JP2016139764A - Substrate fixing device and substrate inspection equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix a substrate in an appropriate state of a tension caused to the substrate.SOLUTION: A substrate fixing device comprises: clamp parts 12a and 12b that clamp edge parts 101a and 101b of a substrate 100; a moving mechanism 13 that causes a tension to the substrate 100 by moving the clamp part 12b; a driving control part (an electropneumatic regulator 14 and a processing part 17) that executes a driving processing which controls a driving parameter and allows the moving mechanism 13 to drive; and a storing part 16 that is constructed so as to be fixable the substrate 100 and stores a value of the driving parameter having a size so as to cause a previously regulated regulation tension to the substrate 100 as a threshold value Pt. The threshold value Pt is regulated on the basis of an elastic deformable range of the substrate 100 specified by a relation of a moving amount of the clamp part 12b to be moved by the moving mechanism 13 in a state of clamping edge parts 101a and 101b and the value of driving parameter. The driving control part maintains the driving parameter to the threshold value Pt in the driving processing.SELECTED DRAWING: Figure 2

Description

  The present invention includes a substrate fixing device that fixes a substrate by including a moving mechanism that moves the clamp unit to generate tension on the substrate, a drive control unit that drives the moving mechanism, and a substrate that includes the substrate fixing device. The present invention relates to an inspection device.

  As this type of substrate fixing device, a substrate fixing device disclosed in Patent Document 1 below is known. The substrate fixing device includes a first clamp mechanism, a second clamp mechanism, a third clamp mechanism, and a fourth clamp mechanism that hold each end of the substrate, and a first clamp mechanism and a second clamp mechanism that move relative to each other. A moving mechanism, a second moving mechanism that relatively moves the third clamping mechanism and the fourth clamping mechanism, and a control unit that controls each moving mechanism are provided. In this substrate fixing apparatus, the control unit controls the first moving mechanism to move the first clamp mechanism and the second clamp mechanism that are holding each end of the substrate in the X-axis direction so as to be separated from each other. . Further, the control unit controls the second moving mechanism to move the third clamp mechanism and the fourth clamp mechanism that are holding each end of the substrate in the Y-axis direction so as to be separated from each other. As a result, the substrate is pulled in the X-axis direction and the Y-axis direction, and tension is generated in the substrate, thereby making it possible to eliminate the distortion and looseness of the substrate.

JP 2014-228347 A (page 6-10, FIG. 3)

  However, the above substrate fixing device has the following problems. That is, in this substrate fixing device, when the clamp mechanism is moved, there is no means for controlling (adjusting) the amount of movement of the clamp mechanism in accordance with the tension generated in the substrate. There is a possibility that the slack may remain or, on the contrary, the tension becomes excessive and the substrate may be plastically deformed.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a substrate fixing device and a substrate inspection device that can fix the substrate in a state where the tension generated on the substrate is appropriate.

  In order to achieve the above object, the substrate fixing apparatus according to claim 1, wherein at least one of the plurality of clamp portions that clamp the edge portion of the substrate and each of the clamp portions facing each other is moved in a direction in which the clamp portions are separated from each other. A substrate fixing device that includes a moving mechanism that generates tension on the substrate and a drive control unit that controls a driving parameter to drive the moving mechanism and fixes the substrate. A storage unit is provided that stores a value of the driving parameter having a magnitude that causes the substrate to generate a prescribed tension that is defined in advance as a threshold, and the threshold is set by the moving mechanism in a state where the edge of the substrate is clamped. It is defined based on the elastic deformation range of the substrate specified from the correlation between the amount of movement of the clamp part to be moved and the value of the driving parameter, Serial drive control section, at the driving process, the substrate fixing device for maintaining said drive parameter to the threshold.

  According to a second aspect of the present invention, in the substrate fixing device according to the first aspect, the moving mechanism includes an air cylinder, and the drive control unit is a pressure of air supplied to the air cylinder. Is controlled as the driving parameter.

