JP2013030401A - Light-emitting device and lighting device - Google Patents

Abstract

A light-emitting device and a lighting device using a ceramic substrate that can be miniaturized are provided.
A light emitting device includes a main body, a ceramic substrate, and a translucent cover member. The main body 11 is made of a heat conductive member. The ceramic substrate 13 is provided with the solid light emitting element 12 on one side and the other side on the main body. The translucent cover member 14 has a support portion 14a in contact with one surface side of the substrate on the inner surface, and is attached to the main body so as to cover the substrate, thereby supporting the substrate on the main body by the support portion.
[Selection] Figure 1

Description

  Embodiments described herein relate generally to a light emitting device and an illumination device that use a solid light emitting element such as a light emitting diode as a light source.

  In recent years, light-emitting devices using light-emitting diodes (hereinafter referred to as “LEDs”) have been used as light sources for various lighting fixtures such as bulb-type LED lamps, downlights, spotlights, etc. Widespread use as a light source for televisions, liquid crystal displays, mobile phones, backlights of various information terminals, and indoor and outdoor billboard advertisements. In addition, its long life, low power consumption, impact resistance, high-speed response, high purity display color, lightness, thinness, and the like can be realized, so that it has been applied not only for general lighting but also in various industrial fields.

JP 2009-152142 A JP 2011-082141 A

  On the other hand, in these light emitting devices, the LEDs are required to have higher output in order to ensure sufficient brightness of the lighting device. For this reason, the heat radiation performance is further improved by using ceramics having good thermal conductivity for the substrate to be mounted so that the luminous efficiency is not lowered due to the temperature rise of the LED.

  On the other hand, a ceramic substrate is weaker than a resin substrate or a metal substrate and has a property of being easily cracked. If a strong torque such as a screw is applied, the substrate may be broken. For this reason, the attachment of the board on which the LED is mounted to the main body is not directly fixed by screws, but is fixed by a metal spring member fixed to the main body by screws.

  For this reason, the spring member must be fixed to the main body with a screw, and a space for receiving the screw in the main body is required. In addition, the height of the main body cannot be reduced due to the height of the screw. Furthermore, a space corresponding to the area of the screw and the spring member must be provided in the main body, and these factors are obstacles for realizing the miniaturization of the light emitting device.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device and a lighting device using a ceramic substrate capable of achieving downsizing.

  The light-emitting device in the embodiment of the present invention includes a main body, a ceramic substrate, and a translucent cover member. The main body is made of a heat conductive member. The ceramic substrate has a solid light emitting element disposed on one side and the other side disposed on the main body. The translucent cover member has a support portion on the inner surface that abuts on one side of the substrate, and is attached to the main body so as to cover the substrate, thereby supporting the substrate on the main body by the support portion.

  According to the embodiment of the present invention, it is possible to provide a light emitting device and a lighting device using a ceramic substrate capable of achieving miniaturization.

The perspective view which decomposes | disassembles and shows the light-emitting device which is embodiment of this invention. The perspective view shown in the state which assembled the light-emitting device similarly. The cross-sectional perspective view which follows FIG. 2A-A which similarly shows a light-emitting device. The perspective view which decomposes | disassembles and shows the illuminating device similarly using the light-emitting device. The perspective view similarly shown in the state which assembled the illuminating device using a light-emitting device. The lighting device for signboards using the light emitting device is also shown, (a) is a front view showing a part cut away, (b) is a front view showing a state in which 16 light emitting devices are connected, and (c) is 4 in the same manner. The front view which shows the state connected individually, (d) is a front view which shows one light-emitting device. The cross-sectional perspective view equivalent to FIG. 3 which similarly shows the modification of a light-emitting device.

  Hereinafter, embodiments of the light emitting device and the illumination device of the present invention will be described.

  The light-emitting device of this embodiment is a small waterproof light-emitting device used for a sign lighting device. As shown in FIGS. 1 to 3, the light-emitting device 10 is a main body made of a heat conductive member. 11. A solid-state light emitting element 12 is disposed on one surface side, a ceramic substrate 13 disposed on the main body 11 on the other surface side, a support portion 14a in contact with one surface side of the substrate 13 on the inner surface, By being attached to the main body 11 so as to cover, the substrate 13 is constituted by the translucent cover member 14 that supports the main body 11 by the support portion 14a.

