JP2012047527A - Method for manufacturing physical quantity sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a physical quantity sensor device for suppressing an inclination of a sensor part in removal of a mending tool, and for suppressing occurrence of product failure.SOLUTION: A method of manufacturing a physical quantity sensor device includes: a connection process of inserting a mending tool 80 whose fixing force as a force to fix a sensor part 20 is variable from the opposite side of the loading side of the sensor part 20 in a concave part 11 via a through-hole 12 into the inside of the concave part 11, and bringing the mending tool 80 into contact with the sensor part 20 to fix the sensor part 20 to the mending tool 80, and performing wire bonding in a state that the sensor part 20 is fixed to the mending tool 80 to electrically connect the sensor part 20 via a bonding wire 50 to a connection terminal 40; and a removal process of removing the mending tool 80 from a package 10 after weakening the fixing force of the mending tool 80 more than that in the connection process.

Description

  The present invention relates to a method for manufacturing a physical quantity sensor device in which a sensor unit for detecting a physical quantity is mounted on a package via an adhesive having elasticity.

  Conventionally, an angular velocity sensor device in which a sensor unit for detecting a physical quantity such as an angular velocity is mounted on a package via an adhesive is known. However, in such an angular velocity sensor device, there is a problem that the detection accuracy is reduced when an external impact, that is, external acceleration is applied.

  That is, in the angular velocity sensor device as the physical quantity sensor device, the angular velocity is detected based on the Coriolis force generated in the detection direction, but when acceleration from the outside in the detection direction is transmitted to the sensor element via the package, Even though the angular velocity is not applied, the output is made as if the angular velocity has occurred.

  For this reason, in such an angular velocity sensor device, an unnecessary vibration due to external acceleration is absorbed by holding the sensor part in a package via an elastic adhesive or the like and causing the adhesive to function as a vibration isolating member. What is made is known. In such a physical quantity sensor device, the external acceleration is attenuated by the elastic function of the adhesive, so that unnecessary vibrations to the sensor unit can be reduced.

  In such an angular velocity sensor device, the sensor unit is mounted on the package via an elastic adhesive, and then wire bonding is performed on the sensor unit to electrically connect the sensor unit and the leads provided in the package. Manufactured by connecting. However, since the sensor unit is mounted on the package via an adhesive having elasticity, the sensor unit is wobbled when wire bonding is performed, and there is a problem that it is very difficult to appropriately bond the sensor unit.

  In order to solve this problem, for example, in Patent Document 1, a magnetic member is provided in the sensor unit, and a permanent magnet as a jig is disposed on the back side of the package when wire bonding is performed on the sensor unit. It is disclosed that the sensor portion is fixed to the package by the magnetic force generated between the magnetic member and the jig.

JP 2006-317321 A

  However, in the manufacturing method disclosed in Patent Document 1, a magnetic force is generated between the magnetic member provided in the sensor unit and the jig even after the wire bonding is completed. Will be removed. In this case, due to the magnetic force between the magnetic member and the jig, it is difficult to remove the jig in the direction perpendicular to the sensor part, and the sensor part may be tilted when removing the jig, resulting in defective products. There is a problem that it may occur.

  Such a problem does not occur only when the sensor unit for detecting the angular velocity is mounted on the package via an elastic adhesive, but the sensor unit for detecting a physical quantity such as acceleration is made elastic to the package. This is a problem that occurs in the same way when mounting via an adhesive.

  In view of the above points, the present invention provides a method of manufacturing a physical quantity sensor device that can suppress the tilting of a sensor unit when removing a jig and can suppress the occurrence of product defects. Objective.

