JP2012089592A - Photoelectric conversion device and photoelectric conversion module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photoelectric conversion device and a photoelectric conversion module which contribute to the increase of the size.SOLUTION: A photoelectric conversion device 2 includes a heat radiation substrate 5, multiple ceramic substrates 6 disposed on the heat radiation substrate 5 so as to be spaced apart from each other, electrode layers 7 respectively provided at the multiple ceramic substrates, lead frames 8 which are respectively provided on the electrode layers 7 and electrically connect the electrode layers 7, provided on the adjacent ceramic substrates 6, with each other, and multiple photoelectric conversion elements 4 respectively disposed on the multiple ceramic substrates 6 in a planar perspective view.

Description

  The present invention relates to a photoelectric conversion device and a photoelectric conversion module using the photoelectric conversion device.

  In recent years, development of a photoelectric conversion device having a photoelectric conversion element has been advanced. As an exemplary photoelectric conversion device, there is a solar cell device that converts solar energy into electric power. In particular, for the purpose of improving the power generation efficiency, a concentrating solar cell device is being developed. The photoelectric conversion device includes a photoelectric conversion element that converts light energy into electric power energy. When the photoelectric conversion device is, for example, a solar cell device, the photoelectric conversion element is a solar cell element that converts solar energy into electric power energy (see, for example, Patent Document 1).

  Note that in the photoelectric conversion device, a condensing member that condenses light on the photoelectric conversion element is provided on the photoelectric conversion element.

JP-A-9-64396

  Since the photoelectric conversion device collects light and converts it into electricity, when it is installed and used outdoors, it is easily affected by sunlight. Therefore, when trying to enlarge the photoelectric conversion device, there is a problem that the photoelectric conversion device itself is easily affected by thermal expansion, and there is a risk that the photoelectric conversion device may be destroyed.

  This invention is made | formed in view of the above, Comprising: It aims at providing the photoelectric conversion apparatus and photoelectric conversion module which can contribute to enlargement.

  A photoelectric conversion device according to an embodiment of the present invention includes a heat dissipation substrate, a plurality of ceramic substrates that are spaced apart from each other on the heat dissipation substrate, and an electrode provided on each of the plurality of ceramic substrates. Layer, and a lead frame provided on each of the electrode layers provided on the plurality of ceramic substrates and electrically connecting the electrode layers provided on the adjacent ceramic substrates, and seen through in plan view And a plurality of photoelectric conversion elements disposed on each of the plurality of ceramic substrates.

  Moreover, the photoelectric conversion module which concerns on one Embodiment of this invention is provided with the said photoelectric conversion apparatus and the condensing member provided above the said photoelectric conversion apparatus.

  ADVANTAGE OF THE INVENTION According to this invention, the photoelectric conversion apparatus and photoelectric conversion module which can contribute to enlargement can be provided.

It is a disassembled perspective view which shows the external appearance of the photoelectric conversion module which concerns on this embodiment. It is a partial sectional view of a photoelectric conversion module concerning this embodiment. It is the top view and sectional drawing of the photoelectric conversion apparatus which concern on this embodiment. It is a top view of the lead frame of the photoelectric conversion apparatus concerning this embodiment. It is the top view and sectional drawing of the photoelectric conversion apparatus which concern on this embodiment, Comprising: The state which excluded the photoelectric conversion element and the lead frame is shown. It is the top view and sectional drawing of the photoelectric conversion apparatus which concern on one modification.

  Exemplary embodiments of a photoelectric conversion device and a photoelectric conversion module according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited to the example of the following embodiment.

<Schematic configuration of photoelectric conversion module>
FIG. 1 is an overview perspective view of a photoelectric conversion module 1 according to the present embodiment, and an exploded perspective view in which a part thereof is enlarged. FIG. 2 is a cross-sectional view of the photoelectric conversion device 2 and the light collecting member 3 which are part of the photoelectric conversion module 1 shown in FIG. FIG. 3A is a plan view of the photoelectric conversion device 2 illustrated in FIG. FIG. 3B is a cross-sectional view of the photoelectric conversion device 2 illustrated in FIG. 2, and is a cross-sectional view taken along the line AA ′ of the plan view of FIG. FIG. 4 is a plan view of the lead frame. 5 (A) and 5 (B) correspond to FIGS. 3 (A) and 5 (B), and show a state in which the photoelectric conversion element, the lead frame, and the bonding resin are removed from FIG. ing.

