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JP2016180601A - Humidity detection unit - Google Patents

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JP2016180601A
JP2016180601A JP2015059576A JP2015059576A JP2016180601A JP 2016180601 A JP2016180601 A JP 2016180601A JP 2015059576 A JP2015059576 A JP 2015059576A JP 2015059576 A JP2015059576 A JP 2015059576A JP 2016180601 A JP2016180601 A JP 2016180601A
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case
substrate
humidity sensor
detection unit
hole
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JP6539466B2 (en
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英紀 牛膓
Hidenori Gocho
英紀 牛膓
柳 修二
Shuji Yanagi
修二 柳
淳 遁所
Atsushi Tondokoro
淳 遁所
田中 健一
Kenichi Tanaka
健一 田中
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a humidity detection unit that has a humidity sensor installable in a situation in which foreign substances are not easily attached.SOLUTION: A humidity sensor 5 is equipped to a first surface 2a of a substrate 2. On the first surface 2a, a case 10 is provided to cover the humidity sensor 5 and a leg part 11 extending downward from a side plate of the case 10 is interposed in the inside of a through-hole 3 penetrating the substrate 2. Between the through-hole 3 and the leg part 11, a ventilation path 4 is formed leading to the inside of the case 10. Further, the spaces between the side plates of the case 10 and the first surface 2a of the substrate 2 are sealed with a resin material 13.SELECTED DRAWING: Figure 3

Description

本発明は基板に湿度センサが実装された湿度検知ユニットに関する。   The present invention relates to a humidity detection unit in which a humidity sensor is mounted on a substrate.

湿度センサは、空気調整装置や冷蔵庫など各種電気製品や電子製品に使用されている。
特許文献1に記載されているように、湿度センサは、電極間に水分を吸収し放出する感湿性高分子が配置されている。感湿性高分子は保持している水分に応じて誘電率が変化するものであり、電極間の静電容量を測定することでこの湿度センサが晒されている外気の湿度が計測される。
Humidity sensors are used in various electrical and electronic products such as air conditioners and refrigerators.
As described in Patent Document 1, in the humidity sensor, a moisture-sensitive polymer that absorbs and releases moisture is disposed between the electrodes. The moisture-sensitive polymer has a dielectric constant that changes depending on the moisture held, and the humidity of the outside air to which the humidity sensor is exposed is measured by measuring the capacitance between the electrodes.

湿度センサは、外気に晒される必要があるため、特許文献1では、導電ワイヤーやICなどは樹脂で覆われているが、センサチップは外気に露出させた構造を採用している。   Since the humidity sensor needs to be exposed to the outside air, in Patent Document 1, the conductive wires, ICs, and the like are covered with resin, but the sensor chip adopts a structure exposed to the outside air.

特許文献2には、ガスセンサに関する発明が記載されている。このガスセンサは、多層基板で構成された配線基板の凹部内にガス検出素子が収納されている。前記配線基板とガス検出素子が保護カバーで覆われ、この保護カバーに複数の通気孔が形成されている。   Patent Document 2 describes an invention related to a gas sensor. In this gas sensor, a gas detection element is housed in a concave portion of a wiring board formed of a multilayer board. The wiring board and the gas detection element are covered with a protective cover, and a plurality of vent holes are formed in the protective cover.

国際公開 WO2010/113712 A1International publication WO2010 / 113712 A1 特開2012−2721号公報JP 2012-2721 A

湿度センサでは、保持される水分の量に応じて誘電率が変化する感湿性高分子を使用しているが、この感湿性高分子は異物が付着すると誘電率に影響を及ぼす課題がある。例えば異物として油脂などの有機物が付着すると、保持されている水分とは無関係に誘電率を変化させてしまい、しかも一度付着した有機物は容易に離脱しないため、湿度の測定値に常に誤差を含ませることになる。   The humidity sensor uses a moisture-sensitive polymer whose dielectric constant changes depending on the amount of moisture to be held, but this moisture-sensitive polymer has a problem of affecting the dielectric constant when foreign matter adheres. For example, if an organic substance such as oil or fat adheres as a foreign substance, the dielectric constant changes regardless of the retained moisture, and once attached organic substance does not easily leave, an error is always included in the measured humidity value. It will be.

