JP2012195652A - Piezoelectric vibrating piece, piezoelectric vibrator, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric vibrating piece that relaxes stress on a vibrating portion when mounted, and to provide a piezoelectric vibrator, and an electronic device, using the same.SOLUTION: A piezoelectric vibrating piece 10 includes: a first recessed portion 17A that is recessed from a first main surface of a piezoelectric substrate 11 toward a second main surface on an opposite side of the first main surface; a vibrating portion that is arranged on a bottom portion 17Aa of the first recessed portion 17A; a thick portion 16 that is connected integrally to a perimeter of the vibrating portion and is thicker than the vibrating portion; a mount portion 20 that is connected to the thick portion 16 and is supported at one point on the piezoelectric substrate 11; and a second recessed portion 17B that is recessed from the second main surface of the piezoelectric substrate 11 toward the bottom portion 17Aa of the first recessed portion 17A. The vibrating portion includes the bottom portion 17Aa of the first recessed portion 17A, and a bottom portion 17Ba of the second recessed portion 17B. On each of the first and second main surfaces thereof, the piezoelectric substrate 11 has a level difference in a thickness direction of the thick portion 16 on the border between the vibrating portion and the thick portion 16.

Description

  The present invention relates to a piezoelectric vibrating piece, a piezoelectric vibrator using the same, and an electronic device, and more particularly to a technique for reducing the influence of a stress generated at a mounting position after mounting on a vibrating part.

  Conventionally, by providing a concave portion on one main surface of the piezoelectric substrate, an ultra-thin vibrating portion is provided on the bottom surface of the concave portion, and an edge of a thick annular surrounding portion that supports the periphery of the vibrating portion. An ultra-thin piezoelectric vibrator provided with an extended extraction electrode, a so-called reverse mesa type piezoelectric vibration element is known (Patent Documents 1 to 3).

  In Patent Documents 4 and 5, one electrode pad provided on the main surface of the annular surrounding portion of the piezoelectric substrate facing the inner bottom surface of the package and one connection electrode disposed inside the package are provided. By connecting and fixing with a fixing member such as a conductive adhesive, the inverted mesa type piezoelectric vibration element is fixed by one-point support, and the other electrode pad provided on the other main surface of the annular surrounding portion and the above A piezoelectric vibrator is described in which the other connection electrode arranged inside the package is electrically connected using a bonding wire.

  Incidentally, as described above, there is a form in which the piezoelectric vibration element is mounted and fixed to the package by applying a conductive adhesive. As described above, in the heat treatment process such as drying for curing the conductive adhesive, the distortion due to the difference in the linear expansion coefficient among the piezoelectric vibration element, the package, and the conductive adhesive is reduced. There is a problem that the stress from the fixed part to the vibration part, that is, the mount distortion adversely affects the vibration.

  In the following, methods for eliminating the mount distortion have been studied in Patent Documents 6 and 7, but in the case of the above-described inverted mesa type piezoelectric vibration element for the purpose of increasing the resonance frequency, the vibration part is excessive. Because of the thin wall, the effect of mount distortion reacts very sensitively compared to a flat-shaped piezoelectric vibration element, so even if the structure proposed in Patent Documents 6 and 7 is applied to an inverted mesa piezoelectric vibration element There was a problem that the influence of the mounting distortion on the vibration part could not be prevented.

  That is, in Patent Document 6, one end portion is a free end among a pair of end portions serving as both ends in the longitudinal direction of a thickness-slip piezoelectric vibration element such as an AT-cut quartz crystal substrate having a rectangular flat shape, and the other A piezoelectric vibrator in which the piezoelectric vibration element is mounted with two ends supported on the inner bottom surface of the package, and a notch or a slit is provided between the support section and the vibration section of the piezoelectric vibration element Is disclosed.

  FIG. 12 is a schematic diagram of a piezoelectric vibrator according to Patent Document 6. 12A is a top view of the piezoelectric vibration element constituting the piezoelectric vibrator, FIG. 12B is a bottom view of the piezoelectric vibration element constituting the piezoelectric vibrator, and FIG. FIG. 12D is a cross-sectional view taken along the line AA ′ of FIG. 12C, and shows a top view of the piezoelectric vibrator mounted inside.

  In FIG. 12, a rectangular piezoelectric vibration element 600 having a support portion 602 and a vibration portion 604 is shown. Excitation electrodes 606A and 606B formed on the upper and lower surfaces of the vibration part 604 of the piezoelectric vibration element 600, and input / output drawn from the excitation electrodes 606A and 606B to the edge of the support part 602 (of the piezoelectric vibrator 600). A slit 610 is disposed on the main surface of the piezoelectric vibration element 600 between the terminal portions 608A and 608B. Thus, the excitation electrodes 606A and 606B are physically separated from the input / output terminal portions 608A and 608B.

  By the way, when trying to reduce the size of the piezoelectric vibrating element (piezoelectric vibrating piece), the resonance frequency of the piezoelectric vibrating element may change over time due to the residual stress generated by the curing of the adhesive applied to the support portion of the piezoelectric vibrating element. Alternatively, there is a problem that the area of the excitation electrode has to be reduced, thereby causing a problem that the electrical characteristics as the piezoelectric vibration element deteriorate. For example, the problem that impedance becomes large and good characteristics cannot be obtained appears remarkably.

  In the above configuration, the adhesive 616 for fixing and electrically connecting the support portion 602 of the piezoelectric vibration element 600 and the electrode terminal (not shown) at the bottom of the container 612 that accommodates the piezoelectric vibration element 600 is cured. Then, the residual stress with respect to the piezoelectric vibration element 600 is generated over the direction and range indicated by the two-dot chain line in FIG.

  However, in the above configuration, the residual stress is not propagated to the vibrating portion 604 by the slit 610. By setting the longitudinal length of the slit 610 to an optimum length, the propagation direction of the residual stress is set. It can restrict | limit outside the area | region shown with the above-mentioned two-dot chain line. As a result, it is said that a small piezoelectric vibration element 600 in which the secular change of the resonance frequency of the piezoelectric vibrator 600 is small can be manufactured without impairing the electrical characteristics of the piezoelectric vibration element 600.

  However, the piezoelectric vibration element 600 of Patent Document 1 is supported on the substrate by two adhesives 616 disposed at different positions. Therefore, stress is applied to the piezoelectric vibration element 600 due to the difference in thermal expansion coefficients among the piezoelectric vibration element 600, the adhesive 616, and the substrate. The stress in this case is applied on a line connecting the bonding positions of the two adhesives 616 with the bonding position of the two adhesives 616 as a base point. However, in the case of the configuration of Patent Document 1, generation of this stress itself is avoided. It is difficult to do. In particular, when the piezoelectric vibrator is downsized, it is difficult to avoid propagation of this stress to the vibrating portion 604 (excitation electrodes 606A and 606B).