  The photoelectric conversion module 1 according to the present embodiment is a photovoltaic power generation module that converts sunlight into electric power. Moreover, the photoelectric conversion apparatus 2 according to the present embodiment includes a photoelectric conversion element 4 that collects light. For example, the photoelectric conversion element 4 has a function of collecting sunlight to generate power. As shown in FIG. 1, the photoelectric conversion module 1 includes a plurality of photoelectric conversion devices 2. A plurality of photoelectric conversion devices 2 are electrically connected in parallel or in series.

  The photoelectric conversion module 1 includes a plurality of photoelectric conversion devices 2 and a light collecting member 3 that receives light. The condensing member 3 is provided above the photoelectric conversion device 2. The condensing member 3 is, for example, a dome-shaped Fresnel lens. The condensing member 3 has a function of collecting light received from the outside and collecting the received light on the photoelectric conversion element 4 of the photoelectric conversion device 2. The light collecting member 3 is made of, for example, glass, plastic, resin, or the like. The condensing member 3 includes a frame member 3a and a lens member 3b, and is fixed by the frame member 3a so as to surround the outer periphery of the lens member 3b.

  As shown in FIG. 2 or FIG. 3, the photoelectric conversion device 2 includes a heat dissipating substrate 5, a plurality of ceramic substrates 6 disposed on the heat dissipating substrate 5, and a plurality of ceramic substrates 6 respectively. The electrode layer 7 provided on the electrode layer 7, and the lead frame 8 provided on each of the electrode layers 7 and electrically connected to each other on the adjacent ceramic substrate 6. And a plurality of photoelectric conversion elements 4 arranged so as to overlap each of the substrates 6.

The heat dissipation substrate 5 has a function of radiating heat transmitted to the photoelectric conversion element 4 to the outside. The photoelectric conversion device 2 generates heat by converting a part of the energy of the light transmitted through the light collecting member 3 into heat. Therefore, the heat dissipation substrate 5 is made of a material that easily transfers heat from the photoelectric conversion element 4. The heat dissipation substrate 5 is made of a metal material having excellent heat dissipation, such as aluminum, copper, or molybdenum. The heat conductivity of the heat dissipation substrate 5 is set to 80 W / (m · K) or more, for example. Moreover, the thermal expansion coefficient of the thermal radiation board | substrate 5 is set to 5 * 10 < ^-6 > / degreeC or more and 20 * 10 < ^-6 > / degreeC or less, for example.

  The size of the heat dissipating substrate 5 is set to such a size that a plurality of ceramic substrates 6 can be provided. The size of the heat dissipation substrate 5 is set such that, for example, the length of one side in a plan view is 20 mm or more and 200 mm or less, and the thickness in the vertical direction is 0.5 mm or more and 10 mm or less.

  On the lower surface of the heat radiating substrate 5, heat radiating fins 9 are provided. The heat radiating fins 9 have a function of radiating heat transmitted to the heat radiating substrate 5 toward the outside. The heat radiating fins 9 are made of, for example, a metal material having excellent heat radiating properties such as aluminum, copper, or molybdenum. The heat radiating fins 9 are connected to the lower surface of the heat radiating substrate 5 through, for example, soldering, brazing, or grease.

The ceramic substrate 6 is made of, for example, a ceramic material such as alumina, mullite, or aluminum nitride, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials. The thermal conductivity of the ceramic substrate 6 is set to, for example, 14 W / m · K or more and 200 W / m · K or less. Moreover, the thermal expansion coefficient of the ceramic substrate 6 is set to, for example, 3 × 10 ⁻⁶ / ° C. or more and 10 × 10 ⁻⁶ / ° C. or less.

  The size of each ceramic substrate 6 is set such that one photoelectric conversion element 4 can be mounted on the upper surface of one ceramic substrate 6. The size of each ceramic substrate 6 is set such that, for example, the length of one side in a plan view is 3 mm or more and 30 mm or less, and the thickness in the vertical direction is 0.1 mm or more and 5 mm or less.

  An electrode pattern as an electrode layer 7 is provided on each ceramic substrate 6. The electrode layer 7 is electrically connected to the photoelectric conversion element 4 and is for taking out the electric power generated by the photoelectric conversion element 4 to the outside. The electrode layer 7 is made of, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof.

