the lower surface of the second translucent member. 8 is joined to form the translucent member 10. Light from the light emitting element 30 enters from the lower surface 7 of the first light transmissive member and is emitted to the outside from the upper surface 3 of the second light transmissive member.

(Light emitting element)
In the present embodiment, the light emitting element 30 is flip-chip mounted on the conductor wiring of the substrate 40 via a bonding member. The light emitting element 30 has a pair of electrodes on the same surface side, a surface on which the pair of electrodes are formed as a lower surface, and an upper surface 31 facing the lower surface as a main light extraction surface. As the light emitting element 30, a publicly known one can be used. For example, it is preferable to use a light emitting diode or a laser diode. Moreover, the light emitting element 30 can select the thing of arbitrary wavelengths. For example, as a blue or green light emitting element, a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) or a device using GaP is used. it can. Furthermore, as a red light emitting element, GaAlAs, AlInGaP, or the like can be used in addition to the nitride semiconductor element. The light emitting element 30 may be a semiconductor light emitting element made of a material other than those described above. The composition, emission color, size, number, and the like of the light emitting element 30 can be appropriately selected according to the purpose. The light emitting element 30 preferably has a pair of positive and negative electrodes on the same surface side. Thereby, the light emitting element 30 can be flip-chip mounted on the substrate 40. In this case, a surface facing the surface on which the pair of electrodes is formed is a main light extraction surface of the light emitting element. When the light emitting element 30 is mounted face up on the substrate 40, the surface on which the pair of electrodes are formed becomes the main light extraction surface of the light emitting element 30. The light emitting element 30 is electrically connected to the substrate 40 via a bonding member such as a bump, for example.

(Translucent member)
The translucent member 10 is provided so as to be bonded to the upper surface 31 of the light emitting element 30 provided in the light emitting device 100. The translucent member 10 includes a first translucent member 1 and a second translucent member 2 each having an upper surface and a lower surface, and the upper surface 5 of the first translucent member and the lower surface of the second translucent member. 8 is joined to form the translucent member 10. The first translucent member 1 is a resin layer containing a phosphor, the second translucent member 2 is a glass plate, and the second translucent member 2 is a support for the first translucent member 1. Have a role. The translucent member 10 is formed in a convex shape in which the area of the upper surface 3 of the second translucent member is smaller than the lower surface 7 of the first translucent member, and the side surface 6 of the first translucent member has a plan view. In FIG. 2, it is located outside the side surface 4 of the second translucent member.
The thickness of the translucent member 10 is, for example, about 60 to 300 μm. Among the thicknesses described above, the thickness of the second light transmissive member 2 is, for example, about 50 to 90% of the thickness of the light transmissive member 10.

(First translucent member)
The first light transmissive member 1 is provided so as to be bonded to the upper surface 31 of the light emitting element 30.
The first light transmissive member 1 is formed of a resin material containing a phosphor 11. The first light transmissive member 1 has, for example, a flat plate shape, and includes an upper surface 5, a lower surface 7 facing the upper surface 5, and a side surface 6 in contact with the upper surface 5 and the lower surface 7.
The lower surface 7 of the first light transmissive member is a surface on which light from at least one light emitting element 30 included in the light emitting device 100 is incident. The lower surface 7 is formed to have a larger area than the sum of the areas of the upper surfaces 31 of one or more light emitting elements 30 bonded to the lower surface 7. The lower surface 7 of the first light transmissive member is formed to be substantially flat.

  In the present embodiment, the upper surface 5 of the first translucent member is formed so as to be substantially parallel to the lower surface 7. The side surface 6 of the first light transmissive member is formed on a surface substantially perpendicular to the lower surface 7 of the first light transmissive member. By forming the side surface 6 substantially perpendicular to the lower surface 7, it is possible to suppress creeping of the adhesive material 15 that joins the first light-transmissive member 1 and the light-emitting element 30 to the side surface when the light-emitting device 100 is manufactured. can do. By suppressing the creeping of the adhesive 15 to the side surface 6, it is possible to prevent light emitted from the light emitting element 30 from leaking outside without passing through the first light transmissive member 1.

  The lower surface 7 of the first light transmissive member is formed larger than the upper surface 31 of the light emitting element 30 so as to include the entire upper surface 31 of the light emitting element 30. That is, the periphery of the lower surface 7 of the first translucent member is located outside the periphery of the upper surface 31 of the light emitting element 30 in plan view. By forming the lower surface 7 of the first light transmissive member with a larger area than the upper surface 31 of the light emitting element 30, the light emitted from the light emitting element 30 can be incident on the first light transmissive member 1 without loss. it can. The lower surface 7 of the first translucent member has a large area in the range of 105 to 150% with respect to the sum of the areas of the upper surface 31 of at least one light emitting element 30 bonded to the lower surface 7. Is formed. The first light transmissive member 1 allows light emitted from the light emitting element 30 to enter from the lower surface 7 and to enter the second light transmissive member 2 from the lower surface 8 of the second light transmissive member.

  The first light transmissive member 1 is formed of a resin material containing a phosphor 11 capable of converting the wavelength of at least part of light emitted from the light emitting element 30. Examples of the resin material include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, and modified resins or hybrid resins thereof. Among them, it is preferable to include a flexible silicone resin that is excellent in heat resistance and electrical insulation.

As the phosphor 11, a phosphor 11 used in this field can be appropriately selected. Examples of phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include, for example, yttrium-aluminum-garnet-based phosphors (YAG: Ce) activated by cerium, and lutetium-aluminum-garnet-based phosphors activated by cerium. (LAG: Ce), nitrogen-containing calcium aluminosilicate phosphors activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ : Eu), silicate phosphors activated with europium ((Sr, Ba) ₂ SiO ₄ : Eu), β sialon phosphor, CASN phosphor (CaAlSiN ₃ : Eu), SCASN phosphor ((Sr, Ca) AlSiN ₃ : Eu) and other nitride phosphors, KSF Examples include phosphors (K ₂ SiF ₆ : Mn), sulfide phosphors, quantum dot phosphors, and the like. By combining these phosphors 11 with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured. When the light emitting device 100 capable of emitting white light is used, the light emitting device 100 is adjusted to be white depending on the type and concentration of the phosphor 11 contained in the first light transmissive member 1. The density | concentration of the fluorescent substance 11 contained in the 1st translucent member 1 is about 30-80 mass%, for example.

