JP2006010547A - Humidity sensor module and humidity sensor mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To collectively and easily mount a humidity sensor on a circuit board with other parts. <P>SOLUTION: This humidity sensor mounting structure has both the humidity sensor having a sensing part 70 on the side of one surface 11 of a substrate 10 and a circuit board 400 electrically connected to the humidity sensor 100. A substrate through hole 440 passing through in the thickness direction of the substrate is formed in the circuit board 400. The humidity sensor 100 is mounted on the circuit board 400 in such a way as to oppose the one surface 11 of the substrate 10 to the circuit board 400 and cover the substrate through hole 440. In the humidity sensor 100, a sensing part 70 faces the substrate through hole 440, and the substrate 10 is electrically connected to the circuit board 400 via an electrically conductive juncture member 410 in the periphery of the substrate through hole 440. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a humidity sensor module in which a humidity sensor is integrated in a case, and a humidity sensor mounting structure in which the humidity sensor is mounted on a circuit board.

  Conventionally, as this type of humidity sensor, there is generally known a sensor composed of a substrate such as a semiconductor or ceramic, and having a sensing unit made of an electrode, a moisture sensitive film, etc. on one side of the substrate. Yes.

  Such a humidity sensor is incorporated, for example, in an auto air conditioner system of an automobile and is applied as a sensor for detecting humidity in the vehicle interior. In this case, for example, the windshield can be prevented from fogging by adjusting the air blowing state based on the detected humidity in the vehicle interior.

  This humidity sensor is usually used by being mounted on a circuit board. An output signal from the humidity sensor is appropriately processed by the circuit board, and control in the integrated system is performed based on the processed signal.

  On the other hand, conventionally, a configuration in which a humidity sensor can be connected to the outside has been proposed as a configuration in which a lead wire is connected to the humidity sensor, for example, a connector having a lead wire and a module in which the humidity sensor is integrated with a case (patent) Reference 1).

However, when trying to mount a sensor module incorporating such a lead wire on a circuit board, in fact, a lead wire insertion hole is provided in the circuit board, a long lead wire is bent and mounted, It is necessary to mount another wiring member after connecting it to the wire.
JP 2002-267626 A

  By the way, in recent years, surface mount components (SMD, Surface Mounted Devices) have become mainstream in mounting components on a circuit board, and humidity sensors are simultaneously used with other electronic components such as resistors and capacitors. It is desired that the battery can be mounted and connected by a conductive bonding member such as solder or a conductive adhesive.

  However, the conventional humidity sensor module with a lead wire is mounted on the circuit board through the above-described labor, and thus it is difficult to perform surface mounting and handling is also inconvenient.

  In view of the above problems, an object of the present invention is to easily mount a humidity sensor together with other components when mounting a humidity sensor on a circuit board.

  In order to achieve the above object, according to the first aspect of the present invention, a humidity sensor (100) having a substrate (10) provided with a sensing portion (70) on one surface (11) side can be externally connected. The humidity sensor (100) has a case (200) with the inner surface of the case (200) and the one surface (11) of the substrate (10) facing each other. ) And electrically connected to the terminal (210) in the case (200), and the portion facing the sensing unit (70) in the case (200) is located inside and outside the case (200). A humidity sensor module is provided, characterized in that a through hole (230) is provided to communicate with the humidity sensor module.

  According to this, since the externally connectable terminal (210) is provided on the surface of the case (200) and the humidity sensor (100) is housed in the case (200), the case (200) is connected to the circuit. The humidity sensor module (300) can be connected to the terminal (210) by the conductive bonding member (410) simply by mounting it on the substrate (400) via the conductive bonding member (410) such as solder. It becomes possible. That is, this humidity sensor module (300) can be configured as a surface-mounted component.

  In the present invention, the inner surface of the case (200) and the one surface (11) of the substrate (10) provided with the sensing unit (70) in the humidity sensor (100) are opposed to each other in the case (200). A through hole (230) is provided in a portion facing the sensing unit (70).

  Therefore, the sensing unit (70) faces the external measurement environment from the through hole (230), and appropriate humidity detection by the humidity sensor (100) becomes possible.

  As described above, according to the humidity sensor module (300) of the present invention, when the humidity sensor (100) is mounted on the circuit board (400), it is easily mounted together with the other components (420, 430). Can do.

  Here, in the invention according to claim 2, in the humidity sensor module according to claim 1, the terminal (210) is integrated by being insert-molded into the case (200). It is said.

