JP2015170268A - Ic card and inlet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain an IC card that mounts two antennas, a dual IC chip and a contactless type IC chip, and has an excellent communication distance with communication frequencies of two IC chips close.SOLUTION: An IC card has: a base material 11; a first coil pattern 12 that is formed in the base material to have both ends connected to a first terminal pair 16; a second coil pattern 32 that is formed in the base material to have both ends connected to a second terminal pair 36; a dual IC chip 1 that has contact terminals 7A and 7B, is mounted so as to connect to the first terminal pair, and performs contactless type communication using the first coil pattern and performs contact type communication using the contact terminal; and a contactless communication IC chip 2 that is mounted so as to connect to the second terminal pair, and performs contactless type communication using the second coil pattern. The contactless type communication using the first coil pattern and the contactless type communication using the second coil pattern are configured to be independently performed in the same communication frequency band, and one of the first coil pattern and the second coil pattern is configured to be formed on an inner side of the other thereof.

Description

  The present invention relates to an IC card in which two functions of a contact type and non-contact type dual interface card and a non-contact type IC card are mounted on one card and an inlet as a base thereof.

  There are two types of IC cards, contact communication type and non-contact communication type. Contact cards with only contact type IC chips, non-contact cards with only non-contact type IC chips, contact communication type and non-contact communication type Are classified into cards having both functions. Cards with both contact and non-contact communication functions include hybrid cards with contact ICs and non-contact ICs, and dual interface cards with contact and non-contact IC chips. is there. The IC chip for contact type IC cards and the IC chip for dual interface cards generally have contact terminals (electrodes) on the IC chip. It is required to mount an IC chip so that the terminals are exposed. Hereinafter, an IC chip for a dual interface card is referred to as a dual-purpose IC chip or a combination IC chip.

  In recent years, IC cards have been widely used, and have been actively used in various fields such as transportation systems, settlement systems, entrance / exit management systems, and the types of IC cards are increasing. Therefore, the user often carries a plurality of IC cards and uses the IC cards properly according to the usage. However, it is troublesome to carry a plurality of cards, and there is a demand for performing various processes with a single card.

  Therefore, a card in which a plurality of card functions are mounted on one card has been proposed. The above-mentioned hybrid card and dual interface card are also such examples, and further, an IC card equipped with a plurality of contactless card functions has been proposed. Such an IC card has a plurality of antennas and a plurality of non-contact type IC chips.

  In the configuration having a plurality of antennas described above, it is practically difficult to mount three or more antennas and three or more IC chips because of the coil pattern of the antenna that can be formed on the card. The case where an antenna and two IC chips are mounted is targeted. Further, from the viewpoint of multi-function, it is desirable that one of the plurality of non-contact type IC chips is a dual-purpose IC chip. The present invention is directed to an IC card having a plurality of antennas and a plurality of non-contact type IC chips, one of which is a dual-purpose IC chip.

  Furthermore, in an environment where it is actually used, two card functions that communicate in the same frequency band are mounted on one IC card. Specifically, two card functions that have the same communication frequency band with the reader / writer. It is desirable to install. The present invention is not limited to this, but is intended for an IC card equipped with two card functions having close communication frequencies.

  Patent Document 1 describes an information processing medium having coil patterns on the outside and inside of a substrate. In the disclosed information processing medium, the outer coil and the inner coil pattern are electromagnetically coupled, and electromagnetic waves are transmitted and received between the reader / writer using the outer coil pattern. The inner coil pattern is the outer coil pattern. Via the reader / writer. In other words, the outside IC chip connected to the outside coil pattern can communicate with the reader / writer independently, but the inside IC chip connected to the inside coil pattern is the inside coil pattern. Communication with the reader / writer is performed via the outer coil pattern. For this reason, when communication failure occurs due to disconnection of the outer coil, not only the outer IC chip but also the inner IC chip has communication failure.

