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CN107813436A - Topping machanism - Google Patents

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Publication number
CN107813436A
CN107813436A CN201710805534.5A CN201710805534A CN107813436A CN 107813436 A CN107813436 A CN 107813436A CN 201710805534 A CN201710805534 A CN 201710805534A CN 107813436 A CN107813436 A CN 107813436A
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China
Prior art keywords
cutting
air
light
tool
cutting tool
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Granted
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CN107813436B (en
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笠井刚史
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Disco Corp
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Disco Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Auxiliary Devices For Machine Tools (AREA)

Abstract

提供切削装置,其具有非接触设置机构。切削装置具有:保持被加工物的卡盘工作台;利用切削刀具来切削被加工物的切削单元;检测切削刀具的前端位置的检测构件;和控制构件,其对卡盘工作台、切削单元和检测构件进行控制,检测构件包含:刀具侵入部;配设在刀具侵入部的一侧的发光部;配设在刀具侵入部的另一侧的受光部,其接受来自发光部的光;清洗水喷嘴,其对发光部和受光部的端面提供清洗水,防止切削屑向端面附着;和空气提供喷嘴,其对端面提供空气,控制构件在检测切削刀具的前端位置的检测动作时,停止从清洗水提供喷嘴和空气提供喷嘴提供清洗水和空气,在检测动作以外的待机时,对端面间歇地提供清洗水和空气将附着在端面上的切削屑去除。

A cutting device is provided having a non-contact setting mechanism. The cutting device has: a chuck table that holds a workpiece; a cutting unit that cuts the workpiece with a cutting tool; a detection member that detects the position of the tip of the cutting tool; and a control member that controls the chuck table, the cutting unit, and the The detection component is controlled, and the detection component includes: a tool intrusion part; a light emitting part arranged on one side of the tool intrusion part; a light receiving part arranged on the other side of the tool intrusion part, which receives light from the light emitting part; washing water Nozzles for supplying cleaning water to the end surfaces of the light-emitting part and light-receiving part to prevent chips from adhering to the end surfaces; and air supply nozzles for supplying air to the end surfaces, and the control member stops cleaning from The water supply nozzle and the air supply nozzle supply cleaning water and air, and intermittently supply cleaning water and air to the end surface to remove chips adhering to the end surface during standby other than the detection operation.

Description

切削装置cutting device

技术领域technical field

本发明涉及切削装置,尤其涉及既能够抑制向非接触设置机构的光学传感器提供清洗水又能够防止光学传感器的污染的切削装置。The present invention relates to a cutting device, and more particularly, to a cutting device capable of preventing contamination of the optical sensor while suppressing supply of washing water to an optical sensor of a non-contact installation mechanism.

背景技术Background technique

通过利用被称为划片机的切削装置将半导体晶片或陶瓷、玻璃等需要精密切削的各种电子部件分割成各个芯片。在这些电子部件的加工中需要微米单位的精密的切断,对于该切断而言不仅芯片的尺寸很重要,切入深度也很重要。Various electronic components requiring precise cutting such as semiconductor wafers, ceramics, and glass are divided into individual chips by using a cutting device called a dicing machine. In the processing of these electronic components, precise dicing in the order of microns is required, and not only the size of the chip but also the depth of incision is important for this dicing.

例如,将半导体晶片固定在划片带上,使切削刀具在划片带中切入10~30μm左右而将半导体晶片完全切断,但如果针对该划片带的切入量不足,则无法将晶片完全切断,成为下侧的切断片缺失的锯齿状态。For example, the semiconductor wafer is fixed on the dicing tape, and the cutting tool is cut into the dicing tape by about 10 to 30 μm to completely cut the semiconductor wafer. However, if the cutting amount for the dicing tape is insufficient, the wafer cannot be completely cut. , it becomes a jagged state in which the cut piece on the lower side is missing.

并且,在切削中使用的切削刀具具有随着继续进行切削加工而产生磨损的性质,需要随时校正因切削刀具的磨损而导致的切入深度的变动。In addition, the cutting tool used for cutting has the property of being worn as the cutting process is continued, and it is necessary to correct the fluctuation of the depth of cut due to the wear of the cutting tool at any time.

