JP2013074273A - Led light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light emitting device which has excellent heat radiation performance.SOLUTION: An LED light emitting device includes: a substrate 2 having a recessed part which opens at an upper end surface; an LED element 3 attached to an area in the recessed part of the substrate 2; a sealing member 4 which seals the LED element 3 and is made of a translucent material; and a wavelength conversion member 6 provided above the sealing member 4 and containing a phosphor 61. Recessed grooves 81, each of which serves as a heat shielding part shielding heat emitted from the LED element 3 and heat emitted from the wavelength conversion member 6, are formed at the substrate 2.

Description

  The present invention relates to a light emitting device provided with an LED element.

  Conventionally, a light emitting device that emits light of a color different from that of LED elements such as white by combining blue light or ultraviolet light emitting LED elements and various phosphors using a gallium nitride compound semiconductor Has been developed (Patent Document 1). Such a light emitting device using an LED element has advantages such as small size, power saving and long life, and is widely used as a light source for display and a light source for illumination. In particular, recently, LED elements with high output and high brightness have been developed, and their uses are increasingly expanding.

  By the way, the power loss inside the LED element is converted into thermal energy and causes the junction temperature to rise. However, the LED element is sensitive to temperature, and as the temperature rises, the thermal disturbance of the crystal becomes severe, and many electrons and positive Hole pairs are generated, and normal operation is difficult to obtain. For this reason, when the output of the LED element is increased, the amount of heat generated by the LED element increases, and the LED element itself deteriorates due to the heat.

  In addition, the phosphor is also vulnerable to heat, and the phosphor is also thermally deteriorated due to the heat generated by the phosphor itself and the heat transfer from the LED element. For this reason, there is an urgent need to solve a decrease in luminous efficiency and luminance of the phosphor due to thermal degradation.

  Thus, conventionally, an attempt has been made to dissipate heat from a heat dissipating fin provided in the lower part of a light emitting device using such an LED element (Patent Document 2).

JP 2005-191197 A JP 2007-80867 A

  However, if the heat generated from the LED element and the heat generated from the phosphor are not separated in the light emitting device and are mixed together, it is effective even when it is desired to cool either the LED element or the phosphor preferentially. The heat generated from the LED element and the heat generated from the phosphor cannot be properly managed and processed.

  In addition, in the light emitting device 1 ′ having the configuration illustrated in FIG. 25, the wavelength conversion member 6 containing the phosphor 61 is prepared in advance in order to suppress the variation in the color of light emission and the illuminance from lot to lot. Then, using the reference light source, analyze the emission color, illuminance, and the like of the wavelength conversion member 6, classify and manage the wavelength conversion member 6 according to the result, and select those having the desired emission color, illuminance, etc. Thus, an attempt has been made to combine with a suitable LED element 3.

  And in manufacturing light-emitting device 1 ', each process as shown, for example in FIG.26 and FIG.27 is performed. That is, first, the cylindrical frame body 2 whose upper opening is closed by the wavelength conversion member 6 containing the phosphor 61 prepared in advance is installed upside down (FIG. 26A). Next, a predetermined amount of transparent resin 4 ′, which is a sealing material for the LED element 3, is filled in the frame body 2 (FIGS. 26A to 26B). Then, before the transparent resin 4 ′ is cured, the substrate 8 on which the LED element 3 is mounted is placed so that the LED element 3 faces downward, and the LED element 3 is sealed with the transparent resin 4 ′. (FIGS. 27 (c) to (d)). Then, the transparent resin 4 ′ is cured by heating or the like as necessary to form the sealing member 4, and the light emitting device 1 is completed.

  At this time, the amount of the transparent resin 4 ′ filled in the frame body 2 by potting is made larger than the amount necessary for forming the sealing member 4, and the substrate 8 on which the LED element 3 is mounted is placed on the transparent resin 4. The transparent resin 4 ′ functions as an adhesive so that the transparent resin 4 ′ oozes out between the substrate 8 and the frame 2 when installed on the substrate.

  However, if the transparent resin 4 ′ is interposed between the substrate 8 and the frame body 2 in this way, heat conduction from the frame body 2 to the substrate 8 is hindered, and thus from the wavelength conversion member 6 (phosphor 61). It becomes difficult to release the generated heat to the substrate 8 via the frame 2, and the heat dissipation efficiency is lowered.

  The present invention has been made in view of such problems, and it is a main intended object of the present invention to provide an LED light emitting device excellent in heat dissipation performance.

  That is, the LED light-emitting device according to the present invention includes a base body having a recess opening in the upper end surface, an LED element mounted in the recess of the base body, and a sealing material made of a translucent material that seals the LED element. And a wavelength conversion member containing a phosphor provided above the sealing member, and the base blocks heat generated from the LED element and heat generated from the wavelength conversion member. A heat blocking part is formed.

