JP2016201447A - Molded package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a half molded type package which has irregularities both for preventing a peeled molded resin from penetrating through one surface of a die pad, and preventing a resin burr in the other surface of the die pad.SOLUTION: A molded package P1 comprises a semiconductor chip 30 which is mounted on one surface 10a of a flat die pad 10 via a die bond material 20; and a molded resin 40 which seals the one surface 10a of the die pad 10. A portion 11 just below the chip of another surface 10b of the die pad 10 is exposed from the molded resin 40. In the other surface 10b of the die pad 10, an annular recess 12 is formed so as to surround the whole circumference of the portion 11 just below the chip, and an inner peripheral side of the recess 12 is exposed from the mold resin 40. In the surface 10a of the die pad 10, a portion just above the recess 12 is an annular protrusion 13 which has a protruded shape derived from a concave shape of the recess 12.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mold package in which a semiconductor chip mounted on one surface side of a die pad is sealed with a mold resin and the other surface of the die pad is exposed from the mold resin.

  Conventionally, as this type of mold package, for example, a package described in Patent Document 1 has been proposed. This package includes a plate-shaped die pad whose one surface and the other surface are front and back, a semiconductor chip mounted on one surface of the die pad via a die bonding material, and a mold resin that seals one surface of the die pad together with the semiconductor chip. And comprising.

  Of the other surface of the die pad, at least a portion directly below the semiconductor chip located below the semiconductor chip is exposed from the mold resin. In this way, this type of mold package is configured so that substantially only one side of the die pad is sealed with the mold resin, and is called a so-called half mold type.

  In the case of such a half mold type package, the other side of the die pad, in particular, the lower part of the die pad, which needs to be radiated, needs to be exposed from the mold resin by preventing resin burrs caused by the mold resin. It is.

  Therefore, in the above-mentioned Patent Document 1, the die pad is subjected to press processing using a punch from the other surface side of the die pad, and the step immediately below the chip is provided with a step, thereby providing a step in the peripheral portion immediately below the chip. Intrusion of resin burrs was prevented at the step.

  On the other hand, in the case of such a mold package, it is important to take measures to prevent the mold resin from peeling on the one surface side of the die pad sealed with the mold resin. In particular, when mold resin peeling penetrates between the semiconductor chip and the outer peripheral edge of the die pad, that is, when so-called penetration peeling occurs, moisture or the like enters through the peeling portion, thereby reducing the characteristics of the semiconductor chip. Concerned.

  There are mainly the following two factors that cause such peeling. The first is that the adhesion between the die bond material and the mold resin is generally low, and the mold resin is easily peeled from the vicinity of the semiconductor chip. Second, the mold resin is likely to be peeled off due to stress concentration at the outer peripheral edge of the die pad.

  For this reason, conventionally, the surface of the die pad is also pressed to form a recess such as a groove between the semiconductor chip and the outer peripheral end of the die pad, thereby taking measures to prevent peeling.

JP 2013-175895 A

  As described above, in this type of mold package, it is necessary to take measures from both sides of prevention of penetration peeling on one surface of the die pad and prevention of resin burr on the other surface of the die pad, and recesses are provided on both front and back surfaces of the die pad. There is a need. However, in the conventional press work, in order to ensure the flatness of the die pad, a shallow concave portion has to be formed separately on one surface and the other surface of the die pad.

  The present invention has been made in view of the above problems, and in a half mold type package, unevenness for making both prevention of penetration peeling on one surface of the die pad and prevention of resin burr on the other surface of the die pad compatible, It aims at realizing the structure suitable for forming easily by press work.

In order to achieve the above object, in the invention described in claim 1, a plate-like die pad (10) in which one surface (10 a) and the other surface (10 b) are in a front-back relationship, and a die bond material (20 ) And a mold resin (40) for sealing one side of the die pad together with the semiconductor chip, and at least the chip located directly below the semiconductor chip on the other side of the die pad The lower part (11) is a mold package exposed from the mold resin,
A concave portion (12) having a step and recessed is provided in an annular shape so as to surround the entire circumference immediately below the chip, between the lower surface of the die pad and the outer peripheral edge (10c) of the die pad. The portion of the other side of the die pad on the inner peripheral side of the recess is exposed from the mold resin, and the portion of the one side of the die pad that is located immediately above the recess is a convex shape inheriting the concave shape of the recess. It is set as the cyclic | annular convex part (13) which has.

