JP6298381B2 - Substrate laminating method and substrate laminating apparatus - Google Patents

Description

  The present invention relates to a substrate bonding method and a substrate bonding apparatus in which a reinforcing support plate is bonded to various substrates such as a semiconductor wafer, a glass substrate, and a circuit substrate via a double-sided adhesive tape.

  A semiconductor wafer (hereinafter simply referred to as a “wafer”) is formed by forming a large number of elements on the wafer, then shaving the back surface of the wafer in a back grinding process, and then cutting it into individual elements in a dicing process. However, in recent years, with the demand for high-density mounting, the wafer thickness tends to be reduced from 100 μm to 50 μm, and further to about 25 μm.

  Such thinly back-ground wafers are not only fragile, but are often distorted, resulting in extremely poor handling.

  Therefore, a method for reinforcing a wafer by bonding a rigid substrate such as a glass plate to the wafer via a double-sided adhesive tape has been proposed and implemented.

  Specifically, a wafer having an adhesive tape affixed to the upper surface is placed on and fixed to a holding table, and a base made of a reinforcing glass plate or the like is tilted to the upper end of the base support section above the wafer. The base is attached to the semiconductor wafer by moving the press roller to the surface of the base held tilted and lowering the base support in accordance with the movement. (For example, see Patent Document 1).

JP 2000-349136 A

  However, the conventional method has the following disadvantages.

  When bonding a wafer and a glass plate through a double-sided pressure-sensitive adhesive tape, it is necessary to apply it to either the wafer or the glass plate in advance. That is, the application of the double-sided adhesive tape and the bonding of the wafer and the glass plate must be performed in separate processes, resulting in a disadvantage that the processing process and the apparatus are increased in size.

  Further, when the glass plate is bonded after the double-sided pressure-sensitive adhesive tape is first bonded to the wafer, there is a problem in that the wafer is damaged because excessive pressing is applied twice to the wafer having irregularities on the surface.

  Further, when the wafer surface has irregularities, it becomes easy for air bubbles to be caught in the adhesive interface between the wafer and the double-sided pressure-sensitive adhesive tape. Therefore, when backside grinding is performed with air bubbles entrained in the bonding interface, there is a problem that the thickness of the wafer varies, or water or dust during grinding enters the interface and damages the circuit. .

  This invention is made | formed in view of such a situation, Comprising: While mainly reducing an apparatus, it is providing the board | substrate bonding method and board | substrate bonding apparatus which can paste a support plate and a board | substrate accurately. Objective.

In order to achieve such an object, the present invention has the following configuration.
That is, a substrate laminating method for laminating a reinforcing support plate to a substrate via a double-sided adhesive tape,
A substrate is held in one of a holding table arranged in one of a pair of housings constituting the chamber and a holding unit arranged in the other, and a support plate is held on the other to be opposed.
A first pasting step of pasting a double-sided adhesive tape larger than the outer shape of the housing on one joint of the housing;
After the double-sided pressure-sensitive adhesive tape is sandwiched and joined by the pair of housings, one of the spaces including the substrate or the support plate disposed in close proximity to the pressure-sensitive adhesive surface of the double-sided pressure-sensitive adhesive tape has a lower atmospheric pressure than the other space. While the second pasting process of pasting the double-sided adhesive tape,
After the second pasting process, a third pasting process in which either the holding table or the holding unit is moved so as to relatively approach and the substrate or the support plate is pasted on the double-sided adhesive tape;
The process of opening the chamber after bonding the support plate and the substrate, cutting the double-sided adhesive tape along the outer shape of the support plate and the substrate,
It is provided with.

  (Operation / Effect) According to this method, the chamber is configured in a state where the double-sided adhesive tape is attached to the joint portion of the housing. That is, the space in the chamber is divided into two by the double-sided adhesive tape. At this time, a support plate and a board | substrate are opposingly arranged on both sides of a double-sided adhesive tape. By making one space lower than the other space in this state, the double-sided adhesive tape is radially attached from the center of the substrate or the support plate while being curved. When the attachment of one side of the double-sided pressure-sensitive adhesive tape to the substrate or the support plate is completed, the other surface of the double-sided pressure-sensitive adhesive tape is attached to the support plate or substrate by bringing the holding part and the holding table relatively close to each other.