Furthermore, the 1st translucent member 1 may contain a light-diffusion material. As the light diffusing material, for example, titanium oxide, barium titanate, aluminum oxide, silicon oxide, or the like can be used. In the 1st translucent member 1, the fluorescent substance 11 may be disperse | distributed to the whole 1st translucent member 1, and may be unevenly distributed in the upper surface or lower surface side of the 1st translucent member 1. FIG. .
In addition, by using a blue light-emitting element as the light-emitting element 30 and using a nitride semiconductor with a large red component as the phosphor, a light-emitting device that emits red light can be obtained. Furthermore, amber light can be emitted by using a blue light emitting element as the light emitting element 30 and using a YAG type phosphor and a nitride type phosphor having a large red component as the phosphor. An amber color is a region composed of a long wavelength region of yellow in JIS standard Z8110 and a short wavelength region of yellow red, and a region sandwiched between a yellow region and a short wavelength region of yellow red according to JIS standard Z9101 of safe colors This corresponds to the chromaticity range. For example, it is a region located in the range of 580 nm to 600 nm as the dominant wavelength. Many phosphors that emit red and amber colors have low light exchange efficiency, and it is preferable to increase the phosphor concentration in order to obtain a desired color tone. When setting it as the light-emitting device which light-emits red or amber color, the density | concentration of the fluorescent substance contained in the 1st translucent member 1 is about 60-80 mass%, for example.

(Second translucent member 2)
The second light transmissive member 2 is provided to be joined to the upper surface of the first light transmissive member 1. The 2nd translucent member 2 is formed with the glass material. The 2nd translucent member 2 is flat shape, for example, and is provided with the upper surface 3, the lower surface 8 which opposes the upper surface 3, and the side surface 4 which contact | connects the upper surface 3 and the lower surface 8. FIG. The lower surface 8 of the second translucent member is formed to have the same area as the upper surface 5 of the first translucent member or an area smaller than that of the first translucent member 1 (for example, a smaller area in FIGS. 1 to 4). That is, the second translucent member 2 has the periphery of the lower surface 8 of the second translucent member coincided with the periphery of the upper surface 5 of the first translucent member in plan view or from the periphery of the upper surface 5 of the first translucent member. Is located on the inner side, and the periphery of the upper surface 3 of the second light transmissive member is located on the inner side of the periphery of the upper surface 5 of the first light transmissive member in plan view. The area of the upper surface 3 of the second light transmissive member is preferably smaller than the sum of the areas of the upper surfaces 31 of the one or more light emitting elements 30 included in the light emitting device 100. Furthermore, the area of the upper surface 3 of the second translucent member is preferably 70% or less, and more preferably 50% or less, relative to the area of the lower surface 7 of the first translucent member. Thus, by making the area of the upper surface 3 of the second translucent member smaller than the area of the lower surface 7 of the first translucent member, light emitted from the lower surface 7 of the first translucent member The emitted light from the element 30 can be emitted from the upper surface 3 of the second light transmissive member (that is, the light emitting surface of the light emitting device 100) with a smaller area than the upper surface 31 of the light emitting element 30. In other words, the light emitting device 100 can illuminate farther as a light emitting device with higher luminance by reducing the area of the light emitting surface by the second light transmissive member 2.

  The side surface 4 of the second light transmissive member is formed substantially perpendicular to the upper surface 3 of the second light transmissive member. The side surface 4 is formed substantially perpendicular to the upper surface 3 of the second light transmissive member, so that the light reflective member 20 covers the side surface 4 of the second light transmissive member when the light emitting device 100 is manufactured. Climbing to the upper surface 3 can be suppressed. The side surface 4 of the second light transmissive member has an angle that can suppress the scooping of the light reflective member 20, for example, a range of 90 degrees plus or minus 5 degrees with respect to the upper surface 3, and this range is referred to in this specification. It is almost vertical. Since the side surface 4 of the second light transmissive member is formed substantially perpendicular to the upper surface 3, when the upper surface 3 of the second light transmissive member is the light emitting surface of the light emitting device 100, the upper surface of the light emitting device 100. In the light emitting device 100, the boundary between the light emitting portion and the non-light emitting portion is clear.

  It is preferable that the thickness of the 2nd translucent member 2 shall be more than the thickness of the 1st translucent member 1, for example. For example, the 2nd translucent member 2 is about 30-270 micrometers. The second translucent member 2 is formed of a glass material, and examples of the glass material include borosilicate glass, quartz glass, sapphire glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, and chalcogenide glass. Can be mentioned. The glass material used may be provided with an AR (Anti Reflection) coat for preventing reflection on the upper surface and / or the lower surface. Moreover, it is preferable that the 2nd translucent member 2 is a thing with a refractive index close | similar to the 1st translucent member 1. FIG.

As described above, the first translucent member 1 is a resin layer containing the phosphor 11, the second translucent member 2 is a glass plate, and the second translucent member 2 is the first translucent member. It functions as a support for the sex member 1. For this reason, it is possible to increase the concentration of the phosphor 11 contained in the first translucent member 1 and to form the phosphor layer (that is, the thickness of the second translucent member 2) thin.
Moreover, since the 1st translucent member 1 is formed with the resin material, it has a softness | flexibility compared with the 2nd translucent member 2 formed with the glass material, and even if it makes thickness thin, it is hard to be damaged. Therefore, even if the area of the upper surface 5 of the first light transmissive member is larger than the area of the lower surface 8 of the second light transmissive member, the second light transmissive member 2 is cracked or chipped at the time of manufacture or use. Can prevent damage. Thereby, the upper surface area of the 2nd translucent member 2 can be made smaller than the lower surface area of the 1st translucent member 1, and it can be set as the light-emitting device 100 with higher luminance.
Further, in this way, in the high-luminance light emitting device 100 with the light emitting surface narrowed down, since the second light-transmissive member 2 is formed of a glass material, the light emitting device is less likely to deteriorate due to long-term use. 100.

(Adhesive)
The light emitting element 30 and the translucent member 10 can be joined by the adhesive 15. The adhesive 15 is continuous from the upper surface of the light emitting element 30 to at least a part of the side surface, and is provided between the light reflective member 20 and the side surface of the light emitting element 30. The upper surface of the adhesive 15 interposed between the light reflective member 20 and the side surface of the light emitting element 30 is provided in contact with the lower surface 7 of the first light transmissive member. The adhesive 15 is preferably made of a translucent material that can guide the emitted light from the light emitting element 30 to the first translucent member 1. As the adhesive 15, a known adhesive such as an epoxy resin or a silicone resin, an organic adhesive having a high refractive index, an inorganic adhesive, an adhesive made of low-melting glass, or the like can be used. The adhesive 15 preferably extends from the upper surface 31 to the side surface of the light emitting element 30 and is provided as a fillet 16. The fillet 16 is preferably in contact with both the lower surface 7 of the first translucent member and the side surface of the light emitting element 30 and has a concave curved surface on the light reflecting member 20 side. With such a shape, light emitted from the light emitting element 30 is reflected by the fillet surface of the adhesive 15 and is easily guided to the first light transmissive member 1.
Note that the translucent member 10 and the light emitting element 30 may be joined by pressure bonding or the like without using the adhesive 15.

