JP2012040843A - Mold for compression molding and compression molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably compress and seal a molded article while clamping the molded article even with an entire or partial thickness error in the molded article.SOLUTION: The mold for compression molding 100 includes an upper mold 112 and a lower mold 140, which can relatively approach and separate from each other, and compresses and seals the molded article 102 with resin 104 by arranging the molded article 102 in a cavity formed between the upper mold 112 and the lower mold 140. The upper mold 112 includes an upper compression mold 122 having a first flow passage 124 inside and a suction port 124A formed on a surface for holding the molded article 102 and communicating with the first flow passage 124, and an upper main mold 116 which supports the upper compression mold 122 so as to displace in a direction of relatively approaching and separating (a Z-direction) from each other through a cushioning spring 128. The upper mold 112 further includes a first sealed region 125 which is connected to a first air suction mechanism 130 for generating a decompressed state, is arranged in the upper mold 112, can be at least partially deformed, and is communicated to the first flow passage 124.

Description

  The present invention relates to a compression molding die and a compression molding method.

  A manufacturing process in the semiconductor mounting field includes a resin sealing process in which a semiconductor chip is hardened with a resin in order to protect the semiconductor chip from the effects of mechanical stress and temperature / humidity. One of the sealing methods used in the resin sealing step is a compression molding method. For example, Patent Document 1 describes a compression molding die that realizes the compression molding method. As shown in FIG. 6, the compression molding die 1 has an upper die 12 and a lower die 40 that are relatively close to and away from each other, and an upper part to be molded 2 that is a substrate on which a semiconductor chip is mounted. The resin 4 can be compressed and sealed by being placed in a cavity formed between the mold 12 and the lower mold 40. In other words, by using the compression molding die 1, the molded product is pressed by pressing the resin 4 (thermosetting resin; epoxy resin mixed with glass filler) against the molded product 2 in a heated and melted state. Can be manufactured. In the compression molding method, since the flow of the resin 4 is small, wire deformation and the like can be suppressed and high-quality sealing can be performed. The molded product 2 is provided in the upper compression mold 22 of the upper mold 12 by providing a flow path (not shown) in the upper mold and the suction force of the air suction mechanism.

JP 2004-74461 A

  In the configuration of the compression molding die 1 of Patent Document 1, if there is an overall or partial thickness error in the molded product 2, excessive clamping pressure is applied to the molded product 2 during clamping or clamping. There is a risk of resin leakage due to insufficient pressure. In order to avoid this, it is considered effective to have a movable upper compression mold that forms the upper part of the cavity and holds the product to be molded. That is, in such a configuration in FIG. 6, the upper main die 16 and the upper compression die 22 of the upper die 12 are connected via an elastic body such as a disc spring.

  However, in that case, a gap is formed between the upper compression mold 22 and the upper main mold 16, and it becomes impossible to adopt the same configuration as the conventional one in which the product 2 is held by the air suction mechanism. As a result, it becomes difficult to realize stable compression sealing of the molded product 2.

  Therefore, the present invention has been made to solve the above-described problems. Even if there is a total or partial thickness error in the molded product, the present invention can stably cover the molded product while performing an appropriate clamp. It is an object of the present invention to provide a compression mold and a compression molding method capable of compressing and sealing a molded product.

  The present invention has an upper mold and a lower mold that are relatively close to and away from each other, and a product to be molded is placed in a cavity formed between the upper mold and the lower mold and compressed and sealed with resin. The upper mold is provided with an upper mold provided therein with a first flow path and a suction port communicating with the first flow path on the surface holding the molded product And an upper main mold that supports the upper compression mold so as to be displaceable in the relatively approachable / separable direction via an elastic body, and is connected to a first air suction mechanism that generates a reduced pressure state The above-described problems are solved by providing a first sealed region that is provided in the upper mold and at least a part of which can be deformed and communicates with the first flow path.

  In the present invention, the upper compression mold that holds the product to be molded is supported by the upper main mold through the elastic body so as to be displaceable. For this reason, even if there is an overall and partial thickness error in the molded product, appropriate clamping can be performed on the molded product. The upper compression mold is provided with a first flow path and a suction port communicating with the first flow path on the surface holding the product to be molded, and at least a part of the first flow path is deformable. One sealed area communicates. The first sealed region is connected to a first air suction mechanism that generates a reduced pressure state. For this reason, even if the upper compression mold has a gap with respect to the upper main mold and the gap changes, the air suction force by the first air suction mechanism is applied to the molded product from the suction port through the first sealing region. Can be given stably. That is, the molded product can be easily and reliably held in the upper compression mold by the air suction force. At the same time, the contact timing between the molded product and the resin in the compression sealing process can be accurately controlled, and stable compression sealing of the molded product can be realized.