  Therefore, if no wrinkles or the like are generated on the double-sided pressure-sensitive adhesive tape, the substrate and the support plate can be accurately bonded without damaging irregularities on the substrate surface due to excessive pressing. In addition, air bubbles can be degassed from the recesses on the substrate surface by the pressure reducing action, and the pressure-sensitive adhesive can be brought into close contact with the uneven shape on the substrate surface.

  Furthermore, since the double-sided pressure-sensitive adhesive tape can be attached and the support plate and the substrate can be attached at the same location in the chamber, the apparatus can be miniaturized and the installation area can be reduced.

  In the said method, it is preferable that a 1st sticking process can peel and collect | recover a separator, sticking a double-sided adhesive tape on the junction part of a housing with a sticking member.

  In this case, the application of the double-sided pressure-sensitive adhesive tape to the joint portion of the housing and the bonding of the support plate and the substrate can be automated.

  In addition, in either a 2nd sticking process or a 3rd sticking process, when a double-sided adhesive tape is affixed on a board | substrate or a support plate, it is preferable to affix while a double-sided adhesive tape is heated with a heater.

  According to this method, since the pressure-sensitive adhesive and the base material constituting the double-sided pressure-sensitive adhesive tape can be softened by heating, the double-sided pressure-sensitive adhesive tape is easily deformed. As a result, the double-sided pressure-sensitive adhesive tape can be brought into close contact with a substrate having irregularities with high accuracy.

  The present invention has the following configuration in order to achieve such an object.

That is, a substrate laminating apparatus that bonds a reinforcing support plate to a substrate via a double-sided adhesive tape,
A holding table that holds either the support plate or the substrate;
A holding portion that holds the other support plate or substrate facing the holding table;
A chamber in which a holding table is stored in one of a pair of housings, and a holding part is stored in the other housing;
A tape supply unit for supplying a double-sided adhesive tape larger than the outer shape of the housing;
Affixing a double-sided adhesive tape to one joint of the housing, and a tape attaching mechanism for peeling and collecting the separator attached to the double-sided adhesive tape;
A pressure control unit for causing a pressure difference in two spaces in the chamber partitioned by the double-sided adhesive tape and attaching the double-sided adhesive tape to one of the substrate or the support plate;
A driving mechanism for attaching the other support plate or substrate to the double-sided adhesive tape by relatively approaching the holding table and the holding unit;
A cutting mechanism for cutting the double-sided adhesive tape along the outer shape of the support plate;
A peeling mechanism for peeling the double-sided adhesive tape cut out in the shape of the support plate;
A tape recovery unit for recovering the double-sided adhesive tape after peeling;
It is provided with.

  (Operation / Effect) According to this apparatus, the double-sided adhesive tape can be automatically attached to the joint portion of the housing, and the substrate and the support plate can be attached in the chamber. Therefore, the above method can be suitably performed.

  In addition, in the said apparatus, it is preferable to provide a heater in at least one of a holding table or a holding part.

  According to this configuration, the pressure-sensitive adhesive and the base material constituting the double-sided pressure-sensitive adhesive tape are softened by heating and easily deformed. Therefore, the double-sided pressure-sensitive adhesive tape can be brought into close contact with the substrate having irregularities with high accuracy.

  According to the substrate bonding method and the substrate bonding apparatus of the present invention, the bonding process of the double-sided adhesive tape to the substrate or the support plate at the same location in the chamber and the process of bonding the substrate and the support plate via the double-sided adhesive tape It can be performed. Therefore, the apparatus can be reduced in size. Also, when the double-sided adhesive tape is attached to the substrate with a pressure difference between the two spaces formed in the chamber by the double-sided adhesive tape, compared to the case where the double-sided adhesive tape is attached using a member such as a roller. Excessive pressing does not work. Therefore, a double-sided adhesive tape can be affixed without damaging the irregularities formed on the substrate.

It is a front view which shows the whole board | substrate bonding apparatus. It is a top view which shows the whole board | substrate bonding apparatus. It is a front view which shows the structure of the chamber with which the rotation drive mechanism was equipped. It is a front view which shows a chamber and a raising / lowering drive structure. It is a longitudinal cross-sectional view which shows the structure of a chamber. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus.