  As shown in FIGS. 1, 2, and 4, the light reflective member 20 reflects light that travels to other than the upper surface 3 of the second light transmissive member so as to be emitted from the upper surface 3 of the second light transmissive member. In addition, the side surface of the light emitting element 30 is covered to protect the light emitting element 30 from external force, dust, gas, and the like. The light reflective member 20 exposes the upper surface 3 of the light transmissive member 10 (that is, the upper surface 3 of the second light transmissive member) as the light emitting surface of the light emitting device 100, and the light transmissive member 10, the light emitting element 30, and It is provided so as to cover a part of the upper surface of the substrate 40. Specifically, the light reflective member 20 includes the side surface 4 of the second light transmissive member, the upper surface 5 and the side surface 6 of the first light transmissive member, the side surface of the adhesive 15, and the side surface and the lower surface side of the light emitting element 30. It is provided to cover. The light extraction surface of the light emitting element 30 is exposed from the light reflective member 20 and joined to the lower surface 7 of the first light transmissive member, so that light can enter the light transmissive member 10. . The light reflective member 20 is a member that can reflect the light from the light emitting element 30, and reflects light from the light emitting element 30 at the interface between the light transmissive member 10 and the light reflective member 20, thereby transmitting the light. It is made to enter into the sex member 10. As described above, the light emitted from the light emitting element 30 is reflected by the light reflecting member 20 and passes through the light transmitting member 10, and the upper surface 3 of the second light transmitting member which is the light emitting surface of the light emitting device 100. Is emitted to the outside.

  Here, the upper surface of the light reflective member 20 is preferably equal to or lower than the height of the upper surface 3 of the second light transmissive member. The light emitted from the upper surface 3 of the second light transmissive member that serves as the light emitting surface of the light emitting device 100 also spreads in the lateral direction. Therefore, when the upper surface of the light reflective member 20 is higher than the height of the upper surface 3 of the second light transmissive member, light emitted from the upper surface 3 of the second light transmissive member 20 The light hits the top surface and is reflected, causing variations in light distribution. Therefore, the light reflective member 20 covers the outer periphery of the side surface 4 of the second light transmissive member, and the height of the upper surface of the light reflective member 20 is equal to or lower than that of the upper surface 3 of the second light transmissive member. Provide. By doing so, it is preferable because the light emitted from the light emitting element 30 can be efficiently extracted to the outside.

  The light reflective member 20 includes a light reflective substance in a base material made of a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, or a hybrid resin containing at least one of these resins. Can be formed. As the light reflecting substance, titanium oxide, silicon oxide, zirconium oxide, yttrium oxide, yttria stabilized zirconia, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, and the like can be used. Since the light reflecting member 20 has different amounts of light reflection and transmission depending on the concentration and density of the light reflecting substance, the concentration and density may be adjusted as appropriate according to the shape and size of the light emitting device 100. Moreover, if the light reflective member 20 is made of a material having both heat reflectivity and heat dissipation, it is possible to improve heat dissipation while providing light reflectivity. Examples of such a material include aluminum nitride and boron nitride having high thermal conductivity.

(substrate)
The substrate 40 has at least one light emitting element 30 mounted thereon, and electrically connects the light emitting device 100 to the outside. The substrate 40 is configured to include a flat plate-like support member and a conductor wiring disposed on the surface and / or inside the support member. The substrate 40 has a structure such as the shape and size of the electrode according to the configuration and size of the electrode of the light emitting element 30. In addition, the substrate 40 may be configured to include a heat radiation terminal that is electrically independent from the light emitting element 30 on the lower surface. The heat radiating terminal is preferably formed so as to have an area larger than the sum of the upper surface areas of all the light emitting elements 30 included in the light emitting device 100 and is disposed so as to overlap with a region immediately below the light emitting element 30. . With such a structure of the heat dissipation terminal, the light emitting device 100 having more excellent heat dissipation can be obtained.

The support member of the substrate 40 is preferably made of an insulating material, and is preferably made of a material that hardly transmits light emitted from the light emitting element 30 or external light. The substrate 40 is preferably made of a material having a certain level of strength. Specific examples include ceramics such as alumina, aluminum nitride, and mullite, phenol resins, epoxy resins, polyimide resins, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and the like. The support member may have a structure having a cavity. Thereby, it can form easily by dripping the above-mentioned light reflective member 20 and hardening | curing.
The conductor wiring and the heat radiating terminal can be formed using, for example, a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, or Ni, or an alloy containing these metals. Such a conductor wiring can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, or the like.

  Since the light emitting device 100 has the above-described configuration, as an example, the light emitting device 100 emits more light emitted from the light emitting element 30 when used as headlights for motorcycles, automobiles, etc., or for illumination of ships, aircrafts, etc. Can irradiate far away. That is, as shown in FIG. 4, in the light emitting device 100, when light is emitted from one or more light emitting elements 30, the light propagates through the light transmissive member 10 without being reflected by the light reflective member 20. There are light that goes directly to the upper surface 3 of the second light transmissive member and light that is reflected by the light reflective member 20 and exits from the upper surface 3 of the second light transmissive member. In the light emitting device 100, the light emitted from the light emitting element 30 can be received without loss by making the area of the lower surface 7 of the first light transmissive member larger than the sum of the upper surface areas of the light emitting elements 30. it can. Further, the area of the upper surface 3 of the second light transmissive member is smaller than the sum of the areas of the upper surfaces 31 of the light emitting elements 30 and smaller than the area of the lower surface 7 of the first light transmissive member. Therefore, the emitted light from the light emitting element 30 is concentrated on the upper surface 3 of the second light transmissive member by the light transmissive member 10. Thereby, it is possible to obtain a light emitting device 100 that is suitable for high beam use of a headlight and can irradiate light at a far distance with high luminance. In FIG. 4, typical light irradiation directions are schematically indicated by arrows.