  Further, the substrate fixing device according to claim 3 is the substrate fixing device according to claim 1 or 2, wherein the clamp is obtained from the measurement unit that measures the position of the clamp unit and the position measured by the measurement unit. Identifying the elastically deformable range based on the correlation between the amount of movement of the part and the value of the driving parameter, and setting the threshold value among the values of the driving parameter corresponding to the elastically deformable range And a processing unit that executes a threshold value defining process. The storage unit stores the threshold value defined by the threshold value defining process.

  The substrate fixing device according to claim 4 is the substrate fixing device according to claim 3, wherein the clamp portion has an inclined surface inclined with respect to a moving plane on which the clamp portion moves, and the measuring portion is Then, a separation distance from an arrangement position perpendicular to the moving plane and separated from the inclined surface to the inclined surface is detected, and the position of the clamp portion is measured based on the separated distance.

  According to a fifth aspect of the present invention, there is provided a substrate inspection apparatus including the substrate fixing device according to any one of the first to fourth aspects and an inspection probe brought into contact with the substrate fixed by the substrate fixing device. And an inspection unit that performs an inspection on the substrate based on electric signals to be input and output.

  In the substrate fixing device according to claim 1 and the substrate inspection device according to claim 5, in the driving process in which the drive control unit drives the moving mechanism by controlling the driving parameter, the driving parameter is clamped by the moving mechanism. The threshold value is maintained based on the elastic deformation range of the substrate specified from the correlation between the movement amount of the part and the driving parameter. Therefore, according to the substrate fixing device and the substrate inspection device, unlike the conventional substrate fixing device that does not include means for controlling the movement amount of the clamp portion according to the tension generated on the substrate, the tension generated on the substrate is insufficient. In this case, it is possible to reliably prevent the substrate from being strained or loosened, or on the contrary, from excessive tension and plastic deformation of the substrate, and fixing the substrate with the appropriate tension generated on the substrate. be able to.

  In the substrate fixing device according to claim 2 and the substrate inspection device according to claim 5, the moving mechanism includes an air cylinder, and the pressure of the air supplied to the air cylinder by the drive control unit is used as a driving parameter. Control. For this reason, according to this board | substrate fixing apparatus and board | substrate test | inspection apparatus, although it is the simple structure which controls a pressure, the movement amount of the clamp part by a moving mechanism can be controlled accurately.

  Further, in the substrate fixing device according to claim 3 and the substrate inspection device according to claim 5, the processing unit sets the elastic deformation range of the substrate based on the correlation between the movement amount of the clamp unit and the value of the driving parameter. A threshold value specifying process for specifying a value to be set as a threshold value from the values of the drive parameters corresponding to the elastically deformable range is executed. For this reason, according to the substrate fixing device and the substrate inspection device, by performing the threshold value defining process prior to the inspection of the substrate to be inspected, the threshold value corresponding to the type of the substrate can be reliably defined. Various substrates can be fixed with appropriate tension.

  Further, in the substrate fixing device according to claim 4 and the substrate inspection device according to claim 5, the clamp portion has an inclined surface inclined with respect to the moving plane in which the clamp portion moves, and the measuring portion is in relation to the moving plane. The separation distance from the disposition position that is orthogonal to the inclined surface and the inclined surface is detected, and the position of the clamp portion is measured based on the separation distance. For this reason, according to this board | substrate fixing apparatus and board | substrate inspection apparatus, a measurement part can be moved to an arrangement position using the probing mechanism which moves a probe above a clamp part. Therefore, according to the substrate fixing device and the substrate inspection device, it is not necessary to provide a dedicated moving mechanism for moving the measurement unit, and thus the configuration can be simplified accordingly.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 2 is a configuration diagram showing a configuration of a substrate fixing device 2. FIG. 4 is a plan view of the substrate fixing device 2. FIG. It is a side view of clamps 33a-33c. It is explanatory drawing explaining the usage method of the board | substrate inspection apparatus. It is a correlation diagram showing the correlation between the movement amount Dh and the pressure P.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a substrate fixing device and a substrate inspection device according to the present invention will be described with reference to the accompanying drawings.

