CN110126168B - Die carrier, die recess unit, compression molding die, and compression molding device - Google Patents

Abstract

The invention provides a mold device for compression molding, which can absorb the thickness deviation of workpieces and resin amount deviation when a plurality of workpieces arranged in parallel are respectively compressed and molded, and has high universality. The compression molding die device comprises: an upper die (2) having a workpiece holding section (2a) for holding a plurality of workpieces (W), respectively; and a lower die (3) in which a plurality of lower die cavity recesses (3a) are formed by a jig (5e) and a cavity block (5d), the lower die cavity recesses (3a) being disposed so as to face the workpiece holding section (2a), the jig (5e) being disposed independently for each workpiece for clamping the workpiece (W), the cavity block (5d) being configured to pressurize the resin by being relatively moved while being inserted into the jig (5e), the upper dies (2) each having an adjustment mechanism (8), the adjustment mechanism (8) being capable of adjusting the height of each workpiece (W).

Description

Die carrier, die recess unit, compression molding die, and compression molding device

Technical Field

The present invention relates to a die holder for a die, a die recess unit for a die, a compression molding die, and a compression molding apparatus using the same, which are used for simultaneously compression molding a plurality of workpieces arranged in parallel while individually clamping the workpieces.

Background

Various devices have been developed and put into practical use for a device in which a lower cavity recess provided in a lower mold is covered with a release film, a molding resin (such as a granular resin, a liquid resin, or a powdery resin) is supplied to the lower cavity recess, and a molding die for holding a workpiece on an upper mold is clamped to perform compression molding (see japanese patent application laid-open No. 2010-36542).

In the lower chamber movable type compression molding die, a device for resin molding 1 workpiece by 1 die is the mainstream, and therefore, from the viewpoint of reducing the installation area and improving the productivity, a compression molding device using a compression molding die having two stages in the height direction is also proposed (see japanese patent application laid-open No. 2010-94931).

However, for example, in the case of compression molding a long strip-shaped substrate as a workpiece, in the case of a resin substrate, the variation in thickness is large compared to a lead frame, and there are cases where: the number of semiconductor chips mounted on 1 strip substrate varies depending on the number of mounted semiconductor chips. In addition, when the number of semiconductor chips mounted on 1 strip substrate is changed, if the supply amount of the mold resin is not changed, the molding thickness of the final sealing portion (resin sealing portion) is changed by compression molding. It is difficult to perform compression molding while shortening the molding time while comprehensively adjusting them.

Here, several compression molding apparatuses have been proposed in which strip-shaped substrates are compression molded while being arranged in two parallel rows as in the case of a transfer molding die (see japanese patent application laid-open nos. 2011-143730 and 2012-40843).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2010-36542

Patent document 2: japanese patent application laid-open No. 2010-94931

Patent document 3: japanese patent laid-open publication No. 2011-143730

Patent document 4: japanese laid-open patent publication No. 2012 and 40843

Disclosure of Invention

Problems to be solved by the invention

The compression molding apparatus disclosed in japanese patent application laid-open publication No. 2011-143730 has a pair of compression molding dies, and a lower die is supported by a movable platen, and a clamp member and two slide members, each having two chambers, are supported by the lower die. Mounting rods are provided on the back side (lower side) of the slide member constituting the bottom of the chamber, and elastic members are wound around the respective mounting rods. Thereby, each slide member is slidably supported by the clamp member surrounding each slide member. The adjustment member receiving the mounting rod of each slide member is rotated in a balanced manner about one shaft supported by the movable plate, and can apply uniform pressure to the molten resin. However, since the adjusting member is configured to rotate in a balanced manner about only one shaft provided on the movable disk, and to absorb the variation in the amount of the left and right resin supplied to the left and right chambers, there is a problem in the strength of the adjusting member. If the strength of the adjustment member is insufficient, the adjustment member may be damaged, and the sliding member may not function and may not absorb variations in the amount of resin. Further, when performing maintenance work of the mold or when performing compression molding on a different workpiece, it is necessary to remove the upper mold and the lower mold from the compression molding apparatus and perform the work again. In this case, it is necessary to remove the entire upper die holding the pair of workpieces from the fixed platen and the entire lower die having the two chambers from the movable platen, and therefore, a large-scale operation is required.

In the compression molding die of jp 2012 a-40843, two upper compression dies that hold the strip-shaped substrate by suction are suspended and supported by the upper main die via buffer springs, respectively. Around the two upper compression molds, an upper frame mold is suspended and supported by an upper main mold via springs. Two lower compression dies constituting a lower die cavity and a lower frame die into which the two lower compression dies are inserted are supported by a lower main die disposed to face the upper main die. The lower compression die support is fixed to the lower main die, and the lower frame die is supported in a floating manner by a spring. A release film is held by adsorption on the surfaces of the two lower compression dies and the lower frame die. The plate thickness error of the strip-shaped substrates respectively sucked and held by the upper compression mold is absorbed by the deflection of the buffer spring. Although the thickness error can be absorbed by the upper compression die, since the lower frame die existing between the two bars commonly sandwiches the bar, there is a possibility that the lower frame die is inclined at the time of clamping due to a difference in the thickness of the bar. Further, when the heights of the left and right dies are changed due to variation in the amount of resin supplied to the lower cavity chamber, there is a possibility that the die is not filled on one side and the target resin pressure is not reached, and the entire press apparatus (particularly, the lower die as a movable die) is inclined. Further, since one release film covering two lower mold chambers (two lower compression molds and a lower frame mold) is used for compression molding of two strip-shaped substrates, when the release films are sucked and held, the release films are pulled against each other and are hard to be sucked at an appropriate position. Further, since the surfaces of the two lower mold cavities are covered with one release film, it is difficult to handle the mold, and a useless use area which does not contribute to compression molding is generated. Further, when performing maintenance work of the die or when performing compression molding for different types of workpieces, it is necessary to integrally replace the two upper compression dies suspended and supported by the upper main die via the cushion spring, and it is necessary to integrally remove and replace the two lower compression dies supported by the lower main die and the lower frame die inserted and supported by floating by the two lower compression dies, which results in large-scale die replacement work.

Means for solving the problems

The present invention to which several embodiments described below can be applied is made to solve the above problems.

A first object of the present invention is to provide a compression molding die having high versatility and capable of absorbing variations in thickness and variations in resin amount of a plurality of workpieces arranged in parallel and performing compression molding with high accuracy, and a compression molding apparatus having high versatility and capable of maintaining molding quality with high productivity using the compression molding die.

A second object is to provide a die holder for a compression molding die, which can easily perform replacement work of a plurality of die pocket units and has high versatility. Further, the present invention provides a compression molding die capable of performing compression molding with high accuracy by adjusting variation in die height during clamping of the die at the time of simultaneous compression molding by a plurality of die-recessed units arranged in parallel in a lateral direction on the die carrier.

A third object is to provide a die cavity unit capable of facilitating handling of a film during compression molding, reducing an unnecessary use area, and improving molding quality so that wrinkles are less likely to occur in the film and the thickness of a sealing portion is constant. Further, the compression molding die is provided, which can absorb the deviation of the plate thickness and resin amount of the workpiece to improve the molding quality and improve the replacement operability of the die groove even if a plurality of die groove units are arranged in parallel on the die carrier in the transverse direction.

The invention related to several embodiments described below includes at least the following structures. That is, a compression molding die for simultaneously compression-molding a plurality of workpieces by clamping the plurality of workpieces arranged in parallel in a lateral direction, the compression molding die comprising: a first die having a workpiece holding portion for holding each of the plurality of workpieces; and a second die that forms a plurality of cavity recesses arranged opposite to the workpiece holding portion by a jig for clamping the workpieces and arranged independently for each workpiece and a cavity block that pressurizes a resin by being relatively moved while being inserted into the jig, the first die having an adjustment mechanism that is capable of adjusting a height individually for each workpiece.

With the above configuration, the molding resin is supplied to the plurality of cavity recesses formed in the second mold, and the mold is closed with the work held by the plurality of work holding portions of the first mold, thereby performing compression molding on each work. In this case, even if there is a variation in the plate thickness of the plurality of workpieces and a variation in the amount of resin supplied to the plurality of cavity recesses, the variation in the die height at the time of die clamping can be adjusted individually for each workpiece by the adjustment mechanism provided in the first die, and therefore, the thickness of the resin seal portion (package portion) can be compression molded with high accuracy.