  If it is such, since the heat | fever emitted from the LED element and the heat | fever emitted from the wavelength conversion member (phosphor) do not mix within a base | substrate, each heat | fever can be managed separately.

  The LED light emitting device according to the present invention further includes an annular heat insulating member provided so as to surround the sealing member, and the base includes a lower base to which an LED element is attached, and the lower base. And a cylindrical upper base that supports the wavelength conversion member, the upper base is provided so as to protrude from the inner peripheral surface of the side wall, and presses the heat insulating member toward the lower base. A space having a pressing portion and closed by the lower base, the wavelength conversion member, and the upper base is formed on the outer peripheral side of the space where the sealing member is formed by the heat insulating member. You may partition liquid-tightly to the space into which the translucent material does not flow in. In such a case, since the translucent material does not flow into the outer space partitioned by the annular heat insulating member, a transparent resin or the like is not inserted between the side wall of the upper base and the lower base. No light material is present. For this reason, the heat emitted from the wavelength conversion member and transmitted through the upper base is efficiently transmitted to the lower base without being hindered by the translucent material.

  As the heat insulating member, for example, an elastic deformation member is preferably used.

  In the LED light emitting device according to the present invention in which the heat blocking part is formed in the base, the position where the heat blocking part is formed on the surface of the lower base opposite to the surface on which the LED element is attached. It is preferable that a radiation fin for the LED element provided on the inner side and a radiation fin for the wavelength conversion member provided on the outer side from the position where the heat blocking portion is formed are disposed. If it is such, the magnitude | size of each radiation fin can be selected appropriately according to the calorie | heat amount emitted from the LED element, and the calorie | heat amount emitted from the wavelength conversion member.

  In such an LED light emitting device according to the present invention, it is preferable to use a screw or a solder paste to join the lower base and the upper base. If screws or solder paste is used, both can be brought into close contact with each other without hindering heat conduction from the frame to the substrate.

  Although it does not specifically limit as a use of the LED light-emitting device which concerns on this invention, For example, it can use as a light source of an illuminating device. As an illuminating device using the LED light-emitting device according to the present invention as a light source, for example, a plurality of different distribution wavelength regions of radiation peaks selected from a set of the same product having variations in radiation peaks between individual products are different from each other. Examples include an LED light emitting device according to the present invention having a plurality of LED elements each belonging to a group of LED elements, and a current control unit for changing a current value supplied to each of the plurality of LED elements. . Such a lighting device is also one aspect of the present invention.

  In the said illuminating device, it is preferable that the LED element which belongs to the said LED element group which is mutually different is arrange | positioned alternately on the said base | substrate. As described above, by alternately arranging LED elements belonging to groups having different distribution wavelength regions of radiation peaks selected from the same product on the base, light emitted from the wavelength conversion member excited by each LED element is easily mixed. Thus, when the light is white light, the color temperature of each white light can be finely adjusted to a predetermined value.

  According to the present invention having such a configuration, an LED package with excellent heat dissipation can be constructed, and thermal degradation of LED elements and phosphors can be suppressed to achieve a long life.

It is a longitudinal cross-sectional view of the light-emitting device which concerns on 1st Embodiment of this invention. It is a top view of the light-emitting device concerning the embodiment. It is a bottom view of the light-emitting device concerning the embodiment. It is a graph which shows the outline | summary of the transmittance | permeability and reflectance of the short wavelength transmission filter in the embodiment. It is a graph which shows the outline | summary of the transmittance | permeability and reflectance of the long wavelength transmission filter in the embodiment. It is a figure which shows the manufacturing process (a)-(b) of the light-emitting device based on the embodiment. It is a figure which shows the manufacturing process (c)-(d) of the light-emitting device concerning the embodiment. It is a figure which shows the manufacturing process (a)-(c) of the laminated body in which the wavelength conversion member in the embodiment was pinched | interposed. It is a figure which shows the manufacturing process (d)-(f) of the laminated body in which the wavelength conversion member in the embodiment was pinched | interposed. It is a longitudinal cross-sectional view of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a bottom view of the light-emitting device concerning the embodiment. It is a side view of the light-emitting device concerning the embodiment. It is a figure which shows the manufacturing process (a)-(b) of the light-emitting device based on the embodiment. It is a figure which shows the manufacturing process (c)-(d) of the light-emitting device concerning the embodiment. It is a figure which shows the manufacturing process (a)-(b) of the light-emitting device which concerns on other embodiment. It is a figure which shows the manufacturing process (c)-(d) of the light-emitting device concerning the embodiment. It is a figure which shows the manufacturing process (e)-(f) of the light-emitting device which concerns on the same embodiment. It is a figure which shows the manufacturing process of the light-emitting device which concerns on other embodiment. It is a longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. It is a longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. It is a typical block diagram of the illuminating device provided with the light-emitting device based on this invention. It is a longitudinal cross-sectional view of the light bulb provided with the light-emitting device which concerns on other embodiment. It is a perspective view of the light bulb in the same embodiment. It is a principal part enlarged view of the radiation fin of the light-emitting device concerning the embodiment. It is a longitudinal cross-sectional view of the conventional light-emitting device. It is a figure which shows the manufacturing process (a)-(b) of the conventional light-emitting device. It is a figure which shows the manufacturing process (c)-(d) of the conventional light-emitting device.

