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JP2014018349A - Connection structure for endoscope processor - Google Patents

Connection structure for endoscope processor Download PDF

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JP2014018349A
JP2014018349A JP2012158608A JP2012158608A JP2014018349A JP 2014018349 A JP2014018349 A JP 2014018349A JP 2012158608 A JP2012158608 A JP 2012158608A JP 2012158608 A JP2012158608 A JP 2012158608A JP 2014018349 A JP2014018349 A JP 2014018349A
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processor
protrusion
connection structure
endoscope
endoscope processor
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Tomohiro Mori
智洋 森
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Hoya Corp
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Hoya Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a connection structure for an endoscope processor which can prevent charges from accumulating in the endoscope processor, regardless of a connection state between the endoscope and the endoscope processor.SOLUTION: A connection structure for an endoscope processor has a connection part for attaching the endoscope to the endoscope processor. The connection structure is provided with a first member equipped to the endoscope processor or the endoscope. The fist member is grounded. The connection structure is provided with a second member installed inside the endoscope processor or the endoscope. The second member has a projection part extended toward the first member and is electrically conducted to the connection part.

Description

本発明は、内視鏡プロセッサの接続構造に関し、より詳しくは静電気保護が可能な内視鏡プロセッサの接続構造に関する。   The present invention relates to an endoscope processor connection structure, and more particularly to an endoscope processor connection structure capable of electrostatic protection.

従来、スコープ側への電荷の蓄積を低減させる構成として、プロセッサとスコープとのコネクタが接続されていない間、コネクタの差込側の端子をグランドへ接続する構成が知られている(特許文献1)。これによりスコープに電荷は蓄積されず、コネクタ接続時にプロセッサの電荷がスコープへ流れ込むことによる電子部品等の故障を防止することが可能となる。   2. Description of the Related Art Conventionally, as a configuration for reducing charge accumulation on the scope side, a configuration is known in which the terminal on the insertion side of the connector is connected to the ground while the connector between the processor and the scope is not connected (Patent Document 1). ). As a result, no electric charge is accumulated in the scope, and it is possible to prevent a failure of an electronic component or the like due to the electric charge of the processor flowing into the scope when the connector is connected.

特開2004−267488号公報JP 2004-267488 A

しかし、この構成ではスコープとプロセッサとが接続された状態では、電荷が蓄積されてしまうという問題がある。すなわち、接続状態で蓄積した電荷がプロセッサからスコープへ流れ込むことにより電子部品等が故障する可能性がある。例えば、EMC試験において接続状態で印加される静電気による電子部品の故障は防止できない。   However, in this configuration, there is a problem that charges are accumulated when the scope and the processor are connected. That is, there is a possibility that an electronic component or the like may break down due to the charge accumulated in the connected state flowing from the processor to the scope. For example, failure of an electronic component due to static electricity applied in a connected state in an EMC test cannot be prevented.

そこで本発明は、スコープとプロセッサとの接続状態によらずプロセッサへの電荷の蓄積を防止することが可能な内視鏡プロセッサの接続構造を提供することを目的としている。   Accordingly, an object of the present invention is to provide an endoscope processor connection structure capable of preventing charge accumulation in the processor regardless of the connection state between the scope and the processor.

本発明に係る内視鏡プロセッサの接続構造は、スコープを内視鏡プロセッサに装着するための接続部を有する接続構造であって、プロセッサ又はスコープに設けられ、接地された第1部材と、プロセッサ又はスコープ内に設けられ、第1部材に向かって延びる突出部を有し、接続部に導通する第2部材とを備えることを特徴とする。   The connection structure of the endoscope processor according to the present invention is a connection structure having a connection portion for mounting the scope to the endoscope processor, the first member provided in the processor or the scope and grounded, and the processor Or it has a projection part which is provided in a scope and extends toward the 1st member, and is provided with the 2nd member which conducts to a connection part.

接続部は差込部と受け部とを有し、受け部と第2部材と突出部とが導通することが好ましい。この構成によって、受け部の電荷を突出部へ移動させることができる。   It is preferable that the connection portion has an insertion portion and a receiving portion, and the receiving portion, the second member, and the protruding portion are electrically connected. With this configuration, the charge of the receiving portion can be moved to the protruding portion.