特許文献1に記載された湿度センサはセンサチップが常に外気に晒されているため、感湿性高分子に有機物などの異物が付着する可能性が非常に高い。   In the humidity sensor described in Patent Document 1, since the sensor chip is always exposed to the outside air, there is a very high possibility that foreign substances such as organic substances adhere to the moisture-sensitive polymer.

また、前記湿度センサのセンサチップを特許文献2に記載されたガス検出素子に置き換えて、湿度センサのセンサチップを保護カバーで覆うことも考えられる。しかしながら、特許文献2に示す保護カバーでは貫通孔から入り込んだ異物が直接にセンサチップに触れる可能性が高い。   It is also conceivable that the sensor chip of the humidity sensor is replaced with a gas detection element described in Patent Document 2 and the sensor chip of the humidity sensor is covered with a protective cover. However, in the protective cover shown in Patent Document 2, there is a high possibility that foreign matter entering from the through hole directly touches the sensor chip.

本発明は上記従来の課題を解決するものであり、湿度センサを異物が付着しにくい状態で実装できるようにした湿度検知ユニットを提供することを目的としている。   The present invention solves the above-described conventional problems, and an object of the present invention is to provide a humidity detection unit that can mount a humidity sensor in a state in which foreign matter hardly adheres.

本発明は、基板の一方の表面に湿度センサが実装されている湿度検知ユニットにおいて、
前記基板に貫通穴が形成されており、
前記基板の前記表面に前記湿度センサを覆うケースが装着されて、前記ケースに設けられた脚部が前記貫通穴に挿入され、前記ケースの側板部の少なくとも一部と前記基板の前記表面との隙間が樹脂材料で塞がれており、
前記貫通穴と前記脚部との間に、外気を前記ケース内に流入する通気路が形成されていることを特徴とするものである。
The present invention provides a humidity detection unit in which a humidity sensor is mounted on one surface of a substrate.
A through hole is formed in the substrate;
A case that covers the humidity sensor is attached to the surface of the substrate, a leg portion provided in the case is inserted into the through hole, and at least a part of a side plate portion of the case and the surface of the substrate The gap is closed with resin material,
An air passage for allowing outside air to flow into the case is formed between the through hole and the leg portion.

本発明の湿度検知ユニットは、前記貫通穴は外側内壁と内側内壁を有し、前記脚部が前記外側内壁に当接しており、前記内側内壁と前記脚部との間に、前記ケースの内部に通じる前記通気路が形成されているものが好ましい。   In the humidity detection unit of the present invention, the through hole has an outer inner wall and an inner inner wall, the leg portion is in contact with the outer inner wall, and the interior of the case is between the inner inner wall and the leg portion. It is preferable that the air passage that leads to is formed.

この場合に、前記脚部は、前記貫通穴に挿入されるときに弾性変形して前記外側内壁に押し付けられているものが好ましい。   In this case, it is preferable that the leg portion is elastically deformed and pressed against the outer inner wall when inserted into the through hole.

本発明の湿度検知ユニットは、前記基板の前記表面では、前記ケースで覆われていない領域に電子素子が実装されており、前記電子素子が樹脂材料で覆われているものとして構成できる。   The humidity detection unit of the present invention can be configured such that an electronic element is mounted in a region not covered with the case on the surface of the substrate, and the electronic element is covered with a resin material.