  Initially, the structure of the board | substrate inspection apparatus 1 shown in FIG. 1 as an example of a board | substrate inspection apparatus is demonstrated. As shown in the figure, the substrate inspection apparatus 1 includes a substrate fixing device 2, a probing mechanism 3, and a control unit 4, and, for example, a flexible substrate 100 such as a coreless substrate (see FIGS. 2 and 5). It is configured to be inspectable.

  As shown in FIGS. 2 and 3, the substrate fixing device 2 includes a support base 11, clamp parts 12 a and 12 b (hereinafter also referred to as “clamp part 12” when not distinguished), a moving mechanism 13, an electropneumatic regulator 14, and a laser displacement. A total 15, a storage unit 16, and a processing unit 17 are provided, and the substrate 100 can be fixed.

  As shown in FIGS. 2 and 3, the support base 11 is formed in a substantially rectangular plate shape as an example. A substantially rectangular opening 21 is formed at the center of the support base 11. As shown in FIG. 3, a rail 22 is disposed in the vicinity of the edge portion 21 a of the opening 21 in the support base 11 so as to extend in the X direction of the support base 11. A slider 23 is disposed on the rail 22.

  As shown in FIG. 3, the clamp portion 12 a includes a beam member 31 a and three clamps 32 a to 32 c (hereinafter, also referred to as “clamp 32” when not distinguished). The beam member 31 a is fixed to the support base 11 so as to extend in the Y direction of the support base 11 in the vicinity of the edge portion 21 c of the opening 21 in the support base 11. As shown in FIG. 2, each clamp 32 is configured such that the tip end portion is opened and closed by the supply of compressed air from a compressor (not shown), and clamps (holds) the edge portion 101a of the substrate 100 at the tip end portion. Is possible. Further, as shown in FIG. 3, for example, the clamps 32 are fixed to the beam member 31a so as to be arranged at equal intervals along the length direction of the beam member 31a.

  As shown in FIG. 3, the clamp portion 12 b includes a beam member 31 b and three clamps 33 a to 33 c (hereinafter, also referred to as “clamp 33” when not distinguished). As shown in the figure, one end of the beam member 31b is fixed to the upper surface of the slider 23 disposed on the rail 22 of the support base 11, and the other end is the slider 13a of the moving mechanism 13. It is fixed to the upper surface of the support member 11 and is arranged in parallel with the beam member 31 a of the clamp portion 12 a and extending along the Y direction of the support base 11.

  As shown in FIG. 2, each clamp 33 is configured such that the front end portion is opened and closed by the supply of compressed air from a compressor (not shown), and the edge portion 101b of the substrate 100 can be clamped at the front end portion. It has become. Further, for example, as shown in FIG. 3, the clamps 33 are fixed to the beam member 31b so as to be arranged at equal intervals along the length direction of the beam member 31b. In this case, as described above, since the end portions of the beam member 31b are fixed to the slider 23 of the support base 11 and the slider 13a of the moving mechanism 13, the clamp portion 12b is slid by sliding the sliders 23 and 13a. The support base 11 is moved in the X direction. Further, as shown in FIG. 4, the clamp 33 is inclined with respect to a moving plane (a plane parallel to the surface of the support base 11, hereinafter also referred to as “XY plane”) on which the clamp portion 12 b moves. A surface 41 is formed.