  The photoelectric conversion element 4 is disposed on the ceramic substrate 6 in plan view and is electrically connected to the lead frame 8. The photoelectric conversion element 4 is electrically connected to the lead frame 8 via, for example, solder. Further, the photoelectric conversion element 4 may be mounted on the electrode pattern metallized on the ceramic substrate 6, and the lead frame 8 may be mounted on the electrode pattern.

The photoelectric conversion element 4 has a function of converting light into electric power. The photoelectric conversion element 4 is a solar cell element including a III-V group compound semiconductor, for example. The photoelectric conversion element 4 can immediately convert the received light into electric power and output it by the photovoltaic effect. An exemplary solar cell element has an InGaP / GaAs / Ge3 junction cell structure. The indium gallium phosphide (InGaP) top cell converts energy contained in a wavelength region of 660 nm or less. The gallium arsenide (GaAs) middle cell converts energy contained in a wavelength region of 660 nm or more and 890 nm or less. The germanium (Ge) bottom cell converts energy contained in a wavelength region of 890 nm or more and 2000 nm or less. The three cells are connected in series via a tunnel junction. The open circuit voltage is the sum of the electromotive voltages of the three cells. The size of the photoelectric conversion element 4 is set such that, for example, the length of one side in a plan view is 3 mm or more and 15 mm or less, and the thickness in the vertical direction is 0.3 mm or more and 5 mm or less. In a state where one photoelectric conversion element 4 is superposed on one ceramic substrate 6, the gap between the end of the ceramic substrate 6 and the end of the photoelectric conversion element 4 when viewed in plan is, for example, 10 mm or less. Is set to

  The lead frame 8 provided on the ceramic substrate 6 is for taking out the electric power generated by the photoelectric conversion element 4 to the outside. The lead frame 8 is electrically connected to each photoelectric conversion element 4. The lead frame 8 is made of a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof.

  As shown in FIG. 4, the lead frame 8 is formed in a lattice shape and functions as a terminal. A part of the outer edge of the lead frame 8 is provided with a pair of lead terminals 8a. The pair of lead terminals 8 a are provided symmetrically with respect to the lead frame 8. Each photoelectric conversion element 4 is provided in a region where the lead frame 8 intersects.

  A ceramic base 10 is provided below the pair of lead terminals 8a. The ceramic base 10 is for supporting the lead terminals 8a. The ceramic base 10 is provided on a part of the outer peripheral edge of the heat dissipation board 5 on the upper surface of the heat dissipation board 5. The ceramic base 10 is connected to the heat dissipation substrate 5 via, for example, solder.

The ceramic base 10 is made of, for example, a ceramic material such as alumina, mullite, or aluminum nitride, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials. The thermal conductivity of the ceramic substrate 6 is set to, for example, 14 W / m · K or more and 200 W / m · K or less. Moreover, the thermal expansion coefficient of the ceramic substrate 6 is set to, for example, 3 × 10 ⁻⁶ / ° C. or more and 10 × 10 ⁻⁶ / ° C. or less.

  The ceramic base 10 is made of the same material as that of the ceramic substrate 6, whereby the thermal expansion coefficient of the ceramic substrate 6 and the thermal expansion coefficient of the ceramic base 10 can be matched. By combining the thermal expansion coefficients of the ceramic substrate 6 and the ceramic base 10, the heat stress applied to the lead frame 8 due to the difference in thermal expansion coefficient between the two is suppressed due to the heat of sunlight or the like. can do. As a result, the lead frame 8 can be prevented from being deformed and peeled off from the ceramic substrate 6, and the hermeticity of the photoelectric conversion device 2 can be improved.

  A frame body 11 is provided on the heat dissipation substrate 5 so as to surround the plurality of photoelectric conversion elements 4. A part of the frame body 11 is provided with a gap in which a part of the frame body 11 is interrupted, and the ceramic base 10 is provided in the gap. The frame 11 is made of, for example, a material such as aluminum, copper, molybdenum, or an iron-based alloy. The frame body 11 and the ceramic base 10 can surround the plurality of photoelectric conversion elements 4 in plan view. The frame 11 is connected to the heat dissipation substrate 5 via, for example, a brazing material, a solder material, or a bonding resin.