[Method for Manufacturing Light Emitting Device]
Next, a method S10 for manufacturing the light emitting device 100 shown in the flowchart of FIG. 6 will be described with reference to FIGS. 5A to 5H.
(Step S11 of preparing an aggregate of translucent members)
As shown in FIG. 5A, the upper surface of a flat plate-like first light transmissive member aggregate A1 made of a resin material containing a phosphor and the second light transmissive material made of a material harder than the first light transmissive member aggregate A1. A flat plate-like translucent member assembly A10 in which the lower surface of the optical member assembly A2 is joined is prepared. The first translucent member aggregate A1 is a phosphor-containing resin layer containing the phosphor 11 that converts a part of the light from the light emitting element 30 to a wavelength, and the second translucent member aggregate A2. Is a glass formed or processed into a flat plate shape. For example, the translucent member aggregate A10 can be formed by printing a phosphor-containing resin layer on the lower surface of the glass plate. The first light transmissive member aggregate A1 may not only be in direct contact with the lower surface of the second light transmissive member aggregate A2, but may be joined via another member such as an adhesive. For example, pressure bonding, fusing, sintering, adhesion with an organic adhesive, and adhesion with an inorganic adhesive such as low-melting glass can be given. A printing method, a compression molding method, a phosphor electrodeposition method, a phosphor sheet method, or the like can be used as a method for forming the first light transmissive member aggregate A1. In the printing method, a phosphor containing a phosphor, a binder, and a solvent is prepared, the paste is applied to the lower surface of the second light transmissive member assembly A2, and dried to form a phosphor layer.
The first translucent member aggregate A1 and the second translucent member aggregate A2 are converted into the translucent member 10 including the first translucent member 1 and the second translucent member 2 through each step described later. It is formed. The lower surface of the first translucent member assembly A1 forms the lower surface of the translucent member 10, and the upper surface of the second translucent member assembly A2 forms the upper surface of the translucent member 10.

(Groove forming step S12)
Next, as shown in FIGS. 5B and 5C, in the translucent member assembly A10, a groove Dt is formed on the upper surface of the second translucent member assembly A2 by a blade Br1 such as a processing machine. The groove part Dt penetrates through the second light transmissive member aggregate A2 and may or may not reach the first light transmissive member aggregate A1. In the present embodiment, the groove Dt reaches the first light transmissive member aggregate A1, and the first light transmissive member aggregate A1 is exposed on the bottom surface of the groove Dt. Further, the groove portion Dt formed in this step constitutes the side surface 4 of the second light transmissive member in the light transmissive member 10. In the step of forming the groove portion Dt, processing is performed by the groove portion Dt so that the upper surface of the second light transmissive member assembly A2 becomes a rectangle having a smaller area than the upper surface 31 of the light emitting element 30. Moreover, since the 2nd translucent member 2 is formed with the material harder than the 1st translucent member 1, it is easy to process at the time of the groove part formation by blade Br1, for example, a material with high viscosity like resin is used. The rectangular corners can be sharply processed without being crushed. The groove portion Dt may be formed by other known methods such as laser processing.
As the second light transmissive member aggregate A2, for example, it is preferable to use one having a hardness in the range of 3 to 10 in terms of Morse code. By setting it as this range, the crushing of the corner | angular part at the time of a process, etc. can be suppressed.

(Translucent member forming step S13)
Subsequently, as shown in FIGS. 5D and 5E, the translucent member assembly A10 is divided by the groove Dt, and the translucent member 10 including the first translucent member 1 and the second translucent member 2 is used. Get. When this division is performed, the plurality of translucent members 10 having the lower surface 7 on the first translucent member 1 side having a larger area than the upper surface of the light emitting element 30 are obtained. In this step, the first light transmissive member assembly A10 is divided into each light transmissive member 10 by the blade Br2 having a narrower width than the one formed with the groove Dt at the position of the groove Dt. The body A1 is cut. The periphery of the lower surface 7 of the first light transmitting member in the divided light transmitting member 10 is formed to have an area larger than the sum of the areas of the upper surfaces 31 of one or more light emitting elements 30 used in the light emitting device 100. Is done. The translucent member 10 obtained in this way is formed in a convex shape in which the area of the upper surface 3 of the second translucent member is smaller than the lower surface 7 of the first translucent member. The cut surface of the first light transmissive member assembly A1 is the side surface 6 of the first light transmissive member in the light transmissive member 10, and the groove Dt is the side surface 4 of the second light transmissive member in the light transmissive member 10. The side surface 6 of the 1st translucent member formed is located outside the side surface 4 of the 2nd translucent member in planar view.

In addition, since 1st translucent member aggregate | assembly A1 is formed with the resin material, it is more flexible than the thing formed with the glass material, and is hard to be damaged. That is, since cracks, chips, and the like are unlikely to occur during division, the thickness of the first light transmissive member can be made thinner.
As the first light transmissive member aggregate A1, for example, it is preferable to use one having a hardness after curing in the range of A30 to D50 in Shore hardness. By setting it as this range, it is possible to suppress breakage such as cracking and chipping during manufacturing and use, while maintaining strength when used as the light emitting device 100.
Further, in the first light transmissive member aggregate A1, the phosphor 11 is unevenly distributed on the lower surface side of the first light transmissive member 1 (that is, the surface opposite to the joint surface with the second light transmissive member aggregate A2). In the case where the groove portion Dt reaches the first light transmissive member assembly A1 in the groove portion forming step S12 described above, the first light transmissive member assembly A1 exposed on the bottom surface of the groove portion Dt is used. The region on the upper surface side that does not substantially contain the phosphor can be exposed. That is, even when the groove Dt reaches the first light transmissive member aggregate A1 at the time of forming the groove, the amount of the phosphor included in the first light transmissive member aggregate A1 does not change, resulting in a decrease in the amount of phosphor. Color shift and color unevenness can be suppressed.

(Preparation process of substrate and light emitting element)
The light emitting element 30 and the substrate 40 are prepared. The light emitting element 30 and the board | substrate 40 should just be prepared before the joining process of the translucent member 10. FIG.
The substrate 40 is formed in a flat plate shape having a rectangular shape in plan view, and for example, a conductor wiring and a heat radiating terminal are provided on a support member. In the present embodiment, the substrate 40 may be configured such that the cathode mark is formed of the same material as the electrode material that is the conductor wiring along one corner portion of the upper surface of the substrate.
The light emitting element 30 is mounted on the substrate 40. Here, one light emitting element 30 per one light emitting device 100 is mounted on the conductor wiring of the substrate 40 via bonding members such as bumps.