通过使用了光学传感器的非接触设置机构来随时检测这样的切削刀具的刃尖位置的变动,根据检测结果来进行切削刀具的高度位置的校正(原点位置校正)(例如,参照日本特开平11-214334号公报)。根据该技术,能够容易地对切削刀具的高度位置进行检测而不会将保持被加工物的卡盘工作台或被加工物切断,不会损伤到切削刀具。Such a change in the position of the edge of the cutting tool is detected at any time by a non-contact setting mechanism using an optical sensor, and the height position of the cutting tool is corrected (origin position correction) based on the detection result (for example, refer to Japanese Patent Application Laid-Open No. 11- 214334). According to this technique, the height position of the cutting tool can be easily detected without cutting off the chuck table holding the workpiece or the workpiece, and without damaging the cutting tool.

由于对于光学传感器对切削刀具的刃尖位置(前端位置)的检测而言,重要的是避免光学传感器的误识别,所以需将由发光部和受光部构成的光学传感器保持为清洁。但是,由于光学传感器处于加工室的气体中,所以存在气体中的切削屑附着在光学传感器上而容易诱发误识别的问题。Since it is important for the optical sensor to detect the edge position (tip position) of the cutting tool to avoid misrecognition by the optical sensor, it is necessary to keep the optical sensor composed of a light emitting part and a light receiving part clean. However, since the optical sensor is in the gas of the processing chamber, there is a problem that cutting chips in the gas adhere to the optical sensor and easily induce false recognition.

因此,提出了在切削刀具的前端位置的检测动作以外对光学传感器提供清洗水的方法,但存在大量消耗清洗水的问题。为了避免该问题,在日本特开2003-211354号公报中提出了利用开闭盖来收纳光学传感器,防止光学传感器暴露在加工室的气体中的方法。Therefore, a method of supplying cleaning water to the optical sensor other than the detection operation of the tip position of the cutting tool has been proposed, but there is a problem that a large amount of cleaning water is consumed. In order to avoid this problem, Japanese Patent Application Laid-Open No. 2003-211354 proposes a method of accommodating the optical sensor with an openable cover to prevent the optical sensor from being exposed to the gas in the processing chamber.

专利文献1:日本特开平11-214334号公报Patent Document 1: Japanese Patent Application Laid-Open No. 11-214334

专利文献2:日本特开2003-211354号公报Patent Document 2: Japanese Patent Laid-Open No. 2003-211354

但是,在专利文献2所公开的机构中,当在加工室的气体中包含大量切削屑的情况下,仍留有开闭盖的微小的间隙也会成为光学传感器的污染的原因而产生误检测的可能性。However, in the mechanism disclosed in Patent Document 2, when a large amount of cutting chips is contained in the gas in the processing chamber, there is still a small gap in which the opening and closing cover remains, which may cause contamination of the optical sensor and cause erroneous detection. possibility.

发明内容Contents of the invention

本发明是鉴于这样的点而完成的,其目的在于,提供切削装置,该切削装置具有既能够抑制清洗水的使用量又能够防止污染附着在光学传感器上的非接触设置机构。The present invention has been made in view of the above points, and an object of the present invention is to provide a cutting device having a non-contact installation mechanism capable of suppressing the amount of washing water used and preventing contamination from adhering to an optical sensor.

