JP2015148447A - 自動外観検査装置 - Google Patents
自動外観検査装置 Download PDFInfo
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- JP2015148447A JP2015148447A JP2014019791A JP2014019791A JP2015148447A JP 2015148447 A JP2015148447 A JP 2015148447A JP 2014019791 A JP2014019791 A JP 2014019791A JP 2014019791 A JP2014019791 A JP 2014019791A JP 2015148447 A JP2015148447 A JP 2015148447A
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- 238000011179 visual inspection Methods 0.000 title claims abstract description 38
- 238000007689 inspection Methods 0.000 claims abstract description 453
- 238000003384 imaging method Methods 0.000 claims abstract description 84
- 239000006185 dispersion Substances 0.000 claims abstract description 78
- 230000002950 deficient Effects 0.000 claims description 89
- 238000012545 processing Methods 0.000 claims description 78
- 238000012937 correction Methods 0.000 claims description 23
- 230000005284 excitation Effects 0.000 claims description 19
- 230000007717 exclusion Effects 0.000 claims description 14
- 238000000605 extraction Methods 0.000 claims description 6
- 239000000284 extract Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000002159 abnormal effect Effects 0.000 abstract description 21
- 239000000047 product Substances 0.000 description 48
- 239000000758 substrate Substances 0.000 description 35
- 238000010586 diagram Methods 0.000 description 25
- 238000005286 illumination Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 15
- 238000012360 testing method Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000005755 formation reaction Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000005856 abnormality Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
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- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014019791A JP2015148447A (ja) | 2014-02-04 | 2014-02-04 | 自動外観検査装置 |
| TW103145058A TW201531695A (zh) | 2014-02-04 | 2014-12-23 | 自動外觀檢查裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014019791A JP2015148447A (ja) | 2014-02-04 | 2014-02-04 | 自動外観検査装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2015148447A true JP2015148447A (ja) | 2015-08-20 |
Family
ID=53891932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014019791A Pending JP2015148447A (ja) | 2014-02-04 | 2014-02-04 | 自動外観検査装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2015148447A (zh) |
| TW (1) | TW201531695A (zh) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017183923A1 (ko) * | 2016-04-20 | 2017-10-26 | 주식회사 고영테크놀러지 | 물품의 외관 검사장치 및 이를 이용한 물품의 외관 검사방법 |
| JP2017220497A (ja) * | 2016-06-03 | 2017-12-14 | 株式会社ニューフレアテクノロジー | 検査方法 |
| JP2018205122A (ja) * | 2017-06-05 | 2018-12-27 | 株式会社Ｓｃｒｅｅｎホールディングス | 検査装置および検査方法 |
| JP2019502256A (ja) * | 2015-11-16 | 2019-01-24 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Ｃｍｐモニタリングのための色画像化 |
| JP2020046393A (ja) * | 2018-09-21 | 2020-03-26 | 東レエンジニアリング株式会社 | チップ体の検査装置 |
| CN111477558A (zh) * | 2020-04-28 | 2020-07-31 | 天津福莱迪科技发展有限公司 | 一种产品的视觉检测设备 |
| JP2020161778A (ja) * | 2019-03-28 | 2020-10-01 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| JP2020177032A (ja) * | 2020-08-05 | 2020-10-29 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| US11100628B2 (en) | 2019-02-07 | 2021-08-24 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| JP2022085625A (ja) * | 2020-11-27 | 2022-06-08 | 株式会社フジクラ | 検査装置、検査方法、及び、検査プログラム |
| US11557048B2 (en) | 2015-11-16 | 2023-01-17 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| US11860323B2 (en) | 2018-10-18 | 2024-01-02 | Hamamatsu Photonics K.K. | Radiation imaging device |
| WO2024053198A1 (ja) * | 2022-09-06 | 2024-03-14 | 株式会社ジャパンディスプレイ | 発光素子の検査方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2571997B (en) * | 2018-03-16 | 2021-10-27 | X Fab Texas Inc | Use of wafer brightness to monitor laser anneal process and laser anneal tool |
| JP6786565B2 (ja) * | 2018-10-10 | 2020-11-18 | Ckd株式会社 | 検査装置、ｐｔｐ包装機及びｐｔｐシートの製造方法 |
