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CN204284979U - Lighting device - Google Patents

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Publication number
CN204284979U
CN204284979U CN201420542069.2U CN201420542069U CN204284979U CN 204284979 U CN204284979 U CN 204284979U CN 201420542069 U CN201420542069 U CN 201420542069U CN 204284979 U CN204284979 U CN 204284979U
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light
emitting module
light emitting
wavelength conversion
conversion layer
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川越真
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

本实用新型提供一种照明装置。实施方式的照明装置包括:第1发光模块,具备半导体发光元件、配置在所述半导体发光元件上的第1波长转换层、及配置在所述半导体发光元件上的第2波长转换层;第2发光模块,具备所述半导体发光元件、所述第1波长转换层及所述第2波长转换层,且所述第1波长转换层及所述第2波长转换层的配置与所述第1发光模块具有对称性;器具本体,在下表面设置有光源安装部,在所述光源安装部中交替安装有所述第1发光模块及所述第2发光模块;以及反射体,对从所述第1发光模块及所述第2发光模块出射的光进行控制。本实用新型提供的照明装置能够提高混色性能。

The utility model provides an illuminating device. The lighting device according to the embodiment includes: a first light-emitting module including a semiconductor light-emitting element, a first wavelength conversion layer disposed on the semiconductor light-emitting element, and a second wavelength conversion layer disposed on the semiconductor light-emitting element; A light-emitting module comprising the semiconductor light-emitting element, the first wavelength conversion layer, and the second wavelength conversion layer, and the arrangement of the first wavelength conversion layer and the second wavelength conversion layer is similar to that of the first light-emitting The module has symmetry; the appliance body is provided with a light source installation part on the lower surface, and the first light-emitting module and the second light-emitting module are alternately installed in the light source installation part; The light emitted by the light emitting module and the second light emitting module is controlled. The lighting device provided by the utility model can improve the color mixing performance.

Description

照明装置lighting device

技术领域 technical field

本实用新型的实施方式涉及一种照明装置。 The embodiment of the utility model relates to a lighting device.

背景技术 Background technique

近年来,例如在筒灯(down light)等照明装置中,有时使用将发光二极管(Light Emitting Diode,LED)作为光源而安装在基板上的发光模块(module),所述发光二极管是寿命比灯泡等长且电力消耗比灯泡等少的半导体发光元件。该照明装置例如将使用蓝色LED与黄色荧光体来出射白色光的多个发光模块沿周方向设置。 In recent years, for example, in lighting devices such as down lights, light-emitting modules (modules) that use light-emitting diodes (Light Emitting Diodes, LEDs) as light sources and are mounted on substrates are sometimes used. A semiconductor light-emitting element that is equal in length and consumes less power than a light bulb. In this lighting device, for example, a plurality of light emitting modules that emit white light using blue LEDs and yellow phosphors are arranged along the circumferential direction.

此种照明装置中,例如当利用使用多个荧光体来出射不同光色的光的发光模块时,视发光模块的配置,有可能会产生色差,造成混色性能下降。 In such a lighting device, for example, when using a light emitting module that uses a plurality of phosphors to emit light of different light colors, depending on the arrangement of the light emitting modules, color difference may occur, resulting in a decrease in color mixing performance.

现有技术文献 prior art literature

专利文献 patent documents

专利文献1:日本专利特开2011-204655号公报 Patent Document 1: Japanese Patent Laid-Open No. 2011-204655

实用新型内容 Utility model content

[实用新型所要解决的问题] [Problems to be solved by the utility model]

本实施方式的目的在于提供一种能够提高混色性能的照明装置。 The purpose of this embodiment is to provide a lighting device capable of improving color mixing performance.

[解决问题的技术手段] [Technical means to solve the problem]

实施方式的照明装置包括:第1发光模块,具备半导体发光元件、配置在所述半导体发光元件上的第1波长转换层、及配置在所述半导体发光元件上的第2波长转换层;第2发光模块,具备所述半导体发光元件、所述第1波长转换层及所述第2波长转换层,且所述第1波长转换层及所述第2波长转换层的配置与所述第1发光模块具有对称性;器具本体,在下表面设置有光源安装部,在所述光源安装部中交替安装有所述第1发光模块及所述第2发光模块;以及反射体,对从所述第1发光模块及所述第2发光模块出射的 光进行控制。 The lighting device according to the embodiment includes: a first light-emitting module including a semiconductor light-emitting element, a first wavelength conversion layer disposed on the semiconductor light-emitting element, and a second wavelength conversion layer disposed on the semiconductor light-emitting element; A light-emitting module comprising the semiconductor light-emitting element, the first wavelength conversion layer, and the second wavelength conversion layer, and the arrangement of the first wavelength conversion layer and the second wavelength conversion layer is similar to that of the first light-emitting The module has symmetry; the appliance body is provided with a light source installation part on the lower surface, and the first light-emitting module and the second light-emitting module are alternately installed in the light source installation part; The light emitted by the light-emitting module and the second light-emitting module is controlled.

