JP2012169608A - Prepreg continuum and prepreg - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a prepreg continuum advantageous for downsizing when performing, for example, storage etc., and to provide a prepreg manufactured from the prepreg continuum.SOLUTION: A prepreg continuum 40 comprises: a fiber base material 2 with the shape of a long and thin sheet; a first resin layer 3 formed on one surface of the fiber base material 2; and a second resin layer 4 formed on the other surface of the fiber base material 2. A prepreg is formed by cutting the prepreg continuum in the middle of a longitudinal direction thereof. A plurality of deletion parts 401 lacking a part of the first resin layer 3 and a part of the second resin layer 4 over respective width directions are formed in the middle of the longitudinal direction of the prepreg continuum 40.

Description

  The present invention relates to a prepreg continuous body and a prepreg.

  In recent years, in order to reduce the size and thickness of electronic components and electronic devices, it has been required to reduce the size and thickness of circuit boards used therefor. In order to meet this requirement, a circuit board having a multilayer structure is used and each layer is thinned.

  The circuit board having a multilayer structure includes, for example, a thin fiber substrate, a first resin layer laminated on one surface of the fiber substrate, and a second resin layer laminated on the other surface of the fiber substrate. A prepreg provided with a resin layer is used. And in order to manufacture a prepreg, the apparatus by which a fiber base material, a 1st resin layer, and a 2nd resin layer are supplied separately is used (for example, refer patent document 1). In this apparatus, a fiber base material, a first resin layer, and a second resin layer that are superposed are pressed between a pair of rollers, and the first base material layer and the second resin layer are pressed against the fiber base material. Each of the resin layers is pressure-bonded to produce a prepreg. The manufactured prepreg has a belt shape and is cut into a predetermined length before use. In addition, this prepreg which makes | forms this strip | belt shape is normally wound in the shape of a roll (spiral shape), and is stored in the state miniaturized as much as possible.

  However, the prepreg described in Patent Document 1 may be difficult to wind in a roll shape depending on, for example, the thickness and composition of each resin layer. In this case, when the prepreg is forcibly wound, for example, the first resin layer or the second resin layer may be peeled off from the fiber base material or may be damaged.

International Publication No. 2007/063960 Pamphlet

  An object of the present invention is to provide a prepreg continuous body that is advantageous for downsizing, for example, in storage and the like, and a prepreg manufactured from the prepreg continuous body.

Such an object is achieved by the present inventions (1) to (15) below.
(1) A prepreg continuous body comprising a fibrous base material having a long thin plate shape, and a resin layer formed on one side or both sides of the fibrous base material and configured with a resin composition,
In the middle of the longitudinal direction of the prepreg continuous body, a prepreg continuous body is characterized in that at least one defect portion in which a part of the resin layer is lost in the width direction is formed.

  (2) The prepreg continuous body according to (1), wherein a plurality of the defect portions are formed at equal intervals along the longitudinal direction of the prepreg continuous body.

  (3) The prepreg continuous body according to (1) or (2), which is bent at the defect portion.

(4) A plurality of the defect portions are formed,
The prepreg continuous body according to the above (3), wherein when the respective defect portions are bent, the bending directions thereof are opposite to each other between the adjacent defect portions.

(5) The resin layer is formed on both surfaces of the fiber base material,
The prepreg continuous body according to any one of (1) to (4), wherein the defect portion is formed in at least one of the two resin layers.

(6) The resin layers are respectively formed on both surfaces of the fiber base material, and one resin layer has a larger thickness than the other resin layer,
The prepreg continuous body according to any one of (1) to (5), wherein the defect portion is formed in the one resin layer.

(7) The resin layers are respectively formed on both sides of the fiber base material, and one resin layer is harder than the other resin layer,
The prepreg continuous body according to any one of (1) to (6), wherein the defect portion is formed in the one resin layer.

  (8) The prepreg continuous body according to any one of (1) to (7), wherein a length of the defect portion along a longitudinal direction of the prepreg continuous body is equal to or greater than a total thickness of the prepreg continuous body.

  (9) The prepreg continuous body according to any one of (1) to (8), wherein the fiber base material is exposed from the defect portion.

  (10) The prepreg continuous body according to any one of (1) to (9), wherein the fiber base material is impregnated with the resin composition from the resin layer at least in part in the thickness direction. .

  (11) The prepreg continuous body according to any one of (1) to (10), wherein the defect portion functions as a cutting portion when cutting the prepreg continuous body.

  (12) The prepreg continuous body according to any one of the above (1) to (11), wherein the defect portion is a portion in which the resin layer is cut away at the edge portion of a member having a sharp edge portion. .

  (13) The prepreg continuous body according to any one of (1) to (12), wherein the resin composition includes a curable resin.

  (14) The prepreg continuous body according to any one of (1) to (13), wherein the fiber base material is a glass fiber base material.

  (15) A prepreg obtained by cutting the prepreg continuous body according to any one of (1) to (14) in the longitudinal direction.

  According to the present invention, the prepreg continuous body can be easily bent at the defect portion. Then, by appropriately setting the folding direction, the prepreg continuous body can be folded, for example, in a bellows shape, which is advantageous in that it can be reduced in size when stored, for example.

  Moreover, a prepreg can be manufactured (obtained) from such a prepreg continuous body advantageous for downsizing.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional side view showing a prepreg continuous body manufacturing apparatus that manufactures a prepreg continuous body of the present invention (a diagram showing a manufacturing process when manufacturing a prepreg continuous body of the present invention in order). BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional side view showing a prepreg continuous body manufacturing apparatus that manufactures a prepreg continuous body of the present invention (a diagram showing a manufacturing process when manufacturing a prepreg continuous body of the present invention in order). It is a schematic sectional side view which shows the cutting device which cut | disconnects the prepreg continuous body of this invention. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is a schematic sectional side view which shows the other example of a structure of the prepreg continuous body manufacturing apparatus which manufactures the prepreg continuous body of this invention. It is sectional drawing which shows 1st Embodiment of the prepreg continuous body of this invention. It is a schematic sectional drawing which shows 2nd Embodiment of the prepreg continuous body of this invention. It is a schematic sectional drawing which shows 3rd Embodiment of the prepreg continuous body of this invention. It is sectional drawing which shows the board | substrate manufactured using the prepreg obtained from the prepreg continuous body shown in FIG. It is sectional drawing which shows the semiconductor device manufactured using the board | substrate shown in FIG.

  Hereinafter, the prepreg continuous body and prepreg of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<< First Embodiment >>
1 and 2 are respectively schematic cross-sectional side views showing a prepreg continuous body manufacturing apparatus for manufacturing a prepreg continuous body of the present invention (a diagram showing a manufacturing process when manufacturing a prepreg continuous body of the present invention in order), FIG. 3 is a schematic sectional side view showing a cutting device for cutting the prepreg continuous body of the present invention, FIG. 4 is a sectional view taken along line AA in FIG. 1, and FIG. 5 is a sectional view taken along line BB in FIG. FIG. 6 is a schematic sectional side view showing another configuration example of the prepreg continuous body manufacturing apparatus for manufacturing the prepreg continuous body of the present invention, and FIG. 7 is a sectional view showing the first embodiment of the prepreg continuous body of the present invention. 10 is a cross-sectional view showing a substrate manufactured using the prepreg obtained from the prepreg continuous body shown in FIG. 7. FIG. 11 is a cross-sectional view showing a semiconductor device manufactured using the substrate shown in FIG. It is. In the following description, the upper side in FIGS. 1 to 7, 10 and 11 (the same applies to FIGS. 8 and 9) is “upper” or “upper”, and the lower side is “lower” or “lower”. Will be described. 7, 10 and 11 (the same applies to FIGS. 8 and 9) are greatly exaggerated in the thickness direction (vertical direction in the figure).

<Continuous prepreg>
First, the prepreg continuous body 40 will be described. The prepreg continuous body 40 is obtained by cutting the prepreg continuous body 40 in the longitudinal direction thereof, that is, by a defect portion 401 described later, to obtain the prepreg 1.

  The prepreg continuous body 40 is manufactured by the prepreg continuous body manufacturing apparatus 30 (see FIGS. 1 and 2). When the manufactured prepreg continuous body 40 is cut by the cutting device 50, the prepreg 1 is obtained (see FIG. 3).

As shown in FIG. 7 (FIGS. 2 and 3), the prepreg continuous body 40 has a belt-like overall shape, a long thin plate (flat plate) fiber base material (base material) 2, and a fiber base. The first resin layer (resin layer) 3 that is located on one surface (upper surface) side of the material 2 and is composed of a solid or semi-solid first resin composition, and the other surface of the fiber substrate 2 ( And a second resin layer (resin layer) 4 made of a solid or semi-solid second resin composition. In the middle of the longitudinal direction of the prepreg continuous body 40, a part of the first resin layer 3 and a part of the second resin layer 4 are missing along the width direction (toward the back side in the drawing). A plurality of defective portions 401 (grooves) are formed.
The fiber substrate 2 has a function of improving the mechanical strength of the prepreg continuous body 40.