  Further, the upper mold is provided with an upper frame mold provided with a through-hole to be fitted to the upper compression mold, and the upper mold is moved even when the upper frame mold is displaced relative to the upper compression mold. If it is possible to reduce the pressure by the second air suction mechanism that generates a reduced pressure state between the mold and the lower mold, a sealed state can be created when the lower mold and the upper frame mold are in contact with each other, A reduced pressure state can be established between the upper mold and the lower mold at an early stage. For this reason, when compression-sealing, filling of the resin into the molded product can be performed quickly and sufficiently. At the same time, the air in the resin can be eliminated, and the voids of the molded product (molded product) that has been compression-sealed can be reduced. Further, by reducing the pressure, the air pool in the cavity can be eliminated, and a molded product free from defects can be obtained. That is, the compression sealing process can be shortened to further reduce compression sealing defects.

  The configuration for reducing the pressure between the upper mold and the lower mold is not particularly limited. However, the upper compression mold is provided with a second flow path and an air inlet communicating with the second flow path on a surface on the cavity side excluding a surface for holding the molded product. A second airtight region connected to the two air suction mechanism and provided in the upper mold and at least partially deformable and communicating with the second flow path may be provided. In that case, the first sealed region and the second sealed region can have the same configuration, and the design / development can be performed efficiently and cost reduction can be promoted.

  The first to third air suction mechanisms are further provided with a release film disposed on the surface of the lower mold and a third air suction mechanism for adsorbing the release film to the lower mold. Is controlled independently, efficient and optimal control of the first to third air suction mechanisms can be performed. That is, the compression sealing process can be performed more efficiently, and defective compression sealing can be further reduced.

  The first sealed region or the second sealed region may include a pipe having elasticity. In that case, the first sealed area or the second sealed area can be configured simply and at low cost.

  In addition, by providing a plurality of the upper compression molds, a plurality of the cavities are formed in parallel between the upper mold and the lower mold, and when the molded product is held for each upper compression mold, The holding height of the molded product is changed according to the difference in the thickness of the product, and the compression-sealed surface of the molded product in the cavity is in the same position. That is, the volume of the cavity is kept constant even if the thickness of the molded product is different. For this reason, in the state where compression sealing is performed, the difference in sealing pressure between the cavities is alleviated even if the thickness of the molded product is different, even though the cavity structure is formed in parallel. Stop failure can be prevented. At the same time, since the surface on the compression sealing side of the molded product in the cavity is at the same position, the thickness of the resin portion can be made uniform regardless of the molded product having a different thickness.

  And since it has a plurality of cavities formed in parallel between the upper mold and the lower mold, a plurality of molded articles can be simultaneously Molding becomes possible. That is, by simultaneously performing pressure reduction in the same process on a plurality of cavities, it is possible to simultaneously compress and seal a plurality of moldings while maintaining the same compression sealing quality for each molding.

  The lower mold grips the outside of the region to be molded and sealed with the upper mold, and the lower frame mold is integrally formed with the same number of through holes as the cavity. A lower compression mold that is fitted and disposed in each of the through holes, and the sealing with the upper mold is maintained even when the lower frame mold is displaced relative to the lower compression mold The position of the molded product can be fixed by a clamp before the molded product is compressed and sealed. For this reason, the compression sealing defect accompanying the position shift of the area | region where the molded article is compression-sealed can be avoided. And since the position of a lower compression mold | type can be adjusted when compressing and sealing, even if the resin amount fluctuation | variation has arisen, generation | occurrence | production of the compression sealing defect can be reduced. At the same time, leakage of resin from the cavity can be prevented by maintaining the seal. In addition, since the lower frame mold is integrally formed even if it has the same number of through holes as the cavities, it is possible to reduce the size of the lower mold even though a plurality of molded articles can be molded simultaneously. it can.

  The present invention uses an upper mold and a lower mold that are relatively close to and away from each other, and places the molded product in a cavity formed between the upper mold and the lower mold and compresses the resin with a resin. A compression molding method for performing sealing, wherein the upper mold is provided with a first flow path and a suction port communicating with the first flow path on a surface holding the molding target. And an upper main mold that supports the upper compression mold so as to be displaceable in a relatively approachable / separable direction via an elastic body, and at least a part of the upper compression mold is provided in the upper mold. A first sealed region that is deformable and communicates with the first flow path, and the molded product is disposed in the cavity by applying an air suction force to the molded product through the first sealed region; It can also be regarded as a compression molding method characterized by performing compression sealing.

  According to the present invention, even if there is an overall and partial thickness error in the molded product, the molded product can be stably compressed and sealed while performing an appropriate clamp on the molded product.

Schematic diagram of a compression mold to which an example of the first embodiment of the present invention is applied. The partial schematic diagram of the upper mold | type of the metal mold | die for compression molding to which an example of 2nd Embodiment of this invention was applied Schematic diagram of a compression mold to which an example of the third embodiment of the present invention is applied. Schematic diagram showing a part of the upper mold in FIG. Schematic diagram of a compression mold to which an example of the fourth embodiment of the present invention is applied. Schematic diagram showing a conventional mold for compression molding

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic view of a compression mold to which an example of the first embodiment of the present invention is applied. The general features will be described below.