<First Embodiment>
A first embodiment of the present invention will be described below with reference to the drawings.

  As shown in FIGS. 1 to 3, the light emitting device 1 according to this embodiment includes an LED element 3, a sealing member 4 that seals the LED element 3, and a wavelength conversion member that is provided above the sealing member 4. 6, and the LED element 3, the sealing member 4, and the wavelength conversion member 6 are accommodated and held in the base 2.

Each part is described in detail below.
The LED element 3 emits ultraviolet rays or short-wavelength visible light, and has a radiation peak at 360 to 430 nm, for example. Such an LED element 3 is formed, for example, by laminating a gallium nitride compound semiconductor in the order of an n-type layer, a light emitting layer, and a p-type layer on a sapphire substrate or a gallium nitride substrate.

  The LED element 3 is flip-chip mounted on the substrate 8 using a solder bump, a gold bump, or the like (not shown) with the gallium nitride compound semiconductor facing down. The LED element 3 may be connected to a wiring conductor provided on the substrate 8 using wire bonding. In the present embodiment, a plurality (9) of LED elements 3 are mounted. However, the number of LED elements 3 is not limited to this, and can be appropriately changed according to the purpose and application.

  The substrate 8 is made of a material having high thermal conductivity such as aluminum, copper, alumina, aluminum nitride, and the upper surface of the substrate 8 is electrically connected to the LED element 3, for example, a silver pattern or the like. A wiring conductor (not shown) is formed. This wiring conductor is led to the outer surface of the light emitting device 1 through a wiring layer (not shown) formed inside the base body 2 and connected to the external electric circuit board, whereby the LED element 3 and the external electric circuit board are connected. Are electrically connected.

  The sealing member 4 is for sealing the LED element 3. In order to efficiently extract light from the LED element 3 to the sealing member 4, the sealing member 4 is excellent in translucency and heat resistance, and the LED element 3. Are preferably made of a transparent resin such as a silicone resin.

  The wavelength conversion member 6 contains the phosphor 61 inside. For example, the phosphor 61 is contained in a matrix made of a silicone resin, a fluororesin, a low-melting glass, or the like that is excellent in translucency and heat resistance. Are dispersed.

  It does not specifically limit as the fluorescent substance 61 which the wavelength conversion member 6 contains, For example, a red fluorescent substance, a green fluorescent substance, a blue fluorescent substance, a yellow fluorescent substance etc. are mentioned. Among these, when the red phosphor, the green phosphor, and the blue phosphor are used in combination, the light emitting device 1 that emits white light can be configured.

  The wavelength conversion member 6 is sandwiched between the lower light-transmitting plate 5 and the upper light-transmitting plate 7 together with the spacers S to form a laminate A. Here, the spacer S is made of a metal having high thermal conductivity such as copper or aluminum, and has a flat plate shape provided with a through hole S1 for forming the wavelength conversion member 6.

  The lower light-transmitting plate 5 is made of a material having a high thermal conductivity such as quartz, sapphire, diamond, quartz, and aluminum nitride and having excellent light-transmitting properties. Moreover, as the lower light-transmitting plate 5, for example, a metal having excellent heat conductivity such as copper or aluminum is deposited on the surface thereof in a line shape or a lattice shape, thereby ensuring the light conductivity while ensuring the light transmissivity. It is also possible to use a glass substrate with improved resistance.

  The lower light-transmitting plate 5 may be formed with a dielectric multilayer film in which the light transmittance and the reflectance are reversed with the vicinity of 430 nm as a boundary. As a result, as shown in FIG. It can be used as a low-pass filter that reflects light rays and selectively transmits ultraviolet rays or short-wavelength visible rays.

  Similar to the lower light-transmitting plate 5, the upper light-transmitting plate 7 is made of a material having a high thermal conductivity such as quartz, sapphire, diamond, quartz, and aluminum nitride and having excellent light-transmitting properties.

  The upper light-transmitting plate 7 may be formed with a dielectric multilayer film in which the reflectance and transmittance of light are reversed with the vicinity of 430 nm as a boundary. As a result, as shown in FIG. It can be used as a high-pass filter that reflects visible light and selectively transmits long-wavelength visible light.