  Patent Document 2 describes a card-type information recording medium having a plurality of antennas and a plurality of IC chips, each of which operates independently. However, the two IC chips disclosed in Patent Document 2 have different communication frequencies, and the two antennas have greatly different shapes.

  Further, Patent Document 2 does not describe the use of a dual-purpose (combination) IC chip, but Patent Document describes the use of a dual-purpose (combination) IC chip. As described above, the combined IC chip is required to mount the IC chip so that the contact terminal is exposed at a predetermined position of a card having a predetermined shape. Is not described in particular.

  The non-contact type IC card has a pattern that forms a capacitor whose capacitance value can be adjusted in addition to the coil pattern. The communication frequency is determined by a value obtained by multiplying the inductance value L by the coil pattern, the capacitance value C1 of the capacitor formed on the substrate, and the capacitance value C obtained by summing the internal capacitance C2 of the IC chip, and the capacitance value C1 is adjusted in the manufacturing process. Thus, the desired communication frequency is set. Therefore, when designing a non-contact type IC card, it is necessary to consider a pattern for forming a capacitor in addition to the coil pattern. Patent Documents 1 and 2 do not describe a pattern for forming a capacitor.

JP 2001-101370 A JP 2004-102651 A

  As described above, in the configurations described in Patent Documents 1 and 2, two antennas and two non-contact type IC chips are mounted, and one of the two non-contact type IC chips is a dual-purpose IC chip. It is difficult to realize an IC card in which the communication frequency bands of two non-contact type IC chips are close.

  The present invention includes two antennas and two non-contact type IC chips, and one of the two non-contact type IC chips is a dual-purpose IC chip, and the two card functions have a good communication distance, Further, it is an object to realize an IC card in which each antenna operates independently.

  In order to achieve the above object, an IC card of the present invention is formed on a base material, a first coil pattern formed on the base material, both ends connected to the first terminal pair, and the base material, both ends being second. A second coil pattern connected to the terminal pair and a contact terminal, which are mounted so as to be connected to the first terminal pair, contactless communication using the first coil pattern and contact communication using the contact terminal And a non-contact communication IC chip that is mounted so as to be connected to the second terminal pair and performs non-contact communication using the second coil pattern, and uses the first coil pattern The non-contact type communication and the non-contact type communication using the second coil pattern are performed independently in the same communication frequency band, and one of the first coil pattern and the second coil pattern is formed inside the other. It is characterized by

  The IC card of the present invention has a first capacitor formed on the substrate and connected to the first coil pattern, and a second capacitor formed on the substrate and connected to the second coil pattern, The first capacitor or the second capacitor connected to the other coil pattern formed inside is formed inside the other coil pattern, and the first capacitor or the second capacitor connected to one coil pattern is one Is formed inside the coil pattern and outside the other coil pattern.

  The coil pattern is realized by a spiral pattern formed on one surface of the base material, and both ends of the coil pattern are connected to the other surface of the base material by conducting portions. In order to realize good communication characteristics, it is desirable that the coil pattern has an opening area as large as possible, and one coil pattern is desirably formed along the outer periphery of the substrate. In order to operate each IC chip, it is necessary to obtain a large amount of electric power from a magnetic field. Therefore, it is desirable that the other coil pattern has an opening area as large as possible. Therefore, it is conceivable to form it just inside one coil pattern formed along the outer periphery of the substrate. In that case, the capacitor connected to one coil pattern is formed inside the other coil pattern. Therefore, it is necessary to provide a plurality of sets of conductive portions to which one coil pattern is connected, which causes problems in manufacturing and reliability. Therefore, the capacitor connected to one coil pattern is formed inside the one coil pattern on the outside and on the outside of the other coil pattern. With such limitation, the opening of the other coil pattern is formed. It is desirable to make the area as large as possible.

  Either the first coil pattern to which the dual-purpose IC chip is connected or the second coil pattern to which the non-contact communication IC chip is connected may be provided outside, but the dual-purpose IC chip should be mounted at a predetermined position. Is required.

