JP2018043308A - Cutting device - Google Patents
Cutting device Download PDFInfo
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- JP2018043308A JP2018043308A JP2016178860A JP2016178860A JP2018043308A JP 2018043308 A JP2018043308 A JP 2018043308A JP 2016178860 A JP2016178860 A JP 2016178860A JP 2016178860 A JP2016178860 A JP 2016178860A JP 2018043308 A JP2018043308 A JP 2018043308A
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- cutting
- cleaning water
- blade
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Auxiliary Devices For Machine Tools (AREA)
Abstract
【課題】洗浄水の使用量を抑えつつ光学センサへの汚れの付着を防止可能な非接触セットアップ機構を具備した切削装置を提供する。【解決手段】被加工物を保持するチャックテーブルと、被加工物を切削ブレードで切削する切削ユニットと、切削ブレードの先端位置を検出する検出手段と、これらを制御する制御手段とを備えた切削装置であって、検出手段はU形状ブレード侵入部63と、ブレード侵入部の一方の側に配設された発光部64と、他方の側に配設された発光部からの光の受光部64と、発光部及び受光部の端面に洗浄水を供給し端面への切削屑の付着を防止する洗浄水ノズル68と、端面にエアーを供給するエアー供給ノズル70とを含み、切削ブレードの先端位置を検出する時は洗浄水供給ノズル及びエアー供給ノズルからの洗浄水及びエアーの供給を停止し、それ以外の待機時は洗浄水及びエアーを端面に間欠的に供給し端面に付着した切削屑を除去する。【選択図】図6An object of the present invention is to provide a cutting device having a non-contact set-up mechanism capable of preventing dirt from adhering to an optical sensor while suppressing the amount of cleaning water used. A cutting table includes a chuck table for holding a workpiece, a cutting unit for cutting the workpiece with a cutting blade, a detecting means for detecting a tip position of the cutting blade, and a control means for controlling these. The detection means comprises a U-shaped blade intrusion portion 63, a light emitting portion 64 disposed on one side of the blade intrusion portion, and a light receiving portion 64 for light from the light emitting portion disposed on the other side. A cleaning water nozzle 68 for supplying cleaning water to the end surfaces of the light emitting unit and the light receiving unit to prevent the attachment of cutting chips to the end surfaces; and an air supply nozzle 70 for supplying air to the end surfaces. When detecting, the supply of cleaning water and air from the cleaning water supply nozzle and air supply nozzle is stopped, and at other times, the cleaning water and air are intermittently supplied to the end face to remove cutting chips attached Remove . [Selection diagram] FIG.
Description
本発明は、切削装置に関し、特に、非接触セットアップ機構の光学センサへの洗浄水の供給を抑制しつつ光学センサの汚れを防止可能な切削装置に関する。 The present invention relates to a cutting device, and more particularly to a cutting device capable of preventing contamination of an optical sensor while suppressing supply of cleaning water to the optical sensor of a non-contact setup mechanism.
半導体ウェーハやセラミックス、ガラス等の精密切削が必要となる種々の電子部品は、ダイシングソーと呼ばれる切削装置で個々のチップに分割される。これらの電子部品の加工にはミクロン単位の精密な切断が必要であり、それにはチップのサイズのみならず切り込み深さも重要となる。 Various electronic components that require precision cutting, such as semiconductor wafers, ceramics, and glass, are divided into individual chips by a cutting device called a dicing saw. The processing of these electronic components requires precise cutting in micron units, and not only the chip size but also the cutting depth is important.
例えば、半導体ウェーハはダイシングテープに固定され、ダイシングテープに切削ブレードを10〜30μm程度切り込ませて半導体ウェーハが完全切断されるが、このダイシングテープへの切り込み量が足りなければウェーハは不完全切断となり、下側の切断片は欠けたようなギザギザ状態となってしまう。 For example, a semiconductor wafer is fixed to a dicing tape, and a cutting blade is cut into the dicing tape by about 10 to 30 μm to completely cut the semiconductor wafer. However, if the cutting amount into the dicing tape is not sufficient, the wafer is incompletely cut. Thus, the cut piece on the lower side is in a jagged state as if it were missing.
