JP2014146702A - Electronic apparatus and housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus which achieves a low height while having a heat radiation fin part for radiating heat generated by heating elements.SOLUTION: A housing body (a first case 120 and a second case 130) houses an electronic substrate 110 on which electronic components 112a to 112f including heating elements (the electronic components 112b, 112c) are mounted. The housing body includes first and second main plates which face the electronic substrate 110. A first recessed part 122 is formed on the first main plate 121 so as to recess from the side away from the electronic substrate 110 to the side close to the electronic substrate 110. A first heat radiation fin part 123 is placed in the first recessed part 122. The first heat radiation fin part 123 is formed so as to extend from an outer surface of a region of the first main plate 121 where the first recessed part 122 is formed. Further, the first heat radiation fin part 123 radiates heat generated by the heating elements (the electronic components 112b, 112c).

Description

  The present invention relates to an electronic device and a housing, and for example, relates to an electronic device and a housing that include a heat dissipating fin portion that houses an electronic board on which an electronic component including a heating element is mounted and radiates heat generated by the heating element.

  2. Description of the Related Art In recent years, electronic devices such as communication devices and computers have been rapidly increasing in performance and functionality, such as performing a large amount of computation at a high speed. Along with this, among components installed in electronic devices (for example, LTE (Long Term Evolution) devices), particularly, a central processing unit (CPU), an integrated circuit (multi-chip module: MCM), etc. The calorific value tends to increase.

  In order to dissipate heat generated by such CPUs and MCMs, electronic devices having heat dissipating fins in electronic devices are widely known.

  FIG. 6 is a diagram showing a configuration of an electronic device 900 related to the present invention.

  As shown in FIG. 6, the electronic device 900 includes an electronic substrate 910, a first case 920, and a second case 930.

  The electronic board 910 is accommodated in the first case 920 and the second case 930. A plurality of electronic components 912a to 912f including a heating element are mounted on the first surface 911a and the second surface 911b of the base 911 of the electronic substrate 910. Here, it is assumed that the electronic component 912c is a heating element.

  The first case 920 has a first main plate 921 of the electronic device 900. A plurality of heat radiating fin portions 923 are formed on the first main plate 921.

  The second case 930 includes the second main plate 931 of the electronic device 900.

  The first case 920 and the second case 930 are formed with fitting portions 925 and 935, respectively. By fitting these fitting portions 925 and 935, the electronic substrate 910 is accommodated in a space constituted by the first case 920 and the second case 930.

  Further, substrate holding ribs 926 and 936 are formed in the first case 920 and the second case 930, respectively. The electronic substrate 910 is sandwiched and held by these substrate holding ribs 926 and 936.

  In the electronic device 900 configured as described above, the heat generated by the electronic component 913c (heating element) is radiated to the outside air by the plurality of heat radiating fin portions 923. Thereby, the electronic substrate 910 on which the heat generating element is mounted can be cooled.

  In addition, as a reference technique of the present invention, a technique for forming a radiating fin portion by casting is disclosed in Patent Document 1 and Patent Document 2.

Utility Model Registration No. 3020103 Special table 2011-508447 gazette

  However, as in the electronic device 900 shown in FIG. 6, the casing main body in which the first case 920 and the second case 930 are combined is formed in a rectangular parallelepiped shape so as to avoid interference with the electronic components 912a to 912f. It had been. For this reason, when the radiating fin portion 923 is provided, there is a problem that the height H2 of the electronic device 900 including the radiating fin portion 923 is increased.

  The present invention has been made in view of such circumstances, and provides an electronic device and a housing that can keep the height of the device low while having a radiation fin portion that radiates the heat generated by the heating element. To do.

  The electronic device of the present invention accommodates an electronic board on which an electronic component including a heating element is mounted, and includes a housing main body having first and second main plates facing the electronic board surface, and the first main plate includes the above-described main body. A first recess formed so as to be recessed toward the side approaching from the side away from the electronic substrate, and a region of the first main plate in which the first recess is formed, disposed in the first recess. And a first radiating fin portion that radiates heat generated by the heat generating element.

