JP6777127B2 - Manufacturing method of light emitting device - Google Patents

Description

The present invention relates to a method for manufacturing a light emitting device.

In recent years, a high-power light emitting device configured by using a light emitting element such as an LED has been used as a light source for in-vehicle applications. For example, Patent Document 1 discloses a high-power light-emitting device used as an in-vehicle light source, in which a heat-dissipating layer is formed so as to cover the peripheral edge of the light-emitting surface of the light-emitting element to enhance the heat-dissipating effect. Has been done. According to Patent Document 1, since the light emitting device of Patent Document 1 covers the peripheral edge of the light emitting surface of the light emitting element to form a heat radiating layer, the light radiating characteristics are improved and the light distribution characteristics of sharp edges are obtained. It can be used, for example, and is said to be suitable for in-vehicle headlamp applications. Here, the light distribution characteristic of the sharp edge in Patent Document 1 is understood to have a large difference in brightness between the inside and the outside of the light emitting surface.

Japanese Unexamined Patent Publication No. 2014-127679

However, a light emitting device used as a high-power light source for in-vehicle applications is required to more efficiently extract the light emitted by the light emitting element. Further, there is a demand for a manufacturing method capable of manufacturing such a light emitting device at low cost.

Therefore, the present invention provides a manufacturing method capable of inexpensively manufacturing a light emitting device capable of increasing the brightness difference between the inside and the outside of the light emitting surface and efficiently extracting the light emitted by the light emitting element. The purpose.

The method for manufacturing a light emitting device according to the first embodiment according to the present invention includes a mounting step of mounting a light emitting element on a substrate and a mounting process.
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
A plate-shaped translucent member having a first surface and a second surface on the opposite side of the first surface, the outer periphery of the first surface being smaller than the inner circumference of the opening, and the first surface being said. A translucent member mounting step of facing the sheet and providing a space between the translucent member and the opening and mounting the translucent member in the opening.
The space is filled with the first light-reflecting resin to form the first light-reflecting member, and the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member. And the process of forming the light guide support member
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
including.

Further, the method of manufacturing the light emitting device of the second embodiment according to the present invention includes a mounting step of mounting a light emitting element on a substrate and a mounting process.
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and the outer circumference of the second surface is smaller than the inner circumference of the opening. The first light reflective member coated with a large plate-shaped translucent member so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first light-reflecting. A light guide support member forming step for producing a light guide support member supported by the member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
including.

Further, the method for manufacturing the light emitting device of the third embodiment according to the present invention includes a mounting step of mounting the light emitting element on the substrate and
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and a part of the outer circumference of the second surface is the opening. The first coating of a plate-shaped translucent member larger than the inner circumference so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the light-reflecting resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first. A light guide support member forming step for producing a light guide support member supported by a light reflective member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
including.

According to the method for manufacturing the light emitting device according to the first to third embodiments according to the present invention configured as described above, the brightness difference between the inside and the outside of the light emitting surface can be increased, and the light emitted by the light emitting element can be made efficient. A light emitting device that can be taken out well can be manufactured at low cost.

This is an example of a plan view of a light emitting device manufactured by the method for manufacturing a light emitting device according to the first or second embodiment. This is an example of a plan view of a light emitting device manufactured by the method for manufacturing a light emitting device according to the first or third embodiment. It is sectional drawing when it cut along the line AA shown in FIG. 1A of the light emitting device when it was manufactured by the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing when cut along the line BB shown in FIG. 1B of the light emitting device when manufactured by the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing when it cut along the CC line shown in FIG. 1B of the light emitting device when it was manufactured by the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing when cut along the line AA shown in FIG. 1A of the light emitting device when manufactured by the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing when cut along the line BB shown in FIG. 1B of the light emitting device when manufactured by the manufacturing method of the light emitting device which concerns on 3rd Embodiment. It is sectional drawing when it cut along the CC line shown in FIG. 1B of the light emitting device when it was manufactured by the manufacturing method of the light emitting device which concerns on 3rd Embodiment. This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. It is sectional drawing when the light emitting element is mounted in the manufacturing method of the light emitting device of 1st Embodiment. It is sectional drawing when the light-shielding frame is placed on the sheet in the manufacturing method of the light emitting device of 1st Embodiment. It is sectional drawing when the translucent member is placed on the sheet in the manufacturing method of the light emitting device of 1st Embodiment. It is sectional drawing when the light guide support member was formed in the manufacturing method of the light emitting device of 1st Embodiment. It is sectional drawing when the light guide support member is fixed on the light emitting element in the manufacturing method of the light emitting device of 1st Embodiment. It is sectional drawing which shows the state of filling with the light reflective resin in the manufacturing method of the light emitting device of 1st Embodiment. It is sectional drawing when the 1st light reflective resin was applied on the light shielding frame in the manufacturing method of the light emitting device of 2nd Embodiment. It is sectional drawing when the translucent member was brought into contact with a light-reflecting resin and then pressed in the manufacturing method of the light emitting device of 2nd Embodiment. It is sectional drawing when the light guide support member was formed in the manufacturing method of the light emitting device of 2nd Embodiment.

In the manufacturing method of the embodiment according to the present invention, first, a substrate on which a light emitting element is mounted and a light guide support member in which a light-shielding frame and a light-transmitting member are supported by a light-reflecting member are prepared. Next, the light guide support member is transferred onto the light emitting element mounted on the substrate, and then the light reflecting member surrounding the light emitting element is formed. According to such a method, when manufacturing a plurality of light emitting devices, a substrate on which a light emitting element including a plurality of unit regions is mounted is prepared, and a light-shielding frame and a translucent member reflect light in each unit region of the substrate. Since each of the light guide support members in a state of being supported by the sex member can be placed, it becomes possible to manufacture the light emitting device more efficiently.

Hereinafter, the drawings of the method for manufacturing the light emitting device according to the first to third embodiments according to the present invention and the light emitting device obtained by the manufacturing method (hereinafter, may be referred to as “light emitting device of the embodiment”) will be referred to. I will explain while. However, the embodiments described below are for embodying the technical idea of the present invention and do not limit the present invention. Since the drawings referred to in the following description schematically show the embodiment according to the present invention, the scale, spacing, positional relationship, etc. of each member are exaggerated, or a part of the members is not shown. May be.