根据本发明,提供切削装置,该切削装置具有:卡盘工作台,其对被加工物进行保持;切削单元,其利用切削刀具对该卡盘工作台所保持的被加工物进行切削;检测构件,其对该切削刀具的前端位置进行检测;以及控制构件,其至少对该卡盘工作台、该切削单元和该检测构件进行控制,该切削装置的特征在于,该检测构件包含:U形状的刀具侵入部;发光部,其配设在该刀具侵入部的一侧;受光部,其配设在该刀具侵入部的另一侧,接受来自该发光部的光;以及清洗水喷嘴,其对该发光部和该受光部的端面提供清洗水,防止切削屑向该端面附着,在对该切削刀具的前端位置进行检测的检测动作时,该控制构件停止从该清洗水提供喷嘴提供清洗水,在该检测动作以外的待机时,该控制构件对该端面间歇地提供清洗水,将附着在该端面上的切削屑去除。According to the present invention, there is provided a cutting device including: a chuck table that holds a workpiece; a cutting unit that cuts the workpiece held by the chuck table with a cutting tool; and a detection member that It detects the front end position of the cutting tool; and a control member controls at least the chuck table, the cutting unit and the detection member, the cutting device is characterized in that the detection member includes: a U-shaped tool an intrusion part; a light emitting part arranged on one side of the cutter intrusion part; a light receiving part arranged on the other side of the cutter intrusion part to receive light from the light emitter; and a cleaning water nozzle for the Cleaning water is supplied to the end faces of the light emitting part and the light receiving part to prevent chips from adhering to the end faces. During the detection operation for detecting the position of the tip of the cutting tool, the control means stops the supply of cleaning water from the cleaning water supply nozzle. During standby other than the detection operation, the control means intermittently supplies cleaning water to the end surface to remove cutting chips adhering to the end surface.

优选该检测构件还包含空气提供喷嘴,该空气提供喷嘴对该发光部和该受光部的该端面提供空气,该控制构件在该待机时从该空气提供喷嘴对该端面间歇地提供空气,通过水和空气将附着在该端面上的切削屑去除。Preferably, the detecting member further includes an air supply nozzle, which supplies air to the end surfaces of the light-emitting part and the light-receiving part, and the control member intermittently supplies air from the air supply nozzle to the end surface during the standby state, and passes water And the air will remove the cutting chips attached to the end face.

根据本发明的切削装置,通过对非接触设置机构的光学传感器间歇地提供清洗水,即能够抑制清洗水的使用量又能够防止污染附着在光学传感器上。According to the cutting device of the present invention, by intermittently supplying washing water to the optical sensor of the non-contact installation mechanism, it is possible to suppress the amount of washing water used and prevent contamination from adhering to the optical sensor.

附图说明Description of drawings

图1是具有本发明的非接触设置机构的切削装置的立体图。Fig. 1 is a perspective view of a cutting device having a non-contact setting mechanism of the present invention.

图2是卡盘工作台移动到切削加工位置的状态的加工室壳体的横剖视图。Fig. 2 is a cross-sectional view of the machining chamber casing in a state where the chuck table has moved to the cutting machining position.

图3是加工室壳体的纵剖视图。Fig. 3 is a longitudinal sectional view of a processing chamber casing.

图4是非接触设置机构的框图。Fig. 4 is a block diagram of a non-contact setting mechanism.

图5是示出与切削刀具的切入方向的位置对应的非接触设置机构的输出电压的变化的图表。5 is a graph showing changes in the output voltage of the non-contact setting mechanism corresponding to the position in the cutting direction of the cutting tool.

图6是非接触设置机构的立体图。Fig. 6 is a perspective view of a non-contact setting mechanism.

图7是非接触设置机构的侧视图。Fig. 7 is a side view of the non-contact setting mechanism.

图8是对清洗水的提供方法的推移进行说明的说明图。FIG. 8 is an explanatory diagram illustrating transitions in the method of supplying washing water.

标号说明Label description

2:切削装置;6:卡盘工作台;32:切削单元;38:切削刀具;42:加工室壳体;44:加工室;46:非接触设置机构(刀具端部检测机构);62:安装部件;63:刀具侵入部;64:发光部;65:光学传感器;66:受光部;68:清洗水提供喷嘴;70:空气提供喷嘴;84:光源;86:光电转换部;88:基准电压设定部;90:电压比较部;92:端部位置检测部。2: Cutting device; 6: Chuck table; 32: Cutting unit; 38: Cutting tool; 42: Processing room shell; 44: Processing room; 46: Non-contact setting mechanism (tool end detection mechanism); 62: Mounting part; 63: Tool entry part; 64: Light emitting part; 65: Optical sensor; 66: Light receiving part; 68: Cleaning water supply nozzle; 70: Air supply nozzle; 84: Light source; 86: Photoelectric conversion part; 88: Reference Voltage setting unit; 90: voltage comparison unit; 92: end position detection unit.