  When a dielectric multilayer film is formed on each of the lower light-transmitting plate 5 and the upper light-transmitting plate 7, the lower light-transmitting plate 5 is a low-pass filter, and the upper light-transmitting plate 7 is a high-pass filter, it does not hit the phosphor 61. Ultraviolet rays and short-wavelength visible rays that have passed through the wavelength conversion member 6 are reflected by the upper light-transmitting plate 7 and travel through the wavelength conversion member 6 again. For this reason, since the probability that ultraviolet rays or short-wavelength visible light hits the phosphor 61 is improved, more ultraviolet rays or short-wavelength visible light is converted into long-wavelength visible light. The amount increases. Further, among the long-wavelength visible light emitted from the phosphor 61, the backward light traveling toward the LED element 3 side is reflected by the lower light-transmitting plate 5, changes the traveling direction toward the upper light-transmitting plate 7, Since it passes through the filter 7 and is emitted outside the light emitting device 1, the extraction efficiency of visible light having a long wavelength is also improved. Therefore, the wavelength conversion member 6 is sandwiched between the lower light transmitting plate 5 (LED element 3 side) and the upper light transmitting plate 7 (light emitting surface side), so that ultraviolet rays and short-wavelength visible light can be obtained. The light can be efficiently converted into long-wavelength visible light, and the converted visible light can be efficiently taken out of the light emitting device 1.

  Further, as described above, the long-wavelength visible light traveling backward toward the LED element 3 side is reflected by the lower light-transmitting plate 5, so that the long-wavelength light reaching the inner surface including the side surface and the bottom surface of the concave portion of the base 2 is reached. Visible light is reduced. The LED element 3 has a very long life compared to a conventional light source, but if the long-wavelength visible light reaching the inner surface of the concave portion of the base 2 can be reduced, the base caused by being exposed to the visible light for a long time. The time-dependent deterioration of the reflector formed on the inner surface of the concave portion 2 is suppressed, and as a result, the change in the emission color of the light emitting device 1 is also suppressed.

  The base 2 has a concave portion opened at the upper end surface, and examples thereof include a material made of a material having high thermal conductivity such as aluminum, copper, alumina, aluminum nitride.

  An annular ridge 23 is formed on the side surface of the recess of the base 2, and the laminate A is placed on the upper end surface of the ridge 23. In addition, as shown in FIG. 2, the chamfering holes 24 are formed at the four corners in the concave portion of the base body 2 so that the corner portions do not interfere when the laminate A is fitted into the concave portion. . Also, a metal thin film with high reflectivity is formed on the inner surface including the side surface and the bottom surface of the concave portion of the base 2 by applying metal plating such as silver, aluminum, gold, etc., and functions as a reflector. . Then, ultraviolet light or short-wavelength visible light reflected downward by the upper light transmission plate 7 and transmitted through the wavelength conversion member 6 and the lower light transmission plate 5 is directed again toward the wavelength conversion member 6 by the metal thin film. Can be reflected.

  In addition, although the silicone resin etc. which comprise the sealing member 4 and the wavelength conversion member 6 have high gas permeability, in this embodiment, the lower light transmission board 5 and the upper light transmission board 7 are gas into the recessed part of the base | substrate 2. And the intrusion of moisture can be suppressed, so that the metal thin film formed on the inner surface of the recess of the substrate 2 can be prevented from being corroded by oxidation, sulfidation, chlorination or the like.

  The base 2 is provided with heat radiating fins 9 depending from the bottom surface. The heat dissipating fins 9 are configured such that the protruding portions of the adjacent concave grooves T and the concave grooves T have a heat dissipation function by providing a plurality of concave grooves T extending in the column direction on the outer surface thereof. Is. The radiating fin 9 has a radiating fin 9 a provided below the LED element 3 for releasing heat emitted from the LED element 3, and a base 2 for releasing heat generated from the wavelength conversion member 6 through the base 2. The heat generated from the LED element 3 and the heat generated from the wavelength conversion member 6 are released from the outer surface of the heat radiating fin 9a and the outer surface of the heat radiating fin 9b, respectively. The

  A concave groove 81 is formed on the bottom surface of the concave portion of the base 2 so as to surround the LED element 3. The concave groove 81 prevents the heat generated from the LED element 3 from diffusing in the base 2. It functions to block the heat generated from the LED element 3 and the heat generated from the wavelength conversion member 6.

  Next, a method for manufacturing the light emitting device 1 according to the present embodiment will be described with reference to FIGS.

  First, as shown in FIGS. 6A to 6B, the transparent resin 4 ′ is filled so much as to bulge from the upper end surface of the protrusion 23 into the recess of the base 2. Thereafter, as shown in FIGS. 7C to 7D, the wavelength conversion member 6 is laminated together with the spacer S between the lower light-transmitting plate 5 and the upper light-transmitting plate 7 which are prepared in advance. The body A is disposed on the upper end surface of the ridge 23 so that the peripheral edge thereof is placed. Then, the overflowing transparent resin 4 ′ oozes out between the upper end surface of the protruding portion 23 and the lower surface of the laminate A, and functions as an adhesive that bonds the base 2 and the laminate A together.