  FIG. 13 shows a piezoelectric vibrator according to Patent Document 7. FIG. 13A is a schematic cross-sectional view, and FIG. 13B is a top view. In order to solve the above problem, in the piezoelectric vibrator 700 of Patent Document 2, the extraction electrode 708 that is electrically connected to the excitation electrode 704 is provided on the mounting surface facing the substrate 716 of the piezoelectric vibration element 702 (piezoelectric vibration piece). An extraction electrode 710 formed and electrically connected to the excitation electrode 706 is disposed on the opposite surface of the mounting surface. The extraction electrode 708 formed on the mounting surface side is electrically connected to the electrode on the substrate 716 side via the conductive adhesive 712, and the extraction electrode 710 formed on the opposite surface is connected to the substrate via the wire 714. It is electrically connected to another electrode on the 716 side. That is, the piezoelectric vibration element 702 is supported at one point by the conductive adhesive 712. If such a support method is applied to a package in which a reverse mesa piezoelectric vibration element as disclosed in Patent Documents 4 and 5 is mounted on a package with one point support, the above-described stress can be avoided. It was expected.

Japanese Patent No. 312869 Japanese Patent Laid-Open No. 03-243008 Japanese Patent No. 3102872 JP 2000-332572 A JP 2010-219933 PR Japanese Patent Laid-Open No. 9-326667 JP 2010-252143 A

J. et al. M.M. Ratajski, “The Force Sensitivity of AT-Cut Quartz Crystals”, 20th Annual Symposium on Frequency Control, (1966)

However, even in the configuration of Patent Document 7 (that is, a structure in which an inverted mesa piezoelectric vibration element as disclosed in Patent Documents 4 and 5 is mounted on a package), thermal expansion between the piezoelectric vibration element 702 and the conductive adhesive 712 is performed. Since the coefficients are different from each other, a stress is generated that expands and contracts concentrically with respect to the piezoelectric vibration element 702 around the connection position of the piezoelectric vibration element 702 and the conductive adhesive 712. When the piezoelectric vibration element 702 is downsized, the distance between the connection position and the vibration portion (excitation electrodes 704 and 706) is shortened, and thus it is difficult to avoid propagation of this stress to the vibration portion. It becomes.
Accordingly, the present invention pays attention to the above problems, and in the inverted mesa type piezoelectric vibration element (piezoelectric vibration piece), the piezoelectric vibration piece and the piezoelectric vibration that can sufficiently relax the propagation of stress from the mount portion to the vibration portion. The object is to provide a child and an electronic device.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 Disposed from one main surface of the piezoelectric substrate toward the other main surface opposite to the main surface, the first concave portion and the bottom of the first concave portion A piezoelectric vibrating piece including a vibrating part and a thick part integrally connected to an outer peripheral edge of the vibrating part and thicker than the thickness of the vibrating part, and connected to the thick part and supported at a single point on a substrate A second recessed portion recessed from the other main surface of the piezoelectric substrate toward the bottom of the first recessed portion, and the vibrating portion includes the first and second vibrating portions. Characterized in that both main surfaces of the piezoelectric substrate have a step in the thickness direction of the thick part at the boundary between the vibrating part and the thick part. Piezoelectric vibrating piece.

  When the piezoelectric vibrating piece is supported at one point by the conductive adhesive, the component generated on the surface of the piezoelectric vibrating piece is dominant in the stress generated in the mount portion. However, with the above configuration, the length of the path that propagates from the mount portion to the surface of the piezoelectric vibrating piece and is transmitted to both surfaces of the vibrating portion is increased by the above-described step, so that the stress that reaches the vibrating portion can be relieved. Can do. Further, since the stress path is bent twice by the step, the stress can be effectively relieved at the bending position, and the stress reaching the vibration part can be relieved. Therefore, with the above configuration, the influence of the stress generated in the mount portion on the vibration portion is mitigated, and the piezoelectric vibration piece having good frequency characteristics and the like is obtained.

  Application Example 2 A buffer portion is disposed between the thick portion and the mount portion, and the buffer portion has a longitudinal direction that is orthogonal to the arrangement direction of the mount portion, the buffer portion, and the thick portion. And a slit penetrating in the thickness direction of the thick-walled portion, or a groove dug in the main surface of the piezoelectric substrate facing the substrate, the longitudinal direction being the orthogonal direction. The piezoelectric vibrating piece according to 1.

  In the above configuration, when the slit is provided in the buffer portion, most of the path to the vibration portion side of the stress propagating through the surface of the piezoelectric vibrating piece can be blocked. In addition, when a groove is formed in the buffer portion, the stress that propagates to the vibration portion on the mounting surface side becomes a path that passes in the order of the side surface of the groove, the bottom surface, and the side surface of the groove. Thus, the path is bent four times, so that the stress transmitted to the vibrating part can be relaxed.

Application Example 3 The application example 1 is characterized in that the thin-walled portion is arranged to be unevenly distributed on one of the main surfaces of the piezoelectric substrate in the thickness direction of the thick-walled portion. 2. The piezoelectric vibrating piece according to 2.
Due to the above configuration, when conductive adhesive is applied to the mounting part of the piezoelectric vibrating piece, the distance from the conductive adhesive connection position to the vibrating part on the mounting surface side of the piezoelectric vibrating piece becomes longer, so it occurs at the connection position. The stress transmitted to the vibrating portion can be relaxed.

Application Example 4 The piezoelectric vibrating piece is an X-axis of an orthogonal coordinate system including a crystal axis of quartz, an X axis as an electric axis, a Y axis as a mechanical axis, and a Z axis as an optical axis. An axis obtained by rotating the Z axis in the −Y direction of the Y axis as a Z ′ axis, an axis obtained by rotating the Y axis in the + Z direction of the Z axis as a Y ′ axis, It is formed of an AT-cut quartz crystal having a plane parallel to the X-axis and the Z′-axis and having a thickness in the direction parallel to the Y′-axis. The + Z′-axis is rotated around the Y′-axis in the + X-axis direction. And the Z ′ axis obtained by rotating the Z ′ axis around the Y ′ axis in the range of −120 ° to + 60 °, and the X axis around the Y ′ axis. The X ′ axis obtained by rotating together with the Z ′ axis has edges parallel to each other, and the width direction of the mount part is Any one of the application examples 1 to 3, characterized in that the direction of the edge is parallel to the X ′ axis, and the direction in which the thick portion and the mount are aligned is the direction of the edge parallel to the Z ″ axis. 2. The piezoelectric vibrating piece according to claim 1.
With the above-described configuration, it is possible to reduce a component that propagates to the vibration part among the stress generated in the mount part. Therefore, the piezoelectric vibrating piece is reduced in the influence of stress on the vibrating portion.

