JP2012074638A - Applying position teaching method and electronic component installing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance productivity by deleting the carrying time and the like of a measuring plate and shortening the measuring time; and to improve measuring accuracy.SOLUTION: An application agent is applied to set application coordinates which is set in advance on a measuring plate 20 to which measuring marks 221 and 221 are added, and the applied application agents 25 and 25 and the measuring marks 221 and 221 are imaged to measure each position, and deviation amount (ΔX1, ΔY1 and Δθ1) from the set application coordinates of the applied application agent is calculated. Next, the deviation amount from the set application coordinates of a plurality of applying positions are averaged, and on the basis of the averaged deviation amount, data of the application coordinates when applying the application agent to a substrate are corrected.

Description

  The present invention relates to a coating position teaching method when a coating agent is applied to a substrate, and an electronic component mounting apparatus in which a component holder provided in a mounting head takes out an electronic component and mounts it on the substrate. The present invention relates to an electronic component mounting apparatus including a coating head that coats a coating agent.

  An electronic component mounting apparatus is disclosed in, for example, Patent Document 1, but a component holder takes out an electronic component supplied by a component supply unit and mounts it on a substrate. In addition, a coating apparatus that is provided in the electronic component mounting apparatus and applies an adhesive or the like applies the adhesive onto the substrate before mounting the electronic component. In this coating apparatus, for example, before the adhesive is applied to the substrate, the coating head is moved up and down while moving in the horizontal direction. The measurement plate was removed and carried to the measuring instrument, and the position of the dent was measured to measure the displacement of the dent, that is, the displacement of the coating position.

  On the other hand, the mounting head of the electronic component mounting apparatus is detachably provided on the apparatus main body. However, it is conceivable to attach a coating head having a coating nozzle instead of the mounting head.

Japanese Unexamined Patent Publication No. 7-94896

  However, by applying a nozzle to the measurement plate for each application position, making a dent, removing the measurement plate with the dent, carrying it to the measuring instrument, and measuring the deviation of the dent, that is, the deviation of the application position, When the measuring plate is taken out of the device, when it is transported to the measuring instrument, when it is transported to the measuring instrument, wasted time occurs, and the time until the end of the measurement becomes longer, or when the measuring plate is transported The dents are rubbed and damaged, resulting in a problem that the measurement accuracy decreases.

  Accordingly, an object of the present invention is to eliminate the time for carrying the measurement plate and the like, shorten the time required for measuring the application position, and increase the efficiency of productivity. Moreover, it aims at improving a measurement precision.

  Therefore, according to the first aspect of the present invention, in the application position teaching method, the setting application coordinates set in advance on the measurement plate to which the measurement mark is attached by the application head having the application nozzle for applying the application agent onto the substrate are used. A step of applying a coating agent, a step of imaging the applied coating agent and the measurement mark and measuring a position, a step of calculating a deviation amount of the applied coating agent from the set application coordinates, and And a step of correcting data of application coordinates when applying the coating agent to the substrate based on the deviation amount.

  According to a second aspect of the present invention, in the application position teaching method, the setting application coordinates set in advance on the measurement plate to which the measurement mark is attached by the application head having the application nozzle for applying the application agent on the substrate are provided. A step of applying a pair of coating agents at intervals, a step of measuring the angle of the coating agent by imaging the applied coating agent and the measurement mark, and a predetermined angle of the coating agent A step of calculating an amount of deviation from the angle of the applied coating agent, and a step of correcting data of an application angle when the coating agent is applied to the substrate based on the calculated amount of deviation of the inclination. And

  According to a third aspect of the present invention, a plurality of component supply units that supply electronic components stored in the storage tape are arranged side by side on the mounting base, and the holding head is provided in the mounting head that is detachably mounted to the mounting body. In an electronic component mounting apparatus for taking out an electronic component supplied from a predetermined component supply unit by a tool and mounting the electronic component on a positioned substrate, an application nozzle that is attached to the mounting body and applies an application agent onto the substrate is provided. The coating nozzle is applied to the set coating coordinates set in advance on a measurement plate that is positioned in place of the substrate and provided with a plurality of measurement marks, and the coated coating agent and measurement are performed. The mark is imaged with a camera, the position of the coating agent is measured, the amount of deviation of the applied coating agent from the set application coordinates is calculated, and based on the calculated amount of deviation And correcting the data of the application coordinates at the time of applying the fabric material to the substrate.