また、切削に用いる切削ブレードは、切削加工を継続するにつれて磨耗していく性質を持っており、切削ブレードの摩耗による切り込み深さの変動を随時補正していく必要がある。 Further, the cutting blade used for cutting has a property of being worn as cutting is continued, and it is necessary to compensate for variations in the cutting depth due to wear of the cutting blade as needed.
こうした切削ブレードの刃先位置の変動は、光学センサを使用した非接触セットアップ機構により随時検出され、検出結果に基づいて切削ブレードの高さ位置の補正(原点位置補正)を行うようにしている(例えば、特開平11−214334号公報参照)。この技術によって、被加工物を保持するチャックテーブルや被加工物を切断せずに、切削ブレードを傷めることなく容易に切削ブレードの高さ位置を検出することができる。 Such variation in the cutting edge position of the cutting blade is detected at any time by a non-contact setup mechanism using an optical sensor, and correction of the height position of the cutting blade (origin position correction) is performed based on the detection result (for example, JP, 11-214334, A). With this technique, the height position of the cutting blade can be easily detected without damaging the cutting blade without cutting the chuck table for holding the workpiece or the workpiece.
光学センサによる切削ブレードの刃先位置(先端位置)の検出で重要なのは、光学センサの誤認識を避けるため、発光部及び受光部からなる光学センサを清浄に保つことである。しかし、光学センサが加工室の雰囲気中にあるため、雰囲気中の切削屑が光学センサに付着し誤認識を誘発しやすいという問題がある。 What is important in the detection of the cutting edge position (tip position) of the cutting blade by the optical sensor is to keep the optical sensor composed of the light emitting part and the light receiving part clean in order to avoid erroneous recognition of the optical sensor. However, since the optical sensor is in the atmosphere of the processing chamber, there is a problem that cutting waste in the atmosphere tends to adhere to the optical sensor and cause erroneous recognition.
そこで、切削ブレードの先端位置の検出動作時以外は光学センサに洗浄水を供給するという方法が考案されたが、洗浄水を大量に消費するという問題があった。この問題を避けるため、光学センサを開閉蓋で収容し、光学センサが加工室の雰囲気にさらされるのを防ぐという方法が特開2003−211354号公報で提案された。 Therefore, a method has been devised in which cleaning water is supplied to the optical sensor except during the operation of detecting the tip position of the cutting blade, but there is a problem that a large amount of cleaning water is consumed. In order to avoid this problem, Japanese Patent Application Laid-Open No. 2003-212354 proposed a method in which the optical sensor is accommodated with an opening / closing lid to prevent the optical sensor from being exposed to the atmosphere of the processing chamber.
しかしながら、特許文献2に開示された機構では、加工室の雰囲気に大量に切削屑が含まれている場合、開閉蓋の僅かな隙間も光学センサの汚れの原因となり、誤検出を発生させる恐れが残されていた。 However, in the mechanism disclosed in Patent Document 2, when a large amount of cutting waste is contained in the atmosphere of the processing chamber, a slight gap between the opening and closing lids may cause contamination of the optical sensor, which may cause false detection. It was left.
本発明はこのような点に鑑みてなされたものであり、その目的とするところは、洗浄水の使用量を抑えつつ光学センサへの汚れの付着を防止可能な非接触セットアップ機構を具備した切削装置を提供することである。 The present invention has been made in view of the above points, and an object of the present invention is to provide a cutting with a non-contact setup mechanism capable of preventing the adhesion of dirt to the optical sensor while suppressing the amount of cleaning water used. Is to provide a device.
本発明によると、被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削ブレードで切削する切削ユニットと、該切削ブレードの先端位置を検出する検出手段と、少なくとも該チャックテーブル、該切削ユニット及び該検出手段を制御する制御手段と、を備えた切削装置であって、該検出手段は、U形状ブレード侵入部と、該ブレード侵入部の一方の側に配設された発光部と、該発光部からの光を受光する該ブレード侵入部の他方の側に配設された受光部と、該発光部及び該受光部の端面に洗浄水を供給し該端面への切削屑の付着を防止する洗浄水ノズルと、を含み、該制御手段は、該切削ブレードの先端位置を検出する検出動作時は、該洗浄水供給ノズルからの洗浄水の供給を停止し、該検出動作時以外の待機時は、洗浄水を該端面に間欠的に供給し該端面に付着した切削屑を除去することを特徴とする切削装置が提供される。 According to the present invention, a chuck table that holds a workpiece, a cutting unit that cuts the workpiece held on the chuck table with a cutting blade, a detection unit that detects a tip position of the cutting blade, and at least the A cutting apparatus comprising a chuck table, a control unit for controlling the cutting unit, and the detection means, the detection means being disposed on a U-shaped blade intrusion portion and one side of the blade intrusion portion. The light emitting unit, the light receiving unit disposed on the other side of the blade penetrating unit that receives light from the light emitting unit, and supplying cleaning water to the end surfaces of the light emitting unit and the light receiving unit A cleaning water nozzle for preventing attachment of cutting waste, and the control means stops the supply of cleaning water from the cleaning water supply nozzle during the detection operation for detecting the tip position of the cutting blade, and Other than detection operation Standby is cutting apparatus and removing the cutting chips adhered to intermittently supplied to the end face of the washing water to the end face is provided.