  Examples of the fiber substrate 2 include glass fiber substrates such as glass woven fabric and glass nonwoven fabric, polyamide resin fibers, aromatic polyamide resin fibers, polyamide resin fibers such as wholly aromatic polyamide resin fibers, polyester resin fibers, Synthetic fiber substrate, kraft paper, cotton linter composed of woven or non-woven fabric mainly composed of aromatic polyester resin fiber, polyester resin fiber such as wholly aromatic polyester resin fiber, polyimide resin fiber, fluororesin fiber, etc. Examples thereof include fiber base materials such as organic fiber base materials such as paper fiber base materials mainly composed of paper, mixed paper of linter and kraft pulp, and the like.

  Among these, it is preferable that the fiber base material 2 is a glass fiber base material. By using this glass fiber base material, the mechanical strength of the prepreg 1 obtained by cutting the prepreg continuous body 40 can be further improved. In addition, there is an effect that the thermal expansion coefficient of the prepreg 1 can be reduced.

  As glass which comprises such a glass fiber base material, E glass, C glass, A glass, S glass, D glass, NE glass, T glass, H glass etc. are mentioned, for example. Among these, it is preferable that glass is S glass or T glass. Thereby, the thermal expansion coefficient of a glass fiber base material can be made comparatively small, and, for this reason, the prepreg continuous body 40 can be made as small as possible in the thermal expansion coefficient.

  Although the average thickness of the fiber base material 2 is not specifically limited, It is preferable that it is 150 micrometers or less, It is more preferable that it is 100 micrometers or less, It is more preferable that it is about 10-60 micrometers. By using the fiber substrate 2 having such a thickness, the mechanical strength of the prepreg 1 can be ensured and the thickness thereof can be reduced. Furthermore, workability when performing processing such as drilling on the prepreg 1 can be improved. Moreover, in the state which made the prepreg 1 the board | substrate 10, the workability at the time of processing the through-hole (through hole) by mechanical drill or laser irradiation with respect to the said board | substrate 10 can also be improved. Furthermore, it is possible to improve the insulation reliability at a narrow pitch where the distance between pitches between the through holes is 70 μm or less.

  A first resin layer 3 is provided on one surface side of the fiber base 2, and a second resin layer 4 is provided on the other surface side. Moreover, the 1st resin layer 3 is comprised with the 1st resin composition, On the other hand, the 2nd resin layer 4 is 2nd resin of the composition different from the said 1st resin composition in this embodiment. It is composed of a composition.

  With this configuration, the composition of the resin composition can be appropriately set according to the characteristics required for each resin layer. Needless to say, the first resin composition and the second resin composition may have the same composition.

  In the present embodiment, since the wiring portion (conductor pattern) is formed on the first resin layer 3 of the prepreg 1 obtained from the prepreg continuous body 40, the first resin composition has an adhesive property with a metal. The composition is set so as to be excellent. Further, in order to reliably embed the wiring portion of another prepreg 1 or other fiber base material obtained from the prepreg continuous body 40 in the second resin layer 4 of the prepreg 1, the second resin composition includes: The second resin layer 4 is set to have a composition such that flexibility (flexibility) and fluidity are higher than those of the first resin layer 3. Each such resin composition will be described in detail later.

  As shown in FIG. 7, in this embodiment, a part of the fiber base 2 in the thickness direction is impregnated with the first resin composition (first resin layer 3) (hereinafter, this part is referred to as “first Impregnated portion 31 "), the remaining portion of the fiber base material 2 not impregnated with the first resin composition is impregnated with the second resin composition (second resin layer 4) (hereinafter referred to as this). This portion is referred to as “second impregnation portion 41”). Thereby, the first impregnation part 31 which is a part of the first resin layer 3 and the second impregnation part 41 which is a part of the second resin layer 4 are located in the fiber base material 2. And in the fiber base material 2, the 1st impregnation part 31 (lower surface of the 1st resin layer 3) and the 2nd impregnation part 41 (upper surface of the 2nd resin layer 4) are contacting. In other words, in the present embodiment, the first resin composition is impregnated into the fiber base material 2 from the upper surface side of the fiber base material 2, and the second resin composition is impregnated from the lower surface side of the fiber base material 2. The fiber base material 2 is impregnated, and the voids in the fiber base material 2 are filled with these resin compositions.

  With this configuration, the fiber base 2 can be protected by the first resin layer 3 and the second resin layer 4. As a result, even when an external impact is applied to the prepreg 1, the fiber base material 2 itself can be prevented from being destroyed, and the effect of improving the mechanical strength of the prepreg 1 by the fiber base material 2 is ensured. It can be demonstrated.

  Further, when the interface 20 between the first impregnation portion 31 and the second impregnation portion 41 inside the fiber base 2 is viewed microscopically, it is preferable that the interface 20 is uneven (see FIG. 7). See enlarged detail view). Alternatively, the interface 20 may be such that the impregnated portion 31 (first resin layer 3) and the second resin layer 4 are melted and mixed with each other. Thereby, not only the anchor effect with respect to the fiber base material 2 of each resin layer but the adhesiveness of resin layers increases, and it can prevent more reliably that each resin layer peels from the fiber base material 2. FIG. Thereby, the durability of the prepreg 1 can be improved. Furthermore, when the prepreg 1 is used as the substrate 10, it is possible to improve the moisture absorption heat resistance.

As described above, the flexibility of the second resin layer 4 is higher than that of the first resin layer 3. In such a magnitude relationship, the average thickness t _a1 [μm] of the first impregnation portion 31 is larger than the average thickness t _b1 [μm] of the second impregnation portion 41 (t _a1 > t _b1 ) It is preferable to set. This is due to the following reason.

When the flexibility of the second resin layer 4 is set higher than that of the first resin layer 3, the thermal expansion coefficient of the second resin layer 4 tends to be larger than that of the first resin layer 3. Therefore, when the opposite of magnitude relation between _{"t a1> t b1", "t} a1 _{<t b1",} when the prepreg 1 is heated, the inside of the fiber substrate 2, a second impregnation portion 41 However, there is a possibility that the fiber substrate 2 is deformed to a greater extent than the first impregnated portion 31 and a crack (crack) or the like occurs in the fiber base material 2 portion. The crack or the like in the fiber base material 2 part greatly affects the entire prepreg 1 and the prepreg 1 may not be able to withstand use.

On the other hand, if “t _a1 > t _b1 ”, it is possible to eliminate the above inconvenience, that is, to prevent or suppress the occurrence of cracks or the like in the prepreg 1. Thereby, the prepreg 1 can endure use.

Specifically, when the maximum thickness of the fiber substrate 2 is T [μm], the average thickness t _a1 is preferably 0.50 × T to 0.95 × T, and 0.7 It is more preferable that it is * T-0.9 * T. By setting the average thickness _ta1 in such a range, it is possible to more reliably prevent the prepreg 1 from cracking or other warping while reliably preventing each resin layer from peeling from the fiber base material 2. Can be prevented or suppressed.

In addition, the magnitude relationship of “t _a1 > t _b1 ”, that is, the degree of impregnation of the first resin composition is larger than the degree of impregnation of the second resin composition is the first resin This is because the composition and the second resin composition are different in composition.

Further, the average thickness of the portion (the first non-impregnated portion 32) excluding the first impregnation portion 31 of the first resin layer 3 is set to _ta2 [μm], and the second impregnation of the second resin layer 4 is performed. When the average thickness of the portion excluding the portion 41 (second non-impregnated portion 42) is t _b2 [μm], it is preferable that the relationship 1.2 × t _a2 <t _b2 is satisfied and 2 × t _a2 It is more preferable to satisfy the relationship <t _{b2, and} it is even more preferable to satisfy the relationship 3 × t _a <t _b . By satisfying such a relationship, a relatively high rigidity can be imparted to the portion on the upper surface side of the prepreg 1, so that the wiring portion is highly workable on the upper surface of the prepreg 1 (on the first non-impregnated portion 32). Can be formed. On the other hand, since the second resin layer 4 can have high flexibility and sufficient thickness, the second resin layer 4 (second non-impregnated portion 42) is connected to the wiring portion of another prepreg 1. When embedding other fiber base materials, the embedding can be reliably performed, that is, the embedding property to the wiring part of other prepregs 1 or other fiber base materials is improved.

Specifically, the average thickness t _a2 is preferably 0.1 to 15 μm, and more preferably 1 to 10 μm. On the other hand, the average thickness t _b2 is preferably 4 to 50 μm, and more preferably 8 to 40 μm.

  As shown in FIG. 1, the first resin layer 3 is applied to the prepreg continuous body manufacturing apparatus 30 as a thin plate-like first support (support) 5 a supported by a support base (support sheet) 51. Supplied. The second resin layer 4 is also supplied to the prepreg continuous body manufacturing apparatus 30 as a thin plate-like second support (support) 5 b supported by the support base 51.

  As the support base 51, for example, a resin film is preferable. Examples of the resin material constituting the resin film include fluorine resins, polyimide resins, polybutylene terephthalate, polyester resins such as polyethylene terephthalate, and the like. And as a resin material which comprises a resin film, since it is excellent in heat resistance and cheap, among these, a polyethylene terephthalate is preferable. Moreover, it is preferable that the process which can peel is performed to the surface at the side of the resin layer of the resin film. Thereby, as will be described later, the support base 51 and each resin layer can be easily separated.