| TWI872100B (zh) * | 2019-08-13 | 2025-02-11 | 日商東京威力科創股份有限公司 | 基板處理裝置、噴嘴檢查方法及電腦可讀取之記憶媒體 |
| JP7368141B2 (ja) * | 2019-08-20 | 2023-10-24 | 東レエンジニアリング株式会社 | ウエーハ外観検査装置および方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0374854A (ja) * | 1989-08-16 | 1991-03-29 | Toshiba Corp | 表面検査装置 |
| JPH11172571A (ja) * | 1997-12-02 | 1999-06-29 | Toyobo Co Ltd | 織布の検反装置 |
| JP2000146853A (ja) * | 1998-11-10 | 2000-05-26 | Toshiba Corp | レジストパターンの欠陥検査装置及び欠陥検査方法 |
| JP2002228594A (ja) * | 2001-01-31 | 2002-08-14 | Japan Vilene Co Ltd | 被測定物の状態評価方法および状態評価装置 |
-
2014
- 2014-02-04 JP JP2014019791A patent/JP2015148447A/ja active Pending
- 2014-12-23 TW TW103145058A patent/TW201531695A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0374854A (ja) * | 1989-08-16 | 1991-03-29 | Toshiba Corp | 表面検査装置 |
| JPH11172571A (ja) * | 1997-12-02 | 1999-06-29 | Toyobo Co Ltd | 織布の検反装置 |
| JP2000146853A (ja) * | 1998-11-10 | 2000-05-26 | Toshiba Corp | レジストパターンの欠陥検査装置及び欠陥検査方法 |
| JP2002228594A (ja) * | 2001-01-31 | 2002-08-14 | Japan Vilene Co Ltd | 被測定物の状態評価方法および状態評価装置 |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019502256A (ja) * | 2015-11-16 | 2019-01-24 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Ｃｍｐモニタリングのための色画像化 |
| US11715193B2 (en) | 2015-11-16 | 2023-08-01 | Applied Materials, Inc. | Color imaging for CMP monitoring |
| US11557048B2 (en) | 2015-11-16 | 2023-01-17 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| CN115555982A (zh) * | 2015-11-16 | 2023-01-03 | 应用材料公司 | 用于cmp监控的彩色成像 |
| KR101802812B1 (ko) * | 2016-04-20 | 2017-11-29 | 주식회사 고영테크놀러지 | 물품의 외관 검사장치 및 이를 이용한 물품의 외관 검사방법 |
| WO2017183923A1 (ko) * | 2016-04-20 | 2017-10-26 | 주식회사 고영테크놀러지 | 물품의 외관 검사장치 및 이를 이용한 물품의 외관 검사방법 |
| US11100629B2 (en) | 2016-04-20 | 2021-08-24 | Koh Young Technology Inc. | Appearance inspecting apparatus for article and appearance inspecting method for article using the same |
| JP2017220497A (ja) * | 2016-06-03 | 2017-12-14 | 株式会社ニューフレアテクノロジー | 検査方法 |
| US11074684B2 (en) | 2017-06-05 | 2021-07-27 | SCREEN Holdings Co., Ltd. | Inspection apparatus and inspection method |
| JP2018205122A (ja) * | 2017-06-05 | 2018-12-27 | 株式会社Ｓｃｒｅｅｎホールディングス | 検査装置および検査方法 |
| JP2020046393A (ja) * | 2018-09-21 | 2020-03-26 | 東レエンジニアリング株式会社 | チップ体の検査装置 |
| TWI828782B (zh) * | 2018-10-18 | 2024-01-11 | 日商濱松赫德尼古斯股份有限公司 | 放射線攝像裝置 |
| US11860323B2 (en) | 2018-10-18 | 2024-01-02 | Hamamatsu Photonics K.K. | Radiation imaging device |
| US11100628B2 (en) | 2019-02-07 | 2021-08-24 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| US11776109B2 (en) | 2019-02-07 | 2023-10-03 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| TWI834843B (zh) * | 2019-03-28 | 2024-03-11 | 日商濱松赫德尼古斯股份有限公司 | 檢查裝置及檢查方法 |
| KR20210144682A (ko) | 2019-03-28 | 2021-11-30 | 하마마츠 포토닉스 가부시키가이샤 | 검사 장치 및 검사 방법 |
| US12228515B2 (en) | 2019-03-28 | 2025-02-18 | Hamamatsu Photonics K.K. | Inspection apparatus and inspection method |
| WO2020195137A1 (ja) | 2019-03-28 | 2020-10-01 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| JP2020161778A (ja) * | 2019-03-28 | 2020-10-01 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| CN111477558A (zh) * | 2020-04-28 | 2020-07-31 | 天津福莱迪科技发展有限公司 | 一种产品的视觉检测设备 |
| CN111477558B (zh) * | 2020-04-28 | 2020-12-25 | 天津福莱迪科技发展有限公司 | 一种产品的视觉检测设备 |
| JP7291676B2 (ja) | 2020-08-05 | 2023-06-15 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| JP2020177032A (ja) * | 2020-08-05 | 2020-10-29 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| JP2022085625A (ja) * | 2020-11-27 | 2022-06-08 | 株式会社フジクラ | 検査装置、検査方法、及び、検査プログラム |
| JP7518741B2 (ja) | 2020-11-27 | 2024-07-18 | 株式会社フジクラ | 検査装置、検査方法、及び、検査プログラム |
| WO2024053198A1 (ja) * | 2022-09-06 | 2024-03-14 | 株式会社ジャパンディスプレイ | 発光素子の検査方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201531695A (zh) | 2015-08-16 |
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| A621 | Written request for application examination |
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