JP2016082166A - Adhesive tape joining method and adhesive tape joining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To paste an adhesive tape accurately to the concave region on the outside of the convex region of a substrate having protrusions and recesses, where the protrusion is formed.SOLUTION: A convex region 36 where at least the protrusion, i.e., a bump 37, is formed out of the protrusions and recesses formed in a wafer W, as a substrate, is supported by an elastic first support member 34, a concave region 38 on the outer periphery of the wafer W is supported by an annular second support member 35 harder than the first support member 34, and then a support plate G is pasted, while pressing, to a double-sided adhesive tape piece T that has been pasted to the wafer W supported by the first support member 34 and second support member 35.SELECTED DRAWING: Figure 12

Description

  The present invention relates to an adhesive tape attaching method and an adhesive tape attaching apparatus for attaching an adhesive tape to a substrate having irregularities such as a semiconductor wafer (hereinafter referred to as “wafer” as appropriate), a circuit board, and an LED substrate.

  For example, in the case of a semiconductor wafer as the substrate, a protective adhesive tape is attached to the circuit forming surface before the back surface grinding (see Patent Document 1).

  Further, in response to demands for high-density mounting in recent years, wafers tend to become larger and thinner. A supporting plate such as a glass substrate is bonded to the wafer via a double-sided adhesive tape to protect and reinforce the circuit forming surface (see Patent Document 2).

JP 2010-272755 A JP 2005-88379 A

  When adhesive tape is applied to a wafer using a conventional method with protective tape and double-sided adhesive tape, contaminated water or dust may enter the interface with the wafer when the adhesive tape is ground to contaminate or damage the circuit. Yes.

  This invention is made | formed in view of such a situation, Comprising: The main objective is to provide the adhesive tape sticking method and adhesive tape sticking apparatus which can affix an adhesive tape on the board | substrate with which the unevenness | corrugation was formed accurately. And

Therefore, the inventors repeated the experiment of attaching a protective adhesive tape (protective tape) for each different type of wafer and attaching the support plate through the double-sided adhesive tape, and the occurrence of contamination of the wafer circuit, etc. The cause was investigated earnestly. As a result, the inventors obtained the following knowledge.

  When a support plate is bonded to a wafer via a double-sided adhesive tape, bumps are formed on the back surface of the wafer. Therefore, a gap is generated between the convex area where the bump is formed and the concave area on the outer periphery of the wafer surrounding the convex area. When the wafer is placed on the holding table and the support plate on which the double-sided adhesive tape is previously attached is bonded to the wafer, the pressure is adjusted to a level at which the bumps in contact with the holding table are not damaged. Therefore, it was found that the pressure acting on the concave area not supported by the holding table in a non-contact manner is smaller than that of the convex area, and as a result, the double-sided pressure-sensitive adhesive tape is not in close contact with the concave area.

  It has been found that the same problem occurs in the protective adhesive tape to be attached to the wafer surface due to the gap between the convex region where the circuit is formed and the concave region on the outer periphery.

  Accordingly, the present invention has the following configuration in order to achieve such an object.

That is, an adhesive tape attaching method for attaching an adhesive tape to a substrate having irregularities,
Supporting at least the convex region of the irregularities by a first support member having elasticity,
A concave region on the outer periphery of the substrate is supported by an annular second support member that is harder than the first support member;
An adhesive tape is affixed to the substrate supported by the first support member and the second support member.

  (Operation / Effect) According to the above method, the first support member is elastically deformed when a load is applied to the convex region when the adhesive tape is attached to the substrate. At the same time, a load is also applied to the concave region with the elastic deformation of the first support member. Since the concave region is supported by the second support member that is harder than the first support member, a load greater than the convex region can be applied. Therefore, since the adhesive tape can be brought into close contact with the concave region, it is possible to prevent contaminated water and dust from entering the interface between the adhesive tape and the substrate when grinding the back surface of the substrate.

  In addition, when a board | substrate has a bump on the back surface, you may affix an adhesive tape as follows.

For example, the first support member that is an elastic sheet is placed and held on a holding table,
On the first support member, the second support member having the same height as the bump is placed and held,
An adhesive tape is affixed in a state where the substrate is placed on the second support member.

Alternatively, the second support member is placed and held on the holding table,
Placing and holding the first support member, which is an elastic sheet, on the second support member;
When the substrate is placed on the first support member and the adhesive tape is attached, the first support member and the second support member are such that the pressure acting on the concave region is equal to or greater than the pressure acting on the convex region. Adjust the thickness.