[Application Example 5] Any one of Application Examples 1 to 4, wherein a side of the thick-walled portion that sandwiches the vibration portion together with the mount portion is cut out, and an end portion of the thin-walled portion is exposed. The piezoelectric vibrating piece described in the example.
With the above configuration, when a plurality of piezoelectric vibrating pieces are cut out from the wafer, the area occupied by the wafer per piezoelectric vibrating piece can be reduced. Therefore, the number of piezoelectric vibrating pieces that can be cut out from the wafer can be increased, and the cost of the piezoelectric vibrating pieces can be suppressed.

[Application Example 6] In any one of Application Examples 1 to 5, the opposite surface side of the mount portion is notched in the thickness direction of the mount portion to form a stepped portion. Piezoelectric vibrating piece.
A conductive adhesive is applied to the mounting surface of the piezoelectric vibrator of the mount portion described above. The stress caused by the conductive adhesive propagates through the end face of the piezoelectric vibrating piece to the other main surface of the mount part and to the vibrating part side disposed on the opposite surface of the mounting surface of the piezoelectric vibrating piece. . Therefore, in the above configuration, the path of the stress propagating to the above-described vibration part can be bent by the stepped part, so that the stress can be effectively relieved at the bending position.

  Application Example 7 Excitation electrodes arranged on both surfaces of the thin portion and forming the vibration portion, and extraction electrodes drawn from the excitation electrode and arranged on the mounting surface side and the opposite surface side of the mount portion, The piezoelectric vibrating piece according to Application Example 6, wherein an extraction electrode disposed on the opposite surface side of the mount portion is disposed on the stepped portion.

  In the above configuration, the extraction electrode disposed on the surface opposite to the mounting surface of the piezoelectric vibrating piece is electrically connected to the substrate via a wire. Therefore, in the above configuration, since the extraction electrode is formed at the stepped portion, the height with respect to the substrate at the connection position between the extraction electrode and the wire can be reduced, so that the piezoelectric vibrator using this piezoelectric vibrating piece Can be reduced in height.

Application Example 8 According to any one of Application Examples 1 to 7, wherein one or a plurality of concave portions are formed at a position where the extraction electrode on the mounting surface side of the mount portion is formed. Piezoelectric vibrating piece.
With the above-described configuration, it is possible to suppress the stress applied to the piezoelectric vibrator by suppressing the spreading of the conductive adhesive at the mount portion during bonding with the conductive adhesive.

Application Example 9 The lead electrode on the mounting surface side of the mount part of the piezoelectric vibrating piece according to any one of Application Examples 1 to 8 and the substrate are connected by a conductive adhesive, and the mount part A piezoelectric vibrator comprising an extraction electrode on the opposite surface and the substrate connected via a wire.
With the above configuration, the influence of the stress generated in the mount portion on the vibration portion is mitigated, and the piezoelectric vibrator having good frequency characteristics and the like is obtained. In particular, by using Application Example 7 together, a piezoelectric vibrator with a reduced height can be constructed.

Application Example 10 The lead electrode on the mounting surface side of the mount part of the piezoelectric vibrating piece according to any one of Application Examples 1 to 8 and the substrate are connected by a conductive adhesive, and the mount part An electronic device comprising: an extraction electrode on the opposite surface side and the substrate connected via a wire, and comprising at least one electronic component.
With the above configuration, the influence of the stress generated in the mount portion on the vibration portion is alleviated, and the electronic device has good frequency characteristics and the like. In particular, by using Application Example 7, an electronic device with a reduced height can be constructed.

Application Example 11 In the electronic device according to Application Example 10, the electronic component is any one of a thermistor, a capacitor, a reactance element, and a semiconductor element.
With the above configuration, an electronic device using the piezoelectric vibrating piece as an oscillation source can be constructed.

FIG. 1A is a schematic diagram of a piezoelectric vibrator according to a first embodiment, FIG. 1A is a schematic cross-sectional view, FIG. 1B is a top view, and FIG. 1C is a diagram of a piezoelectric vibrating piece constituting the piezoelectric vibrator. It is a bottom view. FIG. 2A is a schematic diagram of a modification of the piezoelectric vibrator according to the first embodiment, FIG. 2A is a schematic cross-sectional view, FIG. 2B is a top view, and FIG. 2C is a piezoelectric constituting the piezoelectric vibrator. It is a bottom view of a modification of the resonator element. It is a schematic diagram which shows the Euler angle (crystal orientation) of a piezoelectric vibrating piece. FIG. 4C is a detailed view (No. 1) of a portion surrounded by a dashed line in FIG. 1C, FIG. 4A is a bottom view, and FIG. 4B is a cross-sectional view taken along line AA ′ in FIG. FIG. FIG. 5 is a detailed view (part 2) of the part surrounded by the one-dot chain line in FIG. 1C, FIG. 5A is a bottom view, and FIG. 5B is a cross-sectional view taken along the line AA ′ in FIG. FIG. FIGS. 6A and 6B are detailed views (part 3) of a portion surrounded by a one-dot chain line in FIG. 1C, FIG. 6A is a bottom view, and FIG. 6B is a cross-sectional view taken along line AA ′ in FIG. FIG. FIG. 7A is a schematic diagram of a piezoelectric vibrator according to a second embodiment, FIG. 7A is a schematic cross-sectional view, FIG. 7B is a top view, and FIG. 7C is a diagram of a piezoelectric vibrating piece constituting the piezoelectric vibrator. It is a bottom view. FIG. 8A is a schematic diagram of a piezoelectric vibrator according to a third embodiment, FIG. 8A is a schematic cross-sectional view, FIG. 8B is a top view, and FIG. 8C is a diagram of a piezoelectric vibrating piece constituting the piezoelectric vibrator. It is a bottom view. FIGS. 9A and 9B are schematic views of an electronic device (part 1) using the piezoelectric vibrating piece of the present embodiment, FIG. 9A is a schematic cross-sectional view, and FIG. 9B is a top view. It is a schematic diagram of the electronic device (the 2) using the piezoelectric vibrating piece of this embodiment, Fig.10 (a) is a cross-sectional schematic diagram, FIG.10 (b) is a top view. It is a schematic diagram of the electronic device (the 3) using the piezoelectric vibrating piece of this embodiment, Fig.11 (a) is a cross-sectional schematic diagram, FIG.11 (b) is a top view. FIG. 12A is a schematic diagram of a piezoelectric vibrator according to Patent Document 1. FIG. 12A is a top view of a piezoelectric vibration element that constitutes the piezoelectric vibrator, and FIG. 12B is a bottom face of the piezoelectric vibration element that constitutes the piezoelectric vibrator. FIG. 12C is a top view of the piezoelectric vibrator in which the piezoelectric vibration element is mounted inside the container, and FIG. 12D is a cross-sectional view taken along the line AA ′ in FIG. FIG. 13A is a schematic diagram of a piezoelectric vibrator according to Patent Document 2, FIG. 13A is a schematic cross-sectional view, and FIG. 13B is a top view.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the components, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely illustrative examples and not intended to limit the scope of the present invention only unless otherwise specified. .