  As shown in FIG. 1, the compression mold 100 includes an upper mold 112 and a lower mold 140 that are relatively close to and away from each other, and two molded articles 102 (102 </ b> A and 102 </ b> B) are connected to the upper mold 112. It arrange | positions in the cavity of the same number (two) as the two to-be-molded articles 102 formed in parallel with the lower mold | type 140 (in the X direction), and performs compression sealing with resin 104 (104A, 104B). Here, the upper mold 112 has an upper compression mold 122 (122A, 122B) in which a suction path 124A communicating with the first flow path 124 is provided on the surface that holds the first flow path 124 and the product 102. And an upper main mold 116 that supports the upper compression mold 122 so as to be displaceable in a relatively approachable / separable direction (Z direction) via a buffer spring 128 that is an elastic body. The compression molding die 100 is connected to a first air suction mechanism 130 for generating a reduced pressure state, and is provided in the upper die 112, and at least a part thereof is deformable and communicates with the first flow path 124. A region 125 is provided. Here, the cavity is a space for resin sealing surrounded by the upper compression mold 122 (122A, 122B) of the upper mold 112, the lower compression mold 150 (150A, 150B) of the lower mold 140, and the lower frame mold 148. Say.

  The molded product 102 is, for example, a substrate (including a lead frame) on which a semiconductor chip is mounted. The surface of the substrate on which the semiconductor chip is mounted becomes the compression-sealed surface of the molded product 102. A semiconductor chip is mounted in the region to be compressed and sealed, and only the substrate exists outside the region to be compressed and sealed. The resin 104 is preformed with a predetermined shape and weight so as to fill the region to be compressed and sealed with the compression and sealing. The release film 106 is separated into strips and can be expanded and contracted. The release film 106 can improve the peelability of the molded product 102 from the cavity when it is compression-sealed and prevent cavity contamination. In the present embodiment, the molded product 102 and the resin 104 are each placed in the cavity by a loader (not shown). Further, in the present embodiment, the molded products 102A and 102B are the same although the thicknesses thereof are different due to an error, and therefore the resins 104A and 104B are the same. However, there is no limitation to this, and the molded articles do not have to be the same.

  Hereinafter, the configuration will be described in detail.

  As shown in FIG. 1, the compression mold 100 includes an upper mold 112 fixed to a fixed platen (not shown), and a lower mold 140 attached to a movable platen (not shown) that can move toward and away from the fixed platen. With.

  The upper mold 112 includes an upper main mold 116, an upper frame mold 120, and an upper compression mold 122, as shown in FIG. The upper main mold 116 supports the upper compression mold 122 via a buffer spring 128. For this reason, each of the upper compression molds 122A and 122B can be independently displaced in a direction (Z direction) that can approach and separate from the upper main mold 116. That is, in a state where compression sealing is performed, when pressure is applied to the upper compression mold 122 from the lower mold side, the buffer spring 128 is compressed, and each of the upper compression molds 122A and 122B moves toward the upper main mold 116. Will be. That is, with the configuration in which the upper compression mold 122 is individually supported by the buffer spring 128 in this way, the holding height of the molded product 102 is changed according to the difference in thickness of the molded product 102 for each cavity, so Both of the surfaces of the molded product 102 on the compression sealing side can have the same holding height (same position). In the present embodiment, a disc spring is used as the buffer spring 128, but the present invention is not limited to this.

  The upper compression mold 122 has the same number (two) as the cavity, and includes a cartridge heater (not shown) inside. In particular, the cartridge heater is configured to heat the upper compression mold 122 to a predetermined temperature. The upper compression mold 122 is provided with a first flow path 124 therein. The lower surfaces of the upper compression molds 122A and 122B constitute upper surfaces of the cavities, respectively, and hold the molded products 102A and 102B, respectively. A plurality of suction ports 124 </ b> A communicating with the first flow path 124 are provided on the surface of the lower surface of the upper compression mold 122 that holds the product 102. The first flow path 124 is a side surface of the upper compression mold 122 and is connected to a pipe having elasticity. The stretchable piping is, for example, a deformable resin tube, and is connected to the first air suction mechanism 130 that is disposed outside the upper mold 112 and generates a reduced pressure state. In other words, the pipe having elasticity constitutes a first sealed region 125 that can be deformed in accordance with the displacement of the upper compression mold 122 in the upper mold 112.

  An upper frame mold 120 is disposed around the upper compression mold 122. In other words, the upper frame mold 120 is provided with a through hole that is fitted to the upper compression mold 122. The upper frame mold 120 is provided with an upper frame channel 120A. An air inlet 120B is provided on the cavity side of the upper frame flow path 120A, and the upper frame flow path 120A is connected to the second air suction mechanism 131 that generates a reduced pressure state outside the upper mold 112. The upper frame mold 120 is connected to the upper main mold 116 via a spring 132.

