JP2016078355A - Liquid jet head and liquid jet apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly detect a temperature of a head chip with high accuracy.SOLUTION: A liquid jet head 1 of the invention includes: a head chip A3a having an actuator substrate A5a and a cover plate A6a joined to a surface of the actuator substrate A5a; a head chip B3b having an actuator substrate B5b and a cover plate B6b joined to a surface of the actuator substrate B5b, the head chip B3b in which a rear surface of the actuator substrate B5b is joined to a rear surface of the actuator substrate A5a; a base member 4 which engages with the head chip A3a and the head chip B3b; and a temperature detection element 13 placed at a position of the base member 4 which is located near the cover plate B6b.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus that eject and record liquid droplets on a recording medium.

  In recent years, an ink jet type liquid ejecting head has been used in which ink droplets are ejected onto recording paper or the like to record characters and figures, or a liquid material is ejected onto the surface of an element substrate to form a functional thin film. In this method, a liquid such as ink or a liquid material is guided from a liquid tank to a channel via a supply pipe, pressure is applied to the liquid filled in the channel, and the liquid is discharged from a nozzle communicating with the channel. When discharging the liquid, the liquid ejecting head or the recording medium is moved to record characters and figures, or a functional thin film having a predetermined shape is formed.

  For example, Patent Document 1 describes an inkjet head 100. FIG. 5 is a schematic cross-sectional view of the inkjet head described in Patent Document 1. As shown in FIG. 5, the inkjet head 100 includes an actuator 110 that ejects droplets, a flow path 116 that supplies ink to the actuator 110, and a front end portion on the droplet ejection side of the actuator 110 as a tapered portion 136. A common base member 130 to be mounted, a nozzle plate 112 bonded to the front end surface of the actuator 110 on the droplet discharge side, a sensor 137 fixed to the outer surface of the actuator 110 in the vicinity of the nozzle plate 112, and the common base member 130 The circuit board 117 is held at the rear end, and the flexible board 133 is electrically connected to the actuator 110 and the circuit board 117. In the common base member 130, a tapered portion 136 that functions as a nozzle cap portion and a base portion that holds the circuit board 117 are integrally configured. The tapered portion 136 is filled with a heat conductive resin 160.

  The sensor 137 detects the temperature of the actuator 110. The actuator 110 generates heat by driving, and changes the temperature of the ejected ink. When the temperature of the ink changes, the viscosity of the ink changes, and the ejection speed of the ink droplets ejected from the actuator 110 changes. Since the actuator 110 for ejecting droplets and the recording medium move relative to each other, when the ejection speed of the ink droplets changes, the landing position of the ink droplets changes, and the recording quality deteriorates. Therefore, the temperature information of the actuator 110 is fed back to a drive circuit that generates a drive signal for the actuator 110, and the drive signal is changed according to the temperature of the actuator 110 to prevent the recording quality from being lowered.

  For example, Patent Document 2 describes an inkjet head having a structure in which a first head chip and a second head chip are stacked. The first head chip includes a piezoelectric ceramic plate A and an ink plate A bonded to the surface thereof, and the second head chip includes a piezoelectric ceramic plate B and an ink plate B bonded to the surface thereof. The first head chip and the second head chip are integrally formed by joining the back surfaces of the piezoelectric ceramic plate A and the piezoelectric ceramic plate B together. The first and second head chips that are integrally formed have front end portions on the ink discharge side attached to the opening portion of the nozzle cap. A base is fixed to the nozzle cap, and the base holds the circuit board on the side opposite to the direction in which the ink droplets are ejected.

JP 2009-143210 A JP 2007-50687 A

  As shown in FIG. 5, in the inkjet head 100 of Patent Document 1, a cord drawing chamber 139 that penetrates outward from the tapered portion 136 is formed in the common base member 130. The cord 138 connected to the sensor 137 needs to be pulled out through the cord drawing chamber 139 and connected to the circuit board 117 by drawing the outer surface of the common base member 130. Therefore, the assembly process becomes complicated, and the cord 138 is drawn around the outer surface for a long time, so that it is easy to get noise and the temperature detection accuracy may be lowered. The ink jet head of Patent Document 2 has a structure in which a first head chip and a second head chip are stacked and is suitable for high-density recording, but does not describe temperature detection means of the head chip.