  A bonding resin 12 is provided on the frame 11 on which the plurality of photoelectric conversion elements 4 are not provided and the outer periphery of the ceramic base 10. The bonding resin 12 is for bonding the light-transmitting substrate 13 disposed to face the heat dissipation substrate 5. By providing the bonding resin 12 continuously on the frame 11 and the outer periphery of the ceramic base 10, the plurality of photoelectric conversion elements 4 can be hermetically sealed by the heat dissipation substrate 5 and the light transmissive substrate 13. The bonding resin 12 is made of a material such as an epoxy resin or a silicone resin, for example.

  The photoelectric light emitting element 4 is hermetically sealed by being surrounded by the heat dissipation substrate 5, the ceramic base 10, the frame 11, the bonding resin 12, and the light transmissive substrate 13. Note that the space to be hermetically sealed is filled with an inert gas. Alternatively, the hermetically sealed space is maintained in a low pressure state having a lower pressure than the atmosphere.

  The light transmissive substrate 13 is provided so as to face the heat dissipation substrate 5. The light transmissive substrate 13 transmits sunlight and can irradiate the plurality of photoelectric conversion elements 4. The light transmissive substrate 13 is made of a light transmissive material such as glass, plastic, or resin. The size of the light-transmitting substrate 13 overlaps with the heat dissipation substrate 5. For example, the length of one side when viewed in plan is 20 mm or more and 200 mm or less, and the vertical thickness is 0.2 mm or more. It is set to 5 mm or less.

  The light transmissive substrate 13 is provided so as to be spaced from the photoelectric conversion element 4. By providing the photoelectric conversion element 4 and the light-transmitting substrate 13 through a hermetically sealed space, a part of the light-transmitting substrate 13 comes into contact with the photoelectric conversion element 4 and the light-transmitting substrate 13 or photoelectric It can suppress that the conversion element 4 is damaged. If the photoelectric conversion element 4 is damaged, the photoelectric conversion efficiency of the photoelectric conversion element 4 may be reduced. However, according to the present embodiment, since the two do not contact, the photoelectric conversion efficiency of the photoelectric conversion element 4 is reduced. Can be suppressed. In addition, if the light-transmitting substrate 13 is damaged, there is a possibility that the light traveling from the light collecting member 3 toward the photoelectric conversion element 4 is diffusely reflected at the damaged portion. However, according to the present embodiment, the two are not in contact with each other. It is possible to suppress a reduction in the amount of light condensed on the photoelectric conversion element 4.

  The lead terminals 8a of the lead frame 8 are provided so as to extend from the inside of the light transmissive substrate 13 toward the outside of the light transmissive substrate 13 in plan view. The electric power generated by each photoelectric conversion element 4 is taken out from the lead terminal 8a toward the outside.

  The photoelectric conversion module 1 and the photoelectric conversion device 2 collect light and convert it into electricity. Since it is often used outdoors, it is easily affected by the heat of sunlight. Further, the photoelectric conversion module 1 and the photoelectric conversion device 2 are greatly influenced by the temperature difference of the outside air between day and night. Furthermore, the photoelectric conversion module 1 and the photoelectric conversion device 2 are also affected by the weather. Therefore, the photoelectric conversion module 1 and the photoelectric conversion device 2 are placed in an environment in which thermal expansion is likely to occur due to a difference in temperature.

  Therefore, in the photoelectric conversion module 1 and the photoelectric conversion device 2, the substrate on which the photoelectric conversion element 4 is mounted or the photoelectric conversion element 4 is destroyed due to the difference in thermal expansion coefficient between the heat dissipation substrate 5 and the substrate on which the photoelectric conversion element 4 is mounted. There is a risk. In particular, if the photoelectric conversion module 1 and the photoelectric conversion device 2 are to be increased in size, there is a high possibility that the substrate on which the photoelectric conversion element 4 is mounted or the photoelectric conversion element 4 is destroyed. However, if it is joined to the copper heat dissipation substrate 5, for example, there is a problem that the larger the ceramic substrate, the easier it is to crack because the difference in the coefficient of thermal expansion of copper is large.