具体实施方式Detailed ways

以下,参照附图对本发明的实施方式进行详细地说明。参照图1,示出了具有本发明实施方式的非接触设置机构(刀具端部检测机构)的切削装置2的立体图。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1 , there is shown a perspective view of a cutting device 2 having a non-contact setting mechanism (tool end detection mechanism) according to an embodiment of the present invention.

4是切削装置2的基座,在基座4上配设有卡盘工作台6,该卡盘工作台6能够旋转且能够通过未图示的加工进给构件在X轴方向上往复移动。在卡盘工作台6的周围配设有防水罩8,在该防水罩8和基座4的区域内,连结有用于保护加工进给机构的轴部的折皱10。4 is a base of the cutting device 2, and the chuck table 6 is arranged on the base 4, and the chuck table 6 is rotatable and can reciprocate in the X-axis direction by a machining feed member not shown. A waterproof cover 8 is disposed around the chuck table 6 , and a bellows 10 for protecting the shaft of the machining feed mechanism is connected between the waterproof cover 8 and the base 4 .

在基座4的后方竖立设置有门型形状的柱12。在柱12上固定有沿Y轴方向伸长的一对导轨14。在柱12上搭载有Y轴移动块16,该Y轴移动块16能够通过由滚珠丝杠18和未图示的脉冲电动机构成的Y轴移动机构(分度进给机构)20沿着导轨14在Y轴方向上移动。A door-shaped post 12 is erected behind the base 4 . A pair of guide rails 14 extending in the Y-axis direction are fixed to the column 12 . A Y-axis moving block 16 is mounted on the column 12, and the Y-axis moving block 16 can move along the guide rail 14 by a Y-axis moving mechanism (index feed mechanism) 20 composed of a ball screw 18 and a pulse motor (not shown). Move in the Y-axis direction.

在Y轴移动块16上固定有沿Z轴方向伸长的一对导轨22。在Y轴移动块16上搭载有Z轴移动块24,该Z轴移动块24能够通过由滚珠丝杠26和脉冲电动机28构成的Z轴移动机构30被导轨22引导而在Z轴方向上移动。A pair of guide rails 22 extending in the Z-axis direction are fixed to the Y-axis moving block 16 . The Z-axis moving block 24 is mounted on the Y-axis moving block 16, and the Z-axis moving block 24 can move in the Z-axis direction by being guided by the guide rail 22 through a Z-axis moving mechanism 30 composed of a ball screw 26 and a pulse motor 28. .

在Z轴移动块24上安装有切削单元32,在切削单元32的主轴外壳34中以能够旋转的方式收纳有图4所示的主轴36,在主轴36的前端部以能够装卸的方式安装有切削刀具38。在Z轴移动块24上还安装有具有显微镜和照相机的拍摄单元40。A cutting unit 32 is attached to the Z-axis moving block 24, a main shaft 36 shown in FIG. Cutting tool 38. An imaging unit 40 including a microscope and a camera is also mounted on the Z-axis moving block 24 .

42是构成加工室44的加工室壳体,其由聚碳酸酯等透明树脂形成。加工室壳体42对卡盘工作台6和切削刀具38进行收纳。在加工室壳体42上形成有排气口50。42 is a processing chamber casing constituting the processing chamber 44, which is formed of transparent resin such as polycarbonate. The machining chamber case 42 accommodates the chuck table 6 and the cutting tool 38 . An exhaust port 50 is formed in the processing chamber casing 42 .

46是本发明实施方式的非接触设置机构(刀具端部检测机构),在图4和图5中示出了其详细的结构。通过拉拽把手48,能够打开加工室壳体42的门49,能够将被加工物搬入到卡盘工作台6上或将被加工物从卡盘工作台6搬出。Reference numeral 46 denotes a non-contact setting mechanism (tool end detection mechanism) according to an embodiment of the present invention, and its detailed structure is shown in FIGS. 4 and 5 . By pulling the handle 48 , the door 49 of the processing chamber casing 42 can be opened, and the workpiece can be loaded onto the chuck table 6 or unloaded from the chuck table 6 .

