JP2013120821A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of preventing interface peeling between a substrate and an encapsulation resin without leaking of a light ray to a back side of the light-emitting device.SOLUTION: A light-emitting device 100 comprises: a substrate 1; a light-emitting device 3 mounted on a front face 10 of the substrate 1; a translucent resin 6 which covers a light-emitting surface of the light-emitting device 3; and a light-shielding resin 7, having contact with the translucent resin 6 and having a structure for stopping the substrate 1 from coming out toward a front side at a side face or a back face of the substrate 1.

Description

  The present invention relates to a light emitting device.

  There are various types of light emitting devices. Recently, light emitting devices in the form of so-called electronic component packages in which a light emitting element such as a light emitting diode is mounted on a substrate and sealed with a sealing resin are widely used.

  Patent Document 1 includes an optical semiconductor chip electrically connected to the upper surface of a base material, and a sealing resin that covers the optical semiconductor chip, and the sealing resin includes at least the upper surface of the base material and the side surface of the base material. An optical semiconductor element bonded to a part is described.

  In Patent Document 2, a third sealing body is formed in which a first sealing body that covers one surface of a wiring board having a semiconductor chip mounted on one surface and a second sealing body that covers the other surface are joined. A semiconductor device having the above-described configuration is described.

JP 2002-222998 A JP 2010-103348 A

  2. Description of the Related Art In recent years, light emitting devices have been reduced in size and brightness, and the range of temperature rise of light emitting devices due to heat generation during light emission has increased. At this time, due to the difference in the linear expansion coefficient between the substrate on which the light emitting element is mounted and the sealing resin, thermal stress is generated at the interface between the two. When the light emitting device is repeatedly turned on / off, the thermal stress repeatedly acts on the interface between the substrate and the sealing resin. In some cases, the interface breakage occurs, and the sealing resin is peeled off from the substrate. There is a risk that.

  Therefore, as in Patent Document 1 described above, when the sealing resin is adhered not only to the upper surface of the base material but also to the side surface, the adhesive strength between the sealing resin and the base material is increased, and peeling of both occurs. It will be difficult.

  However, this alone is not always sufficient to prevent peeling between the sealing resin and the substrate. Further, in such a structure, light propagated through the sealing resin bonded to the side surface of the substrate leaks to the back side of the substrate, so that the light use efficiency is reduced or its use is limited.

  This invention is made | formed in view of this situation, The subject which it is going to solve is preventing the interface peeling of a board | substrate and sealing resin in a light-emitting device, without making a light beam leak to the back side. That is.

The invention disclosed in the present application in order to solve the above problems has various aspects, and the outline of typical aspects of the aspects is as follows.
(1) A substrate, a light emitting element mounted on the front surface of the substrate, a translucent resin that covers a light emitting surface of the light emitting element, and the translucent resin, to the front side on the side surface or the back surface of the substrate And a light-shielding resin having a retaining structure.
(2) In (1), the light-shielding resin surrounds the light-transmitting resin when viewed from the front.
(3) In (1) or (2), the adhesive strength per unit area at the interface between the light-transmitting resin and the light-shielding resin is the unit strength per unit area at the interface between the light-shielding resin and the substrate. Light emitting device with greater bond strength.
(4) The light-emitting device according to any one of (1) to (3), wherein the retaining structure is a fitting portion that enters inside the outer shape of the substrate in a front view.
(5) The light-emitting device according to any one of (1) to (4), wherein the retaining structure includes a bridge portion extending between opposing sides of the substrate.
(6) In any one of (1) to (5), the retaining structure includes a first insertion portion that enters inside the outer shape of the substrate on the back surface of the substrate, and a front surface from the first insertion portion. A light emitting device having a second insertion portion that enters the inside of the substrate.
(7) In any one of (1) to (6), the retaining structure is a light emission that is a tapered portion in which a cross-sectional area of the translucent resin decreases from the back surface to the front surface of the substrate in a cross-sectional view. device.

  According to the side surfaces of (1) to (7) above, in the light emitting device, it is possible to prevent interface peeling between the substrate and the sealing resin without causing light rays to leak out to the back side.

  In particular, according to the side surface (2), leakage of light rays to the side surface and the bottom surface is prevented.

  In particular, according to the above aspect (3), the interface peeling between the translucent resin and the light-shielding resin is difficult to occur.

  In particular, according to the above aspects (4) to (7), the light-shielding resin and the substrate are mechanically fixed, and the interface peeling between the substrate and the sealing resin is effectively prevented.