  The housing of the present invention can accommodate an electronic substrate on which an electronic component including a heat generating element is mounted, and includes a housing body having first and second main plates facing the electronic substrate, and the first main plate. A first first recess formed to be recessed toward the side approaching from the side away from the electronic substrate, and the first recess of the first main plate disposed in the first recess. And a first heat dissipating fin portion that radiates heat generated by the heat generating element.

  According to the electronic device and the housing of the present invention, the height of the device can be kept low while having the heat dissipating fin portion that dissipates heat generated by the heat generating element.

It is sectional drawing which shows the structure of the electronic device in the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the 1st modification of the electronic device in the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the 2nd modification of the electronic device in the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in the 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device relevant to this invention.

<First Embodiment>
The configuration of electronic device 100 according to the first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a configuration of an electronic device 100 according to the first embodiment of the present invention.

  As shown in FIG. 1, the electronic device 100 includes an electronic substrate 110, a first case 120, and a second case 130. In addition, the housing | casing which combined the 1st case 110 and the 2nd case 120 respond | corresponds to the housing body of this invention.

  The electronic board 110 is accommodated by the first case 120 and the second case 130. The electronic substrate 110 includes a base material 111 and a plurality of electronic components 112a to 112f.

  The base material 111 is formed in a flat plate shape. For example, glass epoxy resin is used as the material of the base material 111.

  The electronic components 112a to 112f are, for example, a central processing unit (CPU), an integrated circuit (MCM), a heating element such as a transistor, a coil, a filter, and a resistor. In addition, at least one of the electronic components 112a to 112f is a heating element. Here, it is assumed that the electronic components 112b and 112c are heating elements. As shown in FIG. 1, the upper surfaces of the electronic components 112 b and 112 c that are heating elements are in contact with the inner surface of the first case 121. That is, the recess 122 described later is provided corresponding to the mounting position of the heating elements 112b and 112c. As a result, the heat generated by the electronic components 112b and 112c, which are heat generating elements, is easily transferred to the first case 120.

  As shown in FIG. 1, the electronic components 112 a to 112 c are mounted on the first surface 111 a of the substrate 111. Further, the electronic substrates 112d to 112f are mounted on the second surface 111b of the base material 111.

  The first case 120 includes a first main plate 121, a first recess 122, and a first radiating fin portion 123. The first main plate 121 constitutes the outer surface of the housing body of the present invention.

  As shown in FIG. 1, the first recess 122 is formed in the first main plate 121 so as to be recessed toward the side approaching from the side away from the electronic substrate 110. The first recess 122 is formed according to the height of the electronic components 112b and 112c. That is, the first recess 122 is formed in the first main plate 121 so that the upper surfaces of the electronic components 112 b and 112 c that are heat generating elements are in contact with the inner surface of the first case 120. At this time, as shown in FIG. 1, the electronic components 112 b and 112 c that are heating elements are arranged so as to be thermally connected to a surface of the first recess 122 that faces the electronic substrate 110.

  The first radiating fin portion 123 is disposed in the first recess 122. Moreover, the 1st heat radiating fin part 123 is formed so that it may extend from the outer surface of the area | region in which the 1st recessed part 122 was formed among the 1st main plates 121. As shown in FIG. The first heat radiating fin portion 123 radiates heat generated by the electronic components 112b and 112c (heating elements) to the outside air. Heat generated by the electronic components 112 b and 112 c (heat generating elements) is transferred to the heat radiating fins 123 through the inner surface of the first case 120. The first heat radiation fin portion 123 can function as a heat sink or a radiator.

  The first heat dissipating fin portion 123 is preferably formed when the first case 120 is molded by casting. Thereby, compared with the case where the 1st radiation fin part 123 is formed by processing a sheet metal using an extrusion die material, a process can be simplified and manufacturing cost can be reduced.

