JP2012114196A - Cutting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device capable of reducing the fear that cutting waste adheres to a workpiece.
A chuck means having a holding surface for holding a workpiece, a cutting blade for cutting the workpiece held on the chuck table, and a spindle on which the cutting blade is mounted, A machining feed means for relatively moving the chuck table and the cutting means in a machining feed direction parallel to the holding surface, and an index feed for moving the chuck table, the cutting means and the cutting means relative to an index feed direction orthogonal to the machining feed direction. The cutting means is disposed such that an axis of the spindle is in a vertical direction, and the holding surface of the chuck table is parallel to the axis of the spindle. The chuck table being processed and a storage chamber for storing the cutting blade, and supplying the liquid to the storage chamber to supply the chuck table and the cutting table And a liquid supply means for immersing the blade in the liquid.
[Selection] Figure 1

Description

  The present invention relates to a cutting apparatus that can reduce the risk of cutting waste adhering to a workpiece.

  A semiconductor wafer in which a number of devices such as IC and LSI are formed on the surface, and each device is partitioned by a line to be divided (street), the back surface is ground by a grinding machine and processed to a predetermined thickness. The cutting line is cut by a cutting device (dicing device) and divided into individual devices, and the divided devices are widely used in various electric devices such as mobile phones and personal computers.

  The cutting apparatus includes a chuck table that holds a wafer, a cutting means that rotatably supports a cutting blade that cuts the wafer held by the chuck table, and a machining feed that relatively feeds the chuck table and the cutting means. Means, and index feed means for relatively indexing and feeding the chuck table and the cutting means, so that the wafer can be divided into individual devices with high accuracy.

  When a workpiece such as a semiconductor wafer is cut with a cutting blade of a cutting device, cutting waste is generated. In order to prevent cutting scraps from adhering to the workpiece, the cutting apparatus performs cutting while supplying cutting water to the workpiece during machining.

  If the cutting waste dries while attached to the surface of the workpiece, the cutting waste adheres to the workpiece, and it is very difficult to remove the fixed cutting waste from the workpiece even after cleaning. Have difficulty. In particular, if the cutting waste that has entered between the cutting grooves adheres to the side surface of the chip, it is very difficult to remove.

  Japanese Patent Laid-Open No. 2003-234308 discloses a cutting device that improves the effect of removing cutting waste by providing a nozzle that injects a fluid mixture obtained by mixing cleaning water and air onto a workpiece being processed. is suggesting.

JP 2003-234308 A

  However, even with the cutting device disclosed in Patent Document 1, it is difficult to completely prevent the chips from adhering to the workpiece.

  This invention is made | formed in view of such a point, The place made into the objective is providing the cutting device which can reduce a fear that cutting waste adheres to a workpiece.

  According to the present invention, a chuck table having a holding surface for holding a workpiece, a cutting blade having a cutting blade for cutting the workpiece held on the chuck table, and a spindle to which the cutting blade is mounted; A machining feed means for moving the chuck table and the cutting means relative to each other in a machining feed direction parallel to the holding surface, and an index for moving the chuck table, the cutting means and the cutting means relative to an index feed direction orthogonal to the machining feed direction. A cutting device including a feeding means, wherein the cutting means is disposed such that an axis of the spindle is in a vertical direction, and the holding surface of the chuck table is parallel to the axis of the spindle. The chuck table being processed and a storage chamber for storing the cutting blade, and supplying the liquid to the storage chamber to supply the chuck table and the chuck table Cutting device for the cutting blade, characterized by comprising a liquid supply means dipping into the liquid, it is provided.

  According to the cutting device of the present invention, the cutting waste generated by cutting gathers to the lower end of the storage chamber under its own weight, and the risk of adhering to the workpiece can be reduced, and the workpiece is immersed in the liquid. There is no drying inside, and the risk of cutting chips sticking to the workpiece can be reduced.

  In addition, since the processing point by the cutting blade is also immersed in the liquid, the cooling effect of the processing point is improved and the processing quality can be improved. Furthermore, the risk of dirt sticking to a light sensor such as a blade breakage detector or a non-contact setup sensor disposed around the processing point is reduced, and the frequency of cleaning can be reduced.

It is a perspective view of the cutting device of a 1st embodiment of the present invention. It is a partial cross section side view of the cutting device shown in FIG. It is a perspective view of the semiconductor wafer supported by the annular frame via the dicing tape. It is a partial cross section side view of the cutting device of 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device 2 according to a first embodiment of the present invention is shown. FIG. 2 is a partial cross-sectional side view of the cutting apparatus 2 shown in FIG.

  A pair of guide rails 6 parallel to each other are fixed to the first base 4 of the cutting device 2 so as to extend in the X-axis direction. Reference numeral 12 denotes a machining feed means composed of a ball screw 8 and a pulse motor 10, and the ball screw 8 is screwed into a nut (not shown) fixed to the X-axis moving block 14.

  When the pulse motor 10 of the processing feed means 12 is driven, the ball screw 8 is rotated and guided by the guide rail 6, and the X-axis moving block 14 is moved in the X-axis direction. The X-axis moving block 14 extends in the vertical direction.

  A chuck table 18 is rotatably supported on the X-axis moving block 14 via a cylindrical support base 16. The holding surface 18a of the chuck table 18 extends in the vertical direction. Four clamps 20 are disposed around the chuck table 18.

  As shown in FIG. 3, the first street S1 and the second street S2 are formed orthogonally on the surface of the semiconductor wafer W which is a kind of workpiece, and the first street S1 and the first street S1 A device D is formed in each region partitioned by two streets S2.