1 is a schematic cross-sectional view of a light emitting device according to a first embodiment of the present invention. 1 is a front view of a light emitting device according to a first embodiment of the present invention. It is a schematic sectional drawing of the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on the 3rd Embodiment of this invention. It is a rear view of the light emitting device which concerns on the 3rd Embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on the 4th Embodiment of this invention. It is a rear view of the light emitting device which concerns on the 4th Embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on the 5th Embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on the 6th Embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on the 7th Embodiment of this invention. It is a schematic sectional drawing explaining the manufacturing method of the light-emitting device which concerns on the 1st Embodiment of this invention. FIG. 12 is a front view of the collective substrate in step ST2 of FIG. It is a schematic sectional drawing explaining the manufacturing method of the light-emitting device which concerns on the 1st Embodiment of this invention. It is a schematic sectional drawing explaining the manufacturing method of the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a schematic sectional drawing explaining the manufacturing method of the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a schematic sectional drawing explaining the manufacturing method of the light emitting device which concerns on the 6th Embodiment of this invention. It is a schematic sectional drawing explaining the manufacturing method of the light emitting device which concerns on the 6th Embodiment of this invention.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

  FIG. 1 is a schematic cross-sectional view of a light emitting device 100 according to a first embodiment of the present invention.

  The light emitting device 100 has a structure in which an element electrode 2 is formed on one surface of a substrate 1 and a light emitting element 3 is mounted on the element electrode 2. On the other surface of the substrate 1, a terminal electrode 5 that is electrically connected to the element electrode 2 is formed through a through hole 4 that penetrates the substrate 1. The surface of the substrate 1 on which the light emitting element 3 is mounted is covered with a translucent resin 6 that functions as a so-called sealing resin, and covers the side surfaces of the substrate 1 and the translucent resin 6 on the outside thereof. Thus, a light shielding resin 7 is provided. The light emitting element 3 is an element that emits light and emits light when a voltage is applied. At this time, even if there is a light ray emitted from the light emitting element 3 toward the lower side in the figure, the light ray is blocked by the substrate 1 and therefore the light ray is mainly extracted to the upper side in the figure. Hereinafter, the surface of the light emitting element 3 shown on the upper side in the drawing is referred to as the light emitting surface, the surface facing the light emitting side is referred to as the front surface, and the opposite surface is referred to as the back surface.

  The substrate 1 is made of an insulating material, and various common circuit board materials may be used. The substrate 1 is preferably opaque and particularly has a property of reflecting light rays and is excellent in heat conduction. The former contributes to the effect of increasing the utilization efficiency of the light beam by reflecting the light beam traveling toward the back side of the light emitting device 100 to the front surface side, and the latter contributes to the effect of efficiently dissipating the heat generated from the light emitting element 3. It is. The property of reflecting light refers to the property of reflecting most of the incident light, and is defined as the property of reflecting 70% or more of the incident light in this specification. The property of reflecting the light beam may be provided by the material of the substrate 1 itself, or may be obtained by applying a coating that reflects the light beam to the surface of the substrate 1. Specific materials for the substrate 1 include glass epoxy resin, paper phenol resin, ceramics, and metal. In this embodiment, ceramics are used. In addition, when forming the board | substrate 1 with a metal, the surface treatment which provides insulation to the surface is required.

  The element electrode 2, the through hole 4, and the terminal electrode 5 are made of metal, for example, aluminum or copper, and are formed by a normal method of creating various circuit patterns on the substrate 1. In the present embodiment, the terminal electrode 5 is a solid pattern formed on the back surface of the substrate 1 and the light emitting device 100 is shown as an electronic component for surface mounting. It is good also as a lead wire protruding on the back side of substrate 1.

  The light emitting element 3 is an element that emits light in accordance with electric power applied via the element electrode 2 and is a light emitting diode in the present embodiment. As shown in the figure, the light emitting element 3 may be connected to the element electrode 2 by mounting a separately manufactured element on the element electrode 2 or may be formed directly on the substrate 1 using a semiconductor manufacturing process. Also good.