  The main body 11 is made of a metal such as aluminum, copper, or iron, or a member having good thermal conductivity such as ceramics. In this embodiment, the main body 11 is made of aluminum die casting. The main body 11 is configured in a relatively thick disk shape, and a circular substrate support portion 11a having an outer diameter smaller than the outer diameter of the main body 11 is provided on one surface side (upper surface in FIG. 1) of the disk. The main body 11 is formed by concentrically projecting integrally. Further, a stepped portion is formed by the outer side surface of the circular substrate support portion 11a and the outer peripheral surface portion on the one surface side of the main body 11, and a seal receiving portion 11b for receiving a seal member 15 described later is integrally formed.

  On the surface of the circular substrate support portion 11a, a shallow concave fitting portion 11a1 having a substantially square shape for arranging, supporting and providing a ceramic substrate 13 described later is dug and formed integrally. The bottom surface of the recessed fitting portion 11a1 is formed to have a smooth planar shape so that the other surface side of the substrate 13 is closely supported. Further, the other surface side surface of the main body 11 is also formed to have a smooth flat shape, and is configured such that a separate heat radiating member and a heat radiating mechanism, which will be described later, are in close contact and appropriately supported.

  As described above, the main body 11 of the light emitting device 10 according to the present embodiment is configured to be appropriately supported by closely attaching a separate heat radiating member or heat radiating mechanism, and thus has various heat radiating members or heat radiating mechanisms. be able to. Furthermore, it is possible to attach a common heat radiating member and heat radiating mechanism to a plurality of light emitting devices, and it is possible to provide a light emitting device with excellent versatility.

  Incidentally, if the main body has a heat sink function, restrictions are imposed on the main body itself, and what can be attached is limited. On the other hand, in the present embodiment, it is possible to eliminate restrictions on the mounting surface by providing a heat dissipating member and a heat dissipating mechanism that are separate from the main body.

  Further, a pair of mounting pieces 11c are integrally formed on the outer peripheral surface of the disk-shaped main body 11 so as to oppose each other in the radial direction, and a member for locking and mounting a cover member 14 to be described later to the main body 11. Stop part 11d is formed in one. The engaging portion 11d has a pair of guide portions 11d1 and 11d1 formed integrally on the outer peripheral surface so as to form a convex shape, and an engaging claw 11d2 formed integrally protruding at a substantially middle portion of the pair of guide portions. Consists of.

  Four locking portions 11d configured as described above are formed at substantially equal intervals with an angle of 90 ° with respect to the outer peripheral surface of the main body 11 forming a disc. In addition, the latching claw 11d2 is formed to have a claw 11d3 that is tilted so as to gradually spread downward in FIG. In FIG. 1, 11e is an electric wire insertion hole formed penetrating from the other surface side of the main body 11 to the one surface side, and an elastic body 11e1 made of a silicone resin for electric wire insertion is fitted from the other surface side of the main body 11. Then, the two electric wires w1 and w1 connected to the lighting device are drawn in an airtight state from the other surface side of the main body 11 toward the one surface side.

  As shown in FIG. 1, the solid light emitting element 12 constitutes a light emitting module having a planar light emitting surface together with a substrate 13 on which the solid light emitting element is mounted. In the present embodiment, the solid state light emitting device 12 is configured by a light emitting diode (hereinafter referred to as “LED”). In the present embodiment, it is composed of a large number of blue LED chips 12 having a high luminance and a high output that are necessary as a light source for a signboard illumination device.

  Each blue LED chip 12 is mounted on one side of a flat substrate 13 and further provided with a yellow phosphor to form a substantially square COB (Chip on Board) type light emitting module that emits white light. Configure. And while transmitting the blue light radiated | emitted from the blue LED chip | tip 12, it excites a yellow fluorescent substance with blue light, it converts into yellow light, the blue light and yellow light which permeate | transmitted mixed, and white (day white, (Including daylight color, light bulb color, etc.). The light emitting module may be an SMD (Surface Mount Device) type.