参照图2,示出了卡盘工作台6移动到切削加工位置的状态的加工室壳体42的横剖视图。图3是加工室壳体42的纵剖视图,在对卡盘工作台6上所保持的被加工物的切削中,从切削水喷嘴54朝向刀具前端提供切削水,从冷却水喷嘴52朝向切削刀具38的加工点提供冷却水而执行被加工物的切削。Referring to FIG. 2 , it shows a cross-sectional view of the machining chamber housing 42 in a state where the chuck table 6 is moved to the cutting machining position. 3 is a longitudinal sectional view of the machining chamber housing 42. During the cutting of the workpiece held on the chuck table 6, cutting water is supplied from the cutting water nozzle 54 toward the front end of the tool, and from the cooling water nozzle 52 toward the cutting tool. The machining point 38 provides cooling water to cut the workpiece.

因此,加工屑、切削水和冷却水的雾56在加工室44的气体中飞散,非接触设置机构46暴露在这样的气体中。Therefore, the mist 56 of machining chips, cutting water, and cooling water is scattered in the gas of the machining chamber 44, and the non-contact setting mechanism 46 is exposed to such gas.

接着,参照图4至图6对本发明实施方式的非接触设置机构(刀具端部检测机构)46进行详细地说明。如图6所示,圆柱状的托架60从基座4突出,在该托架60上固定有非接触设置机构46的安装部件62。安装部件62具有:水平部62a、构成U形状的刀具侵入部63的垂直部62b以及倾斜部62c。Next, the non-contact setting mechanism (tool end detection mechanism) 46 according to the embodiment of the present invention will be described in detail with reference to FIGS. 4 to 6 . As shown in FIG. 6 , a cylindrical bracket 60 protrudes from the base 4 , and a mounting member 62 of the non-contact installation mechanism 46 is fixed to the bracket 60 . The attachment member 62 has a horizontal part 62a, a vertical part 62b and an inclined part 62c constituting the U-shaped tool entry part 63 .

由发光部64和接受来自发光部64的光的受光部66构成的光学传感器65夹着刀具侵入部63配设(参照图7)。如图4所示,发光部64经由光纤83与光源84连接,受光部66经由光纤85与光电转换部86连接。An optical sensor 65 including a light emitting unit 64 and a light receiving unit 66 that receives light from the light emitting unit 64 is disposed across the tool entry portion 63 (see FIG. 7 ). As shown in FIG. 4 , the light emitting unit 64 is connected to a light source 84 via an optical fiber 83 , and the light receiving unit 66 is connected to a photoelectric conversion unit 86 via an optical fiber 85 .

在安装部件62的倾斜部62c上配设有:清洗水提供喷嘴68,其对发光部64和受光部66的端面提供恒温调整后的清洗水;以及空气提供喷嘴70,其对发光部64和受光部66的端面提供空气。On the inclined portion 62c of the mounting member 62, there are disposed: a cleaning water supply nozzle 68 for supplying constant-temperature-adjusted cleaning water to the end surfaces of the light emitting portion 64 and the light receiving portion 66; and an air supply nozzle 70 for supplying the light emitting portion 64 and the Air is supplied to the end surface of the light receiving unit 66 .

如图4所示,清洗水提供喷嘴68经由电磁切换阀76而与清洗水提供源78选择性地连接,空气提供喷嘴70经由电磁切换阀80而与空气提供源82选择性地连接。As shown in FIG. 4 , washing water supply nozzle 68 is selectively connected to washing water supply source 78 via electromagnetic switching valve 76 , and air supply nozzle 70 is selectively connected to air supply source 82 via electromagnetic switching valve 80 .

在对使用了非接触设置机构46的切削刀具38进行设置时,对Z轴进给机构30的脉冲电动机28进行驱动而使切削刀具38的前端部(刃尖)从上方侵入到非接触设置机构46的刀具侵入部63中。When setting the cutting tool 38 using the non-contact setting mechanism 46, the pulse motor 28 of the Z-axis feed mechanism 30 is driven so that the front end (edge) of the cutting tool 38 enters the non-contact setting mechanism from above. 46 of the tool intrusion into the portion 63 .