  According to this, since the part located immediately above the concave portion of one surface of the die pad is a convex portion having a convex shape inheriting the concave shape of the concave portion, the concave portion on the other surface side of the die pad by a half punch press (step press). And the convex portion on one side can be formed simultaneously.

  And since the recessed part is provided in an annular shape so as to surround the entire periphery of the die pad on the other side of the die pad, the progress of the resin burr can be blocked by the recessed part. The part containing is exposed from the mold resin.

  In addition, since the convex portion is located immediately above the concave portion on one surface of the die pad with respect to the annular concave portion surrounding the lower portion of the chip on the other surface of the die pad, the convex portion is an annular shape surrounding the entire circumference of the semiconductor chip. It is said. Therefore, the progress of the peeling of the mold resin between the semiconductor chip and the outer peripheral end of the die pad is blocked by the step of the convex portion.

  Therefore, according to the present invention, a configuration suitable for easily forming unevenness by pressing to prevent penetration peeling on one side of the die pad and prevention of resin burr on the other side of the die pad is realized. can do.

  Here, as in the invention described in claim 2, the mold package according to claim 1 includes a bonding wire (50) for connecting one surface of the die pad and the semiconductor chip, and the mold resin includes the semiconductor chip and the bonding wire. At the same time, the one surface side of the die pad may be sealed, and the bonding wire may be connected to the convex portion on the one surface of the die pad.

  According to this, since the wire connecting portion on one surface of the die pad has a step due to the convex portion on both sides of the semiconductor chip side and the outer peripheral end portion side of the die pad, peeling occurring on both sides is stopped at the step. It is difficult to proceed to the wire connection part. Thus, since the progress of the peeling of the mold resin on the one surface side of the die pad to the wire connecting portion is prevented, it is preferable in terms of improving the reliability of the wire connecting portion.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is a schematic sectional drawing which shows the principal part of the mold package concerning 1st Embodiment of this invention. It is a schematic plan view which shows the planar shape of the one surface side of the die pad in the mold package concerning 1st Embodiment. It is a schematic sectional drawing which shows the principal part of the mold package concerning 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the mold package concerning 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the mold package concerning 4th Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the mold package concerning other embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the mold package concerning other embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, parts that are the same or equivalent to each other are given the same reference numerals in the drawings for the sake of simplicity.

(First embodiment)
The half mold type mold package P1 according to the first embodiment of the present invention will be described with reference to FIGS. The mold package P1 is mounted on a vehicle such as an automobile and is applied as a device for driving various electronic devices for the vehicle.

  As shown in FIG. 1 and FIG. 2, the mold package P1 of the present embodiment is roughly composed of a plate-like die pad 10 in which the one surface 10a and the other surface 10b are in a relation of front and back plate surfaces, and one surface of the die pad 10. The semiconductor chip 30 is mounted on the die 10 via the die bonding material 20, and the mold resin 40 is provided to seal the one surface 10 a side of the die pad 10 together with the semiconductor chip 30.

  In the mold package P1 of the present embodiment, as in a typical half mold type, the chip directly lower portion 11 located immediately below the semiconductor chip 30 in the other surface 10b of the die pad 10 is exposed from the mold resin 40. Yes. Note that the lower portion 11 of the chip corresponds to a region where the semiconductor chip 30 is projected onto the other surface 10 b of the die pad 10, and specifically, here is a rectangular region that is the same as the semiconductor chip 30.

  As described above, the lower portion 10 b of the die pad 10, which requires heat dissipation, is a portion that needs to be reliably exposed from the mold resin 40 by preventing the resin burr due to the mold resin 40. The exposed portion of the die pad 10 is connected to an external member (not shown) such as a wiring board or a casing located outside the package, and heat generated in the semiconductor chip 30 is radiated from the other surface 10b of the die pad 10 to the external member. It has become so.