  Further, as shown in FIG. 1, of the first main plate 121, the outer surface of the first recessed portion forming region where the first recessed portion 122 is formed and the outer surface of the region other than the first recessed portion forming region. The step height h1a between them can be greater than or equal to the height h1b of the first fin portion 123 in a direction substantially perpendicular to the surface of the electronic substrate 110 (up and down in the plane of FIG. 1). In this case, the front end portion of the first fin portion 123 is above the outer surface of the first main plate 121 other than the first concave portion formation region where the first concave portion 122 is formed (on the paper surface of FIG. 1). It does not protrude in the vertical direction. That is, by satisfying h1b ≦ h1a, the housing body constituted by the first case 120 and the second case 130 can be made more compact. On the other hand, it is good also as h1b> h1a as needed, such as heat dissipation efficiency.

  Further, as shown in FIG. 1, the distance h1c between the outer surface of the first main plate 121 other than the first recess formation region and the surface of the electronic substrate 110 is other than the first recess formation region. It is set according to the height of the electronic component 112a mounted on the electronic board 110 corresponding to the area. Since the distance h1c is set according to the mounting height of the electronic component 112a, the distance h1c can be set to the minimum necessary distance. In other words, by setting the distance h1c to the minimum according to the mounting height of the electronic component 112a, the housing main body constituted by the first case 120 and the second case 130 can be made more compact. it can. On the other hand, the distance h1c may not be adjusted to the mounting height of the electronic component 112a depending on the design conditions.

  The first case 120 and the second case 130 are formed with fitting portions 125 and 135, respectively. By fitting these fitting portions 125 and 135, the electronic substrate 110 is accommodated in the space of the housing body configured by the first case 120 and the second case 130.

  Further, substrate holding ribs 126 and 136 are formed in the first case 120 and the second case 130, respectively. The electronic board 110 is sandwiched and held by these board holding ribs 126 and 136.

  Next, a first modification 100a of the electronic device according to the first embodiment of the present invention will be described with reference to the drawings.

  FIG. 2 is a cross-sectional view illustrating a configuration of the electronic device 100a. In FIG. 2, components equivalent to the components shown in FIG. 1 are denoted by the same symbols as those shown in FIG. 1.

  As shown in FIG. 2, the electronic device 100 a includes an electronic substrate 110, a first case 120, and a second case 130. In addition, the housing | casing which combined the 1st case 110 and the 2nd case 120 respond | corresponds to the housing body of this invention.

  Here, FIG. 1 and FIG. 2 are compared. 2 is different from FIG. 1 in that a heat conductive member 140 is interposed between the electronic components 112b and 112c, which are heat generating elements, and the inner surface of the first recess 122. FIG. That is, the electronic components 112 b and 112 c that are heating elements are arranged so as to be thermally connected to the first recess 122 via the heat conductive member 140.

  The thermally conductive member is formed of, for example, a material that reduces the thermal resistance between the upper surface of the heating element (electronic components 112b and 112c) and the inner surface facing the electronic substrate 110 among the surfaces constituting the first recess 122. Has been. Here, the material of the heat conductive member includes, for example, a silicon compound or a polymer resin.

  Next, a second modification 100b of the electronic device according to the first embodiment of the present invention will be described with reference to the drawings.

  FIG. 3 is a cross-sectional view illustrating a configuration of the electronic device 100b. In FIG. 3, constituent elements equivalent to those shown in FIGS. 1 to 2 are given the same reference numerals as those shown in FIGS. 1 to 2.

  As shown in FIG. 3, the electronic device 100 b includes an electronic substrate 110, a first case 120 b, and a second case 130. Note that the case in which the first case 110b and the second case 120 are combined corresponds to the case main body of the present invention.

  Here, FIG. 1 and FIG. 3 are compared. In FIG. 1, the recess 122 is formed on one end side of the first case 120 (on the right side of the paper surface of FIG. 1). On the other hand, in FIG. 3, the recessed part 122 is formed in the center part of the 1st case 120b. Thus, the position of the recess 122 can be changed according to the mounting position of the heat generating element. Even with such a configuration, the same effect as the above-described configuration can be obtained.