  Here, the laminate A in which the wavelength conversion member 6 is sandwiched together with the spacer S between the lower light-transmitting plate 5 and the upper light-transmitting plate 7 is prepared in advance as described above. It is manufactured as follows.

  First, a large number of through holes S1 having a size corresponding to a plurality of spacers S are provided on a large filter having a size corresponding to a plurality of lower light-transmitting plates 5 (or upper light-transmitting plates 7). The stacked metal plates are stacked (FIG. 8A). Here, the spacer S is laminated so that the upper end surface of the base 2 and the upper surface of the upper light-transmitting plate 7 are substantially flush with each other when the laminate A is disposed on the upper end surface of the ridge 23. The height of the body A is adjusted.

  Next, a predetermined amount of the resin composition 6 containing the phosphor 61 is filled into the through-hole S1 (FIGS. 8B to 8C).

  Thereafter, a large filter having a size corresponding to a plurality of upper light-transmitting plates 7 (or lower light-transmitting plates 5) is placed on the spacer S in an overlapping manner (FIG. 9D).

  And the laminated body A by which the wavelength conversion member 6 is pinched | interposed between the lower translucent board 5 and the upper translucent board 7 with the spacer S by hardening the resin composition 6 by heating etc. as needed. It is possible to form a laminated body in which a plurality of layers are integrated (FIG. 9E).

  A plurality of laminates A can be produced at a time by cutting the laminate in which the laminates A thus obtained are united and separating them one by one (FIG. 9 (f). )).

  According to the light emitting device 1 according to this embodiment, since the concave groove 81 that functions as a heat blocking portion is formed on the bottom surface of the concave portion of the base 2, the heat generated from the LED element 3 and the wavelength conversion member The heat generated from 6 does not mix in the substrate 2, and each heat can be managed separately. For this reason, in order to discharge | release the heat | fever emitted from the LED element 3, the magnitude | size of the radiation fin 9a provided in the downward direction of the LED element 3, and the peripheral part of the bottom face of the base | substrate 2 in order to discharge | release the heat | fever emitted from the wavelength conversion member 6 The size of the radiating fins 9b provided in can be determined appropriately in accordance with the amount of heat emitted from the LED element 3 and the amount of heat emitted from the wavelength conversion member 6.

Second Embodiment
A second embodiment of the present invention will be described below with reference to the drawings. In the following, description will be made centering on differences from the first embodiment.

  As shown in FIGS. 10 to 12, the light-emitting device 1 according to this embodiment includes an LED element 3 mounted on a substrate 8, a sealing member 4 that seals the LED element 3, and an upper side of the sealing member 4. The LED element 3 is attached to the main substrate (lower base) 2A, and the sealing member 4 and the wavelength conversion member 6 stand on the main substrate 2A. Are accommodated and held in a frame body (upper substrate) 2B.

  The main substrate 2A is made of a material having high thermal conductivity such as aluminum, copper, alumina, aluminum nitride, or the like. The main board 2A is formed with a recess that fits with the board 8, whereby the board 8 is positioned.

  The main board 2A is provided with heat radiating fins 9 depending from the lower surface thereof. The heat radiating fin 9 has a heat radiating fin 9a provided below the LED element 3 to release heat generated from the LED element 3, and a frame for releasing heat generated from the wavelength conversion member 6 through the frame 2B. It consists of the radiation fin 9b provided under the side wall of the body 2B.

  The main substrate 2A is further formed with an annular through-hole 81 so as to surround the LED element 3, and the through-hole 81 generates heat from the LED element 3 in the main substrate 2A and the wavelength conversion member 6. It functions to block the heat that is emitted and transmitted through the frame 2B. In addition, a connecting portion for connecting the inner peripheral side and the outer peripheral side sandwiching the annular through hole 81 is partially provided so that the inner side and the outer side of the main substrate 2A are not separated by the annular through hole 81. Yes.

  The frame 2B has a cylindrical shape, and is made of a metal having a high thermal conductivity such as copper or aluminum. The frame body 2 </ b> B is formed with an annular pressing portion 23 that protrudes from the inner peripheral surface of the side wall, and the laminated body A is placed on the upper end surface of the pressing portion 23. Further, the pressing portion 23 is provided with a through hole 21 penetrating between the inner peripheral surface and the outer peripheral surface of the frame 2B.