  Here, the semiconductor chip 30 is made of a silicon semiconductor or the like formed by a normal semiconductor process, and is made of, for example, an IC chip or a power element such as a MOS transistor or IGBT.

  The planar shape of the semiconductor chip 30 is not particularly limited, but typically has a rectangular plate shape as shown in FIG. The die bond material 20 for fixing the semiconductor chip 30 to the die pad 10 is made of solder, Ag paste, conductive adhesive, or the like.

  Here, the die pad 10 has a rectangular plate shape that is slightly larger than the semiconductor chip 30. Here, the die pad 10 is made of the same lead frame material as a lead 60 described later, and has the same material and plate thickness as the lead 60.

  In this case, the lead frame material is formed by patterning a metal plate such as Cu (copper), Fe (iron), or 42 alloy by etching or stamping to form the die pad 10 and the lead 60. . The die pad 10 and the lead 60 are connected by a tie bar (not shown) before sealing with the mold resin 40, but after sealing with the mold resin 40, they are separated by lead cutting or the like.

  Here, the above-described lead 60 is positioned outside the outer peripheral end portion 10c of the die pad 10, and typically has an elongated plate shape. One lead 60 may be provided, but typically, a plurality of leads 60 are provided outside the die pad 10.

  In this embodiment, one surface 10 a of the die pad 10 and the semiconductor chip 30 are connected by a bonding wire 50, and the lead 60 and the semiconductor chip 30 are connected by a bonding wire 51.

  Here, the die pad bonding wire 50 that is connected to the die pad 10 and the lead bonding wire 51 that is connected to the lead 60 are both made of Al (aluminum), Au (gold), Cu (copper), or the like. It is formed by ordinary wire bonding.

  In order to secure the connectivity between the bonding wires 50 and 51 and the die pad 10 and the lead 60, Ag (silver) plating or Ni / Pd / Au (nickel / palladium / Gold) plating is desirable. Of course, those without plating may be used.

  Here, the die pad bonding wire 50 is, for example, a GND wire of the semiconductor chip 30 and may be one, but typically, a plurality of die pads are provided. In FIG. 2, only one die pad bonding wire 50 is shown. Thereby, the grounding of the semiconductor chip is performed via the die pad bonding wire 50, the die pad 10, and the external member connected to the other surface 10b of the die pad 10.

  The lead bonding wire 51 is a signal wire for driving and controlling the semiconductor chip 30. The lead bonding wire 51 is connected to the inner lead of the leads 60. By connecting the outer lead of the lead 60 to the outside of the package, signals can be exchanged between the semiconductor chip 30 and the outside. Yes.

  The mold resin 40 seals the one surface 10 a side of the die pad 10 together with the semiconductor chip 30, the die pad bonding wire 50, the lead bonding wire 51, and the inner lead of the lead 60.

  Here, the mold resin 40 is the same as that applied to this type of half mold type package, and is made of an epoxy resin or the like formed by transfer molding. As shown in FIG. 1, the mold resin 40 seals the one surface 10 a side of the die pad 10 and the outer peripheral end portion 10 c of the die pad 10.

  Here, in this embodiment, as shown in FIGS. 1 and 2, there is a step between the lower surface 10b of the die pad 10 and the outer peripheral end 10c of the die pad 10 on the other surface 10b. A recessed portion 12 is provided in an annular shape so as to surround the entire circumference of the chip directly lower portion 11.

  A portion of the other surface 10 b of the die pad 10 on the inner peripheral side of the concave portion 12 including the chip lower portion 11 is exposed from the mold resin 40. On the other hand, a portion of the one surface 10a of the die pad 10 that is located immediately above the concave portion 12 is an annular convex portion 13 having a convex shape inheriting the concave shape of the concave portion 12.

  The convex portion 13 has a convex shape inheriting the concave shape of the concave portion 12, and the concave portion of the concave portion 12 on the other surface 10b side of the die pad 10 constitutes the convex portion 13 on the one surface 10a side as it is. That is, the step shape and height of the convex portion 13 are substantially the same as the step shape and depth of the concave portion 12.