  As an example, the moving mechanism 13 is composed of a rodless type air cylinder, and as shown in FIG. 3, in the vicinity of the edge 21 b of the opening 21 in the support base 11, in a state parallel to the rail 22, and It is fixed to the support base 11 so as to extend along the X direction of the support base 11. The moving mechanism 13 is driven by compressed air from a compressor (not shown) supplied via the electropneumatic regulator 14, and slides the slider 13a in the X direction shown in FIG. One example of “at least one of the clamp portions facing each other”) is moved in a direction in which the clamp portions 12a and 12b come in contact with and away from each other (X direction of the support base 11 shown in the figure). In this case, the moving mechanism 13 clamps the clamp portions 12a and 12b in a state in which the edge portions 101a and 101b of the substrate 100 are clamped in directions away from each other (X1 direction of the support base 11 shown in the figure). By moving the portion 12b, the substrate 100 is tensioned.

  The electropneumatic regulator 14 functions as a drive control unit that drives the moving mechanism 13 together with the processing unit 17. In this case, the electropneumatic regulator 14 is a regulator provided with an electropneumatic proportional valve, and is not shown in the figure according to the control signal output from the processing unit 17 (for example, in proportion to the current value of the control signal). The pressure P of the compressed air from the compressor is adjusted steplessly and supplied to the moving mechanism 13. That is, in this board | substrate fixing apparatus 2, a drive control part controls the pressure P of the air supplied to the air cylinder as the moving mechanism 13 as a driving parameter.

  The laser displacement meter 15 functions together with the processing unit 17 as a measurement unit that measures the position of the clamp unit 12b. In this case, the laser displacement meter 15 is orthogonal to the position above the inclined surface 41 in the clamp 33 (the moving plane (XY plane) of the clamp portion 12b) and separated from the inclined surface 41 by the probing mechanism 3 (see FIG. 3). (Refer to FIG. 2). Further, the laser displacement meter 15 irradiates the inclined surface 41 of the clamp 33 with the laser light L and receives the reflected light, so that the separation distance Dv from the laser displacement meter 15 to the inclined surface 41 (the height direction in FIG. 2). ).

  The storage unit 16 stores a threshold value Pt used when the substrate fixing device 2 fixes the substrate 100. In this case, when the substrate 100 is fixed, the threshold value Pt is obtained by moving the clamp portion 12b by the moving mechanism 13 in a state where the edge portions 101a and 101b of the substrate 100 are clamped by the clamp portions 12a and 12b, respectively. Threshold pressure defining process executed by the processing unit 17 is the pressure P (value of the driving parameter) of the compressed air supplied to the moving mechanism 13 when the tension generated in the substrate 100 becomes the prescribed tension defined in advance. Stipulated in

  As described above, the processing unit 17 functions as a drive control unit together with the electropneumatic regulator 14 and executes a driving process for driving the moving mechanism 13 by controlling the pressure P (driving parameter) of air supplied to the moving mechanism 13. To do. In this case, in the driving process, the processing unit 17 maintains the pressure P at the above-described threshold value Pt, thereby maintaining the tension generated in the substrate 100 at the specified tension.

  The processing unit 17 functions as a measurement unit, and measures the position of the clamp 33 from the separation distance Dv (the distance from the laser displacement meter 15 to the inclined surface 41 of the clamp 33) detected by the laser displacement meter 15. Further, the processing unit 17 obtains the movement amount (movement distance) Dh of the clamp unit 12b from the detected position of the clamp 33, and based on the correlation between the movement amount Dh and the value of the pressure P of the compressed air, the elasticity of the substrate 100 is obtained. A deformable range is specified, and a threshold value defining process is performed in which a value selected from the range of the pressure P corresponding to the elastically deformable range is defined as the threshold value Pt.

  The probing mechanism 3 causes the inspection probe 51 (see FIG. 3) to be probed on the substrate 100 (for example, a conductor pattern outside the figure formed on the substrate 100) under the control of the control unit 4.

  The control unit 4 controls the substrate fixing device 2 and the probing mechanism 3 in accordance with an operation on an operation unit (not shown). Further, the control unit 4 functions as an inspection unit, and performs an inspection on the substrate 100 based on an electric signal input / output via the probe 51 brought into contact with the substrate 100 fixed by the substrate fixing device 2.