  According to a third aspect of the present invention, in the humidity sensor module according to the first or second aspect, the humidity sensor (100) includes a moisture sensitive film (20), and the moisture sensitive film (20) is provided. It is a capacitance type that detects humidity based on a change in capacitance between sandwiched electrodes (41, 42).

  In a fourth aspect of the present invention, a humidity sensor module (100) having a substrate (10) provided with a sensing portion (70) on one side (11) is incorporated in a case (200). 300), and the humidity sensor (100) mounting structure in which the humidity sensor module (300) is mounted on the circuit board (400) has the following characteristics.

  That is, in this mounting structure, the case (200) has an externally connectable terminal (210) on the surface, and the humidity sensor (100) has the inner surface of the case (200) and one surface of the substrate (10). (11) is stored in the case (200) in a state of being opposed to each other, and is electrically connected to the terminal (210) in the case (200), and the sensing unit (70) in the case (200) A through hole (230) that communicates the inside and the outside of the case (200) is provided in a portion that is opposed to the terminal (210). The terminal (210) and the circuit board (400) of the case (200) are connected to the conductive bonding member ( 410).

  This invention provides the mounting structure formed by mounting the humidity sensor module (300) of Claim 1 on a circuit board (400), The effect is the said Claim 1. It is the same as the invention.

  That is, according to the mounting structure of the humidity sensor of the present invention, when mounting the humidity sensor (100) on the circuit board (400), it can be easily mounted together with the other components (420, 430).

  Here, in the invention according to claim 5, in the humidity sensor mounting structure according to claim 4, the through hole (230) in the case (200) faces the circuit board (400) in the case (200). It is characterized in that it is provided at the site to be.

  According to this, when the humidity sensor module (300) is mounted on the circuit board (400) via the conductive bonding member (410) such as solder or conductive adhesive, the through hole ( 230) is directed downward, so that contamination of the humidity sensor (100) by solder flux or the like can be suppressed as much as possible.

  Furthermore, in the invention according to claim 6, in the humidity sensor mounting structure according to claim 5, the portion of the circuit board (400) facing the through hole (230) in the case (200) has a substrate thickness. A board through hole (440) penetrating in the vertical direction is provided.

  As in the present invention, when the through hole (230) in the case (200) is provided in a portion of the case (200) facing the circuit board (400), the circuit board (400) has a board through hole (440). If this is provided, an external humidity atmosphere can be easily introduced from the substrate through hole (440) through the through hole (230) in the case (200) to the sensing unit (70) of the humidity sensor (100). .

  In the invention according to claim 7, in the humidity sensor mounting structure according to claims 4 to 6, the terminal (210) is integrated by insert molding in the case (200). It is characterized by being.

  According to an eighth aspect of the present invention, in the humidity sensor mounting structure according to the fourth to seventh aspects, the humidity sensor (100) includes a moisture sensitive film (20), and the moisture sensitive film (20 ) Between the electrodes (41, 42) between which the humidity is detected based on a capacitance change.

  According to the ninth aspect of the present invention, a humidity sensor (100) having a sensing portion (70) on one surface (11) side of the substrate (10), and a circuit electrically connected to the humidity sensor (100). A substrate through-hole (440) penetrating in the thickness direction of the substrate is formed in the circuit board (400), and the humidity sensor (100) is provided on one surface (11) of the substrate (10). It is mounted on the circuit board (400) so as to cover the board through hole (440) while facing the circuit board (400). In the humidity sensor (100), the sensing unit (70) is mounted on the board through hole (440). ), And the board (10) and the circuit board (400) are electrically connected via the conductive bonding member (410) around the board through hole (440). Providing mounting structure of humidity sensor It is.

  In the present invention, since the humidity sensor (100) is directly connected to the circuit board (400) via the conductive bonding member (410), the mounting process can be made very simple. .

  Further, in the present invention, since the substrate through hole (440) is provided in the portion of the circuit board (400) facing the sensing portion (70) of the humidity sensor (100), the substrate through hole (440) is provided. An external humidity atmosphere is introduced into the sensing unit (70) of the humidity sensor (100), and humidity can be detected.

  Therefore, according to the humidity sensor mounting structure of the present invention, when mounting the humidity sensor (100) on the circuit board (400), it can be easily mounted together with other components (420, 430).

