JP2015138704A - light-emitting element module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting element module that can suppress occurrence of uneven brightness regardless of usage.SOLUTION: A light-emitting element module 1 comprises: a light-emitting element 11 that emits a light; a substrate 12 on which the light-emitting element 11 is mounted; a lens member 28 that is disposed on a mounting surface 12a side of the substrate 12 and is at least provided with a light control unit 13; and a light absorption unit 19 that absorbs light. The light absorption unit 19 comprises a member disposed between the substrate 12 and the lens member 28.

Description

  The present invention relates to a light emitting element module.

  For example, a display device such as a signboard or a sign is known in which a light emitting element module is arranged inside in order to improve visibility. For example, in Patent Document 1, as a light-emitting element module applied to such a display device, a housing that houses a substrate on which a light source is mounted has an opening between a flat plate and a part of the periphery of the substrate. And a side plate standing upright on the flat plate so as to surround the substrate, and a structure for fixing the mounting plate by inserting a screw or the like into the mounting hole of the mounting plate extended from the flat plate outside the side plate is disclosed. Has been.

JP 2011-233356 A

  In the conventional light emitting element module, the light emitted in the front direction includes not only the light emitted in the front direction without being reflected by the lens or the substrate but also the light emitted in the front direction as a result of being reflected by the lens or the substrate. Accordingly, the intensity of light emitted in the front direction is increased. On the other hand, in order to uniformly illuminate the member to be illuminated, it is necessary to secure a distance for the light to diffuse, but when the light intensity is high, the distance necessary for the diffusion becomes long. For this reason, for example, when a conventional light emitting element module is arranged inside a thin display device, it is not possible to secure a distance for sufficiently diffusing light with high intensity emitted in the front direction. As a result, there is a problem that uneven brightness occurs on the display surface of the display device, and it is required to suppress the occurrence of uneven brightness. From the above, there is a demand for a light-emitting element module that can suppress the occurrence of uneven brightness regardless of the application.

  A light-emitting element module according to an embodiment of the present invention controls a light-emitting element that generates light, a substrate on which the light-emitting element is mounted, a mounting surface side of the substrate, and emission of light generated by the light-emitting element. A lens member including at least a light control unit and a light absorption unit that absorbs light are provided, and the light absorption unit is configured by a member disposed between the substrate and the lens member.

  According to such a configuration, the light emitting element, the substrate on which the light emitting element is mounted, the lens member including at least the light control unit disposed on the mounting surface side of the substrate, and the substrate and the lens member are disposed. A light absorption part. Thereby, a part of the light generated by the light emitting element is reflected by the substrate or the lens member and then absorbed by the light absorbing portion. The absorbed light includes light emitted in the front direction of the light emitting element module if it is not absorbed by the light absorbing unit. For this reason, it can suppress that the light intensity of a front direction becomes large too much. Therefore, for example, even when it is disposed inside a thin display device, the occurrence of uneven brightness can be suppressed regardless of the application.

  In the light emitting element module according to another aspect, the light absorbing portion may be disposed so as to surround the light emitting element on the outer peripheral side.

  In the light emitting element module according to another aspect, the light absorption unit may be configured by a sealing member that seals at least a space between the substrate and the lens member on the inner peripheral side of the light absorption unit.

  In the light emitting element module according to another aspect, the light absorbing portion may be configured by a member having thermal conductivity.

  In the light emitting element module according to another aspect, the light emitting element module may include a pressing structure that applies a pressing force to the light absorbing portion.

  A light-emitting element module according to an embodiment of the present invention controls a light-emitting element that generates light, a substrate on which the light-emitting element is mounted, a mounting surface side of the substrate, and emission of light generated by the light-emitting element. A lens member including at least a light control unit and a light absorption unit that absorbs light are provided, and the light absorption unit is formed on the surface of the lens member between the substrate and the lens member.

  In the light emitting element module according to another aspect, the light absorption unit may be formed on a bottom surface of the light control unit.

  In the light emitting element module according to another aspect, the light absorbing portion may be formed on an inner surface of a lens member provided so as to surround the light emitting element on the outer peripheral side.

  According to one aspect of the present invention, it is possible to suppress the occurrence of uneven brightness regardless of the application.

FIG. 1 is a perspective view of the light emitting element module according to the first embodiment. FIG. 2 is a plan view of the light emitting element module according to the first embodiment. FIG. 3 is an exploded perspective view of the light emitting element module according to the first embodiment on the plane side. FIG. 4 is an exploded perspective view of the bottom surface side of the light emitting element module according to the first embodiment. FIG. 5 is a cross-sectional view taken along line VV shown in FIG. FIG. 6A is a schematic diagram illustrating a structure near the light absorption unit according to the first embodiment, and FIG. 6B is a schematic diagram illustrating an adhesive layer. FIG. 7 is a schematic view of a light emitting element module according to a modification. FIG. 8 is a schematic diagram illustrating a structure in the vicinity of the light absorption unit according to the second embodiment. FIG. 9 is a diagram illustrating an evaluation result of the light emitting element module according to the example. FIG. 10 is a diagram illustrating an evaluation result of the light emitting element module according to the example. FIG. 11 is a diagram illustrating an evaluation method of the light absorption unit according to the example. FIG. 12 is a diagram illustrating an evaluation result of the light absorption unit according to the example. FIG. 13 is a diagram illustrating an evaluation result of the light absorption unit according to the example. FIG. 14 is a diagram illustrating an evaluation result of the light absorption unit according to the example. FIG. 15 is a schematic diagram illustrating a structure of a light emitting element module according to a comparative example.

  Hereinafter, embodiments of a light-emitting element module according to the present invention will be described in detail with reference to the drawings. In this description, the same reference numerals are used for the same elements, and duplicate descriptions are omitted.

[First Embodiment]
With reference to FIGS. 1-6, the structure of the light emitting element module 1 which concerns on this embodiment is demonstrated. The light emitting element module 1 is a light emitting element module used for a display device such as a signboard or a sign installed inside or outside a store or public facility. In particular, even when used in a thin display device, for example, the occurrence of uneven brightness on the display surface is suppressed regardless of the application. In addition, even when the display device is installed outdoors, water can be prevented from entering the light emitting element module 1 due to dew condensation or water splashing.

  The light emitting element module 1 controls the emission of light generated by the light emitting element 11, which is arranged on the mounting surface 12 a side of the light emitting element 11 that generates light, the substrate 12 on which the light emitting element 11 is mounted, and the substrate 12. A lens member 28 including at least the light control unit 13, and a sealing unit 14 disposed on the mounting surface 12a side of the substrate 12 so as to surround at least the light emitting element 11 when viewed in a direction perpendicular to the mounting surface 12a; A cover member 16 that covers the mounting surface 12a side of the substrate 12 and a pressing structure 17 that applies a pressing force to the sealing portion 14 are provided. In the present embodiment, the “optical axis” is the optical axis of outgoing light emitted from the light emitting element module 1. In addition, although the X axis, the Y axis, and the Z axis are set for each drawing, they are set for convenience of explanation. In the present embodiment, the Z axis is set in the optical axis direction, which is the direction in which the optical axis RL of the emitted light emitted in the front direction of the light emitting element module 1 extends. The light from the light emitting element module 1 is emitted in the positive direction of the Z axis, the light emission side (that is, the Z axis positive side) is “table”, and the opposite side (that is, the Z axis negative side) is “ These words are used as the “back”.