  The liquid jet head of the present invention includes an actuator substrate A, a head chip A having a cover plate A bonded to the surface of the actuator substrate A, an actuator substrate B, and a cover plate B bonded to the surface of the actuator substrate B. A head chip B where the back surface of the actuator substrate B is bonded to the back surface of the actuator substrate A, a base member that engages with the head chip A and the head chip B, and a portion near the cover plate B. And a temperature detecting element located on the base member.

  The head chip A includes a flow path member A that is bonded to the surface of the cover plate A, and the head chip B includes a flow path portion B that is bonded to the surface of the cover plate B.

  In addition, the base member and the flow path part B are made of the same material.

  The actuator substrate A includes a channel A that applies pressure to the liquid, the cover plate A includes a liquid chamber A that communicates with the channel A, and the flow path member A is a flow path that communicates with the liquid chamber A. A, the actuator substrate B includes a channel B that applies pressure to the liquid, the cover plate B includes a liquid chamber B that communicates with the channel B, and the flow path portion B communicates with the liquid chamber B. The flow path B is provided, and the head chip A and the head chip B have communication holes that allow the flow path A and the flow path B to communicate with each other.

  In addition, a circuit board, and a flexible board that electrically connects the circuit board to the head chip A and the head chip B are further provided, and the temperature detection element is the cover plate B of the base member. The temperature detecting element and the circuit board are electrically connected via a lead wiring along the surface of the base member on the cover plate B side.

  The flexible substrate includes a driver IC that generates a drive signal, the base member includes a heat dissipation portion, and the flexible substrate on which the driver IC is located contacts the heat dissipation portion via a heat conductive material. .

  The base member is mounted with the circuit board behind the head chip A and the head chip B.

  Further, the base member is provided with a recess for accommodating the temperature detecting element on the surface of the cover plate B side.

  Further, the base member has a nozzle cap portion for mounting the head chip A and the head chip B.

  The nozzle plate further includes a nozzle plate that adheres to the front end face of the nozzle cap portion, and the nozzle plate is attached to the front end faces of the head chip A and the head chip B.

  The liquid ejecting apparatus according to the aspect of the invention includes the liquid ejecting head, a moving mechanism that relatively moves the liquid ejecting head and the recording medium, a liquid supply pipe that supplies liquid to the liquid ejecting head, and the liquid And a liquid tank for supplying the liquid to the supply pipe.

  The liquid jet head according to the present invention includes an actuator substrate A, a head chip A having a cover plate A bonded to the surface of the actuator substrate A, an actuator substrate B, and a cover plate B bonded to the surface of the actuator substrate B. A head chip B whose back surface is joined to the back surface of the actuator substrate A; a head member that engages with the head chip A and the head chip B; and a temperature that is positioned in the base member near the cover plate B. A detection element. As a result, the temperature of the head chip capable of high-density recording can be quickly detected with high accuracy.

FIG. 3 is an explanatory diagram of a liquid ejecting head according to the first embodiment of the invention. FIG. 6 is a schematic cross-sectional view of a liquid jet head according to a second embodiment of the present invention. FIG. 6 is a schematic exploded perspective view of a liquid jet head according to a second embodiment of the present invention. FIG. 6 is a schematic perspective view of a liquid ejecting apparatus according to a third embodiment of the invention. It is a cross-sectional schematic diagram of a conventionally well-known inkjet head.

(First embodiment)
FIG. 1 is an explanatory diagram of a liquid jet head 1 according to the first embodiment of the present invention. FIG. 1A is a schematic cross-sectional view of the liquid ejecting head 1, and FIG. 1B is a schematic exploded perspective view of the head chip 3. Hereinafter, the discharge direction S in which the liquid jet head 1 discharges droplets is defined as the front, and the opposite direction is defined as the rear. The direction in which the plurality of channels ACa or the plurality of channels BCb are arranged is defined as a reference direction K.

  The liquid jet head 1 includes a head chip A3a, a head chip B3b, a base member 4 that engages with the head chip A3a and the head chip B3b, and a temperature detection element 13 that is positioned on the base member 4. The head chip A3a has an actuator substrate A5a and a cover plate A6a joined to the surface of the actuator substrate A5a. The head chip B3b has an actuator substrate B5b and a cover plate B6b bonded to the surface of the actuator substrate B5b, and the back surface of the actuator substrate B5b is bonded to the back surface of the actuator substrate A5a. The temperature detection element 13 is located on the base member 4 in the vicinity of the cover plate B6b. This will be specifically described below.