本発明の湿度検知ユニットは、基板の一方の表面に湿度センサが実装されると共にこの湿度センサがケースで覆われ、ケースの脚部が基板の貫通穴に装着されている。そのため、基板の前記表面側からケースの内部に異物が直接に入りにくくなっている。また、貫通穴の内部に通気路が形成されているため、外気は基板の他方の表面側から前記通気路を通じて湿度センサに与えられる。前記通気路は基板の厚さ寸法分だけ流入距離を有しているため、湿度検知ユニットを手で保持されたときなどに、指に付着している油脂などの有機物が湿度センサに届きにくくなる。そのため、湿度センサの検知精度を常に高く維持することが可能になる。   In the humidity detection unit of the present invention, a humidity sensor is mounted on one surface of a substrate, and the humidity sensor is covered with a case, and a leg portion of the case is mounted in a through hole of the substrate. Therefore, it is difficult for foreign matter to enter directly into the case from the surface side of the substrate. Further, since the air passage is formed inside the through hole, the outside air is given to the humidity sensor from the other surface side of the substrate through the air passage. Since the air passage has an inflow distance corresponding to the thickness dimension of the substrate, when the humidity detection unit is held by hand, it is difficult for organic substances such as oil and fat adhering to the finger to reach the humidity sensor. . For this reason, the detection accuracy of the humidity sensor can always be kept high.

本発明の実施の形態の湿度検知ユニットの全体構造を示す斜視図、The perspective view which shows the whole structure of the humidity detection unit of embodiment of this invention, 図1に示す湿度検知ユニットの分解斜視図、1 is an exploded perspective view of the humidity detection unit shown in FIG. 図1に示す湿度検知ユニットをIII−III線で切断した断面図、Sectional drawing which cut | disconnected the humidity detection unit shown in FIG. 1 by the III-III line | wire, 図3の一部を拡大した拡大断面図、FIG. 3 is an enlarged cross-sectional view of a part of FIG.

図1ないし図4に示すように、本発明の実施の形態の湿度検知ユニット1は、基板2を有している。基板2はガラスエポキシ基板であり、各図において上に向けられている第1の表面2aと、これとは逆に下に向けられている第2の表面2bを有している。第1の表面2aには、銅箔により配線パターンが形成されている。以下で説明する湿度センサ5や各種電子素子は、配線パターン上に接続されており、湿度センサ5と各種電子素子ならびに配線パターンとで電子回路が構成されている。   As shown in FIGS. 1 to 4, the humidity detection unit 1 according to the embodiment of the present invention has a substrate 2. The substrate 2 is a glass epoxy substrate, and has a first surface 2a facing upward in each figure and a second surface 2b facing downward in the opposite direction. A wiring pattern is formed of copper foil on the first surface 2a. The humidity sensor 5 and various electronic elements described below are connected on a wiring pattern, and an electronic circuit is configured by the humidity sensor 5, various electronic elements, and the wiring pattern.

図2と図3に示すように、基板2の第1の表面2aに湿度センサ5が実装されている。湿度センサ5は湿度センサチップであり、小基板の表面に設けられた対を成す電極と、この電極間に挟まれた感湿性高分子を有している。   As shown in FIGS. 2 and 3, a humidity sensor 5 is mounted on the first surface 2 a of the substrate 2. The humidity sensor 5 is a humidity sensor chip, and has a pair of electrodes provided on the surface of a small substrate and a moisture sensitive polymer sandwiched between the electrodes.

対を成す電極は、小基板の表面の面に沿う方向に間隔を空けて配置されて、前記表面において電極と電極の間の感湿性高分子が配置されている。あるいは、小基板の表面と垂直な方向へ、電極と感湿性高分子と電極の順に立体的に重ねられて配置されている。   The electrodes forming a pair are arranged at intervals in a direction along the surface of the surface of the small substrate, and the moisture-sensitive polymer between the electrodes is arranged on the surface. Alternatively, the electrode, the moisture-sensitive polymer, and the electrode are three-dimensionally stacked in the direction perpendicular to the surface of the small substrate.