  The light emitting element 11 is a light emitter that generates light when supplied with driving power. As the light emitting element 11, for example, a light emitting diode (LED) that generates light by flowing a current through a compound such as gallium arsenide or gallium nitride is used. In addition, you may use the thing provided with the fluorescent substance in order to obtain lights other than the luminescent color of LED itself as the light emitting element 11. FIG. For example, the light-emitting element 11 may be one in which the LED is covered with a resin material or sheet mixed with a phosphor, or one in which a phosphor is applied to the light-emitting surface of the LED. Here, one light emitting element 11 may be mounted on the substrate 12, or a plurality of light emitting elements 11 may be mounted on the substrate 12. When the number of the light emitting elements 11 is one, the light emitting elements 11 are arranged on the mounting surface 12 a of the substrate 12 so that the optical axis thereof coincides with the optical axis RL of the light emitting element module 1.

  The substrate 12 is a rectangular plate-like member on which the light emitting element 11 is mounted. For example, an aluminum substrate, a copper substrate, a glass epoxy substrate, a glass composite substrate, or the like can be used. In the present embodiment, the substrate 12 is disposed so that the mounting surface 12a extends in the X-axis direction and the Y-axis direction so as to be orthogonal to the optical axis RL, and the rectangle in which the Y-axis direction is the longitudinal direction. The shape is not particularly limited, and any shape such as a square shape or a circular shape may be adopted. The surface of the substrate 12 is configured as a mounting surface 12a on which the light emitting element 11 and the lens member 28 are mounted. A wiring pattern (not shown) made of copper foil is provided on the mounting surface 12a. The wiring pattern is a wiring that supplies driving power to the light emitting element 11, and is electrically connected to a power source (not shown) outside the substrate 12 via a wire 21. The wire 21 is used to electrically connect the plurality of light emitting element modules 1 in series or in parallel. In each figure, only the electrode part 22 connected to the wire 21 is shown in the wiring pattern.

  Two electrode portions 22 are provided at positions on both ends in the longitudinal direction (Y-axis direction) of the mounting surface 12a of the substrate 12 (see particularly FIG. 3). The electrode portion 22 is connected to the wire 21 by soldering, and a solder portion 23 is formed by the soldering. The wires 21 connected to the electrode portions 22 are drawn outward from the edge portions on both sides in the longitudinal direction (Y-axis direction) of the substrate 12. However, the position where the electrode portion 22 is provided and the direction in which the wire 21 is pulled out are not particularly limited, and the electrode portion 22 is provided on the end side in the short direction (X-axis direction) of the substrate 12 so that the short direction ( The wire 21 may be pulled out in the (X-axis direction). Note that an electrode portion (not shown) connected to the light emitting element 11 is provided at the center of the mounting surface 12a. By connecting the light emitting element 11 to this electrode portion, driving power is supplied to the light emitting element 11.

  In addition, semicircular cutouts 12c are formed at four corners of the substrate 12 (see FIGS. 3 and 4). Further, the substrate 12 is formed with through holes 15A and 15B through which the screws 53A and 53B constituting the pressing structure 17 are inserted. The arrangement of the through holes 15A and 15B will be described later together with the pressing structure 17. Further, a bottomed hole 12 d for aligning the lens member 28 is formed in the mounting surface 12 a of the substrate 12. However, in the present invention, the shape is not essential, and the present invention is not limited to such a form.

  The lens member 28 includes a light control unit 13 and a light control unit support unit 18 that supports the light control unit 13 with respect to the substrate 12. The light control unit support unit 18 includes an annular portion 26 formed over the entire circumference of the outer edge portion of the light control unit 13, and flange portions 27 </ b> A and 27 </ b> B projecting radially outward from the annular portion 26. Yes. The lens member 28 may be manufactured by a method such as molding using a mold or cutting and polishing. As the material of the lens member 28 (that is, the material of the light control unit 13), for example, glass, acrylic resin, polycarbonate resin, silicone resin, or the like may be applied. In the present embodiment, for example, as shown in FIG. 6, when a boundary line L <b> 1 that extends the bottom surface 13 c to the outer peripheral side is set, the region on the emission surface 13 b side (Z-axis positive side) from the bottom surface 13 c and the boundary line L <b> 1 It may be regarded as the control unit 13. Further, a portion protruding from the outer edge of the light control unit 13 to the outer peripheral side when viewed from the optical axis direction, that is, a portion on the outer peripheral side from the boundary line L2 shown in FIG. 6 may be regarded as the flange portions 27A and 27B. A portion between the boundary line L1 and the boundary line L2 may be regarded as the annular portion 26. However, in the present embodiment, the portion is referred to as an “annular portion”, but it may be a rectangular shape or other polygonal shape instead of a circular shape. Further, the “flange portion” does not need to be circular, and may be rectangular or other polygonal shapes.

  The light control unit 13 controls emission of light generated by the light emitting element 11 so that the light emitting element module 1 can emit emitted light according to desired characteristics. That is, the light control unit 13 transmits the light generated in the light emitting element 11 into the light control unit 13 to control how the light spreads, and in the state where the light intensity at each orientation angle is controlled. To do. In the present specification, the light at the previous stage generated by the light emitting element 11 and transmitted through the light control unit 13 is referred to as “light generated by the light emitting element”. The light emitted in a state controlled by the light control unit 13 corresponds to “emitted light” emitted as the light emitting element module 1. The light control unit 13 is configured by a hemispherical dome-shaped lens disposed on the mounting surface 12 a side of the substrate 12. In order to control the emitted light emitted from the light emitting element module 1, the light control unit 13 may be a convex lens, or a lens in which a part of the convex lens is formed in a concave lens shape. The light control unit 13 is disposed on the light emitting surface side of the light emitting element 11 so as to cover the light emitting element 11 at a position where the central axis coincides with the optical axis RL. The light control unit 13 is formed on the back side (Z-axis negative side) and is incident on the incident surface 13a on which light generated by the light emitting element 11 is incident. The light control unit 13 is formed on the front side (Z-axis positive side) and transmits through the light control unit 13. And an emission surface 13b (see FIG. 5) for emitting the emitted light as emission light.

  The emission surface 13b is formed in a substantially hemispherical dome shape, and is a surface that emits light that has passed through the light control unit 13 as emitted light so as to be directed to a member to be illuminated (for example, a signboard of a store). The exit surface 13b is formed to be curved with an arbitrary curvature radius, but is formed substantially parallel to the entrance surface 13a in the vicinity of the optical axis RL. The shape of the exit surface 13b is not particularly limited, and may be changed as appropriate according to the application and required characteristics of the light emitting element module 1. For example, the radius of curvature may be changed, and the portion parallel to the entrance surface 13a Need not be provided.

  The incident surface 13a includes a bottom surface 13c formed in a planar shape, and a guide portion 13d formed in a concave shape at the center position of the bottom surface 13c (see FIGS. 4 and 5). The bottom surface 13c faces the mounting surface 12a of the substrate 12 in parallel and is disposed at a position separated from the mounting surface 12a. The bottom surface 13c can scatter light by being a rough surface (an uneven surface). For example, when the bottom surface 13c of the incident surface 13a is not a rough surface, the intensity of the emitted light emitted from the light control unit 13 is reflected by the bottom surface 13c and the light reflected by the emission surface 13b without being transmitted through the light control unit 13 However, it becomes high in a part near the optical axis RL, and ring-shaped unevenness may occur. On the other hand, by making the bottom surface 13c of the incident surface 13a rough, the light reflected by the exit surface 13b can be scattered by the bottom surface 13c, thereby suppressing the occurrence of ring-shaped unevenness as described above. it can. At the center of the bottom surface 13c, a guide portion 13d, which is a recess for guiding the light generated by the light emitting element 11 to the emission surface 13b side, is formed. The guide portion 13d is configured as a depression with the optical axis RL as the central axis. In a state where the light emitting element 11 and the light control unit 13 are mounted on the mounting surface 12 a of the substrate 12, the guide unit 13 d is located immediately above the light emitting element 11.