  The present invention has the following configuration in order to achieve such an object.

That is, an adhesive tape attaching device for attaching an adhesive tape to a substrate having irregularities,
A first support member for supporting at least a convex region of the irregularities with elasticity;
A second support member that is harder than the first support member that supports the concave region on the outer periphery of the substrate;
And an affixing mechanism for affixing an adhesive tape to a substrate placed on the first support member and the second support member.

  (Operation / Effect) According to this configuration, the first support member supporting one convex region is elastically deformed when the tape is applied. Since the other concave area is supported by the second support member that is harder than the first support member, a load greater than the convex area is applied. Therefore, the above method can be suitably performed.

  According to the pressure-sensitive adhesive tape applying method and the pressure-sensitive adhesive tape applying device of the present invention, the pressure-sensitive adhesive tape can be brought into close contact with the concave region of the substrate having irregularities.

It is a top view which shows the whole structure of an adhesive tape sticking apparatus. It is a front view of an adhesive tape sticking mechanism. It is a perspective view of a cutting roller. It is a front view which shows schematic structure of a separator peeling mechanism. It is a longitudinal cross-sectional view of a support plate bonding mechanism. It is a disassembled perspective view which shows the structure of a holding table. It is a longitudinal cross-sectional view when a wafer is mounted on a holding table. It is a schematic diagram which shows the affixing operation | movement of a double-sided adhesive tape piece. It is a schematic diagram which shows the affixing operation | movement of a double-sided adhesive tape piece. It is a schematic diagram which shows the operation | movement which bonds a support plate to a wafer. It is a schematic diagram which shows the operation | movement which bonds a support plate to a wafer. It is the elements on larger scale which show the state which has bonded the support plate. It is a front view which shows the structure of the holding | maintenance table of a modification. It is a schematic diagram which shows the operation | movement which bonds a support plate using the holding table of a modification. It is a front view which shows the structure of the holding | maintenance table of a modification.

  Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the semiconductor wafer (hereinafter referred to as “wafer” as appropriate) has protruding electrodes 3 such as solder balls and bumps formed on the back surface and the surface after the back surface grinding. For example, the thickness of the wafer W is 100 μm or less, and the thickness of the protruding electrodes 3 and the pitch between the protruding electrodes are 100 μm.

  The top view of the adhesive tape sticking apparatus is shown by FIG.

  This adhesive tape sticking apparatus is composed of a substrate supply / recovery unit 1, a first substrate transport mechanism 2, an alignment mechanism 3, an adhesive tape sticking mechanism 4, a separator peeling mechanism 5, a support plate sticking mechanism 6, and the like. Hereinafter, each configuration will be described in detail.

  Two cassettes C1 and C2 are placed on the substrate supply / recovery unit 1. In one cassette C1, a large number of wafers W are inserted and stored in multiple stages in a horizontal posture. In the other cassette C2, the wafer W to which the reinforcing support plate G is bonded and the support plate G before bonding are inserted and stored in multiple stages in a horizontal posture. The support plate G is formed of, for example, a glass substrate having the same shape as the wafer W or stainless steel. The wafer W is stored with the circuit surface facing upward.

  The first substrate transport mechanism 2 includes a robot arm 7. The robot arm 7 moves horizontally by a movable table. The robot arm 7 itself is configured to be able to move forward and backward horizontally, and can be turned and raised as a whole. The tip of the robot arm 7 is provided with a horseshoe-shaped vacuum suction type substrate holder.

  The alignment mechanism 3 detects an alignment mark such as a notch formed on each outer periphery while rotating the wafer W and the back surface of the support plate G with the suction pad moving forward and backward from the holding surface. Thereafter, the alignment mechanism 3 aligns the wafer W and the support plate G based on the detection result.

  As shown in FIG. 2, the adhesive tape attaching mechanism 4 includes a holding table 8, a double-sided adhesive tape supply mechanism 9, a cutting mechanism 10, a dancer roller 11, an unnecessary tape collecting mechanism 12, a separator peeling mechanism 13, a separator collecting mechanism 14, and an attaching mechanism. 15 or the like.