  In order to achieve the above object, according to the first aspect of the present invention, the package (10) has a recess (11) on one side and a through-hole (12) formed on the bottom surface of the recess (11). Providing a connection terminal (40) to be electrically connected, placing an adhesive (30) on the bottom surface of the recess (11), and adhesive (30) on the bottom surface of the recess (11) The mounting step of mounting the sensor part (20) via the jig and the jig (80) in which the fixing force, which is the force for fixing the sensor part (20), can be changed, into the sensor part (20) in the recess (11). Is inserted into the recess (11) through the through-hole (12) from the opposite side of the mounting side and brought into contact with the sensor unit (20) to fix the sensor unit (20) to the jig (80), Wire bonder with sensor part (20) fixed to jig (80) By connecting the sensor part (20) and the connection terminal (40) via the bonding wire (50), and the fixing force of the jig (80) from the time of the connection process. And a removal step of removing the jig (80) from the package (10).

  In such a manufacturing method, the jig (80) in which the fixing force that is the force for fixing the sensor unit (20) is variable is used, and in the detaching step, the fixing force of the jig (80) is used in the connecting step. The jig (80) is removed from the package (10) after being weakened. For this reason, when removing a jig | tool (80) from a package (10), it can suppress that a sensor part (20) tilts, and it can suppress that a product defect generate | occur | produces.

  For example, as in the invention described in claim 2, in the mounting step, the jig (80) having a variable fixing force, which is a force for fixing the sensor unit (20), is used as the sensor unit ( 20) is inserted into the recess (11) through the through hole (12) from the side opposite to the mounting side and is brought into contact with the sensor unit (20) to fix the sensor unit (20) to the jig (80). In the connection step, the sensor unit (20) can be fixed to the jig (80) used in the mounting step.

  In such a manufacturing method, the sensor unit (20) is fixed to the jig (80) even during the mounting process. For this reason, compared with the case where the sensor part (20) is not fixed by the jig (80), the adhesive (30) is too close to the bottom surface of the recess (11) due to the weight of the sensor part (20), or on the bottom surface. It is possible to suppress tilting with respect to the device.

  Further, as in the invention described in claim 3, in the invention described in claim 1 or 2, the jig (80) has one surface in contact with the sensor unit (20) and the suction hole (83) on one surface. In the connection process, the sensor part (20) is sucked through the suction hole (83) to perform wire bonding in a state where the sensor part (20) is fixed to one surface and then removed. In the process, the jig (80) can be removed after the suction is stopped and the fixing force of the jig (80) is weakened.

  Further, as in the invention described in claim 4, in the invention described in claim 1 or 2, a sensor unit (20) having a magnetic material is prepared, and a jig (80) is used as an electromagnetic coil ( 84) and a fixed iron core (85), and a portion having a portion that becomes an electromagnet when energized is prepared. In the connection step, the electromagnetic coil (84) is energized and provided in the sensor unit (20). Wire bonding is performed in a state where the sensor unit (20) is fixed to the jig (80) by the magnetic force of the magnetic body and the electromagnet. In the detaching step, the energization to the electromagnetic coil (84) is stopped and the jig (80 The jig (80) can be removed after weakening the fixing force.

  As in the invention described in claim 5, in the invention described in claim 1 or 2, a sensor unit (20) provided with a magnetic body is prepared, and a magnetic body (88) is provided as a jig (80). In the connecting step, the sensor unit (20) is cured by the magnetic force between the magnetic body provided in the sensor unit (20) and the magnetic body (88) provided in the jig (80). Wire bonding is performed in a state of being fixed to the tool (80), and in the removing step, the jig (80) is heated to a temperature higher than the Curie point of the magnetic body (88) provided in the jig (80). The jig (80) can be removed after weakening the fixing force of (80).

  Further, as in the invention described in claim 6, in the invention described in claim 1 or 2, an ultraviolet curable resin (89) is provided as a jig (80) in a portion that contacts the sensor unit (20). In the connection process, the jig (80) is brought into contact with the sensor part (20), and the sensor part (20) is bonded and fixed to the jig (80). In the step, the jig (80) can be removed after the ultraviolet curable resin (89) is cured by irradiating with ultraviolet rays to weaken the fixing force of the jig (80).