  The annular portion 26 is formed so as to surround the outer periphery of the bottom surface 13c. In the present embodiment, the annular portion 26 projects to the substrate 12 side (Z-axis negative side) from the bottom surface 13c. The flange portions 27 </ b> A and 27 </ b> B are portions that project in an arc shape radially outward from the outer edge portion of the light control unit 13. In the present embodiment, a pair of flange portions 27A and 27B are provided. The flange portion 27A and the flange portion 27B are provided in regions facing each other across the optical axis RL. The flange portions 27 </ b> A and 27 </ b> B constitute a part of the pressing structure 17, and the entire lens member 28 is pressed toward the substrate 12 through the flange portion 27 when a pressing force is applied from another member. The detailed description of the flange portions 27A and 27B will be described later together with the pressing structure 17. In the present embodiment, in a state where the lens member 28 (that is, the light control unit 13) is mounted on the mounting surface 12a of the substrate 12, the incident surface 13a of the light control unit 13, the mounting surface 12a of the substrate 12, and the annular portion A space SP is formed between the space 26 and the terminal 26.

  The sealing unit 14 seals at least the space SP between the substrate 12 and the light control unit 13 on the inner peripheral side of the sealing unit 14 by the pressing force applied by the pressing structure 17. In the present embodiment, the sealing portion 14 also serves as a light absorbing portion 19 described later, and is configured by a sealing member 29 that is separate from the lens member 28. The sealing unit 14 seals a region on the inner peripheral side of the sealing unit 14, which is a region where the light emitting element 11 is disposed, in the space SP between the substrate 12 and the light control unit 13. Intrusion of water from a region on the outer peripheral side of the sealing portion 14 is prevented. The sealing unit 14 is disposed between the lens member 28 having the light control unit 13 and the substrate 12, that is, at the position on the incident surface 13 a side of the light control unit 13 and on the mounting surface 12 a side of the substrate 12. The sealing portion 14 is configured in an annular shape, and is arranged so that its central axis coincides with the optical axis RL. Since the light emitting element 11 is disposed on the optical axis RL, the sealing portion 14 is disposed so as to surround the light emitting element 11 when viewed in the direction perpendicular to the mounting surface 12a. Note that the structure in which the sealing portion 14 surrounds the light emitting element 11 may be any shape (polygonal ring such as a quadrangular ring), not a ring. Moreover, even if it does not surround all the circumferences, it may be interrupted on the way. Further, the position of the light emitting element 11 and the position of the sealing portion 14 in the optical axis direction may be shifted up and down by providing a step on the mounting surface 12a. When viewed in a direction perpendicular to the mounting surface 12 a, the sealing portion 14 is disposed so as to surround the light emitting element 11.

  Next, the light absorption unit 19 configured by the sealing member 29 will be described in more detail. As shown in FIG. 6, the sealing member 29 is a member formed in an annular shape, and both end surfaces in the optical axis direction (Z-axis direction) are configured to be planar. An end surface 29 a on the front side (Z-axis positive side) of the sealing member 29 is in contact with the bottom surface 13 c of the light control unit 13, and an end surface 29 b on the back side (Z-axis negative side) of the sealing member 29 is in contact with the substrate 12. When a pressing force is applied to the sealing member 29 by the pressing structure 17 described later, the end surface 29 a is in close contact with the bottom surface 13 c of the light control unit 13, and the end surface 29 b is in close contact with the substrate 12. Accordingly, the sealing member 29 prevents water from entering from the boundary portion between the sealing member 29 and the lens member 28, and prevents water from entering from the boundary portion between the sealing member 29 and the substrate 12. The sealing member 29 is disposed so as to overlap the light control unit 13 when viewed from the optical axis direction. Therefore, the end surface 29a on the front side (Z-axis positive side) of the sealing member 29 is in surface contact with the bottom surface 13c configured as a rough surface. Further, the end surface 29 b on the back side (Z-axis negative side) of the sealing member is in surface contact with the mounting surface 12 a of the substrate 12. The outer diameter of the sealing member 29 substantially matches the outer diameter of the bottom surface 13c (that is, the inner diameter of the annular portion 26). In addition, the outer peripheral surface 29c of the sealing member 29 may be separated from the inner side surface 26a of the annular portion 26 as shown in FIG. 6, or may be brought into contact as shown in FIG. The inner diameter of the sealing member 29 is set such that the inner peripheral surface 29d is spaced at least radially outward with respect to the light emitting element 11, and is larger than the diameter of the guide portion 13d in this embodiment. In a state where the light control unit 13, the sealing member 29, and the light emitting element 11 are mounted on the mounting surface 12 a of the substrate 12, the light emitting element 11 is disposed in a region on the inner peripheral side with respect to the inner peripheral surface 29 d of the sealing member 29. Has been. That is, the sealing member 29 is arranged on the mounting surface 12a of the substrate 12 so as to surround the light emitting element 11 when viewed in the direction perpendicular to the mounting surface 12a. Depending on the shape of the sealing member 29 constituting the light absorbing portion 19, the light absorbing portion 19 may have any shape (polygonal ring such as a quadrangular ring) instead of an annular ring. Moreover, even if it does not surround the light emitting element 11 over the perimeter, it may be interrupted on the way.

  The thickness of the sealing member 29 in a state where no pressing force is applied is the size of the space SP in the optical axis direction (the dimension between the bottom surface 13c and the mounting surface 12a of the substrate 12; (Dimensions shown) are set to the above dimensions. Therefore, the sealing member 29 is compressed by pressing the lens member 28 against the substrate 12 by the pressing structure 17 with the sealing member 29 sandwiched between the substrate 12 and the lens member 28. As a result, the end face 29 a comes into close contact with the lens member 28, and the end face 29 b comes into close contact with the substrate 12.

  In the present embodiment, the sealing member 29 includes a base layer 33 on the substrate 12 side and an adhesive layer 34 on the light control unit 13 side. The base layer 33 is a layer corresponding to the base portion of the sealing member 29, is made of an elastic member, and has a function of supporting the adhesive layer 34. The hardness of the base layer 33 of the sealing member 29 is set so that the Shore A hardness is 70 or less so that the base layer 33 is deformed following the uneven shape by the wiring pattern formed on the mounting surface 12a of the substrate 12 and can be in close contact with the mounting surface 12a. Good. The thickness of the base layer 33 is set larger than that of the adhesive layer 34. The base layer 33 and the adhesive layer 34 are set to have the same shape and the same size as viewed from the optical axis direction, but they may have different shapes and sizes.