  As described above, the communication frequency is determined by a value obtained by multiplying the inductance L by the coil pattern, the capacitance value C1 formed on the base material, and the capacitance value C obtained by summing the internal capacitance C2 of the IC chip, By adjusting, the desired value is set. When the communication frequencies of the dual-purpose IC chip and the non-contact communication IC chip are the same or close, if the number of turns is the same, the inductance of one coil pattern on the outside is larger than the inductance of the other coil pattern on the inside. Therefore, a pattern for forming a capacitor was formed so that the default capacitance value of the capacitor connected to one coil pattern on the outside is smaller than the default capacitance value of the capacitor connected to the other coil pattern on the inside. Above, it is desirable to adjust the capacitance value.

  Also, the number of turns of one coil pattern on the outside is made smaller than the number of turns of the other coil pattern on the inside so that the inductance of one coil pattern and the inductance of the other coil pattern have similar inductance values. You may design it.

  The present invention defines the best arrangement for the first coil pattern for the combined (chip) IC chip and the second coil pattern for the non-contact type IC chip to operate independently. Since each IC chip operates independently, communication can be performed using the antenna of the other coil pattern even if one coil pattern becomes defective due to disconnection or the like. Further, with the arrangement of the coil pattern of the present invention, communication characteristics not inferior to those obtained when two cards each provided with an optimum coil pattern are used in an overlapping manner were obtained.

  According to the present invention, a multi-function IC card having a good communication distance by mounting a contact type, a non-contact type IC chip and a non-contact type IC chip having a close communication frequency band is realized.

FIG. 1 is a plan view of the IC card according to the first embodiment. FIG. 2 is a diagram illustrating a process of mounting a dual-purpose (combination) IC chip on a base material in the first embodiment. FIG. 3 is a plan view of the IC card according to the second embodiment.

  FIG. 1 is a plan view of an IC card 10 according to the first embodiment. In FIG. 1, a solid line indicates a pattern shape on one surface (front surface) of the substrate 11, a broken line indicates a pattern shape on the other surface (back surface), and an IC chip on which a dotted line is mounted. Further, the coil pattern and the wiring pattern are shown as single lines, and only the electrodes are shown as patterns having a width. Further, in FIG. 1, a portion close to the upper side of the IC card is referred to as an upper side, and a portion close to the lower side is referred to as a lower side. This is the same in FIG.

  The IC card of the first embodiment includes a base material 11, a first card function pattern formed on the base material 11, a second card function pattern formed on the base material 11, and a first card function. The contact type and non-contact type (combination) IC chip 1 connected to the connection terminal pair of the pattern for use, and the non-contact type IC chip 2 connected to the connection terminal pair of the pattern for the second card function. In FIG. 1, the base material 11 on which a pattern is formed in a state where the dual-purpose (combination) IC chip 1 and the non-contact type IC chip 2 are not mounted is referred to as an antenna substrate.

  The pattern for the first card function includes a coil pattern 12 formed along the outer shape on the surface of the base material 11, and a conductive portion (hole) 13 provided at one end on the outer side of the coil pattern 12 to conduct the front surface and the back surface. , Provided on the inner side of the coil pattern 12, a conductive portion (hole) 14 for conducting the front surface and the back surface, a connection pattern 15 for connecting the conductive portions 13 and 14 on the back surface, and a portion near the inner end of the coil pattern 12. The connected first terminal electrode 16A, the second terminal electrode 16B facing the first terminal electrode 16A, the connection pattern 17 for connecting the conductive portion 14 and the second terminal electrode 16B on the surface, and the inner end of the coil pattern 12 The connection pattern 18 extending from the first connection electrode 18, the first surface electrode 19 connected to the connection pattern 18, the second surface electrode 20 connected to the connection pattern 18, and the conductive portion 14 extending from the back surface. Having a connection pattern 21, the first back electrode 22 connected to the connection pattern 21, the second back electrode 23 that is connected to the connection pattern 21, the. Except for the coil pattern 12, it is formed on the upper side of the substrate 11.