  Next, a method for inspecting the substrate 100 using the substrate inspection apparatus 1 will be described with reference to the accompanying drawings.

  First, prior to the inspection, an operation for defining the threshold value Pt is performed. In this operation, first, a test substrate 100 having the same configuration as the substrate 100 to be inspected is fixed to the substrate fixing device 2. Specifically, as shown in FIG. 5, the edge portion 101a of the substrate 100 is clamped by the clamps 32a to 32c of the clamp portion 12a. Next, the clamp portion 12b is brought close to the clamp portion 12a in accordance with the width of the substrate 100 (the length in the left-right direction in the figure). Then, the edge part 101b of the board | substrate 100 is clamped to each clamp 33a-33c of the clamp part 12b.

  Next, an operation unit (not shown) is operated to instruct execution of the threshold value defining process. In response to this, the control unit 4 controls the probing mechanism 3 to move the laser displacement meter 15 of the substrate fixing device 2 to a position above the inclined surface 41 of the clamp 33 (for example, the clamp 33b). Subsequently, the control unit 4 instructs the processing unit 17 of the substrate fixing apparatus 2 to execute a threshold value defining process.

  Next, the processing unit 17 executes a threshold value defining process according to an instruction from the control unit 4. In this threshold value defining process, the processing unit 17 gradually increases the pressure P of the compressed air supplied to the moving mechanism 13 by gradually increasing the current value of the control signal output to the electropneumatic regulator 14. In response to this, the moving mechanism 13 gradually slides the slider 13a in the X1 direction (direction in which the clamp portions 12a and 12b are separated from each other, see FIG. 5). In this case, the end of the beam member 31b in the clamp portion 12b is fixed to the slider 13a. For this reason, the clamp part 12b is moved to the direction of X1 with the slide of the slider 13a.

  On the other hand, the laser displacement meter 15 irradiates the inclined surface 41 of the clamp 33 with the laser beam L and receives the reflected light, and is separated from the laser displacement meter 15 (position above the inclined surface 41) to the inclined surface 41. The distance Dv is detected. Subsequently, the processing unit 17 measures the position of the clamp 33 from the separation distance Dv detected by the laser displacement meter 15. In this case, since the inclined surface 41 is inclined with respect to the XY plane, the separation distance Dv changes according to the movement amount Dh of the clamp portion 12b along the XY plane (specifically, the separation distance Dv is the movement amount). Changes in proportion to Dh). Therefore, the movement amount Dh can be measured from the separation distance Dv.

  Further, the processing unit 17 specifies the pressure P of the compressed air supplied to the storage unit 16 from the current value of the control signal output to the storage unit 16, and correlates the movement amount Dh and the pressure P (the movement amount of the clamp unit). And the value of the driving parameter).

  Here, the correlation between the movement amount Dh and the pressure P is represented by the correlation diagram shown in FIG. 6 as an example because the substrate 100 has flexibility. Specifically, as shown in the figure, from the time when the supply of compressed air to the moving mechanism 13 is started, until the pressure P reaches the pressure P1 (pressure P at which the moving mechanism 13 starts driving) (see the figure). In the “stop period” shown in FIG. 4B, the slider 13a (clamp portion 12b) is stopped (the movement amount Dh is maintained at “0”). Next, when the pressure P reaches the pressure P1, sliding of the slider 13a is started and movement of the clamp portion 12b is started. Subsequently, until the pressure P reaches the pressure P2 ("deflection removal section" shown in the figure), the deflection of the substrate 100 is gradually removed with the movement of the clamp portion 12b, and the movement amount Dh becomes the movement amount Dh1. It becomes. Next, until the pressure P reaches the pressure P3 after reaching the pressure P2 ("elastic deformation section" shown in the figure), the substrate 100 is elastically deformed, and the movement amount Dh becomes the movement amount Dh2. Subsequently, until the pressure P3 reaches the pressure P4 after reaching the pressure P3 ("plastic deformation section" shown in the figure), when the pressure P4 is reached, the substrate 100 is cracked or broken. Occurs.

