JP2017220199A - RFID tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress cracking of an IC chip and disconnection of an antenna pattern at an edge of an adhesive. An RFID tag 10 according to the present embodiment includes a base material 12, an antenna pattern 14, an IC chip 16, an adhesive material 18, and a reinforcing material 24. The base material 12 is in the form of a flexible sheet. The antenna pattern 14 is formed on the base material 12. The IC chip 16 is mounted on the base material 12 and is connected to the antenna pattern 14. The adhesive material 18 adheres the IC chip 16 and the base material 12. The reinforcing material 24 covers the IC chip 16 and the adhesive material 18. The reinforcing material 24 is located at a position where the central portion 24A is displaced from the IC chip 16 and the adhesive material 18 in the length direction (X direction) of the base material 12. [Selection diagram] Fig. 1

Description

  The technology disclosed in the present application relates to an RFID tag.

  In recent years, RFID (Radio Frequency Identification) tags that exchange information with external devices such as reader / writers in a non-contact manner using radio waves have begun to be used. Examples of this type of RFID tag include the following. That is, a flexible base material, an antenna pattern formed on the base material, an IC (Integrated Circuit) chip mounted on the base material and connected to the antenna pattern, and the IC chip and the base material are bonded. It is an RFID tag provided with the adhesive material to perform.

  For example, as described in Patent Documents 1 and 2, some RFIDs as described above include a reinforcing material that covers an IC chip and an adhesive. In this RFID tag, the reinforcing material is arranged so that the central portion of the reinforcing material is positioned on the IC chip and the adhesive material. Patent Documents 3 to 5 disclose technologies in which various ideas are applied to the RFID tag.

JP 2007-94634 A JP 2011-221599 A JP-A-3-52255 JP 2007-148672 A JP 2010-86361 A

  In an RFID tag provided with a reinforcing material, when compressive stress or bending stress acts on the RFID tag, it is assumed that the reinforcing material is bent at the center. Therefore, when the central portion of the reinforcing material is located on the IC chip and the adhesive material, bending stress acts on the IC chip and the IC chip is cracked as the reinforcing material is bent at the central portion. There is a fear. Further, even when the IC chip is not cracked, as the reinforcing material is bent at the central portion, the edge of the adhesive (the boundary between the portion with and without the fillet portion, and the adhesive ( There is a risk that stress is concentrated on the edge of the adhesive and the antenna pattern is disconnected at the edge of the adhesive.

  The technology disclosed in the present application has been made in view of the above circumstances, and as one aspect, provides an RFID tag that can suppress cracking of an IC chip and disconnection of an antenna pattern at an edge of an adhesive material. For the purpose.

  The RFID tag of the technology disclosed in the present application includes a base material, an antenna pattern, an IC chip, an adhesive material, and a reinforcing material. The substrate is in the form of a flexible sheet. The antenna pattern is formed on the base material. The IC chip is mounted on the base material and connected to the antenna pattern. The adhesive material bonds the IC chip and the base material. The reinforcing material covers the IC chip and the adhesive material. This reinforcing material is located at a position where the central portion is displaced in the length direction of the substrate with respect to the IC chip and the adhesive.

  According to the RFID tag of the technology disclosed in the present application, it is possible to suppress breakage of the IC chip and disconnection of the antenna pattern at the edge of the adhesive.

It is a two-view figure (plan view and side sectional view) of the RFID tag according to the present embodiment. FIG. 2 is an enlarged two-side view of a peripheral portion of the IC chip shown in FIG. 1. It is a figure explaining the lamination process of the manufacturing method of the RFID tag which concerns on this embodiment. It is a figure explaining the division | segmentation process of the manufacturing method of the RFID tag which concerns on this embodiment. It is a figure explaining the case where a compressive stress acts on the reinforcing material used for the RFID tag which concerns on this embodiment. It is a figure explaining the case where the eccentric compressive stress acts on the reinforcing material used for the RFID tag which concerns on this embodiment. It is a figure explaining the case where a bending stress acts on the reinforcing material used for the RFID tag which concerns on this embodiment. It is a longitudinal cross-sectional view which shows the 1st modification of the RFID tag which concerns on this embodiment. It is a longitudinal cross-sectional view which shows the 2nd modification of the RFID tag which concerns on this embodiment. It is a longitudinal cross-sectional view which shows the 3rd modification of the RFID tag which concerns on this embodiment. It is a longitudinal cross-sectional view which shows the 4th modification of the RFID tag which concerns on this embodiment. It is a longitudinal cross-sectional view which shows the 5th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 6th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 7th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 8th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 9th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 10th modification of the RFID tag which concerns on this embodiment. It is a longitudinal cross-sectional view which shows the 11th modification of the RFID tag which concerns on this embodiment. It is a figure explaining the case where a downward bending load acts on the RFID tag which concerns on a comparative example regarding the 12th modification of the RFID tag which concerns on this embodiment. It is a figure explaining the case where an upward bending load acts on the RFID tag which concerns on a comparative example regarding the 12th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 12th modification of the RFID tag which concerns on this embodiment. It is a figure explaining the case where a compressive load acts on the reinforcement material of the RFID tag which concerns on a comparative example regarding the 13th modification of the RFID tag which concerns on this embodiment. It is a figure explaining the case where the eccentric compressive load acts on the reinforcement material of the RFID tag which concerns on a comparative example regarding the 13th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 14th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 15th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 16th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 17th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 18th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 19th modification of the RFID tag which concerns on this embodiment. It is a top view which shows the 20th modification of the RFID tag which concerns on this embodiment. It is a double view which shows the 21st modification of the RFID tag which concerns on this embodiment. It is a figure explaining the lamination process in the 21st modification of the RFID tag which concerns on this embodiment. It is a double view which shows the 22nd modification of the RFID tag which concerns on this embodiment. It is a double view which shows the 23rd modification of the RFID tag which concerns on this embodiment. It is a double view which shows the 24th modification of the RFID tag which concerns on this embodiment. It is a figure explaining the case where a compressive stress and a bending stress act on the reinforcing material of the RFID tag which concerns on a comparative example.

  Hereinafter, an embodiment of the technology disclosed in the present application will be described.

  As shown in FIG. 1, the RFID tag 10 according to this embodiment includes a base material 12, an antenna pattern 14, an IC chip 16, an adhesive 18, a first protective layer 20, and a second protective layer 22. And a reinforcing member 24.

  The base material 12 has a rectangular sheet shape (plate shape) in plan view. In each drawing, an arrow X, an arrow Y, and an arrow Z indicate the length direction (longitudinal direction), the width direction (short direction), and the thickness direction of the base material 12, respectively. The width direction of the base material 12 is a direction orthogonal to the length direction of the base material 12 in a plan view of the base material 12, and the thickness direction of the base material 12 is the length of the base material 12 in a side view of the base material 12. It is a direction orthogonal to the direction. The length direction, width direction, and thickness direction of the substrate 12 are the same as the length direction, width direction, and thickness direction of the RFID tag 10.