  The holding table 8 is a chuck table that holds the back surface of the wafer by suction. The holding table 8 is configured to move along a guide rail laid at a position where the wafer W is received from the robot arm 7 and a pasting position where a double-sided adhesive tape piece ta to be described later is pasted. The holding table 8 is provided with an air permeable elastic sheet on the surface.

  The double-sided pressure-sensitive adhesive tape supply mechanism 9 includes a bobbin for mounting an original fabric roll on which the double-sided pressure-sensitive adhesive tape T is wound. The double-sided pressure-sensitive adhesive tape supply mechanism 9 guides the double-sided pressure-sensitive adhesive tape T fed from the raw roll to a predetermined conveyance path while applying a predetermined tension to the double-sided pressure-sensitive adhesive tape T via the dancer roller 11, and a cutting mechanism 10. Then, the separator peeling mechanism 13 is supplied. The double-sided pressure-sensitive adhesive tape T has separators S attached to the front and back surfaces.

  In the cutting mechanism 10, a cutting roller 16 and a receiving roller 17 that are synchronously driven are arranged vertically opposite to each other. As shown in FIG. 3, the cutting roller 16 is configured by mounting a sheet 19 on which a cutting blade 18 is formed on a driving roller 20. The cutting blade 18 is formed in an annular shape for cutting the double-sided adhesive tape T into a circle.

  The receiving roller 17 is a metal driving roller. Note that at least one of the cutting roller 16 and the receiving roller 17 is configured to be moved up and down by a drive cylinder. Therefore, the setting of the gap between the rollers 16 and 17 can be changed according to the thickness of the double-sided adhesive tape T.

  The unnecessary tape collecting mechanism 12 peels off the unnecessary double-sided adhesive tape T ′ cut and connected to the circular double-sided adhesive tape piece ta on the separator S on the back side from the separator S immediately after the feed roller 21 to collect the recovery bobbin. 22 is configured to wind up. Therefore, the separator S in which the double-sided adhesive tape piece ta is left is guided to the separator peeling mechanism 13.

  The separator peeling mechanism 13 includes a peeling member 23. The peeling member 23 has a flat surface that can hold the double-sided adhesive tape piece ta horizontally. Further, the tip of the peeling member 23 has a tapered taper, and the separator S is folded back at the tip and guided to the separator collecting mechanism 14, and the double-sided adhesive tape piece ta is fed forward while peeling.

  The pasting mechanism 15 includes a pasting roller 25. The sticking roller 25 presses and sticks the tip of the double-sided adhesive tape piece ta fed from the peeling member 23 against the wafer W held on the holding table 8.

  The second substrate transport mechanism 26 sucks and holds the surface of the wafer W to which the double-sided adhesive tape piece ta is attached. That is, a suction plate 27 that can be moved up and down is provided on a movable base that moves along rails laid on the apparatus frame.

  As shown in FIG. 4, the separator peeling mechanism 5 includes a tape supply unit 30, a holding table 31, a peeling roller 32, and a tape collection unit 33.

  The tape supply unit 30 has a bobbin loaded with a raw roll of a release tape PE that is narrower than the diameter of the double-sided adhesive tape piece ta. The peeling tape PE fed out from the tape supply unit 30 is guided to the peeling roller 32.

  As shown in FIG. 5, the holding table 31 is housed in the lower housing 45B among the upper and lower upper housings 45A and 45B constituting the chamber 45 of the support plate laminating mechanism 6 described later.

  The holding table 31 is laminated on the surface in the order of the first support member 34 and the second support member 35. The first support member 34 is made of an elastic sheet such as silicon rubber.

  As shown in FIG. 6, the second support member 35 is configured by an annular plate cut out in an outer ring shape of the convex region 36 of the circuit pattern of the wafer W. As shown in FIG. 7, the second support member 35 is set to have a thickness larger than the diameter of the wafer W and equal to or less than the height of the bump 37. That is, when the recessed area 38 where the bumps 37 on the outer periphery of the wafer are not formed is in contact with the second support member 35, the tips of the bumps 37 are in contact with the first support member 34. The second support member 35 is formed of a hard member such as PET (polyethylene terephthalate).

  The first support member 34 and the second support member 35 are formed with a plurality of pin holes 39a and 39b, and the support pins 40 standing on the holding table 31 are engaged with the pin holes 39a and 39b. To do.

  The lower housing 45B is configured to reciprocate between the separation position of the separator and the lower portion of the upper housing 45A along the guide rail 41 with the holding table 31 stored.