好ましくは、該検出手段は、該発光部及び該受光部の該端面にエアーを供給するエアー供給ノズルを更に含み、該制御手段は、該待機時に、該エアー供給ノズルから該端面にエアーを間欠的に供給し、水とエアーからなる2流体により該端面に付着した切削屑を除去する。 Preferably, the detection means further includes an air supply nozzle that supplies air to the light emitting portion and the end face of the light receiving portion, and the control means intermittently supplies air from the air supply nozzle to the end face during the standby time. The cutting waste adhering to the end face is removed by two fluids consisting of water and air.
本発明の切削装置によると、非接触セットアップ機構の光学センサに間欠的に洗浄水を供給することで、洗浄水の使用量を抑えつつ光学センサへの汚れの付着を防止することができる。 According to the cutting device of the present invention, by supplying cleaning water intermittently to the optical sensor of the non-contact setup mechanism, it is possible to prevent dirt from adhering to the optical sensor while suppressing the amount of cleaning water used.
以下、本発明の実施形態を図面を参照して詳細に説明する。図1を参照すると、本発明実施形態に係る非接触セットアップ機構(ブレード端部検出機構)を具備した切削装置2の斜視図が示されている。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a perspective view of a cutting device 2 provided with a non-contact setup mechanism (blade end detection mechanism) according to an embodiment of the present invention.
4は切削装置2のベースであり、ベース4にはチャックテーブル6が回転可能且つ図示しない加工送り手段によりX軸方向に往復動可能に配設されている。チャックテーブル6の周囲にはウォーターカバー8が配設されており、このウォーターカバー8とベース4に渡り、加工送り機構の軸部を保護するための蛇腹10が連結されている。 Reference numeral 4 denotes a base of the cutting apparatus 2. A chuck table 6 is rotatable on the base 4 and is reciprocally movable in the X-axis direction by a processing feed means (not shown). A water cover 8 is disposed around the chuck table 6, and a bellows 10 is connected across the water cover 8 and the base 4 to protect the shaft portion of the processing feed mechanism.
ベース4の後方には門型形状のコラム12が立設されている。コラム12にはY軸方向に伸長する一対のガイドレール14が固定されている。コラム12にはY軸移動ブロック16が、ボールねじ18と図示しないパルスモータとからなるY軸移動機構(割り出し送り機構)20によりガイドレール14に沿ってY軸方向に移動可能に搭載されている。 A gate-shaped column 12 is erected on the rear side of the base 4. A pair of guide rails 14 extending in the Y-axis direction are fixed to the column 12. A Y-axis moving block 16 is mounted on the column 12 so as to be movable in the Y-axis direction along the guide rail 14 by a Y-axis moving mechanism (index feed mechanism) 20 including a ball screw 18 and a pulse motor (not shown). .
Y軸移動ブロック16にはZ軸方向に伸長する一対のガイドレール22が固定されている。Y軸移動ブロック16上には、Z軸移動ブロック24がボールねじ26とパルスモータ28とからなるZ軸移動機構30によりガイドレール22に案内されてZ軸方向に移動可能に搭載されている。 A pair of guide rails 22 extending in the Z-axis direction are fixed to the Y-axis moving block 16. On the Y-axis movement block 16, a Z-axis movement block 24 is mounted on the Y-axis movement block 16 so as to be guided in the guide rail 22 by a Z-axis movement mechanism 30 including a ball screw 26 and a pulse motor 28 so as to be movable in the Z-axis direction.