  The first terminal electrode 16A and the second terminal electrode 16B form a connection terminal pair 16, and the dual-purpose (combination) IC chip 1 is mounted so as to be connected thereto. The dual-purpose (combination) IC chip 1 is a combination IC of an ISO / IEC14443 Type A communication system, for example. The first terminal electrode 16A is connected to a portion near the inner end of the coil pattern 12, and the second terminal electrode 16B is connected to the coil pattern 12 via the connection pattern 17, the conductive portion 14, the connection pattern 15, and the conductive portion 13. Since it is connected to one end on the outside, the dual-purpose (combination) IC chip 1 is connected to both ends of the coil pattern 12. The positions of the first terminal electrode 16A and the second terminal electrode 16B are set so that the contact terminals of the mounted dual-purpose (combined) IC chip 1 are in the positions defined by the specifications.

  The 1st surface electrode 19 and the 2nd surface electrode 20, the 1st back surface electrode 22, and the 2nd back surface electrode 23 are arrange | positioned facing both surfaces of the base material 11, and form a capacitor | condenser. The first surface electrode 19 and the second surface electrode 20 are connected to the inner end of the coil pattern 12 via the connection pattern 18, and the first back surface electrode 22 and the second back surface electrode 23 are connected to the connection pattern 21 and the conduction portion 14. The capacitor is connected to both ends of the coil pattern 12 in parallel with the dual-purpose (combination) IC chip 1 because it is connected to one end outside the coil pattern 12 via the connection pattern 15 and the conductive portion 13. .

  The first surface electrode 19 and the first back electrode 22 have a large area facing each other and form a capacitor having a large capacity. The second surface electrode 20 has a shape in which a plurality of rectangles facing the second back electrode 23 are discretely connected, and a plurality of portions facing the second back electrode 23 each form a plurality of small capacitors. . At the time of manufacture, the capacitance value is adjusted by changing the number of remaining capacitors by drilling holes in a portion to be removed among a plurality of small capacitors. In this way, the communication frequency is appropriately adjusted by adjusting the capacitance values of the capacitors connected to both ends of the coil pattern 12.

  The pattern for 2nd card functions is provided in the coil pattern 32 formed inside the coil pattern 12 of the surface of the base material 11, and the outer end of the coil pattern 32, and the conduction | electrical_connection part (hole) which conducts the surface and a back surface. 33, a conductive portion (hole) 34 that is provided inside the coil pattern 32 and connects the front surface and the back surface, a connection pattern 35 that connects the conductive portions 33 and 34 on the back surface, and close to the inner end of the coil pattern 32. The third terminal electrode 36A connected to the part, the fourth terminal electrode 36B facing the third terminal electrode 36A, the connection pattern 37 connecting the conduction part 34 and the fourth terminal electrode 36B on the surface, and the inside of the coil pattern 32 A connection pattern 38 extending from the end of the connection pattern 38, a third surface electrode 39 connected to the connection pattern 38, a fourth surface electrode 40 connected to the connection pattern 38, and a connection pattern 3 A fifth surface electrode 41 connected to the connection pattern 42, a connection pattern 42 extending on the back surface from the conductive portion 34, a third back electrode 43 connected to the connection pattern 42, and a fourth back electrode 44 connected to the connection pattern 42. And a fifth back surface electrode 45 connected to the connection pattern 42. The coil pattern 32 is formed on the lower side of the inner side of the coil pattern 12 along the lower side of the long side and the left and right sides, and the other patterns are formed on the inner side of the coil pattern 32.