第1部材はプロセッサの筐体であり、突出部の先端が、上面又は底面の第1部材に近接することが好ましい。近接していることにより放電され得るからである。   The first member is a housing of the processor, and it is preferable that the tip of the protruding portion is close to the first member on the top surface or the bottom surface. It is because it can be discharged by being close.

突出部の先端に突起が形成され、突起の先端を第1部材に近接させても良い。   A protrusion may be formed at the tip of the protrusion, and the tip of the protrusion may be brought close to the first member.

上面の第1部材に凹部が形成され、凹部に突出部の先端を近接させても良い。   A recess may be formed in the first member on the upper surface, and the tip of the protrusion may be brought close to the recess.

底面の第1部材の上には樹脂材が設けられ、樹脂材の外壁面に沿って鉛直方向下向きに下方突起が形成され、下方突起は第2の部材と導通し、下方突起の下端を底面の第1部材に近接させても良い。   A resin material is provided on the first member on the bottom surface, a lower projection is formed vertically downward along the outer wall surface of the resin material, the lower projection is electrically connected to the second member, and the lower end of the lower projection is the bottom You may make it adjoin to the 1st member.

本発明によれば、スコープとプロセッサとの接続状態によらずプロセッサへの電荷の蓄積を防止することが可能な内視鏡プロセッサの接続構造を提供することが出来る。   ADVANTAGE OF THE INVENTION According to this invention, the connection structure of the endoscope processor which can prevent accumulation | storage of the electric charge to a processor irrespective of the connection state of a scope and a processor can be provided.

本発明の第1の実施形態を適用した内視鏡プロセッサの接続構造である。It is a connection structure of an endoscope processor to which the first embodiment of the present invention is applied. 本発明の第2の実施形態を適用した内視鏡プロセッサの接続構造である。It is a connection structure of an endoscope processor to which a second embodiment of the present invention is applied. 本発明の第3の実施形態を適用した内視鏡プロセッサの接続構造である。It is a connection structure of an endoscope processor to which a third embodiment of the present invention is applied.

以下、本発明の第1の実施形態の構成について、図面を用いて説明する。内視鏡10は、スコープ20とプロセッサ40とを有する。スコープ20とプロセッサ40とは接続部80において接続される。スコープ20の基端にはスコープコネクタ22が設けられ、スコープコネクタ22には、信号用差込部24と光学用差込部26とが設けられる。プロセッサ40には、信号用受け部42と光学用受け部44とが設けられる。接続部80において、信号用差込部24と信号用受け部42とが連結され、かつ、光学用差込部26と光学用受け部44とが連結される。これにより、スコープ20とプロセッサ40とが電気的及び光学的に接続され、スコープ20は体内を観察可能となる。   The configuration of the first embodiment of the present invention will be described below with reference to the drawings. The endoscope 10 includes a scope 20 and a processor 40. The scope 20 and the processor 40 are connected at the connection unit 80. A scope connector 22 is provided at the proximal end of the scope 20, and the scope connector 22 is provided with a signal insertion portion 24 and an optical insertion portion 26. The processor 40 is provided with a signal receiver 42 and an optical receiver 44. In the connecting portion 80, the signal insertion portion 24 and the signal receiving portion 42 are connected, and the optical insertion portion 26 and the optical receiving portion 44 are connected. Thereby, the scope 20 and the processor 40 are electrically and optically connected, and the scope 20 can observe the inside of the body.

プロセッサ40の筐体は、導体である第1部材46が上面および底面に設けられることによって形成される。底面の第1部材46には、絶縁性のある樹脂板47が設けられる。樹脂板47と外壁51との間には空間Sが形成される。信号接続孔48は、信号用受け部42に延設された筒状の導電部材50によって形成される。また、光学接続孔52は、光学用受け部44に延設された筒状の導電部材54によって形成される。信号接続孔48には信号線(図示せず)が挿通されて、ケーブル49を介して画像処理等が施される。光学接続孔52には、ライトガイド53が挿通されて、光源90からの光がスコープ20へ伝達される。   The housing of the processor 40 is formed by providing a first member 46, which is a conductor, on the top surface and the bottom surface. The first member 46 on the bottom surface is provided with an insulating resin plate 47. A space S is formed between the resin plate 47 and the outer wall 51. The signal connection hole 48 is formed by a cylindrical conductive member 50 extending to the signal receiving portion 42. Further, the optical connection hole 52 is formed by a cylindrical conductive member 54 that extends to the optical receiving portion 44. A signal line (not shown) is inserted into the signal connection hole 48, and image processing or the like is performed via the cable 49. The light guide 53 is inserted into the optical connection hole 52, and the light from the light source 90 is transmitted to the scope 20.