Z軸移動ブロック24には切削ユニット32が取り付けられており、切削ユニット32のスピンドルハウジング34中には図4に示すスピンドル36が回転可能に収容され、スピンドル36の先端部には切削ブレード38が着脱可能に取り付けられている。Z軸移動ブロック24には更に、顕微鏡及びカメラを有する撮像ユニット40が取り付けられている。 A cutting unit 32 is attached to the Z-axis moving block 24, and a spindle 36 shown in FIG. 4 is rotatably accommodated in a spindle housing 34 of the cutting unit 32, and a cutting blade 38 is provided at the tip of the spindle 36. Removably attached. An imaging unit 40 having a microscope and a camera is further attached to the Z-axis moving block 24.
42は加工室44を画成する加工室ケーシングであり、ポリカーボネート等の透明樹脂から形成されている。加工室ケーシング42はチャックテーブル6及び切削ブレード38を収容する。加工室ケーシング42には排気口50が形成されている。 Reference numeral 42 denotes a processing chamber casing that defines the processing chamber 44, and is formed of a transparent resin such as polycarbonate. The processing chamber casing 42 accommodates the chuck table 6 and the cutting blade 38. An exhaust port 50 is formed in the processing chamber casing 42.
46は本発明実施形態に係る非接触セットアップ機構(ブレード端部検出機構)であり、その詳細は図4及び図5に示されている。取っ手48を引っ張ることにより、加工室ケーシング42の扉49を開けることができ、チャックテーブル6上に被加工物を搬入したり、チャックテーブル6から被加工物を搬出したりすることができる。 Reference numeral 46 denotes a non-contact setup mechanism (blade end detection mechanism) according to an embodiment of the present invention, the details of which are shown in FIGS. By pulling the handle 48, the door 49 of the processing chamber casing 42 can be opened, and the workpiece can be loaded onto the chuck table 6, or the workpiece can be unloaded from the chuck table 6.
図2を参照すると、チャックテーブル6が切削加工位置に移動した状態の加工室ケーシング42の横断面図が示されている。図3は加工室ケーシング42の縦断面図であり、チャックテーブル6に保持された被加工物の切削中には、切削水ノズル54からブレード先端に向かって切削水を供給し、冷却水ノズル52から切削ブレード38の加工点に向かって冷却水を供給しながら被加工物の切削を遂行する。 Referring to FIG. 2, a cross-sectional view of the processing chamber casing 42 with the chuck table 6 moved to the cutting position is shown. FIG. 3 is a longitudinal sectional view of the processing chamber casing 42. During cutting of the workpiece held on the chuck table 6, cutting water is supplied from the cutting water nozzle 54 toward the blade tip, and the cooling water nozzle 52. Then, the workpiece is cut while supplying cooling water toward the machining point of the cutting blade 38.
従って、加工室44の雰囲気中には加工屑や切削水及び冷却水のミスト56が飛散し、このような雰囲気に非接触セットアップ機構46がさらされていることになる。 Accordingly, machining waste, mist 56 of cutting water and cooling water scatters in the atmosphere of the processing chamber 44, and the non-contact setup mechanism 46 is exposed to such an atmosphere.
次に、図4乃至図6を参照して、本発明実施形態に係る非接触セットアップ機構(ブレード端部検出機構)46について詳細に説明する。図6に示すように、ベース4から円柱状のブラケット60が突出しており、このブラケット60に非接触セットアップ機構46の取り付け部材62が固定されている。取り付け部材62は、水平部62aと、U形状ブレード侵入部63を画成する垂直部62bと、傾斜部62cとを有している。 Next, the non-contact setup mechanism (blade end detection mechanism) 46 according to the embodiment of the present invention will be described in detail with reference to FIGS. As shown in FIG. 6, a columnar bracket 60 protrudes from the base 4, and the attachment member 62 of the non-contact setup mechanism 46 is fixed to the bracket 60. The attachment member 62 has a horizontal portion 62a, a vertical portion 62b that defines a U-shaped blade intrusion portion 63, and an inclined portion 62c.