感湿性高分子は外気の湿度に応じて水分を吸収しまた水分を放出する機能を有しており、感湿性高分子は含まれる水分の量によって誘電率が変化する。湿度センサ5では、小基板上で前記感湿性高分子が外気に晒されている。   The moisture-sensitive polymer has a function of absorbing and releasing moisture according to the humidity of the outside air, and the dielectric constant of the moisture-sensitive polymer changes depending on the amount of moisture contained. In the humidity sensor 5, the moisture-sensitive polymer is exposed to the outside air on a small substrate.

湿度センサ5は、小基板の下面に前記電極と電気的に接続されている 複数の端子部が形成されており、それぞれの端子部が、第1の表面2aに形成された配線パターンに半田付けされている。   The humidity sensor 5 has a plurality of terminal portions electrically connected to the electrodes on the lower surface of the small substrate, and each terminal portion is soldered to a wiring pattern formed on the first surface 2a. Has been.

基板2の第1の表面2aには、湿度センサ5と並んで、IC素子などの電子素子6a,6bが実装されている。この電子素子6a,6bの端子部も、第1の表面2aに形成された配線パターンに半田付けされている。   Electronic elements 6 a and 6 b such as IC elements are mounted on the first surface 2 a of the substrate 2 along with the humidity sensor 5. The terminal portions of the electronic elements 6a and 6b are also soldered to the wiring pattern formed on the first surface 2a.

第1の表面には、湿度センサ5と電子素子6a,6bを覆うケース10が装着される。ケース10は合成樹脂で形成されまたは金属板で形成される。実施の形態のケース10は合成樹脂製である。ケース10は、下方が開口した立方体であり、天井板部10aと4つの側板部10b,10c,10d,10eを有している。   A case 10 covering the humidity sensor 5 and the electronic elements 6a and 6b is mounted on the first surface. Case 10 is formed of a synthetic resin or a metal plate. The case 10 of the embodiment is made of synthetic resin. The case 10 is a cube that is open at the bottom, and has a ceiling plate portion 10a and four side plate portions 10b, 10c, 10d, and 10e.

ケース10の対向する2つの側板部10bと10cには、ケースの裾部12から下向きに突出する脚部11が一体に形成されている。脚部11の下端部には、ケース10の外側方向へ突出する掛止爪11aが一体に形成されている。   The two side plate portions 10b and 10c facing the case 10 are integrally formed with a leg portion 11 projecting downward from the skirt portion 12 of the case. A latching claw 11 a that protrudes outward from the case 10 is integrally formed at the lower end of the leg 11.

図2と図3に示すように、基板2には一対の貫通穴3,3が形成されている。貫通穴3,3は、湿度センサ5と電子素子6a,6bが実装されている領域を挟む位置に形成されている。 図2に示すように、それぞれの貫通穴3,3の開口形状は矩形(長方形)である。   As shown in FIGS. 2 and 3, the substrate 2 is formed with a pair of through holes 3 and 3. The through holes 3 and 3 are formed at positions sandwiching a region where the humidity sensor 5 and the electronic elements 6a and 6b are mounted. As shown in FIG. 2, the opening shape of each through-hole 3 and 3 is a rectangle (rectangle).

図3と図4に示すように、それぞれの貫通穴3は、ケース10の外面側に位置する外側内壁3aと、ケース10の内側に位置する内側内壁3bとを有している。   As shown in FIGS. 3 and 4, each through hole 3 has an outer inner wall 3 a located on the outer surface side of the case 10 and an inner inner wall 3 b located on the inner side of the case 10.