Further, when the mold is replaced by the setup adjustment, the adjustment mechanism provided in the first mold can be shared, and therefore, the versatility can be improved.

Preferably, the first die has first pocket units having the work holding portions arranged in parallel in a lateral direction on a first die frame, the adjusting mechanism has spring units that bias the first pocket units in directions away from the first die frame in a die opening and closing direction, and the adjusting mechanism adjusts a variation in die height when the first pocket units arranged in parallel on the first die frame clamp the dies.

Thus, the variation in the die height during die clamping is adjusted by the spring unit of the adjustment mechanism for each of the first pocket units arranged in parallel in the lateral direction, and therefore, the variation in the plate thickness of the workpiece and the variation in the resin amount can be adjusted for each of the first pocket units. Further, even if the first recess unit is replaced, the adjustment mechanism provided in the first mold frame can be used all the time.

The second mold may be provided with second groove units having the cavity recess portion arranged in parallel with a second mold frame, and each of the second groove units may be supported by the second mold frame so as to be relatively movable between a cavity block forming a bottom of the cavity recess portion and a jig forming a side portion of the cavity recess portion around the cavity block.

Accordingly, since the work held by the work holding portions of the first groove units arranged in parallel in the lateral direction of the plurality of works is clamped while the jigs of the second groove units arranged to face each other are pressed against the chamber block, the whole of the first die or the second die is not inclined due to the variation in the plate thickness of the work and the variation in the amount of resin, and compression molding can be performed individually for each work.

Preferably, a film covering the lower mold clamping surface including the cavity recess is suction-retained by each of the second groove units.

In this way, when a film covering the lower mold clamping surface is used for each second pocket unit, handling is facilitated when the film is sucked and held on the lower mold clamping surface including the lower mold cavity recess, and it is possible to avoid as much as possible the occurrence of useless use areas that do not contribute to compression molding, such as long films.

The compression molding die may include: an upper die frame; an upper die recess unit detachably assembled to the upper die frame via an adjusting mechanism for adjusting a die height, the upper die recess unit having a workpiece holding portion on an upper die clamping surface; a lower die frame disposed opposite to the upper die frame; and a lower die cavity unit which is assembled to the lower die frame in an insertable and removable manner, and which forms a lower die cavity recess by a lower die cavity block disposed to face the workpiece holding portion and a jig supported to surround the lower die cavity block in a relatively movable manner.

Since the variation in the mold height at the time of clamping the mold is adjusted for each workpiece by the adjustment mechanism provided in the upper mold frame, the thickness of the resin seal portion (package portion) can be compression-molded with high accuracy.

The pair of upper cavity units may be supported in a lateral direction on the upper die frame so as to be detachable via the adjustment mechanism, the upper die groove units are respectively provided with a first upper die plate and a second upper die plate which are assembled on the adjusting mechanism in an overlapping manner and are provided with workpiece holding parts, a pair of lower die groove units and a pair of upper die groove units are arranged oppositely along the transverse direction and are respectively arranged on the lower die frame in a detachable manner, the lower die groove units have first and second lower die chamber recesses, respectively, the first lower cavity recess is formed by a lower cavity block arranged opposite to the first upper plate and a clamp which surrounds the lower cavity block and is supported in a relatively movable manner, the second lower die cavity recess is formed by a lower die cavity block disposed opposite to the second upper die plate and a jig supported so as to be movable relative to the lower die cavity block so as to surround the lower die cavity block.

Thus, even if the pair of upper cavity units are arranged on the upper die frame in the lateral direction and the pair of lower cavity units are arranged on the lower die frame in the lateral direction so as to face the pair of upper cavity units, it is possible to absorb and adjust the variation in the die height at the time of clamping the die for each of the pair of cavity units arranged in parallel. The upper die groove unit or the lower die groove unit can be independently assembled and disassembled from the upper die frame or the lower die frame and replaced, and even if the groove is replaced, the adjusting mechanism arranged on the upper die frame can be always used.

A compression molding die having a plurality of dies mounted in a row in a lateral direction, the dies clamping a single workpiece and compression molding a resin, the compression molding die being opened and closed by a common die opening and closing mechanism, the compression molding die comprising: a first die having a workpiece holding portion for holding the workpiece; and a second die that forms a cavity recess portion arranged opposite to the workpiece holding portion by a jig for clamping the workpiece and a cavity block inserted into the jig and pressurizing a resin by a relative movement, wherein an adjustment mechanism for adjusting a height is provided in either of the first die and the second die.

In this case, for example, even in the case of a large-sized workpiece which is not necessarily arranged side by side in the lateral direction, it is possible to perform compression molding with high accuracy by adjusting the variation in the die height corresponding to the large-sized workpiece at the time of die clamping by the configuration of a first die or a second die which is mounted in a plurality of rows in the lateral direction and which is openable and closable by a common die opening and closing mechanism and which has a height adjusting mechanism.

A compression molding die for simultaneously compression molding a plurality of workpieces by clamping the plurality of workpieces arranged side by side in a lateral direction, the compression molding die comprising: a first die for supporting workpiece holders for holding the workpiece, the workpiece holders being arranged in a horizontal direction on a first base section of a first die frame; and a second die which supports cavity recesses arranged to face the workpiece holding portion in a lateral direction on a second base portion of a second die frame, the cavity recesses being formed by a jig for clamping the workpiece and a cavity block which pressurizes a resin by moving relatively while being inserted into the jig, the cavity block being supported and fixed to a die plate independently for each workpiece, the jig being supported by the die plate independently for each workpiece, and an adjustment mechanism for adjusting a height of each workpiece being provided independently between the die plate and the second base portion.

Thus, when a plurality of workpieces are clamped by the first die and the second die, respectively, the first die having the workpiece holding portions arranged in the first base portion in the lateral direction and the second die having the cavity recesses arranged in the second base portion in the lateral direction so as to face the workpiece holding portions, the variation in die height can be absorbed for each workpiece by the jig supported by the die plate and the adjustment mechanism provided between the die plate and the second base portion.

In the compression molding apparatus having any one of the compression molding dies described above, since compression molding can be performed simultaneously while absorbing variations in plate thickness and clamping position, respectively, using a die pocket unit in which a plurality of strip-shaped substrates are arranged in parallel, productivity and molding quality are improved.

A die holder for detachably supporting a pair of upper and lower die holders, each of which has a plurality of die pocket units arranged in parallel in a lateral direction, wherein an adjustment mechanism is integrally provided on a base portion, which is either one of the upper and lower die holders, and the adjustment mechanism can absorb a variation in die height at the time of clamping a die, which is caused by a total variation in thickness of a work clamped by each die pocket unit, an amount of a resin of a molding resin, and a thickness of a thin film covering a clamping surface.

In the above-described configuration, since the adjustment mechanism is provided integrally with the base portion and the die frame on either one of the upper and lower sides, it is possible to absorb variation in die height at the time of die clamping caused by total variation in thickness of the workpiece clamped by the plurality of die pocket units arranged side by side in the lateral direction, the amount of resin of the molding resin, and the thickness of the thin film covering the clamping surface.

Further, when the mold recess unit is replaced, the replacement work is easy without replacing the mold frame, and the adjustment mechanism can be used all the time even if the mold recess unit is replaced, so that the versatility is high.

The mold frame may have: a first groove guide provided on the mold opening/closing surface side of the first guide block adjacent to the first guide block, the first guide block being provided to hang from the first base part; and a second groove guide provided adjacent to a second guide block on an open/close die surface side of the second guide block, the second guide block being provided upright from a second base portion, stepped portions into which the first groove unit is inserted and removed being formed on both sides by the first guide block and the first groove guide, and stepped portions into which the second groove unit is inserted and removed being formed on both sides by the second guide block and the second groove guide, respectively.

Thus, the first groove unit can be inserted and removed from the front side with the stepped portions formed by the first guide block and the first groove guide disposed on both sides as guides. The second groove unit can be inserted from the front side with the stepped portion formed by the second guide block and the second groove guide disposed on both sides as the guide. Therefore, the number of replacement parts of the mold can be reduced, and replacement work can be easily performed.

The first base side portion of the frame shape provided so as to hang down from the first base portion and the second base side portion of the frame shape provided so as to stand up from the second base portion may be arranged to face each other, and the first guide block that partitions the first mold space portion surrounded by the first base side portion and the second guide block that partitions the second mold space portion surrounded by the second base side portion may be arranged to face each other.