ブレード侵入部63を挟んで発光部64と発光部64からの光を受光する受光部66からなる光学センサ65が配設されている(図7参照)。図4に示すように、発光部64は光ファイバー83を介して光源84に接続されており、受光部66は光ファイバー85を介して光電変換部86に接続されている。 An optical sensor 65 including a light emitting portion 64 and a light receiving portion 66 that receives light from the light emitting portion 64 is disposed with the blade intrusion portion 63 interposed therebetween (see FIG. 7). As shown in FIG. 4, the light emitting unit 64 is connected to the light source 84 through the optical fiber 83, and the light receiving unit 66 is connected to the photoelectric conversion unit 86 through the optical fiber 85.
取り付け部材62の傾斜部62cには、発光部64及び受光部66の端面に恒温調整された洗浄水を供給する洗浄水供給ノズル68と、発光部64及び受光部66の端面にエアーを供給するエアー供給ノズル70が配設されている。 The inclined portion 62c of the mounting member 62 supplies cleaning water supply nozzles 68 for supplying cleaning water whose temperature is adjusted to the end surfaces of the light emitting unit 64 and the light receiving unit 66, and supplies air to the end surfaces of the light emitting unit 64 and the light receiving unit 66. An air supply nozzle 70 is provided.
図4に示すように、洗浄水供給ノズル68は電磁切替弁76を介して洗浄水供給源78に選択的に接続され、エアー供給ノズル70は電磁切替弁80を介してエアー供給源82に選択的に接続される。 As shown in FIG. 4, the cleaning water supply nozzle 68 is selectively connected to a cleaning water supply source 78 via an electromagnetic switching valve 76, and the air supply nozzle 70 is selected as an air supply source 82 via an electromagnetic switching valve 80. Connected.
非接触セットアップ機構46を使用した切削ブレード38のセットアップ時には、Z軸送り機構30のパルスモータ28を駆動して、切削ブレード38の先端部(刃先)を非接触セットアップ機構46のブレード侵入部63に上方から侵入させていく。 At the time of setting up the cutting blade 38 using the non-contact setup mechanism 46, the pulse motor 28 of the Z-axis feed mechanism 30 is driven so that the tip portion (blade edge) of the cutting blade 38 becomes the blade entry portion 63 of the non-contact setup mechanism 46. Let it invade from above.
この時、切削ブレード38が光学センサ65の発光部64と受光部66との間を全く遮っていない場合には、受光部66が受光する光量が最大であり、この光量に対応する光電変換部86からの出力は、例えば図5に示すように5Vに設定されている。 At this time, when the cutting blade 38 does not block between the light emitting part 64 and the light receiving part 66 of the optical sensor 65, the light quantity received by the light receiving part 66 is the maximum, and the photoelectric conversion part corresponding to this light quantity. The output from 86 is set to 5 V as shown in FIG. 5, for example.
切削ブレード38がブレード侵入部63に進入されるのに従って、切削ブレード38が発光部64から出射される光ビームを遮る量が徐々に増加するので、受光部66が受光する光量は徐々に減少し、光電変換部86からの出力電圧は図5に符号87で示すように徐々に減少する。 As the cutting blade 38 enters the blade intrusion portion 63, the amount by which the cutting blade 38 blocks the light beam emitted from the light emitting portion 64 gradually increases, so the amount of light received by the light receiving portion 66 gradually decreases. The output voltage from the photoelectric conversion unit 86 gradually decreases as indicated by reference numeral 87 in FIG.
そして、切削ブレード38が発光部64と受光部66の所定位置に達した時、光電変換部86からの出力電圧が基準電圧である例えば3Vになるように設定されている。従って、光電変換部86の出力電圧が3Vになった時、電圧比較部90は光電変換部86の出力電圧が基準電圧に達した旨の信号を端部位置検出部92に出力する。 When the cutting blade 38 reaches the predetermined positions of the light emitting unit 64 and the light receiving unit 66, the output voltage from the photoelectric conversion unit 86 is set to 3 V, which is a reference voltage, for example. Therefore, when the output voltage of the photoelectric conversion unit 86 reaches 3 V, the voltage comparison unit 90 outputs a signal indicating that the output voltage of the photoelectric conversion unit 86 has reached the reference voltage to the end position detection unit 92.