  The adhesive layer 34 has a viscosity of at least a surface portion having a predetermined value or more, and can be adhered in close contact with the contact surface. That is, the adhesive layer 34 is a layer that constitutes the end surface 29a of the sealing member 29, and deforms following the uneven shape of the bottom surface 13c that is configured as a rough surface of the light control unit 13, and the bottom surface 13c It is a layer that can adhere. In the present embodiment, a double-sided tape 36 provided on the base layer 33 is applied as the adhesive layer 34. As shown in FIG. 6B, the double-sided tape 36 includes an adhesive layer 36a that adheres to the end face 33a of the base layer 33, an adhesive layer 36b that adheres to the rough bottom surface 13c, an adhesive layer 36a, and an adhesive layer. And a base material 36c separating the layer 36b. An adhesive that can adhere to the base layer 33 may be applied as the adhesive of the adhesive layer 36a. For example, a silicone-based adhesive can be used, and the light control unit 13 can be used as an adhesive of the adhesive layer 36b. On the other hand, an adhesive that can be adhered may be applied. For example, an acrylic adhesive may be used. Moreover, as the base material 36c, polyester or a nonwoven fabric can be used, for example. The adhesive layer 36b can be in close contact with the bottom surface 13c so as to bite into the uneven shape of the bottom surface 13c which is a rough surface (see, for example, the adhesive layer 34 in FIG. 6A). Therefore, the surface which contacts the rough surface which is a contact surface can be enlarged. In addition, although the double-sided tape 36 was illustrated as the adhesion layer 34, it is not limited to this, It is good also as a layer formed with a single adhesive.

  The sealing part 14 constituted by the sealing member 29 also serves as the light absorbing part 19. That is, the light absorption unit 19 is configured by a member disposed between the substrate 12 and the lens member 28. Here, the “member” is configured as a component that can be separated from the substrate 12 and the lens member 28 separately. Therefore, the structure in which the light absorption film is directly formed on the mounting surface 12a of the substrate 12 does not correspond to the “member” in the present embodiment. The light absorbing portion 19 is configured by a sealing member 29 that seals at least the space SP between the substrate 12 and the lens member 28 on the inner peripheral side of the light absorbing portion 19. Therefore, the light absorption part 19 is arrange | positioned so that the light emitting element 11 may be surrounded on the outer peripheral side. In the present embodiment, the light absorbing portion 19 has a characteristic of absorbing light by using a black material as the base layer 33 of the sealing member 29 described above. A material such as EPDM (ethylene propylene rubber) containing a pigment such as carbon or metal oxide, fluorine rubber, or silicone rubber is suitable for the light absorbing portion 19. Other materials having hardness that can be deformed following the wiring pattern formed on the mounting surface 12a of the substrate 12 by pressure may be used. Moreover, even if it is not black, if it has sufficient light absorbency, for example, it may be gray. For example, as the member of the light absorbing portion 19, a member having a light transmittance of 30 to 0% or 25 to 0% at 400 to 750 nm may be used. Here, the adhesive layer 34 may not have the light absorption performance. In other words, the members constituting the light absorption unit 19 may have light absorption performance over the entire area between the mounting surface 12a of the substrate 12 and the bottom surface 13c of the light control unit 13, but may not have. . As described above, the member constituting the light absorption unit 19 may not have the light absorption performance in the portion that directly contacts the bottom surface 13c of the light control unit 13, and instead of or in addition to that, The portion that directly contacts the mounting surface 12a may not have the light absorption performance. The sealing member 29 is formed in an annular shape and is disposed near the outer periphery of the space SP between the lens member 28 and the substrate 12. That is, the inner diameter is large. As a result, the contact pressure with the lens member 28 decreases as compared with the case where the inner diameter of the sealing member 29 is made smaller, so that the surface pressure increases. Therefore, since the sealing member 29 can be prevented from being lifted, the waterproof property can be further improved.

  Furthermore, the light absorption part 19 may be comprised from the member which has heat conductivity. In the present embodiment, the light absorbing portion 19 having thermal conductivity is preferably made of a material such as EPDM (ethylene propylene rubber), fluorine rubber, or silicone rubber containing carbon, metal, ceramics, or the like. For example, a member having a thermal conductivity of 1.0 W / m · K or 10.0 W / m · K or more may be used as the member of the light absorbing portion 19 having thermal conductivity. Here, the adhesive layer 34 may not have thermal conductivity when the thickness is sufficiently thin. In other words, the members constituting the light absorption unit 19 may be arranged so as to conduct heat from at least the mounting surface 12 a of the substrate 12 to the light control unit 13 through the light absorption unit 19. Thereby, the thermal radiation performance of the board | substrate 12 can be improved more. Therefore, the lifetime of the light emitting element module 1 can be extended. Further, the light absorbing portion 19 having thermal conductivity may be pressed by the pressing structure 17. In this case, it is possible to enhance the heat radiation performance and at the same time provide waterproofness.

  Moreover, the modification of this embodiment is respectively shown to Fig.7 (a) and (b). In the light emitting element module 101 illustrated in FIG. 7A, the sealing member 129 does not include an adhesive layer. For this reason, the end surface of the sealing member 129 is in direct contact with the lens member 28 by the pressing force of the pressing structure 17 to ensure waterproofness. Since the sealing member 129 is black as a whole, the sealing member 129 functions as the sealing portion 114 and also functions as the light absorbing portion 119. The sealing member 129 as the light absorbing portion 119 has a light absorbing performance even in a portion in contact with the bottom surface 13 c of the lens member 28. In such a configuration, since the sealing member 129 can be formed as a single member, labor and cost for manufacturing the sealing member 129 can be reduced. Moreover, since the whole sealing member 129 has light absorption performance, generation | occurrence | production of a brightness nonuniformity can be suppressed more reliably.

  In the light emitting element module 201 shown in FIG. 7B, as in the first embodiment, the sealing member 229 includes a base layer on the substrate 12 side and an adhesive layer on the light control unit 13 side. In the light emitting element module 201, both the base layer and the adhesive layer are black. Therefore, it differs from the light emitting element module 1 according to the first embodiment in that the adhesive layer also functions as the light absorbing portion 219. The sealing member 229 as the light absorbing portion 219 has light absorbing performance even in a portion that contacts the bottom surface 13c of the lens member 28. In such a configuration, the black pressure-sensitive adhesive layer having light absorption performance is in close contact with the lens member 28, so that the occurrence of luminance unevenness can be more reliably suppressed.

  Next, the configuration of the cover member 16 will be described. The cover member 16 protects each component mounted on the mounting surface 12a by covering the mounting surface 12a side of the substrate 12 while exposing the emission surface 13b of the light control unit 13. As shown in FIGS. 1 to 5, the cover member 16 is a substantially rectangular plate-like member that covers the mounting surface 12 a side of the substrate 12, and a synthetic resin such as polycarbonate resin, acrylic resin, or ABS resin is used as the material. be able to. The cover member 16 includes a base portion 41 that covers the mounting surface 12 a of the substrate 12, and a side wall portion 42 that surrounds the outer periphery of the substrate 12. The base portion 41 is disposed such that the back side (Z-axis negative side) back surface 41a faces the mounting surface 12a of the substrate 12 in parallel. The base portion 41 has a shape corresponding to the substrate 12 and has a rectangular shape whose longitudinal direction is the Y-axis direction. However, the base portion 41 may be appropriately changed according to the shape of the substrate 12. Good. The side wall part 42 is formed so as to cover the four side surfaces of the substrate 12 by extending from the four outer peripheral edge parts of the base part 41 to the back side (Z-axis negative side). That is, the length between the inner walls of the side wall portions 42 facing each other in the longitudinal direction (Y-axis direction) of the cover member 16 is substantially the same as the length in the longitudinal direction of the substrate 12. The length between the inner walls of the side wall portions 42 facing each other substantially coincides with the length in the short direction of the substrate 12. Further, of the four side wall portions 42 of the cover member 16, projecting portions 42 a projecting inward are formed in accordance with the semicircular shape of the notch portions 12 c paired in one diagonal direction ( (See FIG. 4). The protrusion 42a restricts displacement of the cover member 16 attached to the substrate 12 in the XY axis direction. In order to improve workability, a latch capable of fitting the substrate 12 to the protrusion 42a so that the position of the substrate 12 relative to the cover member 16 does not shift even if the entire light emitting element module 1 is turned in the positive direction of the Z axis. A structure may be provided.