In this way, the first base part and the second base part are arranged to face each other, and the frame-shaped first base side part and the frame-shaped second base side part are arranged to face each other. Further, since the first guide block partitioning the first mold space and the second guide block partitioning the second mold space are disposed to face each other, the first pocket unit removably received in the first mold space and the second pocket unit removably received in the second mold space can be easily aligned.

The first base side portion may be rotatably coupled to the first base portion by a hinge on a side of the first pocket unit that is deeper in the insertion and extraction direction, and the second base side portion may be rotatably coupled to the second base portion by a hinge on a side of the second pocket unit that is deeper in the insertion and extraction direction.

Thus, when the first base side portion is rotated by a predetermined amount with respect to the first base portion about the hinge provided on the insertion/removal direction depth side of the first pocket unit, the first pocket unit held by the first base portion is exposed on the insertion/removal direction front side, and therefore, the first pocket unit can be replaced by being pulled out in the insertion/removal direction front side.

Further, when the second base side portion is rotated by a predetermined amount with respect to the second base portion about the hinge provided on the insertion/removal direction depth side of the second pocket unit, the second pocket unit held by the second base portion is exposed on the insertion/removal direction front side, and therefore, the second pocket unit can be replaced by being pulled out in the insertion/removal direction front side.

The adjusting mechanism may have a spring unit that applies a force to the first recess plate with respect to the first die frame in the die opening/closing direction or applies a force to the second recess plate with respect to the second die frame in the die opening/closing direction, or may have a sliding plate having slopes overlapping each other slidably provided between the first die frame and the first recess plate or between the second die frame and the second recess plate.

Thus, the variation in the mold height at the time of clamping the mold can be absorbed and adjusted for each of the die-cavity units arranged in parallel with a simple structure, and the adjustment mechanism can be used at all times even if the die-cavity units are replaced.

A die-recess unit for compression molding a resin by clamping a workpiece by a first recess unit and a second recess unit, wherein a workpiece holding portion is provided on a clamping surface of either the first recess unit or the second recess unit, a cavity recess portion is formed on a clamping surface of the other of the first recess unit and the second recess unit, the cavity recess portion is arranged to face the workpiece holding portion, the cavity recess portion is formed by a jig for clamping the workpiece and a cavity block inserted into the jig and relatively moving to pressurize the resin, a film suction hole or a suction groove having a suction hole is provided on a clamping surface of the jig for suction-holding an outer peripheral edge portion of a film covering the cavity recess portion, and a film suction hole or a suction groove having a suction hole is provided between the film suction hole and the cavity recess portion, Or a peripheral groove is arranged between the suction groove with the suction holes and the cavity concave part, and a plurality of suction holes are arranged at the bottom of the peripheral groove.

With the above-described die pocket unit, the outer peripheral edge portion of the film is held by suction in the film suction hole or the suction groove having the suction hole, and suction is performed from the suction hole provided in the groove bottom portion of the peripheral groove provided between the film suction hole and the chamber recess portion or between the suction groove having the suction hole and the chamber recess portion, at the nip surface of the jig including the chamber recess portion provided in any one of the pocket units, so that the remaining portion of the film is accommodated in the peripheral groove, and suction fixation and wrinkle flattening of the film can be smoothly performed.

Therefore, when a plurality of workpieces are simultaneously compressed and pressed while being clamped by the die pocket units arranged in parallel in the transverse direction, it is possible to prevent the deterioration of the forming quality due to the occurrence of wrinkles in the film. Further, handling of the thin film is facilitated and useless use areas of the thin film are eliminated.

The peripheral groove may also serve as a recess into which a film pressing pin that presses a film provided on a nip surface of either the first groove unit or the second groove unit enters. Thus, when the workpiece and the film are clamped by the pair of die groove units, the film pressing pin is inserted into the peripheral groove, so that the remaining portion of the film can be reliably guided into the peripheral groove and the wrinkles can be flattened.

The peripheral groove may also serve as a retreat groove for the chuck claw of the workpiece holding portion.

Thus, even if the chuck jaws for mechanically holding the workpiece on the workpiece holding portion are provided, the chuck jaws can be inserted into the peripheral groove when the workpiece and the film are clamped, and therefore, the chuck jaws do not interfere with the clamping surface of the second die recess unit. Further, the work can be held by the work holding portion not only by air suction but also by the chuck jaws, and therefore, the transfer of the work can be performed reliably.

A groove unit for a compression molding die for clamping a workpiece to a pair of groove units and compression molding a resin, wherein a first lock piece is provided so as to protrude from each edge portion of a rectangular clamp surface or a groove plate constituting one of the groove units, and a second lock piece capable of engaging with the first lock piece is provided so as to protrude from a clamp surface or a groove plate opposing surface of the other opposing groove unit.

Thus, when clamping a workpiece to the pair of groove units, the relative clamping surfaces can be aligned by the concave-convex fitting of the first and second locking blocks. This contributes to improvement in molding quality.

The first groove unit may have a first engaging portion that is engaged with a first guide block formed upright with respect to the first mold frame in an insertable and removable manner, and the second groove unit may have a second engaging portion that is engaged with a second guide block formed upright with respect to the second mold frame in an insertable and removable manner.

Thus, the compression molding die is opened, and the first die groove unit is inserted and removed in a state where the first locking portion is locked to the first guide block erected from the first die frame on both sides, whereby the die replacement operation can be easily performed.

Further, the second mold groove unit is inserted and removed in a state where the second locking portion is locked to the second guide block erected on both sides from the second mold frame, so that the mold replacement work can be easily performed.

A leveling mechanism for correcting the inclination of the clamping surfaces with respect to each other may be provided at a position opposing the first groove unit and the second groove unit.

This makes it possible to maintain the parallelism between the clamping surfaces of the first groove unit and the second groove unit, which are disposed to face each other when the mold is closed.

A die pocket unit for compression molding having a first pocket unit having a work holding portion for holding a work and a second pocket unit having a cavity recess for supplying a molding resin, wherein the second pocket unit is arranged so that a cavity block forming a bottom of the cavity recess and a jig forming a side portion of the cavity recess can be relatively moved, and a stopper for limiting a height position of the jig is provided on a surface of the jig on a side opposite to a side where a clamping surface is located.

Accordingly, the relative height position of the jig with respect to the chamber block is defined by the stopper in accordance with the variation in the plate thickness of the workpiece and the amount of resin supplied to the chamber recess, and therefore, the variation in the plate thickness of the workpiece and the variation in the amount of resin supplied to the chamber recess can be absorbed, and compression molding can be performed with a desired thickness.

A plurality of overflow chambers may be provided along an outer peripheral edge of the chamber block.

Thus, even if the amount of resin supplied to the cavity recess is not accurately measured for each workpiece, the compression molding can be performed while keeping the thickness of the molded article constant by containing the excess resin in the overflow cavity.

Preferably, in the compression molding die, any one of the die recess units is arranged side by side in a lateral direction with respect to a die frame, and the die recess unit is provided to be able to be independently inserted into and removed from the die frame.

Thus, a necessary mold recess unit among the plurality of mold recess units arranged in parallel in the lateral direction with respect to the mold frame can be taken out from the mold frame, maintenance or mold replacement can be performed, and a mold replacement operation can be easily performed with a small number of replacement parts. Further, the film can be held by suction on the nip surface including the cavity recess in a state in which wrinkles are flattened for each die pocket unit, so that handling is facilitated and a useless use region of the film can be eliminated.

ADVANTAGEOUS EFFECTS OF INVENTION

Provided is a highly versatile compression molding die capable of absorbing variations in die height during die clamping caused by variations in the thickness of a plurality of workpieces arranged side by side in a transverse direction and variations in the amount of resin supplied, and capable of performing compression molding with high accuracy.

Further, it is possible to provide a compression molding apparatus which uses the compression molding die, has high productivity, and has high versatility for maintaining molding quality.

Since the adjustment mechanism is provided integrally with the base portion and the die frame on either the upper or lower side, it is possible to absorb the variation in die height at the time of die clamping caused by the total variation in the plate thickness of the workpiece clamped by the plurality of die pocket units arranged side by side in the lateral direction, the resin amount of the molding resin, and the film thickness covering the clamping surface.

Further, when the mold recess unit is replaced, the replacement work is easy without replacing the mold frame, and the adjustment mechanism can be used all the time even if the mold recess unit is replaced, so that the versatility is high.

Provided is a die cavity unit which can facilitate handling of a thin film during compression molding, reduce useless use areas, and improve molding quality so that variations in the thickness of a work and variations in the amount of resin can be absorbed and the thickness of a sealing portion can be made constant.