  Between the upper frame mold 120 and the upper compression mold 122, and between the upper compression mold 122A and the upper compression mold 122B, a seal member 134 such as an O-ring is disposed on the upper side (FIG. 1) of the intake port 120B. Yes. For this reason, it is assumed that the upper frame mold 120 is displaced relative to the upper compression mold 122 while the upper frame mold 120 is in contact with the lower mold 140 via the release film 106. Even in this case, a sealed state is formed between the upper mold 112 and the lower mold 140 so that the pressure can be reduced. The upper frame mold 120 is movable with respect to the upper compression mold 122 without being limited by the molded article 102 even when the molded article 102 is held by the upper compression mold 122.

  As shown in FIG. 1, the lower mold 140 includes a lower main mold 144, a lower frame mold 148, and a lower compression mold 150. The lower main mold 144 supports two lower compression molds 150A and 150B. The lower main mold 144 is provided with a cartridge heater (not shown) so as to have a predetermined temperature. The lower frame mold 148 faces the upper frame mold 120 and the upper compression mold 122. The lower frame mold 148 grips (clamps) the outer side of the region to be molded and held of the molded article 102 held by the upper compression mold 122 with the upper compression mold 122. The lower frame mold 148 is integrally formed with the same number of through holes as the two cavities corresponding to the upper compression molds 122A and 122B. The lower compression molds 150 are respectively fitted in the through holes. A lower frame channel 158 is provided in the lower frame mold 148. The lower frame channel 158 is provided with an intake port 148A on a sliding surface with the lower compression mold 150 and a surface facing the upper mold 112, and is connected to a third air suction mechanism 160 that causes decompression. The lower frame mold 148 is attached to the lower main mold 144 via a spring 152. Therefore, the lower frame mold 148 is movable with respect to the lower compression mold 150.

  A portion where the lower frame mold 148 and the lower compression mold 150 are fitted to each other, lower than the intake port 148A provided in the lower frame mold 148 (FIG. 1), and the surface facing the upper mold 112 of the lower frame mold 148 Are provided with seal members 154 and 156 such as O-rings. For this reason, the release film 106 can be adsorbed on the surface of the lower mold 140. When the lower frame mold 148 is in contact with the upper frame mold 120, the lower mold 140 and the upper mold 112 are kept sealed even when the lower frame mold 148 is displaced relative to the lower compression mold 150. . When there is no release film, the inside of the cavity can be decompressed from the lower mold 140 as well.

  Next, the strength relationship between the buffer spring 128 and the spring 132 of the upper mold 112 and the spring 152 of the lower mold 140 will be described. The relationship between the force F1 due to the spring 132, the force F2 due to the spring 152, and the force F3 due to the buffer spring 128 is expressed by equation (1). The forces F1 to F3 are the sum of the forces of all the springs.

  F1 <F2 <F3 (1)

  Here, with the force F4 (<F3) when all the buffer springs 128 are not functioning, Expression (2) is established.

  F2> F4 (2)

  That is, for example, in a state where only the upper compression mold 122A is in contact with the lower frame mold 148 via the molded article 102A, the lower frame mold 148 is not compressed, and only the upper compression mold 122A is displaced. However, when the upper compression mold 122B is also in contact with the lower frame mold 148 via the article to be molded 102, the lower frame mold 148 is compressed.

  Next, the operation of the compression mold 100 will be described with reference to FIG.

  In the mold opening state where the upper mold 112 and the lower mold 140 are separated from each other, the release film 106 is disposed on the lower mold 140. Then, the third air suction mechanism 160 is operated. Then, an air suction force is generated in the air inlet 148A provided in the lower frame mold 148 via the lower frame channel 158. For this reason, the release film 106 is adsorbed following the surfaces of the lower compression mold 150 and the lower frame mold 148. In this state, the upper mold 112 and the lower mold 140 are set to a constant temperature (for example, 175 degrees) when compression-sealing.

  Next, the workpiece 102 is brought close to the suction port 124 </ b> A on the lower surface of the upper compression mold 122 by a loader (not shown). At this time, the first air suction mechanism 130 is operated. Then, an air suction force is generated in the suction port 124 </ b> A provided in the upper compression mold 122 through the first sealed region 125 and the first flow path 124. Therefore, the molded product 102 is attracted to the lower surface of the upper compression mold 122, and the molded products 102A and 102B are held by the upper compression molds 122A and 122B, respectively. Further, the resins 104A and 104B are disposed in the respective cavities on the release film 106. In addition, holding | maintenance of the to-be-molded goods 102A and 102B by adsorption | suction (arrangement | positioning to a cavity) does not need to be simultaneous. The arrangement of the resin 104 is performed simultaneously as much as possible in order to match the time until the resin 104 is cured.