所述第1发光模块及所述第2发光模块呈圆环状地交替配置。 The first light-emitting modules and the second light-emitting modules are arranged alternately in an annular shape.

所述第1发光模块及所述第2发光模块呈直线状地交替配置。 The first light-emitting modules and the second light-emitting modules are arranged alternately in a straight line.

具有多个可变更安装朝向的第3发光模块,所述多个第3发光模块交替地变更安装朝向而安装在所述光源安装部中。 There are a plurality of third light-emitting modules whose installation directions can be changed, and the plurality of third light-emitting modules are installed in the light source installation part while changing the installation directions alternately.

(实用新型的效果) (effect of utility model)

根据实施方式,可提供一种能够提高混色性能的照明装置。 According to the embodiment, it is possible to provide a lighting device capable of improving color mixing performance.

附图说明 Description of drawings

图1是一实施方式的照明装置的剖面图。 FIG. 1 is a cross-sectional view of a lighting device according to an embodiment.

图2(a)及图2(b)是表示光源配置不同的发光模块的结构的图。 2( a ) and FIG. 2( b ) are diagrams showing the configuration of light emitting modules in which light source arrangements are different.

图3是在照明装置的器具本体中配置有发光模块的状态的底视图。 Fig. 3 is a bottom view of a state in which a light-emitting module is arranged in a fixture body of a lighting device.

图4是发光模块的剖面图。 Fig. 4 is a cross-sectional view of a light emitting module.

图5(a)及图5(b)是用于说明以往的光度分布与本实施方式的光度分布的图。 FIG. 5( a ) and FIG. 5( b ) are diagrams for explaining a conventional photometric distribution and a photometric distribution according to the present embodiment.

图6是用于说明发光模块的另一例的图。 Fig. 6 is a diagram illustrating another example of a light emitting module.

图7是用于说明照明装置的另一例的图。 Fig. 7 is a diagram for explaining another example of the lighting device.

[符号的说明] [explanation of the symbol]

11、11a:照明装置 11, 11a: Lighting device

12:器具本体  12: Appliance body

13a、13b、13c:发光模块 13a, 13b, 13c: light emitting modules

14:反射体 14: reflector

15:透光性罩  15: Translucent cover

16:反射框 16: Reflection frame

21、21a:基板部 21, 21a: Substrate part

22:筒部 22: Barrel

23:收容部 23: Containment

24:照射开口  24: Irradiation opening

25:发光模块配置部 25: Lighting module configuration department

26:凹陷部 26: Depression

29:配线孔 29: wiring hole

30:散热鳍片  30: cooling fins

34:基板 34: Substrate

35:LED元件 35: LED components

36:包围部 36: Surrounding Department

37a、37b:荧光体层 37a, 37b: Phosphor layers

38a、38b、39a、39b:电极焊垫 38a, 38b, 39a, 39b: electrode pads

42:表面部 42: surface part

43:反射筒部  43: Reflecting tube part

44:反射面 44: reflective surface

51:反射面部  51: Reflective Face

52:缘部 52: Edge

具体实施方式 Detailed ways

实施方式的照明装置包括:第1发光模块,具备半导体发光元件、配置在所述半导体发光元件上的第1波长转换层、及配置在所述半导体发光元件上的第2波长转换层;第2发光模块,具备所述半导体发光元件、所述第1波长转换层及所述第2波长转换层,且所述第1波长转换层及所述第2波长转换层的配置与所述第1发光模块具有对称性;器具本体,在下表面设置有光源安装部,在所述光源安装部中交替安装有所述第1发光模块及所述第2发光模块;以及反射体,对从所述第1发光模块及所述第2发光模块出射的光进行控制。 The lighting device according to the embodiment includes: a first light-emitting module including a semiconductor light-emitting element, a first wavelength conversion layer disposed on the semiconductor light-emitting element, and a second wavelength conversion layer disposed on the semiconductor light-emitting element; A light-emitting module comprising the semiconductor light-emitting element, the first wavelength conversion layer, and the second wavelength conversion layer, and the arrangement of the first wavelength conversion layer and the second wavelength conversion layer is similar to that of the first light-emitting The module has symmetry; the appliance body is provided with a light source installation part on the lower surface, and the first light-emitting module and the second light-emitting module are alternately installed in the light source installation part; The light emitted by the light emitting module and the second light emitting module is controlled.