  As described above, the electronic device 100 according to the first embodiment of the present invention includes the housing body (the first case 120 and the second case 130), the first recess 122, and the first radiating fin portion. 123. The housing body accommodates the electronic substrate 110 on which the electronic components 112a to 112f including the heat generating elements (electronic components 112b and 112c) are mounted. In addition, the housing body has first and second main plates 121 and 131 that face the electronic substrate 110. The first recess 122 is formed so as to be recessed in the first main plate 121 toward the side approaching from the side away from the electronic substrate 110. The first radiating fin portion 123 is disposed in the first recess 122. Moreover, the 1st heat radiating fin part 123 is formed so that it may extend from the outer surface of the area | region in which the 1st recessed part 122 was formed among the 1st main plates 121. As shown in FIG. Further, the first heat radiating fin portion 123 radiates heat generated by the heat generating elements (electronic components 112b and 112c).

  As described above, the first recess 122 is formed in the first main plate 121 of the housing body, and the first heat dissipating fin portion 123 is provided in the first recess 122. The amount by which the first fin portion 123 protrudes outward from the first main plate 121 can be reduced. As a result, the height H1 of the device can be kept low while having the radiation fin portion that radiates the heat generated by the heating element. Therefore, the size of the apparatus can be made compact. Preferably, the height of the first fin portion 123 can be set so that the first fin portion 123 does not protrude outward from the first main plate 121 of the housing body. Thereby, the maximum height of the housing body can be adjusted to the minimum.

  Moreover, in the electronic device 100 according to the first embodiment of the present invention, the outer surface of the first recess forming area in which the first recess 122 is formed in the first main plate 121 and the first recess forming area. The step height h1a between the outer surfaces of the other regions is equal to or higher than the height h1b of the first fin portion 123 in the direction substantially perpendicular to the surface of the electronic substrate 110. For this reason, the front-end | tip part of the 1st fin part 123 does not protrude above the outer surface other than the 1st recessed part formation area in which the 1st recessed part 122 was formed among the 1st main plates 121. .

  In the electronic device 100 according to the first embodiment of the present invention, the distance h1c between the outer surface of the first main plate 121 other than the first recess formation region and the surface of the electronic substrate 110 is the first It is set in accordance with the height of the electronic component 112a mounted on the electronic substrate 110 corresponding to a region other than the one recess forming region.

  Thus, since the distance h1c is set according to the mounting height of the electronic component 112a, the distance h1c can be set to the minimum necessary distance. As a result, the housing body (the first case 120 and the second case 130) can be made more compact.

  In the electronic device 100 according to the first embodiment of the present invention, the first recess 122 is formed according to the height of the electronic components 112b and 112c. That is, the first recess 122 is formed in the first main plate 121 so that the upper surfaces of the electronic components 112 b and 112 c that are heat generating elements are in contact with the inner surface of the first case 120. As a result, the heat generated by the electronic components 112b and 112c, which are heat generating elements, can be efficiently transferred to the first radiating fin portion 123 via the first main plate 121.

  In the electronic device 100 according to the first embodiment of the present invention, the heating elements (electronic components 112b and 112c) are thermally connected to the inner surface facing the electronic substrate 110 among the surfaces constituting the first recess 122. Has been placed. As a result, the heat generated by the thermal elements (electronic components 112b and 112c) can be efficiently transferred to the first radiating fin portion 123 via the first main plate 121.

  In the electronic device 100a according to the first embodiment of the present invention, the heating elements (electronic components 112b and 112c) are formed on the electronic substrate 110 among the surfaces constituting the first recess 122 via the heat conductive member 140. It may be arranged to thermally connect to the opposing inner surfaces.

  Thereby, the thermal resistance between the upper surface of the heat generating elements (electronic components 112b and 112c) and the inner surface facing the electronic substrate 110 among the surfaces constituting the first recess 122 is reduced. By using the heat conductive member 140, an air gap is formed between the upper surface of the heating element (electronic components 112 b and 112 c) and the inner surface facing the electronic substrate 110 among the surfaces constituting the first recess 122. This can be further suppressed, and these surfaces can be brought into close contact with each other. As a result, the heat generated by the heat generating elements (electronic components 112b and 112c) can be more efficiently transmitted to the first heat radiating fin portion 123 through the housing body.