  Furthermore, a fourth aspect of the present invention is the electronic component mounting apparatus according to the third aspect, wherein the coating head includes a coating nozzle in which a pair of coating holes are formed at intervals, and the measurement plate is preset. A pair of coating agents are applied to the application coordinates by the application nozzle, the applied coating agent and the measurement reference mark are imaged, and the angle of the coating agent is measured. The amount of deviation of the applied coating agent from the angle is calculated, and the application angle when applying the adhesive to the substrate is corrected based on the calculated amount of deviation of the angle.

  The present invention eliminates the time for carrying the measurement plate and the like, shortens the time required to measure the application position, and increases the efficiency of productivity.

The schematic plan view of an electronic component mounting apparatus is shown. It is a control block diagram. It is a figure which shows a flowchart. It is a top view of a measurement plate. It is a figure which shows the application position coordinate data of a measurement plate. It is a figure which shows the relationship between the position (coordinate) of the measurement mark on a measurement plate, and an application position (coordinate). It is a figure which shows the measurement mark and coating agent on the measurement plate after application | coating operation | movement. It is a figure which shows the relationship between the position (coordinate) of the measurement mark on the measurement plate after application | coating operation | movement, and an application position (coordinate). It is a figure which shows the data of the measured application | coating position (coordinate). It is a figure which shows the deviation | shift amount for every application | coating point. It is a figure which shows correction | amendment of the application position for every application | coating step to a board | substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus 1, and component supply apparatuses 2 </ b> A and 2 </ b> B are disposed on the front side and the rear side of the electronic component mounting apparatus 1.

  Each of the component supply devices 2A and 2B has a large number of component supply units 5 arranged side by side on a feeder base 3 of a cart table (not shown) as an attachment table, and a tip portion on the component supply side is a substrate. It is detachably disposed on the apparatus body via a connector (not shown) so as to face the conveyance path of the printed circuit board P. When this connector is released and the handle is pulled, it is moved by a caster provided on the lower surface. It is a possible configuration.

  And each component supply apparatus 2A, 2B is arrange | positioned so that the front-end | tip part by the side of a component supply may face the pick-up area | region of the mounting head 6A attached to the attachment body 7 so that attachment or detachment is possible, A tape feeding mechanism that intermittently feeds the storage tape, which is sequentially wound in a state of being wound around a supply reel that is rotatably mounted on the cart table, to a suction extraction position of an electronic component, and suction removal by driving a peeling motor. A cover tape peeling mechanism for peeling the cover tape from the carrier tape before the position. The cover tape is peeled off by the cover tape peeling mechanism, and the electronic parts loaded in the carrier tape storage section are sequentially moved to the suction extraction position. It can be supplied and taken out from the tip portion by a suction nozzle which is a component holder provided in the mounting head 6A.

  Between the front-side component supply device 2A and the rear-side component supply device 2B, a supply conveyor, a positioning unit (having a conveyor), and a discharge conveyor that constitute the substrate transfer device are provided. The supply conveyor conveys each printed circuit board P received from the upstream to the positioning unit, and after electronic components are mounted on the substrate P positioned by a positioning mechanism (not shown) in this positioning unit, It is then transported to the downstream device.