  FIG. 1 is a schematic diagram of a piezoelectric vibrator according to the first embodiment, FIG. 1A is a schematic sectional view, FIG. 1B is a top view, and FIG. 1C is a piezoelectric vibrator. The bottom view of a piezoelectric vibrating piece is shown. FIG. 2 is a schematic diagram of a modification of the piezoelectric vibrator according to the first embodiment. FIG. 2 (a) is a schematic cross-sectional view, FIG. 2 (b) is a top view, and FIG. 2 (c) is a piezoelectric vibration. The bottom view of the modification of the piezoelectric vibrating piece which comprises a child is shown. In the following description and drawings, the X ′ axis, the Y ′ axis, and the Z ″ axis are orthogonal to each other.

  The piezoelectric vibrator 100 according to the first embodiment is formed of a base substrate 48, a ring portion 58, a lid 60, and the piezoelectric vibrating piece 10. The base substrate 48 and the ring portion 58 are formed of an insulator. The base substrate 48 has, for example, a rectangular shape in plan view. Similarly, the ring portion 58 has a rectangular shape in plan view, and can accommodate the piezoelectric vibrating piece 10 in a space formed by the inner wall thereof. A ring portion is connected to the periphery of the base substrate 48. As a result, a recess for accommodating the piezoelectric vibrating piece 10 is formed by the base substrate 48 and the ring portion 58. Then, in a state where the internal space 62 where the recess is formed is evacuated and the piezoelectric vibrating piece 10 is disposed therein, the opening of the recess is sealed with a lid 60 formed of metal or the like.

  Connection electrodes 50 and 52 that are electrically connected to the piezoelectric vibrating piece 10 are disposed on the base substrate 48. Furthermore, external electrodes 54 and 56 are disposed on the bottom surface of the base substrate 48, and the external electrode 54 is electrically connected to the connection electrode 50 through the through electrode 64, and the external electrode 56 is connected through the through electrode 66. It is electrically connected to the electrode 52.

  The piezoelectric vibrating piece 10 is accommodated in the internal space 62. The lead electrode 34 disposed on the base substrate 48 side (the mounting surface 12 side described later) of the mounting portion 20 described later of the piezoelectric vibrating piece 10 is connected to the connection electrode 50 via the conductive adhesive 38 and mounted. The extraction electrode 36 disposed on the lid 60 side (opposite surface 14 side described later) of the unit 20 is connected to the connection electrode 52 via a wire 40 such as Au. Therefore, the piezoelectric vibrating piece 10 is supported at one point by the conductive adhesive 38 in the mount portion 20 and fixed on the base substrate 48 in a cantilevered support state with the mount portion 20 as a fixed end. The extraction electrode 34 is connected to the excitation electrode 30, and the extraction electrode 36 is connected to the excitation electrode 32. Therefore, the excitation electrode 30 is connected to the external electrode 54 via the extraction electrode 34, the conductive adhesive 38, the connection electrode 50, and the through electrode 64, and the excitation electrode 32 is the extraction electrode 36, the wire 40, the connection electrode 52, and the through electrode. It is connected to the external electrode 56 through 66. Therefore, by applying an AC voltage to the external electrodes 54 and 56, the piezoelectric vibrating piece 10 oscillates thickness shear vibration at a predetermined resonance frequency.

  FIG. 3 shows the Euler angle (crystal orientation) of the piezoelectric vibrating piece 10. As shown in FIG. 3, the piezoelectric vibrating piece 10 according to the present embodiment includes, as the piezoelectric substrate 11, an X axis as an electric axis, a Y axis as a mechanical axis, and an optical axis as a crystal axis of crystal. An axis obtained by inclining the Z axis in the −Y direction (about 35 ° 15 ′) of the Y axis with respect to the X axis of the orthogonal coordinate system composed of the Z axis and the Y axis is the Z ′ axis, and the Y axis is the An AT-cut quartz crystal substrate 11a is used, which is composed of a plane parallel to the X-axis and the Z'-axis, with the axis tilted in the + Z direction of the Z-axis as the Y'-axis and the thickness parallel to the Y'-axis. is doing.

  Here, Non-Patent Document 1 describes the stress sensitivity related to the AT-cut quartz base plate. In the AT-cut quartz substrate 11a, the X-axis is about the Y'-axis and the direction is from the -X-axis to the -Z'-axis. It is described that the stress sensitivity is most dull in the direction of the Z ″ axis obtained by rotating the Z ′ axis by rotating it by 60 ° or 120 °.

  Therefore, in the piezoelectric vibrating piece 10 of this embodiment, in the AT-cut quartz crystal substrate 11a, rotating the + Z ′ axis around the Y ′ axis in the + X axis direction is a positive rotation angle, and the Z ′ axis is the Y ′ axis. The direction parallel to the Z ″ axis obtained by rotating around the angle ψ (−120 ° to + 60 °) is the long side (edge), and the X axis is rotated around the Y ′ axis together with the Z ′ axis. A piezoelectric substrate 11 having a rectangular shape with a short side (edge) in a direction parallel to the X ′ axis is obtained. That is, the piezoelectric substrate 11 that forms the outer shape of the piezoelectric vibrating piece 10 is obtained by rotating the in-plane orientation of the AT-cut quartz substrate 11 a by an angle ψ.

