JP2017112197A - Substrate holding device, coating apparatus, and substrate holding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress influence of wrapping of a substrate to a position adjustment of the substrate on a placing base.SOLUTION: A substrate holding device comprises: a placing base in which a substrate is placed onto a placing surface; a position adjustment mechanism that executes a position adjustment processing for adjusting a position of the substrate on the placing surface by moving a position adjusting member movable between a contact position contacted to an edge of the substrate on the placing surface and a separation position to be separated from the separation position to the contact position in a state where the substrate is placed on the placing surface; a main pressure position that enable a shape of the substrate to be matched with the shape of the placing surface by pressing the substrate on the placing surface to the placing surface; a pressing mechanism that selectively positions the pressing member at a temporal pressing position facing to the substrate of the placing surface so as to be separated from the placing surface from the main pressing position; and a control part that allows the position adjustment mechanism to execute the position adjustment processing after the position adjustment member is positioned at the separation position, and is moved the pressing member to the substrate of the placing surface, and allows the pressing member to be moved to the main pressing position after the completion of the position adjustment processing.SELECTED DRAWING: Figure 6

Description

  The present invention is for precision electronic devices such as glass substrates for liquid crystal display devices, semiconductor wafers, glass substrates for PDPs, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper, etc. The present invention relates to a technique for holding a substrate (hereinafter simply referred to as “substrate”).

  2. Description of the Related Art Conventionally, in a substrate processing apparatus that performs processing such as coating of a coating liquid on a substrate, processing on the substrate is performed in a state where the substrate is held on a mounting table such as a stage. Further, in the coating apparatus of Patent Document 1, when the substrate is held on the stage, the position of the substrate on the stage is adjusted. Specifically, the position adjustment of the substrate is executed by moving the contact member from a position retracted from the edge of the substrate to a position where the contact member contacts the edge of the substrate. Subsequently, the substrate is attracted to the stage and held on the stage. Incidentally, if the substrate is warped, the substrate may not be properly adsorbed. Therefore, in Patent Document 1, when it is determined that a suction failure has occurred after the start of the suction of the substrate, the peripheral portion of the substrate is pressed by the pressing member, and the suction failure of the substrate is resolved.

JP 2013-175622 A

  By the way, when the warpage of the substrate is large, the warpage of the substrate may affect the position adjustment of the substrate on the mounting table. On the other hand, although the technique of Patent Document 1 can correct the substrate warp by pressing the substrate with the pressing member after the substrate position adjustment, the substrate warp during the substrate position adjustment is performed. It was not always effective.

  The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of suppressing the influence of the warpage of the substrate on the position adjustment of the substrate on the mounting table.

  The first aspect of the present invention is movable between a mounting table on which a substrate is mounted on a mounting surface, and a contact position that contacts the periphery of the substrate on the mounting surface and a spaced position that separates the substrate. A position adjustment mechanism that performs a position adjustment process for adjusting the position of the substrate on the placement surface by moving the position adjustment member from the separated position to the contact position while the substrate is placed on the placement surface; A main pressing position that causes the shape of the substrate to conform to the shape of the mounting surface by pressing the substrate on the mounting surface against the mounting surface; and a substrate on the mounting surface that is farther from the mounting surface than the main pressing position. A pressing mechanism that selectively positions the pressing member at the temporary pressing position opposite to the position, and the positioning member is moved toward the substrate on the mounting surface while the position adjusting member is positioned at the separation position. After that, the position adjustment mechanism executes the position adjustment process, and after the position adjustment process is completed, the pressing member is moved to the final pressing position. It is characterized in that a control unit for moving the.

  According to a second aspect of the present invention, there is provided the substrate holding device according to the first aspect described above, and a nozzle that discharges the coating liquid toward the substrate held by the substrate holding device.

  According to a third aspect of the present invention, a position adjusting member that is movable between a contact position that contacts the periphery of the substrate placed on the placement surface of the placement table and a separation position that is separated from the substrate is placed at the separation position. A step of positioning, a main pressing position for causing the shape of the substrate to conform to the shape of the mounting surface by pressing the substrate on the mounting surface against the mounting surface, and mounting away from the mounting surface than the main pressing position A step of moving the pressing member, which is selectively positioned at the temporary pressing position facing the substrate on the surface, toward the substrate on the mounting surface to be positioned at the temporary pressing position, and the position adjusting member from the separated position. Including a step of performing a position adjustment process for adjusting the position of the substrate on the mounting surface by moving to a contact position, and a step of moving the pressing member to the main pressing position after the position adjustment process is completed. It is said.

  As described above, the pressing member according to the present invention includes a main pressing position that causes the shape of the substrate to conform to the shape of the mounting surface by pressing the substrate on the mounting surface of the mounting table against the mounting surface, and a main pressing position. Can also be selectively positioned at a temporary pressing position that is away from the mounting surface and faces the substrate on the mounting surface. And the position adjustment process which adjusts the position of the board | substrate on a mounting surface by making a position adjustment member contact is performed in the state in which the press member was located in the temporary press position. Therefore, even when the warpage of the substrate placed on the placement surface is large, the warpage of the substrate can be corrected to some extent by the pressing member located at the temporary pressing position when performing the position adjustment process. . As a result, it is possible to suppress the influence of the warpage of the substrate on the position adjustment of the substrate on the mounting table.

1 is a plan view showing a substrate holding device according to a first embodiment of the present invention. It is a block diagram which shows the electrical constitution with which the board | substrate holding apparatus of FIG. 1 is provided. It is a perspective view which shows the position adjustment means which the substrate holding apparatus of FIG. 1 uses for position adjustment of a board | substrate. FIG. 2 is a perspective view showing pressing means used by the substrate holding apparatus of FIG. It is a side view which shows the press means which the board | substrate holding apparatus of FIG. 1 uses for the press of a board | substrate, and its periphery. It is a flowchart which shows an example of the board | substrate fixation which the board | substrate holding apparatus of FIG. 1 performs. It is a flowchart which shows the procedure of the temporary press of the board | substrate performed by the board | substrate holding | maintenance apparatus of FIG. 1 by board | substrate fixation. FIG. 8 is an operation explanatory diagram illustrating an operation executed by the flowcharts of FIGS. 6 and 7. FIG. 8 is an operation explanatory diagram illustrating an operation executed by the flowcharts of FIGS. 6 and 7. It is a side view which shows the board | substrate holding | maintenance apparatus concerning 2nd Embodiment of this invention. It is a front view which shows the board | substrate holding apparatus of FIG. It is a block diagram which shows the electrical constitution with which the board | substrate holding apparatus of FIG. 10 is provided. It is a flowchart which shows the procedure of the temporary press of the board | substrate performed by the board | substrate holding | maintenance apparatus of FIG. It is a perspective view which shows an example of the coating device which concerns on this invention.