  According to a tenth aspect of the present invention, in the humidity sensor mounting structure according to the ninth aspect, the humidity sensor (100) includes a moisture sensitive film (20), and electrodes sandwiching the moisture sensitive film (20). It is a capacity type that detects humidity based on a change in capacity between (41, 42).

  In addition, the code | symbol in the bracket | parenthesis of each said means is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a schematic cross-sectional view showing a mounting structure of a humidity sensor 100 according to a first embodiment of the present invention on a circuit board 400. As shown in FIG. 2 is a schematic plan view of the humidity sensor 100 as viewed from one surface 11 of the substrate 10, and FIG. 3 is a schematic cross-sectional view taken along the line AA in FIG. In addition, the hatching in FIG. 2 is for identification, and does not show a cross section.

  The humidity sensor 100 of the present embodiment is, for example, a sensor that is used for humidity control of an auto air conditioner and detects indoor humidity, and other applications such as detecting outdoor humidity for weather observation, for example. Provided.

  In the mounting structure of the present embodiment, the humidity sensor 100 having the substrate 10 provided with the sensing unit 60 on the one surface 11 side is incorporated in the case 200 to form the humidity sensor module 300, and the humidity sensor module 300 is used as the circuit board 400. It is the mounting structure of the humidity sensor 100 mounted on top.

  Case 200 is formed by molding a resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate). As shown in FIG. 1, a terminal 210 that can be externally connected is provided on the surface of the case 200.

  The terminal 210 is made of a conductive metal such as brass or 42 alloy. In this embodiment, the terminal 210 is integrated with the case 200 by being insert-molded into the case 200.

  Further, as shown in FIG. 1, the terminal 210 has an intermediate portion embedded in the case 200, one end side exposed to the outer surface of the case 200, that is, the other end side exposed to the inner surface of the case 200. Yes.

  Further, a cover 220 formed of the same resin as that of the case 200 is attached to the upper end opening of the case 200 by means such as adhesion, welding, or screw tightening, and the upper end opening is covered with the cover 220 and shielded. Has been.

  As shown in FIG. 1, the humidity sensor 100 is housed in the case 200 with the inner surface of the case 200 and the one surface 11 of the substrate 10 facing each other.

  The humidity sensor 100 is electrically connected to the terminal 210 in the case 200. Specifically, the exposed portion of the terminal 210 exposed on the inner surface of the case 200 and the humidity sensor 100 are electrically connected.

  Further, as shown in FIG. 1, a through hole 230 that communicates the inside and outside of the case 200 is provided in a portion of the case 200 that faces the sensing unit 60. The sensing unit 60 of the humidity sensor 100 faces the outside of the case 200 through the through hole 230.

  As described above, the humidity sensor module 300 of the present embodiment includes the humidity sensor 100 having the substrate 10 provided with the sensing unit 60 on the one surface 11 side, and the case 200 having the externally connectable terminal 210 on the surface. The humidity sensor 100 is housed in the case 200 with the inner surface of the case 100 and the one surface 11 of the substrate 10 facing each other, and is electrically connected to the terminal 210 in the case 200. A through hole 230 that communicates the inside and outside of the case 200 is provided in a portion of the 200 facing the sensing unit 60.

  As shown in FIG. 1, the humidity sensor module 300 is mounted on a circuit board 400. Specifically, the terminal 210 of the case 200 and the circuit board 400 are electrically connected via a conductive bonding member 410 such as solder, a conductive adhesive, or a silver paste.

  Here, as the circuit board 400, a general circuit board such as a printed board or a ceramic board can be employed. Further, the circuit board 400 may be a single-layer board or a laminated board.

  On the circuit board 400, other components 420 and 430 such as a resistor 420 and a capacitor 430 are mounted via a conductive bonding member 410 as in the humidity sensor module 300. Thus, the humidity sensor module 300 and other components 420 and 430 are surface-mounted on the circuit board 400.

  In the present embodiment, as illustrated in FIG. 1, the through hole 230 in the case 200 is provided in a portion of the case 200 that faces the circuit board 400. A substrate through hole 440 that penetrates in the thickness direction of the substrate is provided in a portion of the circuit board 400 that faces the through hole 230 in the case 200.

  Next, details of the humidity sensor 100 will be described with reference to FIGS. The humidity sensor 100 includes a substrate 10, and a moisture sensitive film 20 whose capacitance value changes according to humidity is provided on one surface 11 side of the substrate 10.