Drawings

Fig. 1 is a cross-sectional explanatory view of a compression molding die after opening the die.

Fig. 2 is a sectional explanatory view of the upper die of fig. 1, partially cut away.

Fig. 3 is a cross-sectional explanatory view of the upper mold of fig. 2 viewed from the side.

Fig. 4 is a plan view of the upper die of fig. 2 viewed from the clamping surface side.

Fig. 5 is a cross-sectional explanatory view of the lower die of fig. 1.

Fig. 6 is a cross-sectional explanatory view of the lower die of fig. 5 viewed from the side.

Fig. 7A is a plan view of the lower die of fig. 5 viewed from the clamping surface side, and fig. 7B is a partial sectional view showing a state before and after closing of the lower die chamber block and the lower die movable jig.

Fig. 8 is a cross-sectional explanatory view of the compression molding die of fig. 1 viewed from the front in a closed state.

Fig. 9 is a sectional explanatory view of the mold frame viewed from the front and a sectional explanatory view of the mold cavity unit taken out from the mold frame.

Fig. 10A is a cross-sectional explanatory view in front view showing a state before and after the removal of the mold cavity unit from the mold frame, and fig. 10B is a cross-sectional explanatory view in side view of the mold cavity unit removed from the mold frame.

Fig. 11A is a sectional view of a compression molding die of another example viewed from the front, and fig. 11B is a plan view of a lower die viewed from the clamping surface side.

Fig. 12 is a cross-sectional explanatory view of a compression molding die when compression molding is performed on a large-sized workpiece, as viewed from the front.

Fig. 13 is a cross-sectional explanatory view of a compression molding die in a case where compression molding is performed on a large-sized workpiece of another example of fig. 12, as viewed from the side.

Fig. 14A is a plan view of an upper mold for molding a rectangular substrate viewed from the clamping surface side, and fig. 14B is a plan view of a lower mold viewed from the clamping surface side.

Fig. 15A is a plan view of an upper mold for molding a circular substrate viewed from the clamping surface side, and fig. 15B is a plan view of the lower mold viewed from the clamping surface side.

Fig. 16 is a cross-sectional explanatory view of a compression molding die of another example viewed from the front.

Fig. 17 is a cross-sectional explanatory view of a compression molding die of another example viewed from the front.

Fig. 18 is a cross-sectional explanatory view of a compression molding die in a case where compression molding is performed on one strip-shaped substrate, as viewed from the front.

Fig. 19 is a cross-sectional explanatory view of a compression molding die in a case where three strip-shaped substrates are compression molded, as viewed from the front.

Fig. 20A is a cross-sectional explanatory view showing another example of the adjusting mechanism provided on the upper die in a front view, and fig. 20B is a cross-sectional explanatory view of the adjusting mechanism in a side view.

Fig. 21 is a plan layout view showing an example of a resin molding apparatus using a compression molding die.

Fig. 22 is an explanatory diagram showing another example of the compression molding apparatus.

Fig. 23 is an explanatory diagram showing another example of the compression molding apparatus shown in fig. 22.

Fig. 24 is an explanatory view showing another example of the compression molding die.

Fig. 25 is an explanatory view showing another example of the compression molding die.

Detailed Description

Hereinafter, one embodiment for carrying out the present invention will be described in detail with reference to the drawings. The term "die-cavity unit" means a unit in which die members constituting a cavity recess or a work holding portion are integrally assembled. The term "compression molding die" means a die in which the die cavity unit is integrally assembled to the die frame, and the die opening/closing mechanism is removed.

[ first embodiment ]

Fig. 1 shows a compression molding die 1 for compression molding a plurality of workpieces W, respectively, and has the following configuration. Further, it is assumed that the work W is a rectangular long strip substrate (a lead frame, a metal substrate, a ceramic substrate, a resin substrate, or the like). The size of the workpiece W is assumed to be about 100mm × 300mm (hereinafter, simply referred to as "workpiece W").

The compression molding die 1 includes an upper die 2 (first die) and a lower die 3 (second die). The compression molding die 1 includes an upper cavity unit 4 (first cavity unit), the upper cavity unit 4 having a workpiece holding portion 2a for holding the workpiece W on the upper die 2, a plurality of lower cavity units 5 (second cavity units) arranged to face each other, and the lower cavity units 5 having lower cavity recesses 3a for supplying the molding resin to the lower dies 3.

Further, the upper cavity units 4 are arranged in parallel at a plurality of positions (two positions in fig. 1) of the upper mold frame 6 (first mold frame) in the lateral direction. Lower die groove units 5 are provided in parallel at a plurality of positions (two positions in fig. 1) of the lower die frame 7 (second frame) in a lateral direction. The upper and lower die groove units 4 and 5 are oppositely disposed, respectively. The upper die frame 6 includes an adjusting mechanism 8 (as a mechanism for making the total height of the plurality of dies the same, even if one die is used, the workpiece W having a deviation described below can be adjusted, and therefore, the adjusting mechanism 8 is hereinafter referred to as an "adjusting mechanism 8") and the adjusting mechanism 8 adjusts the deviation of the plate thickness of the workpiece W held by the plurality of workpiece holding portions 2a (both of the difference in plate thickness of each workpiece W and the difference in local thickness and inclination in the plane of 1 workpiece, hereinafter, collectively referred to as a "deviation"), and the deviation of the die height when the plurality of upper die groove units 4 and the lower die groove units 5 are clamped (in addition to the "deviation", the deviation includes the difference in die height due to the difference in the amount of resin supplied to the lower die cavity recess 3a, and is simply referred to as a "deviation"). As a result of the adjustment of the variation in the die height by the adjustment mechanism 8, the total height of the dies after compression molding by the plurality of dies used for compression molding can be made uniform, and the inclination of the press mechanism can be avoided.

With the above configuration, the mold resin is supplied to the lower cavity recesses 3a provided in the plurality of lower cavity units 5 arranged in parallel with the lower mold frame 7, respectively, and the work W is held by the work holding portions 2a provided in the plurality of upper cavity units 4 arranged in parallel with the upper mold frame 6, respectively, and in this state, the mold is closed, and compression molding can be performed for each work W.

In this case, even if there is a variation in the thickness of the plurality of workpieces W or a variation in the height of the mold during mold clamping due to a difference in the amount of resin supplied, the upper concave groove unit 4 and the lower concave groove unit 5 disposed to face each other can be adjusted by the adjustment mechanism 8 provided in the upper mold frame 6, and therefore, the thickness of the resin seal portion (package portion) can be compression-molded with high accuracy.

Further, since the upper die frame 6 and the lower die frame 7 are provided with a plurality of groove units in a single layer, the bending rigidity can be improved by securing the thickness of the base, and the temperature change in the molding cycle can be suppressed because the heat capacity is large.

Further, even if the upper and lower cavity units 4 and 5 are replaced by the replacement adjustment, the adjustment mechanism 8 provided in the upper die frame 6 can be shared, and therefore, the versatility can be improved.

The adjusting mechanism 8 is disposed between the upper die frame 6 and the upper cavity unit 4. Thus, even if the upper cavity unit 4 is replaced, the adjustment mechanism 8 can be used all the time. As an example of the adjusting mechanism 8, a spring unit that biases the upper cavity unit 4 in the mold opening and closing direction with respect to the upper mold frame 6 is provided. Thus, variations in the die height of a plurality of die-cavity units arranged side by side in the lateral direction (an arrangement in which another workpiece is arranged on the immediately lateral side so that the long sides of the workpieces are parallel) can be adjusted with a simple configuration.

Here, a configuration example of the upper mold 2 and the lower mold 3 constituting the compression molding die 1 will be specifically described. An example of the structure of the upper mold 2 will be described with reference to fig. 2. The upper die frame 6 includes an upper die base portion 6a (first base portion) having a rectangular plate shape, and an upper die base side portion 6b (first base side portion) having a rectangular frame shape provided to hang down along an outer peripheral edge portion of the upper die base portion 6 a. An upper die guide 6d (first guide) is provided so as to hang down from the upper die base portion 6a and partition an upper die space portion 6c (first die space portion) surrounded by the upper die base side portion 6 b. The upper die space portions 6c (see fig. 9) partitioned by the upper die guide 6d are provided with the adjustment mechanisms 8, respectively.