  FIG. 1 is a plan view showing a substrate holding apparatus according to a first embodiment of the present invention. FIG. 2 is a block diagram showing an electrical configuration of the substrate holding apparatus of FIG. In FIG. 1 and the subsequent drawings, an XYZ orthogonal coordinate system in which the Z direction is the vertical direction and the XY plane is the horizontal plane is appropriately attached in order to clarify the directional relationship. Further, for the purpose of easy understanding, the dimensions and numbers of the respective parts are exaggerated or simplified as necessary. Incidentally, in the state of FIG. 1, most of the end of the substrate S held by the substrate holding device 1 does not appear, but the end of the substrate S is indicated by a broken line in FIG. 1 and is hidden by the substrate S of the substrate holding device 1. The portion is shown through the substrate S.

  The substrate holding device 1 includes a controller 10 which is a computer composed of a CPU (Central Processing Unit) and a RAM (Random Access Memory), and holds the substrate S received from a robot or the like by controlling each part of the device by the controller 10. It is a device to do. There are various types of substrates S to be held by the substrate holding apparatus 1. In particular, since the substrate holding device 1 includes a mechanism for correcting the warp of the substrate S as will be described later, the substrate holding device 1 is suitable for holding the substrate S having a multilayer structure including a metal layer such as copper. That is, the multilayer substrate S is likely to warp due to the difference in thermal expansion coefficient between the layers, whereas the substrate holding device 1 can hold the substrate S while correcting the warp. Further, although the shape of the substrate S to be held is various, here, a configuration for holding the substrate S having a quadrangular shape in plan view will be described.

  The substrate holding apparatus 1 includes a cubic stage 11 on which a substrate S is placed. In the upper part of the stage 11, a mounting surface 110 having a quadrangular shape in plan view is provided facing upward. The placement surface 110 is a horizontal plane, and the substrate S is horizontally supported by the placement surface 110 with its surface facing up. A large number of ventilation holes (not shown) are opened on the mounting surface 110, and the substrate holding device 1 includes an air supply unit 112 that supplies air to the ventilation holes and air that sucks air from the ventilation holes. And a suction part 113. Then, the controller 10 blows air from the vent hole to the substrate S on the mounting surface 110 by supplying air to the vent hole by the air supply unit 112, or sucks air from the vent hole by the air suction unit 113. Thus, the substrate S can be adsorbed to the placement surface 110.

  The substrate holding device 1 includes a plurality of lift pins 12 for placing the substrate S received from the robot on the placement surface 110. That is, the stage 11 is provided with a plurality of pin accommodation holes 114 that extend in parallel with the Z direction and open to the placement surface 110, and the lift pins 12 are accommodated in the pin accommodation holes 114. Each lift pin 12 has a pin shape extending in parallel with the Z direction. The controller 10 moves the lift pin 12 up and down by the lift pin actuator A 112, so that the lift pin 12 moves forward and backward with respect to the pin accommodation hole 114. When the robot transports the substrate S above the placement surface 110, the plurality of lift pins 12 raised by the drive of the lift pin actuator A112 project from the pin housing hole 114 above the placement surface 110, and the respective upper ends thereof. The substrate S is received. Subsequently, by driving the lift pin actuator A 112, the plurality of lift pins 12 are lowered and received in the pin accommodation holes 114, whereby the substrate S is placed on the placement surface 110 from the upper ends of the plurality of lift pins 12.

  Further, the substrate holding device 1 includes a position adjustment mechanism 2 that adjusts the position of the substrate S placed on the placement surface 110 on the placement surface 110. This position adjusting mechanism 2 has a total of eight position adjusting means 20 arranged on each side of the mounting surface 110, and each position adjusting means 20 is a pin extending in parallel with the Z direction. It has a shape alignment pin 21. That is, each side surface of the stage 11 is provided with two notch portions 115 that are notched vertically to the side surface and extend in the horizontal direction, and the alignment pin 21 is provided in each notch portion 115. Has been placed. The upper end of the alignment pin 21 protrudes above the mounting surface 110 from the notch 115, and the position adjusting means 20 drives the alignment pin 21 in the horizontal direction along the notch 115 by the position adjusting actuator A21. Thus, the portion above the mounting surface 110 of the alignment pin 21 can be brought into contact with the peripheral edge of the substrate S.

  FIG. 3 is a perspective view showing a position adjusting means used for position adjustment of the substrate by the substrate holding apparatus of FIG. The position adjusting means 20 includes a position adjusting actuator A 21 that drives the alignment pin 21 in the horizontal direction while supporting the lower end portion of the alignment pin 21, and a base member 22 that fixes the position adjusting actuator A 21 to the stage 11. Then, the position adjustment actuator A21 moves the alignment pin 21 forward and backward along the notch 115, thereby bringing the contact position P1 (FIG. 9) into contact with the peripheral edge of the substrate S on the placement surface 110, and the placement. The alignment pin 21 moves in the horizontal direction between the separation position P2 (FIG. 9) that is separated from the peripheral edge of the substrate S on the surface 110. As the position adjustment actuator A21, various types such as an air cylinder and a solenoid can be used.

  As shown in FIG. 1, the plurality of alignment pins 21 are arranged so as to surround the substrate S on the mounting surface 110 from four directions. Then, the controller 10 places the substrate S from the robot onto the placement surface 110 by the lift pins 12 in a state where each alignment pin 21 is retracted to the separation position P2 outside the placement region of the substrate S on the placement surface 110. Put. Subsequently, the controller 10 moves each alignment pin 21 to the contact position P1 closer to the placement area of the substrate S than the separation position P2. In this way, the plurality of (two) alignment pins 21 abut on each side of the substrate S, so that the position of the substrate S placed so as to be shifted or inclined with respect to the placement surface 110 is within the horizontal plane. Adjusted appropriately. That is, the controller 10 adjusts the position of the substrate S on the placement surface 110 by moving the alignment pin 21 from the separation position P2 to the contact position P1 while the substrate S is placed on the placement surface 110. The “position adjustment process” is executed.

  Further, the substrate holding device 1 includes a pressing mechanism 3 that presses the substrate S on the mounting surface 110 against the mounting surface 110. The pressing mechanism 3 has a total of four pressing means 30, one on each side of the mounting surface 110, and each pressing means 30 extends along the corresponding side of the mounting surface 110. The pressing member 31 is provided. Then, the pressing unit 30 presses the substrate S against the mounting surface 110 by lowering the pressing member 31 moved to the position immediately above the peripheral edge of the substrate S on the mounting surface 110 by the pressing actuators A311 to A313. . Incidentally, the pressing member 31 is provided with a notch 32 cut out in the advancing and retreating direction of the alignment pin 21 provided on the corresponding side of the mounting surface 110, and the alignment pin is provided in each notch 32. 21 is arranged. The pressing member 31 can press the peripheral edge of the substrate S onto the mounting surface 110 from above while protruding in the horizontal direction toward the substrate S on the mounting surface 110 with respect to the alignment pin 21 at the contact position P1. It has become.