  Each beam 10 that moves along the guide rail by the Y-axis drive motor 9 in the Y direction is provided with a mounting body 7 that is moved by the X-axis drive motor 13 in the longitudinal direction, that is, in the X direction. As described above, the mounting head 6A is detachably attached, but sometimes the application head 6B having a plurality of application nozzles for applying an adhesive on the substrate P is detachably attached. That is, in this embodiment, the coating head 6B is attached to the attachment body 7 attached to the front beam 10, and the mounting head 6A is attached to the attachment body 7 attached to the back beam 10.

  The mounting head 6A is equipped with a vertical axis drive motor 14 for moving the suction nozzle up and down, and a θ-axis drive motor 15 for rotating the mounting head 6A around the vertical axis. Therefore, the suction nozzle of the mounting head 6A can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  The coating head 6B is equipped with a vertical axis drive motor 18 for moving the coating nozzle up and down, and a θ-axis drive motor 17 for rotating the coating head 6B around the vertical axis. Further, the coating head 6B is provided with a coating nozzle (not shown), and two coating holes are formed below the coating nozzle with a gap therebetween. These application nozzles can move in the X direction and the Y direction in accordance with the movement of the application head 6B, can rotate around the vertical axis, and can move up and down.

  Furthermore, the interval between the two application nozzles is set according to the width of the mold between the electrodes provided at both ends of the component to be mounted after the adhesive is applied, and is approximately equal to the width of the electronic component.

  A component recognition camera 11 captures an image of the electronic component in order to recognize the position of the electronic component with respect to the suction nozzle and how much the electronic component is sucked and held with respect to the XY direction and the rotation angle. Each electronic component is picked up by the component recognition camera 11 while being sucked and held by the suction nozzle, and is recognized by the recognition processing device 23 described later.

  Reference numeral 12 denotes a substrate recognition camera attached to the attachment body 7 attached to the beam 10 for imaging a positioning mark or the like attached to the substrate P or the like and recognizing the position of the substrate P or the like. .

  Next, the control block diagram of FIG. 2 will be described. The electronic component mounting apparatus 1 includes a CPU (Central Processing Unit) 31 as a control apparatus that performs overall control of the mounting apparatus 1, and a bus line connected to the CPU 31. A random access memory (RAM) 32 and a read only memory (ROM) 33 are provided as storage devices that are connected to each other. Based on the data stored in the RAM 32, the CPU 31 comprehensively controls operations related to the component mounting operation including the adhesive application operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 33. That is, the CPU 31 controls driving of the Y-axis drive motor 9, the X-axis drive motor 13, the vertical axis drive motors 14 and 18, the θ-axis drive motors 15 and 17, etc. via the interface 34 and the drive circuit 35.

  The component supply unit 5 contains a microcomputer and a memory storing a serial number.

  The RAM 32 stores mounting data for each type of printed circuit board P related to component mounting, and the X direction (indicated by X) in the printed circuit board P for each mounting order (step number). , Y direction (indicated by Y) and angle (indicated by Z) information, arrangement number information of each component supply unit 5 and the like are stored. Application data is also stored for each type of printed circuit board P related to adhesive application, and the X direction (indicated by X), Y direction (indicated by X) in the printed circuit board P is determined for each application order (step number). Y) and angle (indicated by Z) information and the like are stored.

  Further, as shown in FIG. 5, coordinate data of a plurality of positions where the adhesive is applied on the measurement plate when teaching the application position correction amount is stored for each column. This coordinate data is, for example, 20 points for each row corresponding to the measurement mark on the measurement plate, and data for a total of 80 points in 4 rows. For example, the coordinates in the X direction (indicated by X) in the measurement plate , Y direction (indicated by Y) coordinates and angle (indicated by θ) information. The angle θ1 is 0 ° without rotation, θ2 is an angle obtained by rotating the coating angle clockwise by, for example, 45 °, and θ3 is an angle obtained by rotating the coating angle by, for example, 90 ° clockwise. Furthermore, θ4 is an angle obtained by rotating the coating angle clockwise by, for example, 135 °.