  An embodiment of the present invention will be described below with reference to the drawings. In this embodiment, a case where a reinforcing support plate is bonded to a circuit forming surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) via a double-sided adhesive tape will be described as an example.

  FIG. 1 is a front view showing an entire configuration of a substrate bonding apparatus according to one embodiment of the present invention, and FIG. 2 is a plan view of the substrate bonding apparatus.

  The substrate bonding apparatus includes a wafer / support plate supply / collection unit 1, a transport mechanism 2, an alignment stage 3, a tape supply unit 4, a bonding unit 5, a tape cutting mechanism 6, a chamber 7, a pressure unit 8, a peeling unit 9, and A tape recovery unit 10 and the like are provided. Hereinafter, a specific configuration of each of the structural units and mechanisms will be described.

  Two cassettes C 1 and C 2 are placed in parallel on the wafer / support plate supply / recovery unit 1. A large number of wafers W are inserted and stored in multiple stages in one of the cassettes C1 and C2 in a horizontal posture with the circuit forming surface (surface) facing upward.

  A number of support plates G are inserted and stored in multiple stages in the other cassette C1. The support plate G may have the same shape as the wafer W and the same size or more. The support plate G is made of a glass substrate or stainless steel.

  The transport mechanism 2 includes a robot arm 11. The robot arm 11 is configured to be capable of moving forward and backward horizontally, and is capable of turning and moving up and down as a whole. The tip of the robot arm 11 is provided with a horseshoe-shaped vacuum suction holding unit. The holding unit is inserted into a gap between the wafers W or the support plates G housed in multiple stages in the cassette C1 or the cassette C2, and sucks and holds the wafers W or the support plates G from the back surface. The wafer W or the support plate G held by suction is pulled out of the cassette C1 or C2, and is conveyed in the order of the alignment stage 3, the pressure member 61, the holding table 37, and the wafer / support plate supply / collection unit 1.

  The alignment stage 3 sucks and holds the wafer W or the support plate G carried in by the transport mechanism 2 with a suction pad, and detects notches and orientation flats formed on the outer periphery of the wafer W or the support plate G while turning. Thereafter, the alignment stage 3 performs alignment based on the detection result.

  As shown in FIG. 1, the tape supply unit 4, the pasting unit 5, the first separator collection unit 12, and the cutting unit 24 are mounted on the same vertical plate 14. The vertical plate 14 moves horizontally along the upper frame 16 via the movable table 15.

  In the tape supply unit 4, a wide double-sided adhesive tape T wound in rolls is loaded in a supply bobbin 17. The double-sided pressure-sensitive adhesive tape T with separators s1 and s2 fed out from the supply bobbin 17 is guided around the guide roller group and guided to the affixing unit 5. Further, the supply bobbin 17 is provided with an appropriate rotational resistance so that excessive tape feeding is not performed.

  The first separator collecting unit 12 is configured such that a collecting bobbin 19 that takes up the separator s1 peeled from the back surface of the double-sided adhesive tape T by the peeling roller 20 is rotationally driven in the winding direction.

  As shown in FIG. 3, the affixing unit 5 includes an affixing roller 21 and a second separator recovery unit 22. The pasting unit 5 corresponds to the tape pasting mechanism of the present invention.

  The affixing roller 21 is rotatably supported and affixes the double-sided adhesive tape T to a joint portion 72 of lower housings 33B and 33C described later while pressing and rolling the surface of the double-sided adhesive tape T with the separator s2. .

  The second separator collecting unit 22 peels and collects the separator s2 from the surface of the double-sided pressure-sensitive adhesive tape T attached to the joint part 72 of the housings 33B and 33C. That is, after the second separator s2 wound around the pasting roller 21 and peeled from the other adhesive surface of the double-sided adhesive tape T is guided by the guide roller and guided between the pair of upper and lower pinch rollers 23, It is wound and collected by a collection bobbin 24 driven by a motor.