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a figure which shows the cross-sectional structure of the physical quantity sensor apparatus manufactured by applying the manufacturing method of the physical quantity sensor apparatus in 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the physical quantity sensor apparatus shown in FIG. FIG. 3 is a top view of the jig shown in FIG. 2. It is a figure which shows a part of manufacturing process of the physical quantity sensor apparatus in 2nd Embodiment of this invention. It is a figure which shows a part of manufacturing process of the physical quantity sensor apparatus in 3rd Embodiment of this invention. It is a figure which shows a part of manufacturing process of the physical quantity sensor apparatus in 4th Embodiment of this invention.

(First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is a diagram illustrating a cross-sectional configuration of a physical quantity sensor device manufactured by applying the physical quantity sensor device manufacturing method according to the present embodiment.

  As shown in FIG. 1, in the physical quantity sensor device of this embodiment, a sensor unit 20 is mounted on a package 10 via an adhesive 30 having elasticity, and a lead 40 provided with the sensor unit 20 in the package 10. And are connected via a bonding wire 50. In the present embodiment, the lead 40 corresponds to the connection terminal of the present invention.

  The package 10 accommodates the sensor unit 20 and includes a recess 11 on one surface. A through hole 12 is formed on the bottom surface of the recess 11 to communicate the inside and outside of the recess 11. The package 10 includes a lead 40 having one end exposed in the recess 11 and the other end exposed to the outside of the package 10. Such a package 10 is made of resin in this embodiment, but may be made of ceramic or the like, for example.

  A sensor unit 20 is mounted in the recess 11 of the package 10 via an adhesive 30. Specifically, the sensor unit 20 is mounted via an adhesive 30 arranged so as to surround the through hole 12. The adhesive 30 functions as a vibration isolating member and attenuates acceleration transmitted from the package 10 to the sensor unit 20. For example, an adhesive having elasticity such as silicone gel or epoxy is used.

  The sensor unit 20 is configured by housing a sensor chip for detecting a physical quantity in a case 21. In the present embodiment, the case 21 is configured to include a box-shaped main body 21a having a storage space for storing a sensor chip, and a lid portion 21b that closes an opening of the main body. And the pad 22 is provided in the part on the opposite side to the cover part 21b side among the main bodies 21a in the case 21, The said pad 22 and the sensor chip accommodated in the accommodation space were embedded in the case 21. FIG. It is electrically connected through a conductor or the like. Further, in the present embodiment, the lid portion 21b is configured by stacking FeNiCo on the body W Ni-Pt plated from the main body 21a side.

  The sensor chip is a semiconductor chip in which a beam structure having a comb-tooth structure is formed on a silicon substrate or the like, and an angular velocity is detected based on a change in capacitance between the movable electrode and the fixed electrode in accordance with the applied angular velocity. Etc. are used.

  And such a sensor part 20 is mounted in the recessed part 11 via the adhesive agent 30 so that the cover part 21b may oppose the bottom face of the recessed part 11. FIG.

  The pad 22 and the lead 40 exposed in the recess 11 are electrically connected via a bonding wire 50 made of gold, aluminum, or the like. As a result, an electrical signal from the sensor chip is output to the outside via the lead 40.

  The package 10 is provided with an upper lid 60 and a lower lid 70, which seals the interior of the package 10. Specifically, the grooves 10 and 14 are provided in the package 10, and the protruding ends 61 and 71 are provided in the upper lid 60 and the lower lid 70, respectively. Then, the groove 15 is filled with the adhesive 15 and the protruding end 61 of the upper lid 60 is inserted, and the groove 15 is filled with the adhesive 15 and the protruding end 71 of the lower lid 70 is inserted, whereby the package 10 The upper lid 60 and the lower lid 70 are integrated. In addition, although the upper cover 60 and the lower cover 70 are comprised using resin in this embodiment, you may be comprised using the metal etc., for example.