而且,实施方式的照明装置中,所述第1发光模块及所述第2发光模块呈圆环状地交替配置。 Furthermore, in the lighting device according to the embodiment, the first light emitting modules and the second light emitting modules are arranged alternately in an annular shape.

而且,实施方式的照明装置中,所述第1发光模块及所述第2发光模块呈直线状地交替配置。 Furthermore, in the lighting device of the embodiment, the first light-emitting modules and the second light-emitting modules are arranged alternately in a straight line.

而且,实施方式的照明装置包括多个可变更安装朝向的第3发光模块,所述多个第3发光模块交替地变更安装朝向而安装在所述光源安装部中。 Furthermore, the lighting device according to the embodiment includes a plurality of third light-emitting modules whose installation directions can be changed, and the plurality of third light-emitting modules are installed in the light source installation part while changing the installation directions alternately.

以下,参照附图来详细说明本实用新型的实施方式。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

首先,基于图1至图4来说明一实施方式的照明装置的结构。图1是一 实施方式的照明装置的剖面图,图2(a)及图2(b)是表示光源配置不同的发光模块的结构的图,图3是在照明装置的器具本体中配置有发光模块的状态的底视图,图4是发光模块的剖面图。 First, the configuration of a lighting device according to one embodiment will be described based on FIGS. 1 to 4 . Fig. 1 is a cross-sectional view of a lighting device according to an embodiment, Fig. 2(a) and Fig. 2(b) are diagrams showing the structure of light emitting modules with different light source arrangements, and Fig. The bottom view of the state of the module, Fig. 4 is a sectional view of the light emitting module.

如图1至图4所示,照明装置11为筒灯,被嵌入设置在嵌入孔中,所述嵌入孔设置在天花板等屋顶构件上。 As shown in FIGS. 1 to 4 , the lighting device 11 is a downlight, and is embedded in an insertion hole provided on a roof member such as a ceiling.

照明装置11具备:器具本体12;多个发光模块13a及发光模块13b,配置在该器具本体12的一面侧即下表面;反射体14,配置在这些发光模块13a及发光模块13b的下侧并安装在器具本体12中;透光性罩(cover)15,安装在该反射体14的下侧;以及反射框16,覆盖反射体14及透光性罩15的周围而安装在器具本体12中。照明装置11更具备:电源单元(unit),配置在屋顶构件上,对发光模块13a及发光模块13b供给点灯电源。 The lighting device 11 includes: a fixture body 12; a plurality of light emitting modules 13a and 13b disposed on one side of the fixture body 12, that is, the lower surface; a reflector 14 disposed on the lower side of these light emitting modules 13a and 13b Installed in the appliance body 12; a translucent cover (cover) 15 installed on the underside of the reflector 14; . The lighting device 11 further includes a power supply unit (unit), which is arranged on the roof member and supplies lighting power to the light emitting module 13a and the light emitting module 13b.

为了兼作对发光模块13a及发光模块13b发出的热进行散热的散热构件,器具本体12由导热性及散热性优异的例如铝铸件(aluminum die-cast)等金属或陶瓷(ceramics)等材料所形成,且具有圆形的基板部21,以从该基板部21的周边部朝向下方扩开开口的方式形成有圆筒状的筒部22,在该筒部22的内侧形成有收容发光模块13及反射体14等的收容部23,在该收容部23的下表面即器具本体的下表面形成有照射开口24。 In order to also serve as a heat dissipation member for dissipating the heat emitted by the light emitting module 13a and the light emitting module 13b, the device body 12 is formed of materials such as metals such as aluminum die-cast or ceramics that are excellent in heat conductivity and heat dissipation. , and has a circular substrate portion 21, a cylindrical tube portion 22 is formed in such a manner that the opening is expanded downward from the peripheral portion of the substrate portion 21, and a light-emitting module 13 and a light emitting module are housed inside the tube portion 22. The receiving part 23 of the reflector 14 etc. has the irradiation opening 24 formed in the lower surface of this receiving part 23, ie, the lower surface of the instrument main body.