(Translucent member joining step S14)
As shown in FIG. 5F, the lower surface of the translucent member 10 and the lower surface of the first translucent member 1 in the translucent member 10 and the lower surface of the light transmissive element 10 are positioned outside the peripheral edge of the upper surface 31 of the light emitting element 30. The upper surface 31 of the element 30 is joined.
In the present embodiment, the light emitting element 30 and the translucent member 10 are joined by the adhesive 15. In joining with the adhesive material 15, first, the adhesive material 15 is dropped on the upper surface 31 of the light emitting element 30, and the translucent member 10 is disposed on the adhesive material 15. The dropped adhesive 15 is pressed by the translucent member 10 and wets and spreads to the side surface of the light emitting element 30 to form a fillet 16 between the lower surface of the translucent member 10 and the side surface of the light emitting element 30. Provided. The amount and viscosity of the adhesive 15 to be dropped are appropriately adjusted so that the fillet 16 is provided on the side surface of the light emitting element 30 and the adhesive 15 does not wet and spread to the substrate 40.

  In the translucent member 10, the lower surface 7 of the first translucent member is bonded onto the light emitting element 30 through the adhesive 15 disposed on the upper surface of the light emitting element 30. The translucent member 10 is formed such that the area of the lower surface 7 of the first translucent member is larger than the sum of the areas of the upper surfaces 31 of the one or more light-emitting elements 30. It is preferable that the distance to the outer edge of the lower surface 7 of the optical member is equal. In addition, the translucent member 10 has the entire center of one or more light emitting elements 30 arranged so that the center of the upper surface 3 of the second translucent member is generally rectangular in plan view. It is preferable to arrange so as to substantially overlap. In the translucent member 10 bonded to the light emitting element 30, the area of the lower surface 7 of the first translucent member is larger than the sum of the areas of the upper surface 31 of the light emitting element 30. Therefore, the translucent member 10 takes in light emitted from the upper surface of the light emitting element 30 from the lower surface 7 of the first translucent member having a larger area than the upper surface 31 of the light emitting element 30, and the lower surface 7 of the first translucent member. It becomes a structure which can be light-guided to the upper surface 3 of the 2nd translucent member which is smaller than the upper surface 31 of the light emitting element 30, and is an area smaller than this.

(Light reflective member supply process S15)
Subsequently, as illustrated in FIG. 5G, a light reflective member 20 that covers the light emitting element 30, the translucent member 10, and the substrate 40 is provided. The light emitting device 100 may have one type or two or more types of light reflective members 20. The following is an example when the light reflective member 20 is formed of two layers.
(First light reflective member supplying step)
First, the light reflective member 20 is supplied to a height between the light emitting element 30 and the substrate 40 and to a height that covers the light emitting element 30 and the adhesive 15 on the side surface. In addition, when the light-reflective member 20 is arrange | positioned between the light emitting element 30 and the board | substrate 40, it is preferable to use the material of low linear expansion. Thereby, the thermal stress at the joint between the light emitting element 30 and the substrate 40 can be relaxed.

(Second light reflective member supplying step)
Next, the light reflective member 20 that covers the side surface of the translucent member 10 is supplied. The light reflective member 20 covers the side surface 4 of the second light transmissive member, and the upper surface 5 and the side surface 6 of the first light transmissive member. At this time, it is preferable that the light reflective member 20 is dropped on the upper surface of the substrate 40 separated from the light transmissive member 10 so that the upper surface 3 of the second light transmissive member is exposed from the light reflective member 20. Moreover, the light reflective member 20 is supplied so that the surface of the light reflective member 20 supplied previously may be covered.
The light reflective member 20 uses, for example, a resin in which titanium oxide is contained in a silicone resin.

(Individualization step S16)
As shown in FIG. 5H, after the light reflective member 20 is formed, the substrate 40 is cut for each unit of the light emitting device by laser irradiation or a tool such as a blade to form the light emitting device 100. The light emitting device 100 manufactured by each process as described above allows light emitted from one or more light emitting elements 30 to be emitted from the lower surface 7 of the first light transmissive member that is larger than the sum of the areas of the upper surfaces 31 of the light emitting elements 30. Incident light can be emitted from the upper surface 3 of the second light transmissive member, which is smaller than the lower surface 7 of the first light transmissive member, to the outside as high-luminance light. Moreover, since the 1st translucent member 1 is formed with the resin material, even if the area difference of the 1st translucent member 1 and the 2nd translucent member 2 is enlarged, it is 1st in a manufacturing process etc. The translucent member 1 is hardly broken and damaged, and the yield can be improved. Moreover, since the 2nd translucent member is formed with the glass material, even as the light-emitting device 100, a light irradiation surface is hard to deteriorate and it is excellent in product quality.

(Modification)
The light emitting device 100 may include a plurality of light emitting elements 30, and the translucent member 10 may have various shapes. For example, as illustrated in FIGS. 7, 8, and 9 </ b> A to 9 </ b> D, in the light emitting devices 100 </ b> A and 100 </ b> B, the light emitting element groups 30 </ b> A and 30 </ b> B including a plurality of light emitting elements 30 may be configured. It is good also as a structure of translucent member 10A, 10B, 10C. Each configuration will be described below. In addition, about the structure and manufacturing method of the light-emitting device 100 already demonstrated, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.
The light emitting device 100A may have a configuration of a light emitting element group 30A in which a plurality of light emitting elements 30 are arranged. For example, as shown in FIG. 7, the light emitting element group 30A is in a state where two light emitting elements 30 of the same size are arranged side by side and aligned. When the light emitting elements 30 are arranged adjacent to each other, the translucent member 10 has a lower surface 7 of the first translucent member than a region of the light emitting element group 30A having a total area where the light emitting elements 30 are arranged in parallel. Is also formed to be larger. Note that the area of the light emitting element group 30A is such that the area between the light emitting elements 30 is a part of the upper surface area of the light emitting element group 30A. The translucent member 10 is formed such that the upper surface 3 of the second translucent member is smaller than the area of the light emitting element group 30A. In the light emitting device 100A having such a configuration, light from the plurality of light emitting elements 30 is incident from the lower surface 7 of the first light transmissive member and is smaller than the lower surface 7 of the first light transmissive member. The light can be emitted from the upper surface 3 to the outside, so that it is possible to irradiate light farther with higher brightness.