  Next, a method for manufacturing such a physical quantity sensor device will be described. FIG. 2 is a cross-sectional view showing a manufacturing process of the physical quantity sensor device shown in FIG.

  First, as shown in FIG. 2A, the package 10 having the above-described configuration is prepared, the adhesive 30 is disposed on the bottom surface of the recess 11, and the sensor unit 20 is mounted on the bottom surface of the recess 11 via the adhesive 30. The mounting process is performed. In this embodiment, when this process is performed, the sensor unit 20 is fixed and the jig 80 whose fixing force is variable is used. FIG. 3 is a top view of the jig 80 in the present embodiment.

  2A and 3, the jig 80 of the present embodiment has a fixing portion 81 that comes into contact with the package 10 and a surface that protrudes from the fixing portion 81 and that is perpendicular to the protruding direction at the tip. And a protrusion 82 having an adsorption hole 83 formed on the one surface. Then, by sucking the object to be symmetric through the suction hole 83, the object can be fixed on one surface. In addition, the jig | tool 80 of this embodiment is comprised using nonmagnetic materials, such as stainless steel and geralumin, for example.

  Then, when performing the process of FIG. 2A, the protruding portion 82 is recessed from the side opposite to the mounting side of the sensor unit 20 via the through hole 12 while the fixing unit 81 is in contact with the package 10. It is inserted into and brought into contact with the sensor unit 20. Thereafter, the sensor unit 20 is fixed to one surface of the jig 80 by sucking the sensor unit 20 in a state where the one surface of the jig 80 is in contact with the sensor unit 20.

  That is, when Ag paste or the like is used as the adhesive 30, the fluidity is high. Therefore, when the sensor unit 20 is mounted without using the jig 80, the adhesive 30 spreads due to the weight of the sensor unit 20. The distance between the sensor unit 20 and the bottom surface of the recess 11 may be shorter than a desired distance, or the sensor unit 20 may be tilted. For this reason, as in the present embodiment, by fixing the sensor unit 20 with the jig 80, a predetermined interval can be formed between the sensor unit 20 and the bottom surface of the recess 11, and the sensor unit 20. Can be prevented from tilting.

  Thereafter, the adhesive 30 is cured in a state where the sensor unit 20 is fixed to the jig 80, thereby bonding the sensor unit 20 and the bottom surface of the recess 11 through the adhesive 30. Thereby, a predetermined interval can be secured between the sensor unit 20 and the bottom surface of the recess 11.

  Subsequently, as illustrated in FIG. 2B, a wire bonding process is performed with the sensor unit 20 fixed to the jig 80, and the sensor unit 20 and the lead 40 are electrically connected by the bonding wire 50. I do. That is, wire bonding is performed in a state where the bonding property is secured by the jig 80.

  Next, as shown in FIG. 2C, after the fixing force of the jig 80 is weakened compared to the connection process, a removal process of removing the jig 80 from the package 10 is performed. Specifically, in the present embodiment, the jig 80 is removed from the package 10 after the suction of the jig 80 is stopped and the fixing to the sensor unit 20 is stopped. Thereafter, the physical lid sensor 70 shown in FIG. 1 is manufactured by arranging the lower lid 70 on the package 10 and arranging the upper lid 60 to seal the inside of the package 10.

  As described above, in the manufacturing method of the present embodiment, when the wire bonding is finished, the suction is stopped and the fixing to the sensor unit 20 is stopped, and then the jig 80 is removed from the package 10. For this reason, when removing the jig | tool 80 from the package 10, it can suppress that the sensor part 20 inclines, and it can suppress that a product defect generate | occur | produces.

  Further, when the sensor unit 20 is mounted on the package 10, since the jig 80 is brought into contact with the sensor unit 20 and the sensor unit 20 is fixed, the sensor unit 20 is too close to the bottom surface of the recess 11 due to its own weight, Inclination with respect to the bottom surface can be suppressed.