  The average thickness of the support base 51 is not particularly limited, but is preferably about 10 to 50 μm, and more preferably about 20 to 40 μm.

  In order to obtain the first resin layer 3 and the second resin layer 4 having the above characteristics, the first resin composition and the second resin composition preferably have the following compositions.

  The first resin composition includes, for example, a curable resin, and includes at least one of a curing aid (for example, a curing agent and a curing accelerator) and an inorganic filler as necessary. .

  In order to improve the adhesion with the metal constituting the wiring part, a method of using a curable resin excellent in adhesion with the metal, a curing aid for improving the adhesion with the metal (for example, a curing agent, a curing accelerator) Etc.), a method using an acid-soluble material as an inorganic filler, a method using an inorganic filler and an organic filler in combination, and the like.

  Examples of such curable resins include urea (urea) resins, melamine resins, maleimide resins, polyurethane resins, unsaturated polyester resins, resins having a benzoxazine ring, bisallyl nadiimide compounds, vinyl benzyl resins, vinyl benzyl ether resins. Benzocyclobutene resin, cyanate ester resin, epoxy resin and the like. Among these, the curable resin is preferably a combination having a glass transition temperature of 200 ° C. or higher. For example, spiro ring-containing, heterocyclic, trimethylol type, biphenyl type, naphthalene type, anthran type, novolak type bi- or trifunctional epoxy resin, cyanate ester resin (including prepolymer of cyanate ester resin), maleimide It is preferable to use a resin, a benzocyclobutene resin, or a resin having a benzoxazine ring. Among these, it is preferable to use an epoxy resin and / or a maleimide resin and / or a cyanate resin because thermal expansion is reduced and heat resistance is remarkably improved. Furthermore, it is particularly preferable to use a cyanate resin because it is excellent in flame retardancy, impact resistance, high rigidity, and electrical characteristics (low dielectric constant, low dielectric loss tangent).

  In particular, the thermal expansion coefficient of the prepreg 1 can be reduced (hereinafter also referred to as “low thermal expansion”) by using the thermosetting resin and the filler together. Furthermore, the electrical characteristics (low dielectric constant, low dielectric loss tangent) of the prepreg 1 can be improved.

  If the thermosetting resin is used, the cross-link density increases in the first resin layer 3 after curing after the substrate 10 (see FIG. 10) to be described later is manufactured, so the first resin layer after curing. 3 (obtained substrate) can be improved in heat resistance.

  Here, the improvement in heat resistance is that the glass transition temperature becomes 200 ° C. or higher after the curing reaction of the thermosetting resin, the thermal decomposition temperature of the cured resin composition increases, and the reaction at 250 ° C. or higher. This is considered to result from the reduction of low molecular weight such as residues. Furthermore, the improvement in flame retardancy is an aromatic thermosetting resin, and since the ratio of the benzene ring is high due to its structure, the benzene ring is easily carbonized (graphitized). This is considered to be due to the occurrence of carbonized portions in the resin layer 3.

  Furthermore, although a flame retardant may be contained within a range not impairing the effects of the present invention, a non-halogen flame retardant is preferable from the viewpoint of the environment. Examples of the flame retardant include an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicone flame retardant, and a metal hydroxide. Examples of organophosphorus flame retardants include phosphine compounds such as HCA, HCA-HQ, and HCA-NQ manufactured by Sanko Co., Ltd., and phosphorus-containing benzoxazine compounds such as HFB-2006M manufactured by Showa Polymer Co., Ltd. Phosphoric acid ester compounds such as PPQ manufactured by Clariant Co., Ltd., OP930 manufactured by Clariant Co., Ltd., PX200 manufactured by Daihachi Chemical Co., Ltd., phosphorus-containing epoxy resins such as FX289 and FX310 manufactured by Toto Kasei Co., Ltd. Examples thereof include phosphorus-containing phenoxy resins such as ERF001 manufactured by Co., Ltd. Examples of organic nitrogen-containing phosphorus compounds include phosphate ester compounds such as SP670 and SP703 manufactured by Shikoku Kasei Kogyo Co., Ltd., SPB100 and SPE100 manufactured by Otsuka Chemical Co., Ltd., and FP-series manufactured by Fushimi Seisakusho Co., Ltd. Examples thereof include phosphazene compounds. Examples of the metal hydroxide include magnesium hydroxide such as UD650 and UD653 manufactured by Ube Materials Co., Ltd., CL310 manufactured by Sumitomo Chemical Co., Ltd., and aluminum hydroxide such as Showa Denko Co., Ltd. HP-350 and the like.

  The cyanate resin used in the present invention can be obtained, for example, by reacting a cyanogen halide compound with phenols. Specific examples of the cyanate resin include novolak-type cyanate resins such as phenol novolak-type cyanate resins and cresol novolak-type cyanate resins, naphthol aralkyl-type cyanate resins, dicyclopentadiene-type cyanate resins, biphenyl-type cyanate resins, and bisphenol A-type cyanate resins. And bisphenol type cyanate resins such as bisphenol AD type cyanate resin and tetramethyl bisphenol F type cyanate resin.

  Among these, it is particularly preferable to include a novolac type cyanate resin, a naphthol aralkyl type cyanate resin, a dicyclopentadiene type cyanate resin, and a biphenyl type cyanate resin. Further, the cyanate resin is preferably contained in an amount of 10% by weight or more in the total solid content of the resin composition. Thereby, the heat resistance (glass transition temperature, thermal decomposition temperature) of the prepreg 1 can be improved. Further, the thermal expansion coefficient of the prepreg 1 (particularly, the thermal expansion coefficient in the thickness direction of the prepreg 1) can be reduced. When the thermal expansion coefficient in the thickness direction of the prepreg 1 is reduced, the stress strain of the multilayer printed wiring can be reduced. Furthermore, in a multilayer printed wiring board having fine interlayer connection portions, the connection reliability can be greatly improved.

  Among the novolac type cyanate resins, a novolak type cyanate resin represented by the following formula (I) is preferable. A novolak cyanate resin represented by the formula (I) having a weight average molecular weight of 2000 or more, more preferably 2000 to 10000, still more preferably 2200 to 3500, and a weight average molecular weight of 1500 or less, more preferably 200 to 1300. It is preferable to use in combination with the novolak type cyanate resin represented by I). In the present invention, the weight average molecular weight is a value measured by a gel-permeation chromatography method in terms of polystyrene.

（式（Ｉ）中、ｎは０以上の整数を示す。）

(In formula (I), n represents an integer of 0 or more.)

  Moreover, as cyanate resin, the cyanate resin represented by following formula (II) is also used suitably. The cyanate resin represented by the following formula (II) includes naphthols such as α-naphthol and β-naphthol, p-xylylene glycol, α, α′-dimethoxy-p-xylene, 1,4-di (2-hydroxy). It is obtained by condensing naphthol aralkyl resin obtained by reaction with -2-propyl) benzene or the like and cyanic acid. N in the formula (II) is 1 or more, and more preferably 10 or less. When n is 10 or less, the resin viscosity is not high, the impregnation property to the base material is good, and the performance as a laminate is not deteriorated. In addition, intramolecular polymerization is unlikely to occur at the time of synthesis, and the liquid separation property at the time of washing with water is improved, so that a decrease in yield can be prevented.

（式（II）中、Ｒは水素原子またはメチル基を示し、ｎは１以上の整数を示す。）

(In the formula (II), R represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.)

  As the cyanate resin, a dicyclopentadiene type cyanate resin represented by the following formula (III) is also preferably used. Dicyclopentadiene-type cyanate resin has a relatively low decomposition temperature and is easy to volatilize as a decomposition gas without being carbonized. Therefore, smear hardly remains during processing such as laser irradiation and is excellent in pore workability. The dicyclopentadiene type cyanate resin represented by the following formula (III) is obtained by condensing a phenol resin having a dicyclopentadiene structure and cyanic acid. N in the formula (III) is 0 or more but preferably 8 or less. When n is 8 or less, the resin viscosity is not high, the impregnation property to the base material is good, and the performance as a laminate is not deteriorated. More preferably, it is 5 or less. These resins are available as Lonza DT-4000 and DT-7000.

  When a cyanate resin is used as the curable resin, it is preferable to use an epoxy resin (substantially free of halogen atoms) in combination. Examples of the epoxy resin include phenol novolac type epoxy resin, bisphenol type epoxy resin, naphthalene type epoxy resin, arylalkylene type epoxy resin, and the like.

  Among these, the epoxy resin is preferably a naphthalene type or arylalkylene type epoxy resin. By using a naphthalene-type or arylalkylene-type epoxy resin, moisture-absorbing solder heat resistance (solder heat resistance after moisture absorption) and flame retardancy can be improved in the cured first resin layer 3 (obtained substrate). it can. As the naphthalene type epoxy, HP-4700, HP-4770, HP-4032D, HP-5000 manufactured by DIC Corporation, NC-7300L manufactured by Nippon Kayaku Co., Ltd., ESN manufactured by Nippon Steel Chemical Co., Ltd. As the aryl alkylene type epoxy resin, NC-3000, NC-3000L, NC-3000-FH manufactured by Nippon Kayaku Co., Ltd., NC-7300L manufactured by Nippon Kayaku Co., Ltd. Examples include ESN-375 manufactured by Nippon Steel Chemical Co., Ltd. The arylalkylene type epoxy resin means an epoxy resin containing one or more combinations of an aromatic group and an alkylene group such as methylene in the repeating unit, and is excellent in heat resistance, flame retardancy, and mechanical strength.

