JP2011151276A - Photoelectric converter and photoelectric conversion module - Google Patents

Abstract

An object of the present invention is to provide a photoelectric conversion device and a photoelectric conversion module that are excellent in heat dissipation.
A photoelectric conversion device includes an element mounting substrate, a photoelectric conversion element provided in a central region of the upper surface of the element mounting substrate, and a photoelectric conversion element provided on the upper surface of the element mounting substrate. And the lower part extends from the central region toward the peripheral region located on the outer periphery of the central region and is joined to the upper surface of the element mounting substrate 5 and is joined to the upper part of the frame 10. A condensing member 9 provided in a region overlapping with the photoelectric conversion element 7 and a conductive member 11 provided in a lower surface of the element mounting substrate 5 and provided in a region overlapping the frame body 10 in a plan view. The photoelectric conversion device, wherein the thermal expansion coefficient of the body 10 and the conductive member 11 is larger than the thermal expansion coefficient of the element mounting substrate 5.
[Selection] Figure 3

Description

  The present invention relates to a photoelectric conversion device and a photoelectric conversion module using the photoelectric conversion device.

  In recent years, development of a photoelectric conversion device having a photoelectric conversion element has been advanced. As an exemplary photoelectric conversion device, there is a solar cell device that converts solar energy into electric power. In particular, for the purpose of improving the power generation efficiency, a concentrating solar cell device is being developed. In the case of this solar cell device, the photoelectric conversion element is a solar cell element that converts solar energy into electric power. For example, Patent Document 1 discloses a structure for efficiently irradiating condensed solar light onto a solar cell element.

JP 2009-147155 A

  By the way, in the structure of the solar cell device, a technology for efficiently radiating the heat of the substrate on which the solar cells are mounted has been developed.

  This invention is made | formed in view of the said subject, and it aims at providing the photoelectric conversion apparatus and photoelectric conversion module excellent in heat dissipation.

  In order to solve the above problems, a photoelectric conversion device according to the present invention includes an element mounting substrate, a photoelectric conversion element, a frame, a light collecting member, and a conductive member, and the frame and the conductive member. The thermal expansion coefficient of the conductive member is larger than the thermal expansion coefficient of the element mounting substrate. The photoelectric conversion element is provided in a central region on the upper surface of the element mounting substrate. The frame body is provided on an upper surface of the element mounting substrate, surrounds the photoelectric conversion element, and a lower portion extends from the central region toward a peripheral region located on an outer periphery of the central region, and the element mounting substrate. It is joined to the upper surface of. The condensing member is joined to the upper part of the frame and is provided in a region overlapping the photoelectric conversion element. The conductive member is provided on a lower surface of the element mounting substrate, and is provided in a region overlapping the frame body as seen through a plane.

  The photoelectric conversion module according to the present invention includes the photoelectric conversion device and a light receiving member that is provided on the photoelectric conversion device and collects light on the light collecting member.

  The present invention can provide a photoelectric conversion device and a photoelectric conversion module excellent in heat dissipation.

It is a disassembled perspective view which shows the external appearance of the photoelectric conversion module which concerns on this embodiment. It is an outline perspective view of a photoelectric conversion device concerning this embodiment. It is sectional drawing when the photoelectric conversion apparatus shown in FIG. 2 is cut | disconnected by the AA line. It is a general-view perspective view of the photoelectric conversion apparatus which concerns on the modification 1 of this embodiment. It is sectional drawing when the photoelectric conversion apparatus shown in FIG. 4 is cut | disconnected by the BB line. It is sectional drawing of the photoelectric conversion apparatus which concerns on the modification 2 of this embodiment. It is sectional drawing of the photoelectric conversion apparatus which concerns on the modification 3 of this embodiment. It is sectional drawing of the photoelectric conversion apparatus which concerns on the modification 4 of this embodiment. It is sectional drawing of the photoelectric conversion apparatus which concerns on the modification 5 of this embodiment. It is sectional drawing of the photoelectric conversion apparatus which concerns on the modification 6 of this embodiment. It is an outline perspective view of the photoelectric conversion module concerning this embodiment.

  Hereinafter, a photoelectric conversion device and a photoelectric conversion module according to an embodiment of the present invention will be described with reference to the drawings.

<Embodiment>
<Configuration of photoelectric conversion module and photoelectric conversion device>
The photoelectric conversion module 1 according to the present embodiment is a solar power generation module that converts solar energy into electric power. The photoelectric conversion device 2 according to the present embodiment includes a photoelectric conversion element 5 that converts light energy into electric power. For example, the photoelectric conversion element 7 is a solar cell element having a function of converting solar energy into electric power.