  The antenna pattern 14 is formed on the surface of the substrate 12 and extends in the length direction of the substrate 12. The antenna pattern 14 is made of, for example, silver paste. In the present embodiment, the antenna pattern 14 is linear as an example, but may be bent or curved.

  The IC chip 16 is mounted on the base material 12. The IC chip 16 is rectangular in plan view, and is arranged with the length direction of the base material 12 as the longitudinal direction. The IC chip 16 is disposed at the center of the base material 12 in the length direction. As shown in more detail in FIG. 2, the IC chip 16 has a bump part 26, and the bump part 26 is connected to the antenna pattern 14.

  The adhesive 18 has conductivity, and bonds the IC chip 16 and the substrate 12. The adhesive 18 protrudes outside the outer peripheral portion of the IC chip 16. A portion of the adhesive 18 that protrudes outside the outer peripheral portion of the IC chip 16 is formed as a fillet-shaped fillet portion 28.

  As shown in FIG. 1, the first protective layer 20 is overlaid on the surface of the base material 12 and covers the above-described IC chip 16, adhesive 18, and antenna pattern 14. The second protective layer 22 is overlaid on the back surface of the substrate 12. The first protective layer 20 and the second protective layer 22 have the same length and width as the base material 12.

  The reinforcing material 24 has a sheet shape (plate shape) and is superimposed on the surface of the first protective layer 20. The reinforcing member 24 is rectangular in plan view, and is arranged with the length direction of the base material 12 as the longitudinal direction. The reinforcing member 24 is shorter than the base material 12 and has the same width as the base material 12.

  The reinforcing material 24 is disposed at a position on the center side in the length direction of the base material 12 and covers the IC chip 16 and the adhesive material 18 from above the first protective layer 20. In the RFID tag 10 of the present embodiment, the central portion 24A (the central portion in the longitudinal direction) of the reinforcing material 24 is located at a position shifted in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive material 18. The length and arrangement position of the reinforcing member 24 are set. That is, in the RFID tag 10 of the present embodiment, the central portion 24 </ b> A of the reinforcing material 24 is not positioned on the IC chip 16 and the adhesive material 18.

  In addition, by appropriately setting the length and the arrangement position of the reinforcing material 24, the IC chip 16 and the adhesive 18 in the longitudinal direction of the base material 12 are either the central portion 24 </ b> A of the reinforcing material 24 or the reinforcing material 24. Between the two end portions 24B (one end portion in the longitudinal direction).

  The base material 12, the reinforcing material 24, the first protective layer 20, and the second protective layer 22 are formed of a resin material such as PET (Polyethylene Terephthalate) or PEN (Polyethylene Naphthalate), for example. It has flexibility. In the cured state, the adhesive 18 has higher bending stiffness than the base material 12, the reinforcing material 24, the first protective layer 20, and the second protective layer 22. Since the base member 12, the reinforcing material 24, the first protective layer 20, and the second protective layer 22 have flexibility, the RFID tag 10 has flexibility as a whole.

  Next, a method for manufacturing the RFID tag 10 will be described.

  The manufacturing method of the RFID tag 10 of the present embodiment includes a laminating process and an individualizing process. As shown in FIG. 3, in the laminating process, the base material 12, the reinforcing material 24, the first protective layer 20, and the second protective layer 22 are bonded together. Further, in the laminating process, the arrangement position of the reinforcing material 24 is set so that the central portion 24 </ b> A of the reinforcing material 24 is displaced in the length direction of the base material 12 with respect to the IC chip 16 and the adhesive material 18. The In the pre-process of the laminating process, the antenna pattern 14 is formed on the base 12 in advance, and the IC chip 16 is bonded to the base 12 with the adhesive 18.

  Further, in the laminating step, as shown in the left diagram of FIG. 4, an antenna pattern 14 for a plurality of RFID tags is formed on a single substrate 12 having a size for a plurality of RFID tags, IC chips 16 for a plurality of RFID tags are mounted. Further, the first protective layer 20 and the second protective layer 22 for a plurality of RFID tags are bonded to a single substrate 12, and the reinforcing material 24 for a plurality of RFID tags is attached to the first protective layer 20. It is pasted together. That is, in the RFID tag manufacturing method of the present embodiment, the constituent members of a plurality of RFID tags are bonded together. In such a laminating process, for example, a general laminator can be used.

  Subsequently, as shown in the left to right diagrams in FIG. 4, in the singulation process, a portion corresponding to the outer shape of each RFID tag is cut by a method such as half cut or laser cut. Thus, a plurality of individual RFID tags 10 are manufactured.

  Next, characteristics of the reinforcing material 24 provided in the above-described RFID tag 10 will be described.

  In FIG. 5, the reinforcing member 24 is indicated by a line segment. As shown in FIG. 5, when the compressive stress σ acts on the reinforcing member 24, the reinforcing member 24 is bent due to buckling when the line length ratio of the reinforcing member 24 is λ> 100. At this time, the reinforcing member 24 is bent at the central portion 24A. A bending line when the reinforcing member 24 is bent at the central portion 24 </ b> A extends in a direction perpendicular to the direction in which the compression direction acts in a plan view of the reinforcing member 24.

  In the upper diagram of FIG. 6, the reinforcing member 24 is shown in a vertical cross-sectional view, and in the lower diagram of FIG. 6, the reinforcing member 24 is shown by a line segment. As shown in FIG. 6, when an eccentric compressive stress σ acts on the reinforcing member 24, the reinforcing member 24 bends due to compressive fracture when the line length ratio of the reinforcing member 24 is λ ≦ 100. At this time, the reinforcing member 24 is bent at the central portion 24A.

  As described above, when the compressive stress acts on the reinforcing material 24, if the reinforcing material 24 buckles or compressively breaks, the reinforcing material 24 bends at the central portion 24A.

  In FIG. 7, the reinforcing member 24 is shown in a longitudinal sectional view. In FIG. 7, downward loads Fa and Fb are applied to both ends of the reinforcing member 24, and an upward load Fc is applied between both ends of the reinforcing member 24. The length La is the length from the input point A of the load Fa to the input point C of the load Fc, and the length Lb is the length from the input point B of the load Fb to the input point C of the load Fc. The length L is the sum of the length La and the length Lb, and is the length from the input point A of the load Fa to the input point B of the load Fb.

  The balance of force is expressed by equation (1), and the balance of rotational moments around the input point A of the load Fa is expressed by equation (2). Further, the bending stress σ acting on the reinforcing member 24 at the input point C of the load Fc is expressed by Expression (3). Then, when equations (1) to (3) are solved, equation (4) is obtained. However, Z in Formula (4) is a section modulus.

  Here, if the smaller tensile strength or compressive strength is σb, the reinforcing member 24 bends when σ> σb. Thereby, Formula (5) is obtained.