  FIG. 4 is a perspective view showing the pressing means used for pressing the substrate by the substrate holding apparatus of FIG. FIG. 5 is a side view showing the pressing means used by the substrate holding apparatus of FIG. The pressing member 31 of each pressing means 30 includes a frame 33 and a contact flat plate 34 attached to the lower surface of the frame 33. The contact flat plate 34 is provided on the lower surface of the front end portion of the frame 33 extending in the horizontal direction along the corresponding side of the placement surface 110 with the notch 32 removed, and placed on the lower contact plane 35. Contact the surface of the substrate S on the surface 110.

  Each pressing means 30 has first and second pressing actuators A311 and A312. The rod of the first pressing actuator A311 is attached to the frame 33 of the pressing member 31 via the L-shaped plate 361, and the second pressing actuator 3011 The rod of the actuator A 312 is attached to the first pressing actuator A 311 via the L-shaped plate 362. The first pressing actuator A311 drives the pressing member 31 up and down, and the second pressing actuator A312 drives the first pressing actuator A311 up and down.

  4 and 5, the rods of the respective pressing actuators A311 and A312 are positioned at the lowermost ends of the respective lifting ranges, and the pressing member 31 is the final pressing height H1 that is the lowermost end of the lifting ranges (FIG. 9). Located in. The distance between the contact plane 35 of the pressing member 31 positioned at the main pressing height H1 and the mounting surface 110 matches the thickness of the substrate S, and the pressing member 31 positioned at the main pressing height H1 By pressing the substrate S against the placement surface 110, the shape of the substrate S is made to conform to the shape (planar shape) of the placement surface 110.

  Further, when the rod of the first pressing actuator A311 is positioned at the uppermost end of the lifting range while the rod of the second pressing actuator A312 is positioned at the lowermost end of the lifting range, the pressing member 31 is in the middle of the lifting range. Therefore, the contact pressing surface 31 of the pressing member 31 is positioned between the upper end of the alignment pin 21 and the mounting surface 110, and is positioned at the temporary pressing height H2 (FIG. 9) higher than the actual pressing height H1. And when the curvature more than fixed has arisen in the peripheral part of the board | substrate S, the peripheral part of the board | substrate S is pressed by the contact plane 35 of the press member 31 located in the temporary press height H2, and the curvature of the board | substrate S is carried out. Can be corrected to some extent. The distance between the contact plane 35 of the pressing member 31 located at the temporary pressing height H2 and the mounting surface 110 is wider than the thickness of the substrate S. Therefore, in a state where the substrate S on the mounting surface 110 is pressed by the contact plane 35 of the pressing member 31 located at the temporary pressing height H2, the substrate S can slide in the horizontal direction with respect to the mounting surface 110. The position adjustment means 20 can move in the horizontal direction according to the position adjustment processing.

  Further, when the rods of the respective pressing actuators A311 and A312 are positioned at the uppermost ends of the respective raising / lowering ranges, the pressing members 31 are the uppermost ends of the raising / lowering ranges and are retracted heights H3 higher than the temporary pressing height H2 (FIG. ). As described above, the distance between the contact plane 35 of the pressing member 31 positioned at the retracted height H3 and the placement surface 110 is set wider than the assumed maximum value of the warp amount of the substrate S. Therefore, the contact plane 35 of the pressing member 31 located at the retracted height H3 is separated from the substrate S on the placement surface 110.

  Each pressing means 30 fixes the moving plate 371 that supports the second pressing actuator A 312, the rail 372 that supports the moving plate 371 so as to be movable back and forth in the horizontal direction with respect to the stage 11, and the rail 372 fixed to the stage 11. A base member 373. Further, the pressing means 30 includes a third pressing actuator A313 (FIG. 2) that drives the moving plate 371. When the third pressing actuator A313 advances the moving plate 371 toward the stage 11, the second pressing actuator A312 advances with the first pressing actuator A311 and the pressing member 31, and the pressing member 31 is placed on the mounting surface 110. Is located at the advance position L1 (FIG. 9) immediately above the placement area of the substrate S. 4 and 5, the pressing member 31 is located at the advance position L1. On the other hand, when the third pressing actuator A313 retracts the moving plate 371 from the stage 11, the second pressing actuator A312 retracts with the first pressing actuator A311 and the pressing member 31, and the pressing member 31 moves from the advance position L1 to the substrate S. Is located at the retracted position L2 (FIG. 8) outside the mounting range.

  Incidentally, as these 1st-3rd press actuators A311-A313, various things, such as an air cylinder and a solenoid, can be used, for example.

  The pressing mechanism 3 having the above-described configuration causes each of the four pressing members 31 provided corresponding to different sides of the square substrate S to press a range along the corresponding side of the substrate S. . The total length of the contact plane 35 of each pressing member 31 along the side of the substrate S is equal to or more than two-thirds of the peripheral length of the substrate S. Accordingly, by positioning all the four pressing members 31 at the main pressing height H1 or the temporary pressing height H2, the peripheral edge of the substrate S is pressed in a range of two-thirds or more of the peripheral length of the substrate S. be able to.

  FIG. 6 is a flowchart showing an example of substrate fixing executed by the substrate holding apparatus of FIG. FIG. 7 is a flowchart showing a procedure of temporary pressing of the substrate executed by the substrate holding apparatus of FIG. 8 and 9 are operation explanatory views showing the operations executed by the flowcharts of FIGS. 8 and 9, the advance position L1 and the retracted position L2 of the pressing member 31 are indicated by the positions of the tips of the contact flat plate 34, and the heights H1 to H3 of the pressing member 31 are the heights of the contact plane 35. It is shown.

  In step S101, the pressing members 31 provided on each of the four sides of the placement surface 110 are retracted to the retracted position L2 while being positioned at the retracted height H3. In step S102, the alignment pins 21 are positioned at the separation position P2. . As a result, the state shown in the column “S101 to S102” in FIG. 8 is obtained. At this time, as shown in the same column, the upper end of the lift pin 12 is accommodated in the pin accommodation hole 114. When the robot R transports the substrate S above the placement surface 110, each lift pin 12 rises from the pin accommodation hole 114, and the upper end of each lift pin 12 comes into contact with the substrate S (step S103). Receives the substrate S from the robot R (step S104). When the lift pins 12 are lowered and the upper ends of the lift pins 12 are accommodated in the pin accommodation holes 114, the substrate S is placed on the placement surface 110 from the upper ends of the lift pins 12 (step S105). As shown in the column “S105” in FIG. 8, in the example shown here, the peripheral edge of the substrate S warps in a bow shape, and the peripheral edge of the substrate S is separated from the placement surface 110.