<Light emitting device of the embodiment>
In the light emitting device of the embodiment, as shown in FIGS. 1A, 1B, 2A to 2F, the substrate 10 and the light emitting element 1 provided on the substrate 10 and the second surface face the light emitting surface of the light emitting element 1. A light-shielding frame having an opening by exposing the first surface 3a of the translucent member 3 which includes a plate-shaped translucent member 3 provided so as to perform the light emitting device and further constitutes a light emitting surface of the light emitting device. A first light-reflecting member 9a is provided so as to connect the opening 5a of the above and a part of the side surface of the translucent member 3, and light is emitted between the first light-reflecting member 9a and the substrate 10. A second light reflective member 9b is provided so as to cover the side surface of the element 1. Hereinafter, the first light-reflecting member 9a and the second light-reflecting member 9b may be collectively referred to as a "light-reflecting member".
In the light emitting device of the embodiment, a light-shielding frame 5 having an opening 5a on the upper surface of the light-reflecting member around the translucent member 3 and a first surface 3a of the translucent member 3 inside the opening 5a. The first surface 3a of the translucent member 3 is exposed from the first light-reflecting member 9a and the light-shielding frame 5.

Here, in particular, in the light emitting device of the embodiment, when viewed in a plan view from above (that is, from the light emitting surface side of the light emitting device), the inner circumference of the opening 5a constitutes the light emitting surface of the light emitting device. The first light reflecting member 9a is exposed between the inner circumference of the opening 5a and the outer circumference of the first surface 3a, which is located away from the outer circumference of the first surface 3a of 3. In this way, on the upper surface of the light emitting device, the translucent member 3 and the light-shielding frame 5 are separated by interposing the surface of the first light reflecting member 9a, and the side surface of the light emitting element 1 and the translucent property. The side surface of the member 3 and the light-shielding frame 5 are separated by interposing a light-reflecting member.

The light emitting device of the embodiment configured as described above can increase the brightness difference between the light emitting surface and the region surrounding the light emitting surface, and can efficiently take out the light emitted by the light emitting element. In the light emitting device of the embodiment, the distance between the inner circumference of the opening 5a and the outer circumference of the light emitting surface 3a increases the difference in brightness between the inside and the outside of the light emitting surface 3a and efficiently extracts the light emitted by the light emitting element. In order to achieve both of these, it is preferably 5 μm or more and 150 μm or less, and more preferably 40 μm or more and 60 μm or less.

Hereinafter, various embodiments of the light emitting device of the embodiment will be described.
In the light emitting device of the embodiment, in a plan view, the area of the second surface 3b of the translucent member 3 is larger than the area of the first surface (that is, substantially the light emitting surface of the light emitting device) 3a of the translucent member 3. It has become.
By making the area of the first surface 3a of the translucent member 3 smaller than that of the second surface 3b, the light emitted from the light emitting element 1 incident from the second surface 3b of the translucent member 3 has a smaller area. It can be emitted from the first surface 3a. That is, by passing through the translucent member 3, the area of the light emitting surface is narrowed down, and it becomes possible to illuminate a farther distance with high brightness. A light emitting device having a high front brightness is particularly suitable for in-vehicle lighting such as a headlight. In addition, in in-vehicle lighting, there are various regulations regarding the colors of the lights, for example, it is stipulated that the color of the headlights is white or pale yellow, and all of them are the same. ing.

Further, it is preferable that at least a part of the outer circumference of the second surface 3b of the translucent member 3 is located outside the inner circumference of the opening 5a of the light-shielding frame 5 when viewed in a plan view from above. In the light emitting device of the embodiment shown in FIG. 1A, the entire outer circumference of the second surface 3b is located outside the inner circumference of the opening 5a when viewed in a plan view from above. Further, in the light emitting device of the embodiment shown in FIG. 1B, a part of the outer circumference of the second surface 3b is located outside the inner circumference of the opening 5a when viewed in a plan view from above. When the outer circumference of the second surface 3b of the translucent member 3 is rectangular, at least one side of the outer circumference, preferably two opposing sides, is configured to be located outside the inner circumference of the opening 5a of the light-shielding frame 5. Is preferable. Further, when the outer circumference of the second surface 3b of the translucent member 3 is a rectangle having a long side and a short side, as shown in FIG. 1B, the long side of the outer circumference is the inner circumference of the opening 5a of the light shielding frame 5. It is preferably configured to be located on the outside. The side surface of the translucent member 3 may have a step so that a collar portion having a constant thickness is formed, and FIGS. 2A, 2C, 2D, 2F and 3 to 6 show. As shown, part or all of it may be an inclined surface. When the side surface of the translucent member 3 has an inclined surface, the inclined surface may be a flat surface or a curved surface. Further, at least one side surface of the translucent member 3 may have a substantially rectangular shape as shown in FIGS. 2B and 2E.

In this way, a part or all of the outer circumference of the second surface 3b of the translucent member 3 is located outside the inner circumference of the opening 5a when viewed in a plan view from above, and the translucent member 3 is the first. If the outer circumference of the surface 3a is located inside the inner circumference of the opening 5a when viewed in a plan view, the following effects can be obtained.
That is, when the light emitting device is viewed in a plan view from above (that is, the light emitting surface side), the outer periphery of the first surface 3a of the translucent member 3 and the first surface 3a of the translucent member 3 is inside the opening 5a. The upper surface of the first light reflective member 9a surrounding the above can be visually recognized. At this time, in the region inside the opening 5a, the inclined surface and / or the collar portion of the translucent member 3 is located at least a part below the light reflecting member. As a result, even if the first light-reflecting member 9a is cracked or peeled off, the inclined surface and / or the flange portion of the translucent member 3 is located inside the opening 5a. The light leaking from the 5a can be only the light emitted from the translucent member 3. From the viewpoint of enhancing such an effect, as shown in FIG. 1A, the entire outer circumference of the second surface 3b of the translucent member 3 is the inner circumference of the opening 5a of the light-shielding frame 5 when viewed in a plan view from above. It is more preferably located on the outside. Further, when the outer circumference of the second surface 3b of the translucent member 3 is a rectangle having a long side and a short side, at least the long side of the outer circumference of the second surface 3b is the opening of the light shielding frame 5 as described above. It is preferable to configure the portion 5a so as to be located outside the inner circumference.
Further, since the light leaking from the light-reflecting member is blocked in the region covered by the light-shielding frame 5, for example, even if the second light-reflecting member 9b located on the side of the light-emitting element 1 is cracked or peeled off. It is possible to more effectively suppress the light emitted from the side surface of the light emitting element 1 from passing through cracks and peeling points and leaking to the light emitting surface side.
For example, when a light emitting device that emits white light by mixing blue light emitted from the light emitting element 1 and yellow light whose wavelength is partially converted from the blue light is used as vehicle illumination, the light emitting surface is used. If the blue light emitted from the light emitting element 1 leaks in addition to the emitted white light, a difference in chromaticity may occur in the opening 5a, and uneven emission color may occur in the irradiation area. Further, when the blue leaked light is visually recognized, the above-mentioned regulation as in-vehicle lighting is not satisfied, and the safety of the vehicle may be impaired.