  Reference numeral 37 denotes a recognition processing apparatus connected to the CPU 31 via an interface 34. An image of an electronic component captured by the component recognition camera 11 and a positioning mark captured by the substrate recognition camera 12 and captured. The image recognition process is performed by the recognition processing device 37, and the processing result is sent to the CPU 31. In other words, the CPU 31 outputs an instruction to the recognition processing device 37 to perform recognition processing on the image picked up by the image board recognition camera 12 picked up by the component recognition camera 11 and receives the recognition processing result from the recognition processing device 37. Is.

  Reference numeral 38 denotes a monitor for displaying a part image and a screen for setting various data. The monitor 38 is provided with various touch panel switches 39 as input means. Can be set.

  Reference numeral 40 denotes a storage device such as a server connected to the electronic component mounting apparatus 1, which stores various information stored in the RAM 32.

  Next, teaching of the application position correction amount will be described based on the flowchart of FIG. First, in a state where power is supplied to the electronic component mounting apparatus 1, the measurement plate is transported instead of the substrate P and positioned at the positioning unit.

  As shown in FIG. 4, the surface of the measurement plate 20, which is a resin plate, for example, is a color that easily contrasts with the color of the adhesive to be applied (for example, red), for example, white, and one diagonal line on the surface. Black positioning marks 21 and 21 are printed at the upper corner, and a plurality of measurement mark rows 22A, 22B, 22C and 22D are printed between the positioning marks 21 and 21 from the top to the bottom. Like the positioning marks 21, 21, a plurality of black measurement marks 22,... Are printed on each measurement mark row, and the pair of measurement marks 221, 221 is inclined with respect to each application position. In FIG. 4, for example, 40 measurement marks 22 are provided for each column corresponding to 20 application positions.

  FIG. 6 shows four upper left measurement marks 221, 221, 222, 222 on the measurement plate 20 shown in FIG. 4 and an application position 23 when applying an adhesive that does not appear on the surface of the measurement plate 20. The middle of the pair of measurement mark 221 and measurement mark 221 and the middle of the pair of measurement position 222 and measurement position 222 are the application positions 23 and 23 when applying the adhesive, respectively. There are other measurement marks, and similarly, each application position is located at the center of the pair of measurement marks.

Hereinafter, the operation of correcting the application position correction will be described with reference to the flowchart of FIG.
First, the work manager operates the monitor, conveys and positions the measurement plate 20 instead of the substrate P, and applies the coating agent to each preset application position of the measurement plate 20 (step S01).

  When the application to all the application positions is completed, the operation moves to the application position measurement operation.

Note that when applying the adhesive to the measurement plate 20, the application position may be measured by looking at the measurement marks one by one.
That is, first, the printed circuit board recognition camera 12 of the application head 6B moves above the application position on the upper left of the measurement plate 20, and images the application marks 221, 221 and the application agents 25, 25 to measure their positions. (Step S02).

  That is, the captured images are recognized to determine the coordinates (x1a, y1a) and (x1b, y1b) of the application marks 221 and 221 and the inclinations of the application marks 221 and 221 from these coordinates. Further, the coordinates (xc1, yc1) and (xd1, yd1) of each coating agent 25, 25 are obtained, and the inclination of the line connecting each coating agent 25, 25 from these coordinates with respect to the vertical line in FIG. The angle (θA1) of the application position 26 is obtained.

  Next, the CPU 31 calculates the deviation of the application position and the deviation of the angle based on the measurement position and inclination of each application mark and each application agent (step S03).