  Next, the lower mold 140 is moved closer to the upper mold 112. Then, the upper frame mold 120 and the lower frame mold 148 come into contact with each other via the release film 106, and the release film 106 is fixed. At the same time, the upper mold 112 and the lower mold 140 form a sealed state. At this time, the operation of the second air suction mechanism 131 reduces the pressure of the cavity formed between the upper mold 112 and the lower mold 140 through the upper frame flow path 120A provided in the upper frame mold 120.

  Further, the upper mold 112 and the lower mold 140 are brought close to each other, the spring 132 is contracted, and the molded article 102 is gripped (clamped) by the upper compression mold 122 and the lower frame mold 148. For this reason, the to-be-molded product 102 is firmly fixed. In this embodiment, if the molded product 102A is thicker than the molded product 102B, first, the molded product 102A is clamped by the upper compression mold 122A and the lower frame mold 148. However, in a state where the upper compression mold 122B and the lower frame mold 148 are not in contact with each other via the article to be molded 102B, the relationship of Expression (2) is established. For this reason, after the buffer spring 128 that supports the upper compression mold 122A is compressed, the lower frame mold 148 clamps the molded product 102B held by the upper compression mold 122B. That is, the surfaces of the molded products 102A and 102B on the compression sealing side are in the same position. After clamping, the spring 152 is compressed according to the relationship of the formula (1).

  Next, the lower mold 140 is moved further upward to approach the upper mold 112. Then, in a state where the inside of each cavity is equal to or lower than a certain pressure, compression sealing is performed in the vertical direction (uniaxial direction) to complete the mold clamping.

  Next, the upper frame channel 120A is opened to the atmosphere, and the upper mold 112 and the lower mold 140 are opened. Then, when an unloader (not shown) has moved to a predetermined position of the upper mold 112, compressed air is sent to the first flow path 124 through the first sealed region 125. Then, the molded article 102 (molded article) that has been compression-sealed is released from the upper compression mold 122, and the molded article is taken out from the upper mold 112 by an unloader. Further, the release film 106 is moved by opening the lower frame channel 158 to the atmosphere.

  As described above, in the present embodiment, the upper compression mold 122 that holds the workpiece 102 is supported by the upper main mold 116 via the buffer spring 128 so as to be displaceable. For this reason, even if there is an overall and partial thickness error in each of the molded products 102, appropriate clamping can be performed on each of the molded products 102. The upper compression mold 122 is provided with a first flow path 124 inside and a suction port 124A that communicates with the first flow path 124 on the surface that holds the molded product 102, and the first flow path 124 can be deformed. The first sealed region 125 is in communication. The first sealed region 125 is connected to a first air suction mechanism 130 that generates a reduced pressure state. For this reason, even if the upper compression mold 122 has a gap with respect to the upper main mold 116 and the gap changes, the air suction force by the first air suction mechanism 130 from the suction port 124A via the first sealed region 125. Can be stably given to the molded article 102. That is, the article 102 can be easily and reliably held on the upper compression mold 122 by the air suction force. At the same time, the contact timing between the molded article 102 and the resin 104 in the compression sealing process can be accurately controlled, and as a result, stable compression sealing of the molded article 102 can be realized.

  Further, the upper mold 112 is provided with an upper frame mold 120 provided with a through-hole to be fitted to the upper compression mold 122, and the upper frame mold 120 is not displaced even when it is displaced relative to the upper compression mold 122. The second air suction mechanism 131 can reduce the pressure between the mold 112 and the lower mold 140. For this reason, a sealed state can be created when the lower mold 140 and the upper frame mold 120 are in contact with each other, and a reduced pressure state can be established between the upper mold 112 and the lower mold 140 at an early stage. For this reason, at the time of compression sealing, the resin 104 can be quickly and sufficiently filled into the molded product 102. At the same time, the air in the resin 104 can be eliminated and the voids of the molded product can be reduced. Further, by reducing the pressure, the air pool in the cavity can be eliminated, and a molded product free from defects can be obtained. That is, the compression sealing process can be shortened to further reduce compression sealing defects.

  Furthermore, the first to third air suctions are further provided with a release film 106 disposed on the surface of the lower mold 140 and a third air suction mechanism 160 for adsorbing the release film 106 to the lower mold 140. The mechanisms 130, 131 and 160 are controlled independently. Therefore, efficient and optimal control of the first to third air suction mechanisms 130, 131, and 160 can be performed. That is, the compression sealing process can be performed more efficiently, and defective compression sealing can be further reduced.

  Moreover, since the 1st sealing area | region 125 is provided with the piping which has a stretching property, the 1st sealing area | region 125 can be comprised simply and at low cost.