In one embodiment of the light emitting device of the embodiment, the outer circumference of the first surface 3a of the translucent member 3 is located inside the outer circumference of the light emitting element 1 when viewed in a plan view from above, as shown in FIG. 1A. Here, as shown in FIG. 1A, in a light emitting device including a plurality of light emitting elements 1, when the outer circumference of the light emitting element 1 is referred to, the outer circumference is defined by looking at the plurality of light emitting elements 1 as a unit, and adjacent light emission is performed. The outer circumference of each light emitting element facing each other is not included.
In this way, the light emitted from the plurality of light emitting elements 1 can be collected and emitted from the first surface 3a of the translucent member 3. As a result, the light emitted by the light emitting element 1 can be emitted from the exit surface 3a in a state of having a higher luminous flux density.
Further, in another embodiment of the light emitting device of the embodiment, the outer circumference of the first surface 3a of the translucent member 3 is located inside the outer circumference of the light emitting element 1 when viewed from above in a plan view, as shown in FIG. 1B. To do. In this way, by appropriately setting the area of the light emitting surface of the light emitting element and the area of the first surface 3a (light emitting surface of the light emitting device) of the translucent member 3, the light flux density on the light emitting surface of the light emitting device is a desired luminous flux. It can be adjusted to the density.

In the light emitting device of the embodiment, as shown in FIGS. 2A to 2F and FIGS. 4 to 6, the first surface 3a of the translucent member 3 has substantially the same height (that is, the same plane as the upper surface of the light shielding frame 5). It may be located above), or as shown in FIG. 3, it may be located below the upper surface of the light-shielding frame 5. When the first surface 3a of the translucent member 3 is located below the upper surface of the light-shielding frame 5, it is preferable that the first surface 3a of the translucent member 3 and the upper surface of the light-shielding frame 5 are parallel to each other. .. Even when the first surface 3a of the translucent member 3 is located below the upper surface of the light-shielding frame 5, the light-reflecting member is the first surface 3a of the translucent member 3, which is the light emitting surface of the light emitting device. Is preferably provided so as to expose the side surface of the light emitting element 1 and the side surface of the translucent member 3. At this time, it is preferable that the light-reflecting member is provided so as to cover the inner circumference of the opening of the light-shielding frame located above the first surface 3a of the translucent member 3. The inner peripheral end surface of the opening of the light-shielding frame 5 may be inclined as shown in FIGS. 4 and 5. The light emitting device having no resin wall 7 as shown in FIGS. 2A to 5 has an advantage that it can be made smaller than the light emitting device having the resin wall 7.

In the light emitting device of the embodiment, as shown in FIG. 6, a resin wall 7 may be provided between the substrate 10 and the light shielding frame 5. The resin wall 7 may be provided on the outside of the light-reflecting member, for example, so as to surround the light-reflective member or to face the light-reflective member in between. Thereby, peeling of the light-shielding frame 5 can be further prevented.

Hereinafter, each component of the light emitting device of the embodiment will be described.
(Board 10)
The substrate 10 is a member that supports the light emitting element 1 and the like, and has at least a wiring on its surface that is electrically connected to an external electrode of the light emitting element 1. As the main material of the substrate 10, a material which is an insulating material and which is difficult for light from the light emitting element 1 and light from the outside to pass through is preferable. Specific examples thereof include ceramics such as alumina and aluminum nitride, phenol resins, epoxy resins, silicone resins, polyimide resins, BT resins, and resins such as polyphthalamide. When a resin is used, an inorganic filler such as glass fiber, silicon oxide, titanium oxide, or alumina may be mixed with the resin, if necessary. As a result, it is possible to improve the mechanical strength, reduce the coefficient of thermal expansion, and improve the light reflectance. Further, the substrate 10 may have an insulating material formed on the surface of a metal member. The wiring is formed in a predetermined pattern on the insulating material. The wiring material can be at least one selected from gold, silver, copper, titanium, palladium, nickel and aluminum. The wiring can be formed by plating, vapor deposition, sputtering, or the like.

(Light emitting element 1)
It is preferable to use a light emitting diode as the light emitting element 1. As the light emitting element, one having an arbitrary wavelength can be selected. For example, as the blue and green light emitting elements, nitride semiconductors (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), ZnSe, and GaP are used. be able to. Further, as the red light emitting element, GaAlAs, AlInGaP and the like can be used. Further, a semiconductor light emitting device made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light emitting elements to be used can be appropriately selected according to the purpose. In the case of a light emitting device having a phosphor, a nitride semiconductor capable of emitting a short wavelength capable of efficiently exciting the phosphor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably mentioned. Various emission wavelengths can be selected depending on the material of the semiconductor layer and its mixed crystallinity.

The light emitting element 1 used in the light emitting device of the embodiment has, for example, positive and negative electrodes on the same surface side. As shown in FIG. 2A, the light emitting element 1 is flip-chip mounted on the substrate 10 via the conductive bonding member 11. In FIG. 2A, the conductive bonding member 11 connected to the positive and negative electrodes of the light emitting element 1 is simplified, but in reality, it is connected to each of the positive and negative electrodes provided on the same surface side. It is provided in. The positive and negative electrodes of the light emitting element 1 are connected to positive and negative wiring (not shown) provided on the substrate 10 via the conductive bonding member 11, respectively. Further, the light emitting element 1 is mounted on the substrate with the surface on which the electrodes are formed as the lower surface, and the upper surface facing the lower surface is the main light emitting surface. As described above, such a light emitting element 1 is connected to the substrate by using a conductive bonding member such as a bump or a conductive paste, and therefore, as compared with a light emitting element connected by a metal wire or the like, the light emitting element 1 is connected to an electrode. The contact area with the substrate can be increased and the connection resistance can be lowered.

The light emitting element 1 is, for example, a light emitting element formed by laminating a nitride semiconductor layer on a sapphire substrate for translucent growth, and the sapphire substrate is on the upper surface side of the light emitting element 1 and is a main light emitting surface. It becomes. The growth substrate may be removed, for example, by polishing, laser lift-off, or the like.