  An O-ring R is disposed between the substrate 8 and the pressing portion 23 of the frame 2B. With the O-ring R, the space in the frame 2B is the center side (LED element 3 side) space SP1 and the outer periphery. The space SP2 on the side (the lower peripheral edge side of the frame 2B) is partitioned, the space SP1 on the center side is filled with a transparent resin 4 'to form a sealing member 4, and a transparent resin is formed on the outer peripheral side. A space SP2 into which 4 ′ does not flow is formed.

  On the upper surface of the main substrate 2A and the inner peripheral surface of the frame body 2B, a metal thin film with high reflectivity is formed by applying metal plating such as silver, aluminum, gold, etc., and functions as a reflector. .

  Next, a method for manufacturing the light emitting device 1 according to the present embodiment will be described with reference to FIGS.

  First, the laminated body A formed by sandwiching the wavelength conversion member 6 together with the spacer S between the lower light-transmitting plate 5 and the upper light-transmitting plate 7 is formed on the upper end surface of the pressing portion 23 (in FIG. 13). It arrange | positions so that it may closely_contact | adhere to a lower end surface) and the inner peripheral surface of the frame 2B. The laminate A and the frame 2B are bonded with a silicone resin adhesive. Further, an O-ring R is installed in a recess 231 formed on the lower end surface (the upper end surface in FIG. 13) of the pressing portion 23. And transparent resin 4 'of the quantity which does not flow out over O-ring R is inject | poured on the laminated body A (lower translucent board 5) (FIGS. 13 (a)-(b)).

  Next, before the transparent resin 4 ′ is cured, the main board 2 </ b> A provided with the LED elements 3 and the heat radiating fins 9 is placed on the frame 2 </ b> B so that the LED elements 3 face downward ( FIG. 14 (c)). At this time, the O-ring R and the transparent resin 4 ′ are pressed by the substrate 8, and excess transparent resin 4 ′ flows into the through hole 21. As described above, when the main board 2A is provided on the frame body 2B on which the O-ring R is installed, the center-side space SP1 filled with the transparent resin 4 'and separated from each other by the O-ring R, and the transparent resin 4 An outer peripheral side space SP2 into which 'does not flow is formed. Then, if necessary, the transparent resin 4 ′ is cured by heating or the like, whereby the sealing member 4 is formed in the center side space SP1, and the light emitting device 1 in which the frame 2B and the main substrate 2A are integrated. Is completed (FIG. 14D). In the obtained light emitting device 1, the transparent resin 4 'is not interposed between the side wall of the frame 2B and the main substrate 2A, and a screw or a screw is not provided between the side wall of the frame 2B and the main substrate 2A. You may join by solder paste etc.

  According to the light emitting device 1 according to this embodiment, since the transparent resin 4 ′ does not flow into the outer space SP2 partitioned by the O-ring R, the side wall of the frame 2B, the main substrate 2A, The transparent resin 4 'is not interposed between them. For this reason, the heat emitted from the wavelength conversion member 6 and transmitted through the frame 2B is efficiently transmitted to the main substrate 2A without being blocked by the transparent resin 4 ′.

  Further, according to the light emitting device 1 according to the present embodiment, since the through hole 81 functioning as a heat blocking portion is formed in the main substrate 2A, the heat generated from the LED element 3 and the wavelength conversion member 6 The heat transmitted through the frame 2B does not mix in the main board 2A, and each heat can be managed separately. For this reason, in order to discharge | release the heat | fever emitted from the LED element 3 in order to discharge | release the magnitude | size of the radiation fin 9a provided in the downward direction of the LED element 3, and the heat | fever emitted from the wavelength conversion member 6 through the frame 2B, it is a frame. The size of the radiation fins 9b provided below the body 2B can be appropriately determined according to the amount of heat emitted from the LED element 3 and the amount of heat emitted from the wavelength conversion member 6.

  The present invention is not limited to the above embodiment.

  For example, the wavelength conversion member 6 may not be formed as the laminated body A by being sandwiched between the lower light-transmitting plate 5 and the upper light-transmitting plate 7 together with the spacer S, for example, the lower light-transmitting plate 5 and the spacer S. The wavelength conversion member 6 may be formed by using a technique such as potting using the upper light-transmitting plate 7 as a substrate.

  Moreover, when manufacturing the light-emitting device 1 which concerns on 1st Embodiment, you may make it as follows. That is, first, as shown in FIGS. 15A to 15B, an appropriate amount of transparent resin 4 ′ is filled in the concave portion of the base 2 and cured to form the sealing member 4. As shown in FIGS. 16C to 16D, after the transparent resin 4 ′ is stacked on the lower light-transmitting plate 5 side of the laminated body A, as shown in FIGS. With the optical plate 5 side facing the sealing member 4, the laminate A is disposed so that the peripheral edge portion is placed on the upper end surface of the protrusion 23. Then, the laminate A and the sealing member 4 are bonded, and the overflowing transparent resin 4 ′ oozes out between the upper end surface of the protrusion 23 and the lower surface of the laminate A, and the substrate 2 and the laminate 2 are laminated. It functions as an adhesive that bonds the body A.