  The cutting unit 25 includes a movable base 26 that moves along a frame f provided on the front side of the sticking roller 21, and a cutter 27 below the movable base 26 via a cutter holder. That is, the cutting unit 25 cuts the double-sided adhesive tape T in the width direction.

  As shown in FIGS. 1 and 2, the tape cutting mechanism 6 is cut by a support arm 30 that extends in the radial direction at the lower end of the tip of an arm that is cantilevered from a movable base 29 that can be moved up and down along a vertical frame 28. A unit 31 is provided. The cutter unit 31 is mounted with a cutter 32 having a blade edge downward through a cutter holder. In addition, the cutter unit 31 can adjust the turning radius via the support arm 30. The tape cutting mechanism 6 corresponds to the cutting mechanism of the present invention.

  The chamber 7 is constituted by a pair of upper and lower housings having an outer shape smaller than the width of the adhesive tape T. In this embodiment, as shown in FIG. 3, one upper housing 33A and two lower housings 33B and 33C are provided.

  The lower housings 33 </ b> B and 33 </ b> C are connected and fixed to a rotation shaft 35 of a rotary drive machine 34 such as a motor, and are provided at both ends of the turning arm 36. That is, for example, when one lower housing 33B forms the upper housing 33A and the chamber 7, the other lower housing 33C is configured to be located at a tape attaching position on the attaching unit 5 side. Further, the upper and lower surfaces of the lower housings 33B and 33C are subjected to mold release processing such as fluorine processing.

  A holding table 37 that can be raised and lowered is provided in the lower housings 33B and 33C. The holding table 37 is connected to a rod 38 that passes through the lower housings 33B and 33C. The other end of the rod 38 is drivingly connected to an actuator 39 made of a motor or the like. Accordingly, the holding table 37 moves up and down in the lower housings 33B and 33C. The holding table 37 includes a suction pad 73 that moves forward and backward from the surface to receive the wafer W. Further, a heater 49 is embedded in the holding table 37.

  As shown in FIG. 4, the upper housing 33 </ b> A is provided in the lift drive mechanism 40. The elevating drive mechanism 40 includes a movable frame 43 that can be moved up and down along a rail 42 that is vertically disposed on the back of a vertical wall 41, a movable frame 44 that is supported by the movable platform 43 so that the height can be adjusted, and the movable frame An arm 45 extending forward from 44 is provided. An upper housing 33 </ b> A is mounted on a support shaft 46 that extends downward from the tip of the arm 45.

  The movable base 43 is moved up and down by screw feed 47 by rotating the screw shaft 47 forward and backward by a motor 48.

  As shown in FIG. 5, the upper and lower housings 33 </ b> A to 33 </ b> C are connected to a vacuum device 51 through a flow path 50. The flow path 50 on the upper housing 33A side includes an electromagnetic valve 52. In addition, a flow path 55 including electromagnetic valves 53 and 54 for opening to the atmosphere is connected to each of the housings 33A to 33C. Further, a flow path 57 including an electromagnetic valve 56 that adjusts the internal pressure once reduced by leakage is connected to the upper housing 33A. The opening / closing operation of the electromagnetic valves 52, 53, 54, and 56 and the operation of the vacuum device 51 are performed by the control unit 60.

  The pressure unit 8 includes a pressure member 61 in the upper housing 33A. The pressure member 61 is a plate having a suction pad on the bottom surface. The shape of the suction pad is not particularly limited, and examples thereof include a concave shape, a flat shape, and a convex shape. Further, the material and hardness of the suction pad are appropriately selected. A cylinder 62 is connected to the upper portion of the pressurizing member and moves up and down in the upper housing 33A. In addition, a heater 63 is incorporated in the pressure member 61. Note that the pressing member 61 corresponds to a holding portion of the present invention.

  As shown in FIGS. 1, 2, and 16, the peeling unit 9 includes a movable table 65 that moves horizontally along the guide rail 64, a fixed receiving piece 66 that moves up and down on the movable table 65, and the fixed receiving piece. 66 and a movable piece 68 that is opened and closed by a cylinder 67 is provided. That is, the peeling unit 9 grips and peels one end side of the unnecessary adhesive tape T ′ cut into the shape of the wafer W by the tape cutting mechanism 6 by the fixed receiving piece 66 and the movable piece 68. The peeling unit 9 corresponds to the peeling mechanism of the present invention.