  The processing unit 17 specifies the elastic deformable range (the elastic deformation section) of the substrate 100 based on the correlation between the movement amount Dh and the pressure P, and the range of the pressure P corresponding to the elastic deformation range ( In the above example, the threshold value Pt is defined from the range of the pressure P2 to the pressure P3. In this case, as an example, the processing unit 17 is a value obtained by adding a value corresponding to 80% of the value obtained by subtracting the pressure P2 from the pressure P3 to the pressure P2 (ie: P2 + (P3-P2) × 0.8). Is defined as a threshold value Pt. Next, the processing unit 17 stores the defined threshold value Pt in the storage unit 16. Subsequently, the processing unit 17 controls the electropneumatic regulator 14 to stop the supply of compressed air to the moving mechanism 13, stops the slide of the slider 13a (movement of the clamp unit 12b), and ends the defining process.

  Next, the clamping of the substrate 100 by the clamp portions 12 a and 12 b is released, and the substrate 100 is removed from the substrate fixing device 2. Thus, the operation for defining the threshold value Pt is completed.

  Next, an inspection is performed on the substrate 100 to be inspected. First, as shown in FIG. 5, the edge portions 101a and 101b of the substrate 100 are clamped by the clamp portions 12a and 12b of the substrate fixing device 2, respectively.

  Subsequently, the operation unit (not shown) is operated to instruct the start of inspection. In response to this, the control unit 4 instructs the processing unit 17 of the substrate fixing apparatus 2 to execute the driving process. Next, the processing unit 17 executes a driving process in accordance with an instruction from the control unit 4. In this driving process, the processing unit 17 gradually increases the pressure P of the compressed air supplied to the moving mechanism 13 by gradually increasing the current value of the control signal output to the electropneumatic regulator 14. In response to this, the moving mechanism 13 gradually slides the slider 13a in the direction of X1 shown in FIG. 5, whereby the clamp portion 12b is gradually moved in the direction of X1.

  Subsequently, the processing unit 17 maintains the state (the state where the pressure P is the threshold value Pt) when the pressure P reaches the threshold value Pt (the current value of the control signal is maintained at the current value corresponding to the threshold value Pt). . Thereby, the substrate 100 is fixed by the substrate fixing device 2. In this case, the threshold value Pt is defined within the range of the pressure P corresponding to the elastically deformable range of the substrate 100 as described above. For this reason, in this state (the state where the pressure P is the threshold value Pt), the bending of the substrate 100 is reliably removed, and the substrate 100 is maintained in a state where it is not plastically deformed. In other words. The substrate 100 is fixed by the substrate fixing device 2 with an appropriate tension generated on the substrate 100.

  Next, the control unit 4 controls the probing mechanism 3 to cause the probe 51 to probe the conductor pattern of the substrate 100. In this case, the substrate 100 is fixed by the substrate fixing device 2 without being bent. For this reason, in this board | substrate test | inspection apparatus 1, the position shift with the probe 51 and a conductor pattern is prevented reliably, and it is possible to probe the probe 51 reliably to the probing object position.

  Subsequently, the control unit 4 performs an inspection on the substrate 100 based on an electric signal input / output via the probe. Thereafter, when the inspection of the substrate 100 is finished, the control unit 4 instructs the substrate fixing device 2 to release the fixation. In response to this, the processing unit 17 of the substrate fixing apparatus 2 controls the electropneumatic regulator 14 to supply compressed air to the moving mechanism 13 so that the slider 13a slides in the direction X2 shown in FIG. As a result, the clamp portion 12b moves in the direction X2, and the substrate 100 is not fixed by the substrate fixing device 2. Next, the clamping of the edges 101 a and 101 b of the substrate 100 by the clamps 32 and 33 is released, and the substrate 100 is removed from the substrate fixing device 2. Thus, the inspection for the substrate 100 is completed. Subsequently, when inspecting another substrate 100, the substrate 100 is fixed to the substrate fixing device 2 in accordance with the above-described procedure, and the execution of the inspection is instructed.