  The base portion 41 of the cover member 16 has an opening 43 in which the light control unit 13 is disposed on the inner peripheral side, a potting portion 44 for potting the periphery of the solder portion 23 with the filler PT, and a drawer for pulling out the wire 21 Part 46 is formed. The base portion 41 is provided with bosses 47A and 47B for tightening the screws 53A and 53B. The configuration of the bosses 47A and 47B will be described later together with the description of the pressing structure 17.

  The opening 43 is a through-hole penetrating between the front surface 41 b and the back surface 41 a of the base portion 41 and is formed at the center position of the base portion 41. The opening 43 has a circular shape centered on the optical axis RL when viewed from the optical axis direction. A lens member 28 is disposed on the inner peripheral side of the opening 43. The light control unit 13 of the lens member 28 passes through the opening 43 and protrudes to the Z axis positive side from the surface 41 b of the base unit 41. The inner diameter of the opening 43 is larger than the outer diameter of the light control unit 13 (the outer diameter of the portion that spreads most outward in the radial direction). Accordingly, the inner edge 43a of the opening 43 and the light control unit 13 are separated in a direction parallel to the mounting surface 12a of the substrate 12 (that is, the XY axis direction and the direction orthogonal to the optical axis direction). Thus, at least a part of the mounting surface 12a of the substrate 12 is exposed in a region between the inner edge 43a of the opening 43 and the outer edge of the light control unit 13 when viewed from the optical axis direction (see FIG. 2). The opening 43 is provided with claw portions 51A and 51B protruding from the inner edge portion 43a to the inner peripheral side. The configuration of the claw portions 51A and 51B will be described later together with the description of the pressing structure 17.

  The potting portions 44 are respectively provided at positions corresponding to the solder portions 23 provided on the mounting surface 12 a of the substrate 12, that is, positions at both ends in the longitudinal direction (Y-axis direction) of the cover member 16. In the potting portion 44, an opening 48 penetrating between the front surface 41b and the back surface 41a is formed so that the solder portion 23 can be coated with the filler PT (colored in gray in FIGS. 1 and 5). Yes. The opening 48 has a rectangular shape when viewed from the optical axis direction. Further, in order to easily store the filler PT in the opening portion 48, side wall portions 49 protruding from the surface 41b so as to surround the opening portion 48 are formed at the four edge portions of the opening portion 48. The filler PT is not particularly limited as long as waterproof performance can be ensured. For example, a silicone resin, a modified silicone resin, a polyurethane resin, an acrylic resin, or the like can be used.

  The lead-out portion 46 is formed between the end portion in the longitudinal direction (Y-axis direction) of the cover member 16 and the potting portion 44. The lead portion 46 includes a plurality of guide grooves 51 for drawing the wire 21 from the solder portion 23 in the longitudinal direction (Y-axis direction) of the substrate 12. A region corresponding to the lead-out portion 46 protrudes to the front side (Z-axis positive side) from the surface 41b of the base portion 41, and a guide groove 51 is formed on the back surface 41a side of the protruding region. In the present embodiment, the three guide grooves 51 are formed with respect to the one extraction portion 46. However, since there are two wires 21 to be extracted, two guide grooves 51 may be provided. The guide groove 51 is a groove having a U-shaped cross section that extends in the longitudinal direction (Y-axis direction) of the cover member 16. The size and shape of the guide groove 51 are set according to the wire 21. The guide groove 51 extends from the outer peripheral surface of the side wall portion 42 of the cover member 16 to the opening 48 of the potting portion 44.

  Next, the pressing structure 17 will be described. The sealing of the space SP between the mounting surface 12a (substrate 12) and the incident surface 13a (light control unit 13) by the sealing unit 14 is realized by a pressing structure 17 that applies a pressing force to the sealing unit 14. Yes. The pressing structure 17 according to the present embodiment is applied to the flange portions 27A and 27B of the lens member 28, the claw portions 51A and 51B of the cover member 16 that presses the flange portions 27A and 27B toward the substrate 12, and the sealing portion 14. And a pressing force generator 52 for generating a pressing force.

  As described above, the flange portions 27A and 27B of the lens member 28 are configured to project outward from the light control unit 13 in the radial direction. The flange portions 27A and 27B extend in parallel with the bottom surface 13c. On the front side (Z-axis positive side) of the flange portion 27A, a rib 31 is provided at a central position in the circumferential direction. In addition, a columnar protruding portion 32 protruding toward the substrate 12 is provided on the back side (Z-axis negative side) of the flange portion 27A and the flange portion 27B. The protrusions 32 provided on the flange portion 27A and the flange portion 27B are inserted into the bottomed holes 12d formed on the mounting surface 12a of the substrate 12, respectively. The tip of the protruding portion 32 is positioned close to the bottom surface of the bottomed hole 12d, whereby the lens member 28 is positioned in the optical axis direction.

  Thus, by providing the positioning structure in the optical axis direction, it is possible to suppress application of excessive pressing force to the sealing portion 14, and the lens member 28 is inclined with respect to the optical axis RL. It can also be suppressed that a non-uniform pressing force is applied to the sealing member 29. Moreover, the positioning of the lens member 28 with respect to the board | substrate 12 can be easily performed by such a protrusion part 32 and the bottomed hole 12d at the time of an assembly. The flange 27A is provided with a rib 31 on the front side (Z-axis positive side). By using the rib 31 as a mark, the lens member 28 can be easily assembled to the substrate 12. When the reference line L3 extending in one diagonal direction of the substrate 12 and the cover member 16 is set (see FIG. 2), the flange portions 27A and 27B are arranged on the reference line L3 so that the lens member 28 is disposed. Is mounted on the substrate 12.

  The claw portions 51 </ b> A and 51 </ b> B protrude from the position on the upper end side of the inner edge portion 43 a of the opening portion 43 of the cover member 16 to the inner peripheral side. The surface on the back side (Z-axis negative side) of the claw portions 51A and 51B functions as a contact surface that contacts the surface on the front side (Z-axis positive side) of the flange portions 27A and 27B (see, for example, FIG. 6). It is arranged on the front side (Z axis positive side) from the back surface 41a. When viewed from the optical axis direction, the claw portion 51A and the claw portion 51B are disposed at positions facing each other across the optical axis RL.

  The pressing force generator 52 generates a pressing force by connecting the substrate 12 and the cover member 16 with a fastening member. In this embodiment, screws 53A and 53B are used as the fastening members. A pressing force is generated by screwing the substrate 12 and the cover member 16, specifically, screws 53 </ b> A and 53 </ b> B, bosses 47 </ b> A and 47 </ b> B formed on the cover member 16, and formed on the substrate 12. Through holes 15A and 15B. By tightening the screws 53A and 53B from the back surface 12b (the surface opposite to the mounting surface 12a) of the substrate 12 toward the cover member 16, the substrate 12 and the cover member 16 are coupled. Accordingly, screw holes 47a are formed in the bosses 47A and 47B of the cover member 16, and the through holes 15A and 15B of the substrate 12 are insertion holes through which the screws 53A and 53B are passed. Boss 47A, 47B protrudes from the surface 14a of the base part 41 to the front side (Z-axis positive side).