  In step S106, temporary pressing of the substrate S is executed. That is, the four pressing members 31 move horizontally to the advance position L1 while maintaining the retracted height H3, and are positioned immediately above the corresponding side of the substrate S (step S201). Subsequently, the four pressing members 31 are lowered from the retracted height H3 to the temporary pressing height H2 (step S202). As shown in the column of “S202” in FIG. 9, the pressing member 31 positioned at the temporary pressing height H2 presses the peripheral edge of the warped substrate S toward the placement surface 110, thereby Warpage is corrected to some extent. As a result, the height of the peripheral edge of the substrate S is suppressed to the temporary pressing height H2 or less, and is lower than the upper end of the alignment pin 21.

  When the temporary pressing of the substrate S is completed, the air supply unit 112 starts air blowing from the vent hole of the stage 11 to the lower surface of the substrate S on the placement surface 110 (step S107). As a result, the lower surface of the substrate S is slightly separated from the placement surface 110, and the frictional force between the lower surface of the substrate S and the placement surface 110 is reduced. In step S108, each alignment pin 21 is moved to the contact position P1, and the position of the substrate S on the placement surface 110 is adjusted (position adjustment processing). When the position adjustment process is completed, the four pressing members 31 are lowered to the main pressing height H1 (step S109). As shown in the column of “S109” in FIG. 9, the shape of the substrate S is changed to the shape of the placement surface 110 by pressing the substrate S against the placement surface 110 by the pressing member 31 thus positioned at the full press height H1. It is corrected so as to follow.

  When the lowering of the pressing member 31 to the main pressing height H1 is completed, the air supply unit 112 stops air blow to the substrate S (step S110). Then, the air suction unit 113 sucks air from the air holes, thereby sucking the substrate S onto the placement surface 110 (step S111). Thus, the substrate S is fixed to the placement surface 110, and the flowchart of FIG.

  As described above, in the first embodiment, the pressing member 31 presses the substrate S on the mounting surface 110 of the stage 11 against the mounting surface 110, thereby changing the shape of the substrate S to the shape of the mounting surface 110. The main pressing height H1 can be selectively positioned along the temporary pressing height H2 that is farther away from the placement surface 110 than the main pressing height H1 and faces the substrate S on the placement surface 110. And the position adjustment process which adjusts the position of the board | substrate S on the mounting surface 110 by making the alignment pin 21 contact | abut is performed in the state in which the press member 31 was located in the temporary press height H2. Therefore, even when the warpage of the substrate S placed on the placement surface 110 is large, the warp of the substrate S is caused by the pressing member 31 positioned at the temporary pressing height H2 when performing the position adjustment process. It can be corrected to some extent. As a result, the influence of the warp of the substrate S on the position adjustment of the substrate S on the stage 11 can be suppressed.

  At this time, the position adjustment process is executed in a state where air is blown to the lower surface of the substrate S. Accordingly, the frictional force generated between the substrate S and the placement surface 110 can be suppressed, and the position adjustment of the substrate S in the position adjustment process can be performed smoothly.

  Further, the position adjustment mechanism 2 moves the plurality of alignment pins 21 arranged so as to surround the substrate S on the placement surface 110 from the separation position P2 provided for each alignment pin 21 to the contact position P1. Execute the position adjustment process. As described above, by performing the position adjustment process with the plurality of alignment pins 21 surrounding the substrate S, the position of the substrate S on the placement surface 110 can be adjusted more accurately.

  Further, the suction of the substrate S to the placement surface 110 is executed after the pressing member 31 is moved to the main pressing height H1. Thus, the adsorption of the substrate S to the placement surface 110 can be reliably performed in a state where the peripheral edge portion of the substrate S is in close contact with the placement surface 110.

  In particular, in this embodiment, the positional adjustment of the substrate S on the stage 11 and each pressing member 31 can be effectively suppressed by adjusting the position of the substrate S while suppressing the influence of the warp of the substrate S. Yes. As a result, in the pressure correction (step S109) of the substrate S executed after the position adjustment process, each pressing member 31 is brought into precise contact with the peripheral edge of the corresponding substrate S, and the shape of the substrate S is changed to that of the placement surface 110. It can fit the shape firmly. Furthermore, since the adsorption of the substrate S (step S111) can be performed in a state where the substrate S is in close contact with the placement surface 110, the adsorption of the substrate S is performed reliably and the substrate S is firmly fixed to the stage 11. be able to.

  Further, the pressing mechanism 3 presses the peripheral edge portion of the substrate S by the pressing member 31 positioned at the main pressing height H <b> 1 within a range of two-thirds or more of the peripheral length of the substrate S. As a result, the shape of the substrate S can be made to conform to the shape of the mounting surface 110 and the shape of the substrate S can be corrected more reliably.

  Further, the pressing member 31 comes into contact with the substrate S on the placement surface 110 at the contact plane 35. The temporary pressing height H2 is set so that the contact plane 35 of the pressing member 31 positioned at the temporary pressing height H2 is positioned between the upper end of the alignment pin 21 and the mounting surface 110. Therefore, in the position adjustment process executed in a state where the substrate S is temporarily pressed, the peripheral edge of the substrate S is kept lower than the upper end of the alignment pin 21, and the alignment pin 21 is reliably brought into contact with the peripheral edge of the substrate S. be able to. As a result, the influence of the warp of the substrate S on the position adjustment of the substrate S on the stage 11 can be more reliably suppressed.

  Further, the pressing mechanism 3 presses different ranges (ranges along each side) of the surface of the substrate S by the plurality of pressing members 31. As a result, the warpage of the substrate S can be corrected relatively uniformly.

  FIG. 10 is a side view showing a substrate holding apparatus according to the second embodiment of the present invention. 11 is a front view showing the substrate holding apparatus of FIG. FIG. 12 is a block diagram showing an electrical configuration of the substrate holding apparatus of FIG. The second embodiment differs from the first embodiment in that the order in which the pressing members 31 are lowered to the temporary pressing height H2 is determined based on the result of acquiring the warpage amount of the substrate S. Therefore, the following description will focus on the differences from the first embodiment, common portions will be denoted by the corresponding reference numerals, and description thereof will be omitted. However, it is needless to say that the same effect can be achieved in the second embodiment by providing the configuration common to the first embodiment.