如图1及图3所示,在基板部21的下表面的周边部,沿周方向排列形成有多个即6个发光模块配置部25,所述发光模块配置部25用于配置发光模块13a及发光模块13b。发光模块配置部25是由形成在基板部21下表面的凹陷部26所形成。该凹陷部26的凹陷尺寸设为与发光模块13的基板的厚度尺寸相同。 As shown in FIG. 1 and FIG. 3 , on the peripheral portion of the lower surface of the substrate portion 21, a plurality of six light-emitting module arrangement portions 25 are arranged along the circumferential direction, and the light-emitting module arrangement portions 25 are used to arrange the light-emitting module 13a. And the light emitting module 13b. The light emitting module arrangement portion 25 is formed by a recessed portion 26 formed on the lower surface of the substrate portion 21 . The recessed dimension of the recessed portion 26 is set to be the same as the thickness dimension of the substrate of the light emitting module 13 .

在基板部21的中央,形成有贯穿基板部21的配线孔29,在基板部21的上侧,呈放射状地形成有多个散热鳍片(fin)30。 A wiring hole 29 penetrating through the substrate portion 21 is formed at the center of the substrate portion 21 , and a plurality of heat dissipation fins (fins) 30 are radially formed on the upper side of the substrate portion 21 .

而且,各发光模块13a及发光模块13b具有基板34,该基板34是由导热性优异的例如铝等金属或陶瓷等材料形成为大致矩形状。在该基板34的一面即表面,呈矩阵(matrix)状地排列安装有多个作为半导体发光元件的LED元件35,并且所述多个LED元件35通过形成在基板34上的配线图案(pattern)或打线接合(wire bonding)而可供电地连接。以包围多个LED元件35周围的方式形成有堤状的包围部36,在该包围部36的内侧,形成有以密封的方 式覆盖多个LED元件35的荧光体层37a及荧光体层37b。即,发光模块13a及发光模块13b由板上芯片(Chip On Board,COB)模块构成。 Furthermore, each light emitting module 13a and light emitting module 13b has a substrate 34 formed in a substantially rectangular shape from a material such as metal such as aluminum or ceramics having excellent thermal conductivity. On one side of the substrate 34, that is, the surface, a plurality of LED elements 35 as semiconductor light-emitting elements are arranged and mounted in a matrix, and the plurality of LED elements 35 pass through the wiring pattern (pattern) formed on the substrate 34. ) or wire bonding (wire bonding) to connect power supply. A bank-shaped surrounding portion 36 is formed to surround the plurality of LED elements 35, and inside the surrounding portion 36, phosphor layers 37a and 37b that cover the plurality of LED elements 35 in a sealed manner are formed. . That is, the light emitting module 13a and the light emitting module 13b are constituted by a chip on board (Chip On Board, COB) module.

LED元件35例如发出蓝色光,作为第1波长转换层的荧光体层37a是受LED元件35发出的蓝色光激发而主要发出黄色光的荧光体,LED元件35发出的蓝色光由荧光体层37a予以转换,由此,出射色温6000k~8000k的白色光(日光色的光)。 The LED element 35 emits blue light, for example. The phosphor layer 37a as the first wavelength conversion layer is a phosphor that is excited by the blue light emitted by the LED element 35 and mainly emits yellow light. The blue light emitted by the LED element 35 is emitted by the phosphor layer 37a. By converting, white light (light of daylight color) with a color temperature of 6000k to 8000k is emitted.

而且,来自LED元件35的出射光由作为第2波长转换层的荧光体层37b予以转换,从而从第2波长转换层出射色温2000k~3000k的灯泡色的光。 Then, the emitted light from the LED element 35 is converted by the phosphor layer 37b as the second wavelength conversion layer, and light bulb color light having a color temperature of 2000k to 3000k is emitted from the second wavelength conversion layer.

由这些作为第1波长转换层的荧光体37a及作为第2波长转换层的荧光体37b进行波长转换的白色及灯泡色的光由于交替地设置在同一基板上,进而,第1发光模块13a及第2发光模块13b以具有对称性的方式安装在器具本体12中,因此能够均匀地混合而降低色差。 The white light and bulb-colored light whose wavelength is converted by the phosphor 37a as the first wavelength conversion layer and the phosphor 37b as the second wavelength conversion layer are alternately arranged on the same substrate, and furthermore, the first light emitting module 13a and the Since the second light emitting module 13b is mounted symmetrically in the fixture main body 12, it can mix uniformly and reduce color difference.