  According to the pressing structure 17 as described above, the lens member 28 is mounted on the mounting surface 12a of the substrate 12 in a state where the sealing member 29 is loaded in the region in the annular portion 26 of the lens member 28, and the substrate 12 The mounting surface 12 a is covered with a cover member 16. In this state, no pressing force is applied to the sealing member 29. Next, the screws 53A and 53B are fastened from the back surface 12b side of the substrate 12 to the screw holes 47a of the bosses 47A and 47B through the through holes 15A and 15B. By the tightening, the substrate 12 and the cover member 16 are moved so as to be close to each other in the optical axis direction. Accordingly, the claw portions 51A and 51B are also moved to the mounting surface 12a side of the substrate 12, and the flange portions 27A and 27B are pressed against the substrate 12 side by the claw portions 51A and 51B, whereby the entire lens member 28 is moved to the substrate 12. Move to the side. Thus, a pressing force is applied to the sealing member 29 by being sandwiched between the substrate 12 and the lens member 28.

  Next, functions and effects of the light emitting element module 1 according to the present embodiment will be described.

  FIG. 15 is a schematic diagram illustrating a structure of a light emitting element module according to a comparative example. The light emitting element module 401 according to the comparative example has the same configuration as that of the light emitting element module 1 according to the present embodiment, except that the light absorbing portion is not provided. Arrows A 3, A 3 ′, and A 4 schematically show a path of light generated in the light emitting element 11 in the light emitting element module 401.

  Arrows A <b> 3 and A <b> 3 ′ indicate a path of light that travels in the direction of the guide unit 13 d of the light control unit 13 among the light generated by the light emitting element 11. The light indicated by the arrow A3 is refracted in a direction away from the optical axis RL when entering the guide portion 13d. Next, the light is reflected by the emission surface 13 b and proceeds in the direction of the substrate 12. Next, the light is reflected by the incident surface 13a, travels away from the substrate 12, and is emitted from the output surface 13b. The light indicated by the arrow A3 'is refracted in a direction away from the optical axis RL when entering the guide portion 13d. Next, the light is reflected by the emission surface 13 b and proceeds in the direction of the substrate 12. Next, the light reaches the substrate 12 without being reflected by the incident surface 13a. And it reflects in the board | substrate 12, advances in the direction away from the board | substrate 12, and is radiate | emitted from the output surface 13b. The light indicated by the arrows A 3 and A 3 ′ is diffused and part of the light travels in the front direction of the light emitting element module 401. On the other hand, an arrow A4 indicates a path of light traveling in the direction along the substrate 12 among the light generated in the light emitting element 11. This light is scattered by the annular portion 26 and then emitted from the emission surface 13 b of the light control unit 13. The light indicated by the arrow A <b> 4 is diffused and part of the light travels in the front direction of the light emitting element module 401. As described above, in the light emitting element module 401 according to the comparative example, part of the light generated by the light emitting element 11 is emitted in the front direction as a result of being reflected and refracted. As a result, the intensity of light in the front direction becomes excessive, which may cause uneven brightness depending on the application, for example, when applied to a thin display device.

  On the other hand, FIG. 6 shows an outline showing a path of light generated in the light emitting element in the first embodiment. Arrows A <b> 1 and A <b> 2 schematically show a path of light generated in the light emitting element 11 in the light emitting element module 1. Arrow A <b> 1 indicates a path of light that travels in the direction of the guide portion 13 d of the light control unit 13 among the light generated in the light emitting element 11. This light is refracted in the direction away from the optical axis RL when entering the guide portion 13d, and reflected by the exit surface 13b, similar to the light path indicated by arrows A3 and A3 ′ in FIG. Go in the direction. However, the light absorbing portion 19 is provided between the substrate 12 and the incident surface 13a. Therefore, it is absorbed by the light absorber 19 without being reflected by the incident surface 13a and the substrate 12 as indicated by arrows A3 and A3 'in FIG.

  On the other hand, the arrow A <b> 2 indicates the path of light traveling in the direction along the substrate 12 among the light generated in the light emitting element 11. This light travels toward the annular portion 26 in the same manner as the arrow A4 in FIG. However, in this embodiment, the light absorption part 19 is provided between the light emitting element 11 and the annular part 26. For this reason, it is absorbed by the light absorption part 19 without being scattered by the annular part 26 as indicated by an arrow A4 in FIG. As a result, in the light emitting element module 1 according to the present embodiment, the intensity of light emitted in the front direction is suppressed. Therefore, for example, when applied to a thin display device, it is possible to suppress the occurrence of luminance unevenness regardless of the application.

  As described above, the light emitting element module 1 according to the present embodiment includes at least the light emitting element 11, the substrate 12 on which the light emitting element 11 is mounted, and the light control unit 13 disposed on the mounting surface 12a side of the substrate 12. The lens member 28 and the light absorption part 19 comprised by the member arrange | positioned between the board | substrate 12 and the lens member 28 are provided. Thereby, a part of the light generated by the light emitting element 11 is reflected by the substrate 12 and the lens member 28 and then absorbed by the light absorbing portion 19. The absorbed light includes light emitted in the front direction of the light emitting element module 1 if it is not absorbed by the light absorbing unit 19. For this reason, it can prevent that the light intensity of a front direction becomes large too much. Therefore, for example, even when it is disposed inside a thin display device, the occurrence of uneven brightness can be suppressed regardless of the application. Moreover, the light absorption part 19 can be formed only by disposing the member between the substrate 12 and the lens member 28.

  Further, in the light emitting element module 1 according to the present embodiment, the light absorbing portion 19 is disposed so as to surround the light emitting element 11 on the outer peripheral side. Thereby, since the light from the light emitting element 11 can be absorbed over the entire circumference, uniform optical characteristics independent of the direction can be obtained.

  Further, in the light emitting element module 1 according to the present embodiment, the light absorption unit 19 is provided by the sealing member 29 that seals the space SP between the substrate 12 and the lens member 28 on the inner peripheral side of the light absorption unit 19. It is configured. Thereby, since water can be prevented from entering the space SP, sufficient waterproof performance can be ensured. Moreover, such waterproof performance and light absorption performance can be made compatible.

  Further, in the light emitting element module 1 according to the present embodiment, the light absorbing portion 19 is configured by a member having thermal conductivity. Therefore, heat generated by energization of the light emitting element 11 can be radiated through the light absorbing portion 19. Accordingly, the life of the light emitting element module 1 can be extended by mounting the heat sink on the substrate 12.

  Further, in the light emitting element module 1 according to the present embodiment, the light emitting element module 1 includes a pressing structure 17 that applies a pressing force to the light absorbing portion 19. Therefore, the light absorption unit 19 can be brought into close contact with the mounting surface 12 a of the substrate 12 and the bottom surface 13 c of the light control unit 13. Thereby, while being able to improve the thermal radiation effect of the light emitting element module 1 via the light absorption part 19, waterproof performance can be provided.