  More specifically, the entire annular recess 12 and the entire annular protrusion 13 are provided at the same position on the front and back plate surfaces of the die pad 10, and the recess 12 and the protrusion 13 are a set of the uneven portions 14. Is configured. Here, as shown in FIGS. 1 and 2, the planar shapes of the concave portion 12 and the convex portion 13 form a rectangular ring-shaped closed ring having a width.

  In addition, as described above, the recess 12 and the projection 13 have wall surfaces extending in a direction perpendicular to the plate surface of the die pad 10 as steps, but here, the recess 12 and the projection 13 are square in cross section. It is configured as an uneven shape. For example, the thickness of the die pad 10 is about 0.1 mm to 0.3 mm, and the depth of the step of the recess 12 is about half of the thickness of the die pad 10.

  Such concave portions 12 and convex portions 13 are formed by a half punch press. This half punch press is also referred to as a step press, and is intended to stop punching through the workpiece and prevent it from penetrating.

  In the present embodiment, the above-described die pad bonding wire 50 is connected to the convex portion 13 on the one surface 10 a of the die pad 10. Specifically, the bottom of the recess 12 and the top of the projection 13 corresponding thereto are flat surfaces, and the die pad bonding wire 50 is connected to the top of the projection 13 which is this flat surface. .

  The entire surface 10 a of the die pad 10 is sealed with a mold resin 40 as in a typical half-mold type package formed by transfer molding. That is, on one surface 10 a of the die pad 10, the convex portion 13, the inner periphery of the convex portion 13, and the outer periphery of the convex portion 13 are in contact with the mold resin 40 and sealed.

  On the other hand, in the present embodiment, on the other surface 10b of the die pad 10, the mold resin 40 wraps around from the outer peripheral end 10c to the portion of the recess 12, and covers the portion as a so-called resin burr.

  However, the mold resin 40 is retained inside the recess 12, and the development of resin burrs toward the inner periphery of the recess 12 is prevented. Thereby, as described above, the part on the inner peripheral side of the recess 12 including the chip lower part 11 on the other surface 10 b of the die pad 10 is exposed from the mold resin 40.

  Next, a method for manufacturing the mold package P1 of this embodiment will be described. First, as the lead frame material, one in which the die pad 10 having the concavo-convex portion 14 and the lead 60 are integrated is prepared (preparation process).

  Next, the semiconductor chip 30 is mounted on the one surface 10a of the die pad 10 via the die bonding material 20 (mounting process). Next, wire bonding is performed to connect the semiconductor chip 30 to the die pad 10 and the lead 60 with bonding wires 50 and 51 (wire bonding step).

  Thereafter, the wire-bonded work is put into a resin molding die (not shown), and a molding resin 40 is formed by transfer molding (molding process). At this time, the inner surface of the mold is brought into contact with the other surface 10b of the die pad 10 to prevent the resin from entering the other surface 10b of the die pad 10.

  In this way, after molding the mold resin 40, lead molding or lead molding is performed as necessary, thereby completing the mold package P1 of the present embodiment.

  By the way, according to the present embodiment, a portion of the one surface 10a of the die pad 10 that is located immediately above the concave portion 12 is the convex portion 13 having a convex shape inheriting the concave shape of the concave portion 12. Therefore, the concave portion 12 on the other surface 10b side of the die pad 10 and the convex portion 13 on the one surface 10a side can be simultaneously formed by half punching press (step press).

  In this embodiment, since the concave portion 12 and the convex portion 13 are collectively provided on both surfaces of the die pad 10 by a half punch press that has not been conventionally employed, the concave portion 12 and the convex portion 13 can be made deeper and higher. Therefore, the effect of preventing peeling and preventing resin burrs can be sufficiently secured.

  Specifically, since the recess 12 is provided in a closed ring shape so as to surround the entire periphery of the chip directly lower portion 11 of the other surface 10b of the die pad 10, the recess 12 blocks the progress of the resin burr in the molding process. Can be stopped. As a result, a portion of the other surface 10 b of the die pad 10 including the chip immediately lower portion 11 on the inner periphery of the recess 12 is reliably exposed from the mold resin 40.

  Further, since the convex portion 13 is positioned directly above the entire concave portion 12 on one surface 10a of the die pad 10 with respect to the annular concave portion 12 surrounding the chip direct lower portion 11 on the other surface 10b of the die pad 10, the convex portion 13 is It is a closed annular shape surrounding the entire circumference of the semiconductor chip 30.