端部位置検出部92は、基準位置を検出した旨の信号をパルスモータ28に送信し、パルスモータ28の駆動を停止する。この時、端部位置検出部92は、切削ブレード38の切り込み方向(Z軸方向)の位置をZ軸送り機構30のパルスモータ28のパルス数をカウントすることにより検出する。切削ブレード38の最下点端部位置である基準位置は、切削装置2のメモリに記憶される。 The end position detection unit 92 transmits a signal indicating that the reference position has been detected to the pulse motor 28 and stops driving the pulse motor 28. At this time, the end position detector 92 detects the position of the cutting blade 38 in the cutting direction (Z-axis direction) by counting the number of pulses of the pulse motor 28 of the Z-axis feed mechanism 30. The reference position that is the position of the lowest point end of the cutting blade 38 is stored in the memory of the cutting device 2.
本実施形態の非接触セットアップ方法によると、被加工物を切削ブレード38で適宜切削した後に、最下点端部検出ステップを実行して、前回割り出されて記憶された切削ブレード38の最下点端部の位置と比較し、切削ブレード38の摩耗量(消耗量)を算出部94で算出する摩耗量算出ステップを実行する。 According to the non-contact setup method of the present embodiment, after the workpiece is appropriately cut by the cutting blade 38, the lowest point end detection step is executed, and the lowest of the cutting blade 38 calculated and stored last time. Compared with the position of the point end portion, a wear amount calculation step is performed in which the calculation portion 94 calculates the wear amount (consumption amount) of the cutting blade 38.
そして、摩耗量算出ステップから算出された切削ブレード38の摩耗量に基づいて、位置補正部96で切削ブレード38のZ軸方向の原点位置を補正する。この原点位置の補正により、切削ブレード38の刃先をチャックテーブル6の枠体の上面に接触する原点位置とすることができる。 Based on the wear amount of the cutting blade 38 calculated from the wear amount calculating step, the position correcting unit 96 corrects the origin position of the cutting blade 38 in the Z-axis direction. By correcting the origin position, the cutting edge of the cutting blade 38 can be set to the origin position in contact with the upper surface of the frame body of the chuck table 6.
上述したように、非接触セットアップ機構46は加工室44の雰囲気に常にさらされている。従って、雰囲気に含まれているミスト、切削屑等により光学センサ65の発光部64及び受光部66の端面が汚染される。 As described above, the non-contact setup mechanism 46 is always exposed to the atmosphere of the processing chamber 44. Therefore, the end surfaces of the light emitting unit 64 and the light receiving unit 66 of the optical sensor 65 are contaminated by mist, cutting waste, and the like contained in the atmosphere.
この汚染を防止するために、本発明実施形態では、切削ブレード38の先端位置を検出する検出動作時以外では、洗浄水供給ノズル68から発光部64の端面及び受光部66の端面に洗浄水を間欠的に供給し、より好ましくは、洗浄水供給ノズル68及びエアー供給ノズル70から発光部64の端面及び受光部66の端面に洗浄水及びエアーを間欠的に供給し、発光部64及び受光部66の端面に付着した汚れを除去する。 In order to prevent this contamination, in the embodiment of the present invention, cleaning water is supplied from the cleaning water supply nozzle 68 to the end surface of the light emitting unit 64 and the end surface of the light receiving unit 66 except during the detection operation of detecting the tip position of the cutting blade 38. More preferably, the cleaning water and air are intermittently supplied from the cleaning water supply nozzle 68 and the air supply nozzle 70 to the end surface of the light emitting unit 64 and the end surface of the light receiving unit 66, so that the light emitting unit 64 and the light receiving unit are supplied. The dirt adhering to the end face of 66 is removed.
以下、この端面洗浄方法について、図8を参照して詳細に説明する。図8の符号Aは切削ブレード38の刃先検出中であり、この時には洗浄水供給ノズル68からの洗浄水の供給及びエアー供給ノズル70からのエアーの供給を停止する。 Hereinafter, this end face cleaning method will be described in detail with reference to FIG. 8 indicates that the cutting edge of the cutting blade 38 is being detected. At this time, the supply of the cleaning water from the cleaning water supply nozzle 68 and the supply of air from the air supply nozzle 70 are stopped.
尚、ブレード端部位置検出時には、ヒンジ74を介して取り付け部材62に取り付けられた開閉蓋72を開いて検出することは言うまでもない。検出動作が終了すると、開閉蓋72を閉じて発光部64及び受光部66が加工室44の雰囲気にさらされることを防止する。 Needless to say, when detecting the position of the blade end, the opening / closing lid 72 attached to the attachment member 62 is opened via the hinge 74. When the detection operation is completed, the open / close lid 72 is closed to prevent the light emitting unit 64 and the light receiving unit 66 from being exposed to the atmosphere of the processing chamber 44.