  When the epoxy resin is used in combination, the content is not particularly limited, but it is preferably 1 to 55% by weight, more preferably 2 to 40% by weight based on the entire first resin composition.

  Further, the thermosetting resin composition may contain a maleimide compound from the viewpoint of heat resistance. The maleimide compound is not particularly limited as long as it is a compound having one or more maleimide groups in one molecule. Specific examples thereof include N-phenylmaleimide, N-hydroxyphenylmaleimide, bis (4-maleimidophenyl) methane, 2,2-bis {4- (4-maleimidophenoxy) -phenyl} propane, bis (3,5 -Dimethyl-4-maleimidophenyl) methane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, bis (3,5-diethyl-4-maleimidophenyl) methane, polyphenylmethanemaleimide, these maleimide compounds Or a prepolymer of a maleimide compound and an amine compound.

  Moreover, when using an epoxy resin and / or cyanate resin as a thermosetting resin, it is preferable that an epoxy resin is 5 to 50 weight% in the total solid of a resin composition, and an epoxy resin is 5 to 5 weight%. More preferably, it is 25% by weight. Moreover, it is preferable that cyanate resin is 5 to 50 weight% in the total solid of a resin composition, and it is more preferable that cyanate resin is 10 to 25 weight%.

  Furthermore, you may add to a 1st resin composition the component (a resin etc. are included) which improves adhesiveness with a metal. Examples of such components include polyimide resins, polyamide resins, and polyamideimide resins phenoxy resins, polyvinyl alcohol resins, coupling agents, and the like.

  Examples of the phenoxy resin include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a naphthalene skeleton, and a phenoxy resin having a biphenyl skeleton. A phenoxy resin having a structure having a plurality of these skeletons can also be used.

  Among these, it is preferable to use a phenoxy resin having a biphenyl skeleton and a bisphenol S skeleton as the phenoxy resin. Accordingly, the glass transition temperature of the phenoxy resin can be increased due to the rigidity of the biphenyl skeleton, and the adhesion of the phenoxy resin to the metal can be improved due to the presence of the bisphenol S skeleton. As a result, the heat resistance of the first resin layer 3 can be improved, and the adhesion of the wiring part (metal) to the first resin layer 3 can be improved when a multilayer substrate is manufactured. .

  It is also preferable to use a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton as the phenoxy resin. Thereby, the adhesiveness to the 1st resin layer 3 of a wiring part can be further improved at the time of manufacture of the multilayer substrate 200. FIG.

  Although the molecular weight of a phenoxy resin is not specifically limited, It is preferable that a weight average molecular weight is 5000-70000, and it is more preferable that it is 10000-60000.

  When the phenoxy resin is used, its content is not particularly limited, but it is preferably 1 to 40% by weight, more preferably 5 to 30% by weight based on the entire first resin composition.

  Although the said hardening adjuvant (for example, hardening | curing agent, hardening accelerator) is not specifically limited, For example, a zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetyl Organic metal salts such as acetonate cobalt (III), tertiary amines such as triethylamine, tributylamine, diazabicyclo [2,2,2] octane, dicyandiamides, 2-methylimidazole, 2-phenylimidazole, 2-phenyl- 4-methylimidazole, 2-ethyl-4-ethylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl- 2-undeci Imidazoles such as imidazole, 2-phenyl-4-methyl-5-hydroxyimidazole, 2-phenyl-4,5-dihydroxyimidazole, 2,3-dihydro-1H-pyrrolo (1,2-a) benzimidazole, phenol, Examples thereof include phenol compounds such as bisphenol A and nonylphenol, organic acids such as acetic acid, benzoic acid, salicylic acid, and paratoluenesulfonic acid, onium salt compounds, and the like, or mixtures thereof. One of these can be used alone, including derivatives thereof, or two or more of these can be used in combination. Among these curing accelerators, an onium salt compound is preferable from the viewpoint that the varnish storage stability is improved and the yield during production of the prepreg 1 is improved.

  Although content of the said onium salt compound is not specifically limited, It is preferable that it is 0.01 to 10 weight% with respect to the total solid of the resin composition containing an epoxy resin and / or cyanate resin, More preferably, it is 0. 0.1 to 5% by weight, most preferably 0.2 to 2.5% by weight. Thereby, the outstanding sclerosis | hardenability, fluidity | liquidity, and hardened | cured material characteristic can be expressed.

  The phenol compound is not particularly limited, and examples thereof include novolak phenol resins such as phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, arylalkylene type novolak resin, unmodified resole phenol resin, tung oil, linseed oil, walnut Examples include resol-type phenol resins such as oil-modified resol phenol resins modified with oil. As said phenol resin, a phenol novolak or a cresol novolak resin is preferable. Among these, biphenyl aralkyl-modified phenol novolac resin is preferable from the viewpoint of moisture absorption solder heat resistance.

  One of these can be used alone, or two or more having different weight average molecular weights can be used in combination, or one or two or more of these prepolymers can be used in combination.

In the present invention, the first resin composition preferably contains an inorganic filler as a filler. Thereby, even if the prepreg 1 is thinned (for example, a thickness of 35 μm or less), the substrate 10 having excellent mechanical strength can be obtained. Furthermore, the reduction in thermal expansion of the substrate 10 can be improved. The inorganic filler is not particularly limited, but for example, silicates such as talc, fired clay, unfired clay, mica, glass, oxides such as titanium oxide, alumina, silica, fused silica, calcium carbonate, magnesium carbonate, hydrous Carbonates such as talcite, aluminum hydroxide, boehmite (AlO (OH), boehmite commonly referred to as “pseudo” boehmite (ie, Al ₂ O ₃ .xH ₂ O, where x = 1 to 2), hydroxylation Metal hydroxides such as magnesium and calcium hydroxide, sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite, boron such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate Nitrate such as acid salt, aluminum nitride, boron nitride, silicon nitride, carbon nitride, titanium titanate Strontium, and titanium salt such as barium titanate. It is possible to use one kind among these alone, it can be used in combination of two or more.

  Among these, magnesium hydroxide, aluminum hydroxide, boehmite, silica, fused silica, talc, calcined talc, and alumina are preferable. Silica is particularly preferable in terms of low thermal expansion and insulation reliability, and spherical fused silica is more preferable. Further, silica, boehmite, and talc are preferable in terms of flame resistance. Further, depending on the purpose of use of the inorganic filler, a crushed or spherical one is appropriately selected. The average particle size of the inorganic filler is preferably 0.01 to 5.0 μm, and more preferably 0.1 to 2.0 μm. In addition, this average particle diameter can be measured with a particle size distribution meter (“LA-500” manufactured by HORIBA), for example. Thereby, the varnish of the 1st resin composition can be more reliably impregnated in the fiber base material 2, and the fiber base material 2 of the formed 1st resin layer 3 (1st impregnation part 31). Unevenness can be more reliably formed on the surface inside the.

  Moreover, in order to improve the adhesiveness of the 1st resin layer 3 and a wiring part, you may use an inorganic filler soluble in an acid as an inorganic filler. Thereby, when the wiring part (conductor layer) is formed on the first resin layer 3 by plating, the adhesion (plating adhesion) of the wiring part to the first resin layer 3 can be improved. . Examples of the acid-soluble inorganic filler include metal oxides such as calcium carbonate, zinc oxide, and iron oxide.

  Moreover, in order to improve the adhesiveness of the 1st resin layer 3 and a wiring part, you may use together an inorganic filler and an organic filler. Examples of the organic filler include resin-based fillers such as liquid crystal polymer, polyimide, and rubber.

  When the inorganic filler is used, the content thereof is not particularly limited, but is preferably 10% by weight to 90% by weight, and preferably 30% by weight to 80% by weight in the total solid content of the resin composition. More preferably, it is more preferably 50% by weight to 75% by weight. When the cyanate resin and / or the prepolymer thereof are contained in the resin composition, the content of the inorganic filler is preferably 50 to 75% by weight in the total solid content of the resin composition. If the inorganic filler content exceeds the above upper limit, the fluidity of the resin composition may be extremely poor, which may be undesirable, and if it is less than the lower limit, the strength of the insulating layer made of the resin composition is not sufficient, It may not be preferable.

  Moreover, in this invention, since it is a base material which is easy to impregnate even if it is an inorganic filler, the quantity of an inorganic filler can be increased in a resin composition. When the inorganic filler has a high concentration in the resin composition, the drill wearability is deteriorated, but when the inorganic filler is boehmite, the drill wearability is preferable.

  When an inorganic filler is added to the resin composition, a coupling agent may be further contained. The coupling agent improves the wettability of the interface between the thermosetting resin and the inorganic filler, thereby uniformly fixing the resin and the inorganic filler to the base material, and heat resistance, particularly solder heat resistance after moisture absorption. In order to improve the properties.