(Second Embodiment)
A second embodiment of the present invention will be described. The manufacturing method of the physical quantity sensor device according to the present embodiment uses an electromagnet as the jig 80 as compared with the first embodiment, and is otherwise the same as the first embodiment. Then, explanation is omitted. FIG. 4 is a diagram showing a part of the manufacturing process of the physical quantity sensor device in the present embodiment. FIG. 4 is a process corresponding to the process of FIG.

  As shown in FIG. 4, in the present embodiment, as the jig 80, one having an electromagnetic coil 84 and a fixed iron core 85 and having an electromagnet formed by magnetizing the fixed iron core 85 by energizing the electromagnetic coil 84 is prepared. . Specifically, the jig 80 according to the present embodiment has a housing portion 82a that reaches the inside of the protruding portion 82 from the opposite side of the fixed portion 81 to the side in contact with the package 10, and the housing portion 82a A fixed iron core 85 is embedded. A closing lid 86 that closes the accommodating portion 82 a is coupled to the fixing portion 81 with a screw 87. Further, an electromagnetic coil 84 is disposed around the protruding portion 82, and a fixed iron core 85 is disposed inside the electromagnetic coil 84.

  When the sensor unit 20 is mounted on the bottom surface of the recess 11, the projecting portion 82 and the sensor unit 20 are brought into contact with each other and the electromagnetic coil 84 is energized to generate an electromagnetic force in the electromagnet, thereby causing the sensor unit 20 to project. It sticks to. That is, in the present embodiment, the lid portion 21b is configured to include FeNiCo that is a magnetic material, and the sensor portion 20 is configured to have a magnetic material. Therefore, the sensor is formed by the magnetic force between the lid portion 21b and the electromagnet. The part 20 is fixed to the jig 80.

  Subsequently, after wire bonding is performed in a state where the sensor unit 20 is fixed with the jig 80, the jig 80 is removed from the package 10. In the present embodiment, when removing the jig 80 from the package 10, energization of the electromagnetic coil 84 is stopped to stop fixing to the sensor unit 20, and then the jig 80 is removed from the package 10.

  Also in such a physical quantity sensor device, since the jig 80 is removed from the package 10 after weakening the fixing force of the jig 80 than in the mounting process and the connecting process, the same effect as in the first embodiment is obtained. Obtainable.

(Third embodiment)
A third embodiment of the present invention will be described. In the manufacturing method of the physical quantity sensor device of this embodiment, as compared with the first embodiment, the jig 80 includes a jig containing a magnetic material having a Curie point at a temperature higher than the temperature at which the adhesive 30 is cured. Since other aspects are the same as those of the second embodiment, description thereof is omitted here. FIG. 5 is a diagram showing a part of the manufacturing process of the physical quantity sensor device in the present embodiment. FIG. 5 is a process corresponding to the process of FIG.

  As shown in FIG. 5, in the present embodiment, as a jig 80, a magnetic body 88 made of barium ferrite or the like having a Curie temperature higher than the curing temperature of the adhesive 30 is press-fitted into the accommodating portion 82 a. Prepare.

  When the sensor unit 20 is mounted on the bottom surface of the recess 11, the projecting portion 82 and the sensor unit 20 are brought into contact with each other, and the sensor unit 20 is fixed to the jig 80 by the magnetic force of the lid 21 b and the magnetic body 88. .

  Subsequently, after wire bonding is performed in a state where the sensor unit 20 is fixed with the jig 80, the jig 80 is removed from the package 10. In this embodiment, when removing the jig 80 from the package 10, for example, when the magnetic body 88 is configured using barium ferrite, the jig 80 is heated to 450 ° C. or more, which is the Curie temperature. After the magnetism of the magnetic body 88 is eliminated and the fixing to the sensor unit 20 is stopped, the jig 80 is removed from the package 10. The jig 80 can be heated, for example, by placing and heating the package 10 including the jig 80 in a heating furnace.