  Further, as shown in FIG. 8, as an example, six light emitting elements 30 may be arranged and arranged to form a light emitting element group 30B. The translucent member 10 is formed so that the lower surface 7 of the first translucent member is larger than the region of the light emitting element group 30 </ b> B having a total area where the six light emitting elements 30 are arranged in parallel. Note that the area of the light emitting element group 30B is such that the area between the light emitting elements 30 is a part of the upper surface area of the light emitting element group 30B as a region that surrounds the outer periphery of the six light emitting elements 30 in a straight line and a rectangle. The translucent member 10 is formed such that the upper surface 3 of the second translucent member is smaller than the area of the light emitting element group 30B. Also in the light emitting device 100B having such a configuration, light from the plurality of light emitting elements 30 is incident from the lower surface 7 of the first light transmissive member, and is smaller than the second light transmissive property of the lower surface 7 of the first light transmissive member. Since light can be emitted to the outside from the upper surface 3 of the member, it is possible to irradiate light farther with higher brightness.

Furthermore, as shown to FIG. 9B, the side surface 4A of a 2nd translucent member is good also as a structure provided with the vertical side surface 4a and the inclined surface 4b. The side surface 4A of the second translucent member is continuous across the vertical side surface 4a that is substantially perpendicular to the upper surface 3 of the second translucent member, and the vertical side surface 4a and the upper surface 5 of the first translucent member. It is comprised from the inclined surface 4b. The inclined surface 4b is formed so as to spread from the upper surface direction toward the lower surface direction. And the inclined surface 4b is comprised so that it may become a curved surface which protrudes toward the lower side over the vertical side surface 4a and the upper surface 5 of a 1st translucent member. Since the second translucent member includes the inclined surface 4b, the light from the light emitting element 30 can be efficiently transmitted toward the upper surface 3 of the second translucent member by reducing the number of reflections, and the luminance is high. A light-emitting device can be obtained. Further, since the inclined surface 4b is provided, the lower surface 8 of the second light transmissive member and the upper surface 5 of the first light transmissive member can have the same shape, and the first light transmissive property formed of resin. Since the member 1 can be supported in a wider range, the structural strength of the translucent member 10A can be improved.
The light emitting device 100 includes at least one or more light emitting elements 30, and as described above, there are two, six, three, four, five, or seven or more. It doesn't matter.

Further, as shown in FIG. 9A, the inclined surface 4b can be provided by using the blade Br3 when forming the groove portion Dt shown in FIG. 5C. The blade Br3 is thinner than the blade Br2 shown in FIG. 5D, and is operated by partially changing the penetration depth of the blade Br3 so that the groove Dt has the vertical side surface 4a and the inclined surface 4b. In this way, the side surface 4A having the inclined surface 4b is formed. Moreover, you may form the groove part Dt which has an inclined surface using the blade for bevel cutting. In addition, although the inclined surface 4b was shown as a curve in sectional view, it can also be formed as a straight line.
Furthermore, by changing the size, shape, penetration depth, and the like of the blade Br3 when forming the groove portion Dt, the translucent member 10B having different side surface shapes of the first translucent member and the second translucent member. 10C can be formed.

  The side surface 9B of the translucent member 10B has an inclined surface 4bb which is inclined as shown in FIG. 9C. The translucent member 10B is formed by integrally forming the first translucent member 1B and the second translucent member 2B in the same manner as the translucent member 10A. Then, the first translucent member 1B and the second translucent member 2B each having an upper surface and a lower surface are provided, and the upper surface 5b of the first translucent member and the lower surface 8b of the second translucent member are joined. Thus, the translucent member 10B is configured. Also in the translucent member 10B, similarly to the above-described translucent member 10 and the like, light from the light emitting element 30 is incident from the lower surface 7 of the first translucent member and the upper surface 3 of the second translucent member. Can be discharged to the outside.

Similar to the above-described translucent member 10, the translucent member 10B includes a lower surface 7, an upper surface 3 having an area smaller than the lower surface 7, and a side surface 9B.
The translucent member 10B includes, as the side surface 9B, a first vertical side surface 6B, an inclined surface 4bb, and a second vertical side surface 4ba in order from the lower surface side. The first vertical side surface 6B is a surface substantially perpendicular to the lower surface 7 that is continuous with the lower surface 7, and the vertical side surface 4bc that is a part of the side surface 6b of the first light transmissive member 1B and the side surface of the second light transmissive member 2B. It is a surface consisting of The second vertical side surface 4ba is a surface substantially perpendicular to the upper surface 3 that is continuous with the upper surface 3. The inclined surface 4bb is a surface that is located between the first vertical side surface 6B and the second vertical side surface 4ba and is inclined so as to spread from the upper surface direction toward the lower surface direction. The inclined surface 4bb is formed as a curved surface that protrudes inward.

The boundary surface between the first light transmissive member 1B and the second light transmissive member 2B in the light transmissive member 10B (that is, the joint surface between the first light transmissive member 1B and the second light transmissive member 2B) is the lower surface 7. Is substantially parallel to the first vertical side surface 6B.
In the translucent member 10B, the side surface of the second translucent member 2B is a vertical side surface (that is, the second vertical side surface of the translucent member 10B) 4ba that is continuous with the upper surface 3 of the second translucent member 2B. An inclined surface (that is, an inclined surface of the translucent member 10B) 4bb that is continuous to the side surface 4ba and extends from the upper surface direction toward the lower surface direction, and is continuous to the lower surface of the second light transmissive member continuously to the inclined surface 4bb. It has a vertical side surface (that is, a part of the first vertical side surface 6B of the translucent member 10B) 4bc.

Further, the side surface 6b of the first light transmissive member 1B is continuous from the second light transmissive member 2B and forms the first vertical side surface 6B of the light transmissive member 10B together with the vertical side surface 4bc of the second light transmissive member 2B. doing. That is, the upper surface periphery of the first light transmissive member 1B in the light transmissive member 10B substantially coincides with the lower surface periphery of the second light transmissive member 2B in plan view.
With such a shape, the thickness of the first light-transmissive member 1B formed of the resin material containing the phosphor 11 can be further reduced. In order to reliably support the thinner phosphor-containing resin layer and considering the ease of processing, the thickness of the thinnest portion of the second translucent member 2B is that of the first translucent member 1B. The thickness is preferably equal to or greater than the thickness of the thinnest part.

  The side surface 9C of the translucent member 10C has an inclined surface 4C that is inclined as shown in FIG. 9D. The translucent member 10C is formed by integrating the first translucent member 1C and the second translucent member 2C in the same manner as the translucent member 10A. The first translucent member 1C and the second translucent member 2C each having an upper surface and a lower surface are provided, and the upper surface 5c of the first translucent member and the lower surface 8c of the second translucent member are joined. Thus, the translucent member 10C is configured. Also in the translucent member 10C, similarly to the translucent member 10 and the like, the light from the light emitting element 30 enters from the lower surface 7 of the first translucent member and is externally transmitted from the upper surface 3 of the second translucent member. Can be released.