  The photoelectric conversion module 1 includes a plurality of photoelectric conversion devices 2, a light receiving member 3 and an external substrate 4 provided above the plurality of photoelectric conversion devices 2. The light receiving member 3 has a function of receiving light from the outside and collecting the received light on the light collecting member 9. The light receiving member 3 is configured by fixing a plurality of lens members 3b to a rectangular frame member 3a. The lens member 3b of the light receiving member 3 is, for example, a dome-shaped Fresnel lens, and is made of a resin material having excellent optical characteristics such as acrylic resin. The plurality of photoelectric conversion devices 2 are fixed to the external substrate 4. The light receiving member 3 covers the plurality of photoelectric conversion devices 2 fixed to the external substrate 4.

  The light incident on the light receiving member 3 is collected at the upper end of the light collecting member 9 of the photoelectric conversion device 2. That is, the condensing member 9 has a function of guiding the light collected by the light receiving member 3 to the photoelectric conversion element 7. The light incident on the light collecting member 9 enters the light receiving surface 8 on the upper surface of the photoelectric conversion element 7 from the lower end of the light collecting member 9. The photoelectric conversion element 7 converts light energy into electric power. The external substrate 4 has a function to dissipate heat generated from the photoelectric conversion device 2. The external substrate 4 is made of a metal material such as aluminum, copper, or a carbon-metal composite material. The thermal conductivity of the external substrate 4 is set to, for example, 100 (W / m · K) or more and 500 (W / m · K) or less.

  As shown in FIG. 3, the photoelectric conversion device 2 is provided on the element mounting substrate 5, the photoelectric conversion element 7 provided in the central region of the upper surface of the element mounting substrate 5, and the upper surface of the element mounting substrate 5. 7, a lower portion extends from the central region toward a peripheral region located on the outer periphery of the central region, and is joined to the upper surface of the element mounting substrate 5, and is joined to the upper portion of the frame 10. And a condensing member 9 provided in a region overlapping with the photoelectric conversion element 7 and a conductive member 11 provided on a lower surface of the element mounting substrate 5 and provided in a region overlapping the frame body 10 in a plan view. Yes.

  The element mounting substrate 5 is a member formed in a rectangular shape when seen through the plane. The element mounting substrate 5 is made of an insulating material, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or glass. Made of ceramic material such as ceramic. Alternatively, the element mounting substrate 5 is composed of a composite system obtained by mixing a plurality of these materials. Moreover, the thickness of the element mounting substrate 5 is set to 0.05 mm or more and 1.0 mm or less, for example.

  The thermal conductivity of the element mounting substrate 5 is set to 15 (W / m · K) or more and 250 (W / m · K) or less, for example. The coefficient of thermal expansion of the element mounting substrate 5 is set to 5 (ppm / ° C.) or more and 10 (ppm / ° C.) or less. In addition, the shape of the element mounting substrate 5 when seen in a plan view is not limited to a rectangular shape, and may be a circular shape or the like.

  Further, as shown in FIG. 3, the element mounting substrate 5 is provided with a conductive layer 6 that is electrically connected to the photoelectric conversion element 7 and the conductive member 11. That is, the conductive layer 6 electrically connected to the photoelectric conversion element 7 is provided in the central region on the upper surface of the element mounting substrate 5. In addition, a conductive layer 6 that is electrically connected to the photoelectric conversion element 7 and the conductive member 11 is provided in a via portion inside the element mounting substrate 5. The conductive layer 6 is made of, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, chromium, tungsten, molybdenum, or manganese, or an alloy thereof. For example, it is formed using a metallization forming technique by a screen printing method.

  The photoelectric conversion element 7 is, for example, a solar cell element that includes a III-V group compound semiconductor. The photoelectric conversion element 7 can immediately convert the received light energy into electric power and output it by the photovoltaic effect. For example, the solar cell element has an InGaP / GaAs / Ge3 junction type cell structure. The indium gallium phosphide (InGaP) top cell converts energy contained in a wavelength region of 660 nm or less. The gallium arsenide (GaAs) middle cell converts energy contained in a wavelength region from 660 nm to 890 nm. The germanium (Ge) bottom cell converts light contained in a wavelength region from 890 nm to 2000 nm. The three cells are connected in series via a tunnel junction. The open circuit voltage is the sum of the electromotive voltages of the three cells. A light receiving surface 8 that receives light collected from the light collecting member 9 is formed on the upper surface of the photoelectric conversion element 7.

  In addition, a lower surface electrode is formed on the lower surface of the photoelectric conversion element 7. The lower surface electrode of the photoelectric conversion element 7 is formed of, for example, silver, aluminum or the like. The photoelectric conversion element 7 is mounted on the conductive layer 6 provided in the central region of the upper surface of the element mounting substrate 5 via a bonding material such as low melting point solder or conductive epoxy resin, and the lower surface of the photoelectric conversion element 7. The electrode and the conductive layer 6 are electrically connected.

  An upper surface electrode is provided on the upper surface of the photoelectric conversion element 7. The upper surface electrode of the photoelectric conversion element 7 is formed of, for example, silver, aluminum or the like. The photoelectric conversion element 7 is a conductive wire, and the upper surface electrode of the photoelectric conversion element 7 and the conductive layer 6 in the via portion are electrically connected. In addition, the electric current per one conductive wire reduces and the generation | occurrence | production of the heat | fever of a conductive wire is suppressed by making the connection location of the upper surface electrode of the photoelectric conversion element 7, and the conductive layer 6 more than one place. be able to. As a result, the reliability of the conductive wire can be improved.