  Then, using the piezoelectric substrate 11 described above, the piezoelectric vibrating piece 10 having a rectangular shape with the short side direction as the X′-axis direction and the long side direction as the Z′-axis direction is formed, and the −Y′-axis side Is the mounting surface 12 facing the base substrate 48, and the + Y′-axis side surface is the opposite surface 14 of the mounting surface 12. In the piezoelectric vibrating piece 10 of this embodiment, the mount portion 20, the buffer portion 22, and the thick portion 16 are arranged in the order of the + Z ″ axis.

  The thick portion 16 is disposed on the + Z ″ axis side of the piezoelectric vibrating piece 10. At the center of the main surface on the −Y′-axis side of the thick wall portion 16, a first recessed portion 17 </ b> A that is recessed in the + Y′-axis direction on the main surface on the −Y′-axis side is disposed. In addition, a second recessed portion 17B that is recessed in the −Y′-axis direction on the + Y′-axis main surface is located at a position opposite to the first recessed portion 17A on the + Y′-axis-side main surface of the thick portion 16. Has been placed. Therefore, in the central part of the thick part 16, the bottom part 17 </ b> Aa of the first concave part 17 </ b> A and the bottom part 17 </ b> Ba of the second concave part 17 </ b> B are respectively main surfaces and are formed thinner than the thickness of the thick part 16. A thin portion 18 is disposed.

  Since the thin portion 18 is formed by the first concave portion 17A and the second concave portion 17B, the thin portion 18 has a step with the thick portion 16 in the thickness direction of the thick portion 16 on both sides thereof. The first recessed portion 17A is recessed deeper than the second recessed portion 17B. As a result, the thin portion 18 is unevenly arranged in the thickness direction (Y′-axis direction) of the thick portion 16 on the opposite surface 14 side surface (+ Y′-axis side surface) of the thick portion 16. Become. The thin portion 18 is preferably formed by etching in order to reduce the roughness of the surface of the thin portion 18. When formed by etching, an inclined surface 18 a inclined with respect to the surface of the thin portion 18 is formed on the periphery of the thin portion 18 due to the anisotropy of quartz.

  An excitation electrode 30 is disposed on the mounting surface side of the thin portion 18, and an excitation electrode 32 is disposed on the opposite surface 14 side. By the excitation electrode 30 and the excitation electrode 32, a vibration portion that is a region where thickness shear vibration is generated in the thin portion 18 is formed.

  The mount portion 20 is disposed on the −Z ″ axis side of the piezoelectric vibrating piece 10, and a pad electrode 34 a electrically connected via the excitation electrode 30 and the extraction electrode 34 is disposed on the mounting surface 12 side of the mount portion 20. A pad electrode 36 a that is electrically connected via the excitation electrode 32 and the extraction electrode 36 is disposed on the opposite surface 14 side of the mount portion 20. The pad electrode 34a is connected to the connection electrode 50 of the base substrate 48 via the conductive adhesive 38, and the pad electrode 36a is connected to the connection electrode 52 of the base substrate 48 via the wire 40 such as Au.

  The buffer portion 22 is disposed between the mount portion 20 and the thick portion 16. The buffer portion 22 is provided with a slit 24 whose longitudinal direction is the X′-axis direction. The slit 24 is formed as a through-hole penetrating the piezoelectric vibrating piece 10 from the Y′-axis direction with the X′-axis direction being the longitudinal direction. As a result, connecting portions 28 for connecting the mount portion 20 and the thick portion 16 are formed at both ends of the buffer portion 22 in the X′-axis direction. The connecting portion 28 is provided with the extraction electrode 34 and the extraction electrode 36 described above.

  As described above, the piezoelectric vibrating piece 10 is supported at one point by the conductive adhesive 38. In this case, in the piezoelectric vibrating piece 10, the piezoelectric vibrating piece 10 is centered on the connection position of the piezoelectric vibrating piece 10 and the conductive adhesive 38 due to the difference in thermal expansion coefficient between the conductive adhesive 38 and the piezoelectric vibrating piece 10. On the other hand, a stress is generated that concentrically expands and contracts. This stress is dominated by a component that propagates on the surface of the piezoelectric vibrating piece 10.

  However, with the above-described configuration, the length of the path that propagates from the mount portion 20 through the surface of the piezoelectric vibrating piece 10 and transmits to both surfaces of the vibrating portion (excitation electrode 30 and excitation electrode 32) is formed by the thin portion 18 described above. Therefore, the stress reaching the vibration part can be relaxed. Also, since the stress path is bent twice by the step, the stress is relaxed more effectively than the case where the stress is relaxed while propagating on the flat plate surface. Can be made. Furthermore, since the buffer part 22 is provided with the slit 24, most of the path of the stress propagating on the surface of the piezoelectric vibrating piece 10 to the vibration part side can be blocked. Accordingly, with the above configuration, the influence of the stress generated in the mount portion 20 on the vibration portion is mitigated, and the piezoelectric vibration piece 10 having excellent frequency characteristics and the like is obtained.

  Further, as described above, the thin wall portion 18 is unevenly arranged on the opposite surface 14 side of the thick wall portion 16 in the thickness direction (Y′-axis direction) of the thick wall portion 16. Thus, even if the conductive adhesive 38 is applied to the mounting surface 12 side of the mount portion 20 of the piezoelectric vibrating piece 10, from the connection position of the conductive adhesive 38 to the vibration portion (excitation electrode 30) on the mounting surface 12 side. Therefore, the stress generated at the connection position and transmitted to the vibration part (excitation electrode 30) can be relaxed.

  Further, in the present embodiment, due to the research result shown in Non-Patent Document 1, the stress sensitivity to the stress propagating in the Z ″ axis direction of the piezoelectric vibrating piece 10 is reduced. Therefore, as described above, by setting the long side of the piezoelectric vibrating piece 10 in the Z′-axis direction and the short side in the X′-axis direction, the component that propagates to the vibrating part out of the stress generated in the mount part 20 can be obtained. Can be reduced. Therefore, the piezoelectric vibrating piece 10 (piezoelectric vibrator 100) in which the influence of stress on the vibrating portion is reduced is obtained.

  In the present embodiment, a groove 26 having a longitudinal direction in the X′-axis direction may be formed instead of the slit 24 as shown in FIG. When the groove 26 is formed in the buffer portion 22 in this way, the stress propagated to the vibration portion (excitation electrode 30) on the mounting surface 12 side is caused by the −X axis side surface 26a, the bottom surface 26b, and the + X of the groove 26 of the groove 26. Since the path passes in the order of the axial side surface 26c, the path becomes longer and the path is bent four times by the groove 26, so that the stress transmitted to the vibrating portion (excitation electrode 30) can be relaxed.