  The tape recovery unit 10 includes a pair of recovery rollers 69 and a recovery container 70. The collection roller 69 is arranged in parallel on the terminal side in the moving direction of the peeling unit 9 and is driven to rotate by a motor. That is, the cut double-sided pressure-sensitive adhesive tape T conveyed between the collection rollers 69 is rolled into the collection container 70 below and collected.

  Next, a description will be given of a single operation of bonding the support plate G and the wafer W through the double-sided adhesive tape T by the above-described embodiment apparatus.

  First, the robot arm 11 unloads the support plate G from the cassette C <b> 1 and places it on the alignment stage 3. When the alignment of the support plate G is completed on the alignment stage 3, the robot arm 11 holds the support plate G again and moves below the upper housing 33A. At this time, since the pressure member 61 is lowered to the delivery position, the robot arm 11 delivers the support plate G to the pressure member 61. The pressurizing member 61 sucks and holds the support plate G and moves up to the standby position.

  Next, the robot arm 11 unloads the wafer W from the cassette C <b> 2 and places it on the alignment stage 3. When the alignment of the wafer W is completed on the alignment stage 3, the robot arm 11 holds the wafer W again and transports it to the holding table 37 at the tape application position.

  As shown in FIG. 6, the holding table 37 receives the wafer W by pushing up the suction pad 73 higher than the joint 72 that is the top of the lower housing 33 </ b> B. The suction pad 73 that has received the wafer W is lowered, and the wafer W is suction-held by the holding surface of the holding table 37. At this time, the surface of the wafer W is at a position lower than the bonding portion 72.

  As shown in FIG. 7, the sticking unit 5 is moved to the sticking start end to start sticking. The affixing roller 21 of the affixing unit 5 rolls in the direction opposite to the tape running direction while pressing the surface of the double-sided adhesive tape T, and affixes the double-sided adhesive tape T to the joint 72 of the lower housing 33B.

  At this time, the double-sided pressure-sensitive adhesive tape T supplied from the tape supply unit 4 toward the bonding unit 72 is peeled off the separator s1 from the back surface by the peeling roller 20 in the supply process. Thereafter, the recovery bobbin 24 of the second separator recovery unit 22 is driven and controlled in synchronization with the rolling movement of the sticking roller 21. At this time, the separator s2 wound and reversed by the affixing roller 21 and peeled off from the surface of the double-sided adhesive tape T is wound and collected at the same speed as the moving speed of the affixing roller 21, and the upward adhesive surface of the double-sided adhesive tape T is removed. Exposed.

  The pasting unit 5 stops at a position exceeding a predetermined distance from the joining portion 72 on the pasting end side. The cutting unit 25 operates, and the cutter 27 cuts the rear end side of the double-sided adhesive tape T in the width direction as shown in FIGS. 7 and 8 and FIG. 13 to be described later are illustrated by rotating the lower housing 33B on the left side by 90 degrees so that the tape attaching operation by the attaching unit 5 can be easily understood.

  As shown in FIGS. 10 and 11, the rotary drive 34 is operated to pivot the lower housing 33B below the upper housing 33A. At this time, the lower housing 33C attached to the other end side of the swivel arm 36 moves to the tape attaching position.

  As shown in FIG. 12, the upper housing 33A is lowered, and the chamber 7 is formed in a state where the double-sided adhesive tape T is sandwiched in cooperation with the lower housing 33B.

  The control unit 60 operates the heater 49 to heat the double-sided adhesive tape T from the lower housing 33B side, and operates the vacuum device 51 with the electromagnetic valves 53, 54, 56 closed, The inside of the lower housing 33B is depressurized. At this time, the opening degree of the electromagnetic valve 52 is adjusted so that the pressure in the housings 33A and 33B is reduced at the same speed.

  When both housings 33A and 33B are depressurized to a predetermined pressure, the controller 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51.