另外,对发光模块13a及发光模块13b通过发出蓝色光的LED元件35、荧光体层37a、37b而出射白色及灯泡色的光的例子进行了说明,但也可使用发出其他色的光的LED元件、其他色的荧光体来出射与白色及灯泡色为不同色的光。而且,对发光模块13a及发光模块13b出射白色及灯泡色这两色的光的例子进行了说明,但也可使用出射三色以上的光的发光模块。 In addition, the light-emitting module 13a and the light-emitting module 13b have been described as examples in which the LED element 35 that emits blue light and the phosphor layers 37a and 37b emit white and bulb-colored light, but LEDs that emit light of other colors may also be used. Elements and phosphors of other colors emit light of a color different from white and the color of the light bulb. Furthermore, an example in which the light-emitting module 13a and the light-emitting module 13b emit light of two colors, white and bulb color, has been described, but light-emitting modules that emit light of three or more colors may also be used.

在基板34的表面,安装有电连接于多个LED元件35的电极焊垫(pad)38a、38b、39a及39b。在各发光模块13a及发光模块13b的电极焊垫38a、38b、39a及39b上,连接有穿过配线孔29被引入器具本体12内的来自电源单元的电源线缆(cable),能够从电源单元对各发光模块13a及发光模块13b供给点灯电源。 On the surface of the substrate 34, electrode pads (pads) 38a, 38b, 39a, and 39b electrically connected to the plurality of LED elements 35 are mounted. On the electrode pads 38a, 38b, 39a and 39b of each light-emitting module 13a and light-emitting module 13b, a power supply cable (cable) from the power supply unit that is introduced into the appliance body 12 through the wiring hole 29 is connected. The power supply unit supplies lighting power to each of the light emitting modules 13a and 13b.

电极焊垫38a及电极焊垫38b对配置在荧光体层37a之下的LED元件35供给电源,电极焊垫39a及电极焊垫39b对配置在荧光体层37b之下的LED元件35供给电源。由此,发光模块13a及发光模块13b能够发出白色、灯泡色或者白色及灯泡色的光。 The electrode pads 38a and 38b supply power to the LED elements 35 arranged under the phosphor layer 37a, and the electrode pads 39a and 39b supply power to the LED elements 35 arranged under the phosphor layer 37b. Thereby, the light emitting module 13a and the light emitting module 13b can emit light of white, lightbulb color, or white and lightbulb color.

而且,反射体14由具有绝缘性的合成树脂制,具有圆板状的表面部42,且从该表面部42的上表面周边部,与配置在器具本体12中的各发光模块13a及发光模块13b的位置对应地突出设置有多个反射筒部43。这些反射筒部43以朝向下侧的照射开口24扩开倾斜的方式形成为大致圆锥筒状,在其内表面 形成有使来自LED元件35的光朝向下方的照射方向反射的反射面44。 Moreover, the reflector 14 is made of insulating synthetic resin, has a disk-shaped surface portion 42, and from the upper surface peripheral portion of the surface portion 42, it is connected with each light-emitting module 13a and the light-emitting module disposed in the device main body 12. A plurality of reflective tube parts 43 protrude from the position of 13b. These reflective cylinder portions 43 are formed in a substantially conical cylindrical shape so as to expand and incline toward the lower irradiation opening 24, and a reflective surface 44 for reflecting light from the LED element 35 toward the downward irradiation direction is formed on the inner surface thereof.

反射面44的上端侧的前端部的内径尺寸比发光模块13a及发光模块13b的包围部36的外径尺寸大,反射面44相向地配置在发光模块13a及发光模块13b的包围部36的周围。即,反射面44的上端侧的前端部较发光模块13a及发光模块13b的发光面即荧光体层37a及荧光体层37b的表面位于更上方,反射面44设置到与包围部36的周面相向的位置为止。另外,至少表面部42的下表面或反射面44实施有镜面或白色面等提高反射效率的反射面处理。 The inner diameter of the front end portion on the upper end side of the reflective surface 44 is larger than the outer diameter of the surrounding portion 36 of the light emitting module 13a and the light emitting module 13b, and the reflecting surface 44 is disposed opposite to each other around the surrounding portion 36 of the light emitting module 13a and the light emitting module 13b. . That is, the front end portion of the upper end side of the reflective surface 44 is located higher than the light emitting surfaces of the light emitting modules 13a and 13b, that is, the surfaces of the phosphor layer 37a and the phosphor layer 37b, and the reflective surface 44 is provided to be opposite to the surrounding surface of the surrounding portion 36. up to the desired position. In addition, at least the lower surface of the surface portion 42 or the reflective surface 44 is given a reflective surface treatment such as a mirror surface or a white surface to improve reflection efficiency.