  From equation (5), the load Fc is the smallest when La = L / 2. That is, the load Fc is minimized when La = Lb = L / 2. At this time, the loads Fa and Fb are also minimized. As a result, the reinforcing member 24 is most easily bent when a load is applied to the central portion 24 </ b> A of the reinforcing member 24. Thus, even when a bending stress acts on the reinforcing material 24, the reinforcing material 24 bends at the central portion 24A.

  Next, the operation and effect of this embodiment will be described.

  FIG. 36 shows an RFID tag 100 according to a comparative example. In the RFID tag 100 according to the comparative example, the central portion 24 </ b> A of the reinforcing material 24 is located on the IC chip 16 and the adhesive 18 compared to the RFID tag 10 according to the above-described embodiment. 36 shows a case where compressive stress acts on the reinforcing member 24 along the length direction of the base material 12, and a right diagram of FIG. 36 shows a case where bending stress acts on both ends of the reinforcing member 24. Are shown respectively.

  Here, as described for the characteristics of the reinforcing material 24 described above, in both cases where compressive stress acts on the reinforcing material 24 and when bending stress acts on the reinforcing material 24, the reinforcing material 24 is It bends at its central part 24A.

  Therefore, as shown in FIG. 36, when the central portion 24A of the reinforcing member 24 is located on the IC chip 16 and the adhesive 18, the reinforcing member 24 is bent at the central portion 24A, and the IC 24 Bending stress acts on the chip 16 and the IC chip 16 may be cracked. Even when the IC chip 16 is not cracked, the stress is concentrated on the edge of the adhesive 18 (the boundary between the portion having the fillet portion and the portion having no fillet) as the reinforcing member 24 is bent at the central portion 24A. However, the antenna pattern 14 may be disconnected at the edge of the adhesive 18.

  On the other hand, in the RFID tag 10 according to this embodiment shown in FIG. 1, the reinforcing member 24 covers the IC chip 16 and the adhesive 18, but the central portion 24 </ b> A is connected to the IC chip 16 and the adhesive 18. On the other hand, it is in a position shifted in the length direction of the substrate 12. Therefore, even if a compressive stress or a bending stress acts on the RFID tag 10 and the reinforcing member 24 is bent at the central portion 24A, it is possible to suppress the bending stress from acting on the IC chip 16, so It can suppress that a crack arises. Further, even if the reinforcing member 24 is bent at the central portion 24 </ b> A, it is possible to prevent stress from being concentrated on the edge of the adhesive 18, so that the antenna pattern 14 is prevented from being disconnected at the edge of the adhesive 18. be able to.

  In addition, by appropriately setting the length and the arrangement position of the reinforcing material 24, the IC chip 16 and the adhesive material 18 are either one of the central portion 24 </ b> A of the reinforcing material 24 or the reinforcing material 24 in the length direction of the base material 12. Between the two end portions 24B (one end portion in the longitudinal direction). As a result, the entire IC chip 16 and the adhesive 18 are covered with a portion between the central portion 24A and the one end 24B of the reinforcing member 24. Therefore, even if the reinforcing member 24 is bent at the central portion 24 </ b> A, the state where the IC chip 16 and the adhesive 18 are reinforced by the reinforcing member 24 can be maintained.

  Next, an application example of the RFID tag 10 will be described.

  The RFID tag 10 according to the present embodiment exchanges information with an external device such as a reader / writer in a contactless manner using radio waves. That is, the radio wave emitted from the external device is received by the antenna pattern 14, and the signal received by the antenna pattern 14 is processed by the IC chip 16. The signal output from the IC chip 16 is transmitted as a radio wave from the antenna pattern 14.

  The RFID tag 10 according to this embodiment is used for managing articles, for example. As this article, for example, there is a mat placed at an entrance of a store or the like. The back surface of this type of mat may be formed of rubber, and the RFID tag 10 of this embodiment is embedded in the rubber when the rubber on the back surface of this mat is molded. When the rubber cools and contracts after the molding of the rubber, a compressive stress in the length direction acts on the RFID tag 10. However, in the RFID tag 10 of this embodiment, even when compressive stress is applied, as described above, the IC chip 16 is prevented from being cracked and the antenna pattern 14 is prevented from being disconnected at the edge of the adhesive 18. can do.

  Moreover, as an article to which the RFID tag 10 of the present embodiment is applied, for example, there is a mop used for cleaning a store or the like. Such a mop usually has a cloth wiping portion at the tip. The RFID tag 10 of this embodiment is attached to the wiping portion at the tip of the mop. When the wiping portion performs wiping, if bending load acts on the wiping portion, bending stress may act on both ends of the RFID tag 10 in the length direction. However, in the RFID tag 10 of this embodiment, even when bending stress acts, as described above, the IC chip 16 is prevented from being cracked and the antenna pattern 14 is prevented from being disconnected at the edge of the adhesive 18. can do.

  In addition, this application example shows an example of an article to which the RFID tag 10 of the present embodiment is applied, and the RFID tag 10 of the present embodiment can be applied to various articles other than the above. Of course.

  Next, a modification of this embodiment will be described.

(First modification)
As shown in FIG. 1, in the above embodiment, the reinforcing material 24 is disposed only on the front side of the base material 12. However, as in the first modified example of FIG. 8, the first reinforcing material 24-1 may be disposed on the front side of the base material 12, and the second reinforcing material 24-2 may be disposed on the back side of the base material 12.

  In addition, in the 1st modification shown by FIG. 8, the length of the longitudinal direction of the 1st reinforcement material 24-1 and the 2nd reinforcement material 24-2 is the same. Further, the first reinforcing material 24-1 and the second reinforcing material 24-2 both cover the IC chip 16 and the adhesive material 18. In the first reinforcing member 24-1 and the second reinforcing member 24-2, the central portions 24A-1 and 24A-2 (the central portion in the longitudinal direction) are the length of the substrate 12 with respect to the IC chip 16 and the adhesive material 18. It is in a position shifted in the direction.

  The central portion 24A-1 of the first reinforcing member 24-1 and the central portion 24A-2 of the second reinforcing member 24-2 are in the length direction of the base 12 with respect to the IC chip 16 and the adhesive material 18. Located on the same side. Moreover, in the length direction of the base material 12, the central part 24A-1 of the first reinforcing member 24-1 and the central part 24A-2 of the second reinforcing member 24-2 are at the same position.

  In the first modification, the RFID tag 10 includes a first reinforcing member 24-1 disposed on the front side of the base material 12, and a second reinforcing member 24-2 disposed on the back side of the base member 12. Yes. Therefore, since the IC chip 16 and the adhesive 18 can be reinforced from both the front side and the back side of the base material 12, the IC chip 16 is cracked and the antenna pattern 14 is disconnected at the edge of the adhesive 18. This can be suppressed more effectively.