Similar to the above-described translucent member 10, the translucent member 10C includes a lower surface 7, an upper surface 3 having an area smaller than the lower surface 7, and a side surface 9C.
The translucent member 10C includes a first vertical side surface 6c, an inclined surface 4C, and a second vertical side surface 4ca in order from the lower surface side as the side surface 9C. The first vertical side surface 6 c is a surface substantially perpendicular to the lower surface 7 that is continuous with the lower surface 7, and the second vertical side surface 4 ca is a surface that is substantially perpendicular to the upper surface 3 that is continuous with the upper surface 3. The inclined surface 4C is a surface that is located between the first vertical side surface 6c and the second vertical side surface 4ca and is inclined so as to spread from the upper surface direction toward the lower surface direction. The inclined surface 4C is configured as a curved surface that protrudes inward. The inclined surface 4C is a surface formed of the inclined side surface 6cb and the inclined side surface 4cb, which is formed across the first light transmitting member 1C and the second light transmitting member 2C.

The boundary surface between the first light transmissive member 1C and the second light transmissive member 2C in the light transmissive member 10C is a surface substantially parallel to the lower surface 7 and in contact with the inclined surface 4C.
In the translucent member 10C, the side surface of the second translucent member 2C is a vertical side surface (that is, the second vertical side surface of the translucent member 10C) 4ca that is continuous with the upper surface 3 of the second translucent member 2C. It has an inclined side surface (that is, an inclined side surface of the translucent member 10C) 4cb that is continuous with the side surface 4ca and extends from the upper surface direction toward the lower surface direction. The inclined side surface 4cb is continuous with the lower surface 8c of the second light transmissive member and is continuous with the inclined side surface 6cb of the first light transmissive member 1C. Further, the side surface of the first light transmissive member 1C is an inclined side surface that is continuous from the second light transmissive member 2C and extends from the upper surface direction toward the lower surface direction (that is, a part of the inclined surface 4C of the light transmissive member 10C). (Inclined side surface) 6cb and a first vertical side surface 6c that is continuous with the inclined side surface 6cb and that is connected to the lower surface 7 of the first light-transmissive member 1C substantially perpendicularly.

That is, also in the light transmissive member 10C, the upper surface periphery of the first light transmissive member 1C substantially coincides with the lower surface periphery of the second light transmissive member 2C in plan view.
In such a shape, since the ratio of the thickness of the first light-transmissive member 1C in the light-transmissive member 10C can be increased, for example, more phosphors 11 are required to obtain a desired emission color. It is effective when
Note that, in the first light-transmissive member 1B and the second light-transmissive member 2B of the light-transmissive member 10B and the first light-transmissive member 1C and the second light-transmissive member 2C of the light-transmissive member 10C. Compared to the case of the optical member 10, the side surface 9B or the side surface 9C can be formed by appropriately adjusting the thickness.

Furthermore, in the translucent member 10B, the inclined surface 4bb and the first vertical side surface 6B may be continuous, or may have a surface substantially parallel to the upper surface 3 therebetween. Further, when the inclined surface 4bb has a tangent line that is substantially perpendicular to the upper surface 3 in the vicinity of the upper surface of the translucent member 10B, this region is defined as the second vertical side surface 4ba, and the second vertical side surface 4ba becomes the inclined surface 4bb. It may be configured to be included.
Similarly, in the translucent member 10C, the inclined surface 4C and the first vertical side surface 6c may be continuous, or may have a surface substantially parallel to the upper surface 3 therebetween. Further, when the inclined surface 4C has a tangent line that is substantially perpendicular to the upper surface 3 in the vicinity of the upper surface of the translucent member 10C, this region is defined as the second vertical side surface 4ca, and the second vertical side surface 4ca becomes the inclined surface 4C. It may be configured to be included.

Moreover, you may form each translucent member 10,10A, 10B, 10C like the translucent member 10D shown to FIG. 10A-FIG. 10C. In the translucent member 10D, two of the four side surfaces are vertical side surfaces 9D1 that are continuous with the upper surface and the lower surface. That is, in the plan view, the translucent member 10D has a part of the upper surface periphery of the second light transmissive member 2D substantially coincided with the lower surface periphery of the first light transmissive member 1D, and the other part of the first light transmissive member 2D. It is located inside the lower surface periphery of the optical member 1D.
Also in such a light emitting device 100D, the area of the lower surface of the first light transmissive member 1D is larger than the area of the upper surface of the light emitting element 30, and the area of the upper surface of the second light transmissive member 2D is made larger than that of the plurality of light emitting elements 30. By making it smaller than the total area of the upper surface, a light-emitting device with higher brightness can be obtained. Incidentally, in the light emitting device 100D, the side surface 9D having the inclined surface of the translucent member 10D is provided on the side along the longitudinal direction where the light emitting elements 30 are aligned, and the vertical side surface 9D1 is formed on the side along the short direction. ing. That is, the vertical side surface 9D1 is a portion that coincides with the lower surface periphery of the first light transmissive member 1D in plan view as a part of the upper surface periphery of the second light transmissive member 2D. In addition, the vertical side surface 9D1 may be provided on one side along the longitudinal direction in combination with the side along the short side direction, either one side of the rectangular shape in plan view, or two adjacent sides Any of the three consecutive sides may be used.

  In the light emitting devices 100, 100A, and 100B described above, the lower surface 8 of the second light transmissive member and the upper surface 5 of the first light transmissive member are described as having different sizes. Similarly, the lower surface 8 of the second light transmissive member and the upper surface 5 of the first light transmissive member have the same size, and the upper surface 3 of the second light transmissive member is larger than the upper surface 5 of the first light transmissive member. You may comprise so that it may be located inside. With this configuration, light is easily guided from the upper surface 5 of the first light transmissive member to the lower surface 8 of the second light transmissive member, and the light extraction efficiency of the light emitting devices 100, 100A, and 100B is improved. improves. Further, when a plurality of light emitting elements 30 are bonded to one light transmissive member 10, the influence of the arrangement of each light emitting element 30 and the resulting light distribution, luminance unevenness, and color unevenness are reduced, which is preferable. Furthermore, a phosphor, a light diffusing material, or the like may be included in the adhesive 15 that joins the translucent member 10 and the light emitting element 30. Further, when a plurality of light emitting elements 30 are mounted, the translucent member 10 may be bonded to each of the light emitting elements 30.