  Although the said coupling agent is not specifically limited, For example, an epoxy silane coupling agent, a cationic silane coupling agent, an aminosilane coupling agent, a titanate coupling agent, a silicone oil type coupling agent etc. are mentioned. Thereby, the wettability with the interface of an inorganic filler can be made high, and thereby heat resistance can be improved more.

  Although the addition amount of the coupling agent is not particularly limited, it is preferably 0.05 to 3 parts by weight, particularly preferably 0.1 to 2 parts by weight with respect to 100 parts by weight of the inorganic filler. If the content is less than the lower limit, the inorganic filler cannot be sufficiently coated, and thus the effect of improving the heat resistance may be reduced. If the content exceeds the upper limit, the reaction is affected, and the bending strength is reduced. There is a case.

  In the resin composition used in the present invention, other components can be blended as necessary within a range not inhibiting the effects of the present invention. Other components include, for example, core-shell rubber particles, silicone powder, nylon powder, organic fillers such as fluorine powder, thickeners such as olben and benton, silicone-based, fluorine-based, polymer-based antifoaming agents, or Adhesion imparting agents such as leveling agents, imidazole, thiazole, triazole, and silane coupling agents, and coloring agents such as phthalocyanine blue, phthalocyanine green, iodin green, disazo yellow, carbon black, anthraquinones, etc. Can be mentioned. In addition, ultraviolet absorbers, foaming agents, antioxidants, flame retardant aids, ion scavengers and the like can be mentioned.

  Moreover, when using together the hardening | curing agent or hardening accelerator which further improves the adhesiveness with the metal mentioned later, resin which has ethylenically unsaturated bonds, such as (meth) acrylic resin other than the above-mentioned curable resin, Other thermosetting resins such as unsaturated polyester resins, diallyl phthalate resins, and silicone resins can also be used. In addition to the thermosetting resin, for example, an ultraviolet curable resin, an anaerobic curable resin, or the like can be used as the curable resin.

  The first resin composition preferably contains at least an epoxy resin, a cyanate resin, and an inorganic filler from the viewpoint of easily realizing low linear expansion, high rigidity, and high heat resistance of the prepreg 1. Among them, the solid content of the resin composition preferably contains 5 to 50% by weight of epoxy resin, 5 to 50% by weight of cyanate resin, and 10 to 90% by weight of inorganic filler. It is preferable to contain -25 weight%, 10-25 weight% of cyanate resin, and 30-80 weight% of inorganic fillers. In particular, it is preferable to combine a naphthalene type and aralkyl-modified epoxy resin as the epoxy resin and a novolac type cyanate resin as the cyanate resin.

  Although content of curable resin is not specifically limited, It is preferable that it is 5 to 50 weight% of the whole 1st resin composition, and it is more preferable that it is 10 to 40 weight%. When the content of the curable resin is less than the lower limit, depending on the type of the curable resin, the viscosity of the varnish of the first resin composition becomes too low and it is difficult to form the prepreg 1. There is. On the other hand, when the content of the curable resin exceeds the upper limit, the amount of other components is too small, and the mechanical strength of the prepreg 1 may be reduced depending on the type of the curable resin.

  The second resin composition is set to a composition different from the first resin composition, specifically, a composition in which the second resin layer 4 is more flexible than the first resin layer 3. Yes.

  The constituents of the second resin composition can be the same as those mentioned in the first resin composition, but the type and content of the resin and filler, the molecular weight of the resin (average repeat The composition of the second resin composition differs from that of the first resin composition by making at least one such as the number of units different. As a result, the second resin layer 4 has different characteristics from the first resin layer 3.

  The thermal expansion coefficient in the surface direction of the second resin layer 4, that is, the longitudinal direction (X direction) and the width direction (Y direction) of the prepreg 1 is not particularly limited, but is preferably 20 ppm or less, More preferably, it is 16 ppm. When the thermal expansion coefficient of the second resin layer 4 is within the above range, the prepreg 1 can have high connection reliability, and the obtained substrate is excellent in mounting reliability of semiconductor elements and the like. Become.

  Further, the thermal expansion coefficient in the plane direction of the entire prepreg 1 is not particularly limited, but is preferably 16 ppm or less, more preferably 12 ppm or less, and further preferably 5 to 10 ppm. When the thermal expansion coefficient of the prepreg 1 is within the above range, the crack resistance to repeated thermal shocks is improved in the obtained substrate.

  The thermal expansion coefficient in the surface direction can be evaluated by increasing the temperature at 10 ° C./min using, for example, a TMA apparatus (TA Instruments).

  As described above, a plurality of defective portions 401 are formed in the prepreg continuous body 40 (see FIGS. 2, 3, and 7). These missing portions 401 are formed at equal intervals along the longitudinal direction of the prepreg continuous body 40.

  In the portion where each defect portion 401 of the prepreg continuous body 40 is formed, the strength of the portion where the defect portion 401 is not formed, that is, the first resin layer 3 is reduced by the thickness. The strength of the portion where the first non-impregnated portion 32 remains or the portion where the second non-impregnated portion 42 remains in the second resin layer 4 becomes smaller. In other words, the portions where the respective missing portions 401 of the prepreg continuous body 40 are formed are fragile.

  And the prepreg continuous body 40 can be bend | folded in each defect | deletion part 401 (part in which each defect | deletion part 401 of the fiber base material 2 is located). Further, when each of the defective portions 401 is bent, the bending direction is opposite to each other between the adjacent defective portions 401. By such folding, the prepreg continuous body 40 is folded into a bellows shape. Thereby, the prepreg continuous body 40 becomes advantageous for downsizing, for example, when storing.

  Moreover, in the prepreg continuous body 40, since each defect | deletion part 401 is bent, it is prevented or suppressed that the stress by bending acts on the 1st resin layer 3 or the 2nd resin layer 4. FIG. . When stress acts on each resin layer, depending on the thickness and composition, there is a risk that the resin layer may be peeled off from the fiber base material or damaged. However, in the present invention, such a problem is reliably prevented from occurring. It can be said that each of the defect portions 401 is a portion having a function of relieving stress.

The length L along the longitudinal direction of the prepreg continuum 40 of the defect 401, the total thickness of the prepreg continuum 40 (maximum thickness) is preferably at 1.5 × t _total more than 3.0 It is more preferable that it is _{xt total} or more.

Moreover, the depth d of each defect | deletion part 401 is the extent to which a part of fiber base material 2 is each exposed from both surfaces side, ie, the average thickness t of the 1st non-impregnation part 32 in the 1st resin layer 3 side. it is preferably comparable with _a2, preferably in the second resin layer 4 side of the same order as the average thickness t _b2 of the second non-impregnated portion 42. In this case, as shown in FIG. 7, the first impregnation portion 31 and the second impregnation portion 41 remain in the portion where each defect portion 401 of the fiber base material 2 is located.

  Since the length L and the depth d of each defect portion 401 are such sizes, the defect portion 401 can be easily and reliably bent. In addition, when the prepreg continuous body 40 is changed from the extended state to the bent state, the bending angle at each defect portion 401 can be 180 degrees. Thereby, the part used as the adjacent prepreg 1 can be approached as much as possible, Therefore The prepreg continuous body 40 is further reduced in size and folded in a bellows shape.

  As shown in FIG. 3, each defect portion 401 also functions as a cutting portion that is cut when the prepreg 1 is obtained from the prepreg continuous body 40. As described above, since each of the defective portions 401 has a small thickness, the defective portion 401 can be easily and quickly cut. In addition, the position of each of the defective portions 401 can be easily confirmed because the thickness is reduced. Further, since the contrast between the defect portion 401 and the resin (the first resin layer 3 and the second resin layer 4) is different, it can be easily recognized mechanically. Therefore, it is possible to prevent a mistake in the portion to be cut in the prepreg continuous body 40. Furthermore, since the resin part (the 1st resin layer 3 and the 2nd resin layer 4) is missing, generation | occurrence | production of the resin powder at the time of a cutting | disconnection is suppressed, and the contamination of the prepreg 1 can be prevented.

<Prepreg continuous body manufacturing device (manufacturing method of prepreg continuous body)>
Next, the prepreg continuous body manufacturing apparatus 30 used for manufacturing the prepreg continuous body 40, that is, the prepreg continuous body manufacturing apparatus 30 used in the embodiment of the manufacturing method of the prepreg continuous body of the present invention will be described with reference to FIGS. I will explain.

  As shown in FIGS. 1 and 2, the prepreg continuous body manufacturing apparatus 30 includes a housing 6, first rollers 71 a and 71 b, second rollers 72 a and 72 b, and third rollers 73 a housed in the housing 6. 73b, decompression means 8 for decompressing the inside of the housing 6, and defect portion forming members 9a, 9b for forming the defect portion 401. Hereinafter, the configuration of each unit will be described.

  As shown in FIG. 4, the housing 6 has a pair of wall portions 61 arranged to face each other at an interval, for example, has a box shape. Although it does not specifically limit as a constituent material of the wall part 61, For example, various metals, such as iron, stainless steel, and aluminum, or the alloy containing these is mentioned.

  Between the two wall portions 61 of the housing 6, first rollers 71a and 71b, second rollers 72a and 72b, and third rollers 73a and 73b are respectively constructed. These rollers are connected to a motor (not shown) via a gear mechanism (not shown) in which a large number of gears are arranged, for example. And when this motor operates, the motive power will be transmitted through a gear mechanism, and each roller will rotate, respectively. Since these rollers have the same configuration, the configuration of the first roller 71a will be representatively described below.