  The substrate holding device 1 according to the second embodiment has a configuration in which a notification unit 119 that notifies an operator and a warpage detection mechanism 4 that detects warpage of the substrate S are added to the substrate holding device 1 according to the first embodiment. It has. The notification unit 119 is configured by a display device such as a liquid crystal display, for example, and notifies the worker by displaying predetermined characters and images on the screen of the display device. In addition, the specific structure of the alerting | reporting part 119 is not restricted to this example, The alerting | reporting part 119 can also be comprised so that an operator may be alert | reported with a sound or light.

  The warp detection mechanism 4 includes a plurality of distance sensors 41 arranged in the Y direction, and a sensor support portion 45 having a bridge structure that supports the distance sensors 41 above the placement surface 110. The distance sensor 41 is, for example, a laser displacement meter or the like, and faces the surface of the substrate S placed on the placement surface 110 from above. The sensor support portion 45 includes two column members 451 erected upward from the placement surface 110 on both sides in the Y direction of the placement range of the substrate S on the placement surface 110, and these columns above the placement surface 110. And a beam member 452 spanned between the members 451. The beam member 452 extends in parallel to the Y direction, and the plurality of distance sensors 41 are attached to the beam member 452 at different positions in the Y direction.

  In this way, the plurality of distance sensors 41 supported by the sensor support unit 45 sets different positions in the Y direction in the substrate S as measurement target positions. In particular, in the example shown here, of the three distance sensors 41, the distance sensors 41 at both ends have the Y-direction peripheral edge of the substrate S as the measurement target position, and the center distance sensor 41 is the center of the substrate S in the Y direction. Is the position to be measured.

  Further, the warp detection mechanism 4 includes a scanning drive unit 47 that moves the sensor support unit 45 in the X direction with respect to the stage 11 with each distance sensor 41. This scanning drive unit 47 is constituted by, for example, a linear motor or the like. By moving the sensor support unit 45 in the X direction in accordance with a command from the controller 10, each distance with respect to the surface of the substrate S on the placement surface 110. The measurement target position of the sensor 41 is scanned in the X direction.

  Then, the controller 10 calculates the amount of warpage of each side of the substrate S based on the measurement result of each distance sensor 41. Specifically, the height of the placement surface 110 is measured in advance by each distance sensor 41 as a reference height and stored in the controller 10. Then, the controller 10 acquires the measurement result of each distance sensor 41 in association with the position coordinate (XY coordinate) of each distance sensor 41 while moving each distance sensor 41 in the X direction by the scanning drive unit 47. The heights of different positions on the surface of the substrate S are measured. At this time, the measurement target position of each distance sensor 41 scans the surface of the substrate S over the entire area in the X direction. Subsequently, the controller 10 calculates the difference between the height of the surface of the substrate S and the reference height for each of the different positions on the surface of the substrate S, in other words, the state of the warp of the substrate S. Is estimated. Then, the controller 10 calculates the height from the placement surface 110 of each of the four sides of the substrate S as a value indicating the degree of warpage of each side, that is, the amount of warpage, based on the estimation result of the warp state of the substrate S. To do.

  And also in 2nd Embodiment, the board | substrate S is fixed to the stage 11 by performing the flowchart of FIG. Particularly in the second embodiment, as shown below, the order in which the pressing members 31 are lowered to the temporary pressing height H2 in step S106 of FIG. 6 is determined based on the result of detecting the warpage amount of the substrate S.

  FIG. 13 is a flowchart showing a procedure of temporary pressing of the substrate executed by the substrate holding apparatus of FIG. 10 by fixing the substrate. In step S301, the amount of warpage of each side of the substrate S is detected as described above. In step S302, it is determined whether the amount of warpage of each side of the substrate S is less than the allowable value. When there is a side where the warpage amount is larger than the allowable value among the four sides of the substrate S (in the case of “NO” in step S302), the content that the warpage state of the substrate S is defective is displayed on the screen of the notification unit 119. (Step S303), and the flowchart of FIG. 6 ends.

  Here, various specific values of the allowable value can be considered. For example, the maximum value of the warpage required for a non-defective substrate S may be set as the allowable value. Alternatively, an allowable value may be set for the retreat height H3 of the pressing member 31. That is, a value smaller than a value at which interference between the contact plane 35 of the pressing member 31 located at the retracted height H3 and the substrate S occurs is set as an allowable value. Thereby, when the pressing member 31 is moved from the retracted position L2 to the advanced position L1, it is possible to suppress the interference between the pressing member 31 and the substrate S because the warpage of the substrate S is large.

  On the other hand, when the warpage amount is less than or equal to the allowable value for all four sides of the substrate S (“YES” in step S302), the pressing member 31 is moved from the retracted height H3 to the substrate S on the placement surface 110. The order in which the pressing members 31 are caused to perform the temporary pressing operation to be moved toward the temporary pressing height H2, that is, the temporary pressing order, is determined based on the warpage amount of each side of the substrate S (step S304). Specifically, it is determined that a specific side having the maximum amount of warping among the four sides of the substrate S is specified, and the pressing member 31 corresponding to the specific side is first executed to perform the temporary pressing operation. Further, it is determined that the pressing member 31 corresponding to the opposite side of the specific side is caused to execute the temporary pressing operation second. Subsequently, of the other two sides different from the opposite side, the pressing member 31 corresponding to the side with the larger warp amount is caused to execute the temporary pressing operation third, and the side with the smaller warp amount is placed. It is determined that the corresponding pressing member 31 is to execute the fourth temporary pressing operation.

  Thus, when the temporary pressing order is determined, the four pressing members 31 move horizontally to the advance position L1 while maintaining the retracted height H3, and are positioned immediately above the corresponding side of the substrate S (step S305). Subsequently, the four pressing members 31 are sequentially lowered to the temporary pressing height H2 in accordance with the temporary pressing order determined in step S304, and a temporary pressing operation is executed (step S306). Thus, when the temporary pressing operation is performed on all the four sides of the substrate S, the flowchart of FIG. 13 is terminated and the process returns to the flowchart of FIG.

  Thus, in 2nd Embodiment, the curvature amount (index value) which shows the value according to the space | interval of the surface of the board | substrate S mounted in the mounting surface 110 and the mounting surface 110 differs in the surface where the surface of the board | substrate S differs. Get about. The temporary pressing order for causing each pressing member 31 to execute a temporary pressing operation for moving the pressing member 31 toward the substrate S on the placement surface 110 and positioning the pressing member 31 at the temporary pressing height H2 is based on the warpage amount of the substrate S. Each pressing member 31 performs a temporary pressing operation in accordance with this temporary pressing order. As a result, the warping of the substrate S can be corrected relatively uniformly by positioning the pressing members 31 at the temporary pressing height H2 in the order corresponding to the way of warping of the substrate S. As a result, the influence of the warp of the substrate S on the position adjustment of the substrate S on the placement surface 110 can be more reliably suppressed.