而且,透光性罩15由具有透光性及光扩散性的丙烯酸树脂或玻璃,形成为覆盖反射体14的整个表面侧的大小的圆板状,并通过未图示的安装结构而可装卸地安装于反射体14。 Furthermore, the translucent cover 15 is made of acrylic resin or glass having translucency and light diffusivity, and is formed in a disk shape with a size covering the entire surface side of the reflector 14, and is detachable by an attachment structure not shown. ground mounted on the reflector 14.

而且,反射框16由例如金属或合成树脂形成为圆筒状,且具备:反射面部51,沿着器具本体12的收容部23的内壁面而配置;及缘部52,抵接于屋顶构件的下表面而在与未图示的安装弹簧之间保持屋顶构件,并且覆盖嵌入孔。 Furthermore, the reflective frame 16 is formed into a cylindrical shape by, for example, metal or synthetic resin, and includes: a reflective surface 51 disposed along the inner wall surface of the housing portion 23 of the appliance body 12; The roof member is held between the lower surface and the mounting spring not shown, and the fitting hole is covered.

并且,在以此方式构成的照明装置11中,通过从电源单元对各发光模块13a及发光模块13b供给点灯电源,从而各发光模块13a及发光模块13b的LED元件35点灯,以从荧光体层37a及荧光体层37b表面的发光面放出光。该放出的光的一部分直接朝向透光性罩15,一部分被反射面44反射而朝向透光性罩15,并透过透光性罩15而从照射开口24照射向下方。 In addition, in the illuminating device 11 configured in this manner, by supplying lighting power from the power supply unit to each of the light emitting modules 13a and 13b, the LED elements 35 of each of the light emitting modules 13a and 13b are turned on, so that the phosphor layer 37a and the light-emitting surface on the surface of the phosphor layer 37b emit light. Part of the emitted light goes directly to the translucent cover 15 , and part of it is reflected by the reflective surface 44 to go to the translucent cover 15 , passes through the translucent cover 15 , and is irradiated downward from the irradiation opening 24 .

因各发光模块13a及发光模块13b的LED元件35的点灯而产生的热传导至基板34,并从该基板34传导至器具本体12,且从该器具本体12的包含散热鳍片30的外表面散发到空气中。 The heat generated by the lighting of the LED elements 35 of each light emitting module 13a and light emitting module 13b is conducted to the substrate 34, is conducted from the substrate 34 to the device body 12, and is dissipated from the outer surface of the device body 12 including the heat dissipation fins 30. into the air.

根据该照明装置11,在器具本体12上设置有多个发光模块配置部25并配置多个发光模块13a及发光模块13b,在反射体14上设置有使来自各发光模块13a及发光模块13b的光反射的多个反射面44,因此从照明装置11放出的光量增加而能够提高亮度。 According to this lighting device 11, a plurality of light-emitting module arrangement parts 25 are provided on the appliance body 12 to arrange a plurality of light-emitting modules 13a and 13b, and the reflector 14 is provided with light from each light-emitting module 13a and light-emitting module 13b. Since the plurality of reflective surfaces 44 for light reflection increases the amount of light emitted from the lighting device 11, the brightness can be improved.

如图2(a)及图2(b)至图4所示,本实施方式中,在发光模块13a与发光模块13b中,荧光体层37a及荧光体层37b的配置不同。具体而言,在发光模块13a与发光模块13b中,荧光体层37a及荧光体层37b的配置成对称。进而,照明装置11将发光模块13a与发光模块13b沿基板部21的周方 向交替地配置,更具体而言,分别以60°的角度呈圆环状且大致等间隔地交替配置,以使得从照明装置11出射的光度分布变得相等。 As shown in FIG. 2( a ) and FIG. 2( b ) to FIG. 4 , in this embodiment, the arrangement of the phosphor layer 37 a and the phosphor layer 37 b is different in the light emitting module 13 a and the light emitting module 13 b. Specifically, in the light emitting module 13a and the light emitting module 13b, the arrangement of the phosphor layer 37a and the phosphor layer 37b is symmetrical. Furthermore, in the lighting device 11, the light emitting modules 13a and the light emitting modules 13b are alternately arranged along the circumferential direction of the substrate part 21, more specifically, they are alternately arranged in an annular shape at an angle of 60° at approximately equal intervals, so that The distribution of light intensity emitted from the lighting device 11 becomes equal.