  The translucent resin 6 covers at least the light emitting surface of the light emitting element 3 and seals the light emitting element 3 and the element electrode 2. Since the light emitted from the light emitting element 3 is extracted to the front side of the light emitting device 100 through the light transmissive resin 6, the light transmissive resin 6 has a property of transmitting the light. The translucent resin 6 does not necessarily need to be colorless and transparent, and if necessary, has a scattering structure for scattering light rays and a color conversion structure for converting the color of light rays emitted from the light emitting element 3. May contain. Glass or polystyrene beads may be used as the light scattering structure. The color conversion structure may contain various phosphor particles. The material of the translucent resin 6 itself, that is, the material of the base material is not particularly limited, but is preferably a transparent synthetic resin, and in this embodiment, a silicon-based resin is used. A part of the translucent resin 6 is in contact with the front surface 10 of the substrate 1.

  The light shielding resin 7 is in direct contact with the translucent resin 6 on the side surface 70 and surrounds the translucent resin 6. FIG. 2 is a front view of the light emitting device 100 according to the present embodiment, and shows a state where the light shielding resin 7 surrounds the light transmitting resin 6. In the same figure, the device electrode 2 and the light emitting device 3 are shown through the translucent resin 6. As shown in FIG. 2, it is preferable that the light-shielding resin 7 surrounds the outer side of the light-transmitting resin 6 without a gap in the front view of the light emitting device 100. Thereby, the light from the light emitting element 3 is prevented from leaking to the side surface of the light emitting device 100. Hereinafter, in this specification, the outside refers to the side in the direction away from the light emitting element 3 in the plan view of the light emitting device 100, and the inside refers to the side in the direction approaching the light emitting element 3.

  Returning to FIG. 1, the light shielding resin 7 further covers the side surface of the substrate 1 and reaches the back surface of the light emitting device 100. The light-shielding resin 7 has a fitting portion 71 that enters the inside of the outer shape of the substrate 1 on the back surface of the substrate 1, and meshes with a step 11 formed on the outer periphery of the back surface of the substrate 1. The fitting portion 71 functions as a retaining structure that prevents the light-shielding resin 7 from peeling toward the front side. The retaining structure here means a structure that prevents the two members from separating in a specific direction due to the geometric shape of the two members. According to the present embodiment, in order to prevent the light shielding resin 7 from separating from the substrate 1 toward the front surface side, the light shielding resin 7 is disposed on the front surface of the substrate 1 when viewed from the front surface of the light emitting device 100. It suffices to have a portion that enters the inside from the outer shape. The insertion part 71 shown here is an example of such a retaining structure.

  The light shielding resin 7 has a light shielding property, that is, a property of shielding incident light. The degree of the property of blocking the light depends on the physical properties of the material itself and the thickness of the material in the path through which the light is transmitted. For this reason, the degree to which light should be blocked should be referred to as having a light shielding property, depending on the application requiring the light shielding property. However, in this specification, the transparent resin 6 And the light transmittance of the light shielding resin 7 per unit length (thickness), and the light transmittance of the light shielding resin 7 is smaller than the light transmittance of the light transmitting resin 6. The light shielding resin 7 is referred to as having a light shielding property. This is because if the transmittance of the light-shielding resin 7 reaching the back surface of the light-emitting device 100 is smaller than the transmittance of the light-transmissive resin 6, the portion of the light-shielding resin 7 in this embodiment is manufactured with the light-transmissive resin 6. This is because the amount of light leaking to the back side of the light emitting device 100 is reduced. As for the degree of light shielding property of the light shielding resin 7, preferably 90% or more of light incident on a member having a thickness equal to the thickness of the substrate 1 shown in FIG. 1 is shielded, more preferably 95% or more. To the extent that it is done. If it does in this way, the light ray which leaks to the back side of the light-emitting device 100 will practically disappear or become very little, and the use will not be restricted by the light ray leaking to the back side. This light shielding property may be that which absorbs or reflects incident light. In the former case, the light shielding resin 7 is achieved by coloring it in black or dark color, and in the latter case, it is achieved by using a white resin as the light shielding resin 7. In the present embodiment, from the viewpoint of increasing the utilization efficiency of the light beam from the light emitting element 3, the light blocking resin 7 is a white synthetic resin having a property of reflecting the light beam. The material of the light-shielding resin 7 is not particularly limited, and any known resin may be used, but in the present embodiment, a silicon-based resin is used similarly to the light-transmitting resin 6.