  Therefore, the progress of the peeling of the mold resin 40 between the semiconductor chip 30 and the outer peripheral end portion 10 c of the die pad 10 on the one surface 10 a of the die pad 10 is blocked by the step of the convex portion 13.

  Therefore, according to the present embodiment, the concavo-convex portion 14 for making both prevention of penetration peeling on the one surface 10a of the die pad 10 and prevention of resin burr on the other surface 10b of the die pad 10 easy to form by press working. A configuration suitable for the above can be realized.

  Further, according to the present embodiment, the die pad bonding wire 50 is connected to the convex portion 13 on the one surface 10 a of the die pad 10. According to this, since the wire connecting portion on the one surface 10a of the die pad 10 has a step due to the convex portion 13 on both sides of the semiconductor chip 30 side and the outer peripheral end portion 10c side of the die pad 10, peeling occurring on both sides is not caused. It is stopped at the level difference and does not easily travel to the wire connection part.

  As described above, according to the present embodiment, since the progress of the peeling of the mold resin 40 on the one surface 10a side of the die pad 10 to the wire connecting portion is prevented, the reliability of the wire connecting portion can be improved.

(Second Embodiment)
The mold package P2 according to the second embodiment of the present invention will be described with reference to FIG. 3, focusing on the differences from the first embodiment. In the first embodiment, the die pad 10 is provided with one set of the concavo-convex portion 14 that is a set of the concave portion 12 and the convex portion 13 corresponding to the concave portion 12, but as in the second embodiment. Two sets of uneven portions 14 may be provided.

  As shown in FIG. 3, in this embodiment, two sets of concavo-convex portions 14 are provided, and these two sets of concavo-convex portions 14 are doubled near the semiconductor chip 30 and the outer peripheral end portion 10 c of the die pad 10 in the die pad 10. Are arranged apart from each other so as to form an annular shape. The die pad bonding wire 50 is connected to a portion between the two sets of concavo-convex portions 14 on one surface 10 a of the die pad 10.

  According to this embodiment, the site | part between the two sets of uneven | corrugated | grooved parts 14 in the one surface 10a of the die pad 10 is a site | part which has not been uneven | corrugated processed by press, and is excellent in flatness compared with the said uneven | corrugated processed site | part. . And since the die-pad bonding wire 50 is connected to the site | part which is excellent in this flatness, it is preferable at the point of wire bonding property.

  Further, according to the present embodiment, since the convex portions 13 are on both sides of the semiconductor chip 30 side and the outer peripheral end portion 10c side of the die pad 10 on the one surface 10a of the die pad 10, they are generated on both sides. The peeling is stopped at the level difference of the convex portion 13 and hardly progresses to the wire connection portion.

  As described above, the present embodiment is preferable in terms of improving the reliability of the wire connecting portion because the progress of the peeling of the mold resin 40 on the one surface 10a side of the die pad 10 to the wire connecting portion is prevented.

  In addition, although the uneven | corrugated | grooved part 14 was two sets arrange | positioned with a double ring in the said FIG. In this case as well, any two adjacent sets out of the three or more sets may constitute the two sets of concavo-convex portions 14 in the present embodiment, and the die pad bonding wire 50 may be connected therebetween.

(Third embodiment)
The mold package P3 according to the third embodiment of the present invention will be described with reference to FIG. 4, focusing on the differences from the first embodiment. In the first embodiment, the die pad bonding wire 50 is connected to the convex portion 13 on the one surface 10 a of the die pad 10.

  On the other hand, in this embodiment, as shown in FIG. 4, the die pad bonding wire 50 is connected to a portion of the one surface 10 a of the die pad 10 closer to the semiconductor chip 30 than the convex portion 13.

  According to the present embodiment, the portion on the semiconductor chip 30 side of the convex portion 13 on the one surface 10 a of the die pad 10 is a portion that is not subjected to uneven processing by pressing, and is excellent in flatness as compared with the convex portion 13. Also according to this embodiment, the die pad bonding wire 50 is connected to the portion having excellent flatness, which is preferable in terms of wire bonding.