  The photoelectric conversion module 1 and the photoelectric conversion device 2 according to the present embodiment have a structure in which a plurality of ceramic substrates 6 are mounted on a large heat dissipation substrate 5 and the photoelectric conversion elements 4 are mounted on each ceramic substrate 6. . As a result, the substrate on which the plurality of photoelectric conversion elements 4 are mounted is divided into a plurality of portions and mounted on the heat dissipation substrate 5, thereby reducing the influence of thermal expansion due to the difference in thermal expansion coefficient between the heat dissipation substrate 5 and the ceramic substrate 6. It is possible to suppress the peeling of the ceramic substrate 6 from the heat dissipation substrate 5. And the possibility that the photoelectric conversion element 4 may be destroyed can be reduced, and the photoelectric conversion module 1 and the photoelectric conversion device 2 can be enlarged.

  In addition, by providing the lead frame 8 that electrically connects the plurality of photoelectric conversion elements 4 to each other, the wiring pattern for electrically connecting the plurality of photoelectric conversion elements 4 can be simplified. Since it is no longer necessary to electrically connect the photoelectric conversion elements 4 with wires or the like, the manufacturing process can be simplified and the yield can be improved.

  Further, since the lead frame 8 is connected to the plurality of photoelectric conversion elements 4 or the plurality of ceramic substrates 6, the heat dissipation substrate can be used to position and mount the photoelectric conversion elements 4 or the ceramic substrate 6 with respect to the heat dissipation substrate 5. Compared to mounting the photoelectric conversion elements 4 or the ceramic substrates 6 one by one with respect to 5, it can be positioned and mounted at a time. As a result, even when the photoelectric conversion element 4 or the ceramic substrate 6 is mounted on the heat dissipation substrate 5, the manufacturing process can be simplified and the yield can be improved.

  As described above, according to the present embodiment, it is possible to provide the photoelectric conversion device 2 and the photoelectric conversion module 1 that can contribute to an increase in size.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  Hereinafter, modifications of the embodiment of the present invention will be described. Note that, in the photoelectric conversion module 1 and the photoelectric conversion device 2 according to the modification of the embodiment of the present invention, portions similar to those of the photoelectric conversion module 1 and the photoelectric conversion device 2 according to the embodiment of the present invention are denoted by the same reference numerals. The description will be omitted as appropriate. FIG. 6 is a diagram illustrating a photoelectric conversion device 2 according to a modification, and FIGS. 6A and 6B correspond to FIGS. 3A and 3B. Note that FIG. 6B is a cross-sectional view taken along B-B ′ in FIG.

  In the photoelectric conversion device 2 according to the above-described embodiment, the ceramic base 10, the frame body 11, and the bonding resin 12 are provided and the plurality of photoelectric conversion elements 4 are sealed. For example, as shown in FIG. 6, a transparent resin 14 is filled between the heat dissipation substrate 5 and the light transmissive substrate 13 without providing the ceramic base 10, the frame body 11, and the bonding resin 12. There may be.

  The translucent resin 14 transmits light and joins the heat dissipation substrate 5 and the light transmissive substrate 13 together. The transparent substrate 13 is, for example, a thermosetting resin such as polyimide resin, acrylic resin, epoxy resin, urethane resin, cyanate resin, silicone resin or bismaleimide triazine resin, or polyether ketone resin, polyethylene terephthalate resin or polyphenylene ether resin. It is made of a material having excellent sealing properties such as a thermoplastic resin.

  The photoelectric conversion device 2 according to this modification can improve the adhesion between the heat-radiating substrate 5 and the light-transmitting substrate 13 by covering the plurality of photoelectric conversion elements 4 with the light-transmitting resin 14. The substrate 5 and the light transmissive substrate 13 can be made difficult to peel off, and the airtightness of the plurality of photoelectric conversion elements 4 sandwiched between the heat dissipation substrate 5 and the light transmissive substrate 13 can be favorably maintained. .

<Method for producing photoelectric conversion module>
Here, the manufacturing method of the photoelectric conversion module 1 and the photoelectric conversion apparatus 2 is demonstrated.

  First, the ceramic substrate 6 and the ceramic base 10 are prepared. When the ceramic substrate 6 and the ceramic base 10 are made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, or calcium oxide. Add and mix to obtain a mixture. Then, the molds of the ceramic substrate 6 and the ceramic base 10 are filled with the mixture and dried, and then the ceramic substrate 6 and the ceramic base 10 before sintering are taken out.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. Then, a metallized layer for bonding the photoelectric conversion element 4 is formed on the upper surface of the ceramic substrate 6 before sintering by applying a metal paste using, for example, a screen printing method.