  In the electronic device 100 according to the first embodiment of the present invention, the housing body (the first case 120 and the second case 130) is preferably molded by casting. Thereby, the 1st thermal radiation fin part 123 can be formed simultaneously when shape | molding the 1st case 120 by casting. Thereby, compared with the case where a radiation fin part is formed by processing a sheet metal using an extrusion die material, the processing can be simplified, and the manufacturing cost can be reduced.

  The housing according to the first embodiment of the present invention includes a housing body (first case 120 and second case 130), a first recess 122, and a first radiating fin portion 123. Yes. The housing main body can accommodate the electronic substrate 110 on which the electronic components 112a to 112f including the heating elements (electronic components 112b and 112c) are mounted. In addition, the housing body has first and second main plates 121 and 131 that face the electronic substrate 110. The first recess 122 is formed so as to be recessed in the first main plate 121 toward the side approaching from the side away from the electronic substrate 110. The first radiating fin portion 123 is disposed in the first recess 122. Moreover, the 1st heat radiating fin part 123 is formed so that it may extend from the outer surface of the area | region in which the 1st recessed part 122 was formed among the 1st main plates 121. As shown in FIG. Further, the first heat radiating fin portion 123 radiates heat generated by the heat generating elements (electronic components 112b and 112c).

  This configuration corresponds to the electronic device described above. Therefore, even with such a casing, the same effects as those of the electronic device described above can be obtained. That is, the first recess 122 is formed in the first main plate 121 of the housing body, and the first heat radiating fin portion 123 is provided in the first recess 122. The amount by which the first fin portion 123 protrudes outward from the first main plate 121 can be reduced. As a result, the height H1 of the device can be kept low while having the radiation fin portion that radiates the heat generated by the heating element. Therefore, the size of the apparatus can be made compact. Preferably, the height of the first fin portion 123 can be set so that the first fin portion 123 does not protrude outward from the first main plate 121 of the housing body. Thereby, the maximum height of the housing body can be adjusted to the minimum.

<Second Embodiment>
The configuration of electronic device 100A according to the second embodiment of the present invention will be described with reference to the drawings.

  FIG. 4 is a cross-sectional view showing a configuration of an electronic device 100A according to the second embodiment of the present invention. In FIG. 4, constituent elements that are equivalent to the constituent elements shown in FIGS. 1 to 3 are given the same reference numerals as those shown in FIGS. 1 to 3.

  As shown in FIG. 4, the electronic device 100 </ b> A includes an electronic substrate 110, a first case 120 </ b> A, and a second case 130. Note that the housing in which the first case 110A and the second case 120 are combined corresponds to the housing body of the present invention.

  Here, FIG. 4 and FIG. 1 are compared. 4 is different from FIG. 1 in that the second radiating fin portion 124 is formed on the first main plate 121A of the first case 120A.

  That is, the first case 121 </ b> A includes a first main plate 121 </ b> A, a first recess 122, a first heat radiating fin portion 123, and a second fin portion 124. The first main plate 121A is the outer surface of the housing body of the present invention.

  As shown in FIG. 4, the second radiating fin portion 124 is formed so as to extend from the outer surface of a region other than the first concave portion formation region of the first main plate 121A. Moreover, the 2nd radiation fin part 124 is formed so that it may extend from the outer surface of area | regions other than the 1st recessed part formation area among the 1st main plates 121A. Further, the second heat radiation fin portion 124 radiates heat generated by the heat generating elements (electronic components 112b and 112c) to the outside air.

  Heat generated by the heat generating elements (electronic components 112 b and 112 c) is transferred to the first radiating fin portion 123 and the second radiating fin portion 124 via the inner surface of the first case 120. Therefore, in the present embodiment, both the first heat radiating fin portion 123 and the second heat radiating fin portion 124 radiate the heat generated by the heat generating elements (electronic components 112b and 112c) to the outside air. The first radiating fin portion 123 and the second radiating fin portion 124 can function as a heat sink or a radiator.