  The central portion 24A-1 of the first reinforcing member 24-1 and the central portion 24A-2 of the second reinforcing member 24-2 are in the length direction of the base 12 with respect to the IC chip 16 and the adhesive material 18. Located on the same side of the. Therefore, even when compressive stress or bending stress is applied to the RFID tag 10, the first reinforcing member 24-1 and the second reinforcing member are provided on the same side in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive material 18. The material 24-2 can be bent. Thereby, it is possible to restrict the RFID tag 10 from being bent at unintended positions on the IC chip 16 and the adhesive material 18.

  Furthermore, in the length direction of the base material 12, the central portion 24A-1 of the first reinforcing member 24-1 and the central portion 24A-2 of the second reinforcing member 24-2 are at the same position. Therefore, when compressive stress or bending stress is applied to the RFID tag 10, the first reinforcing member 24-1 and the second reinforcing member 24-2 can be bent at the same position. Thereby, it is possible to more effectively restrict the RFID tag 10 from being bent at unintended positions on the IC chip 16 and the adhesive material 18.

(Second modification)
In the said 1st modification, the length of the longitudinal direction of the 1st reinforcement material 24-1 and the 2nd reinforcement material 24-2 is the same. However, as in the second modified example of FIG. 9, the length of the second reinforcing member 24-2 in the longitudinal direction may be longer than that of the first reinforcing member 24-1.

  In the second modification shown in FIG. 9, the second reinforcing member 24-2 is longer in the longitudinal direction than the first reinforcing member 24-1, but the first reinforcing member 24- 1 may be longer in the longitudinal direction than the second reinforcing member 24-2. That is, the first reinforcing member 24-1 and the second reinforcing member 24-2 may have different lengths in the longitudinal direction.

(Third modification)
In the first and second modifications, the central portion 24A-1 of the first reinforcing member 24-1 and the central portion 24A-2 of the second reinforcing member 24-2 are in the length direction of the base material 12, They are in the same position. However, as in the third modification of FIG. 10, the central portion 24A-1 of the first reinforcing member 24-1 and the central portion 24A-2 of the second reinforcing member 24-2 are the length of the base material 12. The position may be shifted in the direction.

  If comprised in this way, it can suppress by the 2nd reinforcement material 24-2 that the 1st reinforcement material 24-1 bends in center part 24A-1. Moreover, it can suppress by the 1st reinforcement material 24-1 that the 2nd reinforcement material 24-2 bends in center part 24A-2.

(Fourth modification)
As shown in FIG. 8, in the first modification, in the length direction of the substrate 12, one end 24 </ b> B- 1 of the first reinforcing member 24-1 and one of the second reinforcing members 24-2. Are located at the same position. Moreover, in the length direction of the base material 12, the other end 24C-1 of the first reinforcing member 24-1 and the other end 24C-2 of the second reinforcing member 24-2 are in the same position. is there.

  However, like the 4th modification of FIG. 11, in the length direction of the base material 12, one edge part 24B-1 of the 1st reinforcement material 24-1, and one edge of the 2nd reinforcement material 24-2. The position of the portion 24B-2 may be shifted from each other. In the fourth modified example shown in FIG. 11, as an example, one end 24B-1 of the first reinforcing member 24-1 is based on one end 24B-2 of the second reinforcing member 24-2. It is located on the center side in the length direction of the material 12.

  If comprised in this way, one edge part 24B-1 of the 1st reinforcement material 24-1 will be between the center part 24A-2 of the 2nd reinforcement material 24-2, and one edge part 24B-2. Reinforced by part. Thereby, for example, even when bending stress concentrates on one end 24B-1 of the first reinforcing member 24-1, the RFID tag 10 starts from one end 24B-1 of the first reinforcing member 24-1. Can be suppressed by the second reinforcing member 24-2.

  In the second and third modifications shown in FIGS. 9 and 10 described above, one end 24B-1 of the first reinforcing member 24-1 and one end of the second reinforcing member 24-2. The position is shifted from the portion 24B-2. Furthermore, in the second and third modifications shown in FIGS. 9 and 10 described above, the other end 24C-1 of the first reinforcing member 24-1 and the other end of the second reinforcing member 24-2. The portions 24C-2 are also displaced from each other.

  As described above, when the positions of the both ends of the first reinforcing member 24-1 and the second reinforcing member 24-2 are shifted from each other, bending stress concentrates on one of the both ends of one reinforcing member. Even in this case, bending of the RFID tag 10 can be suppressed by the other reinforcing material.

(Fifth modification)
As shown in FIG. 1, in the above embodiment, the second protective layer 22 is provided on the back side of the substrate 12. However, as in the fifth modified example of FIG. 12, the second protective layer may not be provided on the back side of the substrate 12. In addition, as in the fifth modified example of FIG. 12, the reinforcing member 24 may be directly superimposed on the back surface of the base member 12, that is, the surface opposite to the side on which the IC chip 16 is mounted. Thus, if the second protective layer is omitted from the back side of the substrate 12, the cost of the RFID tag 10 can be reduced.

(Sixth modification)
As shown in FIG. 1, in the embodiment, the dimensions of the reinforcing member 24 and the base material 12 are the same in the width direction of the base material 12. However, as shown in FIG. 13, the reinforcing material 24 may be smaller in size than the base material 12 in the width direction of the base material 12. If comprised in this way, the material cost of the reinforcing material 24 can be reduced and, as a result, the cost of the RFID tag 10 can be reduced.

(Seventh modification)
As shown in FIG. 1, in the above embodiment, the entire antenna pattern 14 including the connection portion of the antenna pattern 14 with the IC chip 16 extends in the length direction of the substrate 12. However, as in the seventh modification of FIG. 14, the connection portion 40 with the IC chip 16 in the antenna pattern 14 extends in the width direction of the base material 12, and the reinforcing member 24 may cover the connection portion 40. .

  If comprised in this way, even when the compressive stress of a length direction acts on RFID tag 10, it can suppress that a compressive stress acts on the longitudinal direction of the connection part 40. FIG. Further, even when bending stress acts on both ends of the RFID tag 10 in the length direction, it is possible to suppress the bending stress from acting on both ends of the connection portion 40 in the longitudinal direction. Thereby, disconnection of the antenna pattern 14 can be suppressed more effectively.

(Eighth modification)
As shown in FIG. 1, in the above embodiment, the position of the IC chip 16 and the adhesive 18 is shifted in the length direction of the base material 12 with respect to the central portion 24 </ b> A of the reinforcing material 24. However, as in the eighth modification of FIG. 15, the IC chip 16 and the adhesive material 18 are each of the length of the base material 12 with respect to the central portion 24 </ b> A (the central portion in the longitudinal direction and the short direction) of the reinforcing material 24. The position may be shifted in the direction and the width direction. That is, in other words, the central portion 24 </ b> A of the reinforcing member 24 may be at a position shifted in both the length direction and the width direction of the substrate 12 with respect to the IC chip 16 and the adhesive material 18.