  The peeling roller 32 is configured to be movable up and down by an air cylinder. That is, the release tape PE is attached to the separator S attached to the surface of the double-sided adhesive tape piece ta on the holding table 31.

  The tape recovery unit 33 winds and recovers the release tape PE to which the separator S is attached in synchronization with the feeding of the release tape PE by the tape supply unit 30 and the release speed of the separator S.

  As shown in FIG. 5, the pasting mechanism 15 includes a chamber 45, a pasting mechanism 46, and the like.

  The chamber 45 includes a pair of upper and lower upper housings 45A and a lower housing 45B.

  The upper housing 45 </ b> A is provided in the lift drive mechanism 47. The elevating drive mechanism 47 includes a movable base 50 that can be moved up and down along a rail 49 that is arranged vertically on the back of the vertical wall 48, a movable frame 51 that is supported by the movable base 50 so that the height can be adjusted, and the movable frame An arm 52 extending forward from 51 is provided. An upper housing 45B is mounted on a support shaft 53 that extends downward from the tip of the arm 52.

  The movable table 50 is screwed up and down by rotating the screw shaft 57 forward and backward by a motor 58. A push plate 59 that can be raised and lowered is housed inside the upper housing 45A.

  The adhesive tape attaching apparatus according to the present invention is configured as described above. With reference to FIG. 8 to FIG. 12, the operation of attaching the double-sided pressure-sensitive adhesive tape T to the wafer W using the pressure-sensitive adhesive tape attaching device and the operation of attaching the support plate G to the wafer W via the double-sided pressure-sensitive adhesive tape piece ta will be described. explain.

  First, the initial installation is performed. For example, the first support member 34 and the second support member 35 are set on the holding table 31. When the initial setting is completed, the device is activated.

  The robot arm 7 inserts the front end between the wafers W of the cassette C1, and carries out the wafer W by suction holding from the back surface. The robot arm 7 delivers the wafer W to the suction pad protruding from the holding surface of the alignment mechanism 3. The alignment mechanism 3 obtains and aligns the center position based on an alignment mark such as a notch formed on the wafer W while the wafer W is sucked by the suction pad. When the alignment is completed, the wafer W lifted from the suction surface by the suction pad is again sucked by the robot arm 7 and placed on the holding table 8.

  The holding table 8 moves to the attaching position of the adhesive tape attaching mechanism 4 while holding the wafer W by suction.

  Simultaneously with the start of operation of the apparatus, the adhesive tape attaching mechanism 4 is also interlocked. The adhesive tape pasting mechanism 4 feeds and supplies a belt-like double-sided adhesive tape T. The double-sided pressure-sensitive adhesive tape T with separators S on both sides is a circular double-sided pressure-sensitive adhesive sheet on the separator S on the back surface side by the cutting roller 16 that is rotated in the course of passing between the cutting roller 16 and the receiving roller 17 of the cutting mechanism 10. Half cut into pieces ta.

  The half-cut double-sided adhesive tape T is sent to the unnecessary sheet collecting unit 12 via the dancer roller 11. In this process, the unnecessary sheet collecting unit 12 peels off the unnecessary double-sided adhesive tape T ′ after cutting out the double-sided adhesive tape piece ta by the feed roller 21, and winds and collects it on the collection bobbin 22.

  The separator S on the back side where the double-sided adhesive tape piece ta is left is sent to the separator peeling mechanism 13. When the double-sided pressure-sensitive adhesive tape piece ta reaches the peeling position, the separator peeling mechanism 13 moves the holding table 8 in the conveyance direction of the double-sided pressure-sensitive adhesive tape T in synchronization with the feeding speed of the double-sided pressure-sensitive adhesive tape T.

  At this time, when the double-sided adhesive tape piece ta peeled from the separator S is fed out from the tip of the peeling member 23, as shown in FIGS. 8 and 9, the wafer W on the holding table 8 waiting at the affixing position. The pasting roller 25 is lowered and pasted toward the end portion. Thereafter, by moving the holding table 8 in synchronization with the conveyance speed of the double-sided adhesive tape T, the sticking roller 25 rolls on the double-sided adhesive tape piece ta that is peeled from the separator S at the same speed. Therefore, the sticking roller 25 sticks the double-sided adhesive tape piece ta on the entire surface of the wafer W. At this time, the double-sided adhesive tape piece ta is not in close contact with the concave region of the wafer W.