  In addition, according to the present embodiment, the wire connecting portion on the one surface 10a of the die pad 10 has the convex portion 13 with respect to the outer peripheral end portion 10c side of the die pad 10, and therefore the peeling that occurs from the outer peripheral end portion 10c side is convex. It is stopped at the level difference of the part 13 and hardly travels to the wire connection part.

  As described above, in the present embodiment, when there is a concern that the peeling of the mold resin 40 on the one surface 10a side of the die pad 10 may occur from the outside of the resin, that is, from the outer peripheral end portion 10c side of the die pad 10, to the wire connecting portion. This is preferable from the viewpoint of improving the reliability of the wire connecting portion.

(Fourth embodiment)
The mold package P4 according to the fourth embodiment of the present invention will be described with reference to FIG. 5, focusing on the differences from the first embodiment. In the first embodiment, the die pad bonding wire 50 is connected to the convex portion 13 on the one surface 10a of the die pad 10. However, in the present embodiment, as shown in FIG. Of these, it is connected to a portion on the outer peripheral end 10 c side with respect to the convex portion 13.

  According to the present embodiment, the portion on the outer peripheral end portion 10 c side of the convex surface 13 on the one surface 10 a of the die pad 10 is a portion that is not subjected to uneven processing by pressing, and is excellent in flatness as compared with the convex portion 13. Therefore, according to this embodiment, the die pad bonding wire 50 is connected to the portion having excellent flatness, which is preferable in terms of wire bonding.

  In addition, according to the present embodiment, the wire connection portion on the one surface 10a of the die pad 10 has the convex portion 13 with respect to the semiconductor chip 30 side, so that the peeling that occurs from the semiconductor chip 30 side occurs at the level difference of the convex portion 13. It is difficult to advance to the wire connection part.

  As described above, in this embodiment, in the case where there is a concern that peeling of the mold resin 40 on the one surface 10a side of the die pad 10 may occur from the inside of the mold resin 40, that is, from the semiconductor chip 30 side, peeling to the wire connection portion. Progress is prevented, which is preferable in terms of improving the reliability of the wire connecting portion.

(Other embodiments)
In each of the above-described embodiments shown in FIG. 1 and the like, the recess 12 prevents the mold resin 40 from entering the other surface 10b of the die pad 10, and the mold resin 40 stays in the recess 12, so that the die pad 10 Of the other surface 10b, the inner periphery of the recess 12 was exposed. However, on the other surface 10b of the die pad 10, it is only necessary to expose at least the inner periphery of the recess 12 including the chip lower portion 11. Depending on the conditions at the time of transfer molding, the entire other surface 10b of the die pad 10 is exposed. It may be.

  Furthermore, as shown in FIG. 6, the mold resin 40 as a resin burr may remain between the outer peripheral end 10 c and the recess 12 in the other surface 10 b of the die pad 10. . Moreover, the mold resin 40 as a resin burr may remain in the middle of the recess 12 as shown in FIG.

  Further, even in the case where the two protrusions 13 are provided on the one surface 10a of the die pad 10 as in the second embodiment, the die pad bonding wire 50 has two protrusions as in the first embodiment. It may be connected on one of the convex portions 13 of the portion 13.

  Furthermore, a configuration in which two convex portions 13 are provided on one surface 10a of the die pad 10 as in the second embodiment may be combined with the third embodiment and the fourth embodiment. In this case, the die pad bonding wire 50 may be connected to the semiconductor chip 30 side or the outer peripheral end portion 10c side from the two convex portions 13.

  Further, when there are a plurality of die pad bonding wires 50, all the wires need not be in the same connection form for connection to the one surface 10 a of the die pad 10, and the connection forms according to the above embodiments are mixed. Also good.

  Specifically, for the plurality of die pad bonding wires 50, one connected to the convex portion 13 of the one surface 10a of the die pad 10, one connected to the semiconductor chip 30 side from the convex portion 13, Or what was connected to the peripheral edge part 10c side rather than the convex part 13 may be mixed.

  The die pad bonding wire 50 that connects the semiconductor chip 30 and the one surface 10a of the die pad 10 may be omitted. For example, the semiconductor chip 30 and the one surface 10a of the die pad 10 may be connected by a bump or the like.