  The control unit 60 shown in FIG. 5 gradually increases the inside of the upper housing 33A to a predetermined atmospheric pressure while adjusting the opening of the electromagnetic valve 56 to cause leakage. At this time, the atmospheric pressure in the lower housing 33B becomes lower than the atmospheric pressure in the upper housing 33A, and the double-sided adhesive tape T is drawn into the lower housing 33B from the center by the differential pressure, and It is gradually pasted from the center toward the outer periphery. The control unit 60 corresponds to the pressurization control unit of the present invention.

  When the inside of the upper housing 33A reaches the preset atmospheric pressure, the control unit 60 adjusts the opening degree of the electromagnetic valve 54 so that the atmospheric pressure in the lower housing 33B is the same as the atmospheric pressure in the upper housing 33A.

  As shown in FIG. 13, the pressure member 61 holding the support plate G heated by the heater 63 is lowered to a predetermined height, and the support plate G is attached while heating the double-sided adhesive tape T. . This height is set in advance such that the circuit including the bumps is not damaged depending on the thickness of the double-sided adhesive tape T, the height of the bumps on the wafer W, and the like.

  When the bonding process between the support plate G and the wafer W is completed, the control unit 60 raises the upper housing 33A to release the atmosphere in the upper housing 33A, and fully opens the electromagnetic valve 54 to release the atmosphere in the lower housing 33B. To do.

  While the bonding process is being performed in the chamber 7, the robot arm 11 carries out the wafer W from the cassette C2 and holds the wafer W by suction with the holding table 37 in the lower housing 33C, while joining the joint 72 of the lower housing 33C. The double-sided adhesive tape T is affixed to.

  When the bonding process between the wafer W and the support plate G is completed in the chamber 7, the swivel arm 36 is reversed as shown in FIG. That is, one lower housing 33B is moved to the tape applying position on the attaching unit 5 side, and the other lower housing 33C is moved to the joining position below the upper housing 33A.

  As shown in FIG. 15, the tape cutting mechanism 6 is operated, the cutter unit 31 is lowered to a predetermined height, and the cutter 32 is pierced into the double-sided adhesive tape T between the support plate G and the lower housing 33B. In this state, the cutter 32 is run along the outer periphery of the support plate G to cut the double-sided adhesive tape T. At this time, the surface of the double-sided pressure-sensitive adhesive tape T is kept horizontal. When the cutting of the double-sided adhesive tape T is completed, the cutter unit 31 moves up and returns to the standby position. When the double-sided adhesive tape T is cut, the outer periphery of the double-sided adhesive tape T may be held on the lower housing 32 side.

  The peeling unit 9 is moved to the peeling start position. As shown in FIG. 16, both ends of the double-sided adhesive tape T protruding from the lower housing 33 </ b> B are sandwiched between the fixed receiving piece 66 and the movable piece 68. As shown in FIG. 17, after being moved obliquely upward by a predetermined distance in this state, the double-sided adhesive tape PT cut out in a wafer shape is peeled off while being horizontally moved.

  When the peeling unit 9 reaches the tape collecting unit 10, the free end of the double-sided adhesive tape T is inserted between the collecting rollers 69 and collected. The grip is released and the adhesive tape PT is dropped into the collection container 70.

  The wafer W bonded with the support plate G is pushed up by the suction pad 73 and delivered to the robot arm 11. The robot arm 11 stores the wafer W with the support plate sucked and held from the back side in the position of the cassette C2.

  While the adhesive tape PT on the lower housing 33B side is being cut and peeled, the support plate G is delivered by the robot arm 11 and the wafer W and the support plate G are transferred on the lower housing 33C side. The pasting process is performed. Thus, the bonding operation of the wafer W and the support plate G is completed, and thereafter the same processing is repeatedly performed.

  According to the above-described embodiment apparatus, the double-sided adhesive tape T can be attached and the support plate G and the wafer W can be attached at one place in the chamber 7. Therefore, unlike the prior art, it is not necessary to attach the double-sided adhesive tape T to the support plate G or the wafer W in a separate process first, and to attach the support plate G and the wafer W together. Can be simplified.

  Further, when the double-sided adhesive tape T is applied, excessive pressing does not act on the wafer W as in the case where an application member such as an application roller is used. Therefore, the double-sided pressure-sensitive adhesive tape T can be securely attached to the wafer W without damaging the circuit including the bumps on the wafer surface.