  The substrate 13 is made of, for example, a white, substantially square-shaped ceramic such as aluminum oxide or aluminum nitride. A wiring pattern is formed on one side, and the COB type LED 12 is mounted on a substantially central portion thereof. A light emitting unit is configured.

  The substrate 13 is formed in a thin, substantially square shape that is substantially the same as or slightly smaller than the shallow concave fitting portion 11a1 that forms the approximately square shape of the substrate support portion 11a in the main body 11. Thereby, the board | substrate 13 is positioned in the state substantially matched without being rattled by being disposed and provided in the recessed fitting portion 11a1. At the same time, the entire circumference of the side surface of the substrate 13 can be provided in close contact with the inner peripheral surface of the recessed fitting portion 11a1, and the other surface side of the substrate 13 can be provided in close contact with the bottom surface of the recessed fitting portion 11a1 formed of a smooth flat surface. become. In FIG. 1, 13a is a connector for supplying power to the LED 12, and the above-described electric wires w1 and w1 are connected to the input terminal, the input terminal of the LED 12 is connected to the output terminal, and a separate lighting device (not shown) ) Is supplied to the LED 12 and controlled to be lit.

  The cover member 14 has a support portion 14a that abuts on one surface side of the ceramic substrate 13 on the inner surface, and is locked and attached to the main body 11 so as to cover the substrate 13, whereby the substrate 13 is attached to the main body by the support portion 14a. In this embodiment, it is made of a transparent polycarbonate resin so as to transmit light emitted from the LED 12, and is shallow with one end closed and the other end 14b. It is integrally formed by resin molding into a circular cap shape.

  The cover member 14 is configured such that the diameter of the cover member 14 having a circular cap shape is substantially the same as the diameter of the main body 11 made of a disk so that the cover member 14 can be covered. On the inner surface of the closed one end portion, a support portion 14a that comes into contact with one surface side of the substrate 13 is integrally formed. The support portion 14a is integrally formed so as to protrude downward from the inner surface of the cover member 14 so as to form a convex shape.

  Four support portions 14 a are formed at substantially equal intervals with an angle of 90 ° with respect to the inner surface of the cover member 14 having a circular cap shape, and the cover member 14 is put on the main body 11 and joined. Each of the support portions 14a is configured such that the respective support portions come into contact with the one surface side of the substrate 13, that is, the four corners of the ceramic substrate 13 having a substantially square shape, from above (FIG. 3). ).

  In addition, when the cover member 14 is put on the main body 11 and connected, the projecting dimension h1 directed downward from the support portion 14a is provided in the concave fitting portion 11a1 of the substrate support portion 11a in the main body 11. The ceramic substrate 13 is pressed with an appropriate force (a force that does not cause a crack or the like in the ceramic substrate) with the other side of the substrate 13 facing the smooth bottom surface of the recessed fitting portion 11a1 from the four corners. The dimensions are such that they can be supported. In other words, the ceramic substrate 13 that is liable to crack or the like is fixed and supported on the main body 11 without using fixing means such as screws and spring members that hinder downsizing of the light emitting device as in the prior art. Configure to be able to.

  As described above, the structure of the support portion 14a for supporting the ceramic substrate 13 on the main body 11 can be simplified by being formed integrally with the cover member 14 made of synthetic resin. At the same time, there is no need to use screws or spring members as in the past, so there is no need to provide space for the area of the screws and spring members in the main body, and the entire light emitting device can be made thinner and smaller. become. In addition, simultaneously with the process of covering the cover member 14 with the main body 11 and bonding, the ceramic substrate 13 can be supported with respect to the main body 11, thereby improving workability during assembly and suppressing an increase in cost. It becomes possible.

  Further, a locking piece 14 c for locking the cover member 14 to the main body 11 for coupling and attachment is formed on the outer surface forming the circumference of the cover member 14. The locking piece 14c protrudes downward from the outer surface so as to form a protruding piece and is integrally formed, and a rectangular locking hole 14c1 penetrating through the substantially central portion of the protruding piece is formed.