  Further, by providing two upper compression molds 122, two cavities are formed in parallel between the upper mold 112 and the lower mold 140, and the product 102 is held for each upper compression mold 122. For this reason, the holding height of the molded product 102 is changed according to the difference in the thickness of the molded product 102, and the surface on the compression sealing side of the molded product 102 in the cavity becomes the same position. That is, the volume of the cavity is kept constant even if the thickness of the molded product 102 is different. For this reason, in the state where compression sealing is performed, the difference in sealing pressure for each cavity is alleviated even if the thickness of the molded article 102 is different even though the cavity structure is formed in parallel, and compression such as resin leakage is performed. Sealing failure can be prevented. At the same time, since the surface on the compression sealing side of the molded product 102 in the cavity is at the same position, the thickness of the resin 104 can be made uniform regardless of the molded product 102 having a different thickness.

  In this embodiment, since the two cavities formed in parallel between the upper mold 112 and the lower mold 140 are provided, a simple operation of relative approach and separation between the upper mold 112 and the lower mold 140 is provided. Thus, the two molded articles 102 can be molded simultaneously. That is, simultaneous compression sealing (compression molding) of two moldings 102 is performed while maintaining the compression sealing quality of each molding 102 equal by performing decompression in the same process simultaneously on the two cavities. It can be performed.

  The lower mold 140 is a lower frame mold in which the outer side of the region to be molded 102 to be compressed and sealed is clamped with the upper mold 112, and the same number of through holes as the cavities are provided and integrally formed. 148 and a lower compression mold 150 that is fitted and disposed in the through-holes, respectively, and even if the lower frame mold 148 is displaced relative to the lower compression mold 150, the sealing with the upper mold 112 is maintained. I'm leaning. For this reason, before the molded product 102 is compression-sealed, the position of the molded product 102 can be fixed by the clamp. That is, it is possible to avoid a compression sealing defect caused by a positional shift of a region to be compressed and sealed of the molded product 102. In addition, since the position of the lower compression mold 150 can be adjusted when compressing and sealing, the occurrence of compression sealing defects can be reduced even if the resin amount varies. At the same time, leakage of the resin 104 from the cavity can be prevented by maintaining the seal. Further, since the lower frame mold 148 is integrally formed even if it has the same number of through-holes as the cavities, the size of the lower mold 140 is reduced despite the fact that two molded articles 102 can be molded simultaneously. can do.

  Further, since the resin 104 disposed in the cavity is preformed with a predetermined shape and weight, fluctuations in the amount of resin used for compression sealing can be reduced. At the same time, the resin 104 can be easily handled and managed.

  In addition, since the resin 104 is arranged in the cavity by the release film 106 separated into strips, the arrangement of the conveying means for the resin 104 can be made freely. Moreover, since the excess part of the release film 106 can be reduced as much as possible, the release film 106 can be used effectively.

  That is, according to the present embodiment, the molded product 102 can be stably compressed and sealed while performing an appropriate clamp on the molded product 102 even if the molded product 102 has an overall and partial thickness error. can do.

  Although the present invention has been described with reference to the first embodiment, the present invention is not limited to the first embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  In the first embodiment, the upper compression mold 122 is supported only by the buffer spring 128, but the present invention is not limited to this. For example, as in the second embodiment shown in FIG. 2, the guide pin 223 is used to restrict the movement of the upper compression mold 222 (222A, 222B) in the lateral direction (X direction) relative to the upper main mold 216. Also good. This will be specifically described below.

  The upper main mold 216 is provided with a plurality of through holes 216A. The through hole 216A has a head receiving hole 216AA at the upper end, a spring receiving hole 216AC at the lower end, and a pin hole 216AB between the upper end and the lower end. The guide pin 223 is inserted into the plurality of through holes 216A and can be displaced in a direction (Z direction) in which the guide pin 223 can be relatively approached and separated. The head of the guide pin 223 is set to have a larger diameter than the pin hole 216AB and is accommodated in the head receiving hole 216AA. For this reason, a drop-off preventing structure is configured with respect to the upper main mold 216 at the head of the guide pin 223 (the inner diameter of the head receiving hole 216AA is larger than the inner diameter of the pin hole 216AB). The front end portion (lower end portion) of the guide pin 223 is attached to the upper surface of the upper compression die 222, and the guide pin 223 and the upper compression die 222 are integrated. The buffer spring 228 is disposed in the spring receiving hole 216AC, and the guide pin 223 passes through the center of the buffer spring 228. The buffer spring 228 always urges the lower compression die 222 against the upper compression die 222 suspended from the so-called upper main die 216. That is, the buffer spring 228 is disposed between the upper main mold 216 and the upper compression mold 222 and applies an urging force so that the upper main mold 216 and the upper compression mold 222 are separated from each other.

  In the first embodiment, the upper frame channel 120A is provided in the upper frame mold 120 to depressurize the cavity, but the present invention is not limited to this. For example, the inside of the cavity may be depressurized via the upper compression mold 322 as in the third embodiment of FIG. This will be specifically described below.