  The light-transmitting resin 6 and the light-shielding resin 7 are desirably made of a material that has as high an affinity as possible at the interface and firmly adheres to each other. By doing so, the light shielding resin 7 is prevented from being separated from the front surface side from the substrate 1 by the above-described retaining structure by the fitting portion 71, and the light transmitting resin 6 is further separated from the light shielding resin 7 and the side surface 70. In this case, the positional relationship toward the front side between the translucent resin 6 and the substrate 1 is fixed, and peeling at the interface between the translucent resin 6 and the substrate 1 is prevented. Accordingly, at least, the adhesive strength per unit area at the interface between the translucent resin 6 and the light-shielding resin 7 is larger than the adhesive strength at the interface between the translucent resin 6 and the substrate 1. In addition, the definition and measurement method of the adhesive strength mentioned here are not particularly limited, but for example, various adhesive strengths defined in JIS K 6849 to 6856 may be used. In the present embodiment, the tensile bond strength specified in JIS K 6849 is used as the bond strength.

  Hereinafter, a second embodiment of the present invention will be described with reference to FIG.

  FIG. 3 is a schematic cross-sectional view of a light emitting device 200 according to the second embodiment of the present invention. The light emitting device 200 is substantially the same as the light emitting device 100 according to the previous embodiment except that the position of the fitting portion 271 that is a structure for preventing the light blocking resin 7 from coming off is different. Accordingly, parts common to the light emitting device 100 according to the previous embodiment are denoted by the same reference numerals, and redundant description is omitted.

  The light emitting device 200 according to the present embodiment has a fitting portion 271 in which the retaining structure of the light shielding resin 7 enters inside the outer shape on the side surface of the substrate 1. The fitting portion 271 meshes with a groove 211 formed on the side surface of the substrate 1. Therefore, in the present embodiment, the outer shapes of the front surface and the rear surface of the substrate 1 are substantially equal. Even in this case, as in the previous embodiment, separation of the light-shielding resin 7 from the substrate 1 to the front side is prevented, thereby preventing peeling at the interface between the translucent resin 6 and the substrate 1. The

  In the first embodiment and the second embodiment, the fitting portions 71 and 271 may be provided so as to surround the entire circumference of the substrate 1 or may be provided on a part of the outer circumference thereof. As shown in FIGS. 1 and 3, it is desirable that the fitting portions 71 and 271 are provided so as to face each other on the opposite side surfaces of the substrate 1.

  Next, a third embodiment of the present invention will be described with reference to FIGS.

  FIG. 4 is a schematic cross-sectional view of a light emitting device 300 according to the third embodiment of the present invention. Also in the description of the present embodiment, portions that are common to the light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and redundant descriptions are omitted.

  In the present embodiment, a bridge portion 372 is provided on the back surface of the substrate 1 as a structure for preventing the light shielding resin 7 from coming off. As illustrated, the bridge portion 372 extends between opposing sides of the substrate 1, and connects the light shielding resins 7 positioned so as to sandwich the substrate 1. Even if it does in this way, isolation | separation to the front side from the board | substrate 1 of the light shielding resin 7 is prevented similarly to the insertion parts 71 and 271 in 1st and 2nd embodiment, Thereby, translucent resin 6 and Separation at the interface with the substrate 1 is prevented.

  In the cross-sectional view shown in FIG. 4, the through hole 4 and the terminal electrode 5 are not shown, but this is a plan view of the through hole 4 and the terminal electrode 5 so that the terminal electrode 5 and the bridge portion 372 do not interfere with each other. This is because the position at has been changed.

  FIG. 5 is a rear view of the light emitting device 300 according to this embodiment. In the figure, the position of the through hole 4 is indicated by a broken line. In the embodiment shown here, the bridge portion 372 has a cross shape passing through the center of the back surface of the substrate 1. The terminal electrode 5 is formed by being divided into four regions divided by the bridge portion 372. The through holes 4 are positions where each terminal electrode 5 can be connected to the element electrode 2 (see FIG. 2. The front view of the light emitting device 300 according to this embodiment is the same as that shown in FIG. 2). Are provided respectively. Note that the shape of the bridge portion 372 may not be limited to the one shown here, and a short or a plurality of linear shapes may be provided, or a number of bridge portions 372 orthogonal to each other may be provided. The position may or may not pass through the center of the back surface of the substrate 1. Further, FIG. 4 shown above is a cross-sectional view taken along line IV-IV shown in FIG.

  Furthermore, a fourth embodiment of the present invention will be described with reference to FIG.

  FIG. 6 is a schematic cross-sectional view of a light emitting device 400 according to the fourth embodiment of the present invention. Also in the description of the present embodiment, portions that are common to the light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and redundant descriptions are omitted.