  With this configuration, the reinforcing material 24 in the short direction is caused by compressive stress acting in the width direction on the RFID tag 10 or bending stress acting on both ends in the width direction of the RFID tag 10. Even if it is bent at the center, it is possible to suppress bending stress from acting on the IC chip 16. Thereby, it is possible to prevent the IC chip 16 from being cracked. Further, even if the reinforcing member 24 is bent at the center portion in the width direction, it is possible to suppress stress concentration on the edge of the adhesive material 18, so that the antenna pattern 14 is disconnected at the edge of the adhesive material 18. Can be suppressed.

(Ninth modification)
As shown in FIG. 1, in the above embodiment, the reinforcing material 24 is arranged with the length direction of the base material 12 as the longitudinal direction. However, as in the ninth modification of FIG. 16, the reinforcing member 24 may be arranged with the width direction of the base material 12 as the longitudinal direction.

  If comprised in this way, the longitudinal direction which is the direction in which the reinforcing member 24 is easy to bend, and the length direction of the RFID tag 10 will be orthogonal. Thereby, even when a compressive stress in the length direction acts on the RFID tag 10 or a bending stress acts on both end portions in the length direction of the RFID tag 10, the reinforcing member 24 is formed in the central portion 24 </ b> A (short direction). Can be prevented from being bent at the center).

(10th modification)
In the tenth modification shown in FIG. 17, the reinforcing member 24 has a pair of notches 42 and a pair of notches 44 with respect to the above embodiment. Both of the pair of notches 42 and 44 are open on both sides in the width direction of the substrate 12. One pair of notches 42 are at the same position in the length direction of the substrate 12, and the other pair of notches 44 are at the same position in the length direction of the substrate 12. One pair of notches 42 is formed at a position shifted to one side in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive 18. On the other hand, the other pair of notches 44 are formed at positions shifted to the other side in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive 18.

  With this configuration, when a compression stress in the length direction acts on the RFID tag 10 or a bending stress acts on both ends of the RFID tag 10 in the length direction, a pair of notches Stress concentrates on the line connecting 42 or the line connecting the pair of notches 44. As a result, the reinforcing member 24 can be bent starting from the line connecting the pair of notches 42 or the line connecting the pair of notches 44, so that the RFID tag 10 is located at an unintended position on the IC chip 16 and the adhesive 18. Bending can be restricted.

  Even if the reinforcing material 24 is bent at the central portion 24 </ b> A, the central portion 24 </ b> A of the reinforcing material 24 is in a position shifted in the length direction of the base material 12 with respect to the IC chip 16 and the adhesive material 18. . Therefore, even if the reinforcing member 24 is bent at the central portion 24 </ b> A, it is possible to suppress the bending stress from acting on the IC chip 16 and the stress from being concentrated on the edge of the adhesive 18. Thereby, it is possible to suppress the IC chip 16 from being cracked and to suppress the disconnection of the antenna pattern 14 at the edge of the adhesive material 18.

  In the tenth modification shown in FIG. 17, two pairs of notches 42 and 44 are formed in the reinforcing member 24. However, only one pair of notches of the two pairs of notches 42 and 44 may be formed in the reinforcing member 24. In addition, the pair of notches 42 and 44 described above may be formed in the first reinforcing member 24-1 and the second reinforcing member 24-2 in the first modification of FIG.

(Eleventh modification)
In the eleventh modified example shown in FIG. 18, the first reinforcing member 24-1 and the second reinforcing member 24-2 have a pair of grooves 46 and a pair of grooves 48 with respect to the first modified example. . Both of the grooves 46 and 48 are open on both sides in the width direction of the substrate 12. One pair of grooves 46 are at the same position in the length direction of the base material 12, and the other pair of grooves 48 are at the same position in the length direction of the base material 12. The pair of grooves 46 are formed at positions shifted to one side in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive 18. On the other hand, the other pair of grooves 48 are formed at positions shifted to the other side in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive 18.

  With such a configuration, when a compressive stress in the length direction acts on the RFID tag 10 or a bending stress acts on both ends in the length direction of the RFID tag 10, any groove is formed. Stress concentrates on 46 and 48. As a result, the first reinforcing member 24-1 and the second reinforcing member 24-2 can be bent starting from any one of the grooves 46 and 48, so that the RFID tag is located at an unintended position on the IC chip 16 and the adhesive 18. It can restrict | limit that 10 bends.

  Even if the reinforcing material 24 is bent at the central portion 24 </ b> A, the central portion 24 </ b> A of the reinforcing material 24 is in a position shifted in the length direction of the base material 12 with respect to the IC chip 16 and the adhesive material 18. . Therefore, even if the reinforcing member 24 is bent at the central portion 24 </ b> A, it is possible to suppress the bending stress from acting on the IC chip 16 and the stress from being concentrated on the edge of the adhesive 18. Thereby, it is possible to suppress the IC chip 16 from being cracked and to suppress the disconnection of the antenna pattern 14 at the edge of the adhesive material 18.

  In the eleventh modification shown in FIG. 18, two pairs of grooves 46 and 48 are formed in the first reinforcing member 24-1 and the second reinforcing member 24-2. However, only one pair of grooves of the two pairs of grooves 46 and 48 may be formed in the first reinforcing member 24-1 and the second reinforcing member 24-2. Moreover, at least one of the above-mentioned groove | channels 46 and 48 may be formed in the reinforcing material 24 arrange | positioned only on the front side of the base material 12 like the said embodiment shown by FIG.

(Twelfth modification)
In the twelfth modification, first, the mounting direction of the IC chip 16 is examined. In FIG. 19A, an RFID tag 100 according to a comparative example is shown in a longitudinal sectional view. In the RFID tag 100, the central portion 24 </ b> A of the reinforcing material 24 is located on the IC chip 16 and the adhesive material 18. In FIG. 19A, a bending load is applied to the RFID tag 100 so that the reinforcing member 24 bends upward.

  In the RFID tag 100, when the reinforcing member 24 is bent upward, a bending moment M acts on both ends of the IC chip 16. This bending moment M becomes maximum at the center portion of the IC chip 16, and the maximum value Mmax of the bending moment M is expressed by Expression (6). Here, q is a force per unit length that the IC chip 16 receives due to the deformation of the reinforcing member 24. Further, regarding the IC chip 16, the width is b, the length is L, and the thickness is h.

  FIG. 19B schematically shows the IC chip 16 in a perspective view. As indicated by a thick line on the IC chip 16 in FIG. 19B, the bending stress σ acting on the IC chip 16 becomes maximum on the surface of the central portion of the IC chip 16, and the maximum value σmax of this bending stress. Is expressed by equation (8) from equation (7). However, Z in Formula (7), (8) is a section modulus.

  FIG. 19C shows the cross-sectional stress state of the IC chip 16 reflecting the formula (8). From FIG. 19C, it can be seen that the larger L (longer in the longitudinal direction), the greater the stress and the easier the IC chip 16 breaks. Therefore, it can be said that the IC chip 16 should be mounted vertically in the width direction of the substrate 12.