  Furthermore, when manufacturing the light emitting device 1 according to the second embodiment, the wavelength conversion member 6 is sandwiched together with the spacer S between the lower light transmission plate 5 and the upper light transmission plate 7 as shown in FIG. The laminated body A and the main substrate 2A provided with the LED element 3 and the heat radiating fins 9 are previously fixed to the frame body 2B (FIG. 18A), and then formed in the frame body 2B. The central space SP1 may be filled with a transparent resin 4 ′ through a nozzle inserted into the through hole 21 (FIGS. 18B to 18C).

  Moreover, also in the light emitting device 1 according to the first embodiment, as in the light emitting device 1 according to the second embodiment, a through-hole penetrating between the inner peripheral surface and the outer peripheral surface of the base 2 in the protruding portion 23. 21 may be provided, and the concave groove 81 formed on the bottom surface of the substrate 2 may be a through hole. In addition, when the through-hole 21 is provided in the light-emitting device 1 which concerns on 1st Embodiment, when manufacturing the light-emitting device 1 which concerns on 1st Embodiment, in 2nd Embodiment shown by FIG. The manufacturing method of the light-emitting device 1 which concerns can be applied.

  Further, in the light emitting device 1 according to the present invention, for example, as shown in FIG. 19, a lens 10 may be disposed on the upper end surface of the light emitting device 1. At this time, it is preferable that an antireflection coating is applied to the light exit surface of the lens 10 in order to improve the light extraction efficiency.

  Further, in the light emitting device 1 according to the present invention, the heat generated from the LED element 3 and the heat generated from the wavelength conversion member 6 may be blocked by some means, and heat such as a concave groove or a through hole may be generated. In addition to the heat blocking by the space provided to prevent the diffusion, for example, as shown in FIG. 20, the heat blocking member 81 ′ may be disposed between the main board 2A and the frame body 2B to block the heat. Good.

  Furthermore, only the radiation fin 9a for releasing the heat emitted from the LED element 3 is provided on the bottom surface of the light emitting device 1, and the radiation fin 9b for radiating the heat emitted from the wavelength conversion member 6 is provided on the side surface of the frame 2B. It may be formed separately.

  In the light emitting device 1 of the embodiment shown in FIG. 20, the inner peripheral surface of the frame 2 </ b> B and the inner peripheral surface of the spacer S are continuous to form an inclined surface that expands toward the light emission direction. . At this time, a metal thin film is provided on the inner peripheral surface of the frame 2B, while the spacer S is made of metal, white resin, or the like, and the inclined surface functions as a reflector, thereby extracting light from the light emitting device 1. Efficiency can be improved.

  Furthermore, the light-emitting device 1 itself according to the present invention may be provided on the bottom surface of the light-emitting device 1 without providing the heat-radiating fins 9, and the heat-radiating fins 9 formed separately. Further, a fan may be installed so that air can be sent toward the heat radiating fins 9 and air cooling can be performed more efficiently.

  The light emitting device 1 according to the present invention can be used as a light source of a lighting device 10 having a dimming function. And as such an illuminating device 10, as shown in FIG. 21, in addition to the light-emitting device 1, the thing provided with the power supply 12, current adjustment circuit 14A, 14B, and the control apparatus 15 is mentioned. Here, the light emitting device 1 according to the present embodiment emits white light, and the LED element 3 is the same product (for example, an LED element having an emission peak of 405 nm), but is selected from the same product. 2 of the 1st LED element 3A (for example, the thing whose radiation peak distributes to 395-400 nm) and the 2nd LED element 3B (for example, the thing whose radiation peak is distributed to 410-415 nm) from which the variation of the produced radiation peak differs Groups are used.

  The power supply 12 has a voltage larger than the voltage drop of the LED elements 3A and 3B.

The current adjustment circuits 14A and 14B are formed using, for example, a transistor, a CMOS, a dedicated chip, and the like, and the LED elements with currents I ₁ and I ₂ corresponding to the value of the control signal generated from the current control unit 153 3A and 3B are driven to adjust the amounts and ratios of the currents I ₁ and I ₂ .

  The control device 15 is configured by a digital or analog electric circuit having a CPU, a memory, an A / D converter, a D / A converter, and the like, and may be dedicated or partly or wholly. Alternatively, a general-purpose computer such as a personal computer may be used. Further, it may be configured such that the functions of the respective units are achieved by using only an analog circuit without using a CPU, and need not be physically integrated, but includes a plurality of devices connected to each other by wire or wirelessly. It may be a thing. A predetermined program is stored in the memory, and the CPU and its peripheral devices are cooperatively operated according to the program, thereby at least functioning as the color temperature receiving unit 151, the light amount receiving unit 152, and the current control unit 153. It is comprised so that it may do.