  Moreover, since the electrical connection is maintained at a plurality of connection locations by using a plurality of conductive wire connection locations, the photoelectric conversion device 2 can be prevented from becoming defective. Moreover, also in the point which ensures the electrical connection of the photoelectric conversion apparatus 2, it is preferable that the connection location of the photoelectric conversion element 7 and the conductive layer 6 is made into multiple places.

  The condensing member 9 is a member formed in a rectangular shape when seen through on a plane. The condensing member 9 is joined to the upper portion of the frame body 10 and is provided in a region overlapping the photoelectric conversion element 9. The condensing member 9 has a function of condensing light on the photoelectric conversion element 7. Further, the light condensing member 9 has translucency and has a function of guiding the light reaching from the light receiving member 3 to the photoelectric conversion element 7. The translucency of the condensing member 9 means that when the photoelectric conversion element 7 is a solar cell element, light included in at least a part of the wavelength region of sunlight can be transmitted. The condensing member 9 is made of, for example, borosilicate glass, plastic, or translucent resin.

  Further, a metal layer is formed on the side surface of the light collecting member 9 over the entire circumference for joining with the frame body 10. The metal layer on the side surface is formed by a thin film forming technique such as vapor deposition or sputtering. A metal layer consists of metal materials, such as titanium, platinum, gold | metal | money, chromium, nickel, gold | metal | money, silver, copper, or those alloys, for example. The metal layer on the side surface of the light collecting member 9 is joined to the frame body 10 over the entire circumference of the frame body 10 through a joining member made of, for example, a brazing material, solder, low melting point glass, epoxy resin, or the like. The bonding method includes, for example, a method such as solder bonding, solder bonding, or resin bonding.

  The brazing material is made of, for example, silver-copper brazing. The solder is made of gold-tin, gold-germanium, tin-lead, or the like. The low melting point glass means a glass having a glass transition point of 600 ° C. or lower. The light condensing member 9 is joined to the frame body 10 at the upper part of the frame body 10. Further, the condensing member 9 is joined at any position of the inclined portion 10a of the frame 10 as long as the condensing member 9 is at a position of the inclined portion 10a of the frame 10 and can be condensed on the photoelectric conversion element 7. Also good. The frame 10 will be described later.

  Moreover, the condensing member 9 should just have the function to equalize the intensity distribution of the light energy in a cross-sectional area by reflection of light.

  The frame 10 is a member formed in a rectangular shape when seen through on a plane. The frame 10 is provided on the upper surface of the element mounting substrate 5, surrounds the photoelectric conversion element 7, and the lower portion extends from the central region toward the peripheral region located on the outer periphery of the central region, and the upper surface of the element mounting substrate 5. It is joined with. The frame body 10 has an upper portion extending above the element mounting substrate 5, an inclined portion 10 a joined to the light collecting member 9, and a lower portion facing a peripheral region located on the outer periphery of the central region of the element mounting substrate 5. And an extending portion 10b that is joined to the upper surface of the element mounting substrate 5. The frame body 10 has a function of supporting the light collecting member 9. The light collecting member 9 is joined to the frame 10 at the upper part of the frame 10. The frame 10 is a member formed in a rectangular shape when seen through on a plane, but is not limited to a rectangular shape, and may be formed in a circular shape or the like.

  The frame 10 is provided on a metal material such as aluminum, copper or silver, an alloy containing these metal materials, a composite material in which sintered tungsten is impregnated with copper, or copper-impregnated tungsten, for example. It consists of a composite material in which a plurality of through holes are filled with copper or a composite material in which various metals are laminated in layers. The thermal conductivity of the frame 10 is set to, for example, 100 (W / m · K) or more and 500 (W / m · K) or less. The thermal expansion coefficient of the frame 10 is set to 10 (ppm / ° C.) or more and 25 (ppm / ° C.) or less. Thereby, the heat generated in the vicinity of the photoelectric conversion element 7 is thermally conducted to the frame 10 and efficiently radiated to the outside.

  The frame 10 has a mirror-finished inner surface of an inclined portion 10 a extending above the element mounting substrate 5. The frame 10 can improve the light reflection efficiency by mirror finishing. Moreover, the frame 10 can suppress a temperature rise. The mirror surface processing may be processed so as to be finished smoothly by grinding or may be processed by plating. Further, the thickness of the inclined portion 10a of the frame body 10 is set to, for example, 0.3 mm or more and 3.0 mm or less in order to suppress the leakage of the light reflected by the photoelectric conversion element 7 to the outside. Moreover, the thickness of the extension part 10b of the frame 10 is set to 0.3 mm or more and 3.0 mm or less, for example.