  The actuator substrate A5a includes a channel ACa for applying pressure to the liquid, and the cover plate A6a includes a liquid chamber A9a communicating with the channel ACa. The actuator substrate A5a includes a groove Ma extending from the front end of the surface to the front of the rear end. The cover plate A6a is joined to the surface of the actuator substrate A5a so that the surface near the rear end of the actuator substrate A5a is exposed flush with the front end surface FS of the actuator substrate A5a. The groove Ma of the actuator substrate A5a and the cover plate A6a covering the groove Ma constitute the channel ACa. A plurality of channels ACa are arranged in the depth direction (reference direction K) in FIG. 1A, and each channel ACa opens on the front end surface FS of the actuator substrate A5a and the cover plate A6a. The liquid chamber A9a communicates with the rear side of the plurality of channels ACa.

  Similarly to the actuator substrate A5a, the actuator substrate B5b includes a channel BCb that applies pressure to the liquid, and the cover plate B6b includes a liquid chamber B9b that communicates with the channel BCb, similarly to the cover plate A6a. The actuator substrate B5b includes a groove Mb extending from the front end of the surface of the actuator substrate B5b to the front of the rear end. The cover plate B6b is joined to the surface of the actuator substrate B5b so that the surface near the rear end of the actuator substrate B5b is exposed flush with the front end surface FS of the actuator substrate B5b. A channel BCb is constituted by the groove Mb of the actuator substrate B5b and the cover plate B6b covering the groove Mb. A plurality of channels BCb are arranged in the reference direction K, and each channel BCb is opened on the front end face FS of the actuator substrate B5b and the cover plate B6b with a half-pitch deviation from the opening of the channel ACa.

  The back surface of the actuator substrate A5a opposite to the cover plate A6a is opposite to the back surface of the actuator substrate B5b opposite to the cover plate B6b, and the front end surfaces FS of the actuator substrate A5a and the actuator substrate B5b are flush with each other via an adhesive. And join. Thereby, the head chip A3a and the head chip B3b are integrated. The base member 4 includes a nozzle cap portion 4 a having an opening 21 that is elongated in the reference direction K. The nozzle cap portion 4a holds the head chip A3a and the head chip B3b by attaching the front ends of the head chip A3a and the head chip B3b to the opening 21. The front end face FS of the head chip A3a and the head chip B3b integrated with the front end face FS of the nozzle cap portion 4a is flush with the front end face FS. The base member 4 is bonded to the surface of the cover plate B6b opposite to the actuator substrate B5b.

  As shown in FIG. 1B, the head chip A3a and the head chip B3b are provided with a communication hole 19 penetrating the actuator substrate A5a and the actuator substrate B5b at both ends in the reference direction K. The communication hole 19 is connected to the liquid chamber A9a. It communicates with the liquid chamber B9b. Specifically, the communication hole 19 of the actuator substrate A5a is located between a groove row in which the plurality of grooves Ma are arranged and both ends in the reference direction K of the actuator substrate A5a. The communication hole 19 of the actuator substrate B5b is located between the groove row in which the plurality of grooves Mb are arranged and both ends in the reference direction K of the actuator substrate B5b. The liquid chamber A9a of the cover plate A6a is located on the rear side of each groove Ma of the actuator substrate A5a and extends to the position of the communication hole 19 in the reference direction K. Similarly, the liquid chamber B9b of the cover plate B6b is located on the rear side of each groove Mb of the actuator substrate B5b and extends to the position of the communication hole 19 in the reference direction K. The nozzle plate 11 is adhered to the front end surface FS that is flush with the nozzle cap portion 4a, the head chip A3a, and the head chip B3b. The nozzle plate 11 includes a plurality of nozzles 12a and 12b, and the nozzles 12a and 12b communicate with the channel ACa and the channel BCb, respectively. Accordingly, the liquid flowing into the liquid chamber A9a flows into the channel ACa, flows into the liquid chamber B9b through the communication hole 19, and then flows into the channel BCb. The head chip A3a may include a flow path member A that is bonded to the surface of the cover plate A6a, and the head chip B3b may be configured to include the flow path portion B on the surface of the cover plate B6b. In this case, a communication hole 19 that passes through the cover plate A6a, the actuator substrate A5a, the actuator substrate B5b, and the cover plate B6b is installed, and the liquid is supplied from the flow path of the flow path member A to the liquid chamber A9a. The liquid may be supplied from the channel A to the channel of the channel part B and the liquid chamber B9b communicating with the channel via the communication hole 19. In this case, a partition is installed between the liquid chamber A9a of the cover plate A6a and the communication hole 19, and between the liquid chamber B9b of the cover plate B6b and the communication hole 19, respectively.