  The third terminal electrode 36A and the fourth terminal electrode 36B form a connection terminal pair 36, and the non-contact type IC chip 2 is mounted so as to be connected thereto. The non-contact type IC chip 2 is, for example, a Felica (registered trademark) IC. The third terminal electrode 36A is connected to a portion near the inner end of the coil pattern 32, and the fourth terminal electrode 36B is connected to the coil pattern 32 via the connection pattern 37, the conductive portion 34, the connection pattern 35, and the conductive portion 33. Since it is connected to one end on the outside, the non-contact type IC chip 2 is connected to both ends of the coil pattern 32. The positions of the third terminal electrode 36A and the fourth terminal electrode 36B are not particularly limited.

  The third surface electrode 39, the fourth surface electrode 40, the fifth surface electrode 41, the third back electrode 43, the fourth back electrode 44, and the fifth back electrode 45 are disposed to face both surfaces of the substrate 11, Form a capacitor. The third surface electrode 39, the fourth surface electrode 40, and the fifth surface electrode 41 are connected near the inner end of the coil pattern 32 via the connection pattern 38, and the third back electrode 43, the fourth back electrode 44, and Since the fifth back electrode 45 is connected to one end outside the coil pattern 32 via the connection pattern 42, the conductive portion 34, the connection pattern 35, and the conductive portion 33, the capacitor is in parallel with the non-contact type IC chip 2. The coil pattern 32 is connected to both ends.

  The third surface electrode 39 and the third back electrode 43 have a large opposing area and form a capacitor with a large capacity. The fourth surface electrode 40 and the fifth surface electrode 41 have a shape obtained by connecting a plurality of rectangles discretely facing the fourth back surface electrode 44 and the fifth back surface electrode 45, respectively. A plurality of portions facing the back electrode 45 form a plurality of small capacitors, respectively. At the time of manufacture, the capacitance value is adjusted by changing the number of remaining capacitors by drilling holes in a portion to be removed among a plurality of small capacitors. In this way, the communication frequency is appropriately adjusted by adjusting the capacitance values of the capacitors connected to both ends of the coil pattern 32.

  As shown in FIG. 1, the coil patterns 11 and 32 are realized by a spiral pattern formed on the surface of the base material 11, and both ends of the coil pattern are connected to the other surface of the base material by conducting portions. Is done. In order to realize good communication characteristics, it is desirable that the coil pattern has as large an opening area as possible. Therefore, the coil pattern 11 is formed along the outer periphery of the base material 11. Since the dual-purpose (combination) IC chip 1 and the non-contact type IC chip 2 perform communication in the same communication frequency band, the inductances of the coil patterns 11 and 32 are close to each other. In order to establish stable communication, it is desirable that the coil pattern 32 also has an opening area as large as possible. However, in the coil pattern 11, a capacitor connected to the coil pattern 11 and a connection terminal of the dual-purpose IC chip 1 are used. It is necessary to form a pattern of the first card function unit such as. Therefore, in the first embodiment, the pattern of the first card function unit is arranged on the upper side in the coil pattern 11 so that the opening area of the coil pattern 32 is maximized on the lower side in the coil pattern 11. Form.

  Furthermore, in the first embodiment, the number of turns of the coil pattern 32 is made larger than the number of turns of the coil pattern 12 to reduce the difference in inductance between the coil patterns 12 and 32. Further, the capacitance of the capacitor connected to the coil pattern 12 and the capacitance of the capacitor connected to the coil pattern 32 are set so as to realize a desired communication frequency in consideration of the inductance of the coil patterns 12 and 32. Yes.

FIG. 2 is a diagram illustrating a process of mounting the dual-purpose (combination) IC chip 1 on the base material 11 in the first embodiment.
The dual-purpose (combination) IC chip 1 includes a package 5 incorporating an IC, connection terminals 6A and 6B provided at a lower portion of the package 5, and contact electrodes 7A and 7B provided at an upper portion of the package 5.