ケース10は、湿度センサ5と電子素子6a,6bを覆うようにして基板2の第1の表面2aに装着される。このとき、一対の脚部11,11が基板2に形成された貫通穴3,3の内部に挿入される。脚部11は弾性を有しており、互いの間隔を狭めるように外力を与えた状態で貫通穴3に挿入される。よって、貫通穴3に挿入された後の脚部11には、貫通穴3の外側内壁3aに向く弾性力Eが与えられ、脚部11が外側内壁3aに加圧された状態で、脚部11の下端部の掛止爪11aが、基板2の第2の表面2bに掛止される。   The case 10 is attached to the first surface 2a of the substrate 2 so as to cover the humidity sensor 5 and the electronic elements 6a and 6b. At this time, the pair of leg portions 11 and 11 are inserted into the through holes 3 and 3 formed in the substrate 2. The legs 11 have elasticity and are inserted into the through holes 3 with an external force applied so as to narrow the interval between them. Therefore, the leg 11 after being inserted into the through hole 3 is given an elastic force E toward the outer inner wall 3a of the through hole 3, and the leg 11 is pressed against the outer inner wall 3a. A latching claw 11 a at the lower end of 11 is latched on the second surface 2 b of the substrate 2.

図4に拡大して示すように、脚部11が外側内壁3aに加圧されている結果、貫通穴3の内側内壁3bと脚部11との間に通気路4が形成される。この通気路4は、脚部11の内面側に開口しているため、基板2の第2の表面2b側の外気Aが、通気路4を通って、ケース10の内部空間に導かれて、湿度センサ5に与えられる。   As shown in an enlarged view in FIG. 4, as a result of the leg 11 being pressed against the outer inner wall 3 a, an air passage 4 is formed between the inner inner wall 3 b of the through hole 3 and the leg 11. Since the air passage 4 is open on the inner surface side of the leg 11, the outside air A on the second surface 2b side of the substrate 2 is guided to the internal space of the case 10 through the air passage 4, It is given to the humidity sensor 5.

図4に示すように、ケース10の裾部12と基板2の第1の表面2aとの間に隙間δ2が形成される部分があるが、この隙間δ2に対し、前記通気路4の幅寸法δ1の方が広く形成されている。図1と図3および図4に示すように、第1の基板2の第1の表面2aでは、ケース10の側板部10b,10c,10d,10dの下端部と第1の表面2aとの間に樹脂材料13が供給されて、前記裾部12と第1の表面2aとの間の前記隙間δ2が塞がれている。   As shown in FIG. 4, there is a portion where a gap δ <b> 2 is formed between the skirt 12 of the case 10 and the first surface 2 a of the substrate 2, and the width dimension of the air passage 4 with respect to the gap δ <b> 2. δ1 is formed wider. As shown in FIGS. 1, 3, and 4, on the first surface 2 a of the first substrate 2, the space between the lower ends of the side plate portions 10 b, 10 c, 10 d, and 10 d of the case 10 and the first surface 2 a is obtained. The resin material 13 is supplied to the gap δ2 between the skirt portion 12 and the first surface 2a.

前記樹脂材料13は耐湿性すなわち耐水性を有する樹脂が好ましく、ポリイミド系やエポキシ系樹脂で構成される。前記樹脂材料13が塗布されることによって、ケース10の裾部12と第1の表面2aとの隙間δ2を封止でき、第1の表面2a側からケース10の内部に異物などが混入しにくくなる。   The resin material 13 is preferably a resin having moisture resistance, that is, water resistance, and is composed of a polyimide resin or an epoxy resin. By applying the resin material 13, the gap δ <b> 2 between the skirt portion 12 of the case 10 and the first surface 2 a can be sealed, and foreign matter or the like is not easily mixed into the case 10 from the first surface 2 a side. Become.

前記樹脂材料13は、側板部10b,10c,10d,10eの全域で、ケース10の裾部12の全周を塞ぐことが好ましい。ただし、裾部12と第1の表面2aとの隙間δ2が狭い箇所には塗布せず、樹脂材料13を必要な箇所に部分的に塗布してもよい。   The resin material 13 preferably closes the entire circumference of the skirt portion 12 of the case 10 in the entire region of the side plate portions 10b, 10c, 10d, and 10e. However, the resin material 13 may be partially applied to a necessary portion without being applied to a portion where the gap δ2 between the skirt portion 12 and the first surface 2a is narrow.