  When the application of the double-sided adhesive tape piece ta is completed, the holding table 8 moves to the delivery position of the second substrate transport mechanism 26. The second substrate transport mechanism 26 sucks and holds the surface of the wafer W and places the wafer W on the holding table 31 on the separator peeling mechanism 5 side.

  At this time, in the wafer W, the convex region 36 of the bump 37 is supported by the first support member 34, and the concave region 38 is supported by the second support member 35.

  When the wafer W is placed and held on the holding table 31, the peeling roller 32 descends to one end side of the double-sided adhesive tape piece ta, and the peeling tape PE is attached. Thereafter, as shown in FIG. 10, the separation table 31 is moved, and the separator integrated with the separation tape PE by the tape recovery unit 33 while supplying the separation tape PE from the tape supply unit 30 in synchronization with the moving speed. S is wound up and collected.

  When the separation of the separator S from the double-sided adhesive tape piece ta is completed, the holding table 31 moves to the lower side of the upper housing 45A.

  In addition, while the double-sided adhesive tape piece ta is affixed to the wafer W, the support plate G is unloaded from the cassette C2 by the robot arm 7 and aligned by the alignment mechanism 3. The support plate G that has been aligned is sucked and held by the robot arm 7 and transferred to the pressing plate 59 provided in the upper housing 45A. The pressing plate 59 stands by until the wafer W is transferred while holding the supporting plate G by suction.

  When the holding table 31 reaches below the upper housing 45, as shown in FIG. 11, the upper housing 45A is lowered, and the lower housing 45B is attached to form the chamber 45.

  After reducing the pressure inside the chamber 45 to a predetermined pressure, the pressing plate 59 is lowered and the support plate G is attached to the double-sided adhesive tape piece ta. At this time, since the height of the second support member 35 is slightly lower than the height of the bump 37, the tip of the bump 37 is pressed against the first support member 34. However, when the predetermined load is reached, as shown in FIG. 12, the lowering of the pressing plate 59 is restricted by the second support member 35 supporting the recessed area 38 of the wafer W, and the load applied to the bumps 37 is reduced. It is absorbed by elastic deformation of the first support member 34. Therefore, the load applied to the concave region 38 is equal to or greater than the load applied to the convex region 36. In other words, the load P1 applied to the convex region 36 and the load applied to the concave region 38 have a relationship of P1 ≦ P2.

  When the supporting plate G is pressed against the double-sided adhesive tape piece ta over the possession time, the inside of the chamber 45 is returned to atmospheric pressure, and the upper housing 45A and the pressing plate 59 are raised and released.

  The tip of the robot arm 7 is inverted so that the suction surface faces downward, and the support plate G is sucked and held and stored in the cassette C2.

  The series of processes is completed as described above, and the above processes are repeated until a predetermined number of processes are completed.

  According to the above-described embodiment apparatus, the support plate G is bonded to the wafer W while the concave region 38 is supported by the second support member 35 that is harder than the first support member 34 that supports the convex region 36 of the wafer W. The double-sided adhesive tape piece ta can be brought into close contact with the recessed area 38 of the wafer W. Accordingly, it is possible to prevent contaminated water and dust from entering the adhesive interface between the double-sided adhesive tape piece ta and the wafer W.

  In addition, this invention can also be implemented with the following forms.

  (1) In the above embodiment, as shown in FIG. 13, the first support member 34 is placed on the second support member 35 after the second support member 35 is placed on the holding table 31. It may be. In this case, the first support is based on the relationship between the height of the bump 37 and the elastic modulus of the first support member 34 so that the load P1 applied to the convex region 36 and the load applied to the concave region 38 satisfy the relationship P1 ≦ P2. The thicknesses of the member 34 and the second support member 35 are appropriately set. Due to this relationship, as shown in FIG. 14, the first support member 34 is pushed into the cutout of the second support member 35 while being elastically deformed by the bumps 37. Therefore, excessive pressing applied to the bumps 37 is absorbed. The concave region 38 supported by the second support member 35 is hard to elastically deform the second support member 35, so that the load by the pressing plate 59 is larger than that of the convex region 36. Therefore, the double-sided pressure-sensitive adhesive tape T can be brought into close contact with the concave region 38 with high accuracy.

  (2) In the above embodiment, the support plate G may be an annular shape having an inner diameter cut out in a circle.