  That is, as shown in FIGS. 7 and 8, the measurement mark measurement position 23 calculated from the coordinates (x1a, y1a) and (x1b, y1b) of the coating marks 221 and 221 (shown by a broken x mark in FIG. 8). Of the coating agent calculated from the coordinates (XB1, YB1, θB1) of the (description) and the coordinates (xc1, yc1) and (xd1, yd1) of each coating agent 25, 25 (described by a solid line x in FIG. 8). ) With respect to the coordinates (XA1, YA1, θA1) (positional deviation) (ΔX1, ΔY1). Further, the CPU 31 calculates the inclination of the application mark from the coordinates (x1a, y1a) and (x1b, y1b) of the application marks 221, 221 and coordinates (xc1, yc1) and (xd1, The inclination of the coating agent is calculated from yd1). Then, the actual angle deviation (Δθ1) of the coating agents 25, 25, that is, how many times the inclination is inclined from the vertical state is calculated from the respective inclinations. The calculated deviation amount of the position and angle of the coating agent, that is, the deviation amount (ΔX1, ΔY1, Δθ1) from the preset application position is stored in the RAM 32.

  Thereafter, until the final application position (application point) is determined (step S04), similarly, as shown in FIG. 9, the position of the application agent is measured for each application position, and based on the measurement result. From the first point to the 80th point, the position and angle deviation amount of the coating agent is calculated for each application position (application point). Then, the amount of deviation data of each application position shown in FIG.

  Next, the CPU 31 calculates average values (ΔX, ΔY, Δθ) of the deviation amounts using the calculated deviation amounts (step S05) and stores them in the RAM 32. It should be noted that when calculating the average value of deviation amounts, a target range of deviation amounts used for calculation is set in advance, and deviation amounts other than this target range, that is, deviation amounts excluding extremely large amounts The deviation average value may be calculated based on the above. In this way, by removing any amount that is extremely large when calculating the average value, for example, the average value of the shift amount increases due to a large shift amount, and as a result, the correction amount of the application position described later is wasted. Can be avoided.

  Next, based on the stored average value of deviation amounts, the CPU 31 adds the average deviation amount values (ΔX, ΔY, Δθ) to preset application data when applying the coating agent to the substrate during operation. provide feedback.

  That is, as shown in FIG. 11, the CPU 31 automatically corrects the application position (application coordinates) and angle data for each application step when applying the adhesive to the substrate with the average value of the deviation amounts (step S06). ). As a result, the coating position (coating coordinates) and angle data for each coating step are automatically corrected in the device without removing the measuring plate from the device or carrying it out to the measuring instrument. The position and even the angle can be taught. Further, the time required for correcting the application position of the coating agent can be shortened, and the production efficiency can be improved. Furthermore, the correction operation of the application position by the operator can be greatly simplified.

  Furthermore, after applying the coating agent to the measurement plate, the application position can be measured immediately and the deviation amount can be calculated without transporting or carrying the measurement plate, thereby improving the measurement accuracy of the deviation amount. it can.

  Then, the corrected application data (see FIG. 11) is stored in the RAM 32.

  Thereafter, when the coating agent is applied to the substrate by starting production of the substrate (step S07), the coating agent is applied onto the printed circuit board P by the application nozzle provided in the application head 6B in accordance with the application data stored in the RAM 32. The

  Further, when the CPU 31 determines that the amount of application is not appropriate as a result of the recognition processing of the recognition processing device 37, the monitor 38 displays a message indicating an abnormality, and control is performed so as not to proceed to the application operation to the printed circuit board P. To do.

  However, prior to the coating operation on the printed circuit board P, the substrate recognition camera 12 captures a positioning mark attached to the printed circuit board P, and the recognition processing device 37 recognizes the captured image and processes the captured image. Know the position of P. Therefore, the CPU 31 controls to apply while correcting the position in accordance with the application data, taking the recognition result into consideration in the application position of the application data.

  Next, when the operation of applying the coating agent to the printed circuit board is completed, the mounting head 6A moves according to the mounting data stored in the RAM 32, and the electronic component to be mounted by the suction nozzle corresponding to the component type of the electronic component. It is adsorbed and taken out from a predetermined component supply unit 5.