  Thus, in the substrate fixing device 2 and the substrate inspection device 1, the control unit 4 and the electropneumatic regulator 14 (drive control unit) drive the moving mechanism 13 by controlling the pressure P (drive parameter) of the compressed air. In the driving process to be performed, the pressure P is maintained at the threshold value Pt defined based on the elastically deformable range of the substrate 100 specified from the correlation between the movement amount Dh of the clamp portion 12b by the moving mechanism 13 and the pressure P. For this reason, according to this board | substrate fixing apparatus 2 and the board | substrate inspection apparatus 1, unlike the conventional board | substrate fixing apparatus which is not equipped with the means to control the moving amount Dh of the clamp part 12b according to the tension | tensile_strength which arises in the board | substrate 100, The tension generated in the substrate 100 is surely prevented by the fact that the tension generated in the substrate 100 is insufficient and distortion or slack of the substrate remains, or on the contrary, the substrate 100 is plastically deformed due to excessive tension. The substrate 100 can be fixed in an appropriate state.

  Moreover, in this board | substrate fixing apparatus 2 and the board | substrate inspection apparatus 1, the moving mechanism 13 is provided with an air cylinder, and the drive control part controls the pressure P of the air supplied to an air cylinder as a parameter for a drive. For this reason, according to this board | substrate fixing apparatus 2 and the board | substrate inspection apparatus 1, although it is the simple structure which controls the pressure P, the moving amount | distance Dh of the clamp part 12b by the moving mechanism 13 can be controlled correctly.

  Moreover, in this board | substrate fixing apparatus 2 and the board | substrate inspection apparatus 1, the process part 17 pinpoints the elastic deformation possible range of the board | substrate 100 based on the correlation of the moving amount Dh of the clamp part 12b, and the value of the pressure P, and elastic deformation is carried out. A threshold value defining process for defining a value to be set as the threshold value Pt from the pressure P corresponding to the possible range is executed. For this reason, according to the substrate fixing device 2 and the substrate inspection device 1, the threshold value Pt corresponding to the type of the substrate 100 is reliably defined by executing the threshold value defining process prior to the inspection of the substrate 100 to be inspected. Therefore, various substrates 100 can be fixed in a state where the tension is appropriate.

  Moreover, in this board | substrate fixing apparatus 2 and the board | substrate inspection apparatus 1, the clamp part 12b has the inclined surface 41 which inclines with respect to XY plane (moving plane), and the laser displacement meter 15 is orthogonal to the moving plane, and inclines. A separation distance Dv from the disposition position away from the surface 41 to the inclined surface 41 is detected, and the processing unit 17 measures the position of the clamp portion 12b based on the separation distance Dv. For this reason, according to this board | substrate fixing apparatus 2 and the board | substrate inspection apparatus 1, the laser displacement meter 15 can be moved to an arrangement position using the probing mechanism 3 which moves the probe 51 above the clamp part 12b. Therefore, according to this board | substrate fixing apparatus 2 and the board | substrate inspection apparatus 1, since it is not necessary to provide the moving mechanism for exclusive use for moving the laser displacement meter 15, a structure can be simplified that much.

  The configurations of the substrate fixing device and the substrate inspection device are not limited to the configurations described above. For example, although the example in which only the clamp part 12b, which is one of the clamp parts 12a and 12b facing each other, is moved has been described above, a configuration in which both the clamp parts 12a and 12b are moved may be employed.