  The light emitting device 400 extends between the opposing sides of the substrate 1 as in the third embodiment, and has a bridge portion 472 that connects the light blocking resins 7 positioned so as to sandwich the substrate 1. ing. This prevents separation of the light-shielding resin 7 from the substrate 1 to the front side and prevents peeling at the interface between the translucent resin 6 and the substrate 1. Here, the bridge portion 472 has a structure that penetrates not the back surface of the substrate 1 but the inside of the substrate 1.

  FIG. 7 is a rear view of the light emitting device 400 according to the present embodiment. In the figure, the positions of the through hole 4 and the bridge portion 472 are indicated by broken lines. In this way, the bridge portion 472 is embedded in the substrate 1, so that the area of the terminal electrode 5 can be increased, and the number of through holes is two. It should be noted that the shape and arrangement of the bridge portion 472 can be variously modified as in the third embodiment.

  Next, a fifth embodiment of the present invention will be described with reference to FIG.

  FIG. 8 is a schematic cross-sectional view of a light emitting device 500 according to the fifth embodiment of the present invention. Also in the description of the present embodiment, portions that are common to the light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and redundant descriptions are omitted.

  In the present embodiment, the light-shielding resin 7 is formed on the back surface of the substrate 1 with a first insertion portion 573 that enters the inside of the outer shape of the substrate 1, and from the tip of the first insertion portion 573 toward the front surface. It has a fitting portion 571 including a second fitting portion 574 that enters inside. As described above, by providing the second insertion portion 574 having a structure extending toward the front surface of the light emitting device 500, the light shielding resin 7 can be prevented from being peeled toward the outside of the substrate 1, and the substrate 1 can be shielded from light. The fixing resin 7 is more firmly fixed.

  Furthermore, a sixth embodiment of the present invention will be described with reference to FIG.

  FIG. 9 is a schematic cross-sectional view of a light-emitting device 600 according to the sixth embodiment of the present invention. Also in the description of the present embodiment, portions that are common to the light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and redundant descriptions are omitted.

  In the present embodiment, the light-shielding resin 7 has a cross-sectional area (cross-sectional area in a cross section by a plane parallel to the front surface or the back surface of the substrate 1) from the back surface of the substrate 1 to the front surface in the cross-sectional view shown in FIG. Decreasing taper shape. That is, the light-shielding resin 7 has a tapered portion 676 whose inner peripheral surface is a slope 675 inside. Even in this case, separation of the light-shielding resin 7 from the substrate 1 to the front side is prevented, thereby preventing peeling at the interface between the light-transmitting resin 6 and the substrate 1.

  Finally, a seventh embodiment of the present invention will be described with reference to FIG.

  FIG. 10 is a schematic cross-sectional view of a light-emitting device 700 according to the seventh embodiment of the present invention. Also in the description of the present embodiment, portions that are common to the light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and redundant descriptions are omitted.

  Also in the present embodiment, the light-shielding resin 7 has a fitting portion 71 that enters inside the outer shape of the substrate 1 on the back surface of the substrate 1, as in the light emitting device 100 according to the first embodiment. The light-shielding resin 7 is in direct contact with the translucent resin 6 on the front surface 770, not on the side surfaces thereof, and both are firmly bonded to each other in the region of the front surface 770. Even in this case, separation of the light-shielding resin 7 from the substrate 1 to the front side is prevented, thereby preventing peeling at the interface between the light-transmitting resin 6 and the substrate 1. In this case, in the front view of the light emitting device 700, the light blocking resin 7 does not surround the light transmitting resin 6, and the side surface of the light transmitting resin 6 is exposed. This is advantageous when the light beam is emitted over a wide angle.

  The front surface 770 of the light-shielding resin 7 and the front surface 10 of the substrate 1 may be flush with each other as shown in FIG.

  The various retaining structures described in the first to seventh embodiments described above may be used independently as described above, or may be used in appropriate combination. For example, the fitting portion 71 (see FIG. 1) shown in the first embodiment and the tapered portion 676 (see FIG. 9) shown in the sixth embodiment may be employed simultaneously, and other combinations are also possible. Is possible.

  Then, the manufacturing method of the light-emitting device which concerns on various embodiment of this invention demonstrated above is demonstrated.