  In FIG. 20A, a bending load is applied to the RFID tag 100 so that the reinforcing member 24 bends downward. In the RFID tag 100, when the reinforcing member 24 is bent downwardly, a bending moment M acts on both ends of the IC chip 16. FIG. 20B schematically shows the IC chip 16 in a perspective view, and FIG. 20C shows a balance state of loads acting on the IC chip 16. P is a downward load acting on the central portion of the IC chip 16 in the longitudinal direction, and Ra and Rb are upward loads acting on both ends of the IC chip 16 in the longitudinal direction.

  From the balance of the load, the load P is expressed by Equation (9). Moreover, Formula (10) is derived | led-out from the balance of a rotational moment. L is a length from the input point of the load Ra to the input point of the load Rb, and x is a length from the input point of the load Ra to the input point of the load P. The bending moment M at x = x is expressed by equation (11). Differentiating M by L yields equation (12).

  In Expression (12), dM / dL monotonously increases regardless of the values of x and L. Therefore, it can be said that the larger L is, the larger the bending moment M is. In other words, the smaller the L, the smaller the bending moment M, and the smaller L, the smaller the bending stress. Therefore, it can be said that the IC chip 16 should be mounted vertically in the width direction of the substrate 12.

  From the above examination of the mounting direction of the IC chip 16, in the twelfth modified example of FIG. 21, the IC chip 16 is arranged with the width direction of the base material 12 as the longitudinal direction in the above embodiment.

  With this configuration, the longitudinal direction, which is the direction in which the IC chip 16 is easily bent, and the length direction of the RFID tag 10 are orthogonal to each other. Thereby, even when a compressive stress in the length direction acts on the RFID tag 10 or a bending stress acts on both ends of the RFID tag 10 in the length direction, the IC chip 16 is prevented from being bent. it can.

(Thirteenth modification)
In the thirteenth modification, first, the dimensions of the reinforcing member 24 that do not cause buckling are examined. FIG. 22 is a perspective view of an RFID tag 100 according to a comparative example. P is a compressive load acting on both end portions of the reinforcing member 24, and is represented by Expression (13). σ is a compressive stress acting in the longitudinal direction of the reinforcing material 24. Hereinafter, regarding the reinforcing member 24, the line length ratio is λ, the length is L, the thickness is h, the width is b, the Young's modulus is E, and the cross-sectional secondary moment is I.

  When the line length ratio λ is Equation (14), Equation (15) is derived for the compressive load P from Euler's equation, and when L satisfies Equation (16), the reinforcing member 24 is buckled. Absent.

  Then, the dimension which does not raise | generate a compression fracture about the reinforcing material 24 is examined. FIG. 23 is a longitudinal sectional view showing a main part of the RFID tag 100 according to the comparative example. P is an eccentric compressive load that acts on the back side of both ends of the reinforcing member 24 in the longitudinal direction, and is represented by the above-described equation (13). The tensile stress becomes maximum at the center portion of the surface of the reinforcing member 24, and the maximum value σr of the tensile stress is expressed by Expression (17). Further, the compressive stress becomes maximum at the center of the back surface of the reinforcing member 24, and the maximum value σr of the compressive stress is expressed by the equation (18).

Hereinafter, regarding the reinforcing member 24, the line length ratio is λ, the length is L, and the thickness is h. For the reinforcing member 24, the bending moment acting on the reinforcing member 24 is M, the section modulus is Z, the compressive stress acting on the center of the back surface of the reinforcing member 24 is 4σ, and the tensile stress acting on the center of the surface of the reinforcing member 24. Is 2σ, the compressive strength is σ _c , and the tensile strength is σ _b .

  When the line length ratio λ is the expression (19), when the expression (20) is satisfied at the center of the surface of the reinforcing member 24 where the stress is maximum, that is, when the expression (21) and the expression (22) are satisfied. Even if an eccentric compressive load is applied, the reinforcing material 24 does not bend due to bending stress. That is, when the line length ratio λ is the expression (19), the reinforcing material 24 does not cause compression failure when the expressions (21) and (22) are satisfied.

  From the above examination of the dimensions that do not cause buckling and the examination of the dimensions that do not cause compressive fracture, the thirteenth modified example is different from the above embodiment shown in FIG. The length L and the thickness h of the reinforcing material 24 satisfying (16) are applied. Alternatively, in the thirteenth modification, the length L and the thickness h of the reinforcing material 24 satisfying the formula (19), the formula (21), and the formula (22) are applied to the embodiment shown in FIG. .

  When the length L and the thickness h of the reinforcing material 24 satisfying the expressions (15) and (16) are applied, the buckling of the reinforcing material 24 can be avoided. On the other hand, when the length L and the thickness h of the reinforcing material 24 satisfying the expressions (19), (21), and (22) are applied, the compressive fracture of the reinforcing material 24 can be avoided.

  Even if the reinforcing material 24 is bent at the central portion 24 </ b> A, the central portion 24 </ b> A of the reinforcing material 24 is in a position shifted in the length direction of the base material 12 with respect to the IC chip 16 and the adhesive material 18. . Therefore, even if the reinforcing member 24 is bent at the central portion 24 </ b> A, it is possible to suppress the bending stress from acting on the IC chip 16 and the stress from being concentrated on the edge of the adhesive 18. Thereby, it is possible to suppress the IC chip 16 from being cracked and to suppress the disconnection of the antenna pattern 14 at the edge of the adhesive material 18.

(14th modification)
In the fourteenth modification shown in FIG. 24, the antenna pattern 14 has a lead-out portion 50 that is led out from the end portions 24B and 24C on both sides in the longitudinal direction of the reinforcing member 24 with respect to the above-described embodiment. Further, in the end portions 24 </ b> B and 24 </ b> C of the reinforcing member 24, a notch-shaped relief portion 52 is formed at a position overlapping the lead-out portion 50 in a plan view of the reinforcing member 24.

  With this configuration, even when the RFID tag 10 is bent and deformed starting from the end portions 24B and 24C of the reinforcing material 24, interference between the reinforcing material 24 and the antenna pattern 14 (leading portion 50) is suppressed. Can do. Thereby, disconnection of the antenna pattern 14 can be suppressed.

(15th modification)
In the fifteenth modification shown in FIG. 25, the portion 54 between the lead-out portion 50 and the IC chip 16 in the antenna pattern 14 extends in the width direction of the substrate 12 with respect to the fourteenth modification. . The derivation unit 50 is connected to a portion 54 between the derivation unit 50 and the IC chip 16 in the antenna pattern 14. The lead-out part 50 is arranged at a position shifted in the width direction of the base material 12 with respect to the central part 24A (the central part in the short direction) of the reinforcing member 24. Further, the notch-shaped relief portion 52 is also formed at a position corresponding to the lead-out portion 50 and shifted in the width direction of the base material 12 with respect to the central portion 24A of the reinforcing member 24.