[Second Embodiment]
FIG. 8 is a schematic diagram illustrating a structure in the vicinity of the light absorption unit according to the second embodiment. As shown in FIGS. 6 and 8, the light emitting element module 301 is different from the first embodiment in the configuration of the sealing portion 314 and the light absorbing portion 319.

  The light absorbing portion 319 is formed on the surface of the lens member 28 between the substrate 12 and the lens member 28. Specifically, the light absorbing portion 319 is formed on the bottom surface 13 c of the light control portion 13 constituting the lens member 28 and the inner side surface 26 a of the annular portion 26. The light absorbing portion 319 in the present embodiment is not provided with a separate member like the light absorbing portion according to the first embodiment, and a layer having light absorbing performance is directly formed on the surface of the lens member 28. It is constituted by doing. The layer constituting the light absorbing portion 319 may have a light transmittance of 30 to 0% at 400 to 750 nm, or 25 to 0%. Examples of the method for forming the light absorbing portion 319 include applying a black paint on the surface of the lens member 28, attaching a black sheet to the surface of the lens member 28, and two-color molding. The light absorbing portion 319a provided on the bottom surface 13c is formed in a circular shape so as to surround the outer periphery of the light emitting element 11 when viewed from the optical axis RL direction, and the outer diameter is the outer diameter of the bottom surface 13c (that is, the annular portion). 26 (inner diameter). In addition, as shown in FIG. 8, the outer diameter of the light absorption part 319a may be brought into contact with the annular part or may be separated. The inner diameter of the light absorbing portion 319a is formed so as to be spaced radially outward with respect to the light emitting element 11 when viewed from the optical axis RL direction. The light absorbing portion 319b provided on the inner side surface 26a of the annular portion 26 is provided from the contact portion with the substrate 12 to the connection portion with the bottom surface 13c of the light control portion 13 over the entire circumference of the inner side surface 26a.

  The sealing part 314 is configured by a sealing member 329 formed in an annular shape. The sealing member 329 is identical in shape to the sealing member 29 described in the first embodiment, but is different in that the sealing member 329 is formed of transparent silicone or the like. In addition, it is not necessary to be colorless and transparent, and a material may be appropriately selected from the viewpoint of ease of manufacture and manufacturing cost. The sealing member 329 is formed in an annular shape, and is disposed near the outer periphery of the space SP between the lens member 28 and the substrate 12. That is, the inner diameter is large. As a result, the contact pressure with the lens member 28 is reduced as compared with the case where the inner diameter of the sealing member 329 is made smaller, thereby increasing the surface pressure. Accordingly, the sealing member 329 can be prevented from being lifted, so that waterproofness can be further improved. Note that the sealing member 329 may not be disposed.

  In the light emitting element module 301, as in the light path shown in FIG. 6, a part of the light generated by the light emitting element 11 is incident on the guide portion and reflected by the exit surface 13b, and then is reflected on the bottom surface 13c of the light control portion 13. It is absorbed by the provided light absorber 319a. In addition, another part of the light generated in the light emitting element 11 travels in the direction along the substrate 12 and reaches the inner peripheral surface of the sealing member 329. Since the sealing member 329 is light transmissive, the light generated by the light emitting element 11 passes through the sealing member 329 and reaches the light absorbing portion 319b provided on the inner side surface 26a of the annular portion 26 to be absorbed. Is done. As a result, in the light emitting element module 301, the intensity of light emitted in the front direction is suppressed.

  As described above, according to the light emitting element module 301 according to the present embodiment, the light emitting element 11, the substrate 12 on which the light emitting element 11 is mounted, and the light control unit 13 disposed on the mounting surface 12a side of the substrate 12 are provided. At least a lens member 28 provided, and a light absorbing portion 319 formed on the surface of the lens member 28 between the substrate 12 and the lens member 28 are provided. Accordingly, a part of the light generated by the light emitting element 11 is reflected by the substrate 12 and the lens member 28 and then absorbed by the light absorbing portion 319. The absorbed light includes light emitted in the front direction of the light emitting element module 301 if it is not absorbed by the light absorbing unit 319. For this reason, it can prevent that the light intensity of a front direction becomes large too much. Therefore, for example, even when it is disposed inside a thin display device, the occurrence of uneven brightness can be suppressed regardless of the application. In addition, when a separate member is used as the light absorbing portion as in the first embodiment, it is necessary to use a large amount of a material having a light absorbing performance. In the case where the portion 319 is formed, light can be efficiently absorbed with a small amount of material.

  In addition, the light absorbing portion 319 is formed on the bottom surface 13 c of the light control portion 13. By forming the light absorbing portion 319 on the bottom surface 13c of the light control portion 13 configured as the light incident surface 13a, light can be efficiently absorbed. Thus, for example, when applied to a thin display device, it is possible to suppress the occurrence of luminance unevenness regardless of the application.

  The light absorbing portion 319 is formed on the inner surface of the lens member 28 provided so as to surround the light emitting element 11 on the outer peripheral side. Light that spreads from the light emitting element 11 toward the outer peripheral side can be absorbed by the light absorbing portion 319 formed on the inner surface. Thus, for example, when applied to a thin display device, it is possible to suppress the occurrence of luminance unevenness regardless of the application.

  The present invention has been described in detail based on the embodiments. However, the present invention is not limited to the above embodiment. For example, in the light emitting element module 1 shown in FIG. 6, the sealing member 29 has an annular configuration in which the upper and lower end surfaces 29a and 29b are planar, but as long as sufficient waterproof performance is ensured, Portions corresponding to the end faces 29a and 29b on both sides may be circular sections instead of being planar. In this case, the outer diameter of the sealing member 29 can be reduced, and can be applied to light emitting element modules having more various shapes.

  Further, in the light emitting element module 301 shown in FIG. 8, the light absorbing portion 319 is provided on the bottom surface 13 c of the light control portion 13 and the inner side surface 26 a of the annular portion 26 constituting the lens member 28. However, the light absorption unit 319 may be provided only on either the bottom surface 13 c of the light control unit 13 or the inner side surface 26 a of the annular portion 26. Even in this case, since a part of the light generated by the light emitting element 11 is absorbed by the light absorbing portion 319a or 319b, the effect of reducing the light intensity in the front direction can be obtained. This facilitates manufacturing.

  Moreover, in the above-mentioned embodiment, the light control part support part of the lens member was comprised by the annular part and the flange part. However, the configuration of the light control unit support unit is not particularly limited, and may be a protrusion or the like protruding downward from the light control unit.

  Moreover, in the above-mentioned embodiment, the sealing part 14 which serves as the light absorption part 19 was comprised from the member which has heat conductivity. However, the simple sealing part 14 may be comprised from the member which has heat conductivity.

[Example]
Hereinafter, although the light emitting element module which concerns on one form of this invention based on an Example is demonstrated concretely, the structure of a light emitting element module is not limited to the following Example.

(Optical characteristics)
A light emitting element module (Examples 1, 2 and 3) in which the conditions for the configuration of the light absorbing part are changed and a light emitting element module (Comparative Examples 1 and 2) having no light absorbing part for comparison are prepared The relationship between the orientation angle and the light intensity was measured. The orientation angle is an angle with respect to the optical axis RL, and is an angle indicated by α in FIG. The light absorption part of Example 1 is the same as the structure of the light emitting element module shown in FIG. 8, and is provided by applying a black paint on the flat part of the light control part and the inner surface of the annular part. . In the second embodiment, a light absorbing portion is provided by applying a black paint only to the inner surface of the annular portion in the configuration shown in FIG. The third embodiment has the same configuration as that shown in FIG. As a material for the sealing member, a cylindrical member having an outer diameter of 13.4 mm and an inner diameter of 9.0 mm obtained by adding a pigment to silicone rubber was employed. On the other hand, the comparative example 1 is a structure in which the light absorption part is not provided with respect to the structure shown in FIG. The comparative example 2 has a configuration in which the sealing member is changed to be transparent with respect to the configuration illustrated in FIG. In addition, Examples 1 and 2 and Comparative Example 1 do not include a sealing member. Structures other than the above are the same as those shown in FIG.