  As shown in FIG. 4, the first roller 71 a has a columnar outer shape, and includes a main body portion 74 located at the middle portion in the longitudinal direction and shafts 75 located at both ends of the main body portion 74. It is configured. Each shaft 75 has an outer diameter smaller than the outer diameter of the main body 74.

  In the first roller 71 a, each shaft 75 is inserted into a bearing (bearing) 76 installed on the wall portion 61, and is rotatably supported by the bearing 76.

  In addition, although the 1st roller 71a is a solid thing in the structure shown in FIG. 1, FIG. 4, it is not limited to this, For example, a hollow body may be sufficient.

  In addition, the constituent material of the first roller 71a is not particularly limited, and for example, various metal materials as mentioned in the constituent material of the wall portion 61, or nitrile rubber, butyl rubber, silicone rubber, urethane rubber, chloroprene rubber Various thermoplastic elastomers such as fluorine rubber can be used. In this case, the outer peripheral surface 741 of the main body 74 of the first roller 71a may be subjected to a process for preventing the outer peripheral surface 741 from being worn. Examples of this treatment include a method of forming a film of fluorine, PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), or DLC (Diamond Like Carbon) on the outer peripheral surface 741.

  The first roller 71a and the first roller 71b are arranged in parallel to each other in the horizontal direction, and the outer peripheral surfaces 741 of the main body 74 are in contact with (press contact with) each other (see FIG. 4). And when the 1st roller 71a and the 1st roller 71b rotate, the 1st resin layer 3 and the 2nd resin layer 4 are each crimped | bonded to the fiber base material 2 between these (bonding). Furthermore, the prepreg continuous body 40 which is the crimped body can be conveyed from the left side to the right side in FIG.

  The first roller 71a and the first roller 71b are configured such that each resin layer can be heated while the first resin layer 3 and the second resin layer 4 are pressure-bonded to the fiber base material 2, respectively. May be.

  The second roller 72a and the second roller 72b are located at different positions from the first rollers 71a and 71b, that is, in front of the first roller 71a and 71b in the conveying direction of the fiber substrate 2, and the housing 6 It arrange | positions at the exit of the prepreg continuous body 40 of this. Further, the second roller 72a and the second roller 72b are arranged in parallel to each other in the horizontal direction, and the outer peripheral surfaces 741 of the main body 74 are in contact (pressure contact) with each other. When the second roller 72a and the second roller 72b rotate, the prepreg continuous body 40 can be conveyed from the left side to the right side in FIG. At this time, since the second rollers 72a and 72b are in contact with each other, the outlet of the housing 2 can be hermetically sealed.

  The 3rd roller 73a and the 3rd roller 73b are arrange | positioned with respect to the 1st rollers 71a and 71b in the conveyance direction of the fiber base material 2. As shown in FIG. Further, the third roller 73a and the third roller 73b are spaced apart from each other in the vertical direction (vertical direction), and are opposed to each other in parallel in the horizontal direction. When the third roller 73a rotates, the support base 51 can be peeled off (wound up) from the first resin layer 3 of the first support 5a (see FIG. 1). Similarly, when the third roller 73b rotates, the support base 51 can be peeled from the second resin layer 4 of the second support 5b (see FIG. 1).

  The first rollers 71a and 71b, the second rollers 72a and 72b, and the third rollers 73a and 73b have the same outer diameter (size) of the main body 74 in the configuration shown in FIG. However, the present invention is not limited to this and may be different.

  As shown in FIG. 5, the decompression unit 8 includes a pump 81 and a connection pipe 82 that connects the pump 81 and an opening 611 formed in each wall 61.

  The pump 81 is installed outside the housing 6, and for example, a vacuum pump is applied. As the vacuum pump, for example, a diaphragm pump, a swinging piston type pump, a rotary pump, a diffusion pump, a turbo molecular pump, or the like can be used.

  Each connection pipe 82 is a hard pipe made of a metal material such as stainless steel.

  Each opening 611 opens toward the internal space 70. In the configuration shown in FIG. 5, the opening portions 611 are formed in both the wall portions 61, but the present invention is not limited to this. For example, the opening portion 611 may be formed only in one wall portion 61. .

  Then, by operating the pump 81, the air G in the internal space 70 can be sucked from each opening 611, and thus the internal space 70 can be decompressed.

  Defect portion forming members 9a and 9b are arranged in front of the second roller 72a and 72b in the transport direction of the prepreg continuous body 40. As shown in FIG. 2, the defect portion forming members 9 a and 9 b form the defect portion 401. Each of the defect forming members 9a and 9b is a member made of a plate piece and having a sharp edge portion 91 at the edge thereof. In addition, it does not specifically limit as a constituent material of the defect | deletion part formation members 9a and 9b, For example, a comparatively hard metal material like stainless steel etc. can be used.

  The defect part forming member 9a is supported above the prepreg continuous body 40 so as to be movable in the vertical direction. Thereby, the defect | deletion part formation member 9a can approach / separate with respect to the prepreg continuous body 40. FIG. Then, when the prepreg continuous body 40 moves in a state in which the defect portion forming member 9a approaches, the first non-impregnated portion 32 of the first resin layer 3 can be cut out (cut off) and lost by the edge portion 91. it can.

  The defect forming member 9b is supported below the prepreg continuous body 40 so as to be movable in the vertical direction. Thereby, the defect | deletion part formation member 9b can approach / separate with respect to the prepreg continuous body 40. FIG. And if the prepreg continuous body 40 moves in the state in which the defect | deletion part formation member 9b approached, the 2nd non-impregnation part 42 of the 2nd resin layer 4 can be notched by the edge part 91, and it can be made to be missing.

  The portions cut out by the defect portion forming members 9 a and 9 b are removed from the prepreg continuous body 40, and a plurality of defect portions 401 are formed in the prepreg continuous body 40.

  Next, a process of manufacturing the prepreg continuous body 40 by the prepreg continuous body manufacturing apparatus 30 will be described with reference to FIGS. 1 and 2.

  In the prepreg continuous body manufacturing apparatus 30, prior to the rotation of the first rollers 71a and 71b, the second rollers 72a and 72b, and the third rollers 73a and 73b, the decompression means 8 is operated to The inside of 70 is decompressed.

  Moreover, the fiber base material 2, the 1st support body 5a, and the 2nd support body 5b are each accommodated in the state wound beforehand in the internal space 70, respectively.

  When the third roller 73a rotates, the support base 51 is wound (pulled) by the third roller 73a in the first support 5a, whereby the support base 51 is peeled off from the first resin layer 3. Is done. The first resin layer 3 from which the support base 51 has been peeled gradually approaches the fiber substrate 2.

  In addition, when the third roller 73 b rotates, the second support 5 b is wound around the third roller 73 b, whereby the support substrate 51 is peeled from the second resin layer 4. . The second resin layer 4 from which the support base 51 has been peeled gradually approaches the fiber substrate 2.

  As described above, the support base 51 can be peeled off immediately before (before) the first resin layer 3 and the second resin layer 4 are pressure-bonded to the fiber base 2, respectively. Can be prevented, and each resin layer can be protected by the support base 51 until just before the press bonding.

  And the fiber base material 2, the 1st resin layer 3, and the 2nd resin layer 4 will pass between the 1st roller 71a and the 1st roller 71b collectively. Thereby, the 1st resin layer 3 and the 2nd resin layer 4 are joined to both surfaces of fiber base material 2, respectively (pressure bonding).

  Next, as shown in FIG. 2, the defect portion 401 is formed by the defect portion forming members 9 a and 9 b described above to obtain the prepreg continuous body 40. In addition, the prepreg continuous body 40 can also be made into the state folded by bend | folding in each defect | deletion part 401. FIG.

  In addition, as a prepreg continuous body manufacturing apparatus 30, the thing of the structure shown in FIG. 6 other than the thing of the structure shown in FIG. 1 can also be used. The prepreg continuous body manufacturing apparatus 30 having the configuration shown in FIG. 6 will be described.

  As shown in FIG. 6, the prepreg continuous body manufacturing apparatus 30 supplies the strip-shaped first support body 5 a and the second support body 5 b to the strip-shaped fiber base material 2, respectively. 40 is manufactured. The prepreg continuous body manufacturing apparatus 30 includes first rollers 271a and 271b, second rollers 272a and 272b, third rollers 273a and 273b, fourth rollers 274a and 274b, and a press machine 77. ing.

  The first roller 271a and the first roller 271b are spaced apart in the vertical direction. The first roller 271a feeds the strip-shaped film 78a, and the first roller 271b feeds the strip-shaped film 78b.

  Second rollers 272a and 272b are arranged behind the first rollers 271a and 271b in the conveying direction of the fiber base material 2. The second roller 272a and the second roller 272b are also spaced apart in the vertical direction. The second roller 272a winds up the film 78a sent out from the first roller 271a, and the second roller 272b takes up the film 78b sent out from the first roller 271b.