  Even when configured in this way, when the RFID tag 10 is bent and deformed starting from the end portions 24B and 24C of the reinforcing member 24, interference between the reinforcing member 24 and the antenna pattern 14 (leading portion 50) is suppressed. be able to. Thereby, disconnection of the antenna pattern 14 can be suppressed.

  Moreover, since the derivation | leading-out part 50 is arrange | positioned in the position which shifted | deviated to the width direction of the base material 12 with respect to the center part 24A of the reinforcement material 24, the reinforcement material 24 is a center part 24A (center part of a transversal direction). Even if it bends, it is possible to prevent the lead-out portion 50 from being twisted or bent. Therefore, the disconnection of the antenna pattern 14 can be suppressed also by this.

(16th modification)
In the sixteenth modification shown in FIG. 26, the central portion 12 </ b> A of the base material 12 and the central portion 24 </ b> A of the reinforcing member 24 are at the same position in the length direction of the base material 12. Further, the central portion 12 </ b> A of the base material 12 and the central portion 24 </ b> A of the reinforcing material 24 are at positions shifted in the length direction of the base material 12 with respect to the IC chip 16 and the adhesive material 18.

  When configured in this way, when the compressive stress in the length direction acts on the RFID tag 10 or the bending stress acts on both ends of the RFID tag 10 in the length direction, The reinforcing material 24 is bent at the same position displaced from the IC chip 16 and the adhesive 18. Thereby, it can suppress more effectively that the IC chip 16 is cracked and the antenna pattern 14 is disconnected at the edge of the adhesive 18.

(Other variations)
In the above embodiment, the reinforcing member 24 is rectangular in plan view, but as shown in FIG. 27, the reinforcing member 24 may be circular in plan view. Thus, when the reinforcing member 24 is circular in plan view, for example, the force F1 from the length direction of the base material 12 and the force from the direction inclined with respect to the length direction and the width direction of the base material 12 Even when F2 acts on the reinforcing material 24, the force is dispersed in the reinforcing material 24. Thereby, bending of the reinforcing material 24 can be suppressed.

  Further, the reinforcing member 24 may have a shape other than a rectangle and a circle, for example, a square, an ellipse, and a polygon in a plan view.

  Moreover, in the said embodiment, although the base material 12 is a rectangle by planar view, the base material 12 may be square by planar view as FIG. 28 shows. When the base material 12 is square in plan view, the length direction of the base material 12 corresponds to the length direction of one of the four sides of the square.

  Further, as shown in FIG. 29, the base material 12 may be circular in plan view. When the base material 12 is circular in plan view, the length direction of the base material 12 corresponds to a circular radial direction.

  In addition, as shown in FIG. 30, the base material 12 may be elliptical in plan view. When the base material 12 is elliptical in plan view, the length direction of the base material 12 corresponds to the longitudinal direction of the elliptical shape. Further, the substrate 12 may have a shape other than the above in plan view.

  Moreover, in the said embodiment, as FIG. 1 shows, although the base material 12 has the 1st protective layer 20 and the 2nd protective layer 22, the 1st protective layer 20 and the 2nd protective layer 22 from the base material 12 are included. May be omitted.

  Moreover, in the said embodiment, as FIG. 1 shows, the reinforcing material 24 is overlaid on the surface of the 1st protective layer 20 (laminate layer). However, as shown in FIG. 31, the reinforcing material 24 may be superimposed on the back surface of the substrate 12 and may be disposed inside the second protective layer 22 (laminate layer).

  As shown in FIG. 31, even when the reinforcing member 24 is superimposed on the back surface of the base material 12 and disposed inside the second protective layer 22, for example, as shown in FIG. It can be manufactured by a laminating process.

  Thus, when the reinforcing material 24 is disposed inside the second protective layer 22 (between the base material 12 and the second protective layer 22), the reinforcing material 24 is covered by the second protective layer 22, It can suppress that the reinforcing material 24 peels.

  Further, as shown in FIG. 33, in the width direction of the base material 12, the dimensions of the reinforcing material 24 are made smaller than the dimensions of the base material 12, so that the four sides of the rectangular reinforcing material 24 are seen in plan view. Both may be within the second protective layer 22.

  In this way, when the four sides of the reinforcing material 24 are both inside the second protective layer 22, the entire reinforcing material 24 is covered with the second protective layer 22, so that the reinforcing material 24 is more effectively peeled off. Can be suppressed.

  Further, in the modification shown in FIG. 31, the reinforcing member 24 is superimposed on the back surface of the base material 12 and is disposed inside the second protective layer 22. However, as shown in FIG. 34, the reinforcing member 24 may be superimposed on the surface of the substrate 12 and may be disposed inside the first protective layer 20.

  Further, as shown in FIG. 35, the first reinforcing material 24-1 may be superimposed on the surface of the base material 12, and the second reinforcing material 24-2 may be superimposed on the back surface of the base material 12. The first reinforcing member 24-1 may be disposed inside the first protective layer 20, and the second reinforcing member 24-2 may be disposed inside the second protective layer 22.

  In addition, the modification which can be combined among the above-mentioned some modifications may be combined suitably.

  As mentioned above, although one embodiment of the technique disclosed in the present application has been described, the technique disclosed in the present application is not limited to the above, and various modifications may be made without departing from the spirit of the present invention. Of course, it is possible.

  Next, a reference example will be described.

  In the tenth modification shown in FIG. 17, the central portion 24 </ b> A of the reinforcing member 24 is located at a position shifted in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive material 18. However, in the RFID tag according to the reference example, the central portion 24A of the reinforcing material 24 may be located on the IC chip 16 and the adhesive material 18 as compared with the tenth modification. That is, in the configuration in which the central portion 24 </ b> A of the reinforcing material 24 is located on the IC chip 16 and the adhesive 18, the reinforcing material 24 is displaced in the length direction of the base 12 with respect to the IC chip 16 and the adhesive 18. At least one of the pair of notches 42 and 44 may be formed at the position.

  Similarly, in the configuration in which the central portion 24 </ b> A of the reinforcing material 24 is located on the IC chip 16 and the adhesive 18, the reinforcing material 24 is displaced in the length direction of the substrate 12 with respect to the IC chip 16 and the adhesive 18. At least one of the grooves 46 and 48 shown in FIG.

  Further, in the configuration in which the central portion 24A of the reinforcing member 24 is located on the IC chip 16 and the adhesive material 18, an applicable one of the above-described plural modifications may be applied as appropriate.

  In addition, the following additional remark is disclosed about one Embodiment (except a reference example) of the technique which the above-mentioned application discloses.