図2に示すように、貫通穴3,3が、湿度センサ5と電子素子6a,6bが実装されている領域を挟む位置に形成されているため、貫通穴3,3に脚部11,11が挿入されたときに、脚部11,11を貫通穴3,3の外側内壁3aに付勢する弾性力Eが、一対の脚部11,11どうしを互いに外側内壁3aに向けて押し付ける方向に働くようになり、ケース10をガタつきなく(確実に)基板2に固定することができるとともに、脚部11,11と内側内壁3bとの間に外気をケース10内部に流入する通気路を確実に形成することができる。   As shown in FIG. 2, since the through holes 3 and 3 are formed at positions sandwiching the area where the humidity sensor 5 and the electronic elements 6 a and 6 b are mounted, the leg portions 11 and 11 are formed in the through holes 3 and 3. Is inserted in the direction in which the pair of leg portions 11 and 11 are pressed against each other toward the outer inner wall 3a by the elastic force E that urges the leg portions 11 and 11 toward the outer inner wall 3a of the through holes 3 and 3. The case 10 can be fixed to the board 2 without rattling (reliably), and an air passage through which outside air flows into the case 10 between the legs 11 and 11 and the inner inner wall 3b is ensured. Can be formed.

図1と図2に示すように、基板2の第1の表面2aには、ケース10の外側にも電子素子21が実装されている。電子素子21は、抵抗器やコンデンサなどのチップ電子部品またはIC素子などである。これら電子素子21は、第1の表面2aに形成された配線パターンに接続されている。これら電子素子21は樹脂材料23で覆われているが、この樹脂材料23は、前記樹脂材料13と同じ材料で形成されている。   As shown in FIGS. 1 and 2, an electronic element 21 is mounted on the first surface 2 a of the substrate 2 on the outside of the case 10. The electronic element 21 is a chip electronic component such as a resistor or a capacitor or an IC element. These electronic elements 21 are connected to a wiring pattern formed on the first surface 2a. These electronic elements 21 are covered with a resin material 23, which is formed of the same material as the resin material 13.

基板2の第1の表面2aにはコネクタ部25が形成されて、各配線パターンがこのコネクタ部25に接続されている。また、基板2に必要に応じて取付け穴26が開口している。   A connector portion 25 is formed on the first surface 2 a of the substrate 2, and each wiring pattern is connected to the connector portion 25. A mounting hole 26 is opened in the substrate 2 as necessary.

前記湿度検知ユニット1は、各種電気製品や電子機器の内部に収納され、取付け穴26などを利用して基板2が製品内部に固定される。   The humidity detection unit 1 is housed inside various electric products and electronic devices, and the substrate 2 is fixed inside the product using mounting holes 26 and the like.

湿度検知ユニット1は湿度を測定しようとする外気が触れる場所に設置される。外気Aは基板2の第1の表面2aからケース10の内部に入り込むことはほとんどなく、図4に示すように、基板2の第2の表面2b側から、基板2を貫通する貫通穴3の内部の通気路4を経て、ケース10の内部に浸入する。ケース10から延びる脚部11は弾性力Eによって貫通穴3の外側内壁3aに押し付けられているため、内側内壁3bと脚部11との間に、ケース10の内部に通じる通気路4を確実に開口させることができる。   The humidity detection unit 1 is installed in a place where the outside air where humidity is to be measured is touched. The outside air A hardly enters the inside of the case 10 from the first surface 2a of the substrate 2, and the through hole 3 penetrating the substrate 2 from the second surface 2b side of the substrate 2 as shown in FIG. It enters the inside of the case 10 through the internal ventilation path 4. Since the leg portion 11 extending from the case 10 is pressed against the outer inner wall 3 a of the through hole 3 by the elastic force E, the air passage 4 leading to the inside of the case 10 is surely provided between the inner inner wall 3 b and the leg portion 11. It can be opened.