信号接続孔48と光学接続孔52との距離は、導電部材50と導電部材54との間に鉛直方向に設けられた導電部材56によって定められる。信号接続孔48と上面の第1部材46、光学接続孔52と底面の第1部材46との距離は、導電部材54から鉛直方向下向きに設けられた導電部材58によって定められる。また、導電部材58の下端は水平方向へ折れ曲がるように延設された後ビス60によって樹脂板47に固定される。信号接続孔48は、上面の第1部材46に接触しない。このように、信号接続孔48と光学接続孔52との鉛直方向の位置は、導電部材56、58によって定められる。   The distance between the signal connection hole 48 and the optical connection hole 52 is determined by a conductive member 56 provided in the vertical direction between the conductive member 50 and the conductive member 54. The distance between the signal connection hole 48 and the first member 46 on the top surface, and the distance between the optical connection hole 52 and the first member 46 on the bottom surface are determined by a conductive member 58 provided vertically downward from the conductive member 54. Further, the lower end of the conductive member 58 is extended so as to be bent in the horizontal direction, and then fixed to the resin plate 47 with a screw 60. The signal connection hole 48 does not contact the first member 46 on the upper surface. Thus, the vertical positions of the signal connection hole 48 and the optical connection hole 52 are determined by the conductive members 56 and 58.

導電部材50には、上面の第1部材46に向けてすなわち鉛直方向上向きに突出部62が延設される。さらにその上端には突起64が延設される。突起64は突出部62と同じ材料または異なる導電材料で形成される。突起64と第1部材46とは近接している。   The conductive member 50 has a protrusion 62 extending toward the first member 46 on the upper surface, that is, upward in the vertical direction. Further, a protrusion 64 is extended at the upper end thereof. The protrusion 64 is made of the same material as the protrusion 62 or a different conductive material. The protrusion 64 and the first member 46 are close to each other.

ここで、信号用受け部42、光学用受け部44、導電部材50、54、56、58、突出部62、突起64は導通しており、以下これらの部材をまとめて第2部材66とする。第1部材46は、プロセッサ40が机や床に置かれると、それらに接触する。すなわち、第1部材46の電位は、接地されている状態と同じである。   Here, the signal receiving portion 42, the optical receiving portion 44, the conductive members 50, 54, 56, 58, the protruding portion 62, and the protrusion 64 are conductive, and these members are collectively referred to as the second member 66 hereinafter. . The first member 46 contacts the processor 40 when placed on a desk or floor. That is, the potential of the first member 46 is the same as the grounded state.

通常の使用状態では、スコープ20とプロセッサ40とは絶縁状態にある。スコープ20に静電気が発生したとき、電荷は接続部80を介して第2部材66へ流れ込む。ここで、突起64の電位は、接地されている第1部材46よりも高いため、突起64から第1部材46へ向けて放電が発生する。一方で、プロセッサ40に静電気が発生したとき、電荷は最もインピーダンスの低い上面の第1部材46へ流れ込む。例えば、医療機器等に対するEMC試験において、オペレータは静電気を接続部80に発生させる。このとき、第2部材66全体が電荷を帯びるが、即座に突起64から上面の第1部材46へ向けて放電される。   In a normal use state, the scope 20 and the processor 40 are in an insulated state. When static electricity is generated in the scope 20, the charge flows into the second member 66 through the connection portion 80. Here, since the potential of the protrusion 64 is higher than that of the grounded first member 46, a discharge is generated from the protrusion 64 toward the first member 46. On the other hand, when static electricity is generated in the processor 40, the charge flows into the first member 46 on the upper surface having the lowest impedance. For example, in an EMC test for a medical device or the like, the operator generates static electricity at the connection unit 80. At this time, the entire second member 66 is charged, but is immediately discharged from the protrusion 64 toward the first member 46 on the upper surface.