  4A and 4B are detailed views (No. 1) of a portion surrounded by an alternate long and short dash line in FIG. 1C, FIG. 4A is a bottom view, and FIG. 4B is an A- in FIG. A 'line sectional drawing is shown. FIG. 5 is a detailed view (No. 2) of the portion surrounded by the one-dot chain line in FIG. 1 (c), FIG. 5 (a) is a bottom view, and FIG. 5 (b) is A in FIG. 5 (a). -A 'sectional view taken on the line is shown. Further, FIG. 6 shows a detailed view (No. 3) of the portion surrounded by the one-dot chain line in FIG. 1 (c), FIG. 6 (a) is a bottom view, and FIG. 6 (b) is a view in FIG. 6 (a). AA 'line sectional drawing is shown.

  4, 5, and 6 are detailed views of the connecting portion of the extraction electrode 34 formed on the mounting surface 12 side of the mount portion 20 and the conductive adhesive 38 on the mounting surface 12 side of the mount portion 20. ing. In FIG. 4, a plurality of small circular recesses 42 are formed on the mounting surface 12 side of the mount portion 20, and the extraction electrode 34 is formed so as to cover the mounting surface 12 side of the mount portion 20 and the side surfaces and bottom surface of the recess 42. Yes. In FIG. 5, one large circular recess 44 is formed on the mounting surface 12 side of the mount portion 20, and the extraction electrode 34 is formed so as to cover the mounting surface 12 side of the mount portion 20 and the side surfaces and bottom surface of the recess 44. Yes. In FIG. 6, one large ring-shaped recess 46 is formed on the mounting surface 12 side of the mount portion 20, and the extraction electrode 34 is formed so as to cover the mounting surface 12 side of the mount portion 20 and the side surfaces and bottom surface of the recess 46. ing.

  Thus, by forming the concave portion 42, the concave portion 44, and the concave portion 46 on the mounting surface 12 side of the mount portion 20, the concave portions 42, 44, 46 serve as an adhesive reservoir for the conductive adhesive 38, and the conductive adhesive 38 Can be prevented from spreading over the entire mount 20. As a result, the stress applied to the piezoelectric vibrating piece 10 by the conductive adhesive 38 can be reduced.

  The outer shape of the piezoelectric vibrating piece 10 of this embodiment can be formed by photolithography / etching. In this case, the piezoelectric vibrating piece 10 forms the outer shape of the piezoelectric vibrating piece 10, the step of forming the slit 24, the step of digging the mounting surface 12 side of the thin portion 18, and the opposite surface 14 side of the thin portion 18. A separate process is required. Then, the piezoelectric vibrating piece 10 is formed through a process of forming the excitation electrodes 30 and 32, the extraction electrodes 34 and 36, and the pad electrodes 34a and 36a. Moreover, the slit 24, the groove | channel 26, and the recessed parts 42, 44, and 46 can be formed by sandblasting. The slit 24 can also be formed by photolithography / etching. In this case, a step of forming the slit 24 is necessary in addition to the above-described steps. The groove 26 can also be formed by photolithography / etching. In this case, if the depth of the groove 26 is the same as the depth of digging the mounting surface 12 side of the thin portion 18, the groove 26 can be formed simultaneously with the step of digging the mounting surface 12 side of the thin portion 18.

  FIG. 7 shows a piezoelectric vibrator according to the second embodiment, FIG. 7A shows a schematic cross-sectional view, FIG. 7B shows a top view, and FIG. 7C shows a piezoelectric element constituting the piezoelectric vibrator. The bottom view of a vibration piece is shown. The piezoelectric vibrator 120 of the second embodiment is basically the same as that of the first embodiment, but the opposite surface 14 side of the mount portion 72 of the piezoelectric vibrating piece 70 constituting the piezoelectric vibrator 120 is the same as the mount portion 72. The difference is that a stepped portion 74 is formed by being cut out in the thickness direction. The extraction electrode 36 disposed on the opposite surface 14 side of the mount portion 72 is different in that it is disposed on the stepped portion 74.

  As described above, the conductive adhesive 38 is applied to the mounting surface 12 of the piezoelectric vibrating piece 70 of the mount portion 72. The stress caused by the conductive adhesive 38 propagates through the end surface of the piezoelectric vibrating piece 70 to the opposite surface 14 side of the mount portion 72 and is disposed on the opposite surface 14 side of the piezoelectric vibrating piece 70 ( Propagates to the excitation electrode 32) side. Accordingly, in the above-described configuration, the path of the stress propagating to the above-described vibration part can be bent by the stepped portion 74, so that the stress can be effectively relieved at the bending position.

  Further, the extraction electrode 36 disposed on the opposite surface 14 of the piezoelectric vibrating piece 70 is electrically connected to the base substrate 48 side via the wire 40. Therefore, in the above configuration, since the extraction electrode 36 is formed in the stepped portion 74, the height with respect to the base substrate 48 at the connection position between the extraction electrode 36 and the wire 40 can be reduced. The height of the piezoelectric vibrator 120 using 70 can be reduced. Note that the stepped portion 74 can be formed by sandblasting. Further, if the depth of the stepped portion 74 is the same as the depth of the recessed portion 14 on the opposite surface 14 side of the thin portion 18, the stepped portion 74 is formed in the photolithographic etching process on the opposite surface 14 side of the thin portion 18. They can be formed simultaneously.

  FIG. 8 shows a piezoelectric vibrator according to the third embodiment, FIG. 8A is a schematic sectional view, FIG. 8B is a top view, and FIG. 8C is a piezoelectric vibrating piece constituting the piezoelectric vibrator. A bottom view of 80 is shown. The piezoelectric vibrator 140 according to the third embodiment is basically similar to the first embodiment and the second embodiment, but in the piezoelectric vibrating piece 80 constituting the piezoelectric vibrator 140, the mount portion of the thick portion 82. 72, the portion sandwiching the vibrating portion (thin wall portion 84), that is, the + Z ″ axis side portion from the thin wall portion 84 of the thick wall portion 82 is cut away, and the + Z ″ axis side end portion of the thin wall portion 84 is exposed. Is different. With such a configuration, the length in the Z ″ axis direction of the piezoelectric vibrating piece 80 can be shortened without sacrificing the vibration part itself. In FIG. 8, the portions indicated by broken lines indicate the + Z ″ axis side ends of the piezoelectric vibrating piece 10 of the first embodiment and the piezoelectric vibrating piece 70 of the second embodiment.