  Furthermore, air bubbles can be degassed from the concave portion of the wafer W by the pressure reducing action in the chamber 7, and the pressure-sensitive adhesive can be brought into close contact with the uneven shape on the surface of the wafer W.

  The present invention can also be implemented in the following forms.

  (1) In both the above-described embodiments, the configuration includes the two lower housings 33B and 33C. However, the number of the lower housings may be one. In this case, the lower housing may be swung by the swivel arm 36 as in the above embodiment, or may be configured to slide along a straight rail.

  (2) In the above-described embodiment, the heaters 49 and 63 are provided on both the holding table 37 and the pressure member 61. However, the structure may be provided on either one of them.

DESCRIPTION OF SYMBOLS 4 ... Tape supply part 5 ... Adhering unit 6 ... Tape cutting mechanism 7 ... Chamber 8 ... Pressurizing unit 9 ... Peeling unit 10 ... Tape collection | recovery part 12 ... 1st separator collection | recovery part 21 ... Adhesion roller 22 ... 2nd separator collection | recovery part 25 ... Cutting unit 33A ... Upper housing 33B, 33C ... Lower housing 37 ... Holding table 60 ... Control unit 61 ... Pressure member G ... Support plate T ... Double-sided adhesive tape W ... Semiconductor wafer

Claims (5)

A substrate laminating method for laminating a reinforcing support plate to a substrate via a double-sided adhesive tape,
A substrate is held in one of a holding table arranged in one of a pair of housings constituting the chamber and a holding unit arranged in the other, and a support plate is held on the other to be opposed.
A first pasting step of pasting a double-sided adhesive tape larger than the outer shape of the housing on one joint of the housing;
After sandwiching and joining the double-sided pressure-sensitive adhesive tape between the pair of housings, one of the spaces including the substrate or the support plate disposed in close proximity to and opposite to the pressure-sensitive adhesive surface of the double-sided pressure-sensitive adhesive tape is made to have a pressure higher than that of the other space. A second pasting process for pasting the double-sided adhesive tape while lowering,
After the second pasting process, a third pasting process in which either the holding table or the holding unit is moved so as to relatively approach and the substrate or the support plate is pasted on the double-sided adhesive tape;
The process of opening the chamber after bonding the support plate and the substrate, cutting the double-sided adhesive tape along the outer shape of the support plate and the substrate,
A method of laminating a substrate, comprising: In the substrate bonding method according to claim 1,
The first laminating process is a method of laminating a substrate, wherein the separator is peeled off and collected while the double-sided adhesive tape is adhered to the joint portion of the housing by an adhesive member. In the board | substrate bonding method of Claim 1 or Claim 2,
The substrate laminating method characterized by sticking a double-sided adhesive tape to a board | substrate, heating a double-sided adhesive tape with a heater when either a said 2nd sticking process or a 3rd sticking process affixes a double-sided adhesive tape on a board | substrate. A substrate laminating apparatus for laminating a reinforcing support plate to a substrate via a double-sided adhesive tape,
A holding table that holds either the support plate or the substrate;
A holding portion that holds the other support plate or substrate facing the holding table;
A chamber in which a holding table is stored in one of a pair of housings, and a holding part is stored in the other housing;
A tape supply unit for supplying a double-sided adhesive tape larger than the outer shape of the housing;
Affixing a double-sided adhesive tape to one joint of the housing, and a tape attaching mechanism for peeling and collecting the separator attached to the double-sided adhesive tape;
A pressure control unit for causing a pressure difference in two spaces in the chamber partitioned by the double-sided adhesive tape and attaching the double-sided adhesive tape to one of the substrate or the support plate;
A driving mechanism for attaching the other support plate or substrate to the double-sided adhesive tape by relatively approaching the holding table and the holding unit;
A cutting mechanism for cutting the double-sided adhesive tape along the outer shape of the support plate;
A peeling mechanism for peeling the double-sided adhesive tape cut out in the shape of the support plate;
A tape recovery unit for recovering the double-sided adhesive tape after peeling;
An adhesive tape affixing device characterized by comprising: In the adhesive tape sticking device according to claim 4,
At least one of the holding table or the holding unit is provided with a heater.

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