(Translucent member 3)
The translucent member 3 is a member that transmits the light emitted from the light emitting element 1 and emits it to the outside. The translucent member 3 may contain a light diffusing material or a phosphor capable of wavelength-converting at least a part of the incident light. The translucent member 3 can be formed of, for example, a resin, glass, an inorganic substance, or the like. Examples of the translucent member containing a fluorescent substance include a sintered body of the fluorescent substance, a resin, glass, ceramic, or another inorganic substance containing the fluorescent substance. Further, a resin layer containing a phosphor may be formed on the surface of a molded product such as resin, glass or ceramic. The thickness of the translucent member 3 is, for example, about 50 to 300 μm.
As shown in FIG. 2A, the translucent member 3 and the light emitting element can be joined via, for example, the light guide member 13. Further, for the bonding between the translucent member 3 and the light emitting element 1, a direct bonding method using crimping, sintering, surface activation bonding, atomic diffusion bonding, or hydroxyl group bonding can be used without using the light guide member 13. Good.

(Fluorescent material)
As described above, the translucent member 3 may contain a phosphor. As the phosphor that can be contained in the translucent member 3, a phosphor that can be excited by light emission from the light emitting element 1 is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, an yttrium / aluminum / garnet-based phosphor (YAG: Ce) activated with cerium and a lutethium / aluminum / garnet-based phosphor activated with cerium are used. (LAG: Ce), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate-based phosphor (CaO-Al ₂ O _3- SiO ₂ : Eu), europium-activated silicate-based phosphor ((Sr, Sr,) Ba) ₂ SiO ₄ : Eu), β-sialon phosphor, CaAlSiN ₃ : CASN-based fluorescence represented by Eu, (Sr, Ca) AlSiN ₃ : SCASN-based fluorescence represented by Eu, etc. Body, K ₂ SiF ₆ : KSF-based phosphor represented by Mn, sulfide-based phosphor, quantum dot phosphor, and the like. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device having a desired emission color (for example, a white light emitting device) can be manufactured.

(Shading frame 5)
The light-shielding frame 5 is a member provided on the upper surface of the light emitting device to reduce the brightness of the portion excluding the light emitting surface. In order to reduce the brightness of the portion excluding the light emitting surface, it is necessary to block the light leaking to the outside from other than the first surface 3a of the translucent member 3. Considering this function, the light-shielding frame 5 is made of, for example, a member made of a material that reflects and / or absorbs light without transmitting light, or a member having a film made of a material that reflects and / or absorbs light on the surface. It is preferable to configure it.
The material constituting the light-shielding frame 5 can be selected from resin (including fiber reinforced resin), ceramics, glass, paper, metal, etc., and a composite material composed of two or more of these materials. .. Specifically, as a material having excellent light-shielding property and not easily deteriorated, for example, the light-shielding frame 5 is preferably composed of a metal frame made of metal or a frame having a metal film on the surface. Examples of the metal material include copper, iron, nickel, chromium, aluminum, gold, silver, titanium, and alloys thereof.
Further, it is more preferable that the light-shielding frame 5 has a function of not only suppressing light leakage from the inside of the light emitting device but also suppressing reflection of light from the outside. Examples of the function of suppressing the reflection of light from the outside include having fine irregularities on the surface on the light emitting surface side and using a material having a high light absorption rate. Examples of the fine unevenness include an average arithmetic roughness Ra of 0.5 μm or more and 1.0 μm or less. When the surface of the light-shielding frame has fine irregularities, the surface of the light-shielding frame becomes more wettable with liquid, and the uncured resin material easily wets and spreads on the surface of the light-shielding frame. For this reason, for example, it is preferable that the edge of the upper surface of the light-shielding frame is not subjected to fine uneven processing. Examples of the material having a high light absorption rate include black nickel plating and black chrome plating.
Further, the thickness of the light-shielding frame 5 (that is, the height from the lower surface to the upper surface of the light-shielding frame 5) is 20 μm in consideration of lightness, resistance to deformation, etc. while maintaining strength when used as a light emitting device. It is preferably about 200 μm, more preferably about 30 to 80 μm.

The light-shielding frame 5 may be provided so that the outer circumference of the light-shielding frame 5 coincides with the outer circumference of the light-emitting device in a plan view, but the light-shielding frame 5 is provided so that the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device. It is preferable that it is. As a result, in the dividing step of dividing the light emitting device described later into each unit region (that is, for each individual light emitting device), the light shielding frame 5 is not arranged on the dividing line, so that the displacement of the light emitting frame 5 at the time of division is suppressed. To.
Here, the fact that the light-shielding frame 5 is provided so that the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device means that a part of the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device. Includes that the light-shielding frame 5 is provided in the.
The width of the light-shielding frame 5 in a plan view is preferably at least 130 μm or more in consideration of increasing the difference in brightness between the inside and the outside of the light emitting surface 3a. Further, considering the ease of handling in the manufacturing process, it is more preferably 500 μm or more. The width of the light-shielding frame 5 may be a constant width over the entire circumference, but may be partially different. When the width of the light-shielding frame 5 is partially different, at least 130 μm over the entire circumference. It is more preferable to have a width of 500 μm or more and a width of 500 μm or more.

(1st light reflecting member 9a, 2nd light reflecting member 9b)
The light-reflecting member, that is, the first light-reflecting member 9a and the second light-reflecting member 9b covers the side surface of the light emitting element 1 and the side surface of the translucent member 3, and the side surface of the light emitting element 1 and the translucent member. The light emitted from the side surface of No. 3 is reflected and emitted from the light emitting surface. By providing the light-reflecting member that covers the side surface of the light emitting element 1 and the side surface of the translucent member 3 in this way, the light extraction efficiency can be increased. The light-reflecting member is formed from, for example, a light-reflecting material having a high light reflectance. Specifically, as the light-reflecting member, a light-reflecting material having a reflectance of 60% or more, more preferably 80% or 90% or more with respect to light from the light emitting element can be used. The light-reflecting material is made of, for example, a resin containing a light-reflecting substance. As will be described in detail later, the first light-reflecting member 9a and the second light-reflecting member 9b are formed separately, may be formed from different light-reflecting materials, and are the same light-reflecting material. It may be formed from.

Regarding the first light-reflecting resin 9c forming the first light-reflecting member 9a and the second light-reflecting resin 9d forming the second light-reflecting member 9b, the base resin constituting these resins is Resins such as silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, and hybrid resin containing at least one of these resins can be used, and a light-reflecting substance is used as a base material made of the resin. It can be formed by containing it. Photoreflecting substances include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, yttrium oxide, yttria-stabilized zirconia, calcium carbonate, calcium hydroxide, calcium silicate, niobium oxide, zinc oxide, barium titanate, potassium titanate. , Magnesium fluoride, alumina, aluminum nitride, boron nitride, mulite and the like can be used. Titanium oxide (TiO ₂ ) is preferably used. Further, preferably, as a light-reflecting substance, particles having a refractive index different from that of the resin of the base material are dispersed in the resin of the base material. Since the amount of light reflected and the amount transmitted differs depending on the concentration and density of the light-reflecting substance, the concentration and density can be appropriately adjusted according to the shape and size of the light emitting device. Further, the light-reflecting member may contain other pigments, phosphors and the like in addition to the light-reflecting substance. In particular, when the translucent member 3 contains a phosphor, the second light-reflecting resin 9d also contains the same phosphor, so that the light emitted from the light emitting element leaks from the side surface of the light emitting device. Can be suppressed from being visually recognized.