  Third rollers 273a and 273b are arranged between the first rollers 271a and 271b and the second rollers 272a and 272b. The third roller 273a and the third roller 273b are also spaced apart in the vertical direction. The third roller 273a is an idler that applies tension to the film 78a, and the third roller 273b is an idler that applies tension to the film 78b.

  The fourth rollers 274a and 274b are located between the first rollers 271a and 271b and the second rollers 272a and 272b and behind the third rollers 273a and 273b in the conveying direction of the fiber base material 2. Is arranged. The fourth roller 274a and the fourth roller 274b are also spaced apart in the vertical direction. The fourth roller 274a is an idler that applies tension to the film 78a together with the third roller 273a, and the fourth roller 274b is an idler that applies tension to the film 78b together with the third roller 273b.

  And the prepreg continuous body manufacturing apparatus 30 can clamp the fiber base material 2 with the 1st support body 5a and the 2nd support body 5b between the film 78a and the film 78b, and can convey in that state. it can.

  The supply method of the 1st support body 5a and the 2nd support body 5b in this invention sets the roll-shaped 1st support body 5a larger than the width | variety of the fiber base material 2 to an auto cutter, for example. When a support body has a protective film, it peels from the fiber base material 2 surface, winding up this protective film with a winding roll. The first support 5a can be mechanically carried out after fixing the support by suction from the support base 51 side of the first support 5a. The support is transported and arranged so that the support base 51 is on the outside, that is, the surface of the first resin layer 3 is in contact with both surfaces of the fiber substrate 2 (the fiber substrate 2 and the second resin layer 4). The same applies to the second support 5b having the same). For temporary attachment, for example, in a part of the fiber substrate 2 in the feed direction, the support is partially bonded to the fiber substrate 2 by heating and pressing from the support substrate 51 side of the first support 5a. To do. The bonding condition depends on the resin composition used for the first resin layer 3 and its melt viscosity characteristics, but is usually crimped at a temperature of 60 to 130 ° C. for about 1 to 10 seconds. Then, a support body is conveyed with the fiber base material 2, and a support body is temporarily attached to the fiber base material 2 by cutting a support body with a cutter according to a board | substrate size. When cutting, it is preferable to install a cutter backup heater and / or a powder suction device heated in the range of 40 to 80 ° C. for the purpose of reducing the occurrence of chips of the resin composition ( The same applies to the support 5b having the fiber base 2 and the second resin layer 4).

  A press machine 77 is disposed between the third rollers 273a and 273b and the fourth rollers 274a and 274b. The press machine 77 pressurizes the fiber substrate 2 in a state where the first support body 5a and the second support body 5b are supplied together with the first support body 5a and the second support body 5b from above and below. Device. By this pressurization, the first resin layer 3 of the first support 5 a is pressed against the fiber base 2, and the second resin layer 4 of the second support 5 b is pressed against the fiber base 2. In the configuration shown in FIG. 6, the prepreg continuous body 40 is the one in which the support base 51 remains, but after the first resin layer 3 and the second resin layer 4 are pressure-bonded, the support base 51 is peeled off. You can also

  The press machine 77 includes an upper structure 771 and a lower structure 772. The upper structure 771 includes an upper support 773 having a recess 773a formed in the lower portion, a heating plate 774 supported in the recess 773a, and a plate-like elastic body 775 provided on the lower surface of the heating plate 774. is doing. The lower structure 772 includes a lower support 776 with a recess 776a formed in the upper part, a heating plate 777 supported in the recess 776a, and a plate-like elastic body 778 provided on the upper surface of the heating plate 777. have.

  In the press machine 77 having such a configuration, the fiber substrate 2 can be pressurized together with the first support body 5a and the second support body 5b between the upper structure body 771 and the lower structure body 772. The pressurization is performed in a space surrounded by the recess 773a of the upper support 773 and the recess 776a of the lower support 776. The space is depressurized during the pressurization. Further, the pressurization is performed while heating with the heating plates 774 and 777.

  6 includes a vacuum pressurizing laminator (for example, MVLP-500 / 600) manufactured by Meiki Seisakusho, a laminator (for example, CVP-300) manufactured by Nichigo Morton, and the like.

<Cutting device>
Next, the cutting device 50 for cutting the prepreg continuous body 40 will be described with reference to FIG.

  The cutting device 50 shown in FIG. 3 is positioned in front of the prepreg continuous body 40 in the transport direction with respect to the prepreg continuous body manufacturing apparatus 30. The cutting device 50 includes a belt conveyor 504 that conveys the prepreg continuous body 40 and a cutting member (cutter) 502 that cuts the prepreg continuous body 40.

  The belt conveyor 504 can convey the prepreg continuous body 40 sent from the prepreg continuous body manufacturing apparatus 30 in the horizontal direction in a stretched state. Although it does not specifically limit as the belt conveyor 504, For example, it can comprise with the strip | belt body which has the flexibility comprised with stainless steel.

  The cutting member 502 is configured by a member having two sharp edge portions 503 arranged in the lower end portion. The cutting member 502 is supported above the prepreg continuous body 40 so as to be movable in the vertical direction. And when one cutting part 401 of prepreg continuous body 40 is located directly under cutting member 502, when cutting member 502 moves downward, both ends of fiber base material 2 in chipping part 401 are both connected to each other. Cutting can be performed at the edge portion 503. Thereby, one prepreg 1 is separated from the prepreg continuous body 40. In addition, it does not specifically limit as a constituent material of the cutting member 502, For example, a comparatively hard metal material like stainless steel etc. can be used.

<Board>
Next, the substrate 10 using the prepreg 1 will be described with reference to FIG. A substrate 10 shown in FIG. 10 includes a laminated body 11 and metal layers 12 provided on both surfaces of the laminated body 11.

  The laminate 11 includes two prepregs 1 arranged with the second resin layers 4 facing each other, and a fiber base material 13 sandwiched between the second resin layers 4.

  As the fiber base material 13, the same fiber base material 2 as described above can be used. Moreover, in this embodiment, since the 2nd resin layer 4 has the above characteristics (fluidity), at least one part of the fiber base material 13 is reliably embedded in the 2nd resin layer 4 ( Buried).

  The metal layer 12 is a part that is processed into a wiring part, for example, by bonding a metal foil such as a copper foil or an aluminum foil to the laminate 11, or plating copper or aluminum on the surface of the laminate 11. It is formed. In the present embodiment, since the first resin layer 3 has the characteristics as described above, the metal layer 12 can be held with high adhesion and the metal layer 12 can be used as a wiring portion with high processing accuracy. It can be formed.

  The peel strength between the metal layer 12 and the first resin layer 3 is preferably 0.5 kN / m or more, and more preferably 0.6 kN / m or more. Thereby, the connection reliability in the semiconductor device 100 (refer FIG. 11) obtained by processing the metal layer 12 into a wiring part can be improved more.

  In such a substrate 10, two prepregs 1 each having a metal layer 12 formed on the first resin layer 3 are prepared, and the fiber base material 13 is sandwiched between these prepregs 1. Examples thereof include a method of laminating using a pressure laminator and a laminator heated and pressurized under vacuum. The vacuum press can be performed with a normal hot press machine or the like sandwiched between flat plates. For example, a vacuum press manufactured by Meiki Seisakusho Co., Ltd., a vacuum press manufactured by Kitagawa Seiki Co., Ltd., a vacuum press manufactured by Mikado Technos, etc. Further, as a laminator apparatus, a commercially available vacuum laminating machine such as a vacuum applicator manufactured by Nichigo Morton, a vacuum pressurizing laminator manufactured by Meiki Seisakusho, a vacuum roll type dry coater manufactured by Hitachi Techno Engineering, or the like It can be manufactured using a belt press or the like.

  The substrate 10 of the present invention may include a laminate in which the fiber base material 13 is omitted, and the two prepregs 1 are formed by directly joining the second resin layers 4 together. It may be omitted.

<Semiconductor device>
Next, the semiconductor device 100 using the substrate 10 will be described with reference to FIG. In FIG. 11, the fiber base materials 2 and 13 are omitted, and the first resin layer 3 and the second resin layer 4 are shown as an integral unit.

  A semiconductor device 100 shown in FIG. 11 connects a bump 501 to the multilayer substrate 200, a pad portion 300 provided on the upper surface of the multilayer substrate 200, a wiring portion 400 provided on the lower surface of the multilayer substrate 200, and the pad portion 300. Thus, the semiconductor element 500 mounted on the multilayer substrate 200 is provided. In addition, a wiring part, a pad part, a solder ball, and the like may be provided on the lower surface of the multilayer substrate 200.

  The multilayer substrate 200 includes a substrate 10 provided as a core substrate, three prepregs 1a, 1b, 1c provided on the upper side of the substrate 10, and three prepregs 1d, 1e provided on the lower side of the substrate 10. 1f. The fiber base material 2, the first resin layer 3, and the second resin layer 4 constituting the prepregs 1a to 1c, respectively, from the substrate 10, the fiber base material 2 constituting the prepregs 1d to 1f, the first The arrangement order of the resin layer 3 and the second resin layer 4 from the substrate 10 is the same. That is, the prepregs 1a to 1c and the prepregs 1d to 1f are inverted from each other.