此时,在切削刀具38完全未对光学传感器65的发光部64与受光部66之间进行遮挡的情况下,受光部66所接受的光量是最大的,与该光量对应的来自光电转换部86的输出例如如图5所示的那样被设定为5V。At this time, when the cutting tool 38 does not block the space between the light-emitting part 64 and the light-receiving part 66 of the optical sensor 65 at all, the amount of light received by the light-receiving part 66 is the largest, and the light corresponding to the amount of light comes from the photoelectric conversion part 86. The output of is set to 5V, for example, as shown in FIG. 5 .

随着切削刀具38进入到刀具侵入部63中,切削刀具38对从发光部64射出的光束的遮挡量逐渐增加,因此受光部66所接受的光量逐渐减少,来自光电转换部86的输出电压在图5中如标号87所示的那样逐渐减少。As the cutting tool 38 enters the tool intrusion portion 63, the cutting tool 38 gradually increases the blocking amount of the light beam emitted from the light emitting portion 64, so the amount of light received by the light receiving portion 66 gradually decreases, and the output voltage from the photoelectric conversion portion 86 is at The taper is shown at 87 in FIG. 5 .

然后,当切削刀具38到达了发光部64与受光部66之间的规定的位置时,来自光电转换部86的输出电压例如被设定为基准电压即3V。因此,当光电转换部86的输出电压为3V时,电压比较部90将光电转换部86的输出电压达到基准电压的意思的信号输出给端部位置检测部92。Then, when the cutting blade 38 reaches a predetermined position between the light emitting unit 64 and the light receiving unit 66 , the output voltage from the photoelectric conversion unit 86 is set to, for example, 3V which is a reference voltage. Therefore, when the output voltage of the photoelectric conversion unit 86 is 3V, the voltage comparison unit 90 outputs a signal indicating that the output voltage of the photoelectric conversion unit 86 has reached the reference voltage to the end position detection unit 92 .

端部位置检测部92将已检测到基准位置的意思的信号发送给脉冲电动机28,使脉冲电动机28的驱动停止。此时,端部位置检测部92通过对Z轴进给机构30的脉冲电动机28的脉冲数进行计数来检测切削刀具38的切入方向(Z轴方向)上的位置。切削刀具38的作为最下点端部位置的基准位置被存储在切削装置2的存储器中。The end position detection unit 92 sends a signal indicating that the reference position has been detected to the pulse motor 28 to stop the drive of the pulse motor 28 . At this time, the end position detector 92 detects the position of the cutting tool 38 in the cutting direction (Z-axis direction) by counting the number of pulses of the pulse motor 28 of the Z-axis feed mechanism 30 . The reference position as the lowest point end position of the cutting tool 38 is stored in the memory of the cutting device 2 .

根据本实施方式的非接触设置方法,在利用切削刀具38对被加工物进行适当切削之后,执行磨损量计算步骤,执行最下点端部检测步骤而与上次算出而存储的切削刀具38的最下点端部的位置进行比较,利用计算部94来计算切削刀具38的磨损量(消耗量)。According to the non-contact setting method of the present embodiment, after the workpiece is properly cut with the cutting tool 38, the wear amount calculation step is performed, and the lowest point end detection step is performed to compare the value of the cutting tool 38 calculated and stored last time. The position of the end portion of the lowest point is compared, and the wear amount (consumption amount) of the cutting tool 38 is calculated by the calculation unit 94 .

然后,根据从磨损量计算步骤计算的切削刀具38的磨损量,利用位置校正部96对切削刀具38的Z轴方向的原点位置进行校正。通过该原点位置的校正,能够使切削刀具38的刃尖处于与卡盘工作台6的框体的上表面接触的原点位置。Then, the position of the origin of the cutting tool 38 in the Z-axis direction is corrected by the position correction unit 96 based on the wear amount of the cutting tool 38 calculated in the wear amount calculating step. By correcting the origin position, the edge of the cutting tool 38 can be placed at the origin position where it contacts the upper surface of the frame of the chuck table 6 .