  As a result, when a plurality of piezoelectric vibrating pieces 80 are cut out from the wafer, the area occupied by the wafer per piezoelectric vibrating piece 80 relative to the wafer can be reduced. Therefore, the number of piezoelectric vibrating pieces 80 that can be cut out from the wafer can be increased, and the cost of the piezoelectric vibrating piece 80 can be suppressed.

  FIG. 9 shows an electronic device (part 1) using the piezoelectric vibrating piece of the present embodiment, FIG. 9A is a schematic cross-sectional view, and FIG. 9B is a top view. The electronic device 300 according to this embodiment includes a package 302 (substrate), an integrated circuit (IC 310) that drives a piezoelectric vibrating piece 70 (which may be the piezoelectric vibrating pieces 10 and 80), and a lid 312.

  The package 302 is formed in a three-layer structure as indicated by a broken line in FIG. An external electrode 314 is formed on the lower surface of the package 302. A plurality of connection electrodes 316 are arranged in the lower step 306 of the recess 304 of the package 302. A plurality of connection electrodes 316 are formed so as to face the plurality of pad electrodes 320 formed on the IC 310, and each connection electrode 316 is connected to the corresponding pad electrode 320. In addition, a connection electrode 318 that is connected to the pad electrodes 34 a and 36 a of the piezoelectric vibrating piece 70 via the conductive adhesive 38 is formed on the upper step 308 of the recess 304 of the package 302.

  As described above, the connection electrode 316 formed in the lower step 306 of the recess 304 of the package 302 is connected to the pad electrode 320, but the connection electrode 318 is electrically connected to the external electrode 314. There is something to connect. Therefore, the IC 310 is electrically connected to the outside via the connection electrode 316 and the external electrode 314, and the pad electrodes 34 a and 36 a of the piezoelectric vibrating piece 70 are electrically connected to the IC 310 via the connection electrode 318 and the connection electrode 316. . Therefore, the IC 310 can drive the piezoelectric vibrating piece 70 when electric power is supplied via the external electrode 314. The electronic device 300 of this embodiment has a structure in which the piezoelectric vibrating piece 70 and the IC 310 are both sealed by a lid 312 in the recess 304 with a single seal. With the above configuration, the electronic device 300 in which the stress on the vibrating portion of the piezoelectric vibrating piece 70 is relaxed is obtained.

  FIG. 10 shows an electronic device (part 2) using the piezoelectric vibrating piece of the present embodiment, FIG. 10 (a) is a schematic sectional view, and FIG. 10 (b) is a top view. In FIG. 10, concave portions 404 and 406 are formed on both surfaces of a package 402 (substrate), and a piezoelectric vibrating piece 70 (the piezoelectric vibrating pieces 10 and 80 may be used) is mounted on one concave portion 404 and sealed with a lid 408. The other concave portion 406 is an electronic device 400 having a configuration in which an integrated circuit (IC416) is attached. An external electrode 410 is formed at the lower end of the package 402, and the recess 406 is electrically connected to the connection electrodes 420 and 421 disposed in the external electrode 410 or the recess 404, and the pad of the IC 416 through the wire 414. A connection electrode 412 that is electrically connected to the electrode 418 is provided.

  On the other hand, the connection electrode 420 disposed in the recess 404 is connected to the extraction electrode 34 of the piezoelectric vibrating piece 70 via the conductive adhesive 38, and the connection electrode 421 disposed in the recess 404 is also connected to the extraction electrode 36 and the wire. 40. Therefore, the piezoelectric vibrating piece 70 is connected to the package 402 in a cantilevered state with the mount portion 72 as a fixed end. By isolating the piezoelectric vibrating piece 70 and the IC 416 in this manner, the influence of heat from the IC 416 of the piezoelectric vibrating piece 70 can be reduced.

  FIG. 11 shows an electronic device (part 3) using the piezoelectric vibrating piece of the present embodiment, FIG. 11 (a) is a schematic cross-sectional view of FIG. 5, and FIG. 11 (b) is a top view. In FIG. 11, the electronic device 500 is formed using the piezoelectric vibrator 120 (which may be the piezoelectric vibrators 100 and 140) shown in FIG. That is, an electrode sphere 512 that is electrically connected to the IC 504 (pad electrode 506) is disposed on a substrate 502 on which an integrated circuit (IC 504) that drives the piezoelectric vibrator 120 is mounted. I support it. Then, the electrode sphere 512 and the external electrodes 54, 56, and 57 of the piezoelectric vibrator 120 are electrically connected, and the substrate 502, the IC 504, the electrode sphere 512, and the piezoelectric vibrator 120 are integrally formed with a molding agent 516 such as a resin. ing. Here, an external electrode 510 is formed on the lower surface of the substrate 502, and a plurality of connection electrodes 508 are formed on the upper surface of the substrate 502, some of which are electrically connected to the external electrode 510 via the through electrodes 518. Has been. A part of the pad electrode 506 formed on the IC 504 is connected to the electrode sphere 512 via the wire 514, and the rest is connected to the connection electrode 508 via the wire 514.

  With the above-described configuration, the electronic device 500 can be formed by arranging the substrate 502, the IC 504, the electrode sphere 512, and the like corresponding to the standard of the existing piezoelectric vibrator 120, so that the cost can be suppressed. . In any of the embodiments, the connection between the IC and each electrode may use a face-down bonding method. In any embodiment of the piezoelectric vibrator and electronic device, the piezoelectric vibrating piece of any of the above-described embodiments can be applied.

  In the above-described electronic device, the piezoelectric vibrator is described as having a configuration including an electronic component typified by a semiconductor element (IC). However, it is preferable to include at least one electronic component. As the electronic component, a thermistor, a capacitor, a reactance element or the like can be applied, and an electronic device using a piezoelectric vibrating piece as an oscillation source can be constructed.