  The color temperature reception unit 151 includes, for example, a dial, and receives color temperature data having a color temperature value selected between 2800 to 3200K by turning the dial.

  The light quantity receiving unit 152 includes, for example, a dial and receives light quantity data having a light quantity value (brightness) selected by turning the dial.

The current control unit 153 acquires the color temperature data from the color temperature reception unit 151 and the light amount data from the light amount reception unit 152, generates a control signal based on the color temperature data and the light amount data, and generates the control signal. each current adjusting circuit 14A, is to adjust the current _I 1, _{I 2} are output to 14B.

  The illuminating device 10 thus configured has a predetermined value for the color temperature of the white light emitted from the illuminating device 10 even if the LED elements 3A and 3B attached to the light emitting device 1 have variations in luminescent color. Can be fine-tuned. For this reason, since it can be finely adjusted so that white light having the same color temperature is emitted from any of the plurality of lighting devices 10, it is required to emit white light having a uniform color temperature from a large number of lighting devices 10. It can be suitably used for the intended use.

  In the present embodiment, LED elements 3A and 3B of the same product having variations in the radiation peak are mounted on the same substrate 8, but the LED element 2 group composed of two or more different products is the same. It may be mounted on the substrate 8.

  Moreover, you may comprise the light bulb 100 using the light-emitting device 1 which concerns on this invention. As such a light bulb, the thing of embodiment as shown in FIGS. 22-24 is mentioned, for example.

  The light bulb 100 according to the embodiment has a substantially rotating body shape, and controls the first casing 22 formed by a diffusing member that diffuses light, the light emitting device 1, the voltage supplied to the light emitting device 1, and the like. A second housing 24 in which an air suction port 26a and an air discharge port 26b are formed, and a fan 26 that forcibly generates an air flow from the air suction port 26a to the air discharge port 26b. And.

  In the light emitting device 1 according to the present embodiment, the upper base 2B in which the heat radiating fins 9b for releasing the heat generated from the wavelength conversion member 6 are formed on the side surfaces, and the heat radiating fins 9a for releasing the heat generated from the LED elements 3 in the side surfaces. The lower base 2A formed in the above is fixed to each other by a screw B with a heat insulating member 81 'interposed therebetween.

  In the light emitting device 1 according to such an embodiment, when the ratio between the heat generated from the wavelength conversion member 6 and the heat generated from the LED element 3 is changed, the radiation fins 9b for the wavelength conversion member 6 and the LED element 3 are changed. By appropriately changing the surface area with the heat radiation fins 9a, the heat radiation ratio can be adjusted to an optimum one.

  In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Light-emitting device 2 ... Base | substrate 3 ... LED element 4 ... Sealing member 6 ... Wavelength conversion member 8 ... Board | substrate R ... O-ring (elastic deformation member)
SP1 ... center side space SP2 ... outer peripheral side space

Claims (7)

A base body having a recess opening in the upper end surface;
LED elements attached in the recesses of the substrate;
A sealing member made of a translucent material for sealing the LED element;
A wavelength conversion member containing a phosphor provided above the sealing member,
The LED light-emitting device, wherein the base is formed with a heat blocking portion that blocks heat generated from the LED element and heat generated from the wavelength conversion member. An annular heat insulating member provided so as to surround the sealing member;
The base is composed of a lower base to which an LED element is attached and a cylindrical upper base provided on the lower base and supporting the wavelength conversion member,
The upper base is provided to protrude from the inner peripheral surface of the side wall, and has an annular pressing portion that presses the heat insulating member toward the lower base;
The space closed by the lower base, the wavelength conversion member, and the upper base flows into the space in which the sealing member is formed by the heat insulating member and the translucent material formed on the outer peripheral side thereof. The LED light-emitting device according to claim 1, wherein the LED light-emitting device is partitioned liquid-tightly from a space that is not formed.   The LED light-emitting device according to claim 1, wherein the heat insulating member is an elastically deformable member.   On the surface of the lower base opposite to the surface on which the LED element is mounted, the LED element heat dissipating fin provided on the inner side of the position where the heat blocking section is formed, and the heat blocking section are formed. The LED light-emitting device according to claim 1, wherein a radiation fin for a wavelength conversion member provided outside the position is disposed.   The LED light-emitting device according to claim 1, 2 or 3, wherein the lower base and the upper base are joined together by screws or solder paste. A plurality of LED elements each belonging to a plurality of LED element groups having different distribution wavelength regions of radiation peaks selected from a set of identical products having variations in radiation peaks between individual products, LED light-emitting device according to 3, 4 or 5;
And a current control unit that changes a current value supplied to each of the plurality of LED elements.   The lighting device according to claim 6, wherein LED elements belonging to the different LED element groups are alternately arranged on the base.