  The first radiating fin portion 123 and the second radiating fin portion 124 are preferably formed when the first case 120 is molded by casting. Thereby, compared with the case where a radiation fin part is formed by processing a sheet metal using an extrusion die material, the processing can be simplified, and the manufacturing cost can be reduced.

  Here, the distance h1d between the front end portion of the first fin portion 123 and the surface of the electronic substrate 110 and the distance h1e between the front end portion of the second fin portion 124 and the surface of the electronic substrate 110 are as follows. They are set to be substantially the same in a direction substantially perpendicular to the surface. As a result, the front end portion of the first fin portion 123 and the front end portion of the second fin portion 124 are arranged on the same plane substantially parallel to the surface of the electronic substrate 110, so that the appearance of the appearance is improved. can do.

  As described above, the electronic device 100A according to the second embodiment of the present invention further includes the second fin portion 124. The second fin portion 124 is formed to extend from the outer surface of the first main plate 120A other than the first recess formation region. Further, the heat generated by the heating elements (electronic components 112b and 112c) is radiated.

  As described above, in the electronic device 100A, in addition to the first fin portion 123 provided in the first recess 122, the second fin portion 124 is used to generate heat from the heating elements (electronic components 112b and 112c). Dissipate heat. Therefore, the heat generated by the heating elements (electronic components 112b and 112c) can be radiated more efficiently.

  In the electronic device 100A according to the second embodiment of the present invention, the distance h1d between the front end portion of the first fin portion 123 and the surface of the electronic substrate 110, the front end portion of the second fin portion 124, and the electrons. The distance h1e between the substrate 110 and the surface of the substrate 110 is substantially the same in a direction substantially perpendicular to the surface of the electronic substrate 110.

  As a result, the front end portion of the first fin portion 123 and the front end portion of the second fin portion 124 are arranged on the same plane substantially parallel to the surface of the electronic substrate 110, so that the appearance of the appearance is improved. can do.

<Third Embodiment>
The configuration of electronic device 100B according to the third embodiment of the present invention will be described with reference to the drawings.

  FIG. 5 is a cross-sectional view showing a configuration of an electronic device 100B according to the third embodiment of the present invention. In FIG. 5, constituent elements equivalent to those shown in FIGS. 1 to 4 are denoted by the same reference numerals as those shown in FIGS. 1 to 4.

  As shown in FIG. 5, the electronic device 100B includes an electronic substrate 110, a first case 120A, and a second case 130A. Note that the housing in which the first case 110A and the second case 120A are combined corresponds to the housing body of the present invention.

  Here, FIG. 5 and FIG. 4 are compared. 4 and 5 are common in that they have a first case 120A. On the other hand, FIG. 5 differs from FIG. 4 in that the third fin portion 133 is provided on the second main plate 131A of the second case 130A.

  That is, the second case 130 </ b> A includes a second main plate 131 </ b> A, a second recess 132, and a third heat radiating fin portion 133. The second main plate 131A is the outer surface of the housing body of the present invention. In FIG. 5, it is assumed that the electronic component 112f is also a heating element. Further, the electronic component 112e is, for example, a filter, and is the electronic component having the largest capacity and the highest height among the electronic components 112d to 112f.

  As shown in FIG. 5, the third recess 132 is formed in the second main plate 131 </ b> A so as to be recessed from the side away from the electronic substrate 110. The second recess 132 is formed according to the height of the electronic component 112f. That is, the second recess 132 is such that the upper surface of the electronic component 112f that is a heat generating element (the surface farthest from the electronic substrate 110 among the surfaces constituting the electronic component 112f) abuts the inner surface of the second case 130A. In addition, it is formed on the second main plate 131A. At this time, as shown in FIG. 5, the electronic component 112 f that is a heat generating element is arranged so as to be thermally connected to the second recess 132.