  In the upper main mold 316 of the upper mold 312, a plurality of flow paths 316B are formed. A second flow path 326 is provided separately from the first flow path 324 inside the upper compression mold 322 (322A, 322B). The second flow path 326 communicates with an air inlet 326A provided on the cavity-side surface (the lower surface of the upper compression mold 322) excluding the surface that holds the molded product 302 (302A, 302B). The second flow path 326 and the flow path 316B are connected by a pipe 329 having elasticity (FIG. 4). The flow path 316B is connected to the second air decompression mechanism 331. The stretchable pipe 329 can be deformed according to the distance variation between the upper main mold 316 and the upper compression mold 322. That is, the second sealed region 327 is formed by the flow path 316B and the pipe 329 having elasticity. In the second sealed region 327, the center of the buffer spring 328 is provided with a stretchable pipe 329 (IV (A)) in FIG. 4A, and the other case (IV (B)) in FIG. Shown in (B). As the pipe 329 having elasticity, for example, a deformable resin tube may be used, or a metal bellows (molded or welded) may be used. In particular, in the case of a welded bellows or the like, the spring constant of the expanding and contracting portion can be adjusted, and the movement in the left-right direction (X direction) can be regulated (in some cases, a buffer spring can be omitted). Since the other configuration is the same as that of the above embodiment, the last two digits are the same and the description is omitted.

  Thus, in this embodiment, the 1st sealed area 325 and the 2nd sealed area 327 can be made into the same composition, design and development can be performed efficiently, and cost reduction can be promoted. .

  Moreover, in the said embodiment, although the sealing member was provided between the upper compression type | mold and the upper frame type | mold, this invention is not limited to this. For example, it may be as in the fourth embodiment shown in FIG. In the present embodiment, an upper fixing frame 418 is further provided on the outer periphery of the upper frame mold 420, and the upper fixing frame 418 is fixed to the upper main mold 416. A seal member 434 is provided between the upper fixed frame 418 and the upper frame mold 420. The upper main mold 416 is provided with flow paths 416A and 416B, and the flow path 416B is connected to a second air suction mechanism 431 (not shown). There is no seal member between the upper frame mold 420 and the upper compression mold 422 (422A, 422B) and between the upper compression mold 422A and the upper compression mold 422B, and the pressure in the cavity can be reduced from the gap therebetween. . On the other hand, only the first flow path 424 is formed inside the upper compression mold 422, and the first flow path 424 is connected to a flow path 416A provided in the upper main mold 416 via a pipe having elasticity. . The channel 416A is connected to a first air suction mechanism 430 (not shown). That is, the configuration of the second sealed region 327 of FIGS. 4A and 4B showing the third embodiment is the configuration of the first sealed region 425 of the present embodiment. In addition, since the other structure is the same as 1st Embodiment, description is abbreviate | omitted on the assumption that the last two-digit number is the same.

  In the above embodiment, a mechanism for adjusting the position of the lower frame mold is not employed, but such a mechanism may be provided. In that case, damage to the release film can be prevented, and reuse of the release film can be promoted.

  Moreover, in the said embodiment, although two cavities were provided, this invention is not limited to this. There may be one cavity or three or more cavities. Even if a plurality of cavities are provided, it is not always necessary to use all cavities, and only one or more cavities can be used as appropriate.

  In the above embodiment, the upper mold is attached and fixed to the fixed platen. However, the present invention is not limited to this, and the lower mold is fixed to the fixed platen and the upper mold can approach and separate. It may be movable in any direction.

  Further, in the above embodiment, the upper mold includes an upper frame mold provided with a through hole that is fitted to the upper compression mold, and the upper frame mold is displaced relative to the upper compression mold. However, the pressure can be reduced between the upper mold and the lower mold, but the present invention is not limited to this. For example, the upper frame mold may not be provided, and the cavity may not necessarily be decompressed.

  Moreover, in the said embodiment, although the said 1st sealing area or the 2nd sealing area was equipped with the piping which has a stretching property, this invention is not necessarily limited to this. For example, both the first sealed region and the second sealed region need not be stretchable piping, and the first sealed region and the second sealed region are provided in the upper mold and at least partly deformed. What is necessary is just to be set as the possible structure.

  Further, in the above embodiment, the lower mold is formed integrally with the upper mold while gripping the outside of the compression-sealed region of the molded product with the same number of through holes as the cavity. A lower frame mold, and a lower compression mold that is fitted and disposed in each of the through-holes, and the lower frame mold is disposed with respect to the upper mold even if the lower frame mold is displaced relative to the lower compression mold. Although the sealing is maintained, the present invention is not limited to this. For example, the lower mold need not be divided into a lower frame mold and a lower compression mold. Further, the lower frame mold may not be integrated and may be separated for each through hole. Furthermore, the sealing is not necessarily required.

  In the above embodiment, the resin disposed in the cavity is preformed with a predetermined shape and weight. However, the present invention is not limited to this, and may be a powdery or granular resin or a liquid. Resin may be used.