  Further, among the four sides (parts) of the surface of the substrate S from which the warpage amount has been acquired, a specific side (specific part) that maximizes the warp amount is specified, and the four pressing members 31 are closest to the specific side. A part of the pressing members 31 including the pressing member 31 that presses the above range performs the temporary pressing operation before the other pressing members 31 different from the part of the pressing members 31. Accordingly, the warp of the substrate S can be corrected relatively uniformly because the correction is performed with priority from the side with the large warp among the four sides of the substrate S.

  Incidentally, the specific mode for determining the temporary pressing order in step S304 is not limited to the above example. For example, after causing the two pressing members 31 corresponding to the specific side and the opposite side to perform the temporary pressing operation simultaneously, temporarily pressing the two pressing members 31 corresponding to the other two sides different from the specific side and the opposite side. It may be determined that the operations are executed simultaneously. Alternatively, it may be determined that the temporary pressing operation is executed in order from the pressing member 31 having a large corresponding side warp amount.

  By the way, the above-described substrate holding apparatus 1 can be applied to various substrate processing apparatuses that process the substrate S. For example, as will be described below, the substrate holding device 1 can be provided in a coating apparatus that performs a coating process for coating a coating solution on the substrate S.

  FIG. 14 is a perspective view showing an example of a coating apparatus according to the present invention. The coating device 5 is a coating device called a slit coater that applies a coating solution to the surface of the substrate S using a slit nozzle 6. Various coating liquids such as a resist liquid, a color filter liquid, polyimide, silicon, nanometal ink, and a slurry containing a conductive material can be used. The coating device 5 performs a coating process on the base 50, the substrate holding device 1 disposed on the base 50, and the substrate S held on the stage 11 of the substrate holding device 1 using the slit nozzle 6. An application processing unit 7 and a controller 8 that controls these units are provided. The substrate holding device 1 provided in the coating device 5 has the same configuration as the substrate holding device 1 of the second embodiment, and the function of the controller 10 described above is built in the controller 8.

  The slit nozzle 6 has a discharge port which is a long opening extending in the Y direction, and can discharge the coating liquid from the discharge port toward the surface of the substrate S held on the stage 11. In the coating apparatus 5, a moving mechanism that moves the slit nozzle 6 in the X direction is provided in the coating processing unit 7, and the slit nozzle 6 can be reciprocated in the X direction above the placement surface 110 of the stage 11. . Then, the coating liquid discharged from the slit nozzle 6 that moves in the X direction above the placement surface 110 is applied to the surface of the substrate S on the placement surface 110.

  The moving mechanism of the coating processing unit 7 includes a bridge-structured nozzle support 71 that supports the slit nozzle 6 across the stage 11 in the Y direction, and a slit nozzle moving unit 72 that horizontally moves the nozzle support 71 in the X direction. And have. Therefore, the slit nozzle 6 supported by the nozzle support 71 can be horizontally moved in the X direction by the slit nozzle moving unit 72.

  The nozzle support 71 includes a fixing member 71a to which the slit nozzle 6 is fixed, and two lifting mechanisms 71b that lift and lower while supporting the fixing member 71a. The fixing member 71a is a rod-shaped member having a rectangular section with the Y direction as the longitudinal direction, and is made of carbon fiber reinforced resin or the like. The two lifting mechanisms 71b are connected to both ends in the longitudinal direction of the fixing member 71a, and each has an AC servo motor, a ball screw, and the like. By these elevating mechanisms 71b, the fixing member 71a and the slit nozzle 6 are integrally moved up and down in the vertical direction (Z direction), and the interval between the discharge port of the slit nozzle 6 and the substrate S, that is, the surface of the substrate S The relative height of the discharge port is adjusted.

  The slit nozzle moving unit 72 detects the positions of the two guide rails 73 that guide the movement of the slit nozzle 6 in the X direction, the two linear motors 74 that are driving sources, and the discharge port of the slit nozzle 6. The two linear encoders 75 are provided.

  The two guide rails 73 are disposed at both ends of the base 50 in the Y direction so as to sandwich the mounting range of the substrate S from the Y direction, and extend in the X direction so as to include the mounting range of the substrate S. Has been. Then, the lower ends of the two lifting mechanisms 71 b are guided along the two guide rails 73, so that the slit nozzle 6 moves in the X direction above the substrate S held on the stage 11.

  Each of the two linear motors 74 is an AC coreless linear motor having a stator 74a and a mover 74b. The stator 74a is provided on both side surfaces of the base 50 in the Y direction along the X direction. On the other hand, the mover 74b is fixed to the outside of the lifting mechanism 71b. The linear motor 74 functions as a drive source for the slit nozzle moving unit 72 by the magnetic force generated between the stator 74a and the mover 74b.

  Each of the two linear encoders 75 includes a scale unit 75a and a detection unit 75b. The scale portion 75 a is provided along the X direction below the stator 74 a of the linear motor 74 fixed to the base 50. On the other hand, the detection unit 75b is fixed to the outer side of the moving element 74b of the linear motor 74 fixed to the lifting mechanism 71b, and is disposed to face the scale unit 75a. The linear encoder 75 detects the position of the discharge port of the slit nozzle 6 in the X direction based on the relative positional relationship between the scale unit 75a and the detection unit 75b.

  That is, the coating processing unit 7 moves the slit nozzle 6 relative to the substrate S in the X direction by the slit nozzle moving unit 72 while adjusting the interval between the slit nozzle 6 and the substrate S in the Z direction by the lifting mechanism 71b. be able to. And a coating liquid can be apply | coated to the surface of the board | substrate S by discharging a coating liquid from the slit nozzle 6 which moves to a X direction.

  The three distance sensors 41 are attached to the fixing member 71a of the nozzle support 71 constituting the drive mechanism of the coating processing unit 7 along the Y direction, and the nozzle support 71 is the sensor support 45 described above. The linear motor 74 plays the role of the above-described scanning drive unit 47. Therefore, the controller 8 can fix the substrate S to the stage 11 by executing the flowcharts of FIGS. 6 and 13 in the same manner as described above.

  Incidentally, although the case where the substrate holding device 1 of the second embodiment is equipped in the coating device 5 is illustrated here, the substrate holding device 1 of the first embodiment can also be equipped in the coating device 5. In this case, each distance sensor 41 can be omitted from the coating apparatus 5 of FIG.