In the light emitting devices 100 and 100A to 100D according to the present invention, a protective element such as a Zener diode may be mounted on the substrate 40. By embedding these protective elements in the light-reflecting member 20, it is possible to prevent a decrease in light extraction due to the light from the light emitting element 30 being absorbed by the protective element or blocked by the protective element. .
Further, when two light emitting elements 30 are used, the distance between the two light emitting elements 30 is such that the fillet 16 of the adhesive 15 is continuously formed between the two light emitting elements 30. Is preferred. Specifically, when the light emitting devices 100 and 100 </ b> A to 100 </ b> D include two or more light emitting elements 30, the distance between the adjacent light emitting elements 30 is preferably equal to or less than twice the thickness of the light emitting element 30.

  The light-emitting device according to the present invention can be used as a light source for headlights of vehicles such as motorcycles and automobiles or vehicles such as ships and airplanes. In addition, it can be used for various light sources such as various illumination light sources such as spotlights, display light sources, and in-vehicle components.

1, 1C, 1D First translucent member 2, 2B, 2C, 2D Second translucent member 3 Upper surface of second translucent member 4, 4A Side surface of second translucent member 4a Vertical side surface 4b, 4bb 4C Inclined surface 5 Upper surface of first translucent member 6 Side surface of first translucent member 7 Lower surface of first translucent member 8 Lower surface of second translucent member 10, 10A, 10B, 10C, 10D Optical member 11 Phosphor 15 Adhesive 16 Fillet 20 Light reflective member 30 Light emitting element 30A, 30B Light emitting element group 31 Upper surface (light extraction surface)
40 Substrate 100, 100A, 100B, 100C, 100D Light-emitting device A1 1st translucent member assembly (1st translucent member)
A2 2nd translucent member aggregate | assembly (2nd translucent member)
A10 Assembly Br1, Br2, Br3 Blade Dt Groove S10 Manufacturing Method of Light Emitting Device S11 Preparatory Step S12 Groove Formation Step S13 Translucent Member Formation Step S14 Joining Step S15 Light Reflecting Member Supply Step S16 Individualization Step

Claims (22)

A light emitting element having an upper surface as a light extraction surface;
A first translucent member provided by bonding with an upper surface of the light emitting element and formed of a resin material containing a phosphor;
A second translucent member provided by being bonded to the upper surface of the first translucent member and formed of a glass material,
The lower surface periphery of the first translucent member is located outside the upper surface periphery of the light emitting element in plan view,
The peripheral edge of the lower surface of the second light transmissive member coincides with the peripheral edge of the upper surface of the first light transmissive member in a plan view or is located inside the peripheral edge of the upper surface of the first light transmissive member. A light emitting device in which a peripheral edge of the upper surface of the conductive member is located inside a peripheral edge of the upper surface of the first light transmissive member in plan view.   The light emitting device according to claim 1, wherein an area of an upper surface of the second light transmissive member is smaller than an area of an upper surface of the light emitting element.   3. The light emitting device according to claim 1, wherein a side surface of the second light transmissive member has a vertical side surface continuous with an upper surface of the second light transmissive member.   4. The light emitting device according to claim 1, wherein a side surface of the second translucent member has an inclined surface that widens from the upper surface direction toward the lower surface direction.   The light emitting device according to claim 4, wherein the inclined surface is a curved surface.   6. The light emitting device according to claim 1, wherein a side surface of the first light transmissive member has a surface substantially perpendicular to a lower surface of the first light transmissive member.   The light emitting device according to any one of claims 1 to 6, wherein the second translucent member is borosilicate glass or quartz glass.   The light emitting device according to any one of claims 1 to 7, wherein the first light transmissive member includes a silicone resin.   The light emitting device according to any one of claims 1 to 8, wherein the first light transmissive member and the light emitting element are bonded via an adhesive.   10. The light emitting device according to claim 1, wherein side surfaces of the light emitting element, the first light transmissive member, and the second light transmissive member are covered with a light reflective member. A light emitting element having an upper surface as a light extraction surface;
A first translucent member provided by bonding with an upper surface of the light emitting element and formed of a resin material containing a phosphor;
A second translucent member provided by being bonded to the upper surface of the first translucent member and formed of a glass material,
The upper surface periphery of the first light transmissive member coincides with the lower surface periphery of the second light transmissive member in plan view,
The area of the lower surface of the first light transmissive member is larger than the area of the upper surface of the light emitting element,
The light emitting device wherein the area of the upper surface of the second light transmissive member is smaller than the area of the upper surface of the light emitting element.   The light emitting device according to claim 11, wherein a peripheral edge of the lower surface of the first translucent member is positioned outside a peripheral edge of the upper surface of the light emitting element in plan view.   The light emitting device according to claim 11 or 12, wherein a part of a peripheral edge of the upper surface of the second light transmissive member coincides with a peripheral edge of the lower surface of the first light transmissive member in a plan view.   14. The light emitting device according to claim 11, wherein a side surface of the second light transmissive member has a vertical side surface continuous with an upper surface of the second light transmissive member.   The light emitting device according to any one of claims 11 to 14, wherein a side surface of the second translucent member has an inclined surface that spreads from the upper surface direction toward the lower surface direction.   13. The light emitting device according to claim 11, wherein a side surface of the first translucent member has an inclined surface that spreads from the upper surface direction toward the lower surface direction. An upper surface of a flat plate-shaped first light transmissive member assembly made of a resin material containing a phosphor, and a flat plate-shaped second light transmissive member assembly made of a material harder than the first light transmissive member assembly. A step of preparing a flat plate-shaped translucent member assembly bonded to the lower surface of
In the light transmissive member assembly, forming a groove on the upper surface of the second light transmissive member assembly;
Dividing the translucent member assembly with the groove and obtaining a plurality of translucent members having a first translucent member and a second translucent member;
The lower surface of the first light transmissive member and the upper surface of the light emitting element are joined such that the lower surface periphery of the first light transmissive member of the light transmissive member is positioned outside the periphery of the upper surface of the light emitting element. And a method for manufacturing a light emitting device.   The method of manufacturing a light emitting device according to claim 17, wherein the second light transmissive member is formed of a glass material.   The method for manufacturing a light-emitting device according to claim 17, comprising a step of mounting the light-emitting element on a substrate.   20. The method for manufacturing a light emitting device according to claim 17, wherein the groove has an inclined surface extending from an upper surface to a lower surface of the second light transmissive member assembly.   21. The method according to any one of claims 17 to 20, further comprising a step of providing a light reflective member that covers a side surface of the second light transmissive member, a side surface of the first light transmissive member, and a side surface of the light emitting element. The manufacturing method of the light-emitting device of description.   The method for manufacturing a light emitting device according to any one of claims 17 to 21, wherein the first light transmissive member includes a silicone resin.

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