  The humidity sensor 100 of this example employs an N-type silicon substrate 10 as a semiconductor substrate as the substrate 10, and is configured by forming various films, electrodes, elements, etc. on one surface 11 side of the silicon substrate 10. It is a capacitive type humidity sensor. .

  As shown in FIG. 3, a silicon oxide film (first insulating film) 30 is formed on one surface 11 of the silicon substrate 10, and the silicon oxide film 30 is formed on the same plane. Two sensing electrodes 41 and 42 are formed so as to face each other at a distance.

  The sensing electrodes 41 and 42 are for detecting a change in the capacitance value of the moisture sensitive film 20, and the shape is not particularly limited. However, in this example, the sensing electrodes 41 and 42 have a comb shape, The comb teeth portions of each other mesh and face each other.

  By adopting such a comb-like electrode configuration, the opposing area between the two sensing electrodes 41 and 42 can be increased while minimizing the arrangement area of the electrodes, and the capacitance value between the electrodes can be increased. You can earn.

  Here, as the sensing electrodes 41 and 42, a material mainly composed of Al or an Al alloy (for example, Al-Si in which a small amount of Si (eg, about several percent) is contained in Al) can be employed. In addition, materials that can be used in a normal semiconductor production line, such as Ti, Au, Cu, and Poly-Si, can be used. In this example, both sensing electrodes 41 and 42 are made of Al-Si.

  A silicon nitride film (second insulating film) 50 as a protective film is formed on the two sensing electrodes 41 and 42.

  In this example, the silicon nitride film 50 covers between the sensing electrodes 41 and 42 and the sensing electrodes 41 and 42 (between the comb teeth). Note that the silicon nitride film 50 only needs to cover at least the sensing electrodes 41 and 42, and does not have to exist between the sensing electrodes 41 and 42.

  On the silicon nitride film 50, the moisture sensitive film 20 is formed so as to cover both the sensing electrodes 41, 42 and the both sensing electrodes 41, 42. As this moisture sensitive film | membrane 20, what consists of a hygroscopic polymeric organic material can be employ | adopted, for example, More specifically, polyimide, cellulose butyrate acetate (in this example, polyimide) is used. it can.

  In the moisture sensitive film 20 exposed to the measurement environment through the through hole 230 of the case 200 described above, when water molecules enter the film, the water molecules have a high dielectric constant, so the moisture sensitivity depends on the amount of moisture that has entered. The dielectric constant of the film 20 also changes greatly, and as a result, the capacitance value between the sensing electrodes 41 and 42 also changes.

  Here, on the one surface 11 side of the silicon substrate 10, a region where the moisture sensitive film 20 is disposed is configured as a sensing unit 60 as a moisture sensitive unit.

  Therefore, in the sensing unit 60, the capacitance value between the two sensing electrodes 41 and 42 changes in accordance with the humidity change around the sensor 100, so that the humidity can be detected based on this capacitance value change. .

  Further, in the humidity sensor 10 of the present embodiment, a portion other than the sensing unit 60 on the one surface 11 side of the silicon substrate 10 (in this example, the outer periphery of the sensing unit 60 indicated by the broken line hatching region in FIG. 2) is provided. A circuit element unit 70 is formed for signal processing of a change in capacitance value (signal from the sensing electrode) between the two sensing electrodes 41 and 42 corresponding to a change in ambient humidity.

  The circuit element portion 70 is represented as a C-MOS transistor 71 in the cross-sectional view shown in FIG. Here, a gate electrode 73 made of Poly-Si in the C-MOS transistor 71 is configured as a wiring electrode made of Al that is electrically connected to the source and drain.

  Of course, a circuit element (for example, an element such as a Bi-CMOS transistor) other than the C-MOS transistor 71 may be formed in the circuit element unit 70.

  Similarly to the sensing electrodes 41 and 42, the electrode of the circuit element unit 70 represented by the wiring electrode 73 is also covered with a silicon nitride film 50 as a protective film, and is the same as the sensing electrodes 41 and 42. It can be formed by adopting a material.

  Here, the circuit element unit 70 and the sensing electrodes 41 and 42 are electrically connected to form a switched capacitor circuit, for example, and between the sensing electrodes 41 and 42 that change in accordance with a change in ambient humidity. Humidity can be detected by converting the change in capacitance into a voltage and outputting it.

  In the humidity sensor 100, bumps 80 are provided on the periphery of the silicon substrate 10 on the one surface 11 side of the silicon substrate 10. The bump 80 can be made of solder, Au, Cu or the like, but in this example, a solder bump is adopted.