  The temperature detection element 13 is the surface of the base member 4 on the cover plate B6b side, and is located in the vicinity of the cover plate B6b. The base member 4 includes a circuit board 15 behind the head chip A3a and the head chip B3b. The temperature detection element 13 and the circuit board 15 are electrically connected via the lead wiring 17 along the surface of the base member 4 on the cover plate B6b side. Thereby, the temperature of the head chip 3 can be detected quickly with high accuracy. Moreover, the installation of the lead wiring 17 is easy, and if a metal material is used as the base member 4, the lead wiring 17 can be protected from external electromagnetic noise.

  The actuator substrate A5a and the actuator substrate B5b can use a piezoelectric material, for example, PZT (lead zirconate titanate) ceramics. A plastic material or a ceramic material can be used for the cover plate A6a and the cover plate B6b. If the same material as that of the actuator substrate is used for the cover plate, the linear expansion coefficient is approximated, and the deformation with respect to the temperature change can be minimized. The base member 4 uses a heat conductive plastic material or a metal material such as aluminum. By improving the thermal conductivity of the base member 4, the heat generated from the head chip A3a and the head chip B3b can be quickly diffused.

  Since the nozzle cap portion 4a is configured as an integral body of the same material as the base member 4, the liquid jet head 1 capable of high density recording can be formed without increasing the number of parts. Moreover, since the communication hole 19 is provided between the liquid chamber A9a and the liquid chamber B9b, the liquid may be supplied from either the liquid chamber A9a or the liquid chamber B9b. Therefore, it is sufficient to use one pressure buffer unit (not shown) that relieves fluctuations in the pressure of the liquid to be supplied, and the liquid jet head 1 having a small thickness and a light weight can be configured.

  In this embodiment, the channel ACa and the channel BCb are all constituted by ejection channels that eject droplets. Instead, the ejection channels and the non-ejection channels are alternately arranged in the reference direction K. It may be. In this case, the liquid chamber A9a of the cover plate A6a and the liquid chamber B9b of the cover plate B6b are provided with slits so that the liquid chamber A9a and the liquid chamber B9b communicate only with the discharge channel and not with the non-discharge channel. That's fine. In the present embodiment, the head chip A3a and the head chip B3b are provided with two head chips, but three or more head chips may be stacked.

(Second embodiment)
FIG. 2 is a schematic cross-sectional view of the liquid jet head 1 according to the second embodiment of the present invention. FIG. 3 is a schematic exploded perspective view of the liquid jet head 1 according to the second embodiment of the present invention. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 2, the liquid jet head 1 is positioned on the head chip A3a, the head chip B3b, the base member 4 that engages with the head chip A3a and the head chip B3b, and the base member 4 in the vicinity of the cover plate B6b. And a temperature detecting element 13 for performing the above. The head chip A3a includes an actuator substrate A5a, a cover plate A6a bonded to the surface of the actuator substrate A5a, and a flow path member A8a bonded to the surface of the cover plate A6a. The head chip B3b has an actuator substrate B5b and a cover plate B6b joined to the surface of the actuator substrate B5b. The head chip A3a and the head chip B3b are integrated by joining the back surface of the actuator substrate B5b to the back surface of the actuator substrate A5a. The head chip A3a and the head chip B3b are integrated with the front end surface FS of the actuator substrate A5a and the front end surface FS of the actuator substrate B5b being flush with each other. The base member 4 integrally includes a nozzle cap portion 4a and a flow path portion B4b. The nozzle cap portion 4a attaches and holds the front end portions of the head chip A3a and the head chip B3b to be integrated to the opening portion 21. The flow path part B4b is joined to the surface of the cover plate B6b. In the present embodiment, the flow path part B4b is configured integrally with the base member 4 using the same material as the base member 4, but instead, the flow path part B4b is separated from the base member 4 and the base member 4 is formed. The member 4 may be a separate flow path member.