In manufacturing the light emitting device according to the present invention, the following steps are required.
Step A: Step of preparing a substrate Step B: Step of mounting or forming a light emitting element on the substrate Step C: Step of forming a complementary shape of a retaining structure on the substrate Step D: Step of forming a translucent resin Step E: Step F of forming a complementary shape of a light-shielding resin on a substrate or a substrate and a light-transmitting resin F: Step of forming a light-shielding resin

In addition, when the light emitting device is manufactured by a method of obtaining a large number of light emitting devices from a large-sized substrate by a so-called multi-sided technique, the next process step G: separating each light emitting device connected to each other and individually The process to change is necessary.

  Steps A to G described above are in no particular order and are performed according to a reasonable procedure as necessary. Hereinafter, a specific method for manufacturing a light emitting device according to the present invention will be exemplarily described according to the above-described embodiment. In the following description, it is assumed that all light emitting devices are manufactured by a multi-cavity technique.

  11 and 13 are schematic cross-sectional views illustrating the method for manufacturing the light emitting device 100 according to the first embodiment.

  First, in step ST1 shown in FIG. 11, the collective substrate 12 is prepared. This step corresponds to the above-described step A. Here, a total of four light emitting devices 100 in two vertical rows and two horizontal rows are obtained from one collective substrate 12, but this is for the sake of simplification of the description. A larger number of light emitting devices may be obtained from the aggregate substrate 12. On the collective substrate 12, the element electrode 2, the through hole 4, and the terminal electrode 5 are formed by a known process.

  Next, the long hole 13 is formed in the collective substrate 12 in process ST2. The elongated hole 13 may be formed by machining using an end mill or the like, or may be formed by a chemical process such as etching. FIG. 12 is a front view of the collective substrate 12 in step ST2 of FIG. As shown in the figure, the long holes 13 are formed at the boundary portion of the region to be the individual light emitting device 100 in the future in the collective substrate 12, but the collective substrate 12 is not divided and still remains. 12 is maintaining unity. Areas that are to become individual light emitting devices 100 in the future are connected to each other. That is, by maintaining the integrity of the collective substrate 12 in this way, the collective substrate 12 can be easily handled in a later manufacturing process. In addition, the cross section shown by process ST2 of FIG. 11 shows the cross section in the XI-XI line of FIG.

  Returning again to FIG. 11, in step ST3, the step 11 is formed. The step 11 is obtained by, for example, grinding the back surface of the collective substrate 12 by a dicing saw so as to be equal to the step depth. The step 11 has a complementary shape with the insertion portion 71 which is the retaining structure in the first embodiment. Therefore, this process corresponds to the above-mentioned process C.

  Next, the light emitting element 3 is mounted on the element electrode 2 of the collective substrate 12 in process ST4. As described above, the light emitting element 3 may be mounted with a chip as shown here, or may be directly formed on the collective substrate 12. Therefore, this process corresponds to the above-described process B.

  Next, in step ST5, the collective substrate 12 is fixed on the support member 8. The surface of the support member 8 is an adhesive surface, and the aggregate substrate 12 is attached and fixed. The support member 8 is made of a moderately soft material, and is preferably deformable in accordance with the shape of the back surface of the collective substrate 12. The terminal electrode 5 is buried in the support member 8 by the thickness as shown in the figure, and the back surface of the collective substrate 12 is obtained. And the surface of the support member 8 are bonded together without a gap. As the support member 8, a synthetic resin sheet having an adhesive layer formed on the surface thereof may be used, and an adhesive tape generally marketed as a dicing tape may be suitably used.

  Next, referring to FIG. 13, the frame 9 is arranged on the front surface of the collective substrate 12 in step ST6. The frame 9 is provided with openings at positions corresponding to the individual light emitting devices 100, and a space that is complementary to the translucent resin 6 is formed by the inner peripheral surface 90 of the openings and the front surface of the collective substrate 12. Is done.

  And in process ST7, translucent resin 6 is inject | poured into opening of frame 9, and it hardens | cures. Thereby, translucent resin 6 is formed. Therefore, this process corresponds to the above-mentioned process D.

  Subsequently, in step ST8, the frame 9 is removed. Thereby, the complementary shape 14 of the light-shielding resin, which is a space defined by the inner surface of the long hole 13 of the collective substrate 12, the step 11, the side surface of the translucent resin 6, and the front surface of the support member 8, is formed. Therefore, this process corresponds to the above-mentioned process E.

  Next, in step ST9, the light shielding resin 7 is injected into the complementary shape 14 of the light shielding resin and cured. Thereby, the light-shielding resin 7 is formed. Therefore, this process corresponds to the above-mentioned process F.