  The multilayer substrate 200 includes a circuit unit 201a provided between the prepreg 1a and the prepreg 1b, a circuit unit 201b provided between the prepreg 1b and the prepreg 1c, and a prepreg 1d and the prepreg 1e. The circuit portion 201d is provided, and the circuit portion 201e is provided between the prepreg 1e and the prepreg 1f.

  Furthermore, the multilayer substrate 200 is provided through each of the prepregs 1a to 1f, and includes a conductor portion 202 that electrically connects adjacent circuit portions or between the circuit portion and the pad portion.

  Each metal layer 12 of the substrate 10 is processed into a predetermined pattern, and the processed metal layers 12 are electrically connected to each other by a conductor portion 203 provided through the substrate 10.

  In the semiconductor device 100 (multilayer substrate 200), four or more prepregs 1 may be provided on one side of the substrate 10. Furthermore, the semiconductor device 100 may include a prepreg other than the prepreg 1 of the present invention.

<< Second Embodiment >>
FIG. 8: is a schematic sectional drawing which shows 2nd Embodiment of the prepreg continuous body of this invention.

Hereinafter, the second embodiment of the prepreg continuous body and the prepreg of the present invention will be described with reference to this figure, but the description will focus on the differences from the above-described embodiment, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the formation position of the defect portion is different.

In the prepreg continuum 40A shown in FIG. 8, the second non-impregnated portion 42 of the first non-impregnated portion 32 (first resin layer 3) and the average thickness _{t a2} of the average thickness _{t a2} (second resin A part of the second non-impregnated part 42 having a large average thickness in the layer 4) is lost, and a defective part 401 is formed.

  In this way, by losing the resin layer on the side where the average thickness is large, each defect portion 401 becomes fragile, and the prepreg continuous body 40 </ b> A can be bent at each defect portion 401.

<< Third Embodiment >>
FIG. 9: is a schematic sectional drawing which shows 3rd Embodiment of the prepreg continuous body of this invention.
Hereinafter, the third embodiment of the prepreg continuous body and the prepreg of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the formation position of the defect portion is different.

In the prepreg continuum 40B shown in FIG. 9, although the average thickness t _a2 of the first non-impregnated portion 32 and the average thickness t _a2 of the second non-impregnated portion 42 has the same, the first As described in the embodiment, the second non-impregnated part 42 is more flexible than the first non-impregnated part 32, that is, the first non-impregnated part 32 is more flexible than the second non-impregnated part 42. Is also hard. A part of the hard first non-impregnated part 32 is lost, and a defective part 401 is formed.

  By causing the resin layer on the hard side to be damaged in this manner, each of the defective portions 401 becomes weak, and the prepreg continuous body 40 </ b> B can be bent at each of the defective portions 401.

  As described above, the prepreg continuous body and the prepreg of the present invention have been described with respect to the illustrated embodiment, but the present invention is not limited to this, and each part constituting the prepreg continuous body and the prepreg exhibits the same function. It can be replaced with any configuration obtained. Moreover, arbitrary components may be added.

  Moreover, the prepreg continuous body and prepreg of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Further, in the configuration shown in FIG. 7, the prepreg continuous body is one in which the resin layers are bonded to both surfaces of the fiber base material, but is not limited thereto, and the resin layer is bonded to only one surface of the fiber base material. It may be a thing.

  Further, in the configuration shown in FIG. 7, the prepreg continuous body is a fiber base material impregnated with the first resin composition and the second resin composition, respectively, but is not limited thereto. It may be a thing. The first example is a prepreg continuous body in which neither the first resin composition nor the second resin composition is impregnated in the thickness direction of the fiber base material. The second example is a prepreg continuous body in which the first resin composition is impregnated throughout the thickness direction of the fiber base material and the second resin composition is not impregnated. The third example is a prepreg continuous body in which the second resin composition is impregnated throughout the thickness direction of the fiber base material and the first resin composition is not impregnated. The fourth example is a prepreg continuous body in which the first resin composition is impregnated in a part of the thickness direction of the fiber base material and the second resin composition is not impregnated. The fifth example is a prepreg continuous body in which a part of the fiber base in the thickness direction is impregnated with the second resin composition and not impregnated with the first resin composition.

In the prepreg continuous body, in the configuration shown in FIG. 7, the magnitude relationship between the average thickness t _a1 and the average thickness t _b1 is t _a1 > t _b1 , but the opposite magnitude relationship is “t _a1. In the case of <t _b1 ”, it is possible to prevent or suppress warping of the prepreg obtained from the prepreg continuous body.

In the configuration shown in FIG. 7, the prepreg continuous body has a size relationship between the average thickness t _a2 and the average thickness t _b2 of t _a2 <t _b2 , but is not limited thereto. For example, t _a2 > t _b2 may be sufficient and t _a2 = t _b2 may be sufficient.

  Moreover, the prepreg continuous body manufacturing apparatus may be comprised so that the prepreg continuous body sent out from the housing may be dried.

  In the above embodiment, the prepreg continuous body manufacturing apparatus manufactures a prepreg continuous body by reducing the pressure in the housing (vacuum state). However, the present invention is not limited to this, and the prepreg continuous body manufacturing apparatus is not limited to this. A continuum may be produced.

1, 1a, 1b, 1c, 1d, 1e, 1f Prepreg 2 Fiber substrate (base material)
3 First resin layer (resin layer)
31 1st impregnation part 32 1st non-impregnation part 4 2nd resin layer (resin layer)
41 2nd impregnation part 42 2nd non-impregnation part 5a 1st support body (support body)
5b Second support (support)
51 Support base (support sheet)
6 Housing 61 Wall 611 Opening 71a, 71b First roller 72a, 72b Second roller 73a, 73b Third roller 74 Body 741 Outer peripheral surface 271a, 271b First roller 272a, 272b Second roller 273a 273b Third roller 274a, 274b Fourth roller 75 Shaft 76 Bearing
77 Press machine 771 Upper structure 772 Lower structure 773 Upper support 773a Recess 774 Heating plate 775 Elastic body 776 Lower support 777a Recessed portion 777 Heating plate 778 Elastic body 78a, 78b Film 8 Decompression means 81 Pump 82 Connection tube 9a 9b Defect portion forming member 91 Edge portion 10 Substrate 11 Laminate body 12 Metal layer 13 Fiber base material 20 Interface 30 Prepreg continuous body manufacturing device 40, 40A, 40B Prepreg continuous body 401 Defect portion 50 Cutting device 501 Belt conveyor 502 Cutting member ( cutter)
503 Edge portion 504 Belt conveyor 70 Internal space 100 Semiconductor device 200 Multilayer substrate 201a, 201b, 201d, 201e Circuit portion 202, 203 Conductor portion 300 Pad portion 400 Wiring portion 500 Semiconductor element 501 Bump d Depth G Air L Length t _a1 , T _a2 , t _b1 , t _b2 average thickness t _total total thickness (maximum thickness)
T Maximum thickness

Claims (15)

A prepreg continuous body comprising a fiber base material having a long thin plate shape, and a resin layer formed on one side or both sides of the fiber base material and composed of a resin composition,
In the middle of the longitudinal direction of the prepreg continuous body, a prepreg continuous body is characterized in that at least one defect portion in which a part of the resin layer is lost in the width direction is formed.   2. The prepreg continuous body according to claim 1, wherein a plurality of the defect portions are formed at equal intervals along a longitudinal direction of the prepreg continuous body.   The prepreg continuous body according to claim 1, wherein the prepreg continuous body is bent at the defect portion. A plurality of the defect portions are formed,
4. The prepreg continuous body according to claim 3, wherein when the respective defect portions are bent, the bending directions thereof are opposite to each other between the adjacent defect portions. 5. The resin layer is formed on both sides of the fiber base material,
The prepreg continuous body according to any one of claims 1 to 4, wherein the defect portion is formed in at least one of the two resin layers. The resin layers are respectively formed on both sides of the fiber base material, and one resin layer has a thickness larger than the other resin layer,
The prepreg continuous body according to any one of claims 1 to 5, wherein the defect portion is formed in the one resin layer. The resin layers are respectively formed on both surfaces of the fiber base material, and one resin layer is harder than the other resin layer,
The prepreg continuous body according to any one of claims 1 to 6, wherein the defect portion is formed in the one resin layer.   The prepreg continuous body according to any one of claims 1 to 7, wherein a length of the defect portion along a longitudinal direction of the prepreg continuous body is equal to or greater than a total thickness of the prepreg continuous body.   The prepreg continuous body according to any one of claims 1 to 8, wherein the fiber base material is exposed from the defect portion.   The prepreg continuous body according to any one of claims 1 to 9, wherein the fiber base material is impregnated with the resin composition from the resin layer at least in part in the thickness direction.   The prepreg continuous body according to any one of claims 1 to 10, wherein the defect portion functions as a cutting portion when cutting the prepreg continuous body.   The prepreg continuous body according to any one of claims 1 to 11, wherein the defect portion is a portion in which the resin layer is notched and lost at the edge portion of a member having a sharp edge portion.   The prepreg continuous body according to any one of claims 1 to 12, wherein the resin composition contains a curable resin.   The prepreg continuous body according to any one of claims 1 to 13, wherein the fiber base material is a glass fiber base material.   A prepreg obtained by cutting the prepreg continuous body according to any one of claims 1 to 14 in the middle of its longitudinal direction.

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