图5(a)及图5(b)是用于说明以往的光度分布与本实施方式的光度分布的图。图5(a)表示以往的照明装置的光度分布,图5(b)表示本实施方式的照明装置的光度分布。 FIG. 5( a ) and FIG. 5( b ) are diagrams for explaining a conventional photometric distribution and a photometric distribution according to the present embodiment. FIG. 5( a ) shows the photometric distribution of a conventional lighting device, and FIG. 5( b ) shows the photometric distribution of the lighting device according to this embodiment.

配置有荧光体层的配置相同的发光模块的以往的照明装置如图5(a)所示,尤其在铅垂角度为20度~30度附近,白色及灯泡色的光度不同。 As shown in FIG. 5( a ), the conventional lighting device having the same arrangement of light-emitting modules in which the phosphor layer is arranged has a different luminosity between white and light bulb colors, especially in the vicinity of the vertical angle of 20° to 30°.

与此相对,交替配置有荧光体层37a及荧光体层37b的配置不同的发光模块13a及发光模块13b的本实施方式的照明装置11如图5(b)所示,白色及灯泡色的光度相同。 On the other hand, in the lighting device 11 of this embodiment in which the arrangement of the phosphor layer 37a and the phosphor layer 37b is different, the light emitting modules 13a and 13b are arranged alternately, as shown in FIG. same.

如上所述,本实施方式的照明装置11通过将使荧光体层37a及荧光体层37b的配置具备对称性的发光模块13a及发光模块13b沿基板部21的周方向交替配置,更具体而言,将发光模块13a及发光模块13b沿基板部21的周方向呈圆环状且大致等间隔地交替配置,从而使得从照明装置11出射的光度分布变得相等。 As described above, the lighting device 11 according to this embodiment alternately arranges the light emitting modules 13 a and 13 b in which the arrangement of the phosphor layers 37 a and 37 b has symmetry along the circumferential direction of the substrate portion 21 , and more specifically The light-emitting modules 13a and 13b are arranged alternately in a ring shape at substantially equal intervals along the circumferential direction of the substrate portion 21 so that the light intensity distribution emitted from the lighting device 11 becomes equal.

因而,根据本实施方式的照明装置,即便具备多个具有多个光色的光源,也能够提高混色性能。 Therefore, according to the lighting device of the present embodiment, even if a plurality of light sources having a plurality of light colors are provided, color mixing performance can be improved.

另外,本实施方式中,对荧光体层37a及荧光体层37b的配置不同的发光模块13a及发光模块13b进行了说明,但并不限定于此。 In addition, in this embodiment, although the light emitting module 13a and the light emitting module 13b which differ in arrangement|positioning of the phosphor layer 37a and the phosphor layer 37b were demonstrated, it is not limited to this.

图6是用于说明发光模块的另一例的图。另外,在图6中,对于与图2(a)及图2(b)同样的结构,标注相同的符号并省略说明。 Fig. 6 is a diagram illustrating another example of a light emitting module. In addition, in FIG. 6, the same code|symbol is attached|subjected to the structure similar to FIG. 2(a) and FIG. 2(b), and description is abbreviate|omitted.

图6所示的发光模块13c在基板34的上侧及下侧分别具有电极焊垫38a、38b、39a及39b,且安装朝向能够变更。通过使该发光模块13c上下反转而沿基板部21的周方向交替地配置,从而无需设置荧光体层37a及荧光体层37b的配置不同的多个发光模块13a及发光模块13b,便可提高混色性能。 The light emitting module 13c shown in FIG. 6 has electrode pads 38a, 38b, 39a, and 39b on the upper side and the lower side of the substrate 34, respectively, and the mounting orientation can be changed. By inverting the light-emitting modules 13c upside down and alternately arranging them along the circumferential direction of the substrate portion 21, it is not necessary to provide a plurality of light-emitting modules 13a and 13b with different arrangements of the phosphor layers 37a and 37b. Color mixing performance.