  Thereafter, the ceramic substrate 6 and the ceramic base 10 are fired at a temperature of about 1600 ° C., whereby the ceramic substrate 6 and the ceramic base 10 can be respectively produced. A plurality of ceramic substrates 6 are produced, and two ceramic bases 10 are produced.

  Next, the lead frame 8 is prepared, and the ceramic substrate 6 is positioned and bonded to a region where the lead frame 8 intersects, for example, with silver solder. Further, the ceramic base 10 is positioned and bonded to the position of the lead frame drawn out from the heat radiating substrate 5 by, for example, silver solder.

  Then, the photoelectric conversion element 4 is positioned and joined to each region where the leads of the grid-like lead frame 8 intersect with each other through, for example, solder. In this way, the plurality of photoelectric conversion elements 4 are provided on the lead frame 8.

  Then, the ceramic substrate 6 and the ceramic base 10 are positioned on the lead frame 8 and the photoelectric conversion element 4 mounted thereon is fixed to the heat dissipation substrate 5 with, for example, solder.

  Since a plurality of photoelectric conversion elements 4 are provided in advance, the photoelectric conversion elements 4 can be provided on each of the ceramic substrates 6 on the heat dissipation substrate 5 in a single process.

  Next, the frame 11 and the light transmissive substrate 13 are prepared. Then, the frame body 11 is joined to the heat dissipation substrate 5 via, for example, solder so as to surround the plurality of photoelectric conversion elements 4 along the outer periphery of the heat dissipation substrate 5. Then, a bonding resin 12 made of, for example, an epoxy resin is attached along the outer periphery of the frame 11 of the heat dissipation substrate 5. Thereafter, the light transmissive substrate 13 is positioned so as to face the heat radiating substrate 5, and heat is radiated through the bonding resin 12 deposited along the outer periphery of the frame 11 of the heat radiating substrate 5 in an inert gas atmosphere. The substrate 5 and the light transmissive substrate 13 are bonded. In this way, the photoelectric conversion device 2 can be manufactured.

  A method for manufacturing such a photoelectric conversion module 1 will be described. First, a plurality of photoelectric conversion devices 2 and heat radiation fins 9 are prepared.

  Next, the radiation fin 9 is joined to the lower surface of the photoelectric conversion device 2 through, for example, solder. And the photoelectric conversion module 1 is producible by electrically connecting the lead terminals 8a of each photoelectric conversion apparatus 2, and providing the condensing member 3 on the photoelectric conversion apparatus 2. FIG.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion module 2 Photoelectric conversion apparatus 3 Condensing member 3a Frame member 3b Lens member 4 Photoelectric conversion element 5 Radiation substrate 6 Ceramic substrate 7 Electrode layer 8 Lead frame 8a Lead terminal 9 Radiation fin 10 Ceramic base 11 Frame body 12 Bonding resin 13 Light-transmissive substrate 14 Translucent resin

Claims (7)

A heat dissipation substrate;
A plurality of ceramic substrates each spaced apart on the heat dissipation substrate;
An electrode layer provided on each of the plurality of ceramic substrates;
A lead frame provided on each of the electrode layers and electrically connecting the electrode layers provided on the adjacent ceramic substrate;
A photoelectric conversion device comprising: a plurality of photoelectric conversion elements arranged on each of the plurality of ceramic substrates in a plan view. The photoelectric conversion device according to claim 1,
The photoelectric conversion device, wherein the photoelectric conversion element is bonded onto the lead frame. The photoelectric conversion device according to claim 1 or 2, wherein
A photoelectric conversion device comprising a light-transmitting substrate provided to be opposed to the heat dissipation substrate. The photoelectric conversion device according to claim 3,
A part of the lead frame extends from the inside of the light transmissive substrate to the outside of the light transmissive substrate in a plan view. The photoelectric conversion device according to claim 3,
A frame is provided on the outer periphery of the heat dissipation substrate so as to surround the plurality of photoelectric conversion elements. The photoelectric conversion device according to claim 3,
A photoelectric conversion device, wherein a light-transmitting resin is filled between the heat dissipation substrate and the light-transmitting substrate. A photoelectric conversion device according to any one of claims 1 to 6,
And a light collecting member provided above the photoelectric conversion device for receiving light from outside and collecting the light on the photoelectric conversion element.

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