  As described above, in the above embodiment, the substrate holding device 1 corresponds to an example of the “substrate holding device” of the present invention, and the stage 11 corresponds to an example of the “mounting table” of the present invention. The surface 110 corresponds to an example of the “mounting surface” of the present invention, the position adjusting mechanism 2 corresponds to an example of the “position adjusting mechanism” of the present invention, and the alignment pin 21 is an example of the “position adjusting member” of the present invention. The contact position P1 corresponds to an example of the “contact position” of the present invention, the separation position P2 corresponds to an example of the “separation position” of the present invention, and the pressing mechanism 3 corresponds to the “pressing mechanism” of the present invention. ”, The pressing member 31 corresponds to an example of the“ pressing member ”of the present invention, the contact plane 35 corresponds to an example of the“ contact surface ”of the present invention, and the pressing height H1 of the present invention. Corresponds to an example of “main pressing position”, and the temporary pressing height H2 corresponds to an example of “temporary pressing position” of the present invention. The air supply unit 112 corresponds to an example of the “gas blow mechanism” of the present invention, the air suction unit 113 corresponds to an example of the “adsorption mechanism” of the present invention, and the ventilation holes correspond to the “blow hole” and “adsorption” of the present invention. The coating device 5 corresponds to an example of the “coating device” of the present invention, the slit nozzle 6 corresponds to an example of the “nozzle” of the present invention, and the substrate S corresponds to the “substrate” of the present invention. It corresponds to an example.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, a specific method for detecting the warpage amount of the substrate S is not limited to the above-described content, and various changes can be made. Specifically, using the fact that the central portion of the substrate S is not warped or is small even if warped, the center height of the substrate S is measured by the distance sensor 41 as a reference height. Also good. In this case, the difference between the height of the surface of the substrate S and the reference height is calculated for a different position on the surface of the substrate S as a warpage amount (index value) indicating the degree of warpage of the substrate S, whereby the warpage of the substrate S is calculated. The state can be estimated.

  Further, the amount of warpage of the substrate S has been acquired by measuring using the distance sensor 41. However, for example, when data indicating the warp amount (index value) of the substrate S is prepared in advance, the controller 10 may acquire the warp amount of the substrate S by reading the data.

  Further, the specific value of the temporary pressing height H2 can be appropriately adjusted. Therefore, the optimum value of the temporary pressing height H2 may be experimentally obtained in advance. That is, as a result of experimentally performing the position adjustment process while changing the temporary press height H2, the temporary press height H2 may be set to a value that can be determined to be most suitable for the position adjustment process.

  Further, the pressing means 30 is configured by combining the two actuators A311 and A312. However, the pressing means 30 may be constituted by a single solenoid or the like.

  Moreover, in the said embodiment, each pressing member 31 had a long shape in the direction parallel to a corresponding edge | side. However, the shape of the pressing member 31 is not limited to this. For example, the pressing member 31 having a pin shape may be configured to press the substrate S against the placement surface 110 from above.

  In particular, in configuring the substrate holding device 1 of the first embodiment, it is not necessary to provide the pressing member 31 separately for each side of the substrate S, and the pressing member 31 is integrally formed by a frame having a hollow four-stroke shape. You may comprise.

  Further, the shape of the substrate S to be held by the substrate holding apparatus 1 is not limited to the above-described square shape, and the above-described technique can be applied to hold the substrate S having another shape. For example, the above-described technique is used to hold a rectangular substrate S provided with an orientation flat with a part of the corner notched or a circular substrate S provided with an orientation flat with a part of the periphery cut out. May be.

  Moreover, it demonstrated using the coating device 5 which apply | coats a coating liquid with the slit nozzle 6. FIG. However, the nozzle is not limited to the slit type, and a conventionally known different type of nozzle can be used.

  Further, the coating apparatus 5 moves the slit nozzle 6 relative to the substrate S by moving the slit nozzle 6. However, by driving the substrate holding device 1 in a predetermined direction, the above-described configuration of the substrate holding device 1 can be provided for a device that moves the slit nozzle 6 relative to the substrate S.

  As described above, the specific embodiments have been described as examples, and the present invention can be configured as follows, for example.

  That is, the apparatus further includes a gas blow mechanism that blows gas from the blow hole that opens on the placement surface to the substrate on the placement surface, and the control unit performs position adjustment processing on the position adjustment mechanism while causing the gas blow mechanism to blow gas to the substrate. The substrate holding device may be configured to execute. Accordingly, it is possible to smoothly adjust the position of the substrate in the position adjustment process while suppressing the frictional force generated between the substrate and the mounting surface.

  Further, the position adjustment mechanism performs position adjustment processing by moving a plurality of position adjustment members arranged so as to surround the substrate on the placement surface from the separated positions provided for the respective position adjustment members to the contact positions. The substrate holding device may be configured to perform. As described above, the position adjustment process is executed by the plurality of position adjustment members surrounding the substrate, whereby the position of the substrate on the placement surface can be adjusted more accurately.

  Further, the apparatus further includes an adsorption mechanism for adsorbing the substrate on the placement surface to the placement surface by sucking gas from the suction hole opening in the placement surface, and the control unit moves the pressing member to the main pressing position. The substrate holding device may be configured so that the substrate is adsorbed later by the adsorption mechanism. Thus, the substrate can be reliably adsorbed onto the mounting surface in a state where the substrate is in close contact with the mounting surface.

  At this time, the suction hole can also be used as a blow hole. Specifically, gas suction and gas blow may be switched and executed for the suction holes.

  Further, the substrate holding device may be configured such that the pressing mechanism presses the peripheral edge of the substrate with the pressing member in a range of two or more of the peripheral length of the substrate. Accordingly, the shape of the substrate can be more reliably corrected by keeping the shape of the substrate in line with the shape of the mounting surface.

  The pressing member is in contact with the substrate on the placement surface at the contact surface, and the position adjustment member is provided so as to protrude from the placement surface, and the tip and the placement protruding from the placement surface of the position adjustment member. You may comprise a board | substrate holding | maintenance apparatus so that the contact surface of the press member located in a temporary press position may be located between the surfaces. This makes it possible to more reliably suppress the influence of the warpage of the substrate on the position adjustment of the substrate on the mounting table.

  Further, the substrate holding device may be configured so that the pressing mechanism presses different ranges of the surface of the substrate with a plurality of pressing members. As a result, the warpage of the substrate can be corrected relatively uniformly.

  Further, the control unit further includes an acquisition unit that acquires an index value indicating a value corresponding to a distance between the surface of the substrate placed on the placement surface and the placement surface for different portions of the surface of the substrate, and the control unit includes a pressing member Is determined based on the index value, and the temporary pressing operation is performed on each pressing member in that order. The substrate holding device may be configured to execute. Accordingly, the pressing members can be positioned at the temporary pressing positions in the order corresponding to the way of warping of the substrate, and the warping of the substrate can be corrected relatively uniformly. As a result, the influence of the warpage of the substrate on the position adjustment of the substrate on the mounting table can be more reliably suppressed.