図8において、切削ブレード38の刃先の検出が終了した符号Bに示す被加工物の切削中には、発光部64及び受光部66の端面に向かって間欠的に洗浄水及びエアーを供給する。 In FIG. 8, during the cutting of the workpiece indicated by the symbol B for which the detection of the cutting edge of the cutting blade 38 has been completed, cleaning water and air are intermittently supplied toward the end surfaces of the light emitting unit 64 and the light receiving unit 66.
図8の第2段目に示すように、点線で示すCは供給停止期間であり、Dは供給期間である。従って、Bに示す被加工物の切削中には、供給停止期間Cと供給期間Dとを交互に繰り返す。例えば、1〜5秒毎の供給停止期間Cを実施後、0.1〜2秒程度の供給期間Dを実施する。 As shown in the second stage of FIG. 8, C indicated by a dotted line is a supply stop period, and D is a supply period. Therefore, the supply stop period C and the supply period D are alternately repeated during the cutting of the workpiece shown in B. For example, after performing the supply stop period C every 1 to 5 seconds, the supply period D of about 0.1 to 2 seconds is performed.
更に、図8の第3段目に示すように、供給期間Dにおいては、洗浄水供給ノズル68からの洗浄水の供給とエアー供給ノズル70からのエアーの供給を同時に実施する同時供給期間Eの後に、Fに示す洗浄水のみを供給する期間を設け、Cに示す供給停止期間に端面が乾燥した状態になり、切削屑が端面に付着し易くなるのを防止する。 Further, as shown in the third stage of FIG. 8, in the supply period D, the supply of the cleaning water from the cleaning water supply nozzle 68 and the supply of air from the air supply nozzle 70 are performed simultaneously. After that, a period for supplying only the cleaning water indicated by F is provided, and the end face is in a dry state during the supply stop period indicated by C, thereby preventing the cutting waste from being easily attached to the end face.
ここで、エアー供給ノズル70からのエアーの供給は、発光部64及び受光部66の端面に付いた汚れを洗浄水とともに除去する働きをする。エアーの流量は、端面が乾燥しない程度の流量に調整する。 Here, the supply of air from the air supply nozzle 70 serves to remove dirt attached to the end faces of the light emitting unit 64 and the light receiving unit 66 together with the cleaning water. The air flow rate is adjusted so that the end face does not dry.
エアーは洗浄水と混合され2流体となって端面の洗浄効果が高まるよう、洗浄水供給ノズル68とエアー供給ノズル70の噴出口を近づけて噴出後に混合されるようにしても良いし、ノズルを一体化して内部で洗浄水とエアーを混合してから噴出しても良い。 The air may be mixed with the cleaning water after being jetted so that the cleaning water supply nozzle 68 and the air supply nozzle 70 are brought close to each other so that the cleaning effect of the end face is enhanced by mixing with the cleaning water. It may be integrated and mixed with cleaning water and air, and then ejected.
上述した実施形態によると、非接触セットアップ機構46の発光部64及び受光部66の端面に間欠的に洗浄水及びエアーを供給することで、洗浄水の使用量を抑えつつ光学センサ65への汚れの付着を防止することができる。 According to the above-described embodiment, the cleaning water and the air are intermittently supplied to the end surfaces of the light-emitting unit 64 and the light-receiving unit 66 of the non-contact setup mechanism 46, so that the optical sensor 65 is contaminated while suppressing the amount of cleaning water used. Can be prevented.
この実施例の他、供給期間Dにおいて、水のみを供給し、汚れの付着を防ぎつつ、乾燥を防いでも良い。さらに、ブレード端部位置検出の直前には、エアー供給ノズル70からエアーの供給を行い、端面に付着した洗浄水を除去しても良い。 In addition to this embodiment, in the supply period D, only water may be supplied to prevent drying while preventing dirt from adhering. Further, immediately before the blade end position detection, air may be supplied from the air supply nozzle 70 to remove the cleaning water adhering to the end surface.