また、突起64と第1部材46との距離は、第2部材66と第1部材46との耐圧に応じて自由に定めることが出来る。具体的には、距離が1[mm]であれば1[kv]の電圧に対して絶縁できる。本実施形態では、距離が4[mm]であるため4[kv]の電圧に対して絶縁できる。規格では、一次GNDである第1部材46と二次GNDである第2部材66とは2[kv]以上絶縁される必要があるが、本実施形態はこの規格を満たす。   Further, the distance between the protrusion 64 and the first member 46 can be freely determined according to the pressure resistance between the second member 66 and the first member 46. Specifically, if the distance is 1 [mm], it can be insulated against a voltage of 1 [kv]. In this embodiment, since the distance is 4 [mm], insulation can be performed with respect to a voltage of 4 [kv]. According to the standard, the first member 46, which is the primary GND, and the second member 66, which is the secondary GND, need to be insulated by 2 [kv] or more, but this embodiment satisfies this standard.

このように、スコープ20とプロセッサ40とが接続されているか否かにかかわらず、電荷が第1部材46へ放出されることで、プロセッサへの電荷の蓄積を防止することが可能である。また、追加部品は突起64のみで良いため構成は簡易である。さらに、突起64は突出部62と一体的に形成されても良いが、この場合に追加部品は不要である。   Thus, regardless of whether or not the scope 20 and the processor 40 are connected, it is possible to prevent the charge from being accumulated in the processor by discharging the charge to the first member 46. Further, since the additional parts need only be the protrusions 64, the configuration is simple. Further, the protrusion 64 may be formed integrally with the protrusion 62, but in this case, no additional parts are required.

次に、図2を参照し、第2の実施形態について説明する。第1の実施形態との違いは、突起64を除くかわりに、プロセッサ40の筐体である上面の第1部材46に凹部Dが設けられることである。他の構成は第1の実施形態と同様であり、同部材には同符号が付されている。   Next, a second embodiment will be described with reference to FIG. The difference from the first embodiment is that a recess D is provided in the first member 46 on the upper surface, which is the housing of the processor 40, instead of removing the protrusion 64. Other configurations are the same as those of the first embodiment, and the same reference numerals are given to the same members.

第1部材46は、窪みとなる段差部C、Eを有する。段差部Cは、信号接続孔48の端部Aよりもやや光源90寄りに設けられる。段差部Eは、突出部62と略同位置に設けられる。すなわち、第1部材46の凹部Dの内壁面は、突出部62を覆うように設けられる。上述の通り、絶縁耐圧は突出部62と第1部材46との距離に依存する。したがって、静電気が発生したとき、第1の実施形態と同様に、突出部62と第1部材46との距離に応じた絶縁効果が得られる。また、絶縁耐圧を超える静電気が発生したとき、突出部62から第1部材46に向けて放電が発生する。本実施形態における効果は第1の実施形態と同様であるが、第2の実施形態では、突起64を設ける必要が無いため、第1の実施形態よりも加工が容易である。   The first member 46 has stepped portions C and E that become depressions. The step C is provided slightly closer to the light source 90 than the end A of the signal connection hole 48. The stepped portion E is provided at substantially the same position as the protruding portion 62. That is, the inner wall surface of the recess D of the first member 46 is provided so as to cover the protruding portion 62. As described above, the withstand voltage depends on the distance between the protrusion 62 and the first member 46. Therefore, when static electricity is generated, an insulating effect corresponding to the distance between the protruding portion 62 and the first member 46 can be obtained as in the first embodiment. Further, when static electricity exceeding the withstand voltage is generated, a discharge is generated from the protruding portion 62 toward the first member 46. Although the effect in this embodiment is the same as that in the first embodiment, in the second embodiment, since it is not necessary to provide the protrusion 64, the processing is easier than in the first embodiment.

次に、図3を参照し、第3の実施形態を説明する。第1の実施形態との違いは、突起64を除くかわりに、導電部材58に延設された下方突起72が設けられることである。他の構成は第1の実施形態と同様であり、同部材には同符号が付されている。   Next, a third embodiment will be described with reference to FIG. The difference from the first embodiment is that, instead of the protrusion 64, a lower protrusion 72 extending on the conductive member 58 is provided. Other configurations are the same as those of the first embodiment, and the same reference numerals are given to the same members.