  Moreover, the planar shape of the recessed part 12 and the convex part 13 should just be the continuous cyclic | annular shape which surrounds the semiconductor chip 30, and is not limited to an above-described rectangular frame shape. For example, the planar shape of the concave portion 12 and the convex portion 13 may be a circular shape or the like.

  The die pad 10 is made of the same lead frame material as that of the lead 60. However, the die pad 10 is not limited to this, and is a separate member having a different material, thickness, etc. from the lead 60, such as a heat sink. Thus, the die pad 10 may be configured.

  Further, the present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope described in the claims. The above embodiments are not irrelevant to each other, and can be combined as appropriate unless the combination is clearly impossible, and the above embodiments are not limited to the illustrated examples. Absent. In each of the above-described embodiments, it is needless to say that elements constituting the embodiment are not necessarily essential unless explicitly stated as essential and clearly considered essential in principle. Yes. Further, in each of the above embodiments, when numerical values such as the number, numerical value, quantity, range, etc. of the constituent elements of the embodiment are mentioned, it is clearly limited to a specific number when clearly indicated as essential and in principle. The number is not limited to the specific number except for the case. Further, in each of the above embodiments, when referring to the shape, positional relationship, etc. of the component, etc., the shape, unless otherwise specified and in principle limited to a specific shape, positional relationship, etc. It is not limited to the positional relationship or the like.

DESCRIPTION OF SYMBOLS 10 Die pad 10a One side of die pad 10b Other side of die pad 10c Peripheral edge part of die pad 11 Immediately under chip 12 Concave part 13 Convex part 20 Die bonding material 30 Semiconductor chip 50 Bonding wire for die pad

Claims (6)

A plate-like die pad (10) in which the one surface (10a) and the other surface (10b) are in a front-back relationship;
A semiconductor chip (30) mounted on one surface of the die pad via a die bond material (20);
A mold resin (40) for sealing one side of the die pad together with the semiconductor chip,
Of the other surface of the die pad, at least the chip directly under the semiconductor chip (11) is a mold package exposed from the mold resin,
A concave portion (12) having a step between the lower portion of the die pad and the outer peripheral end portion (10c) of the die pad so as to surround the entire periphery of the lower portion of the die pad. Is provided in a ring shape,
Of the other surface of the die pad, the portion on the inner peripheral side of the recess is exposed from the mold resin,
The mold package characterized in that a portion of the one surface of the die pad that is located immediately above the concave portion is an annular convex portion (13) having a convex shape inheriting the concave shape of the concave portion. A bonding wire (50) for connecting one surface of the die pad and the semiconductor chip;
The mold resin seals one side of the die pad together with the semiconductor chip and the bonding wire,
The mold package according to claim 1, wherein the bonding wire is connected to the convex portion on one surface of the die pad. A bonding wire (50) for connecting one surface of the die pad and the semiconductor chip;
The mold resin seals one side of the die pad together with the semiconductor chip and the bonding wire,
Two sets of the concave and convex portions (14), which are sets of the concave portions and the convex portions corresponding to the concave portions, are provided, and two sets of the concave and convex portions are arranged near the semiconductor chip and the outer peripheral end of the die pad in the die pad. Are placed apart to form a heavy ring,
The mold package according to claim 1, wherein the bonding wire is connected to a portion between the two sets of uneven portions on one surface of the die pad. A bonding wire (50) for connecting one surface of the die pad and the semiconductor chip;
The mold resin seals one side of the die pad together with the semiconductor chip and the bonding wire,
The mold package according to claim 1, wherein the bonding wire is connected to a portion closer to the semiconductor chip than the convex portion on one surface of the die pad. A bonding wire (50) for connecting one surface of the die pad and the semiconductor chip;
The mold resin seals one side of the die pad together with the semiconductor chip and the bonding wire,
2. The mold package according to claim 1, wherein the bonding wire is connected to a portion closer to an outer peripheral end portion of the die pad than the convex portion on one surface of the die pad.   6. The mold package according to claim 2, wherein the bonding wire is a wire for GND of the semiconductor chip.

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