  As shown in FIG. 3, the bump 80 is electrically connected to the electrode 73 of the circuit element unit 70 through an opening formed in the silicon nitride film 50. That is, the sensing electrodes 41 and 42 and the bumps (connection electrodes) 80 are electrically connected via the electrodes 73 of the circuit element unit 70.

  As described above, the exposed portion of the terminal 210 exposed on the inner surface of the case 200 is electrically connected to the humidity sensor 100 (see FIG. 1). A detailed configuration of the electrical connection between the terminal 210 and the humidity sensor 100 is shown in FIG.

  As shown in FIG. 3, the bump 80 is electrically connected to the terminal 210 of the case 200 by solder connection. In the case of the bump 80 made of Au or the like, the humidity sensor 100 and the terminal 210 may be electrically connected via a solder or a conductive adhesive.

  Here, the manufacturing method of the humidity sensor 100 of this example mentioned above is described with reference to FIG. The humidity sensor 100 of the present example can be manufactured using a commonly used semiconductor process.

  First, a diffusion layer and a thermal oxide film for forming the circuit element unit 70 are formed on the one surface 11 of the silicon substrate 10 by a normal ion implantation and thermal diffusion process. On top of this, Poly-Si electrodes 72, source and drain diffusion layers are formed by a normal ion implantation and thermal diffusion process by CVD or the like. Thus, the circuit element unit 70 is formed.

  Subsequently, a silicon oxide film 30 is formed by a CVD method or the like. Further, a contact hole for establishing electrical connection between the circuit element unit 70 and the wiring electrode 73 of the circuit element unit 70 is formed in the silicon oxide film 30 by etching using a photolithographic method.

  Next, the wiring electrode 73 of the circuit element unit 70 and the two sensing electrodes 41 and 42 for detecting humidity change are formed by sputtering or vapor deposition using Al or the like. A silicon nitride film (protective film) 50 is formed thereon by a plasma CVD method or the like.

  Subsequently, the silicon nitride film 50 located at a portion (pad portion) connecting the wiring electrode 73 and the bump 80 of the circuit element portion 70 is removed by etching using a photolithography method. Then, bumps 80 are formed by plating, vapor deposition, or the like, and the bumps 80 and the wiring electrodes 73 of the circuit element unit 70 are connected.

  Next, the moisture sensitive film 20 is formed on the silicon nitride film 50 by using a method of applying polyimide by spin coating and then curing and photoetching, or a method of applying and curing after printing. To do.

  Thus, according to the above manufacturing method, the humidity sensor 100 shown in FIGS. 2 and 3 can be appropriately completed using a normal semiconductor manufacturing line until the moisture sensitive film 20 is formed. .

  The finished humidity sensor 100 is put into the case 200 from the upper end opening of the case 200 so that the bumps 80 and the terminals 210 exposed on the inner surface of the case 200 are in contact with each other, and heated to bump 80 made of solder. The bumps 80 and the terminals 210 are joined by reflowing.

  Next, the humidity sensor module 300 is completed by attaching the cover 220 to the case 200.

  Then, the humidity sensor module 300 and other components 420 and 430 are mounted on the circuit board 400 via the conductive bonding member 410, and the circuit board 400 is subjected to solder reflow, conductive adhesive curing, or the like. To join. Thus, the mounting structure shown in FIG. 1 is completed.

  By the way, according to the present embodiment, the humidity sensor 100 including the substrate 10 provided with the sensing unit 70 on the surface 11 side and the case 200 having the externally connectable terminal 210 on the surface are provided. 100 is housed in the case 200 with the inner surface of the case 200 and the one surface 11 of the substrate 10 facing each other, and is electrically connected to the terminal 210 in the case 200. A humidity sensor module 300 is provided in which a through hole 230 that communicates the inside and outside of the case 200 is provided in a portion that faces the outside.

  According to this, since the externally connectable terminal 210 is provided on the surface of the case 200 and the humidity sensor 100 is housed in the case 200, the case 200 is electrically connected to the circuit board 400 by a conductive bond such as solder. Only by mounting via the member 410, the terminal 210 of the humidity sensor module 300 can be connected by the conductive bonding member 410. That is, the humidity sensor module 300 can be configured as a surface mount component.

  Further, in the present humidity sensor module 300, the inner surface of the case 200 and the one surface 11 of the substrate 10 provided with the sensing unit 70 in the humidity sensor 100 are opposed to each other at a portion facing the sensing unit 70 in the case 200. A through hole 230 is provided.