  Moreover, since the frame 10 is joined only by the side surface of the light collecting member 9, the joint area between the frame 10 and the light collecting member 9 can be reduced. As a result, the compressive stress from the frame 10 to the light collecting member 9 can be reduced, and the displacement of the irradiation light on the light receiving surface 8 of the photoelectric conversion element 7 due to the change in the refractive index of the light collecting member 9 can be suppressed. Condensability can be improved.

  Further, the frame body 10 is joined to the light collecting member 9 over the entire circumference of the frame body 10 and is provided above the photoelectric conversion element 7 via a space 20. As a result, the photoelectric conversion element 7 is provided in a space 20 surrounded by the element mounting substrate 5, the frame body 10, and the light collecting member 9 and hermetically sealed. Since the photoelectric conversion element 7 can be hermetically sealed by being provided in the internal space 20, the moisture resistance of the photoelectric conversion element 7 is improved, and the photoelectric conversion element 7 is reliable over a long period of time. Can work well.

  The conductive member 11 is, for example, a metal material such as aluminum, copper or silver, an alloy containing these metal materials, a composite material in which copper is impregnated with sintered tungsten, or a plurality of copper impregnated tungsten. It is made of a composite material in which copper is filled in the through-hole or a composite material in which various metals are laminated in layers. The conductive member 11 is provided on the lower surface of the element mounting substrate 5, and is provided in a region that overlaps the frame body 10 in a plan view. In addition, the conductive member 11 has a function of improving heat conductivity and efficiently radiating heat generated from the photoelectric conversion element 7 mounted on the element mounting substrate 5 to the outside. That is, the heat around the photoelectric conversion element 7 is conducted to the conductive member 11 and efficiently radiated to the outside.

  The thermal conductivity of the conductive member 11 is set to, for example, 100 (W / m · K) or more and 500 (W / m · K) or less. The thermal expansion coefficient of the conductive member 11 is set to 10 (ppm / ° C.) or more and 25 (ppm / ° C.) or less. Moreover, the thickness of the conductive member 11 is set to 0.3 mm or more and 3.0 mm or less, for example. Further, the thermal expansion coefficients of the frame 10 and the conductive member 11 are set larger than the thermal expansion coefficient of the element mounting substrate 5. In addition, the electroconductive member 11 is provided with the function of the output terminal for the photoelectric conversion apparatus 2 to take out electricity outside.

  The first conductive member 11a and the second conductive member 11b are electrically connected to the conductive layer 6 through a bonding material. The bonding material is made of, for example, silver-copper solder, low melting point solder, conductive epoxy resin, or the like.

  The first conductive member 11a functions as, for example, a positive electrode. The second conductive member 11b functions as, for example, a negative electrode. The photoelectric conversion element 7 is electrically connected to the first conductive member 11a and the second conductive member 11b, via the first conductive member 11a and the second conductive member 11b. Electricity can be taken out to the outside.

  In addition, the conductive member 11 is formed in a predetermined shape using a known metal working method such as cutting or punching, for example, an ingot produced by casting a molten metal material into a mold.

  Here, the photoelectric conversion element storage package will be described. The photoelectric conversion element storage package includes the element mounting substrate 5, the frame body 10, and the conductive member 11, and the photoelectric conversion element 7 and the light collecting member 9 are not mounted. That is, the photoelectric conversion element storage package includes an element mounting substrate 5 having a mounting portion on which the photoelectric conversion element 7 is mounted, and a frame body 10 provided so as to surround the mounting portion on the element mounting substrate 5. ing. In addition, the light collecting member 9 scheduled to be provided above the position where the photoelectric conversion element 7 is to be mounted is joined to the frame 10.

  According to the present embodiment, the upper surface of the element mounting substrate 5 is provided in contact with the extending portion 10 b of the frame 10, and the lower surface of the element mounting substrate 5 is provided in contact with the conductive member 11. Therefore, the photoelectric conversion device 2 can efficiently dissipate the heat around the photoelectric conversion element 7 to the outside of the photoelectric conversion device 2 through the frame body 10 and the conductive member 11, and the element mounting substrate 5 and the photoelectric conversion device. The temperature rise of the element 7 can be suppressed. As a result, a decrease in conversion efficiency of the photoelectric conversion element 7 can be suppressed.

  In addition, the extending portion 10b of the frame body 10 and the conductive member 11 are provided in contact with the upper surface and the lower surface of the element mounting substrate 5, and the conductive member 11 is seen through the plane and the extending portion 10b of the frame body 10. And the upper surface of the element mounting substrate 5 are provided in a region overlapping with a region where the element mounting substrate 5 is joined, so that warpage of the element mounting substrate 5 can be suppressed. That is, since the extension portion 10b of the frame 10 has a larger thermal expansion coefficient than that of the element mounting substrate 5 and the conductive member 11 has a larger thermal expansion coefficient than that of the element mounting substrate 5, it is bonded to the element mounting substrate 5. The thermal deformation that is deformed upward of the element mounting substrate 5 by the extending portion 10b of the frame 10 is deformed downward of the element mounting substrate 5 by the conductive member 11 bonded to the element mounting substrate 5. As a result, it is possible to suppress the stress balance of the element mounting substrate 5 from being lost, and thus the warpage of the element mounting substrate 5 can be reduced. Therefore, in the photoelectric conversion device 2, the warpage of the light receiving surface 8 of the photoelectric conversion element 7 is suppressed by suppressing the thermal deformation of the element mounting substrate 5, and the positional deviation of the light collecting member 9 with respect to the photoelectric conversion element 7 is reduced. It is possible to improve the light collection efficiency.