  In addition, the configuration example in which the edge portions 101a and 101b of the substrate 100 are clamped by the two clamp portions 12a and 12b and the substrate 100 is fixed has been described above, but the other two edges (two upper and lower edges in FIG. 5). It is also possible to adopt a configuration in which the substrate 100 is fixed by clamping with two clamp portions. Moreover, it is also possible to employ a configuration in which all of the four edge portions of the substrate 100 are clamped by the four clamp portions and one or both of the clamp portions facing each other are moved.

  Further, the example in which the movement amount Dh is measured based only on the separation distance Dv for one of the three clamps 33 (the clamp 33b in the above example) has been described above, but the separation distance Dv for all the three clamps 33. It is also possible to adopt a configuration in which the movement amount Dh is measured based on each separation distance Dv (for example, based on an average value of each separation distance Dv).

  Further, the laser displacement meter 15 is disposed above the inclined surface 41 formed on the clamp 33, and the position of the clamp portion 12b is measured from the separation distance Dv from the laser displacement meter 15 to the inclined surface 41. The laser displacement meter 15 is positioned at a position facing the side surface of the clamp 33 (for example, the right surface in FIG. 4), and the clamp portion 12b is determined from the distance from the laser displacement meter 15 to the side surface of the clamp 33. It is also possible to adopt a configuration for measuring the position of

  Moreover, although the example which measures the separation distance Dv using the laser displacement meter 15 was described above, for example, a configuration in which the separation distance Dv is measured using a mechanical measurement device such as a dial gauge may be employed.

  Further, the example in which the processing unit 17 executes the threshold value defining process to define the threshold value Pt has been described above. However, a configuration is adopted in which the threshold value Pt defined in advance (for example, calculated using an external device) is stored in the storage unit 16. You can also

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Board | substrate fixing apparatus 3 Probing mechanism 4 Control part 12a, 12b Clamp part 13 Movement mechanism 14 Electropneumatic regulator 15 Laser displacement meter 16 Memory | storage part 17 Processing part 33a-33c Clamp 41 Inclined surface 51 Probe 100 Board | substrate 101a, 101b Edge Dh Movement amount Dv Separation distance P Pressure Pt Threshold

Claims (5)

A plurality of clamps that clamp the edge of the substrate, a moving mechanism that generates tension on the substrate by moving at least one of the clamps facing each other in a direction in which the clamps are separated from each other, and a driving parameter A substrate fixing device that fixes the substrate with a drive control unit that executes a driving process for controlling the drive mechanism to drive the moving mechanism,
A storage unit that stores, as a threshold, a value of the driving parameter having a magnitude that causes the substrate to generate a predetermined tension that is defined in advance;
The threshold value is an elastically deformable range of the substrate specified by the correlation between the amount of movement of the clamp portion that is moved by the moving mechanism in a state where the edge portion of the substrate is clamped and the value of the driving parameter. Stipulated based on
The drive control unit is a substrate fixing apparatus that maintains the driving parameter at the threshold value in the driving process. The moving mechanism includes an air cylinder,
The substrate fixing apparatus according to claim 1, wherein the drive control unit controls the pressure of air supplied to the air cylinder as the driving parameter. A measurement unit for measuring the position of the clamp unit;
The elastic deformable range is specified based on the correlation between the amount of movement of the clamp unit obtained from the position measured by the measuring unit and the value of the driving parameter, and the elastic deformable range corresponds to the elastic deformable range. A threshold value defining process for defining a value to be the threshold value from among drive parameter values,
The substrate fixing apparatus according to claim 1, wherein the storage unit stores the threshold value defined by the threshold value defining process. The clamp part has an inclined surface inclined with respect to a moving plane in which the clamp part moves,
The measurement unit detects a separation distance from an arrangement position perpendicular to the moving plane and separated from the inclined surface to the inclined surface, and measures the position of the clamp unit based on the separation distance. 3. The substrate fixing device according to 3.   5. An inspection for the substrate based on an electric signal input / output through the substrate fixing device according to claim 1 and an inspection probe brought into contact with the substrate fixed by the substrate fixing device. A board inspection apparatus comprising: an inspection unit that executes

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