  Even in such a physical quantity sensor device, since the jig 80 is removed from the package 10 after weakening the fixing force of the jig 80 than in the mounting process and the connecting process, the same effect as in the second embodiment is obtained. Obtainable.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. The manufacturing method of the physical quantity sensor device according to the present embodiment uses, as compared with the first embodiment, a jig 80 in which an ultraviolet curable resin is disposed in a portion in contact with the sensor unit 20. Since this is the same as in the first embodiment, description thereof is omitted here. FIG. 6 is a diagram showing a part of the manufacturing process of the physical quantity sensor device in the present embodiment.

  As shown in FIG. 6A, in this embodiment, a jig 80 is prepared in which an ultraviolet curable resin 89 is arranged on one surface of the tip of the protruding portion 82. In the present embodiment, the fixing portion 81 and the protruding portion 82 are configured using a material such as quartz that can transmit ultraviolet rays.

  When the sensor unit 20 is mounted on the bottom surface of the recess 11, the sensor unit 20 is fixed to the jig 80 by adhering the sensor unit 20 to the ultraviolet curable resin 89.

  Subsequently, after wire bonding is performed in a state where the sensor unit 20 is fixed with the jig 80, the jig 80 is removed from the package 10. In this embodiment, as shown in FIG. 6B, when the jig 80 is removed from the package 10, ultraviolet light is applied to the ultraviolet curable resin 89 from the opposite side of the jig 80 to the side in contact with the package 10. , The ultraviolet curable resin 89 is cured to weaken the adhesion to the sensor unit 20, and then the jig 80 is removed from the package 10.

  Also in such a physical quantity sensor device, since the jig 80 is removed from the package 10 after weakening the fixing force of the jig 80 than in the mounting process and the connecting process, the same effect as in the first embodiment is obtained. Obtainable.

(Other embodiments)
In each of the above-described embodiments, the example in which the jig 80 is brought into contact with the sensor unit 20 and the sensor unit 20 is fixed to the jig 80 when the sensor unit 20 is mounted on the bottom surface of the recess 11 has been described. When the sensor unit 20 is mounted on the bottom surface of the recess 11, the sensor unit 20 may not be fixed to the jig 80. That is, at least in the connection process, the sensor unit 20 can be secured to the jig 80 to ensure the bonding property, and in the removal process, after the fixing force of the jig 80 is weaker than in the connection process. By removing the jig 80 from the package 10, the effects of the present invention can be obtained.

  In each of the above-described embodiments, the example in which the sensor chip that detects the angular velocity is used has been described. However, for example, a sensor chip that detects acceleration or the like can be used.

  Further, in each of the above embodiments, the example in which the adhesive 30 is cured before the wire bonding between the sensor unit 20 and the lead 40 has been described, but the adhesive after the wire bonding between the sensor unit 20 and the lead 40 is performed. 30 can also be cured.

  Moreover, although the said 1st Embodiment demonstrated the example which comprises the cover part 21b using the material which has magnetic bodies, such as FeNiCo, the said 1st Embodiment attracts the sensor part 20 to the jig | tool 80 by attracting | sucking. Since it adheres, it is not necessary to comprise the cover part 21b using the material which has a magnetic body. That is, the lid portion 21b can be made of only a nonmagnetic material. Similarly, also in the said 4th Embodiment, the cover part 21b can be comprised only with a nonmagnetic material.

  In the fourth embodiment, the jig 80 provided with the ultraviolet curable resin 89 has been described. For example, a thermosetting resin having a curing temperature higher than the curing temperature of the adhesive 30 is applied to one surface of the protrusion 82. It is also possible to use the jig 80 provided in the above. In this case, the jig 80 may be removed from the package 10 after curing the thermosetting resin when performing the removing step.