(Appendix 1)
A sheet-like base material having flexibility;
An antenna pattern formed on the substrate;
An IC chip mounted on the substrate and connected to the antenna pattern;
An adhesive for bonding the IC chip and the substrate;
Reinforcing material that covers the IC chip and the adhesive, and has a central portion shifted in the length direction of the base material with respect to the IC chip and the adhesive,
An RFID tag comprising:
(Appendix 2)
In the length direction of the base material, the IC chip and the adhesive material are disposed between a central portion of the reinforcing material and one end portion of the reinforcing material,
The RFID tag according to appendix 1.
(Appendix 3)
As the reinforcing material, a first reinforcing material arranged on the front side of the base material, and a second reinforcing material arranged on the back side of the base material,
The RFID tag according to Supplementary Note 1 or Supplementary Note 2.
(Appendix 4)
The central part of the first reinforcing material and the central part of the second reinforcing material are located on the same side in the length direction of the base material with respect to the IC chip and the adhesive material,
The RFID tag according to attachment 3.
(Appendix 5)
In the length direction of the base material, the central portion of the first reinforcing member and the central portion of the second reinforcing member are at the same position.
The RFID tag according to appendix 4.
(Appendix 6)
In the length direction of the base material, the central portion of the first reinforcing member and the central portion of the second reinforcing member are displaced from each other.
The RFID tag according to appendix 4.
(Appendix 7)
In the length direction of the base material, one end of the first reinforcing member and one end of the second reinforcing member are displaced from each other.
The RFID tag according to any one of appendix 4 to appendix 6.
(Appendix 8)
The reinforcing material is superimposed on the surface of the base material opposite to the side on which the IC chip is mounted.
The RFID tag according to Supplementary Note 1 or Supplementary Note 2.
(Appendix 9)
The connection portion with the IC chip in the antenna pattern extends in the width direction of the base material,
The reinforcing material covers the connecting portion,
The RFID tag according to any one of supplementary notes 1 to 9.
(Appendix 10)
The central portion of the reinforcing material is at a position shifted in the length direction and the width direction of the base material with respect to the IC chip and the adhesive.
The RFID tag according to any one of Appendix 1 to Appendix 10.
(Appendix 11)
The reinforcing material is arranged with the width direction of the base material as a longitudinal direction,
The RFID tag according to any one of appendices 1 to 11.
(Appendix 12)
The reinforcing material has a pair of notches that are open on both sides in the width direction of the base material,
The pair of notches are formed at positions shifted in the length direction of the base material with respect to the IC chip and the adhesive, and at the same position in the length direction of the base material.
The RFID tag according to any one of Supplementary Note 1 to Supplementary Note 12.
(Appendix 13)
The reinforcing member extends in the width direction of the base material and has a groove formed at a position shifted in the length direction of the base material with respect to the IC chip and the adhesive material.
The RFID tag according to any one of appendices 1 to 13.
(Appendix 14)
The IC chip is arranged with the width direction of the base material as a longitudinal direction,
The RFID tag according to any one of Supplementary Note 1 to Supplementary Note 14.
(Appendix 15)
For the reinforcing material, when the line length ratio is λ, the length is L, the thickness is h, the Young's modulus is E, and the compressive stress acting on the reinforcing material along the length direction of the base material is σ, Satisfying the formulas (1) and (2),

The RFID tag according to any one of Supplementary Note 1 to Supplementary Note 15.
(Appendix 16)
For the reinforcing material, the line length ratio is λ, the length is L, the thickness is h, the compressive stress acting on the central portion of the back surface of the reinforcing material is 4σ, the tensile stress acting on the central portion of the surface of the reinforcing material is 2σ, When the compressive strength is σ _c and the tensile strength is σ _b , the expressions (3), (4), and (5) are satisfied.

The RFID tag according to any one of Supplementary Note 1 to Supplementary Note 15.
(Appendix 17)
The antenna pattern has a lead-out portion led out from an end portion of the reinforcing material in the length direction of the base material,
A cutout relief portion is formed at the end portion of the reinforcing material at a position overlapping the lead-out portion in plan view of the reinforcing material.
The RFID tag according to any one of supplementary notes 1 to 17.
(Appendix 18)
The lead-out portion is disposed at a position shifted in the width direction of the base material with respect to the central portion of the reinforcing material.
The RFID tag according to any one of Supplementary Note 1 to Supplementary Note 18.
(Appendix 19)
In the length direction of the base material, the central portion of the base material and the central portion of the reinforcing material are at the same position.
The RFID tag according to any one of Supplementary Note 1 to Supplementary Note 19.
(Appendix 20)
The reinforcing material is a square, a circle, a rectangle, a square, a circle, and an ellipse in plan view.
The RFID tag according to any one of Supplementary Note 1 to Supplementary Note 19.

DESCRIPTION OF SYMBOLS 10 RFID tag 12 Base material 14 Antenna pattern 16 IC chip 18 Adhesive material 20 1st protective layer 22 2nd protective layer 24 Reinforcement material 24A Central part 24-1 of 1st reinforcement material 24-2 2nd reinforcement material 24A- DESCRIPTION OF SYMBOLS 1 Center part 24A-2 of 1st reinforcement material Center part 40 of 2nd reinforcement material Connection part 42,44 Notch 46,48 Groove 50 Derivation part 52 Relief part

Claims (10)

A sheet-like base material having flexibility;
An antenna pattern formed on the substrate;
An IC chip mounted on the substrate and connected to the antenna pattern;
An adhesive for bonding the IC chip and the substrate;
Reinforcing material that covers the IC chip and the adhesive, and has a central portion shifted in the length direction of the base material with respect to the IC chip and the adhesive,
An RFID tag comprising: In the length direction of the base material, the IC chip and the adhesive material are disposed between a central portion of the reinforcing material and one end portion of the reinforcing material,
The RFID tag according to claim 1. As the reinforcing material, a first reinforcing material arranged on the front side of the base material, and a second reinforcing material arranged on the back side of the base material,
The RFID tag according to claim 1 or 2. In the length direction of the base material, the central portion of the first reinforcing member and the central portion of the second reinforcing member are at the same position.
The RFID tag according to claim 3. In the length direction of the base material, the central portion of the first reinforcing member and the central portion of the second reinforcing member are displaced from each other.
The RFID tag according to claim 3. In the length direction of the base material, one end of the first reinforcing member and one end of the second reinforcing member are displaced from each other.
The RFID tag according to any one of claims 3 to 5. The connection portion with the IC chip in the antenna pattern extends in the width direction of the base material,
The reinforcing material covers the connecting portion,
The RFID tag according to any one of claims 1 to 6. The central portion of the reinforcing material is at a position shifted in the length direction and the width direction of the base material with respect to the IC chip and the adhesive.
The RFID tag according to any one of claims 1 to 7. The reinforcing material has a pair of notches that are open on both sides in the width direction of the base material,
The pair of notches are formed at positions shifted in the length direction of the base material with respect to the IC chip and the adhesive, and at the same position in the length direction of the base material.
The RFID tag according to any one of claims 1 to 8. The reinforcing member extends in the width direction of the base material and has a groove formed at a position shifted in the length direction of the base material with respect to the IC chip and the adhesive material.
The RFID tag according to any one of claims 1 to 9.