  Four locking pieces 14c configured as described above are formed at substantially equal intervals with an angle of 90 ° with respect to the outer surface of the cover member 14 having a circular cap shape. As a result, as shown in FIG. 3, the locking piece 14 c of the cover member 14 and the locking portion 11 d of the main body 11 are formed at corresponding positions. The protruding piece-like locking piece 14 c of the member 14 is fitted while being guided with respect to the guide portion 11 d 1 of the locking portion 11 d of the main body 11.

  At this time, the locking piece 14c of the cover member 14 bends outward due to the elasticity of the resin, and the locking hole 14c1 is fitted into the locking claw 11d2 of the locking portion 11d of the main body 11 and locked. Thereby, it is possible to eliminate or reduce fastening parts (screws or the like) in the coupling configuration of the main body 11 and the cover member 14, and it is possible to improve workability at the time of assembly and suppress an increase in cost.

  Further, as described above, with the cover member 14 locked and attached to the main body 11, as shown in FIG. 3, the inner surface of the cover member 14 has a seal receiving portion formed of a step portion formed on the main body 11. The portion 11b is disposed with a predetermined interval t1. The seal member 15 is accommodated in the interval t1.

  The seal member 15 is interposed in the interval t1 formed between the seal receiving portion 11b formed in the main body 11 and the inner side surface of the cover member 14, so that the inside of the cover member 14, that is, the LED 12 and the substrate 13 is removed. In this embodiment, the light emitting part is sealed with an elastic O-ring made of silicone rubber (hereinafter referred to as “packing” in this embodiment). ").

  The inner diameter of the ring of the packing 15 is formed to be equal to or smaller than the outer peripheral dimension of the side surface of the stepped portion of the main body 11, that is, the seal receiving portion 11b. The outer diameter of the ring of the packing 15 is equal to or larger than the inner diameter dimension of the cover member 14, in other words, the thickness dimension of the packing 15 is equal to or larger than the interval dimension t1.

  Thus, by covering the cover member 14 over the main body 11 and joining, the packing 15 is formed between the inner surface of the cover member 14 and the seal receiving portion 11b formed of a stepped portion of the main body 11 in FIG. A waterproof function that prevents the intrusion of rainwater or the like even when used outdoors when the light emitting part composed of the LED 12 and the substrate 13 is kept airtight in the cover member 14, that is, compressed in the direction. A light emitting device having the same is configured.

  At this time, the compression direction (a direction) of the packing 15 and the direction (the b direction in FIG. 3) in which the support portion 14a of the cover member 14 presses and supports the substrate 13 are substantially orthogonal to each other. However, the support portion 14a does not affect the pressing force of the substrate 13, and the support portion 14a allows the substrate 13 to be securely attached to and supported by the main body 11. At the same time, no extra force is applied to the ceramic substrate 13.

  Incidentally, when the packing 15 is compressed in the vertical direction, that is, in the b direction, the repulsive force of the packing 15 acts in a direction to lift the cover member 14 from the main body 11, so that the substrate 13 is supported by the substrate support portion of the main body 11. 11a cannot be pressed, the adhesion between the substrate 13 and the main body 11 is deteriorated, the thermal conductivity between the substrate 13 and the main body 11 is lowered, and the heat of the substrate 13 is radiated from the main body 11 well. There is a risk that it will not be possible.

  The electric wires w1, w1 are electric wires for supplying the output of a separate lighting device to the LED 12 constituting the light emitting unit, and are constituted by two-core covered electric wires, one on the + side and one on the negative side. The body 11e1 is inserted in an airtight state in advance, and the elastic body 11e1 is pushed into the electric wire insertion portion 11e of the main body 11 from the state of FIG. . And the front-end | tip which peeled off the coating | cover of the electric wires w1 and w1 is inserted in the input terminal of the connector 13a provided in the board | substrate 13, and is connected. Further, as the electric wire, when a plurality of light emitting devices 10 are connected and used, a feeding electric wire is separately used.