Upper groove guides 6e (first groove guides) are provided at the lower end portions of the upper guide blocks 6d adjacent to the upper guide blocks 6d, respectively. A step portion 6f into which the upper die groove unit 4 is inserted and removed is formed between the upper die guide block 6d and the upper die groove guide 6e (between the continuous wall surfaces) and on both sides. As will be described later, the upper cavity block 4 can be inserted and removed using the pair of step portions 6f as guide rails.

As shown in fig. 10B, the upper base portion 6a and the upper base side portion 6B are connected to each other on one side surface side (the deep side in the insertion and extraction direction of the upper cavity unit) adjacent to each other so as to be rotatable by the hinge 6 g. When replacing the upper pocket unit 4, the upper base side portion 6B can be rotated in a predetermined direction (counterclockwise direction in fig. 10B) about the hinge 6g so that the end portion thereof located on the front side in the inserting/removing direction is separated from the upper base portion 6 a. This allows the upper cavity unit 4 to be replaced by pulling it out to the near side with the step portion 6f as a guide. Further, the upper cavity units 4 arranged in parallel on the upper mold frame 6 can be inserted into and removed from the upper mold frame 6 independently from each other, and therefore, the workability of maintenance is good. Further, a link member, not shown, for regulating the opening angle of the upper mold base portion 6a is preferably connected between the upper mold base portion 6a and the upper mold base side portion 6 b. Further, only the near side surface portion of the upper mold base side portion 6B formed in a rectangular frame shape may be connected to the upper mold base portion 6a so as to be rotatable by a hinge (clockwise direction in fig. 10B). In this case, the upper concave groove unit 4 can be drawn out on the drawing-in/drawing-out direction deep side.

Further, although the recess unit is inserted and removed by sliding it laterally on the deep side and the near side, it is not necessarily limited to the insertion and removal by sliding it laterally, and the mold frame and the recess unit may be detachably attached and detached in the vertical direction.

Further, an upper guide 6d and an upper groove guide 6e of an intermediate portion (intermediate portion in fig. 2) that divides the upper mold space portion 6c may be detachably provided on the upper mold base portion 6 a. As a result, as shown in fig. 12 and 13, which will be described later, even if the workpiece W is a large-sized substrate, the upper die frame 6 and the adjustment mechanism 8 can be shared by replacing only the upper notch unit 4.

Fig. 2 and 9 illustrate an example of the structure of the adjustment mechanism 8. A pin suspension plate 8a is provided to overlap the upper die base portion 6 a. The plurality of suspension pins 8b are inserted into pin holes 8c provided at equal intervals in the left-right direction (see fig. 2) and the front-rear direction (see fig. 3) in the pin suspension plate 8a, and the pin heads 8b1 (upper end portions) are respectively engaged with the pin holes 8 c. The distal end portion 8b2 (lower end portion) of each suspension pin 8b is connected to the pressing plate 8 d. A coil spring (not particularly limited to a coil spring as long as it is an elastic body) 8e is inserted between each pin hanging plate 8a and the pressing plate 8d in a state of being compressed from a natural length. Thereby, the pressing plate 8d and the suspension pin 8b are constantly biased vertically downward. The left and right end surfaces of the pressing plate 8d are guided by the upper mold guide 6d and moved up and down while maintaining parallelism.

An example of the configuration of the upper cavity unit 4 will be described with reference to fig. 2 to 4.

The upper notch unit 4 has an upper notch plate 4a (first notch plate) at an upper end portion. The upper cavity plate 4a is attached to a pressing plate 8d of the adjusting mechanism 8 so as to overlap with a lower surface of the pressing plate 8 d. The outer dimensions of the upper cavity plate 4a are the same as those of the pressing plate 8d, and the left and right end faces can be raised and lowered while maintaining parallelism by being guided by the upper guide 6 d. An upper die support block 4b having a larger outer dimension than the upper die groove plate 4a is provided to overlap the lower surface of the upper die groove plate 4 a. The left and right end portions (first locking portions) of the upper support block 4b are assembled to the upper guide block 6d (see fig. 2) so as to be insertable and removable on the near side while being locked to the step portion 6 f. An upper die plate 4c having an outer dimension smaller than that of the upper die support block 4b is provided on the lower surface of the upper die support block 4b so as to overlap. As shown in fig. 4, suction holes 2b serving as a work holding portion 2a are formed in the center of the lower surface of the upper die plate 4c at a plurality of positions along the outer peripheral edge of the work. Further, chuck claws 4d are provided rotatably at a plurality of positions (for example, at 6 positions in fig. 4) around the workpiece holding portion 2a of the upper die plate 4 c.

In fig. 2, the chuck jaw 4d has an L-shape in which the horizontal portion 4d1 and the vertical portion 4d2 are continuous. The middle portion of the horizontal portion 4d1 is rotatably assembled to the upper die support block 4b about a fulcrum 4 e. In the vicinity of the end of the horizontal portion 4d1, a coil spring 4f is attached between the horizontal portion 4d1 and the upper die groove plate 4a in a state of being compressed from its natural length. The horizontal portion 4d1 is integrally provided with a pressing pin 4g so as to penetrate the upper die plate 4 c. Since the horizontal portion 4d1 is always biased downward by the coil spring 4f, the distal end portion of the presser pin 4g protrudes below the clamp surface of the upper die plate 4 c. The locking portion 4d3 is formed at the lower end of the vertical portion 4d2 so as to face inward of the outer peripheral edge of the workpiece. The chuck claws 4d are biased by the resilient action of the coil springs 4f in a direction of sandwiching the outer peripheral edge of the workpiece W by the vertical portions 4d2 about the fulcrums 4 e. Therefore, each of the locking portions 4d3 enters below the outer peripheral edge of the workpiece W, and is in a state capable of holding the workpiece W. When the chuck jaws 4d are opened to remove the workpiece W, the presser pin 4g is simply pushed in against the biasing force of the coil spring 4 f. Further, a film pressing pin 4h is provided in a protruding manner on the outer peripheral side of the upper die plate 4c with respect to the workpiece holding portion 2 a. A coil spring 4i is installed between the film pressing pin 4h and the upper die recess plate 4a in a state of being compressed from a natural length. Thus, the tip end portion of the film pressing pin 4h protrudes below the clamp surface of the upper die plate 4 c. As will be described later, the film pressing pin 4h is provided to stretch the remaining portion of the single film 9 that is sucked and held while covering the nip surface of the lower die 3.

Next, a configuration example of the lower die 3 will be described.

In fig. 5, the lower die frame 7 includes a lower die base portion 7a (second base portion) having a rectangular plate shape, and lower die base side portions 7b (second base side portions) having a rectangular frame shape provided upright along an outer peripheral edge portion of the lower die base portion 7 a. A lower die guide 7d (second guide) is provided upright on the lower die base portion 7a to partition a lower die space portion 7c (second die space portion: see fig. 9) surrounded by the lower die base side portion 7 b. The lower cavity unit 5 is insertably assembled to a lower cavity portion 7c (see fig. 9) partitioned by a lower guide 7 d.

In fig. 5, lower groove guides 7e (second groove guides) are provided on upper end portions of the lower mold guide blocks 7d adjacent to the lower mold guide blocks 7d, respectively. A step portion 7f (see fig. 9) into which the lower die groove unit 5 is inserted and removed is formed between the lower die guide 7d and the lower die groove guide 7e (between the continuous wall surfaces) and on both sides. The lower die groove unit 5 can be inserted and removed with the pair of step portions 7f as guide rails. A suction hole for pressure reduction 7b1 is provided in the side wall of the lower mold base side portion 7b, and is connected to an air suction mechanism not shown. Further, a seal member 7b2 (e.g., an O-ring) is provided on the mold opening/closing surface of the lower mold base side portion 7b, and abuts against the opposing surface of the upper mold base side portion 6b to seal the mold space when the mold is closed.

As shown in fig. 10B, the lower die base portion 7a and the lower die base side portion 7B are connected to each other at an adjacent one-side surface side (lower die pocket unit insertion/removal direction depth side) so as to be rotatable via a hinge 7 g. When replacing the lower cavity unit 5, the end portion of the lower base side portion 7B in the insertion/removal direction can be rotated in a predetermined direction (clockwise direction in fig. 10B) about the hinge 7g so as to be separated from the lower base portion 7 a. This allows the lower die groove unit 5 to be replaced by pulling it out to the near side using the step portion 7f as a guide. Further, the lower die recess units 5 arranged in parallel on the lower die frame 7 can be inserted into and removed from the lower die frame 7 independently of each other, and therefore, the workability of maintenance is good. Further, a link member, not shown, for regulating the opening angle of the lower die base side portion 7b is preferably connected between the lower die base portion 7a and the lower die base side portion 7 b. Further, only the near side surface portion of the lower mold base side portion 7B formed in a rectangular frame shape may be coupled to the lower mold base portion 7a so as to be rotatable (counterclockwise in fig. 10B) by a hinge. In this case, the lower die groove unit 5 can be pulled out in the insertion and extraction direction to the depth side.