  Finally, in step ST10, an appropriate position of the light-shielding resin 7 is ground with a dicing saw or the like, and the light emitting devices 100 connected to each other are separated to obtain individual light emitting devices 100. Therefore, this process corresponds to the above-mentioned process G.

  Next, a method for manufacturing the light emitting device 200 according to the second embodiment will be described with reference to FIGS.

  First, in step ST1 shown in FIG. 14, the collective substrate 12 is prepared. This step corresponds to the above-described step A. Here, a total of four light emitting devices 200 in two vertical rows and two horizontal rows are obtained from one collective substrate 12. In the collective substrate 12, the element electrode 2, the through hole 4, and the terminal electrode 5 are formed by a known process, and a cavity 15 is formed inside a boundary portion of a region to be an individual light emitting device 200 in the future. ing. The cavity 15 can be formed, for example, by providing an opening in an intermediate base material in advance when the aggregate substrate 12 is manufactured by stacking three base materials. As will be described later, the cavity 15 has a shape complementary to the insertion portion 271 that is a structure for preventing the light-shielding resin 7 from coming off. Therefore, the step of forming the cavity 15 corresponds to the above-described step C.

  Next, in step ST <b> 2, the light emitting element 3 is mounted on the element electrode 2 of the collective substrate 12. Of course, the light emitting element 3 may be formed directly on the collective substrate 12. This step corresponds to the above-described step B.

  Next, in step ST3, the translucent resin 6 is formed on the collective substrate 12. The translucent resin 6 is applied and cured so as to cover the entire front surface of the collective substrate 12. This process corresponds to the above-mentioned process D.

  Further, in step ST4, the collective substrate 12 is attached to the adhesive surface of the support member 8 and fixed.

  Next, referring to FIG. 15, in step ST5, the translucent resin 6 and the collective substrate 12 at the boundary portion of the region to be another light emitting device 200 in the future are ground with a dicing saw or the like, and the complementary shape of the light shielding resin is obtained. 14 is formed. At this time, in order to grind the collective substrate 12 so as to overlap with the cavity 15, the cavity 15 is divided into two and each becomes a groove 211 opened on the side surface of the collective substrate 12. Therefore, this step ST5 corresponds to the above-described step E.

  Further, in step ST6, the light shielding resin 7 is injected into the complementary shape 14 of the light shielding resin and cured. Thereby, the light-shielding resin 7 is formed. Therefore, this process corresponds to the above-mentioned process F.

  Finally, in step ST7, an appropriate position of the light-shielding resin 7 is ground with a dicing saw or the like, and the light emitting devices 200 connected to each other are separated to obtain individual light emitting devices 200. Therefore, this process corresponds to the above-mentioned process G.

  The light emitting devices according to the third to fifth and seventh embodiments can also be manufactured by a method similar to the manufacturing method described above. For example, in the light emitting device 300 according to the third embodiment, in step ST3 illustrated in FIG. 11, a groove that is complementary to the bridge portion 372 (see FIG. 4) is formed on the back surface of the collective substrate 12 in place of the step 11. do it. Further, in the light emitting device 400 according to the fourth embodiment, in the process ST1 shown in FIG. 14, the individual light emitting device 400 is individually formed in the future so that the shape of the cavity 15 is complementary to the bridge portion 472 (see FIG. 5). What is necessary is just to make it the shape which penetrates the area | region which should become. Furthermore, the light emitting device 500 according to the fifth embodiment is inserted by using a dicing saw having an irregular cross section when forming the step 11 or by performing grinding a plurality of times in step ST3 shown in FIG. What is necessary is just to form the groove | channel which becomes a complementary shape of the part 571 (refer FIG. 8) in the back surface of the collective substrate 12. FIG. In the light emitting device 700 according to the seventh embodiment, the order of the steps shown in FIG. 13 is changed, and the light shielding resin 7 is formed in step ST9 before the light transmissive resin 6 is formed. As shown in step ST14, it is obtained by forming the translucent resin 6 over the entire front surface of the collective substrate 12.

  Further, a method for manufacturing the light emitting device 600 according to the sixth embodiment will be described with reference to FIGS.

  First, in step ST1 shown in FIG. 16, the collective substrate 12 is prepared. This step corresponds to the above-described step A. Here, a total of four light emitting devices 600 in two vertical rows and two horizontal rows are obtained from one collective substrate 12. On the collective substrate 12, the element electrode 2, the through hole 4, and the terminal electrode 5 are formed by a known process.