  The third radiating fin portion 133 is disposed in the second recess 132. Moreover, the 3rd radiation fin part 133 is formed so that it may extend from the outer surface of the area | region in which the 2nd recessed part 132 was formed among the 2nd main plates 131A. The third heat radiating fin portion 133 radiates heat generated by the electronic component 112f (heat generating element) to the outside air. The heat generated by the electronic component 112f (heating element) is transferred to the third radiating fin portion 133 through the inner surface of the second case 130A. The third radiating fin portion 133 can function as a heat sink or a radiator.

  The third radiating fin portion 133 is preferably formed when the second case 130A is molded by casting. Thereby, compared with the case where the 3rd radiation fin part is formed by processing sheet metal using an extrusion die material, processing can be simplified and manufacturing cost can be reduced.

  Further, as shown in FIG. 5, of the second main plate 131 </ b> A, the outer surface of the second recessed portion forming region in which the second recessed portion 132 is formed and the outer surface of the region other than the second recessed portion forming region. The step height h1f between them is equal to or higher than the height h1g of the third fin portion 133 in a direction substantially perpendicular to the surface of the electronic substrate 110 (up and down in the plane of FIG. 5). For this reason, the tip of the third fin portion 132 is located above the outer surface of the second main plate 131A other than the second recess formation region where the second recess 132 is formed (on the paper surface of FIG. 5). It does not protrude in the vertical direction. On the other hand, the tip portion of the third fin portion 132 is formed on the outer surface of the second main plate 131A other than the second concave portion forming region where the second concave portion 132 is formed, as required for heat dissipation efficiency. May also protrude upward.

  Further, as shown in FIG. 5, the distance h1h between the outer surface of the second main plate 131A other than the second recess formation region and the surface of the electronic substrate 110 is other than the second recess formation region. It is set according to the height of the electronic component 112e (filter) mounted on the electronic substrate 110 corresponding to the region. Since the distance h1h is set in accordance with the mounting height of the electronic component 112e, the distance h1h can be set to the minimum necessary distance. As a result, the housing body constituted by the first case 120A and the second case 130A can be made more compact. On the other hand, the distance h1h may not be set to the minimum necessary distance according to the necessity of heat dissipation efficiency.

  As described above, the electronic device 100B according to the third embodiment of the present invention further includes the second concave portion 132 and the third fin portion 133. The second recess 132 is formed so as to be recessed in the second main plate 131A toward the side approaching from the side away from the electronic substrate 110. The third radiating fin portion 133 is accommodated in the second recess 132. Moreover, the 3rd radiation fin part 133 is formed so that it may extend from the outer surface of the area | region in which the 2nd recessed part 132 was formed among the 2nd main plates 131A. Further, the third radiating fin portion 133 radiates heat generated by the heat generating element (electronic component 112f).

  As described above, in the electronic device 100B, the third fin portion 133 is also formed in the second recess 132 of the second main surface 130A. The electronic device 100B uses the first fin portion 123, the second fin portion 124, and the third fin portion 133 to radiate the heat generated by the heat generating elements (electronic components 112b, 112c, and 112f). Therefore, the heat generated by the heating elements (electronic components 112b, 112c, 112f) can be radiated more efficiently.

  Note that the first fin portion 123 and the second fin portion 124 mainly dissipate heat generated by the heating elements (electronic components 112b and 112c). The third fin portion 133 mainly radiates heat generated by the heat generating element (electronic component 112f). However, since the first fin portion 123, the second fin portion 124, and the third fin portion 133 are connected by the housing body (the fitting body of the first case 120A and the second case 130B), The first fin portion 123 and the second fin portion 124 dissipate heat generated by the heat generating element (electronic component 112f), and the third fin portion 133 dissipates heat generated by the heat generating element (electronic components 112b and 112c). There is also a case.

  In the first, second, and third embodiments, the example in which one first recess 122 is formed in the first cases 120, 120b, 120A has been described. However, the present invention is not limited to this, and a plurality of first recesses 122 may be formed in the first case 120, 120b, 120A. At this time, the shapes of the plurality of first recesses 122 may be the same as or different from each other.