  More specifically, the suction nozzle of the mounting head 6A moves so as to be positioned above the component supply unit 5 that stores the electronic components to be mounted in accordance with the mounting order, but in the Y direction, the Y-axis drive motor 9 is driven and the beam 10 is driven. In the X direction, the X-axis drive motor 13 is driven to move the mounting head 6A, and the predetermined component supply unit 5 is already driven so that components can be taken out at the component suction position. The motor 14 lowers the suction nozzle to suck and take out the electronic components, and then the mounting head 6A is lifted.

  The suction nozzle moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the positioning unit. While the mounting head 6A moves, the component recognition camera moves while the mounting head 6 moves. The electronic component picked up and held by the suction nozzle when passing the upper position of 11 is imaged by the component recognition camera 11 (fly recognition).

  Based on the imaging result of the electronic component, the recognition processing device 37 recognizes how much the electronic component is displaced and held with respect to the suction nozzle by the recognition processing device 37 in the XY direction and the rotation angle. Correction is made based on the recognition processing result and the board recognition processing result, and the Y-axis drive motor 9, the X-axis drive motor 13 and the θ-axis drive motor 15 are controlled by the CPU 31 and are mounted at predetermined positions on the printed circuit board P. Become. Similarly, other electronic components are similarly corrected and mounted.

  In the above-described embodiment, the electronic component mounting apparatus has been described. However, in the coating apparatus provided with the coating head that coats a coating agent such as an adhesive, the coating position (coating coordinates) in the apparatus as described above. The same operation and effect can be obtained by calculating the amount of deviation and automatically correcting the coating coordinate data based on the amount of deviation.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 6A Mounting head 6B Coating head 7 Attachment body 10 Beam 20 Measurement plate 23 Coating position 25 Coating agent 31 CPU
32 RAM
221 Measurement mark

Claims (4)

Applying the coating agent to set application coordinates set in advance on a measurement plate to which a measurement mark is attached by an application head having an application nozzle for applying the coating agent on the substrate;
Imaging the applied coating agent and the measurement mark and measuring the position;
Calculating the amount of deviation of the applied coating agent from the set application coordinates;
And a step of correcting application coordinate data when applying the application agent to the substrate based on the calculated deviation amount. A step of applying a pair of coating agents at intervals to preset application coordinates of a measurement plate on which a measurement mark is attached by a coating head having a coating nozzle for coating the coating material on a substrate; ,
A step of imaging the applied coating agent and the measurement mark to measure the angle of the coating agent;
A step of calculating a deviation amount between a preset angle of the coating agent and an angle of the applied coating agent;
And a step of correcting application angle data when applying the application agent to the substrate based on the calculated deviation amount of the inclination.   A plurality of component supply units that supply electronic components stored in a storage tape are arranged side by side on a mounting base, and a predetermined component supply unit is provided by a holder provided on a mounting head that is detachably attached to a mounting body. In the electronic component mounting apparatus for taking out the supplied electronic component and mounting it on the positioned substrate, the electronic component mounting device includes a coating head that is mounted on the mounting body and includes a coating nozzle for coating a coating agent on the substrate, Apply the coating agent with the coating nozzle to the preset coating coordinates of the measurement plate that is positioned instead of the substrate and has a plurality of measurement marks, and then apply the coating agent and the measurement marks by imaging with the camera. The position of the agent is measured, the amount of deviation of the applied agent from the set application coordinates is calculated, and the agent is applied to the substrate based on the calculated amount of deviation. An electronic component mounting apparatus characterized by correcting the data of the application coordinates when.   The coating head includes a coating nozzle in which a pair of coating holes are formed with a space therebetween, and a pair of coating agents are applied to the coating coordinates set in advance on the measurement plate by the coating nozzle and applied. The angle of the coating agent is measured by imaging the coating agent and the measurement reference mark, the amount of deviation between the preset angle of the coating agent and the angle of the coated coating agent is calculated, and the calculated angle 4. The electronic component mounting apparatus according to claim 3, wherein the application angle when applying the adhesive to the substrate is corrected based on the amount of deviation.

Images