  Next, an assembly procedure of the light emitting device 10 configured as described above will be described. First, by preparing a ceramic substrate 13 on which the LED 12 is mounted and the connector 13a is previously installed, the other surface side is disposed and provided in the recessed fitting portion 11a1 of the substrate support portion 11a on the one surface side of the main body 11. Perform positioning.

  Next, the elastic body 11e1 through which the electric wires w1, w1 are inserted is pushed into the electric wire insertion portion 11e from the other surface side of the main body 11, and the tips of the electric wires w1, w1 are connected to the connector 13a. Next, the packing 15 made of an O-ring is fitted into the seal receiving portion 11 b of the main body 11.

  Next, the cover member 14 is moved downward with respect to the main body 11 assembled as described above so as to cover the substrate 13 provided on the main body 11. Then, the four locking pieces 14c of the cover member 14 are fitted while the guide portions 11d1 of the main body 11 are used as guides.

  In this state, the cover member 14 is further moved downward while resisting the elastic force of the packing 15. As a result, the locking hole 14c1 is locked to the locking claw 11d2 of the main body 11 while the locking piece 14c of the cover member 14 rides on the inclined surface of the locking claw 11d2 of the main body 11 and bends outward due to the elasticity of the resin. And the bending of the locking piece 14c is restored and locked by the claw 11d3.

  In this way, by covering the cover member 14 with the main body 11 and joining them, the front end portions of the support portions 14a of the cover member 14 are on one side of the substrate 13, that is, the corners of the four corners of the ceramic substrate 13 forming a substantially square shape. Each support part 14a contacts the part from above.

  Then, the ceramic substrate 13 disposed and provided in the recessed fitting portion 11a1 of the substrate supporting portion 11a in the main body 11 is made even from the four corners and the other surface side of the substrate 13 is smoothed by the recessed fitting portion 11a1. It can be supported by pressing toward the bottom with an appropriate force.

  At the same time, the packing 15 is accommodated in a compressed state within the interval t1 between the seal receiving portion 11b of the main body and the inner surface of the cover member 14, and airtightness between the cover member 14 and the main body 11 is ensured (see FIG. 3).

  In addition, when removing the cover member 14 from the main body 11, the locking piece 14c of the cover member 14 is bent outside against the elasticity of the resin by a fingertip or a tool. Thereby, the latching state of the latching hole 14c1 and the latching claw 11d2 is cancelled | released, and it can remove easily.

  This completes the assembly work. In this assembling operation, there is no need for a resin filling operation for supporting a package or the like on which an LED is mounted and a hardening or drying process after the filling, and the work efficiency is not lowered. Can solve the problem of rising. In addition, each component in the present embodiment has a simple configuration capable of integral molding of synthetic resin, assembly work can be performed with simple work, work efficiency can be further improved, and mass production is possible. A light emitting device suitable for the above can be provided.

  In addition, the ceramic substrate 13 is simply formed by the four support portions 14a formed on the inner surface of the cover member 14 by an operation process in which the cover member 14 is covered and joined so as to cover the substrate 13 from the upper side of the main body 11. The four corners of the main body 11 are pressed against and supported by the substrate support portion 11a of the main body 11, and the packing 15 is compressed to ensure airtightness. Further, the cover member 14 is locked to the main body 11 and coupled. can do.

  In other words, the cover member 14 has a function of pressing and supporting the substrate 13, a function of pressing and compressing the packing 15, and a function of attaching and attaching to the main body 11, and all these configurations are configured without screws. Thus, it is possible to provide a light emitting device that can achieve downsizing and that has a simplified configuration and a simplified assembly process.

  As described above, the airtightness between the main body 11 and the cover member 14 and the airtightness in the electric wire insertion portion 11e are ensured, and the airtightness of the light emitting portion against the outside air, that is, an LED having functions such as waterproof and dustproof with a simple configuration. The light emitting device 10 is configured using the light source as a light source. Further, the light emitting device 10 of the present embodiment is configured such that a separate heat radiating member or heat radiating mechanism can be attached to the smooth other side of the main body 11 as appropriate. In addition, the light-emitting device 10 in this embodiment is configured as a light-emitting device that achieves downsizing with an outer diameter of about 53 mm and a height of about 16 mm.