  Each of the head chip A3a and the head chip B3b includes a channel ACa and a channel BCb that apply pressure to the liquid. The cover plate A6a and the cover plate B6b include a liquid chamber A9a and a liquid chamber B9b communicating with the channel ACa and the channel BCb, respectively. The channel member A8a includes a channel A10a that communicates with the liquid chamber A9a, and the channel unit B4b includes a channel B10b that communicates with the liquid chamber B9b. The nozzle plate 11 is bonded to the front end face FS of the head chip A3a, the head chip B3b, and the nozzle cap portion 4a. Furthermore, the head chip A3a and the head chip B3b include a communication hole 19 that communicates the flow path A10a and the flow path B10b. The liquid supplied to the connecting portion 20 standing on the rear side of the flow path member A8a flows into the channels ACa from the liquid chamber A9a, and further flows into the flow paths B10b and B9b from the communication holes 19 It flows into BCb.

  The base member 4 includes a temperature detection element 13 in the vicinity of the flow path part B4b. Specifically, as shown in FIG. 3, the base member 4 includes a concave portion 14 that houses the temperature detection element 13 on the surface on the cover plate B6b side. The concave portion 14 is located approximately at the center in the reference direction K of the flow path portion B4b and is located on the rear side of the flow path portion B4b. If the temperature detecting element 13 is housed in the concave portion 14, the temperature of the liquid flowing through the flow path portion B4b can be quickly detected with high accuracy. Further, since the recess 14 is close to the head chip A3a and the head chip B3b, which are heat generation sources, a temperature close to the temperature of the liquid actually discharged from the channel ACa and the channel BCb can be detected.

  The base member 4 includes a heat radiating portion 4c on the rear side of the recess 14 and a substrate holding portion 4d on the rear side. The surface of the heat radiating portion 4c on the concave portion 14 side of the base member 4 protrudes in the plate thickness direction. The board holding unit 4d holds the circuit board 15 that is electrically connected to the external control unit via the two holding members 22. That is, the base member 4 mounts the circuit board 15 behind the head chip A3a and the head chip B3b. The temperature detection element 13 is located on the surface of the base member 4 on the cover plate B6b side. The temperature detection element 13 and the circuit board 15 are electrically connected via a lead wiring 17 along the surface of the base member 4 on the cover plate B6b side. Since the recess 14 side of the base member 4 and the connection side of the circuit board 15 face the same side, the temperature detecting element 13 and the lead wiring 17 can be easily installed in the recess 14 and the circuit board 15. If a metal material is used as the base member 4, the lead wiring 17 can be protected from external electromagnetic noise.

  The liquid ejecting head 1 further includes a flexible substrate 16 that electrically connects the circuit board 15 and the head chip A3a and the head chip B3b. The flexible substrate 16 includes a driver IC 18 that generates drive signals for driving the channels ACa and BCb. Specifically, the flexible substrate B16b has a front end connected to the surface near the rear end of the actuator substrate B5b, and an extended portion 16x extending from the rear side is connected to the circuit board 15. The flexible substrate A16a has a front end connected to the surface near the rear end of the actuator substrate A5a and a rear side connected to the flexible substrate B16b. The flexible board B16b holds four driver ICs 18 on the rear side of the flexible board A16a. The flexible substrate B16b in the region where the driver IC 18 is located is in contact with the heat radiating portion 4c via a heat conductive material (not shown).

  The heat sink 23 is in contact with the surface of the four driver ICs 18 opposite to the flexible substrate B16b. (The heat sink 23 is omitted in FIG. 3). The heat sink 23 engages with the base member 4 so as to press the four driver ICs 18 toward the heat radiating portion 4c. As a result, the heat generated by the driver IC 18 is dissipated to both the front and back sides of the driver IC 18. If a metal material is used for the heat sink 23 and the base member 4, the flexible substrate B16b, the flexible substrate A16a, and the driver IC 18 can be protected from external electromagnetic noise.

  The flexible substrate B16b is electrically connected to the circuit board 15 and acquires an image signal from the circuit board 15. The driver IC 18 generates a drive signal for driving the channel ACa and the channel BCb from the image signal. The flexible substrate B16b is electrically connected to the actuator substrate B5b and supplies a drive signal to the channel BCb. The flexible substrate A16a electrically connects the flexible substrate B16b and the actuator substrate A5a, and supplies a drive signal to the channel ACa.