  Therefore, the sensing unit 70 enters the external measurement environment from the through hole 230, and appropriate humidity detection by the humidity sensor 100 becomes possible.

  As described above, according to the humidity sensor module 300 of the present embodiment, when the humidity sensor 100 is mounted on the circuit board 400, it can be easily mounted together with the other components 420 and 430.

  Further, in this example, as shown in FIGS. 2 and 3, the humidity sensor 100 includes the moisture sensitive film 20, and the humidity is controlled based on the capacitance change between the electrodes 41 and 42 sandwiching the moisture sensitive film 20. Capacitive type to detect.

  The humidity sensor 100 in the present embodiment may be a resistance type that detects humidity based on a resistance change between the electrodes 41 and 42 sandwiching the moisture sensitive film 20, but is more accurate by using a capacitance type. High humidity detection is possible.

  Further, according to the present embodiment, as shown in FIG. 1, the humidity sensor 100 having the substrate 10 provided with the sensing unit 70 on the one surface 11 side is incorporated into the case 200 to form the humidity sensor module 300. A mounting structure of the humidity sensor 100 in which the humidity sensor module 300 is mounted on a circuit board 400 is provided.

  Also in this mounting structure, the feature provided in the humidity sensor module 300, that is, the case 200 has a terminal 210 that can be connected to the outside on the surface, and the humidity sensor 100 includes the inner surface of the case 200 and the substrate 10. The case 200 is housed in the case 200 in a state facing the one surface 11, and is electrically connected to the terminal 210 in the case 200, and the portion of the case 200 facing the sensing unit 70 is disposed in the case 200. A through hole 230 that communicates the inside and the outside is provided, and these characteristic points are provided.

  In addition, the mounting structure is characterized in that the terminal 210 of the case 200 and the circuit board 400 are electrically connected via the conductive bonding member 410.

  This mounting structure provides a mounting structure formed by mounting the humidity sensor module 300 having the above-described characteristic points in the present embodiment on the circuit board 400, and the effect thereof is the above-described humidity sensor module 300. It is the same as the effect by.

  That is, according to the humidity sensor mounting structure of the present embodiment, when mounting the humidity sensor 100 on the circuit board 400, it can be easily mounted together with the other components 420 and 430.

  In particular, in the mounting structure of the present embodiment, as shown in FIG. 1, the through hole 230 in the case 200 is also provided in a portion of the case 200 that faces the circuit board 400.

  According to this, when mounting the humidity sensor module 300 on the circuit board 400 via the conductive bonding member 410 such as solder or conductive adhesive, the through hole 230 in the case 200 faces downward, so that the solder Contamination of the humidity sensor 100 due to flux or the like can be suppressed as much as possible.

  Furthermore, in the mounting structure of the present embodiment, as shown in FIG. 1, a board through hole 440 that penetrates in the board thickness direction is provided in a portion of the circuit board 400 that faces the through hole 230 in the case 200. It is also a feature point.

  When the through hole 230 in the case 200 is provided in a portion of the case 200 facing the circuit board 400 as in the mounting structure of the present embodiment, if the board through hole 440 is provided in the circuit board 400, this board An external humidity atmosphere is easily introduced from the through hole 440 through the through hole 230 in the case 200 to the sensing unit 70 of the humidity sensor 100, which is preferable. The substrate through hole 440 may be omitted.

(Second Embodiment)
FIG. 4 is a schematic cross-sectional view showing a mounting structure of the humidity sensor 100 according to the second embodiment of the present invention on the circuit board 400. Differences from the above embodiment will be mainly described.

  In the first embodiment, the through hole 230 in the case 200 is provided in a portion of the case 200 that faces the circuit board 400. However, in the present embodiment, as shown in FIG. 230 is provided in a part of the case 200 that does not face the circuit board 400. In this case, the circuit board 400 may have no substrate through hole.

  Specifically, in the humidity sensor module 300 shown in FIG. 1, the terminal 210 provided on the side surface of the case 200 is used for connection to the circuit board 400.

  Here, although not shown, in the present embodiment, the terminal 210 whose one end is exposed on the side surface of the case 200 is provided with a through hole 230 in the case 200 at the other end while the intermediate portion is embedded in the case 200. It is pulled out so as to be exposed on the inner surface. This can be easily realized by changing the shape of the terminal 210 insert-molded in the case 200.