  Next, a configuration of a lighting device using the light emitting device configured as described above will be described. As shown in FIGS. 4 and 5, the illuminating device of the present embodiment constitutes a waterproof illuminating device 20 used outdoors. In addition to the light emitting device 10 described above and the main body 11 in the light emitting device 10, It is comprised by the heat radiating member 21 comprised separately from the main body 11 arrange | positioned thermally coupled by the surface side, and the lighting device (illustration omitted) which lights the light-emitting device 10. FIG.

  The heat dissipating member 21 is configured separately from the main body 11 of the light emitting device 10, and is composed of a metal such as aluminum, copper, or iron, in this embodiment, aluminum die-casting, and is slightly thick and substantially oval. The substrate portion 21a has a flat plate shape and a large number of plate-like heat radiation fins 21b integrally formed so as to stand upright from the other surface side of the substrate portion. One surface side of the substrate portion 21a is formed to have a smooth planar shape.

  And as shown in FIG. 5, the other surface side which consists of the smooth surface of the main body 11 of the light-emitting device 10 is mounted in the smooth one surface side of the thermal radiation member 21, and the attachment pieces 11c and 11c provided in the main body 11 are attached. It is fixed to the heat radiating member 21 with screws S1 and S1. Thereby, the illuminating device 20 in which the main body 11 of the light emitting device 10 is supported in close contact with the heat radiating member 21 is configured. The lighting device is configured separately. The electric wires w1 and w1 of the light emitting device 10 are connected to the output terminal of the lighting device, and the output of the lighting device is supplied to each LED 12, whereby the light emitting device 10 is controlled to be turned on. Is done.

  When the lighting device 20 configured as described above is turned on, the white light emitted from the LED 12 passes through the cover member 14 and diffuses the light rays to the surroundings. Light is irradiated uniformly over the entire area.

  At the same time, as shown in FIG. 3, the heat generated from the LED 12 is transmitted to the substrate 13 made of ceramic having good thermal conductivity, and further transmitted to the substrate support portion 11a of the main body 11 made of aluminum. It is transmitted to the heat radiating member 21 and is effectively radiated to the outside from the large number of heat radiating fins 21b. Thereby, the temperature rise of LED can be suppressed and it becomes possible to aim at high output by suppressing the fall of luminous efficiency. At the same time, it is possible to extend the service life.

  At this time, as shown in FIG. 3, the ceramic substrate 13 is arranged from the four corners by the support portion 14 a of the cover member 14 in a state of being provided in the recessed fitting portion 11 a 1 of the main body 11, and Since it is pressed and supported with an appropriate force, the entire circumference of the side surface of the substrate 13 is in close contact with the inner peripheral surface of the recessed fitting portion 11a1, and the other surface side of the substrate 13 is in close contact with the bottom surface of the recessed fitting portion 11a1. Has been. Thereby, the heat of the board | substrate 13 can be effectively transmitted with respect to the main body 11, and it becomes possible to exhibit a more effective thermal radiation effect | action.

  The light emitting device 10 configured as described above is used as a light source of a large signboard lighting device. The light emitting device 10 having the above-described configuration can be used as a light source of a newly constructed signboard illumination device, but can be replaced with, for example, a straight tube fluorescent lamp in an existing signboard illumination device. It is small. Hereinafter, a procedure for constructing a new energy-saving signboard illuminating device by replacing the light emitting device of this embodiment with a fluorescent lamp with respect to an existing signboard illuminating device using a fluorescent lamp as a light source will be described.

  As shown in FIG. 6 (a), the existing signboard lighting device 30 is a so-called internally illuminating lighting device, and includes a mounting panel 31 made of a steel plate to which four straight fluorescent lamps are mounted, and an advertisement. It consists of a front panel 32 made of a translucent member such as a synthetic resin displaying characters, figures, patterns and the like. Note that the mounting panel 31 is made of a steel plate, and when the light emitting device 10 of the present embodiment is mounted, the mounting panel 31 can also serve as a heat radiating member of an LED that is a light source. In the figure, 33 is a separate lighting device.