(Light guide member 13)
In the light emitting device, as described above, the light transmitting member 3 and the light emitting element are joined via, for example, the light guide member 13. As shown in FIG. 2A, the light guide member 13 may cover a part or all of the side surface of the light emitting element 1. When a part of the second surface 3b of the translucent member 3 does not face the upper surface which is the main light emitting surface of the light emitting element 1, the light guide member 13 does not face the upper surface of the light emitting element. It is preferably formed so as to cover a part of the translucent member 3. The light guide member 13 is also interposed between the light emitting element and the translucent member 3 to join the two. The light guide member 13 configured as described above can efficiently guide the light emitted from the upper surface and the side surface of the light emitting element 1 to the translucent member 3.

It is preferable to use a resin material for the light guide member 13 from the viewpoint of easy handling and processing. As the resin material, a resin material including a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, a resin containing at least one of a fluororesin, a hybrid resin, or the like can be used. The light guide member 13 can be formed into the above-described shape by appropriately adjusting the viscosity of the resin material for forming the light guide member 13 and the wettability between the resin material and the light emitting element 1.

(Other parts)
The light emitting device may optionally have another element such as a protective element, an electronic component, or the like. It is preferable that these elements and electronic components are embedded in a light-reflecting member.

<Manufacturing method of the light emitting device of the first embodiment>
The method for manufacturing the light emitting device of the first embodiment includes a mounting step of mounting a light emitting element on a substrate, a light shielding frame mounting step of mounting a light shielding frame having an opening on a sheet, and a first surface and the first surface thereof. A plate-shaped translucent member having a second surface opposite to one surface and having an outer periphery of the first surface smaller than the inner circumference of the opening, and the first surface facing the sheet and A step of placing a translucent member in which a space is provided between the translucent member and the opening and the translucent member is placed in the opening, and a first light-reflecting resin is filled in the space and the first light A light guide support member forming step of forming a reflective member and producing a light guide support member in which the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member, and a light emitting element mounted. A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface and the second surface, and a second light reflective resin are placed between the substrate and the light shielding frame. It includes a second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling.
According to the method for manufacturing the light emitting device of the first embodiment, for example, the light emitting device of the embodiment shown in FIGS. 1A, 1B and 2A to 2C can be manufactured.
Hereinafter, the method for manufacturing the light emitting device of the first embodiment will be described with reference to the drawings.

(Mounting process)
Here, as shown in FIG. 7A, the light emitting element 1 is flip-chip mounted on the substrate 10.
Specifically, for example, a light emitting element 1 having positive and negative electrodes (not shown) on the lower surface on the same surface side, the positive electrode faces the positive wiring provided on the substrate 10, and the negative electrode is the substrate. Each of the conductive joining members 11 is joined so as to face the negative wiring provided on the 10. In addition, in FIGS. 7A, 7E and 7F, as in FIG. 2A and the like, the positive and negative electrodes of the light emitting element 1 and the conductive joining member 11 connected to the positive and negative wiring (not shown) provided on the substrate 10 are distinguished. It is drawn in a simplified manner without any need.

(Shading frame mounting process)
Here, a light-shielding frame 5 and a sheet 4 having an opening 5a are prepared, and as shown in FIG. 7B, the light-shielding frame 5 is placed on the sheet 4.
As the light-shielding frame, a light-shielding frame processed into a desired shape may be prepared in advance, and a plurality of light-shielding frames may be individually arranged on the sheet, or a plurality of light-shielding frames may be arranged in a row direction and / or a column for each unit area. Light-shielding frames connected in the direction may be prepared and collectively arranged on the sheet. As the sheet, it is preferable to use a heat-resistant sheet having an adhesive surface. Examples of the base material of the sheet include polyimide.

(Translucent member mounting process)
Here, it has a first surface 3a and a second surface 3b on the opposite side of the first surface 3a, and the outer circumference of the first surface is smaller than the inner circumference of the opening 5a of the light-shielding frame 5. Using the member 3, as shown in FIG. 7C, the first surface 3a of the translucent member 3 faces the sheet, and a space is provided between the translucent member 3 and the opening 5a of the light-shielding frame 5. The translucent member 3 is placed in the opening.
Specifically, for example, the translucent member 3 is adsorbed on the suction collet and positioned so that the inner circumference of the opening 5a of the light-shielding frame 5 is located outside the outer circumference of the first surface 3a of the translucent member. Then, the suction collet is moved downward, and the translucent member 3 is placed on the sheet.
In the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1A and 2A, as the translucent member 3, a member whose outer circumference of the second surface 3b is larger than the inner circumference of the opening 5a of the light shielding frame 5 is used. For example, when the opening 5a and the second surface 3b of the translucent member 3 are both rectangular having a long side and a short side, both the long side and the short side of the second surface 3b are the openings 5a. Use one that is larger than the long side and short side. Further, in the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1B and 2B, as the translucent member 3, a part of the outer circumference of the second surface 3b is formed on the inner circumference of the opening 5a of the light shielding frame 5. The one larger than the part corresponding to the part of the outer circumference of the second surface 3b is used. For example, when the second surface 3b of the opening 5a and the translucent member 3 is a rectangle having a long side and a short side, the short side of the second surface 3b is larger than the short side of the opening 5a. ..

(Light guide support member forming process)
Here, as shown in FIG. 7D, a light guide support member in which the light-shielding frame 5 and the light-transmitting member 3 are supported by the first light-reflecting member 9a is produced.
Specifically, for example, the first light-reflecting resin 9c is discharged from the tip of the nozzle of the resin discharge device into the space between the translucent member 3 and the opening 5a of the light-shielding frame 5, and the first light is reflected. The sex resin 9c is filled. The first light-reflecting resin 9c is filled so as to flow through the translucent member 3 and into the opening 5a of the light-shielding frame 5.
After filling the space between the translucent member 3 and the opening 5a of the light-shielding frame 5 with the first light-reflecting resin 9c, the filled first light-reflecting resin 9c is cured to cure the first light-reflecting member. Form 9a.