  Also in the present embodiment, the exposed portion of the terminal 210 and the humidity sensor 100 are electrically connected. This connection form can be the same as the example using the bump 80 as shown in FIG.

  Thus, in the present embodiment, the mounting structure of the humidity sensor module 300 is modified in the mounting structure of the humidity sensor, and the effect is the effect of the mounting structure of the humidity sensor described in the first embodiment. It is the same.

(Third embodiment)
FIG. 5 is a schematic cross-sectional view showing the mounting structure of the humidity sensor 100 according to the third embodiment of the present invention on the circuit board 400. Differences from the above embodiment will be mainly described.

  In the mounting structure in the above embodiment, the humidity sensor 100 is incorporated in the case 200 to form the humidity sensor module 300, and the humidity sensor module 300 is mounted on the circuit board 400. The humidity sensor 100 is directly mounted on the circuit board 400 without using the case 200.

  That is, according to the present embodiment, the circuit board 400 includes the humidity sensor 100 having the sensing unit 70 on the one surface 11 side of the substrate 10 and the circuit board 400 electrically connected to the humidity sensor 100. A substrate through hole 440 that penetrates in the substrate thickness direction is formed, and the humidity sensor 100 is formed on the circuit board 400 so as to cover the substrate through hole 440 with the one surface 11 of the substrate 10 facing the circuit board 400. In the humidity sensor 100, the sensing unit 70 faces the board through hole 440, and the board 10 and the circuit board 400 are electrically connected through the conductive bonding member 410 around the board through hole 440. A mounting structure for a humidity sensor is provided.

  In the mounting structure of this embodiment, since the humidity sensor 100 is directly connected to the circuit board 400 via the conductive bonding member 410, the mounting process can be made very simple.

  Further, in the mounting structure of the present embodiment, since the substrate through hole 440 is provided in the portion of the circuit board 400 that faces the sensing unit 70 of the humidity sensor 100, the humidity environment outside from the substrate through hole 440 is humidity. It is introduced into the sensing unit 70 of the sensor 100, and humidity can be detected.

  Therefore, according to the mounting structure of the humidity sensor of this embodiment, when mounting the humidity sensor 100 on the circuit board 400, it can be easily mounted together with the other components 420 and 430.

  Moreover, according to this mounting structure, since the humidity sensor 100 is directly attached to the circuit board 400, the above-described case 200 is not necessary, and reduction in assembling time and cost can be expected.

(Fourth embodiment)
FIG. 6 is a schematic cross-sectional view illustrating a mounting structure of the humidity sensor 100 according to the fourth embodiment of the present invention on the windshield 500.

  The humidity sensor module 300 as shown in the above embodiment is mounted on a windshield 500 as shown in FIG. 5 as an application example instead of being mounted on the circuit board 400 as an application example. Used.

  In the example shown in FIG. 6, the connection between the terminal 210 and the windshield 500 can be made by bonding or the like. The windshield 500 is provided with a wiring (not shown), and the wiring and the humidity sensor 200 are electrically connected through a terminal 210 or the like.

(Other embodiments)
The humidity sensor is not limited to the capacitance type configuration as shown in FIGS. 2 and 3 or the resistance type, but has a substrate having a sensing portion on one side. Can be adopted.

  Moreover, in the said embodiment, although the terminal 210 is integrated by insert-molding in the case 200, the terminal 210 may be integrated in the case 200 by adhesion | attachment etc. Further, the case 200 may not be a molded body such as a resin, and may be a metal or ceramic, for example.

  In the embodiment described above, the terminal 210 provided on the case 200 is exposed from the surface side to the inner surface of the case 200, connected to the circuit board 400 on the surface side, and the humidity sensor 100 at the exposed portion on the inner surface side. However, the configuration of the terminal 210 is not limited to this.

  In addition, for example, a conductor wiring is provided on the inner surface of the case 200, and a through hole penetrating from the surface of the case 200 to the inner surface is provided. May be configured to be electrically connected through the through hole. In this case, the humidity sensor 100 may be electrically connected to the conductor wiring.

  In short, the present invention includes the humidity sensor 100 having the substrate 10 provided with the sensing unit 70 on the one surface 11 side, and the case 200 having the externally connectable terminal 210 on the surface. The case 200 is housed in the case 200 in a state in which the inner surface of the case 200 and the one surface 11 of the substrate 10 are opposed to each other, and is electrically connected to the terminal 210 in the case 200. A humidity sensor module having a through hole 230 communicating between the inside and outside of the case 200, a mounting structure using the humidity sensor module, and a mounting structure for mounting the humidity sensor 100 on the circuit board 400 face down. The design of the other parts can be changed as appropriate.