  Next, in step ST <b> 2, the light emitting element 3 is mounted on the element electrode 2 of the collective substrate 12. Of course, the light emitting element 3 may be formed directly on the collective substrate 12. This step corresponds to the above-described step B.

  Next, in step ST3, the translucent resin 6 is formed on the collective substrate 12. The translucent resin 6 is applied and cured so as to cover the entire front surface of the collective substrate 12. This process corresponds to the above-mentioned process D.

  Further, in step ST4, the collective substrate 12 is attached to the adhesive surface of the support member 8 and fixed. At this time, the collective substrate 12 is turned upside down, and the front surface thereof, that is, the front surface of the translucent resin 6 is fixed to the support member 8, and the back surface of the collective substrate 12 is exposed.

  Next, referring to FIG. 17, in step ST5, the translucent resin 6 and the collective substrate 12 at the boundary portion of the region to be the individual light emitting device 700 in the future are ground with a dicing saw or the like, and the complementary shape of the light shielding resin is obtained. 14 is formed. At this time, as a dancing saw, by using a taper in cross-sectional shape, the complementary shape 14 of the light-shielding resin also has a large opening area on the back side as shown, and the opening area increases toward the front side. The taper shape becomes smaller. This step ST5 corresponds to the above-described step E.

  Further, in step ST6, the light shielding resin 7 is injected into the complementary shape 14 of the light shielding resin and cured. Thereby, the light-shielding resin 7 is formed. Therefore, this process corresponds to the above-mentioned process F.

  Finally, in step ST7, an appropriate position of the light-shielding resin 7 is ground with a dicing saw or the like, and the light emitting devices 700 connected to each other are separated to obtain individual light emitting devices 700. Therefore, this process corresponds to the above-mentioned process G.

  The method for manufacturing a light emitting device according to various embodiments of the present invention described above is an exemplification, and various modifications such as changing the order of each step may be performed as necessary. Moreover, the method of manufacturing the light emitting device according to each embodiment is not necessarily limited to the manufacturing method shown as corresponding to them. For example, as a method for manufacturing the light emitting device 100 according to the first embodiment, a method similar to the method shown as the method for manufacturing the light emitting device 200 according to the second embodiment may be used.

  Furthermore, the specific configurations shown in the embodiments described above are shown as examples, and the invention disclosed in this specification is not limited to the configurations of these specific examples. Those skilled in the art may appropriately modify various modifications to the disclosed embodiments, for example, the shape, number, arrangement, etc. of each member or part thereof, and the technical scope of the invention disclosed in this specification is It should be understood to include such modifications.

  DESCRIPTION OF SYMBOLS 1 board | substrate, 2 element electrode, 3 light emitting element, 4 through-hole, 5 terminal electrode, 6 translucent resin, 7 light-shielding resin, 8 support member, 9 frame, 10 steps, 11 steps, 12 collective board, 13 oblong hole , 14 Complementary shape of light shielding resin, 15 cavity, 70 side surface, 71 insertion portion, 90 inner peripheral surface, 100, 200 light emitting device, 211 groove, 271 insertion portion, 372 bridge portion, 472 bridge portion, 571 insertion portion, 573 1st insertion part, 574 2nd insertion part, 675 slope, 676 taper part.

Claims (7)

A substrate,
A light emitting device mounted on the front surface of the substrate;
A translucent resin covering the light emitting surface of the light emitting element;
A light-blocking resin that is in contact with the light-transmitting resin and has a retaining structure to the front side on the side surface or the back surface of the substrate;
A light emitting device.   The light-emitting device according to claim 1, wherein the light-shielding resin surrounds the light-transmitting resin when viewed from the front.   The adhesive strength per unit area at the interface between the light-transmitting resin and the light-shielding resin is larger than the adhesive strength per unit area at the interface between the light-shielding resin and the substrate. Light emitting device.   The light emitting device according to any one of claims 1 to 3, wherein the retaining structure is a fitting portion that enters the inside of the outer shape of the substrate in front view.   The light-emitting device according to claim 1, wherein the retaining structure includes a bridge portion that extends between opposing sides of the substrate.   The retaining structure includes a first insertion portion that enters the inside of the outer shape of the substrate on the back surface of the substrate, and a second insertion portion that enters the inside of the substrate from the first insertion portion toward the front surface. The light emitting device according to claim 1.   The light emitting device according to any one of claims 1 to 6, wherein the retaining structure is a tapered portion in which a cross-sectional area of the translucent resin decreases from a back surface to a front surface of the substrate in a cross-sectional view.

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