  The back surface of the wafer W is attached to a dicing tape T that is an adhesive tape, and the outer peripheral portion of the dicing tape T is attached to an annular frame F. As a result, the wafer W is supported by the annular frame F via the dicing tape T. In this configuration, the wafer W is sucked and held by the chuck table 18 via the dicing tape T, and the annular frame F is clamped by the clamp 20. To be fixed.

  Referring again to FIG. 1, reference numeral 24 denotes a second base, and a pair of guide rails 26 parallel to each other are fixed to the second base 24 so as to extend in the Y-axis direction (vertical direction). Reference numeral 32 denotes an index feeding means composed of a ball screw 28 and a pulse motor 30, and the ball screw 28 is screwed to a nut (not shown) fixed to the Y-axis moving block 34.

  When the pulse motor 30 of the index feed means 32 is driven, the ball screw 28 is rotated and the Y-axis moving block 34 is guided by the pair of guide rails 26, and the index feed direction (Y) perpendicular to the machining feed direction (X-axis direction). Moved in the axial direction).

  A pair of guide rails 36 parallel to each other are fixed to the Y-axis moving block 34 by extending in the Z-axis direction. Reference numeral 42 denotes a cutting and feeding means composed of a ball screw 38 and a pulse motor 40, and the ball screw 38 is screwed into a nut (not shown) fixed to the Z-axis moving block 44.

  When the pulse motor 40 of the cutting feed means 42 is driven, the ball screw 38 is rotated and the Z-axis moving block 44 is moved in the cutting feed direction (Z-axis direction). A spindle housing 46 is fixed to the Z-axis moving block 44 so as to extend in the vertical direction, and a cutting means 48 is disposed at the tip (lower end) of the spindle housing 46.

  As shown in FIG. 2, the cutting means 48 includes a spindle 50 that is rotatably accommodated in a spindle housing 46, and a cutting blade 52 that is attached to the tip of the spindle 50. An axis 50a of the spindle 50 extends in the vertical direction.

  During the cutting process, the spindle 50 is rotationally driven at a high speed by a motor (not shown) accommodated in the spindle housing 46. The chuck table 18 is disposed such that the holding surface 18 a is parallel to the axis 50 a of the spindle 50.

  Reference numeral 54 denotes a storage chamber. A liquid such as pure water is supplied from the liquid supply means 58 through the supply port 56 into the storage chamber 54, and the storage chamber 54 is filled with pure water 60. As shown in FIG. 2, the chuck table 18 and the cutting means 48 are immersed in pure water 60. Pure water in the storage chamber 54 is drained through the drain port 62.

  As shown in FIG. 2, the liquid supply means 58 of this embodiment includes a liquid supply source 64 that supplies pure water, a water storage tank 66, and a water supply pump 68. It is preferable to provide a liquid level sensor in the water storage tank 66 so as to manage the incoming water supplied from the liquid supply source 64. A drainage valve 63 is disposed adjacent to the drainage port 62.

  In the cutting apparatus 2 of this embodiment, the chuck table 18 and the cutting blade 52 that hold the workpiece are submerged in the pure water 60, and further, the cutting is performed with the workpiece held in the vertical direction by the chuck table 18. Therefore, cutting waste generated by cutting gathers to the lower end of the storage chamber 54 due to its own weight, and can reduce the risk of adhering to the work piece, and does not dry during processing, and the cutting waste adheres to the work piece. The risk of doing so can be reduced.

  Further, since the cutting process is performed in a state where the processing point is submerged, the cooling effect of the processing point is improved and the processing quality can be improved. Although not shown in the drawing, optical sensors such as a blade breakage detector and a non-contact set-up sensor are arranged around the processing point, but the risk of dirt sticking to these optical sensors is reduced, and the cleaning frequency can be reduced. .

  Referring to FIG. 4, a partial cross-sectional side view of a cutting device 2A according to a second embodiment of the present invention is shown. This embodiment is different from the first embodiment shown in FIGS. 1 and 2 in that the pure water 60 in the storage chamber 54 is circulated by a water pump 74 disposed in the circulation path 72.

  A filtration device 70 is disposed at the discharge port 62 of the storage chamber 54. By circulating the pure water 60 in the storage chamber 54, a flow is formed in the storage chamber 54. The cutting waste is collected in the vicinity of the drain port 62, and the cutting waste can be captured by the filtering device 70 to filter the pure water. .

  Examples of the workpiece suitable for applying the cutting apparatus of the present invention include an optical element wafer that does not like the attachment of cutting waste, or a CSP substrate on which cutting material is generated by cutting.

  In the embodiment described above, the chuck table 18 is moved in the machining feed direction. However, the chuck table 18 may be fixed and the cutting means 48 may be movable in the machining feed direction.

2,2A Cutting device 12 Processing feed means 18 Chuck table 32 Index feed means 42 Cutting feed means 48 Cutting means 50 Spindle 52 Cutting blade 54 Storage chamber 60 Pure water 62 Discharge port 64 Liquid supply source 66 Water storage tank 68 Water feed pump 70 Filtration device 72 Circulation path 74 Water supply pump

Claims (1)

A chuck table having a holding surface for holding the workpiece; a cutting means for cutting the workpiece held on the chuck table; and a spindle on which the cutting blade is mounted; a chuck table; A machining feed means for relatively moving the cutting means in a machining feed direction parallel to the holding surface; and an index feed means for relatively moving the chuck table and the cutting means in an index feed direction perpendicular to the machining feed direction. A cutting device provided,
The cutting means is arranged so that the axis of the spindle is in a vertical direction,
The chuck table is disposed so that the holding surface is parallel to the axis of the spindle,
A storage chamber for storing the chuck table being processed and the cutting blade;
Liquid supply means for supplying liquid to the storage chamber and immersing the chuck table and the cutting blade in the liquid;
A cutting apparatus comprising:

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