  Moreover, when the thermal expansion coefficient of the extension part 10b of the frame 10 and the conductive member 11 is the same, the thickness of the extension part 10b and the conductive member 11 is reduced in that the warpage of the element mounting substrate 5 is suppressed. It is preferable that the extension 10b bonded to the element mounting substrate 5 and the region of the conductive member 11 are set to be the same. Warpage of the light receiving surface 8 of the photoelectric conversion element 7 can be suppressed, and light collection efficiency can be improved.

  Further, when the thermal expansion coefficients of the extending portion 10b of the frame 10 and the conductive member 11 are different, the thickness with the larger thermal expansion coefficient is set to the thermal expansion coefficient in terms of suppressing warpage of the element mounting substrate 5. The warp of the element mounting substrate 5 is suppressed by bonding the extending portion 10b and the conductive member 11 to the element mounting substrate 5 so that the stress on the element mounting substrate 5 is balanced. be able to.

  In addition, the photoelectric conversion device 2 efficiently conducts heat from the peripheral portion of the photoelectric conversion element 7 to the conductive member 11 via the conductive layer 6 in the via portion provided in the element mounting substrate 5 to the outside. It can dissipate heat.

<Method for Manufacturing Photoelectric Conversion Device and Photoelectric Conversion Module>
Here, a method for manufacturing the photoelectric conversion module 1 shown in FIG. 1 and the photoelectric conversion device 2 shown in FIG. 2 will be described.

  First, the element mounting substrate 5 is prepared. For example, when the element mounting substrate 5 is made of an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, and the like are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. A green sheet is formed from the obtained mixture. The metal paste is prepared by preparing a high melting point metal powder such as tungsten or molybdenum, adding an organic binder, a plasticizer, a solvent and the like to the powder and mixing them. In addition, as shown in FIG. 3, the element mounting substrate 5 is manufactured, for example, by dividing it into a first element mounting substrate 5a and a second element mounting substrate 5b.

  The element mounting substrate 5a in the state of a green sheet forms a metallized layer to be the conductive layer 6 by printing a metal paste on a region where the photoelectric conversion element 7 is mounted using, for example, a screen printing method. Similarly, the element mounting substrate 5a in the state of a green sheet forms a metallized layer in a region bonded to the frame body 10. In addition, a metalized layer to be the conductive layer 6 is formed by filling a via portion for electrical connection with the element mounting substrate 5b using, for example, a screen printing method and filling a metal paste.

  The element mounting substrate 5b in the green sheet state is formed by printing a metal paste using, for example, a screen printing method to form a metallized layer that becomes the conductive layer 6 for electrical connection with the element mounting substrate 5a. To do. In addition, a metallized layer to be the conductive layer 6 is formed by printing a metal paste on a region in contact with the heat conductive member 11a and the heat conductive member 11b using, for example, a screen printing method. Further, in order to make an electrical connection with the metallized layers formed on the upper and lower surfaces of the element mounting substrate 5b, the vias are filled with a metal paste using, for example, a screen printing method to form the conductive layer 6. Form a layer.

  Further, the sintered element mounting substrate 5 is obtained by laminating the green sheet state element mounting substrate 5a on the green sheet state element mounting substrate 5b and simultaneously firing at a temperature of about 1600 ° C. The element mounting substrate 5a and the element mounting substrate 5b are integrally manufactured.

  Next, the frame body 10 is manufactured by molding a metal plate made of aluminum so as to have an inclined portion 10 a extending above the element mounting substrate 5 and an extending portion 10 b joining the element mounting substrate 5. In addition, it is manufactured by putting a metal material made of aluminum into a mold having an inclined portion 10a extending above the element mounting substrate and an extending portion 10b bonded to the element mounting substrate 5 and molding the mold. May be.

  Then, the frame body 10 is joined to a metallized layer formed on the upper surface of the element mounting substrate 5 via, for example, Au—Cu brazing material, solder, glass, resin, or the like.

  The first conductive member 11a and the second conductive member 11b are bonded to the metallized layer formed on the element mounting substrate 5 through, for example, an Au—Cu brazing material, solder, glass, resin, or the like. .

  The element mounting substrate 5 forms a nickel plating layer on the metallized layer exposed on the element mounting substrate 5 by a plating method such as electrolytic plating or electroless plating. Further, a gold plating layer is formed on the nickel plating layer. As a result, a photoelectric conversion element housing package is formed which is composed of the element mounting substrate 5, the frame body 10, and the conductive member 11 and in which the photoelectric conversion element 7 and the light collecting member 9 are not mounted.