DESCRIPTION OF SYMBOLS 10 Package 11 Recessed part 12 Through-hole 20 Sensor part 30 Adhesive 40 Lead 50 Bonding wire 80 Jig

Claims (6)

In the method of manufacturing a physical quantity sensor device in which a sensor unit (20) for detecting a physical quantity is mounted on a package (10) via an elastic adhesive (30),
The package (10) has a recess (11) on one side, a through hole (12) is formed on the bottom of the recess (11), and a connection terminal (40) electrically connected to the outside. A process to prepare;
Placing the adhesive (30) on the bottom surface of the recess (11);
A mounting step of mounting the sensor unit (20) on the bottom surface of the recess (11) via the adhesive (30);
A jig (80) having a fixing force that is a force for fixing the sensor unit (20) is made variable from the side opposite to the mounting side of the sensor unit (20) in the concave portion (11). 12) is inserted into the concave portion (11) through 12) and brought into contact with the sensor portion (20) to fix the sensor portion (20) to the jig (80). A connection step of electrically connecting the sensor unit (20) and the connection terminal (40) via a bonding wire (50) by performing wire bonding in a state of being fixed to the jig (80);
A physical quantity comprising: a step of removing the jig (80) from the package (10) after weakening the fixing force of the jig (80) than in the connecting step. A method for manufacturing a sensor device. In the mounting step, the jig (80) in which the fixing force, which is a force for fixing the sensor unit (20), is made variable is opposite to the mounting side of the sensor unit (20) in the concave portion (11). Inserted into the recess (11) through the through-hole (12) and contacted with the sensor part (20) to fix the sensor part (20) to the jig (80),
2. The method of manufacturing a physical quantity sensor device according to claim 1, wherein the connecting step is performed in a state where the sensor unit (20) is fixed to the jig (80) used in the mounting step. As the jig (80), a jig having one surface in contact with the sensor unit (20) and having an adsorption hole (83) formed on the one surface is prepared.
In the connecting step, the wire bonding is performed in a state where the sensor unit (20) is fixed to the one surface by sucking the sensor unit (20) through the suction hole (83).
3. The method of manufacturing a physical quantity sensor device according to claim 1, wherein, in the removing step, the jig (80) is removed after suction is stopped to weaken the fixing force of the jig (80). . Prepare the sensor unit (20) with a magnetic body,
As the jig (80), an electromagnetic coil (84) and a fixed iron core (85) are prepared, and a part having an electromagnet when energized is prepared.
In the connection step, the electromagnetic coil (84) is energized, and the sensor unit (20) is applied to the jig (80) by the magnetic force between the magnetic body and the electromagnet provided in the sensor unit (20). Perform the wire bonding in the fixed state,
The said removal step WHEREIN: After stopping the electricity supply to the said electromagnetic coil (84) and weakening the adhering force of the said jig | tool (80), the said jig | tool (80) is removed. The manufacturing method of the physical quantity sensor apparatus of description. Prepare the sensor unit (20) with a magnetic body,
A jig provided with a magnetic body (88) is prepared as the jig (80).
In the connecting step, the sensor part (20) is moved to the jig (by the magnetic force between the magnetic body provided in the sensor part (20) and the magnetic body (88) provided in the jig (80). 80) performing the wire bonding in a fixed state,
In the removing step, the jig (80) was heated to a temperature higher than the Curie point of the magnetic body (88) provided in the jig (80) to weaken the fixing force of the jig (80). The method of manufacturing a physical quantity sensor device according to claim 1 or 2, wherein the jig (80) is removed later. As the jig (80), a portion provided with an ultraviolet curable resin (89) is prepared in a portion in contact with the sensor unit (20),
In the connecting step, the wire bonding is performed in a state where the jig (80) is brought into contact with the sensor part (20) and the sensor part (20) is adhered and fixed to the jig (80),
The said removal process WHEREIN: After making it harden | cure by irradiating an ultraviolet-ray to the said ultraviolet curable resin (89) and weakening the adhering force of the said jig | tool (80), the said jig | tool (80) is removed. Item 3. A method of manufacturing a physical quantity sensor device according to Item 1 or 2.

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