  In the existing signboard lighting device, the light emitting device 10 having the above-described configuration using LEDs as light sources is installed in place of fluorescent lamps in order to save energy and extend the life. A plurality of light emitting devices 10 are connected in a row in this embodiment, and 36 light emitting devices 10 are arranged in a line, and the light emitting devices 10 in a line are bent so as to be linear with respect to a mounting panel 31 made of a steel plate as a heat radiating member. Parallel and meandering are arranged in a matrix. This is arranged so as to be along the four straight tube fluorescent lamps that have been installed as existing instruments. At this time, the light emitting device 10 fixes the pair of attachment pieces 11 c and 11 c formed on the main body 11 to the attachment panel 31 with fixing means such as screws, and the other surface side of the main body 11 is in close contact with the surface of the attachment panel 31. Let

  This is because, as described above, the main body 11 of the light emitting device 10 in the present embodiment is configured to be appropriately supported by closely attaching a separate heat radiating member. It can be attached to the mounting panel 31 which is a common heat radiating member. The light emitting device 10 can also be arranged with a density higher than that of existing fluorescent lamps.

  As described above, a new signboard illumination device 30 in which the light source is an LED is easily configured. When the signboard illumination device 30 is turned on, the light diffused by the cover member 14 is emitted from each light emitting device 10, so that the front panel 32 having a large area can be irradiated substantially evenly. More effective advertising illumination can be performed by irradiating light equivalent to or more equal to that of a conventional fluorescent lamp. At the same time, the heat generated in each light emitting device 10 is effectively radiated to the outside from the steel plate mounting panel 31 which is a common heat radiating member having a large area. Thereby, the energy-saving signboard illumination device 30 with reduced power consumption due to the energy-saving effect of the LED can be provided.

  In addition, as shown in FIGS. 6B, 6C, and 6D, the light emitting device 10 can be used by connecting any number of them, and can be applied to existing or new signboard lighting devices of various sizes. Thus, a light-emitting device with excellent versatility can be provided. At the same time, since the light-emitting devices 10 are connected in a row, the light-emitting devices 10 in a row can be easily applied to lighting devices for signboards of various sizes by simply bending the light-emitting devices 10. Can be improved.

  Even when the signage lighting device is installed outdoors, even if rainwater or dust enters the mounting panel 31, the light emitting device 10 has functions such as waterproofing and dustproofing. It is possible to provide a safe signboard lighting device having a long life without causing deterioration of the light emitting part due to dust or dust, and without causing electric leakage due to deterioration of electrical insulation resistance or the like.

  In addition, since the light emitting device of this embodiment is configured as a small and energy saving light emitting device using LEDs, not only can a new energy saving lighting device be provided, but also the light source of the existing lighting device as described above. The existing lighting device can be easily changed to an energy-saving lighting device. In particular, when applied to a signboard lighting device, it is possible to irradiate a light emitting panel having a large area substantially evenly, and to perform more effective advertising illumination.

  As described above, in the present embodiment, the light emitting device 10 may be configured such that the buffer member 16 having elasticity is provided between the support portion 14 a of the cover member 14 and the ceramic substrate 13. That is, as shown in FIG. 7, a thin buffer piece 16 protruding in an L shape is formed integrally with a packing 15 made of silicone resin. Four buffer pieces 16 are integrally formed corresponding to the support portion 14 a of the cover member 14.

  Thus, when the ceramic substrate 13 is pressed at the four corners by the support portions 14 a of the cover member 14, the substrate 13 is supported and provided in the recessed fitting portion 11 a 1 of the main body 11 via the buffer piece 16. It is possible to press and support the buffer piece 16 more securely by the elastic force of the buffer piece 16, that is, the spring property. At the same time, it is possible to protect the surface of the ceramic with which the support portion 14a abuts. Further, the substrate 13 is not rattled in the recessed fitting portion 11a1, and reliable positioning is performed.