  (3) In the above embodiment, a heater may be embedded in the pressing plate 59 that presses the support plate G, and the support plate G may be bonded to the wafer W while heating.

  (4) In the above embodiment, a heater may be embedded in the pressing plate 59 that presses the support plate G, and the support plate G may be bonded to the wafer W while heating.

(5) Although the circular wafer W has been described as an example in the above embodiment, the present invention can also be applied to a square substrate in which LEDs are formed in a two-dimensional array. In this case, what is necessary is just to comprise the 2nd supporting member which supports the recessed area | region of the outer periphery in which LED is not formed in the cyclic | annular form cut out along the outer ring | wheel of a convex area | region.
(6) When the back surface of the wafer is flat and has a convex region only on the front surface, or when there is no convex region such as a bump on the back surface, the following configuration may be adopted.

  For example, as shown in FIG. 15, the outer peripheral portion 70 of the holding table 31 </ b> A that supports the back surface side of the concave region 38 is made of a hard member such as a metal or ceramic porous, and is in contact with the back surface side of the convex region 36. The part is supported through an elastic body 71 having air permeability. The outer peripheral member 70 corresponds to the second support member of the present invention, and the elastic body 71 corresponds to the first support member of the present invention.

  According to this configuration, when a load is applied to the convex region 36, the elastic body 71 is elastically deformed to reduce the load. Since the outer peripheral portion 70 that supports the concave region 38 is not elastically deformed, a load greater than the convex region 36 is applied. Therefore, the same effect as the above configuration can be obtained.

4 ... Adhesive tape pasting mechanism 6 ... Robot arm 7
DESCRIPTION OF SYMBOLS 8 ... Holding table 15 ... Pasting mechanism 25 ... Pasting roller 31 ... Holding table 34 ... 1st support member 35 ... 2nd support member 36 ... Convex area | region 37 ... Bump 38 ... Concave area 45 ... Chamber 59 ... Pressing plate W ... Semiconductor wafer T ... Double-sided adhesive tape ta ... Double-sided adhesive tape piece

Claims (7)

An adhesive tape attaching method for attaching an adhesive tape to a substrate having irregularities,
Supporting at least the convex region of the irregularities by a first support member having elasticity,
A concave region on the outer periphery of the substrate is supported by an annular second support member that is harder than the first support member;
An adhesive tape attaching method, comprising: attaching an adhesive tape to a substrate supported by the first support member and the second support member. In the adhesive tape sticking method of Claim 1,
The substrate has bumps on the back surface,
Placing and holding the first support member, which is an elastic sheet, on a holding table;
On the first support member, the second support member having the same height as the bump is placed and held,
An adhesive tape attaching method, comprising: attaching an adhesive tape in a state where a substrate is placed on the second support member. In the adhesive tape sticking method of Claim 1,
The substrate has bumps on the back surface,
Placing and holding the second support member on a holding table;
Placing and holding the first support member, which is an elastic sheet, on the second support member;
When the substrate is placed on the first support member and the adhesive tape is attached, the first support member and the second support member are such that the pressure acting on the concave region is equal to or greater than the pressure acting on the convex region. The adhesive tape affixing method characterized by adjusting the thickness of.
An adhesive tape attaching device for attaching an adhesive tape to a substrate having irregularities,
A first support member for supporting at least a convex region of the irregularities with elasticity;
A second support member that is harder than the first support member that supports the concave region on the outer periphery of the substrate;
An adhesive tape attaching apparatus comprising: an adhesive mechanism for attaching an adhesive tape to a substrate placed on the first support member and the second support member. In the adhesive tape sticking device according to claim 4,
The first support member is an elastic sheet,
A pressure-sensitive adhesive tape applying apparatus comprising: a holding table that stacks and arranges the first support member and the second support member. In the adhesive tape sticking device according to claim 5,
Placing the first support member on the holding table;
A pressure-sensitive adhesive tape pasting apparatus comprising: a second support member having a height equal to a height of a bump which is a convex portion formed on the back surface of the substrate. In the adhesive tape sticking device according to claim 5,
Placing the second support member on the holding table;
Placing a substrate on the first support member;
The pressure-sensitive adhesive tape pasting device is characterized by adjusting the thicknesses of the first support member and the second support member so that the pressure acting on the concave region is equal to or greater than the pressure acting on the convex region.

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