(Light guide support member joining process)
Here, as shown in FIG. 7E, the light guide support member is fixed on the light emitting element 1 by joining the second surface 3b of the translucent member 3 to the light emitting surface (that is, the upper surface) of the mounted light emitting element 1. To do.
The translucent member 3 of the light guide support member obtained as described above is aligned with the light emitting element 1, and the translucent member 3 emits light from the light emitting element 1 by, for example, the light guide member 13. Join to the surface.
In the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1A and 2A, the light guide support member is, for example,
(I) The outer circumference of the second surface 3b of the translucent member 3 is located outside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
(Ii) The outer circumference of the first surface 3a of the translucent member 3 is located inside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
Align.
In the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1B and 2B, the light guide support member is, for example,
(I) The outer circumference of the second surface 3b of the translucent member 3 is located outside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
(Ii) The outer circumference of the first surface 3a of the translucent member 3 is located outside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
Align.

When joining the translucent member 3 of the light guide support member and the light emitting element 1, the translucent member 3 having the light guide member 13 coated on the second surface 3b in advance is placed on the light emitting element 1. Alternatively, the light guide member 13 may be applied to the upper surface of the light emitting element 1 and then the light transmissive member 3 of the light guide support member may be placed on the light emitting element 1. The coating amount of the light guide member 13, the load when the translucent member 3 is placed on the light emitting element 1 and pressed, and the viscosity at the time of coating when a resin material is used as the light guide member 13 are derived. It may be appropriately set in consideration of the desired shape of the light guide member 13 after the translucent member 3 of the light support member is joined on the light emitting element 1.

(Sheet removal process)
The sheet 4 may be removed in a sheet removing step after the light guide support member joining step or after the second light reflective member forming step.

(Second light reflective member forming step)
Here, the uncured second light-reflecting resin 9d forming the second light-reflecting member 9b is filled in the space between the substrate 10 and the light-shielding frame 5, so that the substrate 10 and the light-shielding frame 5 are joined. A light-reflecting member (that is, a first light-reflecting member 9a and a second light-reflecting member 9b) that surrounds the light-emitting element 1 and the translucent member 3 is formed between them. In the method of manufacturing the light emitting device of the embodiment, for example, a light-shielding frame 5 that is one size smaller than the substrate 10 (that is, a size in which the outer edge is included in the substrate 10 in a plan view) is used, and the substrate is viewed from the outer peripheral side of the light-shielding frame. The space between the light-shielding frame 5 and the light-shielding frame 5 is filled with the second light-reflecting resin 9d. Note that FIG. 7F is an example in which the sheet 4 is removed before the second light-reflecting member forming step.
After filling the space between the substrate 10 and the light-shielding frame 5 with the second light-reflecting resin 9d, the filled second light-reflecting resin 9d is cured.

As described above, the light emitting device of the embodiment is manufactured.

(Other processes)
In the light emitting device of the embodiment, as shown in FIG. 6, a resin wall 7 may be provided between the substrate 10 and the light shielding frame 5. In the case of manufacturing the light emitting device of such an embodiment, the manufacturing method includes a resin wall forming step before the light guide support member joining step. In the resin wall forming step, the resin wall is formed at a predetermined distance from the opening of the light-shielding frame 5 and the translucent member 3 and at positions facing each other across the opening and the translucent member. As the resin wall 7, a resin wall 7 having a predetermined height is formed on the light-shielding frame 5 and / or the substrate 10. The resin wall 7 is formed by using a resin material having a viscosity capable of maintaining its shape while being sandwiched between the substrate 10 and the light-shielding frame 5. Further, the resin wall 7 is not completely cured, but is kept flexible so that it can be deformed by pressing.

In this way, the resin wall 7 using the uncured resin material is interposed between the substrate 10 and the light-shielding frame 5, and the light guide support member is pressed to cure the resin wall 7 in a deformed state. As a result, the light-shielding frame 5 can be easily fixed at a predetermined height position, so that the height variation of each light-emitting device can be suppressed in the manufacturing process of the light-emitting device.
The resin wall 7 may be finally removed. When removing the resin wall 7, the manufacturing method includes a resin wall removing step after the second reflective member forming step. In the resin wall removing step, the outer peripheral portion of the light-shielding frame on the resin wall may be removed together with the resin wall, whereby a smaller light emitting device can be obtained.

<Manufacturing method of the light emitting device of the second embodiment>
The method for manufacturing the light emitting device of the second embodiment includes a mounting step of mounting a light emitting element on a substrate, a light shielding frame mounting step of mounting a light shielding frame having an opening on a sheet, and a first method on the light shielding frame. It has a first light-reflecting resin coating step of applying one light-reflecting resin, and a first surface and a second surface opposite to the first surface, and the outer periphery of the first surface is inside the opening. A plate-shaped translucent member smaller than the circumference and having an outer circumference of the second surface larger than the inner circumference of the opening is provided at a position where a space is formed between the translucent member and the opening. The first light-reflecting member is formed by contacting and then pressing the coated first light-reflecting resin so that one surface faces the sheet and allowing the first light-reflecting resin to flow into the space. A step of forming a light guide support member in which the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member, an upper surface of the mounted light emitting element, and the second surface. By joining the light guide support member joining step of fixing the light guide support member on the light emitting element by joining the two, and by filling the second light reflective resin between the substrate and the light shielding frame. It includes a second light-reflecting member forming step of forming a second light-reflecting member surrounding the light emitting element.
In the method for manufacturing the light emitting device of the second embodiment, for example, when the opening 5a of the light-shielding frame 5 and the second surface 3b of the translucent member 3 are both rectangular having a long side and a short side, the first By using those having both the long side and the short side of the two surfaces 3b larger than the long side and the short side of the opening 5a, for example, the light emitting device of the embodiment shown in FIGS. 1A and 2D can be manufactured.
Hereinafter, a method for manufacturing the light emitting device of the second embodiment will be described with reference to the drawings.

(Light emitting element mounting process, shading frame mounting process)
Since the light emitting element mounting step and the light shielding frame mounting step are the same as the manufacturing method of the light emitting device of the first embodiment, the description thereof will be omitted.