而且,本实施方式中,对将发光模块13a及发光模块13b沿周方向配置的照明装置11进行了说明,但并不限定于此。 Moreover, in this embodiment, the lighting device 11 in which the light emitting module 13a and the light emitting module 13b are arranged along the circumferential direction has been described, but it is not limited thereto.

图7是用于说明照明装置的另一例的图。另外,在图7中,对于与图3同样的结构,标注相同的符号并省略说明。 Fig. 7 is a diagram for explaining another example of the lighting device. In addition, in FIG. 7, the same code|symbol is attached|subjected to the structure similar to FIG. 3, and description is abbreviate|omitted.

如图7所示,照明装置11a在四边形的基板部21a上,呈直线状且交替 地配置有发光模块13a及发光模块13b。在此种照明装置11a中,也能够提高混色性能。 As shown in FIG. 7, in the lighting device 11a, the light emitting modules 13a and the light emitting modules 13b are arranged linearly and alternately on the quadrangular substrate portion 21a. Also in such an illumination device 11a, the color mixing performance can be improved.

对本实用新型的若干实施方式进行了说明,但这些实施方式仅为例示,并不意图限定实用新型的范围。这些新颖的实施方式能以其他的各种形态来实施,在不脱离实用新型的主旨的范围内,可进行各种省略、替换、变更。这些实施方式及其变形包含在实用新型的范围或主旨内,并且包含在与其均等的范围内。 Although some embodiments of the present invention have been described, these embodiments are merely examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various forms, and various omissions, substitutions, and changes are possible without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope or spirit of the invention, and are included in a range equivalent thereto.

Claims (4)

1. a lighting device, is characterized in that, comprising:
1st light emitting module, the 2nd wavelength conversion layer possessing semiconductor light-emitting elements, be configured in the 1st wavelength conversion layer on described semiconductor light-emitting elements and be configured on described semiconductor light-emitting elements;
2nd light emitting module, possesses described semiconductor light-emitting elements, described 1st wavelength conversion layer and described 2nd wavelength conversion layer, and the configuration of described 1st wavelength conversion layer and described 2nd wavelength conversion layer and described 1st light emitting module have symmetry;
Apparatus body, is provided with light resource installing section at lower surface, is mounted alternately with described 1st light emitting module and described 2nd light emitting module in described light resource installing section; And
Reflector, controls the light from described 1st light emitting module and described 2nd light emitting module outgoing.
2. lighting device according to claim 1, is characterized in that,
Described 1st light emitting module and described 2nd light emitting module are alternately configuration circularly.
3. lighting device according to claim 1, is characterized in that,
Described 1st light emitting module and described 2nd light emitting module be alternately configuration linearly.
4. lighting device according to claim 1, is characterized in that,
Have multiple modifiable installation towards the 3rd light emitting module,
Described multiple 3rd light emitting module alternately changes to be installed towards and is arranged in described light resource installing section.
CN201420542069.2U 2014-03-24 2014-09-19 Lighting device Expired - Fee Related CN204284979U (en)

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Cited By (3)

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TWI567854B (en) * 2015-08-06 2017-01-21 辛耘企業股份有限公司 Indicator device of pipe orifice and substrate treatment apparatus
CN108386732A (en) * 2015-07-06 2018-08-10 扬州艾笛森光电有限公司 Light emitting module and head lamp with this light emitting module
CN110121773A (en) * 2017-06-27 2019-08-13 首尔半导体株式会社 Light emitting device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108386732A (en) * 2015-07-06 2018-08-10 扬州艾笛森光电有限公司 Light emitting module and head lamp with this light emitting module
CN108386732B (en) * 2015-07-06 2019-09-10 扬州艾笛森光电有限公司 Light emitting module and head lamp with this light emitting module
TWI567854B (en) * 2015-08-06 2017-01-21 辛耘企業股份有限公司 Indicator device of pipe orifice and substrate treatment apparatus
CN110121773A (en) * 2017-06-27 2019-08-13 首尔半导体株式会社 Light emitting device
CN110676247A (en) * 2017-06-27 2020-01-10 首尔半导体株式会社 Light emitting device
CN110676247B (en) * 2017-06-27 2023-11-03 首尔半导体株式会社 Lighting device
CN110121773B (en) * 2017-06-27 2023-11-21 首尔半导体株式会社 light emitting device

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