  As a result of the above test, as shown in FIGS. 9 and 10, it is understood that the light intensity in the front direction of the light emitting element module is reduced in all of Examples 1, 2, and 3. That is, when the average value of the light intensity in the region of the orientation angle of −40 degrees to +40 degrees is compared, the average value of Comparative Example 1 is 78% in Example 1, 93% in Example 2, and 76 in Example 3. % Was confirmed to be reduced to%. On the other hand, in Comparative Example 2, no reduction in light intensity was observed.

(Light transmittance)
A light emitting element module (Examples 1, 3 and 4) in which conditions for the configuration of the light absorption part and the sealing part are changed, and a light emitting element module (Comparative Example 2) having a structure not having the light absorption part for comparison. It prepared and measured the light transmittance of the light absorption part (for comparative example 2, sealing member). As described above, the configuration of the light absorption unit according to the first embodiment is obtained by applying a black paint on the surface of the light control unit, and does not include a sealing member. The light absorption part according to Example 3 is the same as the structure of the light emitting element module shown in FIG. 7A, and is configured by an annular sealing member made of black silicone having a thickness of 1.1 mm. The light absorption part according to Example 4 is obtained by attaching a gray VHB (registered trademark) double-sided tape (Y4300, manufactured by Sumitomo 3M Co., Ltd.) having a thickness of 0.8 mm to the surface of the light control part. Is not prepared. Comparative Example 2 does not include a light absorbing portion, but includes an annular sealing member made of transparent silicone having a thickness of 1.1 mm.

  The light transmittances of Examples 1, 3, 4 and Comparative Example 2 were measured by the test method shown in FIG. As shown in FIG. 11, the member which comprises the light absorption part or sealing part which concerns on each Example or a comparative example as a sample is directly inserted in a test position. Thereafter, the sample is irradiated with light from a light source (manufactured by Ocean Optics, HL2000CAL) through an optical fiber cable, and the light intensity that has passed through the sample is measured as a wavelength spectrum by a spectrophotometer (Ocean Optics, USB2000). And the transmittance | permeability for every wavelength shown to Fig.12 (a) is calculated by dividing the light intensity which passed the sample by the light intensity of incident light.

  FIG. 12B shows a value obtained by averaging the transmittance shown in FIG. 12A in the visible light region (400 to 750 nm). According to this, in Example 1, the transmittance was 22%, and in Examples 3 and 4, the transmitted light was below the measurement limit. On the other hand, in the comparative example 2 which does not have a light absorption part, the transmittance was 77%. From this result, it is considered that if the visible light transmittance is about 30% or less, even when applied to a thin display device, for example, the occurrence of luminance unevenness can be suppressed regardless of the application. It is done.

(Heat dissipation effect)
Assuming light emitting element modules (Examples 5, 6, 7, and 8) in which the thermal conductivity condition of the light absorbing portion is changed, the surface temperature of solder provided on the side surface of the light emitting element when the light emitting element is energized (hereinafter referred to as “light emitting element module”). , Solder surface temperature) was obtained by simulation. More specifically, first, a state where the light emitting element module was supported in the air was modeled by bringing the light emitting element module alone into a heat insulating state. Next, when the light-emitting element is energized in a state where the light absorption part is not mounted, the power at which the solder surface temperature becomes 60 degrees (heat generation condition 1) and the heat generation amount of the light-emitting element are set larger than those of the heat generation condition 1. The light emitting element was energized with electric power (heating condition 2). Then, the solder surface temperature at which the heat generation due to energization of the light emitting element and the heat radiation from the light emitting element module are in a steady state was obtained.

  In Example 5, the thermal conductivity was set to 0.17 W / m · K assuming a light absorbing portion made of silicone. In Example 6, in order to interpolate the data, the thermal conductivity was set to 1.7 W / m · K as a virtual material. In Example 7, the thermal conductivity was set to 17 W / m · K assuming a light absorbing portion made of a silicone gel including a filler for improving the heat conduction efficiency. In Example 8, the thermal conductivity was set to 25 W / m · K assuming a light absorption portion made of single-walled carbon nanotubes. The dimensions of the light absorbing portions according to Examples 5, 6, 7, and 8 are the same as in Example 3 in the optical characteristic test and the light transmittance test described above, and a cylindrical member having an outer diameter of 13.4 mm and an inner diameter of 9.0 mm. did.

  The heat dissipation effect of the light absorbing portion was evaluated by obtaining the solder surface temperature at a steady state under the above conditions by simulation. FIG. 13 is a graph showing the solder surface temperature when the light emitting element modules according to Examples 5, 6, 7, and 8 are energized under the heat generation conditions 1 and 2. The horizontal axis is the thermal conductivity (corresponding to each example), and the vertical axis is the solder surface temperature. Further, FIG. 14 is a graph showing how many times the solder surface temperatures of Examples 6, 7, and 8 are lowered with respect to FIG. As a result, even under the heat generation condition 1, which is a condition closer to the actual heat dissipation effect, it is possible to obtain an effect of lowering the solder surface temperature at least once by using a member having thermal conductivity for the light absorbing portion. (Examples 6, 7, and 8) were confirmed.

  DESCRIPTION OF SYMBOLS 1,101,201,301 ... Light emitting element module, 11 ... Light emitting element, 12 ... Board | substrate, 12a ... Mounting surface, 13 ... Light control part, 19, 119, 219, 319 ... Light absorption part, 28 ... Lens member, 29 , 129, 229, 329 ... sealing members.

Claims (8)

A light emitting element for generating light;
A substrate on which the light emitting element is mounted;
A lens member that is disposed on the mounting surface side of the substrate and includes at least a light control unit that controls emission of light generated by the light emitting element;
A light absorption part for absorbing light,
The light absorbing unit is a light emitting element module configured by a member disposed between the substrate and the lens member.   The light-emitting element module according to claim 1, wherein the light absorption unit is disposed so as to surround the light-emitting element on an outer peripheral side.   The light-emitting element module according to claim 2, wherein the light absorption unit is configured by a sealing member that seals at least a space between the substrate and the lens member on an inner peripheral side of the light absorption unit.   The light-emitting element module according to claim 1, wherein the light absorption unit is configured by a member having thermal conductivity.   The light emitting element module according to claim 4, further comprising a pressing structure that applies a pressing force to the light absorbing portion. A light emitting element for generating light;
A substrate on which the light emitting element is mounted;
A lens member that is disposed on the mounting surface side of the substrate and includes at least a light control unit that controls emission of light generated by the light emitting element;
A light absorption part for absorbing light,
The light absorbing unit is a light emitting element module formed on a surface of the lens member between the substrate and the lens member.   The light emitting element module according to claim 6, wherein the light absorption unit is formed on a bottom surface of the light control unit.   The light-emitting element module according to claim 6, wherein the light absorbing portion is formed on an inner surface of the lens member provided so as to surround the light-emitting element on the outer peripheral side.