(1st light reflective resin coating process)
Here, as shown in FIG. 8A, the first light-reflecting resin 9c is applied onto the light-shielding frame 5.
The amount of the first light-reflecting resin 9c applied is an amount capable of forming the first light-reflecting member 9a between the light-transmitting member 3 and the light-shielding frame 5 without a gap in the next light guide support member forming step. Is preferable. However, since the light emission from the first surface 3a of the translucent member 3 which is the light emitting surface of the light emitting device is not hindered, the first light reflective resin 9c does not adhere to the first surface 3a of the translucent member 3. As described above, it is preferable to adjust the coating amount and viscosity of the first light-reflecting resin 9c.
The first light-reflecting resin 9c can be discharged from the tip of the nozzle of the resin ejection device, for example, and applied onto the light-shielding frame 5. The first light-reflecting resin 9c may be applied in a frame shape so as to surround the opening along the opening of the light-shielding frame 5, or may be applied in a linear or dot shape along the opening.
When the light-transmitting member 3 comes into contact with the first light-reflecting resin 9c coated on the light-shielding frame 5, the uncured first light-reflecting resin 9c becomes the surface of the light-shielding frame 5 and the light-transmitting member 3. The space between the translucent member and the opening is filled while covering the inner side surface of the opening 5a of the light-shielding frame 5 and the side surface of the translucent member 3.
The viscosity of the uncured first light-reflecting resin 9c is preferably, for example, 5 Pa · s or more and 15 Pa · s or less. By using a resin material having a low viscosity, it is possible to secure the flow of the resin material to more details while suppressing the generation of voids and the like.

(Light guide support member forming process)
Here, it has a first surface 3a and a second surface 3b on the opposite side of the first surface 3a, and the outer circumference of the first surface 3a is smaller than the inner circumference of the opening 5a of the light shielding frame 5, and the second surface 3b A plate-shaped translucent member 3 whose outer circumference is larger than the inner circumference of the opening 5a of the light-shielding frame 5 is used.
The translucent member 3 is shielded from light so that the first surface 3a of the translucent member 3 faces the sheet 4 at a position where a space is formed between the translucent member 3 and the opening 5a of the light-shielding frame 5. By contacting the first light-reflecting resin 9c coated on the frame 5, the first light-reflecting resin 9c flows and is arranged in the above space as shown in FIG. 8B. The first light-reflecting resin 9c may be applied on the light-shielding frame 5 in a frame shape so as to surround the opening 5a, or may be formed in a circular or linear shape along the opening 5a. It may be applied in places.
For example, in a plan view, the entire outer periphery of the second surface 3b of the translucent member 3 is arranged so as to be located outside the inner circumference of the opening 5a of the light-shielding frame 5, and the side surface of the translucent member 3 is arranged on the side surface of the light-shielding frame 5. When brought into contact with the first light-reflecting resin 9c coated above, the first light-reflecting resin 9c flows toward the first surface 3a side of the light-transmitting member 3, and the light-transmitting member 3 in a short time. The space between the side surface and the opening 5a of the light-shielding frame 5 can be filled with the first light-reflecting resin 9c. When both the opening 5a of the light-shielding frame 5 and the second surface 3b of the translucent member 3 are rectangular having a long side and a short side, the long side and the opening 5a of the second surface 3b in a plan view It is preferable to arrange the translucent member 3 and the light-shielding frame 5 so that the distance between the long sides and the distance between the short side of the second surface 3b and the short side of the opening 5a are equal.

The translucent member 3 is arranged in the opening 5a of the light-shielding frame 5, the above-mentioned space is filled with the first light-reflecting resin 9c, and then the first light-reflecting resin 9c is cured to obtain the first light. The reflective member 9a is formed. As a result, as shown in FIG. 8C or FIG. 8D, a light guide support member in which the light-shielding frame 5 and the translucent member 3 are supported by the first light-reflecting member 9a can be produced.

The sheet 4 may be removed after the light guide support member joining step or after the second light reflective member forming step.

(Light guide support member joining process, second light reflective member forming process)
Since the light guide support member joining step and the second light reflecting member forming step are the same as the manufacturing method of the light emitting device of the first embodiment, the description thereof will be omitted.

<Manufacturing method of the light emitting device of the third embodiment>
The method for manufacturing the light emitting device of the third embodiment includes a mounting step of mounting a light emitting element on a substrate, a light shielding frame mounting step of mounting a light shielding frame having an opening on a sheet, and a first method on the light shielding frame. It has a first light-reflecting resin coating step of applying one light-reflecting resin, and a first surface and a second surface opposite to the first surface, and the outer periphery of the first surface is inside the opening. A plate-shaped translucent member smaller than the circumference and a part of the outer periphery of the second surface larger than the inner circumference of the opening, and a position where a space is formed between the translucent member and the opening. The first light-reflecting resin is brought into contact with the coated first light-reflecting resin so that the first surface faces the sheet and then pressed, and the first light-reflecting resin is allowed to flow into the space to have the first light-reflecting property. A light guide support member forming step of forming a member and producing a light guide support member in which the light-shielding frame and the light-transmitting member are supported by a first light-reflecting member, an upper surface of the mounted light emitting element, and the above. A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the second surface, and filling a second light reflective resin between the substrate and the light shielding frame. This includes a second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element.
In the method for manufacturing the light emitting device of the third embodiment, when the outer circumference of the second surface 3b of the translucent member 3 and the outer circumference of the second surface 3b of the translucent member 3 are both substantially rectangular, the first At least one side of the two surfaces 3b, preferably two opposing sides, is larger than the inner peripheral side of the corresponding opening 5a. For example, when the opening 5a of the light-shielding frame 5 and the second surface 3b of the translucent member 3 are both rectangular having a long side and a short side, the short side of the second surface 3b is the short side of the opening 5a. By using a device larger than the side, the light emitting device of the embodiment shown in FIGS. 1B, 2E and 2F can be manufactured.
For example, in the light guide support member forming step, light transmission is performed so that one side of the outer circumference of the second surface 3b of the light transmission member 3 is located outside one side of the inner circumference of the opening 5a of the light shielding frame 5 in a plan view. The sex member 3 is brought into contact with the first light-reflecting resin 9c coated on the light-shielding frame 5. As a result, the first light-reflecting resin 9c can be made to flow toward the light-transmitting member 3, and the space between the light-shielding frame 5 and the opening 5a can be filled with the first light-reflecting resin 9c. it can.

The method for manufacturing the light emitting device of the third embodiment is different from the method for manufacturing the light emitting device of the second embodiment in that the shape of the translucent member 3 is different, and the other manufacturing methods are the same. That is, in the method for manufacturing the light emitting device of the second embodiment, the translucent member 3 in which the entire outer circumference of the second surface 3b is larger than the inner circumference of the opening 5a of the light shielding frame 5 is used, whereas in the third embodiment In the method of manufacturing the light emitting device, a translucent member 3 in which a part of the outer circumference of the second surface 3b is larger than the inner circumference of the opening 5a is used. As a result, the first light-reflecting resin 9c that is partially contacted can flow toward the light-transmitting member 3, and the flow state of the first light-reflecting resin 9c can be easily changed from the second surface 3b side. Can be visually recognized. In this way, a part of the outer circumference of the second surface of the translucent member 3 shown in FIG. 1B is located outside the inner circumference of the opening 5a of the light-shielding frame 5, and the rest of the outer circumference of the second surface is located. A light emitting device having a configuration located inside the inner circumference of the opening 5a can be manufactured.