  In addition, the control unit specifies a specific part where the index value is maximum among each part of the surface of the substrate from which the index value is acquired, and presses the closest range to the specific part among the plurality of pressing members. You may comprise a board | substrate holding | maintenance apparatus so that it may determine that the one part pressing member containing a member performs provisional pressing operation before the other pressing member different from the said one part pressing member. As a result, the substrate is corrected with priority from the large warped portion of the substrate, so that the substrate warp can be corrected relatively uniformly.

  Specifically, the shape of the substrate is a quadrangular shape, and the pressing mechanism causes each of four pressing members provided corresponding to different sides of the substrate to press the range along the corresponding side of the substrate. The control unit specifies the specific side having the maximum index value among the four sides of the substrate as the specific part, and among the four pressing members, the two pressing members corresponding to the specific side and the opposite side of the specific side are provided. The substrate holding device may be configured to determine that the temporary pressing operation is executed before another pressing member different from the two pressing members. As a result, the substrate is corrected with priority from the side having the large warpage, so that the warpage of the substrate can be corrected relatively uniformly.

  The present invention can be applied to all substrate holding techniques for holding a substrate on a mounting table, and can be suitably applied to a coating apparatus that holds a substrate on the mounting table in order to apply a coating solution to the substrate.

DESCRIPTION OF SYMBOLS 1 ... Substrate holding device 11 ... Stage 110 ... Mounting surface 2 ... Position adjustment mechanism 21 ... Alignment pin P1 ... Contact position P2 ... Separation position 3 ... Pressing mechanism 31 ... Pressing member 32 ... Notch part 33 ... Frame 34 ... Contact Flat plate 35 ... contact plane H1 ... real press height H2 ... temporary press height L1 ... advance position L2 ... retreat position 112 ... air supply part 113 ... air suction part 5 ... coating device 6 ... slit nozzle S ... substrate

Claims (12)

A mounting table on which the substrate is mounted on the mounting surface;
A position adjusting member that is movable between a contact position that contacts the peripheral edge of the substrate on the placement surface and a separation position that is separated from the periphery of the substrate in a state where the substrate is placed on the placement surface. A position adjustment mechanism that performs a position adjustment process for adjusting the position of the substrate on the placement surface by moving the separation position to the contact position;
A main pressing position that causes the shape of the substrate to conform to the shape of the mounting surface by pressing the substrate on the mounting surface against the mounting surface, and a position farther from the mounting surface than the main pressing position. A pressing mechanism that selectively positions the pressing member at a temporary pressing position facing the substrate on the placement surface;
The position adjusting member is moved to the temporary pressing position by moving the pressing member toward the substrate on the mounting surface while the position adjusting member is positioned at the separated position, and then the position adjusting process is performed on the position adjusting mechanism. And a control unit that moves the pressing member to the main pressing position after the position adjustment process is completed. The substrate holding apparatus according to claim 1,
A gas blow mechanism for blowing gas from the blow hole opened on the placement surface to the substrate on the placement surface;
The said control part is a substrate holding apparatus which makes the said position adjustment mechanism perform the said position adjustment process, making the said gas blow mechanism blow gas to the said board | substrate. The substrate holding apparatus according to claim 1 or 2,
The position adjustment mechanism moves a plurality of the position adjustment members arranged so as to surround the substrate on the placement surface from the separated positions provided for the position adjustment members to the contact position. A substrate holding apparatus that performs the position adjustment process. A substrate holding apparatus according to any one of claims 1 to 3,
It further comprises an adsorption mechanism for adsorbing the substrate on the placement surface to the placement surface by sucking gas from the suction hole opening on the placement surface,
The said control part is a substrate holding apparatus which makes the said adsorption mechanism adsorb the said board | substrate after moving the said press member to the said full press position. A substrate holding device according to any one of claims 1 to 4,
The pressing mechanism is a substrate holding device that presses the peripheral portion of the substrate with the pressing member in a range of two-thirds or more of the peripheral length of the substrate. A substrate holding apparatus according to any one of claims 1 to 5,
The pressing member is in contact with the substrate on the mounting surface at the contact surface,
The position adjustment member is provided so as to protrude from the placement surface,
A substrate holding device in which a contact surface of the pressing member located at the temporary pressing position is located between a tip protruding from the mounting surface of the position adjusting member and the mounting surface. A substrate holding apparatus according to any one of claims 1 to 6,
The pressing mechanism is a substrate holding device that presses different ranges of the surface of the substrate with the plurality of pressing members. The substrate holding device according to claim 7,
An acquisition unit for acquiring an index value indicating a value according to a distance between the surface of the substrate placed on the placement surface and the placement surface, on a different part of the surface of the substrate;
The control unit determines the order in which the pressing members move the pressing members toward the substrate on the placement surface to place the pressing members at the temporary pressing position based on the index values. And the board | substrate holding | maintenance apparatus which makes each said pressing member perform the said temporary pressing operation | movement in the said order. The substrate holding apparatus according to claim 8, wherein
The control unit specifies a specific part where the index value is maximum among each part of the surface of the substrate from which the index value is acquired, and is closest to the specific part among the plurality of pressing members. A substrate holding apparatus that determines that a part of pressing members including a pressing member that presses the temporary pressing operation is executed before another pressing member different from the part of the pressing members. The substrate holding apparatus according to claim 9, wherein
The substrate has a quadrangular shape,
The pressing mechanism causes each of the four pressing members provided corresponding to different sides of the substrate to press a range along the corresponding side of the substrate,
The control unit specifies a specific side having the maximum index value among the four sides of the substrate as the specific part, and corresponds to the specific side and the opposite side of the specific side among the four pressing members. A substrate holding apparatus that determines to cause two pressing members to execute the temporary pressing operation before another pressing member different from the two pressing members. A substrate holding device according to any one of claims 1 to 10,
A coating apparatus comprising: a nozzle that discharges a coating liquid toward the substrate held by the substrate holding apparatus. A step of positioning a position adjusting member that is movable between a contact position that contacts the periphery of the substrate placed on the placement surface of the placement table and a separation position that is separated from the separation position;
A main pressing position that causes the shape of the substrate to conform to the shape of the mounting surface by pressing the substrate on the mounting surface against the mounting surface, and a position farther from the mounting surface than the main pressing position. A step of selectively moving the pressing member positioned at the temporary pressing position facing the substrate on the placement surface to the temporary pressing position by moving the pressing member toward the substrate on the placement surface;
Performing a position adjustment process for adjusting the position of the substrate on the placement surface by moving the position adjustment member from the separation position to the contact position;
And a step of moving the pressing member to the main pressing position after completion of the position adjusting process.

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