10 ......... Piezoelectric vibrator, 11 ......... Piezoelectric substrate, 11a ......... AT-cut quartz substrate, 12 ......... Mounting surface, 14 ...... Opposite surface, 16 ......... Thick part, 17A ......... First concave portion, 17Aa ......... Bottom portion, 17B ......... Second concave portion, 17Ba ......... Bottom portion, 18 ......... Thin portion, 18a ......... Inclined surface, 20 ......... Mount portion, 22 ......... Buffering part, 24 ......... Slit, 26 ......... Groove, 26a ......... Side, 26b ......... Bottom, 26c ......... Side, 28 ......... Connecting part, 30 ......... Excitation electrode, 32 ......... Excitation electrode, 34 ......... Extraction electrode, 34a ......... Pad electrode, 36 ......... Extraction electrode, 36a ......... Pad electrode, 38 ......... Conductive adhesive, 40 ......... Wire, 42 ......... concave, 44 ......... concave, 46 ......... concave, 48 ......... base substrate, 50 ......... connection electrode, 2 ... Connection electrode, 54 ... External electrode, 56 ... External electrode, 58 ... Ring portion, 60 ... Lid, 62 ... Internal space, 64 ... Penetration electrode, 66 ... ... Penetration electrode, 70 ......... Piezoelectric vibrating piece, 72 ......... Mounting part, 74 ......... Step part, 80 ......... Piezoelectric vibrating piece, 82 ......... Thick part, 84 ......... Thin part, 100 ......... Piezoelectric vibrator, 120 ......... Piezoelectric vibrator, 140 ......... Piezoelectric vibrator, 300 ......... Electronic device, 302 ...... Package, 304 ......... Recess, 306 ......... Lower stage, 308 ......... Upper part, 310 ......... IC, 312 ......... Lid, 314 ......... External electrode, 316 ...... Connection electrode, 318 ......... Connection electrode, 319 ...... Connection electrode, 320 ... ... Pad electrode, 322 ......... Adhesive, 400 ...... Electronic device, 402 ...... Package 404 ......... Recess, 406 ......... Recess, 408 ......... Lid, 410 ......... External electrode, 412 ......... Connection electrode, 414 ......... Wire, 416 ...... IC, 418 ......... Pad electrode 420... Connection electrode 421... Connection electrode 500... Electronic device 502... Substrate 504 IC IC 506 Pad electrode 508 Connection electrode 510 ......... External electrode, 512 ......... Electrode sphere, 514 ......... Wire, 516 ......... Molding agent, 518 ......... Penetration electrode, 600 ......... Piezoelectric vibration element, 602 ......... Supporting part, 604 ......... vibrating part, 606A ......... excitation electrode, 606B ......... excitation electrode, 608A ...... input / output terminal part, 608B ......... input / output terminal part, 610 ......... slit, 612 ......... container, 614 ......... bottom, 6 16 ......... Adhesive, 700 ......... Piezoelectric vibrator, 702 ......... Piezoelectric vibrating element, 704 ......... Excitation electrode, 706 ......... Excitation electrode, 708 ...... Extraction electrode, 710 ...... Extraction electrode 712 ... Conductive adhesive, 714 ... Wire, 716 ... Substrate.

Claims (11)

A first recessed portion recessed from one principal surface of the piezoelectric substrate toward the other principal surface opposite to the principal surface;
A vibrating portion disposed at the bottom of the first recessed portion;
A piezoelectric vibrating piece provided with a thick portion that is integrally connected to the outer peripheral edge of the vibrating portion and is thicker than the thickness of the vibrating portion,
The mount is connected to the thick part and supported at one point on the substrate,
Providing a second recessed portion recessed from the other main surface of the piezoelectric substrate toward the bottom of the first recessed portion;
The vibrating portion is configured by a bottom portion of the first and second recessed portions,
At the boundary between the vibrating part and the thick part,
Both piezoelectric surfaces of the piezoelectric substrate have a step in the thickness direction of the thick portion. A buffer part is disposed between the thick part and the mount part,
The buffer portion is
A slit that penetrates in the thickness direction of the thick part, with the mount part, the buffer part, and the direction perpendicular to the arrangement direction of the thick part as the longitudinal direction,
The piezoelectric vibrating piece according to claim 1, further comprising a groove dug in a main surface of the piezoelectric substrate facing the substrate, the longitudinal direction being the orthogonal direction.   3. The piezoelectric device according to claim 1, wherein the thin-walled portion is arranged to be unevenly distributed on one of the main surfaces of the piezoelectric substrate in the thickness direction of the thick-walled portion. Vibrating piece. The piezoelectric vibrating piece is
A crystal axis of quartz, an X-axis as an electric axis, a Y-axis as a mechanical axis, and a Z-axis as an optical axis, the X-axis of a Cartesian coordinate system as a rotation axis, and the Z-axis as the rotation axis An axis rotated in the −Y direction of the Y axis is a Z ′ axis, an axis rotated in the + Z direction of the Z axis is a Y ′ axis, and a plane parallel to the X axis and the Z ′ axis Formed by an AT-cut quartz having a thickness parallel to the Y ′ axis,
Z obtained by rotating the + Z ′ axis around the Y ′ axis in the + X axis direction as a positive rotation angle and rotating the Z ′ axis around the Y ′ axis in a range of −120 ° to + 60 °. Each having an edge parallel to the ″ axis and the X ′ axis obtained by rotating the X axis around the Y ′ axis together with the Z ′ axis,
The width direction of the mount portion is a direction of an edge parallel to the X ′ axis,
4. The piezoelectric vibrating piece according to claim 1, wherein a direction in which the thick portion and the mount portion are arranged is a direction of an edge parallel to the Z ″ axis.   5. The piezoelectric device according to claim 1, wherein a side of the thick-walled portion sandwiching the vibration portion together with the mount portion is cut out, and an end portion of the thin-walled portion is exposed. Vibrating piece.   6. The piezoelectric vibrating piece according to claim 1, wherein the opposite surface side of the mount portion is cut out in a thickness direction of the mount portion to form a stepped portion. An excitation electrode disposed on both surfaces of the thin portion and forming the vibrating portion;
An extraction electrode extracted from the excitation electrode and disposed on the mounting surface side and the opposite surface side of the mount part, and
The piezoelectric vibrating piece according to claim 6, wherein the extraction electrode disposed on the opposite surface side of the mount portion is disposed in the stepped portion.   The one or a plurality of concave portions are formed at a position where the extraction electrode on the main surface side facing the substrate of the mount portion is formed. Piezoelectric vibrating piece.   The lead electrode on the mounting surface side of the mount portion of the piezoelectric vibrating piece according to any one of claims 1 to 8 and the substrate are connected by a conductive adhesive, and the lead portion on the opposite surface side of the mount portion is pulled out. A piezoelectric vibrator characterized in that an electrode and the substrate are connected via a wire.   The lead electrode on the mounting surface side of the mount portion of the piezoelectric vibrating piece according to any one of claims 1 to 8 and the substrate are connected by a conductive adhesive, and the lead portion on the opposite surface side of the mount portion is pulled out. An electronic device comprising an electrode and the substrate connected via a wire and including at least one electronic component.   The electronic device according to claim 10, wherein the electronic component is one of a thermistor, a capacitor, a reactance element, and a semiconductor element.

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