下方突起72は、導電部材58が樹脂板47に達した後、ビス70とは反対の水平方向に沿って延び、樹脂板47の鉛直方向の外壁面に沿って下向きに、すなわち空間Sに形成される。下方突起72の下端は、第1部材46に近接する。接続部80において静電気が発生したとき、他の実施形態と同様に、下方突起72の下端から第1部材46に向けて放電が発生する。   The lower projection 72 extends along the horizontal direction opposite to the screw 70 after the conductive member 58 reaches the resin plate 47, and is formed downward along the vertical outer wall surface of the resin plate 47, that is, in the space S. Is done. The lower end of the lower protrusion 72 is close to the first member 46. When static electricity is generated in the connection portion 80, discharge is generated from the lower end of the lower protrusion 72 toward the first member 46, as in the other embodiments.

20 スコープ
24 信号用差込部
40 プロセッサ
42 信号用受け部
46 第1部材
47 樹脂板
62 突出部
64 突起
66 第2部材
72 下方突起
80 接続部
D 凹部
20 scope
24 signal insertion portion 40 processor 42 signal receiving portion 46 first member 47 resin plate 62 protrusion 64 protrusion 66 second member 72 lower protrusion 80 connection portion D recess

Claims (6)

スコープを内視鏡プロセッサに装着するための接続部を有する接続構造であって、
前記プロセッサ又は前記スコープに設けられ、接地された第1部材と、
前記プロセッサ又はスコープ内に設けられ、前記第1部材に向かって延びる突出部を有し、前記接続部に導通する第2部材とを備えることを特徴とする内視鏡プロセッサの接続構造。
A connection structure having a connection part for attaching the scope to the endoscope processor,
A first member provided in the processor or the scope and grounded;
A connection structure for an endoscope processor, comprising: a second member provided in the processor or scope, having a projecting portion extending toward the first member, and conducting to the connection portion.
前記接続部は差込部と受け部とを有し、前記受け部と前記第2部材と前記突出部とが導通することを特徴とする請求項1に記載の内視鏡プロセッサの接続構造。   The endoscope processor connection structure according to claim 1, wherein the connection portion includes an insertion portion and a receiving portion, and the receiving portion, the second member, and the protruding portion are electrically connected. 前記第1部材は前記プロセッサの筐体であり、
前記突出部の先端が、上面又は底面の前記第1部材に近接することを特徴とする請求項2に記載の内視鏡プロセッサの接続構造。
The first member is a housing of the processor;
The endoscope processor connection structure according to claim 2, wherein a tip of the projecting portion is close to the first member on the top surface or the bottom surface.
前記突出部の先端に突起が形成され、前記突起の先端が前記第1部材に近接することを特徴とする請求項3に記載の内視鏡プロセッサの接続構造。   The endoscope processor connection structure according to claim 3, wherein a protrusion is formed at a tip of the protrusion, and the tip of the protrusion is close to the first member. 前記上面の前記第1部材に凹部が形成され、前記凹部に前記突出部の先端が近接することを特徴とする請求項3に記載の内視鏡プロセッサの接続構造。   The endoscope processor connection structure according to claim 3, wherein a concave portion is formed in the first member on the upper surface, and a tip of the protruding portion is close to the concave portion. 底面の前記第1部材の上には樹脂材が設けられ、前記樹脂材の外壁面に沿って鉛直方向下向きに下方突起が形成され、前記下方突起は前記第2の部材と導通し、前記下方突起の下端は前記底面の第1部材に近接することを特徴とする請求項3に記載の内視鏡プロセッサの接続構造。   A resin material is provided on the first member on the bottom surface, and a downward protrusion is formed vertically downward along the outer wall surface of the resin material. The downward protrusion is electrically connected to the second member, and The endoscope processor connection structure according to claim 3, wherein a lower end of the protrusion is close to the first member on the bottom surface.
JP2012158608A 2012-07-17 2012-07-17 Connection structure for endoscope processor Pending JP2014018349A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064040A (en) * 2015-09-30 2017-04-06 Hoya株式会社 Endoscope processor and endoscope connection system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064040A (en) * 2015-09-30 2017-04-06 Hoya株式会社 Endoscope processor and endoscope connection system
WO2017057779A1 (en) * 2015-09-30 2017-04-06 Hoya Corporation Endoscope processor and endoscope connection system
CN106817891A (en) * 2015-09-30 2017-06-09 Hoya株式会社 Endoscope processor and endoscope connection system

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