2 切削装置
6 チャックテーブル
32 切削ユニット
38 切削ブレード
42 加工室ケーシング
44 加工室
46 非接触セットアップ機構(ブレード端部検出機構)
62 取り付け部材
63 ブレード侵入部
64 発光部
65 光学センサ
66 受光部
68 洗浄水供給ノズル
70 エアー供給ノズル
84 光源
86 光電変換部
88 基準電圧設定部
90 電圧比較部
92 端部位置検出部
2 Cutting device 6 Chuck table 32 Cutting unit 38 Cutting blade 42 Processing chamber casing 44 Processing chamber 46 Non-contact setup mechanism (blade end detection mechanism)
62 Mounting member 63 Blade entry part 64 Light emitting part 65 Optical sensor 66 Light receiving part 68 Washing water supply nozzle 70 Air supply nozzle 84 Light source 86 Photoelectric conversion part 88 Reference voltage setting part 90 Voltage comparison part 92 End position detection part
Claims (2)
該検出手段は、
U形状ブレード侵入部と、該ブレード侵入部の一方の側に配設された発光部と、該発光部からの光を受光する該ブレード侵入部の他方の側に配設された受光部と、該発光部及び該受光部の端面に洗浄水を供給し該端面への切削屑の付着を防止する洗浄水ノズルと、を含み、
該制御手段は、
該切削ブレードの先端位置を検出する検出動作時は、該洗浄水供給ノズルからの洗浄水の供給を停止し、該検出動作時以外の待機時は、洗浄水を該端面に間欠的に供給し該端面に付着した切削屑を除去することを特徴とする切削装置。 A chuck table for holding a workpiece, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade, a detecting means for detecting a tip position of the cutting blade, at least the chuck table, and the cutting A cutting device comprising a unit and a control means for controlling the detection means,
The detection means includes
A U-shaped blade intrusion portion, a light emitting portion disposed on one side of the blade intrusion portion, a light receiving portion disposed on the other side of the blade intrusion portion for receiving light from the light emitting portion, A cleaning water nozzle that supplies cleaning water to the end surfaces of the light emitting unit and the light receiving unit and prevents the attachment of cutting waste to the end surfaces;
The control means includes
During the detection operation for detecting the tip position of the cutting blade, the supply of the cleaning water from the cleaning water supply nozzle is stopped, and during the standby time other than the detection operation, the cleaning water is intermittently supplied to the end surface. A cutting apparatus for removing cutting waste adhering to the end face.
該制御手段は、該待機時に、該エアー供給ノズルから該端面にエアーを間欠的に供給し、水とエアーとで該端面に付着した切削屑を除去することを特徴とする請求項1記載の切削装置。 The detection means further includes an air supply nozzle for supplying air to the light emitting portion and the end face of the light receiving portion,
2. The control unit according to claim 1, wherein, during the standby, the air is intermittently supplied from the air supply nozzle to the end surface to remove cutting waste adhering to the end surface with water and air. Cutting equipment.
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Cited By (7)
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CN108878128A (en) * | 2018-07-03 | 2018-11-23 | 福建晟哲自动化科技有限公司 | A kind of nano imaging testing agency of slitting blade and its detection method |
JP2021098243A (en) * | 2019-12-20 | 2021-07-01 | 株式会社ディスコ | Processing device |
TWI834199B (en) * | 2021-08-04 | 2024-03-01 | 日商Towa股份有限公司 | Processing device and method of manufacturing processed product |
JP2023023578A (en) * | 2021-08-05 | 2023-02-16 | 株式会社ディスコ | cutting equipment |
JP2023131659A (en) * | 2022-03-09 | 2023-09-22 | ブラザー工業株式会社 | Control device, machine tool, control method and computer program |
CN114571340A (en) * | 2022-05-09 | 2022-06-03 | 杭州荆鑫机械有限公司 | Polishing device and polishing method for mechanical finish machining |
CN114571340B (en) * | 2022-05-09 | 2022-09-16 | 杭州荆鑫机械有限公司 | Polishing device and polishing method for mechanical finish machining |
Also Published As
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CN107813436A (en) | 2018-03-20 |
TWI755419B (en) | 2022-02-21 |
TW201820434A (en) | 2018-06-01 |
CN107813436B (en) | 2021-06-11 |
KR102302579B1 (en) | 2021-09-14 |
KR20180029876A (en) | 2018-03-21 |
JP6800520B2 (en) | 2020-12-16 |
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