  As described above, the flow path part B4b is installed in the base member 4 and is configured as an integral body of the same material as the nozzle cap part 4a, so that the liquid jet head 1 capable of high-density recording without increasing the number of parts is configured. can do. Further, since the thickness direction when the liquid ejecting heads 1 are erected in a partition is thin, a plurality of liquid ejecting heads 1 can be mounted with high density. Further, since the liquid flows in from one connecting portion 20, it is sufficient to use one pressure buffer unit (not shown) for reducing the pressure fluctuation of the liquid, and the thickness of the liquid jet head 1 is reduced and the weight is reduced. be able to.

  In this embodiment, the temperature detection element 13 is housed in the recess 14. However, the temperature detection element 13 may be fixed in the vicinity of the flow path portion B 4 b using an adhesive or the like without forming the recess 14 in the base member 4. Good. In this embodiment, the concave portion 14 is installed at a substantially central position in the reference direction K of the flow path portion B4b. Instead, the concave portion 14 is installed on the end side in the reference direction K of the flow path portion B4b. May be. In the present embodiment, the temperature detection element 13 is installed on the flow path part B4b side of the base member 4, but instead, the temperature detection element 13 is placed on the outer surface of the base member 4 opposite to the flow path part B4b. You may install in the vicinity. In addition, the configuration and arrangement of the circuit board 15, the flexible substrate A16a, and the flexible substrate B16b are one embodiment of the present invention, and the present invention is not limited to this configuration. Further, the materials of the actuator substrate A5a, the actuator substrate B5b, and the base member 4 are the same as those in the first embodiment, and the description thereof is omitted.

(Third embodiment)
FIG. 4 is a schematic perspective view of the liquid ejecting apparatus 30 according to the third embodiment of the present invention. The liquid ejecting apparatus 30 includes a moving mechanism 40 that reciprocates the liquid ejecting heads 1 and 1 ′, and a flow path unit that supplies the liquid to the liquid ejecting heads 1 and 1 ′ and discharges the liquid from the liquid ejecting heads 1 and 1 ′. 35, 35 ′, liquid pumps 33, 33 ′ and liquid tanks 34, 34 ′ communicating with the flow path portions 35, 35 ′. Each liquid ejecting head 1, 1 ′ uses the liquid ejecting head of the first or second embodiment already described.

  The liquid ejecting apparatus 30 includes a pair of conveying units 41 and 42 that convey a recording medium 44 such as paper in the main scanning direction, liquid ejecting heads 1 and 1 ′ that eject liquid onto the recording medium 44, and a liquid ejecting head. 1, 1 ′ carriage unit 43, liquid tanks 34, 34 ′ and liquid pumps 33, 33 ′ that supply the liquid stored in the liquid tanks 34, 34 ′ to the flow path portions 35, 35 ′, the liquid jet head 1, And a moving mechanism 40 that scans 1 ′ in the sub-scanning direction orthogonal to the main scanning direction. A control unit (not shown) controls and drives the liquid ejecting heads 1, 1 ′, the moving mechanism 40, and the conveying units 41 and 42.

  The pair of conveying means 41 and 42 includes a grid roller and a pinch roller that extend in the sub-scanning direction and rotate while contacting the roller surface. The recording medium 44 sandwiched between the rollers is rotated in the main scanning direction by rotating the grid roller and the pinch roller around the axis by a motor (not shown). The moving mechanism 40 couples a pair of guide rails 36 and 37 extending in the sub-scanning direction, a carriage unit 43 slidable along the pair of guide rails 36 and 37, and the carriage unit 43 to move in the sub-scanning direction. An endless belt 38 is provided, and a motor 39 that rotates the endless belt 38 via a pulley (not shown) is provided.

  The carriage unit 43 mounts a plurality of liquid jet heads 1, 1 ′, and ejects, for example, four types of liquid droplets of yellow, magenta, cyan, and black. The liquid tanks 34 and 34 'store liquids of corresponding colors and supply them to the liquid jet heads 1 and 1' via the liquid pumps 33 and 33 'and the flow path portions 35 and 35'. Each liquid ejecting head 1, 1 ′ ejects droplets of each color according to the drive signal. An arbitrary pattern is recorded on the recording medium 44 by controlling the timing at which liquid is ejected from the liquid ejecting heads 1, 1 ′, the rotation of the motor 39 that drives the carriage unit 43, and the conveyance speed of the recording medium 44. I can.