如上述那样,非接触设置机构46总是暴露在加工室44的气体中。因此,光学传感器65的发光部64和受光部66的端面被气体中所含有的雾、切削屑等污染。As described above, the non-contact setting mechanism 46 is always exposed to the gas in the processing chamber 44 . Therefore, the end surfaces of the light emitting unit 64 and the light receiving unit 66 of the optical sensor 65 are contaminated with mist, cutting chips, and the like contained in the gas.

为了防止该污染,在本发明实施方式中,在对切削刀具38的前端位置进行检测的检测动作以外,从清洗水提供喷嘴68对发光部64的端面和受光部66的端面间歇地提供清洗水,更优选从清洗水提供喷嘴68和空气提供喷嘴70对发光部64的端面和受光部66的端面间歇地提供清洗水和空气,将附着在发光部64和受光部66的端面上的污染去除。In order to prevent this contamination, in the embodiment of the present invention, in addition to the detection operation of detecting the position of the tip of the cutting tool 38, cleaning water is intermittently supplied from the cleaning water supply nozzle 68 to the end surface of the light emitting part 64 and the end surface of the light receiving part 66. , more preferably from the cleaning water supply nozzle 68 and the air supply nozzle 70 to the end surface of the light emitting part 64 and the end surface of the light receiving part 66 intermittently supply cleaning water and air, the pollution attached to the end surface of the light emitting part 64 and the light receiving part 66 is removed .

以下,参照图8对该端面清洗方法进行详细地说明。图8的标号A处于切削刀具38的刃尖检测中,此时停止从清洗水提供喷嘴68提供清洗水并且停止从空气提供喷嘴70提供空气。Hereinafter, this end surface cleaning method will be described in detail with reference to FIG. 8 . Reference numeral A in FIG. 8 is during edge detection of the cutting tool 38 , at which time the supply of washing water from the washing water supply nozzle 68 and the supply of air from the air supply nozzle 70 are stopped.

另外,在刀具端部位置检测时,当然在打开经由铰链74安装在安装部件62上的开闭盖72之后进行检测。当检测动作结束时,关闭开闭盖72而防止发光部64和受光部66暴露在加工室44的气体中。In addition, when detecting the position of the tool end, of course, the detection is performed after opening the opening and closing cover 72 attached to the mounting member 62 via the hinge 74 . When the detection operation is completed, the opening and closing cover 72 is closed to prevent the light emitting unit 64 and the light receiving unit 66 from being exposed to the gas in the processing chamber 44 .

在图8中,在切削刀具38的刃尖的检测结束后的标号B所示的被加工物的切削中,朝向发光部64和受光部66的端面间歇地提供清洗水和空气。In FIG. 8 , cleaning water and air are intermittently supplied toward the end surfaces of the light-emitting portion 64 and the light-receiving portion 66 during cutting of the workpiece indicated by reference numeral B after the detection of the cutting edge of the cutting tool 38 is completed.

如图8的第2行所示,虚线所示的C是提供停止期间,D是提供期间。因此,在B所示的被加工物的切削中,提供停止期间C和提供期间D交替重复。例如,每实施1~5秒的提供停止期间C之后,便实施0.1~2秒左右的提供期间D。As shown in the second row of FIG. 8 , C indicated by a dotted line is a supply stop period, and D is a supply period. Therefore, in the cutting of the workpiece shown in B, the supply stop period C and the supply period D are alternately repeated. For example, after the supply stop period C is implemented for 1 to 5 seconds, the supply period D is implemented for about 0.1 to 2 seconds.

此外,如图8的第3行所示,在提供期间D中,在同时实施从清洗水提供喷嘴68提供清洗水和从空气提供喷嘴70提供空气的同时提供期间E之后,设置了F所示的仅提供清洗水的期间,端面在C所示的提供停止期间变为干燥的状态,防止切削屑容易附着在端面上。In addition, as shown in the third line of FIG. 8 , in the supply period D, after the simultaneous supply period E in which the washing water is supplied from the washing water supply nozzle 68 and the air is supplied from the air supply nozzle 70 is simultaneously performed, the water supply shown in F is set. During the period when only the cleaning water is supplied, the end surface becomes dry during the supply stop period indicated by C, and chips are prevented from easily adhering to the end surface.