  After mounting the non-contact IC 2 so as to connect the non-contact IC 2 to the terminal electrodes 36A and 36B, the base material 11 is laminated with the laminating material 4 including the coil pattern and the like. Thereafter, holes 3A and 3B for embedding the dual-purpose (combination) IC chip 1 in a predetermined position are formed in the base material 11 by milling. The hole 3A is a hole deeper than the coil pattern, and the hole 3B is a hole on the coil pattern so that the first terminal electrode 16A and the second terminal electrode 16B of the connection terminal pair 16 are exposed. The projection 8 of the dual-purpose (combination) IC chip 1 is fitted into the hole 3A, and the connection terminals 6A and 6B of the dual-purpose (combination) IC chip 1 are in contact with the first terminal electrode 16A and the second terminal electrode 16B of the connection terminal pair 16. In this state, connection is made with a conductive paste.

  In the first embodiment described above, the coil pattern 12, the capacitor connected thereto and the first card function unit realized by the dual-purpose IC chip 1, and the coil pattern 32, the capacitor connected thereto and the non-contact type The second card function unit realized by the IC chip 2 communicates with the reader / writer at a similar communication frequency. Further, the first card function unit (combined IC chip 1) and the second card function unit (non-contact type IC chip 2) had a good communication distance with the reader / writer at a close frequency.

  In the first embodiment, the coil pattern 12 to which the dual-purpose (combination) IC chip 1 is connected is provided outside, and the coil pattern 32 to which the non-contact type IC chip 2 is connected is provided inside the coil pattern 12. May be provided outside. In the second embodiment, the coil pattern to which the non-contact type IC chip 2 is connected is provided on the outside, and the coil pattern to which the dual-purpose (combination) IC chip 1 is connected is provided on the inside.

FIG. 3 is a plan view of the IC card 50 of the second embodiment.
The IC card of the second embodiment includes a base material 51, a first card function pattern formed on the base material 51, a second card function pattern formed on the base material 51, and a first card function. A non-contact type IC chip 2 connected to the connection terminal pair of the pattern for use, and a contact type and non-contact type (combination) IC chip 1 connected to the connection terminal pair of the pattern for the second card function.

  The first card function pattern includes a coil pattern 52 formed along the outer shape on the surface of the base material 51, and a conductive portion (hole) 53 provided on one end on the outer side of the coil pattern 52, which conducts the front surface and the back surface. , Provided on the inner side of the coil pattern 52, connected to the conductive portion (hole) 54 for conducting the front surface and the back surface, the connection pattern 55 for connecting the conductive portions 53 and 54 on the back surface, and the inner end of the coil pattern 52. The first terminal electrode 56A, the second terminal electrode 56B facing the first terminal electrode 56A, the connection pattern 57 that connects the conducting portion 54 and the second terminal electrode 56B on the surface, and the portion near the inner end of the coil pattern 52 Connected to the connection pattern 58, the first surface electrode 59 connected to the connection pattern 58, the second surface electrode 60 connected to the connection pattern 58, and the connection pattern 58. Three surface electrodes 61, a connection pattern 62 extending on the back surface from the conductive portion 54, a first back electrode 63 connected to the connection pattern 62, a second back electrode 64 connected to the connection pattern 62, and a connection pattern 62. And a third back electrode 65 connected to the. Except for the coil pattern 52, it is formed on the lower side of the substrate 51. The non-contact type IC chip 2 is, for example, a Felica (registered trademark) IC.

  The pattern for 2nd card functions is provided in the coil pattern 72 formed inside the coil pattern 52 of the surface of the base material 51, and the outer end of the coil pattern 72, and the conduction | electrical_connection part (hole) which conducts the surface and a back surface. 73, a conductive portion (hole) 74 provided inside the coil pattern 72 and conducting the front surface and the back surface, a connection pattern 75 connecting the conductive portions 73 and 74 on the back surface, and close to the inner end of the coil pattern 72 The third terminal electrode 76A connected to the part, the fourth terminal electrode 76B facing the third terminal electrode 76A, the connection pattern 77 for connecting the conducting portion 74 and the fourth terminal electrode 76B on the surface, and the inside of the coil pattern 72 From the connection pattern 78 extending from the end of the electrode, the fourth surface electrode 79 connected to the connection pattern 78, the fifth surface electrode 80 connected to the connection pattern 78, and the conduction portion 74 Having a connection pattern 81 extending Menjo, the fourth back electrode 82 connected to the connection pattern 81, and the fifth back surface electrode 83 connected to the connection pattern 81, the. The coil pattern 72 is formed on the upper side of the coil pattern 52 along the long side of the upper side and the upper side of the left and right sides, and the other patterns are formed on the inner side of the coil pattern 72.