Further, a lower mold guide 7d and a lower mold groove guide 7e of an intermediate portion (intermediate portion in fig. 5) that divides the lower mold space portion 7c may be detachably provided on the lower mold base portion 7 a. As a result, as shown in fig. 12 and 13, even if the work W is a single large (wide) substrate, the lower die holder 7 can be shared by replacing the lower die recess unit 5 with only the upper die recess unit 4.

An example of the structure of the lower die groove unit 5 will be described with reference to fig. 5 to 7A and 7B.

The lower die groove unit 5 has a lower die base plate 5a at a lower end portion. The lower base plate 5a is attached to the lower base part 7a so as to overlap the upper surface of the lower base part 7 a. The lower base plate 5a can be attached so that its left and right end surfaces are guided by the lower guide blocks 7d and inserted and pulled out from the near side of fig. 5 while maintaining parallelism. A plurality of support columns (support posts) 5b are formed upright on the upper surface of the lower base plate 5a and in a vertically lower projection plane of the lower cavity block 5 d. Thus, the clamping pressure can be finely adjusted by changing the arrangement of the support columns 5b or changing the density of the arrangement while preventing warpage of the lower mold cavity block 5 d. Therefore, when a large-sized (wide) workpiece W, for example, a 300mm × 300mm plate, a semiconductor wafer having a diameter exceeding 300mm, or the like is compression-molded, TTV (Total Thickness variation) can be improved. The large (width) size means that the substrate is wider than a long strip substrate of about 100mm × 300mm, and does not necessarily have to be rectangular.

A support plate 5c is supported by the support column 5 b. The support plate 5c is provided so that its left and right end surfaces are guided by the lower die guide 7d, similarly to the lower die base plate 5 a. A lower cavity block 5d is stacked and supported on the center portion of the upper surface of the support plate 5 c. The lower mold chamber block 5d constitutes the bottom of the lower mold chamber recess 3 a. A lower mold movable jig 5e constituting a side portion of the lower mold cavity recess 3a is supported around the lower mold cavity block 5d so as to be movable in the mold opening and closing direction. Specifically, the pressing pin 5f is inserted through the support plate 5c and abuts against the lower surface of the lower mold movable jig 5 e. The flange portion 5h having a larger diameter than the presser pin 5f is always abutted against the lower surface side of the support plate 5c by the action of the coil spring 5g inserted between the presser pin 5f and the lower die base plate 5a in a state of being compressed from a natural length. Thereby, the upper end of the pressing pin 5f protrudes from the support plate 5c, and the lower mold movable jig 5e is constantly biased upward. As described later, the lower cavity block 5d may be directly supported by the support column 5b without interposing the support plate 5c therebetween.

The clamping in the present embodiment exemplifies a case where the workpiece W is clamped by the workpiece holding portion 2a and the movable jig 5e, but in the case of the integral package molding, the clamping is also called as clamping in a case where the workpiece W is sucked and held by the suction hole 2b of the workpiece holding portion 2a and the upper die plate 4c is directly clamped by sandwiching the workpiece W without using the lower mold movable jig 5e, that is, in a case where the entire outer side of the workpiece W is resin-molded in a plan view.

Further, a lower cavity plate 5j (second cavity plate) having a rectangular frame shape is provided so as to surround the outer peripheral side of the lower movable jig 5 e. The lower recessed plate 5j is stacked and supported on the support plate 5 c. A gap between the lower movable jig 5e and the lower groove plate 5j is sealed by a sealing member 5k (e.g., an O-ring). The lower mold movable jig 5e is moved up and down while its inner peripheral side is guided by the lower cavity block 5d and its outer peripheral side is guided by the lower groove plate 5 j.

A stepped portion 5m (second locking portion) corresponding to the stepped portion 7f is formed on the outer peripheral surface side of the lower die groove plate 5 j. As shown in fig. 9, the stepped portion 7f is formed by coupling a narrow lower mold guide 7d and a lower mold groove guide 7e having a width larger than that of the narrow lower mold guide. The stepped portion 5m is formed along both the left and right side surfaces so that the clamping surface side becomes narrow along the stepped portion 7 f. The lower die groove unit 5 can be inserted into and removed from the lower die frame 7 using the step portion 7f facing the stepped portion 5m as a guide rail. In addition, gaps for inserting and removing the units are provided between the upper mold groove unit 4 and the upper mold frame 6 and between the lower mold groove unit 5 and the lower mold frame 7. Therefore, it is preferable that a screw fixing mechanism for eliminating a gap in the height direction in the attached state is provided in the upper cavity unit 4 and the upper mold frame 6, and the lower cavity unit 5 and the lower mold frame 7.

As shown in fig. 7A, relief grooves 5e1 for avoiding interference with the locking portions 4d3 of the chuck jaws 4d from the inner peripheral side are provided at a plurality of positions in the circumferential direction of the clamping surface of the lower die movable jig 5 e. As shown in fig. 7A, a peripheral groove 5e2 is provided continuously with the escape groove 5e1 and circumferentially on the outer peripheral side thereof, and the peripheral groove 5e2 accommodates a loose portion of the single sheet of film (release film) 9 (see fig. 7B). Suction holes 5e3 are provided at a plurality of circumferential positions in the bottom of the circumferential groove 5e 2. The peripheral groove 5e2 does not necessarily have to be continuous with one stroke, and may have the suction holes 5e3 or may be partially broken. Further, a film suction groove 5e4 for sucking and holding the outer peripheral edge portion of the single film 9 is circumferentially provided on the outer peripheral side of the peripheral groove 5e 2. Suction holes 5e5 are provided at a plurality of positions in the circumferential direction of the bottom of the film suction groove 5e 4. Film suction may also be realized by providing only the suction holes 5e5, but the combination of the film suction grooves 5e4 and the suction holes 5e5 enables film suction to be further reliably realized. The film suction grooves 5e4 do not necessarily have to be continuous with one stroke, and may have suction holes 5e5 or may be partially broken. The suction holes 5e3 and 5e5 are connected to an air suction mechanism not shown.

As shown in fig. 7B, the single film 9 is supplied to the lower mold clamping surface covering the lower mold cavity recess 3a, and is sucked and held by the suction holes 5e5 of the film suction groove 5e4 formed in the outermost periphery of the clamping surface of the lower mold movable jig 5 e. The single film 9 is sucked and held along the suction path 5e6 provided on the outer periphery of the bottom of the lower cavity recess 3a (the outer periphery of the lower cavity block 5 d). When the mold is closed in this state, the film pressing pin 4h protruding below the upper die plate 4c enters the opposing peripheral groove 5e 2. At this time, the film pressing pin 4h presses the slack portion of the single film 9 into the peripheral groove 5e2 by the biasing force of the coil spring 4i (see fig. 2), and is sucked into the suction hole 5e3 and accommodated therein. The locking portions 4d3 (see fig. 2) of the chuck claws 4d that hold the outer peripheral edge portion of the workpiece W are accommodated in the opposing escape grooves 5e1 (see fig. 7A), and can be prevented from interfering with the lower mold movable jig 5 e. Further, since the single-piece film 9 is sucked through the suction holes 5e3 in the peripheral groove 5e2, the single-piece film 9 stuck to the molded article is sucked by the lower die 3 at the time of opening the die, and the mold is smoothly released. At this time, since the film pressing pin 4h presses the single film 9 against the lower die 3 by the deflection of the coil spring 4i, the single film 9 can be pressed until the film pressing pin 4h is separated from the lower die 3, and a peeling failure is less likely to occur. The single film (release film) 9 is a heat-resistant film having a thickness of, for example, about 50 μm, is easily released from the mold surface, has flexibility and stretchability, and can be suitably used as a single layer or a multilayer film mainly composed of PTFE, ETFE, PET, FEP, fluorine-containing glass cloth, polypropylene film, polyvinylidene chloride, or the like.

In this way, if the single film 9 covering the lower mold clamping surface including the lower mold cavity recess 3a can be sucked and held for each lower mold pocket unit 5, handling is facilitated when the film is sucked and held to the lower mold clamping surface including the lower mold cavity recess 3a, and generation of a useless use area which is not related to compression molding like a long film can be avoided as much as possible.