这里,来自空气提供喷嘴70的空气的提供起到了与清洗水一起将附着在发光部64和受光部66的端面上的污染去除的作用。空气的流量被调整为端面不会干燥的程度的流量。Here, the supply of air from the air supply nozzle 70 serves to remove contamination adhering to the end surfaces of the light emitting portion 64 and the light receiving portion 66 together with the washing water. The flow rate of the air is adjusted so that the end surface does not dry out.

为了使空气与清洗水混合而成为二流体而提高端面的清洗效果,可以使清洗水提供喷嘴68与空气提供喷嘴70的喷出口接近而在喷出后进行混合,也可以使喷嘴一体化而将清洗水和空气在内部混合之后喷出。In order to make the air and the cleaning water mix into two fluids and improve the cleaning effect of the end face, the cleaning water supply nozzle 68 and the air supply nozzle 70 can be made close to the nozzles of the air supply nozzle 70 and mixed after spraying, or the nozzles can be integrated to form Cleaning water and air are mixed inside and sprayed out.

根据上述的实施方式,通过对非接触设置机构46的发光部64和受光部66的端面间歇地提供清洗水和空气,既能够抑制清洗水的使用量,又能够防止污染附着在光学传感器65上。According to the above-mentioned embodiment, by intermittently supplying cleansing water and air to the end faces of the light emitting unit 64 and the light receiving unit 66 of the non-contact installation mechanism 46, it is possible to suppress the amount of washing water used and prevent contamination from adhering to the optical sensor 65. .

除了该实施例之外,也可以在提供期间D中只提供水,既防止污染的附着,又防止干燥。此外,也可以在即将进行刀具端部位置检测之前,从空气提供喷嘴70进行空气的提供,将附着在端面上的清洗水去除。In addition to this embodiment, it is also possible to supply only water during the supply period D to prevent adhesion of contamination and dryness. In addition, air may be supplied from the air supply nozzle 70 immediately before the tool end position detection to remove the cleaning water adhering to the end surface.

Claims (2)

1. a kind of topping machanism, the topping machanism has:Chuck table, it keeps to machined object;Cutting unit, its The machined object kept using cutting tool to the chuck table is cut;Detection means, it is to the cutting tool Front position is detected;And control member, it is at least carried out to the chuck table, the cutting unit and the detection means Controlling, the topping machanism is characterised by,
The detection means include:
The cutter intrusion portion of U-shape;
Illuminating part, it is disposed in the side in the cutter intrusion portion;
Light accepting part, it is disposed in the opposite side in the cutter intrusion portion, receives the light from the illuminating part;And
(operating) water nozzle is cleaned, it provides rinse water to the end face of the illuminating part and the light accepting part, prevents cutting swarf from adhering to the end face,
In the detection operation that the front position to the cutting tool is detected, the control member stops providing from the rinse water Nozzle provides rinse water, and in standby beyond the detection operation, rinse water is supplied intermittently to the end face in the control member, will The cutting swarf being attached on the end face removes.
2. topping machanism according to claim 1, it is characterised in that
The detection means also provide nozzle comprising air, and the air provides nozzle and the end face of the illuminating part and the light accepting part is carried For air,
The control member provides nozzle from the air when this is standby and air is supplied intermittently to the end face, will by water and air The cutting swarf being attached on the end face removes.
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CN114453956A (en) * 2022-01-18 2022-05-10 甘肃酒钢集团宏兴钢铁股份有限公司 Flash welding machine finishing cutter cooling and cleaning device
CN114453956B (en) * 2022-01-18 2024-03-12 甘肃酒钢集团宏兴钢铁股份有限公司 Cooling and cleaning device for finishing knife of flash welding machine

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TW201820434A (en) 2018-06-01
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JP2018043308A (en) 2018-03-22
JP6800520B2 (en) 2020-12-16
KR20180029876A (en) 2018-03-21
TWI755419B (en) 2022-02-21

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