  Next, the element mounting substrate 5 is a region surrounded by the frame body 10, and is formed on the conductive layer 6 made of a gold plating layer formed on one main surface of the element mounting substrate 5 by, for example, Au—Sn solder. The photoelectric conversion element 7 is mounted, and the lower electrode of the photoelectric conversion element 7 and the conductive layer 6 are electrically connected. The photoelectric conversion element 7 electrically connects the upper surface electrode of the photoelectric conversion element 7 and the conductive layer 6 made of a gold plating layer in the via portion to the upper surface electrode of the photoelectric conversion element 7 through a conductive wire. To do.

  The condensing member 9 is produced by a molding technique. Specifically, borosilicate glass is put into the mold of the light collecting member 9 and heated and pressed to form. Furthermore, the said light-condensing member 9 is produced by cooling the said molded article and taking out a molded article from a metal mold | die. Then, a chromium metal layer is formed, for example, by vapor deposition over the entire circumference of the side surface of the light collecting member 9.

  And the condensing member 9 is joined to the frame 10 via solder or the like. The condensing member 9 may be joined to the element mounting substrate 5 after the condensing member 9 is joined to the frame body 10. In this way, the photoelectric conversion device 2 is manufactured.

  Here, a manufacturing method of the photoelectric conversion module 1 will be described. A plurality of photoelectric conversion devices 2 and an external substrate 4 are prepared. The photoelectric conversion device 2 is fixed to the external substrate 4 via an insulating layer. The insulating layer is made of, for example, a resin having excellent thermal conductivity such as an epoxy resin, a glass epoxy resin, or a silicone resin, or a ceramic material such as alumina or aluminum nitride. Further, the insulating layer has a function of dissipating heat conducted from the conductive member 11 of the photoelectric conversion device 2.

  Here, a method of connecting the two photoelectric conversion devices 2 will be described.

  First, as shown in FIG. 11, both the photoelectric conversion elements 2 and the other photoelectric conversion device 2 are fixed on the external substrate 4 through an insulating layer, for example, so as to be adjacent to each other. And the electroconductive member 11 contact | abutted to the element mounting board | substrate 5 of the two arrange | positioned photoelectric conversion apparatuses 2 is each extended, and is mutually electrically connected. Since the conductive member 11 extends and the adjacent photoelectric conversion devices 2 can be electrically connected to each other, the photoelectric conversion module can be reduced in size. Alternatively, the conductive members 11 may be extended so that the conductive members 11 are electrically connected to each other via a connection member such as a conductive wire. Similarly, a plurality of photoelectric conversion devices 2 are arranged and fixed on the external substrate 4 and are electrically connected. And the photoelectric conversion module 1 can be produced by providing the light receiving member 3 on the plurality of photoelectric conversion devices 2 arranged on the external substrate 4.

  The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention. Hereinafter, modifications of the present embodiment will be described. Note that, in the photoelectric conversion device according to the modification of the present embodiment, the same portions as those of the photoelectric conversion device 2 according to the present embodiment are denoted by the same reference numerals, and description thereof is omitted as appropriate.

<Modification 1>
In the photoelectric conversion device 2 according to the first modification of the present embodiment, the thickness of the extending portion 10b of the frame 10 is changed as compared with the photoelectric conversion device 2 according to the present embodiment.

  According to the present embodiment, the extending portion 10b of the frame 10 extends from the central region of the element mounting substrate 5 of the element mounting substrate 5 toward all directions in the peripheral region, as shown in FIG. . In the photoelectric conversion device 2, since the frame 10 has a wide junction region with the element mounting substrate 5, the heat around the photoelectric conversion element 7 can be efficiently radiated to the outside, and the element mounting substrate 5 and The temperature rise of the photoelectric conversion element 7 can be suppressed. As a result, the photoelectric conversion device 2 can suppress a decrease in conversion efficiency of the photoelectric conversion element 7.

  In addition, a region where the extending portion 10b of the frame body 10 and the element mounting substrate 5 are joined is set wide, and the thickness of the conductive member 11 is set to be thicker than the extending portion 10b as shown in FIG. As a result, the stress on the element mounting substrate 5 is balanced, and the warpage of the element mounting substrate 5 can be suppressed. The warpage of the element mounting substrate 5 can be suppressed by adjusting the thickness of the conductive member 11 and the region to be joined to the element mounting substrate 5. In addition, each thickness of the extension part 10b and the electroconductive member 11 is each in the range of 0.3 mm or more and 3.0 mm or less, for example so that the thickness of the electroconductive member 11 may become thicker than the extension part 10b. Is set.

  Further, the thickness of the extending portion 10b or the conductive member 11 of the frame body 10 or the extending portion 10b or the conductive member 11 of the frame body 10 and the element mounting substrate so that the effects on the element mounting substrate 5 are balanced. By adjusting the region bonded to 5, warping of the element mounting substrate 5 can be suppressed.

