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JP2013247142A5 - Semiconductor device - Google Patents

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Publication number
JP2013247142A5
JP2013247142A5 JP2012117666A JP2012117666A JP2013247142A5 JP 2013247142 A5 JP2013247142 A5 JP 2013247142A5 JP 2012117666 A JP2012117666 A JP 2012117666A JP 2012117666 A JP2012117666 A JP 2012117666A JP 2013247142 A5 JP2013247142 A5 JP 2013247142A5
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JP
Japan
Prior art keywords
region
layer
channel formation
semiconductor device
formation region
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JP2012117666A
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Japanese (ja)
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JP6016455B2 (en
JP2013247142A (en
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Priority to JP2012117666A priority Critical patent/JP6016455B2/en
Priority claimed from JP2012117666A external-priority patent/JP6016455B2/en
Publication of JP2013247142A publication Critical patent/JP2013247142A/en
Publication of JP2013247142A5 publication Critical patent/JP2013247142A5/en
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Claims (3)

酸化物層と、An oxide layer;
ゲート絶縁膜と、A gate insulating film;
前記ゲート絶縁膜を介して、前記酸化物層と重なるゲート電極と、を有し、A gate electrode overlapping with the oxide layer via the gate insulating film,
前記酸化物層は、第1の層と、第2の層とを有し、The oxide layer has a first layer and a second layer,
前記第1の層及び前記第2の層は、それぞれ、Inと、Gaと、Znとを有し、The first layer and the second layer have In, Ga, and Zn, respectively.
前記ゲート電極と遠い側に配置された、前記第1の層は、InとGaの含有率をIn≦Gaとし、The first layer disposed on the side far from the gate electrode has an In and Ga content ratio of In ≦ Ga,
前記ゲート電極と近い側に配置された、前記第2の層は、InとGaの含有率をIn>Gaとすることを特徴とする半導体装置。The semiconductor device, wherein the second layer disposed on the side close to the gate electrode has a content ratio of In and Ga such that In> Ga.
請求項1において、In claim 1,
前記酸化物層は、ソース電極と重なる第1の領域と、ドレイン電極と重なる第2の領域と、前記第1の領域と前記第2の領域との間にあるチャネル形成領域とを有し、The oxide layer has a first region overlapping with the source electrode, a second region overlapping with the drain electrode, and a channel formation region between the first region and the second region,
前記チャネル形成領域は、前記第1の領域より薄く、The channel formation region is thinner than the first region,
前記チャネル形成領域は、前記第2の領域より薄いことを特徴とする半導体装置。The semiconductor device, wherein the channel formation region is thinner than the second region.
請求項2において、In claim 2,
前記チャネル形成領域は、前記第1の領域との境界において、テーパ形状を有し、The channel formation region has a tapered shape at the boundary with the first region,
前記チャネル形成領域は、前記第2の領域との境界において、テーパ形状を有することを特徴とする半導体装置。The channel formation region has a taper shape at a boundary with the second region.
JP2012117666A 2012-05-23 2012-05-23 Semiconductor device Active JP6016455B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012117666A JP6016455B2 (en) 2012-05-23 2012-05-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012117666A JP6016455B2 (en) 2012-05-23 2012-05-23 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016187951A Division JP6188900B2 (en) 2016-09-27 2016-09-27 Method for manufacturing semiconductor device

Publications (3)

Publication Number Publication Date
JP2013247142A JP2013247142A (en) 2013-12-09
JP2013247142A5 true JP2013247142A5 (en) 2015-04-16
JP6016455B2 JP6016455B2 (en) 2016-10-26

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JP2012117666A Active JP6016455B2 (en) 2012-05-23 2012-05-23 Semiconductor device

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JP (1) JP6016455B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506545B2 (en) * 2013-12-27 2019-04-24 株式会社半導体エネルギー研究所 Semiconductor device
US9653487B2 (en) * 2014-02-05 2017-05-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, module, and electronic device
KR102332469B1 (en) 2014-03-28 2021-11-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Transistor and semiconductor device
KR102333604B1 (en) * 2014-05-15 2021-11-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and display device including the same
JPWO2016067161A1 (en) * 2014-10-28 2017-08-31 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
KR102513517B1 (en) * 2015-07-30 2023-03-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and electronic device
TWI715699B (en) * 2016-10-21 2021-01-11 日商半導體能源硏究所股份有限公司 Composite oxide and transistor
KR102482856B1 (en) * 2017-12-15 2022-12-28 엘지디스플레이 주식회사 Thin film trnasistor, method for manufacturing the same and display device comprising the same
JP7209692B2 (en) * 2018-03-06 2023-01-20 株式会社半導体エネルギー研究所 semiconductor equipment
JP2019220530A (en) * 2018-06-18 2019-12-26 株式会社ジャパンディスプレイ Semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5345359B2 (en) * 2008-09-18 2013-11-20 富士フイルム株式会社 Thin film field effect transistor and display device using the same
US9312156B2 (en) * 2009-03-27 2016-04-12 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
WO2011048923A1 (en) * 2009-10-21 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. E-book reader
KR102393447B1 (en) * 2009-11-13 2022-05-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
KR20190100462A (en) * 2009-11-28 2019-08-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
WO2011068037A1 (en) * 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5740169B2 (en) * 2010-02-19 2015-06-24 株式会社半導体エネルギー研究所 Method for manufacturing transistor
JP5666567B2 (en) * 2010-04-23 2015-02-12 株式会社日立製作所 Semiconductor device, RFID tag using the same, and display device
US9209314B2 (en) * 2010-06-16 2015-12-08 Semiconductor Energy Laboratory Co., Ltd. Field effect transistor
JP5626978B2 (en) * 2010-09-08 2014-11-19 富士フイルム株式会社 THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF, AND APPARATUS HAVING THE THIN FILM TRANSISTOR

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