JP2014151249A5

JP2014151249A5 -

Info

Publication number: JP2014151249A5
Application number: JP2013021416A
Authority: JP
Filing date: 2013-02-06
Publication date: 2015-03-19
Anticipated expiration: 2033-02-06

Description

仕切り板１４の平坦面部２５の領域の上面には、ミスト供給部に相当する二流体ノズルであるミストノズル３が設けられる。ミストノズル３はウエハＷの下方であって、周方向に等間隔に４ヶ所に設置されている。ミストノズル３の構成について、図４、図５も参照しながら説明する。ミストノズル３の内部には、縦方向に貫通する処理液供給路４３が設けられており、処理液供給路４３の先端部分には先端部材４０が設けられ、この先端部材４０は、周縁部に多数の処理液吐出孔４１が周方向に等間隔に並べて設けられている。処理液吐出孔４１には、処理液吐出孔４１から突出するようにガイド部４６が設けられている。 A mist nozzle 3 that is a two-fluid nozzle corresponding to a mist supply unit is provided on the upper surface of the area of the flat surface portion 25 of the partition plate 14. The mist nozzles 3 are provided at four locations below the wafer W at equal intervals in the circumferential direction. The configuration of the mist nozzle 3 will be described with reference to FIGS. Inside the mist nozzle 3, the processing liquid supply path 43 penetrating in a vertical direction is provided, the tip member 40 is provided at the tip portion of the processing liquid supply channel 43, the tip member 40, the peripheral portion A large number of treatment liquid discharge holes 41 are arranged at equal intervals in the circumferential direction. The processing solution discharge hole 41, and the guide portion 46 is provided so as to protrude from the processing liquid discharge hole 41.

ガス吐出流路４２は、ガス供給管４７の一端と接続されており、ガス供給管４７の他端には、例えばポンプやバルブ、マスフローメータなどで構成されるガス供給機構４８が接続されており、例えば所定量の窒素ガスをガス吐出流路４２から吐出できるように構成されている。
ミストノズル３は、処理液吐出孔４１から純水を吐出して、吐出される純水に向けてガス吐出流路４２より窒素ガスを吐出する。吐出される純水とキャリアガスである窒素ガスとが混合されて、微細なミストが形成されると推測される。
The gas discharge passage 42 is connected to one end of a gas supply pipe 47, and the other end of the gas supply pipe 47 is connected to a gas supply mechanism 48 composed of, for example, a pump, a valve, a mass flow meter, and the like. For example, a predetermined amount of nitrogen gas can be discharged from the gas discharge passage 42.
The mist nozzle 3 discharges pure water from the treatment liquid discharge hole 41 and discharges nitrogen gas from the gas discharge passage 42 toward the discharged pure water. It is presumed that fine water mist is formed by mixing the discharged pure water and the nitrogen gas as the carrier gas.

Claims

A step of horizontally holding the substrate on a substrate holding portion that is rotatable around a vertical axis;
Thereafter, supplying a coating solution to the center of the substrate, and forming a coating film on the substrate by spreading by a centrifugal force due to rotation of the substrate;
Supplying the mist that is a group of fine particles of liquid or solid to the lower surface side of the substrate before the coating solution reaches the peripheral edge of the substrate, and cooling the substrate;
A coating film forming method comprising:

The coating film forming method according to claim 1, wherein the mist has a particle size of 100 μm or less.

The step of forming the coating film on the substrate includes a step of rotating the substrate at a first rotation speed and supplying a coating liquid to the central portion of the substrate, and then a second rotation that is slower than the first rotation speed. Rotating at a speed, and then rotating the substrate at a third rotational speed faster than the second rotational speed to spread the coating liquid to the peripheral edge of the substrate,
3. The coating film forming method according to claim 1, wherein the supply of the mist is started before the substrate is rotated at the third rotation speed .

A step of horizontally holding the substrate on a substrate holding portion that is rotatable around a vertical axis;
Next, rotating the substrate on the substrate holding unit, volatilizing the liquid by an air flow formed on the lower surface side of the substrate from the liquid storage unit facing the lower surface of the substrate, and cooling the substrate;
Thereafter, supplying a coating solution to the center of the substrate, and forming a coating film on the substrate by spreading by a centrifugal force due to rotation of the substrate;
A coating film forming method comprising:

In a coating film forming apparatus for forming a coating film on a surface of a substrate by spin coating,
A substrate holder for horizontally holding the substrate;
A rotation mechanism for rotating the substrate holder around a vertical axis;
A coating solution nozzle for supplying a coating solution to the substrate;
A cup body provided to surround the substrate and connected to a drain path for discharging the coating liquid scattered by the rotation of the substrate and an exhaust path for exhausting the internal atmosphere;
A mist supply unit for supplying mist which is a liquid or solid particle group to the lower surface side of the substrate;
A control unit for outputting a control signal so as to discharge the mist from the mist supply unit before the coating liquid reaches the peripheral edge of the substrate;
A coating film forming apparatus comprising:

The coating film forming apparatus according to claim 5, wherein the mist has a particle size of 100 μm or less.

The control unit rotates the substrate at a first rotation speed, supplies a coating liquid to the central portion of the substrate in this state, and then rotates the substrate at a second rotation speed lower than the first rotation speed. A step of rotating, a step of rotating the substrate at a third rotational speed higher than the second rotational speed, and a step of rotating the substrate at the third rotational speed in order to spread the coating liquid to the peripheral edge of the substrate thereafter. 7. The coating film forming apparatus according to claim 5, wherein a control signal is output so as to execute a step of starting the supply of mist before.

In a coating film forming apparatus that applies a coating liquid to the surface of a substrate and forms a coating film by spin coating,
A substrate holder for horizontally holding the substrate;
A rotation mechanism for rotating the substrate held by the substrate holding unit around a vertical axis;
A coating solution nozzle for supplying a coating solution to the substrate held by the substrate holding unit;
A cup body provided so as to surround the substrate and connected to a discharge path for discharging the coating liquid scattered by rotation of the substrate and an exhaust path for exhausting the internal atmosphere;
A liquid container that opens to face the lower surface of the substrate and volatilizes the liquid by the airflow;
An apparatus for forming a coating film, comprising: a gas inlet for pulling a substrate onto a lower surface side of the substrate by the rotation of the substrate on the substrate holding portion to form an air flow.

A storage medium storing a computer program used in a coating film forming apparatus that forms a coating film on a surface of a substrate by spin coating,
A storage medium, wherein the computer program includes a group of steps so as to execute the coating film forming method according to any one of claims 1 to 4.