<Modification 2>
In the photoelectric conversion device 2 according to the above-described embodiment, the frame body 10 includes the inclined portion 10a and the extending portion 10b of the frame body 10, but is not limited thereto. As shown in FIG. 6, when viewed in cross section, the frame 10 is positioned higher than the photoelectric conversion element 7 so as to surround the photoelectric conversion element 7 between the inclined portion 10 a and the extending portion 10 b of the frame 10. It is good also as a structure which has the bending part 10c provided close to the photoelectric conversion element 7 while it bends toward the outer side of the photoelectric conversion element 7. FIG. Even if the bonding stress between the element mounting substrate 5 and the frame body 10 is increased by the heat around the photoelectric conversion element 7, the bent portion 10 c has the bent portion 10 c, so that the bent portion 10 c of the frame body 10 is bent, It is possible to suppress a decrease in the bonding property between the element mounting substrate 5 and the extending portion 10b of the frame body 10. Moreover, the fall of the condensing efficiency to the photoelectric conversion element 7 by the deformation | transformation of the frame 10 which arises by the fall of joining property can be suppressed.

  Further, even if the bonding stress between the element mounting substrate 5 and the extending portion 10b is increased and the element mounting substrate 5 is warped, the bent portion 10c of the frame body 10 is bent to deform the inclined portion 10a of the frame body 10. Can be suppressed. As a result, it is possible to suppress a decrease in light collection efficiency on the photoelectric conversion element 7 due to the deformation of the inclined portion 10a of the frame body 10.

  Further, since the photoelectric conversion device 2 has the bent portion 10c, the heat around the photoelectric conversion element 7 can be conducted to the frame body 10 through the bent portion 10c and efficiently radiated to the outside. it can.

<Modification 3>
Further, as shown in FIG. 7, the shape of the region of the light incident portion 40 where light is incident from the light collecting member 9 to the photoelectric conversion element 7 may be matched with the shape of the region of the light receiving surface 8 of the photoelectric conversion element 7. That is, the shape of the light incident portion 40 is formed in accordance with the shape of the light receiving surface 8 of the photoelectric conversion element 7 when viewed through the plane. By forming the shape of the light incident portion 40 according to the shape of the light receiving surface 8 of the photoelectric conversion element 7, the light incident portion 40 passes through the light incident portion 40 from the light collecting member 9 to the light receiving surface 8 of the photoelectric conversion element 7. The light condensing property of the irradiated light can be improved. For example, if the light receiving surface 8 of the photoelectric conversion element 7 is circular, the shape of the light incident portion 40 is preferably matched as a circle, and the light receiving surface 7 of the photoelectric conversion element 7 is rectangular. In this case, the shape of the light incident portion 40 is preferably matched as a rectangular shape.

  In the photoelectric conversion device 2, the photoelectric conversion element 7 and the bent portion 10c of the frame body 10 are provided close to each other, and the heat around the photoelectric conversion element 7 is transferred to the frame body 10 through the bent portion 10c. Heat can be conducted to the outside efficiently.

  Further, when the conductive wire that electrically connects the photoelectric conversion element 7 and the conductive layer 6 is formed on the outer periphery of the light receiving surface 8 of the photoelectric conversion element 7, the incident light is incident on the photoelectric conversion element 7. Light loss due to light reflection at the conductive wire portion can be suppressed, and light collection efficiency can be improved.

<Modification 4>
Further, as shown in FIG. 8, the photoelectric conversion element 7 may be mounted inside the recess 30 provided in the element mounting substrate 5. Since the photoelectric conversion element 7 is provided in the recess 30 of the element mounting substrate 5, the distance between the photoelectric conversion element 7 and the conductive member 11 becomes short, and the thermal conductivity to the thermal conductive member 11 is reduced. The amount of heat conducted to the frame body 10 can be reduced. As a result, the heat around the photoelectric conversion element 7 can be efficiently conducted to the frame 10 and the conductive member 11 to be radiated to the outside, and the temperature rise of the element mounting substrate 5 can be suppressed.

  Further, by adopting this configuration, the frame 10 can be configured so as not to require the shape having the bent portion 10c, so that the structure of the frame 10 is simplified and the manufacturing process can be reduced. .

<Modification 5>
In the photoelectric conversion device 2 according to the above-described embodiment, the condensing member 9 is configured in a flat plate shape, but is not limited thereto. As shown in FIG. 9, the condensing member 9 may have a truncated pyramid shape and be close to the photoelectric conversion element 9. Since the condensing member 9 is provided close to the photoelectric conversion element 9, the photoelectric conversion device 2 can improve the light condensing efficiency from the condensing member 9 to the photoelectric conversion element 7. Moreover, since the area | region of the lower surface part which opposes the photoelectric conversion element 9 of the condensing member 9 is formed according to the area | region of the light-receiving surface 8 of the photoelectric conversion element 7 when planarly seen, The condensing property of the irradiation light irradiated from the lower surface portion to the light receiving surface 8 of the photoelectric conversion element 7 can be improved.