ただし、通気路4は基板2の厚さ分だけの経路長を有しており、第2の表面2b側の外気がこの通気路4の内部を通過してからケース10の内部に至るため、油脂やその他の有機物などの異物が、第2の表面2b側から湿度センサ5に届きにくい。一方で、基板2の第1の表面2aの至った異物は、樹脂材料13で阻止されてケース10の内部に入りにくくなる。   However, the ventilation path 4 has a path length corresponding to the thickness of the substrate 2, and the outside air on the second surface 2 b side passes through the inside of the ventilation path 4 and then reaches the inside of the case 10. Foreign matter such as fats and oils and other organic substances is difficult to reach the humidity sensor 5 from the second surface 2b side. On the other hand, the foreign matter reaching the first surface 2 a of the substrate 2 is blocked by the resin material 13 and is difficult to enter the case 10.

そのため、湿度センサ5に設けられた感湿性高分子に異物が付着する可能性を低くでき、湿度センサ5の検知精度を高く維持することが可能になる。   Therefore, it is possible to reduce the possibility of foreign matter adhering to the moisture-sensitive polymer provided in the humidity sensor 5 and to maintain high detection accuracy of the humidity sensor 5.

1 湿度検知ユニット
2 基板
2a 第1の表面
2b 第2の表面
3 貫通穴
3a 外側内壁
3b 内側内壁
4 通気路
5 湿度センサ
6a,6b,21 電子素子
10 ケース
10b,10c,10d,10e 側板部
11 脚部
11a 掛止爪
12 裾部
13,23 樹脂材料
DESCRIPTION OF SYMBOLS 1 Humidity detection unit 2 Board | substrate 2a 1st surface 2b 2nd surface 3 Through-hole 3a Outer inner wall 3b Inner inner wall 4 Air passage 5 Humidity sensor 6a, 6b, 21 Electronic element 10 Case 10b, 10c, 10d, 10e Side plate part 11 Leg part 11a Hanging claw 12 Bottom part 13, 23 Resin material

Claims (4)

基板の一方の表面に湿度センサが実装されている湿度検知ユニットにおいて、
前記基板に貫通穴が形成されており、
前記基板の前記表面に前記湿度センサを覆うケースが装着されて、前記ケースに設けられた脚部が前記貫通穴に挿入され、前記ケースの側板部の少なくとも一部と前記基板の前記表面との隙間が樹脂材料で塞がれており、
前記貫通穴と前記脚部との間に、外気を前記ケース内に流入する通気路が形成されていることを特徴とする湿度検知ユニット。
In the humidity detection unit where the humidity sensor is mounted on one surface of the board,
A through hole is formed in the substrate;
A case that covers the humidity sensor is attached to the surface of the substrate, a leg portion provided in the case is inserted into the through hole, and at least a part of a side plate portion of the case and the surface of the substrate The gap is closed with resin material,
A humidity detection unit, wherein an air passage through which outside air flows into the case is formed between the through hole and the leg.
前記貫通穴は外側内壁と内側内壁を有し、前記脚部が前記外側内壁に当接しており、前記内側内壁と前記脚部との間に、前記ケースの内部に通じる前記通気路が形成されている請求項1記載の湿度検知ユニット。   The through hole has an outer inner wall and an inner inner wall, the leg portion is in contact with the outer inner wall, and the air passage leading to the inside of the case is formed between the inner inner wall and the leg portion. The humidity detection unit according to claim 1. 前記脚部は、前記貫通穴に挿入されるときに弾性変形して前記外側内壁に押し付けられている請求項2記載の湿度検知ユニット。   The humidity detection unit according to claim 2, wherein the leg portion is elastically deformed and pressed against the outer inner wall when inserted into the through hole. 前記基板の前記表面では、前記ケースで覆われていない領域に電子素子が実装されており、前記電子素子が樹脂材料で覆われている請求項1ないし3のいずれかに記載の湿度検知ユニット。   The humidity detection unit according to any one of claims 1 to 3, wherein an electronic element is mounted on a surface of the substrate that is not covered with the case, and the electronic element is covered with a resin material.
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