In fig. 4, upper mold locking pieces 4j (first locking pieces) are provided at positions 4 on a clamp surface at the center of the peripheral edge portion of an upper mold plate 4c formed in a rectangular shape. In fig. 7A, a pair of lower lock blocks 5n (second lock blocks) are provided at 4 so as to protrude in pairs on a clamping surface or a lower groove plate 5j at the center of the peripheral edge portion of a lower movable jig 5e formed in a rectangular shape. The upper mold lock block 4j is disposed so as to engage with the opposing lower mold lock block 5n by concave-convex fitting. Thus, the upper die plate 4c on which the work holding portion 2a is formed and the lower movable jig 5e or the lower cavity plate 5j constituting the lower cavity recess 3a can be aligned with respect to each of the respective cavity units, and the dies can be closed. The upper and lower lock blocks 4j and 5n may be vertically replaced by a pair.

In fig. 9, an upper die adjustment pin 4k (see fig. 2) and a lower die adjustment pin 5p (see fig. 5) (leveling mechanism) are provided at positions corresponding to the upper die plate 4c of the upper die groove unit 4 and the lower die groove plate 5j of the lower die groove unit 5, respectively, so as to protrude therefrom. The upper tool adjustment pin 4k is supported by the upper tool pocket plate 4a, and is provided to protrude below the upper tool clamping surface so as to penetrate the support block 4b and the upper tool plate 4 c. The lower die adjustment pin 5p is supported by the lower die base plate 5a via a coil spring 5q, and is provided so as to protrude above the lower die clamping surface through the support plate 5c and the lower die recessed plate 5 j.

As shown in fig. 4, the upper die adjustment pins 4k are provided at equal intervals along the edge of the long side of the upper die plate 4c (4 on one side, 8 on both the left and right sides). As shown in fig. 7A, a plurality of lower adjustment pins 5p (4 on one side and 8 on both left and right sides) are provided at equal intervals along the edge portion on the long side of the lower recessed plate 5 j. The number of the upper die adjustment pins 4k and the lower die adjustment pins 5p is arbitrary, and they may be provided on the short side. The upper and lower adjustment pins 4k and 5p are arranged at the same position in a plan view.

The upper die adjustment pin 4k protruding from the upper die plate 4c and the lower die adjustment pin 5p protruding from the lower die groove plate 5j are disposed to face each other. Therefore, at the time of closing the mold, the upper mold adjustment pin 4k and the lower mold adjustment pin 5p opposed to each other at a plurality of places collide with each other earlier than the mold surface, and the deflection of the coil spring 5q absorbs the variation of the pressing force, so that the parallelism between the clamp surfaces of the upper mold groove unit 4 and the lower mold groove unit 5 disposed to face each other can be corrected, and then the mold surfaces can be brought into planar contact, so that the local contact can be prevented.

Here, the operation of the adjustment mechanism 8 will be described with reference to fig. 8. For example, the left half of fig. 8 shows a die clamping state in a case where the workpiece W has a smaller thickness or the amount of resin of the molding resin is smaller than that of the normal workpiece W. The right half of fig. 8 shows a die clamping state in the case where the workpiece W has a larger thickness or the amount of resin of the molding resin is larger than that of the normal workpiece W.

In the case of the left half of fig. 8, the workpiece W has a smaller plate thickness than the normal workpiece W or the amount of resin supplied is smaller than the target amount of resin of the mold resin (the amount of resin that will be the appropriate final package thickness after molding). Or both may be present. In this case, the coil spring 8e inserted between the pin suspension plate 8a and the pressing plate 8d is in a rebound state, and the deflection of the coil spring 8e can absorb the variation in the plate thickness of the workpiece W. When the amount of the molding resin is small, the upper die plate 4c which holds the work W by suction presses the lower die movable jig 5e against the biasing force of the coil spring 5 g. Accordingly, since the relative height position of the lower mold movable jig 5e with respect to the lower mold cavity block 5d is determined to be the same according to the plate thickness of the workpiece W and the amount of resin supplied to the cavity recess portion 3a, when the plate thickness t1 of the workpiece W is thin and the amount of resin supplied to the cavity recess portion 3a is small, the deviation t2 of the plate thickness t1 and the amount of resin can be absorbed. Such an adjustment action is performed by each upper die groove unit 4 and each lower die groove unit 5 provided at a plurality of places (two places in the present embodiment).

In the case of the right half of fig. 8, the workpiece W has a larger thickness than the workpiece W in the left half, or the amount of resin supplied is larger than the target amount of resin of the mold resin (the amount of resin that will be the appropriate final package thickness after molding). Or, in the case where the difference between the right and left is larger, both of them may exist. In this case, in the upper die groove unit 4, an error t3 occurs in the height position of the presser pin 4g urged by the coil spring 4 f. However, the coil spring 8e inserted between the pin suspension plate 8a and the pressing plate 8d is compressed, the suspension pin 8b is pressed back, the head 8b1 is in a state of being slightly separated from the pin suspension plate 8a by the gap t4, and the deflection of the coil spring 8e absorbs the variation in the plate thickness of the workpiece W.

In the lower cavity unit 5, the height position of the pressing pin 5f is changed by a distance t5 by the biasing force of the coil spring 5g, and the lower movable jig 5e is in a state of generating a gap t6 slightly separated from the support plate 5 c. In this way, the relative height position of the lower mold movable jig 5e with respect to the lower mold cavity block 5d is determined to be the same according to the amount of resin supplied to the cavity recess 3 a. This absorbs the variation in the resin thickness t 7.

As described above, the biasing mechanism and the adjusting mechanism 8 of the lower movable jig 5e can absorb variations in the mold height (the distance between the pin hanging plate 8a and the lower mold base plate 5a in fig. 8) at the time of mold clamping caused by variations in the plate thickness of the workpiece W in the plurality of compression molding molds 1, variations in the amount of resin supplied to the cavity recessed portion 3a, and the like. Such a variation adjustment operation of the mold height is performed by each upper cavity unit 4 and each lower cavity unit 5 arranged in the lateral direction and provided at a plurality of places (two places in the present embodiment).

Further, since the adjustment mechanism 8 provided in the upper die holder 6 is provided for each die recess unit, the left and right die recess units are not limited to the case of the left half of fig. 8 (the case where the plate thickness of the workpiece W is small and the amount of supplied resin is less than the target amount of resin) and the right half of fig. 8 (the case where the plate thickness of the workpiece W is thick and the amount of supplied resin is greater than the target amount of resin), and may be reversed from left to right, and the adjustment can be performed without tilting the die even when the plate thickness of the workpiece W is thick on the left and the amount of supplied resin is small, and the plate thickness of the workpiece W is thin and the amount of supplied resin is large on the right. Thus, the total height of the plurality of dies can be kept constant at all times, and therefore, the thickness of the resin seal portion (package portion) can be compression molded with high accuracy without inclining the press surface.

As described above, even when there is a variation in the height in the die opening and closing direction of the upper die 2 and the lower die 3 due to a variation in the plate thickness of the plurality of workpieces W, a variation in the amount of resin supplied to the lower die cavity recess portions 3a, or the like, the variation in the die height at the time of die clamping of the upper die 2 and the lower die 3 can be adjusted for each workpiece W by the adjustment mechanism 8 provided for each upper concave groove cell 4 arranged in parallel on the upper die frame 6, and therefore, compression molding can be performed with high accuracy. In fig. 8, two upper cavity units 4 are arranged side by side in the lateral direction on the upper base portion 6a, and therefore two adjustment mechanisms 8 are also provided in the lateral direction in accordance with this arrangement, but the adjustment mechanism 8 may be interposed at least between one of the upper base portion 6a and the upper cavity unit 4. In this case, a spacer may be interposed in the other upper mold 2 instead of the adjustment mechanism 8. Further, when 3 or more upper cavity units 4 are provided in the upper mold frame 6, it is preferable that the adjusting mechanisms 8, which are 1 less than the number of cavity units, be independently mounted on the upper base portion 6 a. In this case, the height of the remaining upper cavity unit 4 provided with the adjusting mechanism 8 is adjusted in accordance with the height of the upper cavity unit 4 whose height is fixed. Further, a support block or the like for fixing the height may be provided between the upper die base part 6a on the fixing side and the upper cavity block 4.