  Moreover, since the condensing member 9 is formed by matching the inclination angle of the side surface of the condensing member 9 with the inclined portion 10a of the frame body 10 when viewed in cross section, the condensing member 9 and the frame body 10 are smooth. Can be joined.

  Further, the light incident on the light collecting member 9 proceeds from the upper surface portion of the light collecting member 9 to the lower surface portion while being repeatedly reflected by the light collecting member 9, and the light receiving surface of the photoelectric conversion element 7 from the lower surface portion of the light collecting member 9. 8 is incident. Since the leaked light from the condensing member 9 is reflected by the inclined portion 10a of the frame 10 joined to the condensing member 9, the photoelectric conversion device 2 can suppress a decrease in condensing efficiency.

  Further, the light condensing member 9 may be formed in a circular shape in the shape of a rectangular truncated pyramid if the light collecting member 9 has a rectangular shape, for example, when the frame body 10 is seen through a plane in accordance with the shape of the frame body 10. For example, it has a circular truncated cone shape. In addition, the light collecting member 9 is joined to the inclined portion 10 a of the frame body 10 at the side surface portion of the light collecting member 9, but the inclined portion 10 a of the frame body 10 extends to the upper surface portion of the light collecting member 9. Then, the light collecting member 9 may be joined.

<Modification 6>
Further, as shown in FIG. 10, the condensing member 9 may have a truncated pyramid shape, be provided close to the photoelectric conversion element 9, and be joined to a part of the inclined portion 10 a of the frame body 10. Since the condensing member 9 is joined to a part of the inclined portion 10a of the frame body 10, the compressive stress from the frame body 10 to the condensing member 9 can be relieved. In the photoelectric conversion device 2, the compressive stress from the frame body 10 to the light collecting member 9 is reduced, and the displacement of the irradiation light on the light receiving surface 8 of the photoelectric conversion element 7 due to the change in the refractive index of the light collecting member 9 is suppressed. It is possible to improve the light collecting property.

  Moreover, since the condensing member 9 is joined to a part of the inclined portion 10a of the frame body 10 via the inclined portion 10a of the frame body 10 and a gap, heat conduction from the frame body 10 is reduced. The photoelectric conversion device 2 can suppress the displacement of the light collecting member 9 due to heat from the frame body 10 and can improve the light collecting property.

  Moreover, since the leak light from the condensing member 9 is reflected by the inclined portion 10a of the frame body 10 joined to the condensing member 9, the photoelectric conversion device 2 can suppress a decrease in condensing efficiency.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion module 2 Photoelectric conversion apparatus 3 Light receiving member 3a Frame member 3b Lens member 4 External substrate 5 Element mounting substrate 5a First element mounting substrate 5b Second element mounting substrate 6 Conductive layer 7 Photoelectric conversion element 8 Light receiving surface 9 Collection Optical member 10 Frame body 10a Inclined portion 10b Extended portion 10c Bending portion 11 Conductive member 11a First conductive member 11b Second conductive member 20 Space 30 Recess 40 Light incident portion

Claims (7)

An element mounting substrate;
A photoelectric conversion element provided in a central region of the upper surface of the element mounting substrate;
Provided on the upper surface of the element mounting substrate, surrounds the photoelectric conversion element, and a lower portion extends from the central region toward a peripheral region located on an outer periphery of the central region, and is joined to the upper surface of the element mounting substrate. A frame and
A condensing member that is joined to the upper portion of the frame and provided in a region overlapping with the photoelectric conversion element;
A conductive member provided on a lower surface of the element mounting substrate and provided in a region seen from a plane and overlapping the frame body,
The photoelectric conversion device, wherein a thermal expansion coefficient of the frame body and the conductive member is larger than a thermal expansion coefficient of the element mounting substrate. The photoelectric conversion device according to claim 1,
A lower part of the frame extends from the central region toward all directions of the peripheral region. The photoelectric conversion device according to claim 1 or 2, wherein
The thickness of the said electroconductive member is thicker than the thickness of the said frame of the said joining area | region when it sees in cross section, The photoelectric conversion apparatus characterized by the above-mentioned. The photoelectric conversion device according to claim 1, wherein:
The photoelectric conversion device, wherein the frame has a mirror-finished inner surface. A photoelectric conversion device according to any one of claims 1 to 4,
The frame body has a bent portion that is bent toward the outside of the photoelectric conversion element at a position higher than the photoelectric conversion element when viewed in cross-section and is provided close to the photoelectric conversion element. A photoelectric conversion device. A photoelectric conversion device according to any one of claims 1 to 5,
The element mounting substrate has a recess for mounting the photoelectric conversion element. The photoelectric conversion device according to any one of claims 1 to 6,
A light receiving member provided on the photoelectric conversion device and collecting light on the light collecting member;
A photoelectric conversion module comprising:

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