It is a schematic sectional drawing which shows the mounting structure to the circuit board of the humidity sensor which concerns on 1st Embodiment of this invention. It is the schematic plan view which looked at the humidity sensor shown by FIG. 1 from the one surface of the board | substrate. It is a schematic sectional drawing in alignment with the AA cross section in FIG. It is a schematic sectional drawing which shows the mounting structure to the circuit board of the humidity sensor which concerns on 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the mounting structure to the circuit board of the humidity sensor which concerns on 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the mounting structure to the windshield of the humidity sensor which concerns on 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Silicon substrate as a substrate, 11 ... One surface of a substrate, 20 ... Moisture sensitive film,
41, 42 ... sensing electrode, 70 ... sensing unit, 100 ... humidity sensor,
200 ... case, 210 ... terminal, 230 ... through hole in the case,
300 ... Humidity sensor module, 400 ... Circuit board, 410 ... Conductive bonding member,
440: Substrate through hole.

Claims (10)

A humidity sensor (100) having a substrate (10) provided with a sensing portion (70) on one surface (11) side;
A case (200) having on the surface a terminal (210) that can be connected externally;
The humidity sensor (100) is housed in the case (200) with the inner surface of the case (200) and the one surface (11) of the substrate (10) facing each other, and the case (200). And electrically connected to the terminal (210)
A humidity sensor module, wherein a through hole (230) that communicates the inside and outside of the case (200) is provided at a portion of the case (200) that faces the sensing unit (70). The humidity sensor module according to claim 1, wherein the terminal (210) is integrated by insert molding in the case (200). The humidity sensor (100) includes a moisture sensitive film (20), and is a capacitive type that detects humidity based on a change in capacitance between electrodes (41, 42) sandwiching the moisture sensitive film (20). The humidity sensor module according to claim 1 or 2. A humidity sensor module (300) having a substrate (10) provided with a sensing portion (70) on one side (11) side is incorporated in a case (200) to form a humidity sensor module (300). 300) is a mounting structure of a humidity sensor (100) formed by mounting on a circuit board (400),
The case (200) has an externally connectable terminal (210) on the surface,
The humidity sensor (100) is housed in the case (200) with the inner surface of the case (200) and the one surface (11) of the substrate (10) facing each other, and the case (200). And electrically connected to the terminal (210)
A portion of the case (200) facing the sensing unit (70) is provided with a through hole (230) that communicates the inside and outside of the case (200).
The humidity sensor mounting structure, wherein the terminal (210) of the case (200) and the circuit board (400) are electrically connected via a conductive bonding member (410). The humidity sensor according to claim 4, wherein the through hole (230) in the case (200) is provided in a portion of the case (200) facing the circuit board (400). Mounting structure. A board through hole (440) penetrating in the board thickness direction is provided in a portion of the circuit board (400) facing the through hole (230) in the case (200). The mounting structure of the humidity sensor according to claim 5. The humidity sensor mounting structure according to any one of claims 4 to 6, wherein the terminal (210) is integrated with the case (200) by insert molding. The humidity sensor (100) includes a moisture sensitive film (20), and is a capacitive type that detects humidity based on a change in capacitance between electrodes (41, 42) sandwiching the moisture sensitive film (20). The humidity sensor mounting structure according to any one of claims 4 to 7. A humidity sensor (100) having a sensing unit (70) on one surface (11) side of the substrate (10);
A circuit board (400) electrically connected to the humidity sensor (100),
The circuit board (400) is formed with a substrate through hole (440) penetrating in the substrate thickness direction.
The humidity sensor (100) is placed on the circuit board (400) so as to cover the board through-hole (440), with one surface (11) of the board (10) facing the circuit board (400). Installed,
In the humidity sensor (100), the sensing unit (70) faces the substrate through hole (440), and the substrate (10) and the circuit board (400) are surrounded by the substrate through hole (440). ) Is electrically connected via a conductive bonding member (410). The humidity sensor (100) includes a moisture sensitive film (20), and is a capacitive type that detects humidity based on a change in capacitance between electrodes (41, 42) sandwiching the moisture sensitive film (20). The humidity sensor mounting structure according to claim 9.

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