  Similarly, in the third embodiment, the example in which one second recess 132 is formed in the second case 130A has been described. However, the present invention is not limited to this, and a plurality of second recesses 132 may be formed in the second case 130A. At this time, the shapes of the plurality of second recesses 132 may be the same as or different from each other.

  The present invention has been described above based on the embodiment. The embodiment is an exemplification, and various modifications, increases / decreases, and combinations may be added to the above-described embodiments without departing from the gist of the present invention. It will be understood by those skilled in the art that modifications to which these changes, increases / decreases, and combinations are also within the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Electronic device 100a Electronic device 100b Electronic device 100A Electronic device 100B Electronic device 110 Electronic substrate 111 Base material 112a-112f Electronic component 120 First case 120b First case 120A First case 121 First main plate 121A First Main plate 122 First recess 123 First radiation fin portion 124 Second radiation fin portion 125, 135 Fitting portion 126, 136 Substrate holding rib 130 Second case 130A Second case 131 Second main plate 131A Second Main plate 132 second recess 133 third heat radiation fin portion 900 electronic device 910 electronic substrate 911 base material 912a to 912f electronic component 920 first case 921 first main plate 923 heat radiation fin portion 925, 935 fitting portion 926, 936 Substrate holding rib 930 Second case 931 Second main plate

Claims (11)

A housing main body that contains an electronic board on which an electronic component including a heating element is mounted and has first and second main plates facing the electronic board;
A first first recess formed on the first main plate so as to be recessed from a side away from the electronic substrate;
The first recess disposed in the first recess and extending from an outer surface of the first main plate in which the first recess is formed to dissipate heat generated by the heating element. An electronic device having a heat radiating fin portion. The step height between the outer surface of the first recess forming region where the first recess is formed in the first main plate and the outer surface of the region other than the first recess forming region is the electron The electronic device according to claim 1, wherein the electronic device has a height that is equal to or greater than a height of the first radiation fin portion in a direction substantially perpendicular to the substrate surface. Of the first main plate, the distance between the outer surface of the region other than the first recess formation region and the surface of the electronic substrate corresponds to the region other than the first recess formation region on the electronic substrate. The electronic device according to claim 2, wherein the electronic device is set according to a height of the electronic component mounted on the device. The first main plate further includes a second radiating fin portion that is formed to extend from an outer surface of a region other than the first concave portion forming region and that radiates heat generated by the heat generating element. The electronic device of any one of -3. The distance between the front end portion of the first fin portion and the electronic substrate surface and the distance between the front end portion of the second fin portion and the electronic substrate surface are substantially equal to the electronic substrate surface. The electronic device according to claim 4, which is substantially the same in a vertical direction. The electronic device according to claim 1, wherein the first recess is formed according to a height of the electronic component. 7. The electronic device according to claim 1, wherein the heat generating element is disposed so as to be thermally connected to an inner surface facing the electronic substrate among surfaces constituting the first concave portion. 8. The heat generating element according to claim 1, wherein the heat generating element is disposed so as to be thermally connected to an inner surface facing the electronic substrate among surfaces constituting the first recess through a heat conductive member. An electronic device according to 1. The electronic device according to claim 1, wherein the housing body is molded by casting. A second second recess formed on the second main plate so as to be recessed from the side away from the electronic substrate;
The third recess is housed in the second recess and is formed so as to extend from the outer surface of the second main plate in which the second recess is formed, and dissipates heat generated by the heating element. The electronic device according to claim 1, further comprising a radiation fin portion. A housing main body that can accommodate an electronic board on which an electronic component including a heating element is mounted, and has first and second main plates facing the electronic board;
A first first recess formed on the first main plate so as to be recessed from a side away from the electronic substrate;
The first recess disposed in the first recess and extending from an outer surface of the first main plate in which the first recess is formed to dissipate heat generated by the heating element. A housing with a heat radiating fin.

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