  The third terminal electrode 76A and the fourth terminal electrode 76B form a connection terminal pair 76, and the dual-purpose (combination) IC chip 1 is mounted so as to be connected thereto. The dual-purpose (combination) IC chip 1 is, for example, an ISO / IEC14443 Type A combination IC. The positions of the first terminal electrode 76A and the second terminal electrode 76B are set such that the contact terminals of the mounted dual-purpose (combination) IC chip 1 are in the positions defined by the specifications.

Since other parts are the same as those in the first embodiment, further explanation is omitted.
When the communication characteristics were examined with the IC card of the second embodiment, good communication results were obtained.

  The embodiment has been described above, but all examples and conditions described herein are described for the purpose of helping understanding of the concept of the invention applied to the invention and technology. In particular, the examples and conditions described are not intended to limit the scope of the invention, and the construction of such examples in the specification does not indicate the advantages and disadvantages of the invention. Although embodiments of the invention have been described in detail, it should be understood that various changes, substitutions and modifications can be made without departing from the spirit and scope of the invention.

DESCRIPTION OF SYMBOLS 1 Contact type and non-contact type (combination) IC chip 2 Non-contact type IC chip 11, 51 Base material 12, 32, 52, 72 Coil pattern 13, 14, 33, 34, 53, 54, 73, 74 Conduction part (hole)
15, 17-18, 21, 35, 37-38, 42 Connection pattern 55, 57-58, 62, 75, 77-78, 81 Connection pattern 16, 36, 56, 76 Connection terminal pair 16A, 76A First terminal Electrode 16B, 76B Second terminal electrode 19, 20, 39-41, 59-61, 79-80 First, second surface electrode 22, 23, 43-45, 63-65, 82-83 First, second Back electrode 36A, 56A Third terminal electrode 36B, 56B Fourth terminal electrode

Claims (3)

A substrate;
A first coil pattern formed on the substrate and having both ends connected to a first terminal pair;
A second coil pattern formed on the substrate and having both ends connected to a second terminal pair;
A dual-purpose IC chip having a contact terminal, mounted so as to be connected to the first terminal pair, and performing non-contact communication using the first coil pattern and contact communication using the contact terminal;
An IC chip for non-contact communication that is mounted so as to be connected to the second terminal pair and performs non-contact communication using the second coil pattern;
Non-contact communication using the first coil pattern and non-contact communication using the second coil pattern are performed independently in the same communication frequency band,
One of said 1st coil pattern and said 2nd coil pattern is formed inside the other, The IC card characterized by the above-mentioned. A first capacitor formed on the substrate and connected to the first coil pattern;
A second capacitor formed on the base material and connected to the second coil pattern,
The first capacitor or the second capacitor connected to the other coil pattern formed on the inner side is formed on the inner side of the other coil pattern,
The IC card according to claim 1, wherein the first capacitor or the second capacitor connected to the one coil pattern is formed inside the one coil pattern and outside the other coil pattern. A substrate;
A first coil pattern having both ends connected to a first terminal pair formed on the substrate and connected to a dual-purpose IC chip that performs non-contact communication and contact communication;
A second coil pattern formed on the substrate and connected to a second terminal pair to which a non-contact communication IC chip that performs non-contact communication is connected;
The first coil pattern and the second coil pattern are used for non-contact communication performed independently in the same communication frequency band,
One of the first coil pattern and the second coil pattern is formed inside the other, the inlet.

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