  Moreover, in the said embodiment, although the release film was made into strip shape, this invention is not limited to this. For example, the resin may be placed in the cavity with a continuous release film. In this case, it becomes easy to transport the resin to the cavity, and the used release film can be easily collected. Alternatively, a release film may not be used for the lower mold.

  The mold for compression molding of the present invention can be widely used, for example, for the purpose of compressing and sealing a molded article such as a substrate (including a lead frame) on which a semiconductor chip is mounted with a resin.

1, 100, 300, 400 ... Mold for compression molding 2, 102, 102A, 102B, 302, 302A, 302B, 402A, 402B ... Molded article 4, 104, 104A, 104B, 304A, 304B, 404A, 404B ... Resin 6, 106, 306, 406 ... Release film 12, 112, 212, 312, 412 ... Upper mold 16, 116, 216, 316, 416 ... Upper main mold 20, 120, 220, 420 ... Upper frame mold 22, 122, 122A, 122B, 222, 222A, 222B, 322, 322A, 322B, 422, 422A, 422B ... upper compression type 31, 131, 331, 431 ... second air suction mechanism 32, 52, 132, 152, 232, 332, 352, 432, 452 ... springs 34, 54, 56, 134, 154, 156, 334 354, 356, 434, 454, 456 ... Sealing member 40, 140, 340, 440 ... Lower mold 44, 144, 344, 444 ... Lower main mold 48, 148, 348, 448 ... Lower frame mold 50, 150, 150A , 150B, 350A, 350B, 450A, 450B ... Lower compression type 58, 158, 358, 458 ... Lower frame flow path 60, 160 ... Third air suction mechanism 120A ... Upper frame flow path 120B, 148A, 326A ... Intake port 124 324, 424 ... 1st flow path 124A ... Suction port 125, 325, 425 ... 1st sealing area 128, 228, 328, 428 ... Buffer spring 130, 330, 430 ... 1st air suction mechanism 223 ... Guide pin 316B, 416A, 416B ... flow path 326 ... second flow path 327 ... second sealed region 418 ... upper fixed frame

Claims (8)

Compression molding that has an upper mold and a lower mold that are relatively close to and away from each other, and places the product to be molded in a cavity formed between the upper mold and the lower mold and compresses and seals with resin. Mold,
The upper mold includes an upper compression mold in which a first flow path and a suction port communicating with the first flow path are provided on a surface that holds the molding target, and the upper compression mold via an elastic body. And an upper main mold that supports the movable body so as to be displaceable in a relatively approachable / separable direction, and
For compression molding, comprising a first sealed region connected to a first air suction mechanism for generating a reduced pressure state, provided in the upper mold and at least partially deformable and communicating with the first flow path. Mold. In claim 1, further comprising:
The upper mold comprises an upper frame mold provided with a through-hole fitted into the upper compression mold,
Even if the upper frame mold is displaced relative to the upper compression mold, the pressure can be reduced by a second air suction mechanism that generates a reduced pressure state between the upper mold and the lower mold. Mold for compression molding. In claim 2, further:
The upper compression mold is provided therein with a second flow path and an air inlet communicating with the second flow path on a surface on the cavity side excluding a surface holding the molded product,
A compression molding die comprising a second sealed region connected to the second air suction mechanism and provided in the upper mold and at least partially deformable and communicating with the second flow path. In claim 2 or 3, further
A release film disposed on the surface of the lower mold, and a third air suction mechanism for adsorbing the release film to the lower mold,
The first to third air suction mechanisms are independently controlled. A compression mold. In any one of Claims 1 thru | or 4, Furthermore,
The first sealing region or the second sealing region includes a pipe having stretchability. A compression mold. In any one of Claims 1 thru | or 5,
By providing a plurality of the upper compression molds, a plurality of the cavities are formed in parallel between the upper mold and the lower mold,
A mold for compression molding, characterized in that the molded product is held for each upper compression mold. In any one of Claims 1 thru | or 6.
The lower mold includes a lower frame mold formed integrally with the upper mold so as to hold the outer side of the compression-sealed region of the molded article with the same number of through holes as the cavity. A lower compression mold that is fitted and arranged in each hole,
A compression mold, wherein the lower frame mold is kept sealed with the upper mold even when the lower frame mold is displaced relative to the lower compression mold. Using an upper mold and a lower mold that are relatively close to and away from each other, compression molding is performed by placing a molding object in a cavity formed between the upper mold and the lower mold and compressing and sealing with resin. A method,
The upper mold includes an upper compression mold in which a first flow path and a suction port communicating with the first flow path are provided on a surface that holds the molding target, and the upper compression mold via an elastic body. And an upper main mold that displaceably moves in a relatively approachable / separable direction, and is provided in the upper mold and at least partially deformable and communicates with the first flow path. Comprising a first sealed area;
A compression molding method, wherein an air suction force is applied to the molded product through the first sealed region to place the molded product in the cavity and perform the compression sealing.