As described above, the method for manufacturing the light emitting device of the third embodiment is the same as the method for manufacturing the light emitting device of the second embodiment except that the translucent member 3 used is different, and thus other description will be omitted.

As described above, the light emitting device of the embodiment is manufactured.

In the above description, a single light emitting device has been described with reference to the illustrated drawings.
However, in the method for manufacturing the light emitting device of the first to third embodiments, a plurality of light emitting devices are collectively divided into a plurality of unit areas corresponding to the individual light emitting devices as the substrate and the light shielding frame. It is preferable that the light emitting device is separated into individual light emitting devices after the production.
For example, as the substrate and the light-shielding frame, a substrate containing a plurality of (n × m) unit areas so as to form a plurality of rows (n rows) and a plurality of columns (m columns) may be used.
Further, for example, as the light-shielding frame, a light-shielding frame including a plurality of (n × m) unit areas so as to form a plurality of rows (n rows) and a plurality of columns (m columns) corresponding to the substrate may be used. Alternatively, for example, as a light-shielding frame, a plurality of (n × m) light-shielding frames are used so as to form a plurality of rows (n rows) and a plurality of columns (m columns) corresponding to the substrate, and each light-shielding frame is used as a unit area. Good.

Create a plurality of light emitting devices as follows.
(1) In the light emitting element mounting step, one or two or more light emitting elements 1 are mounted in the unit regions, respectively.
(2) Regarding the method for manufacturing the light emitting device of the first embodiment, when the resin forming step is performed before the light guide support member forming step, the opening is separated from the opening and the translucent member by a predetermined distance, and the opening. A resin wall is formed for each unit region at positions facing each other across the translucent member.
When a light-shielding frame containing a plurality of (n × m) unit areas so as to form a plurality of rows (n rows) and a plurality of columns (m columns), for example, a plurality of resin walls parallel to each other are arranged in columns. By forming in the direction, it becomes possible to form the resin walls of a plurality of unit regions arranged in the row direction by one continuous resin wall, and the resin wall can be efficiently formed.
(3) In the light guide support member joining step, the light guide support members are joined so as to collectively cover one or more light emitting elements 1 mounted in the unit region.
(4) In the second light-reflecting member forming step, the space between the substrate and the light-shielding frame in each unit region is filled with the light-reflecting resin.
Then, after the light-reflecting member forming step, in the dividing step, the light-reflecting member and the substrate are divided into unit regions to individualize the light emitting device. The division can be performed, for example, by cutting with a blade or the like.
Considering that the unit region is divided, it is preferable that the division position when the unit region is divided is separated from the outer periphery of the light-shielding frame 5. In other words, the light-shielding frame 5 is preferably one size smaller than the outer shape of the light emitting device. In this case, for example, as the light-shielding frame, a plurality of light-shielding frames that are one size smaller than the outer shape of the light emitting device may be used.

According to the above method for manufacturing a light emitting device, since a plurality of light emitting devices are collectively manufactured and then separated into individual light emitting devices, the light emitting device can be manufactured at low cost.

1 Light emitting element 3 Translucent member 3a First surface (light emitting surface of light emitting device)
3b Second surface (light incident surface of light emitting device)
4 Sheet 5 Light-shielding frame 5a Opening 5b Recess 7 Resin wall 9a 1st light-reflecting member 9b 2nd light-reflective member 9c 1st light-reflective resin 9d 2nd light-reflective resin 10 Substrate 11 Conductive joining member 13 Light guide member 30 Suction collet 35 Nozzle

Claims (11)

The mounting process for mounting the light emitting element on the substrate,
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
A plate-shaped translucent member having a first surface and a second surface on the opposite side of the first surface, the outer periphery of the first surface being smaller than the inner circumference of the opening, and the first surface being said. A translucent member mounting step of facing the sheet and providing a space between the translucent member and the opening and mounting the translucent member in the opening.
The space is filled with the first light-reflecting resin to form the first light-reflecting member, and the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member. And the process of forming the light guide support member
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
A method for manufacturing a light emitting device including. The second surface of the translucent member is larger than the first surface.
In the translucent member mounting step, the translucent member is mounted so that at least a part of the outer periphery of the second surface is located outside the inner circumference of the opening when viewed in a plan view from above. The method for manufacturing a light emitting device according to claim 1. Before the light guide support member forming step, a resin wall is formed at a position facing the opening and the translucent member at a predetermined distance from the opening and the translucent member. The method for manufacturing a light emitting device according to claim 1 or 2, which includes a forming step. The method for manufacturing a light emitting device according to claim 3, further comprising a resin wall removing step of removing the resin wall. The mounting process for mounting the light emitting element on the substrate,
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and the outer circumference of the second surface is smaller than the inner circumference of the opening. The first light reflective member coated with a large plate-shaped translucent member so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first light-reflecting. A light guide support member forming step for producing a light guide support member supported by the member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
A method for manufacturing a light emitting device including. The mounting process for mounting the light emitting element on the substrate,
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and a part of the outer circumference of the second surface is the opening. The first coating of a plate-shaped translucent member larger than the inner circumference so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the light-reflecting resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first. A light guide support member forming step for producing a light guide support member supported by a light reflective member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
A method for manufacturing a light emitting device including. The method for manufacturing a light emitting device according to claim 5 or 6, wherein in the light guide support member forming step, the first surface of the translucent member is brought into contact with the sheet to arrange the translucent member. The substrate and the light-shielding frame are divided into a plurality of unit areas.
In the mounting step, one or two or more light emitting elements are mounted in the unit region, respectively.
In the light guide support member forming step, the light guide support members are formed in the unit regions, respectively.
In the light guide support member joining step, the light guide support member is joined so as to collectively cover the one or more light emitting elements mounted in the unit region.
In the second light-reflecting member forming step, the second light-reflecting resin is filled between the substrate and the light-shielding frame in each unit region.
The method for manufacturing a light emitting device according to any one of claims 1 to 7 , further comprising a dividing step of dividing each unit region after the second light reflecting member forming step. The method for manufacturing a light emitting device according to any one of claims 1 to 8 , further comprising a sheet removing step of removing the sheet after the light guide support member joining step. A claim for joining the translucent member so that the outer periphery of the first surface of the translucent member is located inside the outer periphery of the light emitting element when viewed from above in a plan view in the light guide support member joining step. Item 8. The method for manufacturing a light emitting device according to any one of Items 1 to 9 . The method for manufacturing a light emitting device according to any one of claims 1 to 10 , wherein the translucent member includes a phosphor.

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