  In this embodiment, the moving mechanism 40 moves the carriage unit 43 and the recording medium 44 to perform recording, but instead, the carriage unit is fixed and the moving mechanism is the recording medium. May be a liquid ejecting apparatus that moves and records two-dimensionally. That is, the moving mechanism may be any mechanism that relatively moves the liquid ejecting head and the recording medium.

DESCRIPTION OF SYMBOLS 1 Liquid ejecting head 3 Head chip, 3a Head chip A, 3b Head chip B
4 Base member 4, 4a Nozzle cap part, 4b Flow path part B, 4c Heat radiation part, 4d Substrate holding part 5a Actuator board A, 5b Actuator board B
6a Cover plate A, 6b Cover plate B
8a Channel member A
9a Liquid chamber A, 9b Liquid chamber B
10a Channel A, 10b Channel B
DESCRIPTION OF SYMBOLS 11 Nozzle plate 12a, 12b Nozzle 13 Temperature detection element 14 Recessed part 15 Circuit board 16 Flexible board, 16a Flexible board A, 16b Flexible board B, 16x Extension part 17 Lead wiring 18 Driver IC
19 communication hole 20 connection part 21 opening part 22 holding member 23 heat sink Ca channel A, Cb channel B, FS front end face, K reference direction, Ma, Mb groove

Claims (11)

A head chip A having an actuator substrate A and a cover plate A bonded to the surface of the actuator substrate A;
A head chip B having an actuator substrate B and a cover plate B bonded to the surface of the actuator substrate B, the back surface of the actuator substrate B being bonded to the back surface of the actuator substrate A;
A base member engaged with the head chip A and the head chip B;
And a temperature detection element positioned on the base member in the vicinity of the cover plate B. The head chip A includes a flow path member A joined to the surface of the cover plate A,
The liquid ejecting head according to claim 1, wherein the head chip B includes a flow path portion B that is joined to a surface of the cover plate B.   The liquid ejecting head according to claim 2, wherein the base member and the flow path part B are an integral body made of the same material. The actuator substrate A includes a channel A that applies pressure to the liquid, the cover plate A includes a liquid chamber A that communicates with the channel A, and the flow path member A includes a flow path A that communicates with the liquid chamber A. Prepared,
The actuator substrate B includes a channel B that applies pressure to the liquid, the cover plate B includes a liquid chamber B that communicates with the channel B, and the flow path portion B includes a flow path B that communicates with the liquid chamber B. Prepared,
The liquid ejecting head according to claim 2, wherein the head chip A and the head chip B have a communication hole that communicates the flow path A and the flow path B. 5. A circuit board; and a flexible board that electrically connects the circuit board to the head chip A and the head chip B, and
The temperature detection element is located on the surface of the base member on the cover plate B side,
5. The liquid jet head according to claim 1, wherein the temperature detection element and the circuit board are electrically connected via a lead wiring along a surface of the base member on the cover plate B side. . The flexible substrate includes a driver IC that generates a drive signal;
The base member includes a heat dissipation part,
The liquid ejecting head according to claim 5, wherein the flexible substrate on which the driver IC is located contacts the heat radiating portion via a heat conductive material.   The liquid ejecting head according to claim 5, wherein the base member mounts the circuit board behind the head chip A and the head chip B. 8.   The liquid ejecting head according to claim 1, wherein the base member includes a recess that houses the temperature detection element on a surface on the cover plate B side.   The liquid ejecting head according to claim 1, wherein the base member has a nozzle cap portion on which the head chip A and the head chip B are mounted. A nozzle plate that has a plurality of nozzles and that adheres to the front end face of the nozzle cap portion;
The liquid ejecting head according to claim 9, wherein the nozzle plate is bonded to front end surfaces of the head chip A and the head chip B. A liquid ejecting head according to claim 1;
A moving mechanism for relatively moving the liquid ejecting head and the recording medium;
A liquid supply pipe for supplying a liquid to the liquid ejecting head;
And a liquid tank that supplies the liquid to the liquid supply pipe.

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