  Further, the packing 15 has a waterproof function and can also have a function of supporting the board. By combining the waterproof function and the board support function, the number of parts can be reduced and the assembly process can be reduced. It is possible to reduce the cost. In addition, the buffer piece 16 may be configured separately from the packing 15, and may be configured by, for example, a buffer member having a ring shape along the circular outer peripheral portion of the substrate support portion 11a.

  Further, the cover member 14 is configured to have a light control function such as a lens body or a reflector that controls the light distribution of the light emitted from the LED 12, and is appropriately replaced with the cover member 14 described above according to the illumination application. You may comprise so that it can do.

  In addition, a silicone resin having good thermal conductivity is provided between the other surface side of the substrate 13 and the bottom surface of the recessed fitting portion 11a1 of the main body 11 and between the other surface side of the main body 11 and the heat radiation member 21, as necessary. It is also possible to configure such that each of them can be supported more closely through a sheet such as epoxy resin, an adhesive, or the like, and to dissipate the heat generated by the LED 12 more effectively.

  In the present embodiment, the solid-state light-emitting element 12 constituting the light-emitting device 10 is preferably composed of, for example, an LED chip made of a gallium nitride (GaN) -based semiconductor that emits blue light. A solid state light emitting device using an organic EL or the like as a light source is allowed. Moreover, although it was made to light-emit in white, according to the use of a light-emitting device, you may comprise red, blue, green, etc., and also combining various colors.

  The main body 11 is a metal having good thermal conductivity, for example, a metal including at least one of aluminum (Al), copper (Cu), iron (Fe), and nickel (Ni) in order to improve the heat dissipation of the solid state light emitting device. In addition to this, it may be made of an industrial material such as aluminum nitride (AlN) or silicon carbide (SiC). Furthermore, you may comprise with high heat conductive resin. Furthermore, in order to further improve the heat radiation performance, a large number of heat radiation fins projecting radially, heat radiation pins projecting in the radial direction, and the like may be integrally formed on the outer peripheral surface.

  Further, in the present embodiment, the light emitting device is a light bulb-shaped lighting device that can be substituted for a general incandescent light bulb, a small lighting device for general lighting such as residential use such as a downlight or a spotlight, and further from the ceiling or the like. Relatively large lighting devices for offices and other facilities, such as offices that perform lighting, and large lighting devices such as road lights for highways and general roads, security lights for outdoor lighting such as parks, etc. The present invention is not limited to lighting devices, and can be applied to various types of lighting devices such as thin televisions, liquid crystal displays, mobile phones, backlights of various information terminals, and lighting devices for billboard advertisements indoors and outdoors.

  In addition, in FIG. 7 which shows a modification, the same code | symbol was attached | subjected to the same part as FIGS. 1-6, and detailed description was abbreviate | omitted. The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and the scope of the present invention does not depart from the gist of the present invention such as, for example, a backlight for a thin television. Inside, various design changes can be made.

DESCRIPTION OF SYMBOLS 10 Light-emitting device 11 Main body 11a1 Recessed fitting part 12 Solid light-emitting element 13 Substrate 14 Cover member 14a Support part 15 Sealing member 16 Buffer member 20 Illuminating device 21, 31 Heat radiation member 33 Lighting device

Claims (5)

A body made of a thermally conductive member;
A ceramic substrate having a solid light emitting element disposed on one side and a main body disposed on the other side;
A translucent cover member that has a support portion in contact with one surface side of the substrate on the inner surface and is attached to the main body so as to cover the substrate;
A light-emitting device comprising: The light emitting device according to claim 1, wherein the substrate is provided in a concave fitting portion provided in the main body, and the other surface side is provided in the main body. The light emitting device according to claim 1, wherein the cover member is supported via a buffer member between the support portion and the one surface side of the substrate. 4. A seal member that is compressed in a direction substantially orthogonal to a direction in which the substrate is supported by the main body by a support portion is interposed between the main body and the cover member. Light-emitting device. A light emitting device according to any one of claims 1 to 4;
A heat dissipating member in which the main body of the light emitting device is thermally coupled;
A lighting device for lighting the light emitting device;
An illumination device comprising:

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