In the case of replacing the mold in accordance with the type of the workpiece W, as shown in fig. 10A and 10B, the upper mold base side portion 6B is rotated by a predetermined amount so that the upper mold base side portion 6B is pushed down from the upper mold base portion 6a of the upper mold frame 6 on the near side with the hinge 6g on the deep side as the center in the state where the compression molding mold 1 is opened. At this time, as shown in fig. 10A, each upper groove unit 4 is held in a state where both left and right end portions of the support plate 4b are fitted into the stepped portion 6f formed by the upper guide 6d and the upper groove guide 6e hanging from the upper base portion 6 a. In this state, as shown in fig. 10B, each upper groove unit 4 can be pulled out to the near side with the step portion 6f as a guide, and can be replaced with another upper groove unit 4. Fig. 9 shows the upper cavity unit 4 taken out from the upper die carrier 6.

In a state where the compression molding die 1 is opened, as shown in fig. 10A and 10B, the lower die base side portion 7B is rotated by a predetermined amount from the lower die base portion 7a of the lower die frame 7 so that the lower die base side portion 7B is pushed up from the near side centering on the hinge 7g on the far side. At this time, as shown in fig. 10A, each lower die groove unit 5 is held in a state where stepped portions 5m at both left and right end portions of a lower die groove plate 5j are fitted to stepped portions 7f formed by a lower die guide 7d and a lower die groove guide 7e standing on a lower die base portion 7a in an uneven manner. In this state, as shown in fig. 10B, each lower groove unit 5 can be pulled out to the near side with the step portion 7f as a guide, and replaced with another lower groove unit 5. Fig. 9 shows the lower mold chase unit 5 taken out of the lower mold frame 7.

In this way, when the mold is replaced, the upper mold frame 6, the adjustment mechanism 8, and the lower mold frame 7 can be used without replacement, and therefore, the versatility is high, and the replacement adjustment and maintenance can be performed quickly. Further, in the upper die frame 6 and the lower die frame 7, the upper die base portion 6a and the upper die base side portion 6b are rotatably connected by the hinge 6g on the depth side, and the lower die base portion 7a and the lower die base side portion 7b are rotatably connected by the hinge 7g on the depth side, so that the upper die pocket unit 4 and the lower die pocket unit 5 can be easily pulled out from the near side of the die, and the replacement work can be easily performed.

[ second embodiment ]

Fig. 11A and 11B show another configuration example of the compression molding die 1. The same members as those of the compression molding die 1 disclosed in the first embodiment are given the same reference numerals and described, and the following description will focus on different configurations.

When a plurality of semiconductor chips are mounted on the workpiece W, for example, when a defect occurs in the chip mounting portion, a defective portion of the semiconductor chip may be generated in the workpiece W. In this case, the number of defects of the semiconductor chips may be accurately measured for each workpiece W and the amount of resin supplied may be changed, but this requires time and labor, and the resin needs to be supplied by precise metering. Therefore, in order to enable adjustment on the mold side even when the supply amount of the molding resin does not have to be accurately made uniform, an overflow chamber described later is provided in the present embodiment.

As shown in fig. 11A, a stepped surface 5d1 having a high height of a cavity bottom is provided around the outer peripheral edge portion on the upper surface side of a lower cavity block 5d provided in each lower cavity unit 5, and a plurality of overflow cavities 10 are provided on a stepped surface 5d 1. The overflow chamber 10 accommodates the remaining portion (variation in the amount of absorbed resin) of the molding resin supplied to the lower mold chamber recess 3 a. Therefore, the resin needs to be supplied to the lower cavity recess 3a in an amount larger than the amount of resin necessary for the thickness of the final package portion by the amount of resin flowing out of the receiving capacity of the overflow cavity.

As shown in fig. 11A, a plurality of through holes 5d2 are provided in the step portion 5d1 of the lower cavity block 5 d. The slider 10a is inserted into each through hole 5d2 so as to be able to move up and down. Each slider 10a is supported upright on the upper surface of a connecting plate 10b arranged in a horizontal posture between the lower mold base plate 5a and the support plate 5 c. Each slider 10a is inserted into the through hole 5d2 of the lower cavity block 5d through the support plate 5 c. Coil springs 10c are provided between the coupling plate 10b and the lower base plate 5a, and the sliders 10a are biased and supported upward through the coupling plate 10 b. As shown in fig. 11B, the overflow chamber 10 is formed by the upper end surface of each slider 10a and the hole wall surface of the through hole 5d 2. The slider 10a may have a block shape or an elongated pin shape. The upper end surface (flat surface) of each overflow chamber 10 may have a rectangular shape or another shape such as a circular shape.

The pressing pin 10d is provided on the lower surface of the connecting plate 10b so as to protrude vertically downward. The press pin 10d may be supported by a mold opening and closing mechanism (e.g., a movable platen) not shown through the lower mold base plate 5a and the lower mold frame 7 (lower mold base 7 a). Further, for example, a pressure sensor (load sensor or the like) may be provided at a lower end portion of the pressing pin 10 d. Thus, the pressure of the resin flowing into the mold closing chamber 10 is immediately measured in real time by the pressure sensor, whereby the resin pressure of the molding resin can be controlled in real time. The pressing pin 10d is not essential and may be omitted.

As shown in fig. 11A, a stopper 5i may be provided so as to protrude below a flange portion 5h of a pressing pin 5f supporting a lower mold movable jig 5 e. The stopper 5i can prevent the downward movement by the lower end of the stopper 5i abutting against the base plate 5a when the lower die movable jig 5e is depressed by the upper die 2. The stopper 5i is provided to define a limit position of the downward movement of the lower mold movable jig 5 e. Thus, the height of the lower mold cavity recess 3a is determined, and therefore the thickness of each sealing portion (resin sealing portion) of the compression molding can be controlled to be constant at a plurality of places.

Here, the behavior of the slider 10a in the compression molding operation will be described with reference to fig. 11A. The semiconductor chips should be all mounted on the workpiece W, and when a defect or the like is found in the semiconductor chips themselves in the preceding step, some of the semiconductor chips may not be mounted on the workpiece. That is, a semiconductor chip may be partially defective. When the work W is chipped or chipped, or a part of the resin drops during the resin transfer or the amount of the molding resin supplied to the lower cavity recess 3a is smaller than the target amount of resin due to some reason, when the compression molding die 1 is closed, the sliders 10a inserted into the through holes 5d2 of the lower cavity block 5d so as to penetrate the support plate 5c are compression molded in a state where the sliders 5d1 enter the lower cavity recess 3a from the step portion 5d1 by the biasing force of the coil spring 10 c. Thereby absorbing a difference between the magnitude of the lower mold cavity volume and the resin amount of the supplied molding resin.

When the amount of the molding resin supplied to the lower cavity chamber concave portion 3a is larger than the target amount of the resin with respect to the work W, the slider 10a is pressed down against the biasing force of the coil spring 10c by the resin pressure, and compression molding is performed in a state where the excess resin is accommodated in the through hole 5d 2. Thereby, a difference between the size of the lower mold cavity volume and the resin amount of the molding resin is absorbed.

Further, since there is a possibility that the final package thickness is formed to be thin if the resin amount is too small, it is preferable that the resin amount is intentionally larger than the target resin amount from the beginning and adjusted by the amount of depression of each slider 10 a.

Therefore, even if the supply amount of the molding resin is not accurately measured in advance for each workpiece W, the compression molding can be performed with the thickness of the molded article kept constant. Further, since the concave and convex portions formed in the molded article are the outer peripheral edge portion of the workpiece W regardless of the final product, the molding quality is not affected. Since the slider 10a is constantly biased toward the mold resin in the cavity recess 3a, resin pressure is applied to the mold resin in the cavity recess 3a, and air holes can be eliminated to improve molding quality. The overflow chamber 10 is provided in the lower mold chamber block 5d, but may be provided on the clamping surface of the lower movable jig 5 e.

[ modified examples ]

Next, an example of deformation use corresponding to the workpiece W of the compression molding die 1 of fig. 1 will be described with reference to fig. 12 to 15A and 15B. The compression molding die 1 of fig. 1 exemplifies a case where two rectangular strip-shaped substrates of, for example, 300mm × 100mm as the workpieces W are simultaneously compression molded, but compression molding can be performed using workpieces W larger in size one by one.

Fig. 12 is a sectional explanatory view of a compression mold in a case where a large-sized workpiece is compression-molded as viewed from the front, and fig. 13 is a sectional explanatory view of a compression mold in a case where a large-sized workpiece is compression-molded as viewed from the side. An embodiment is shown in which, from the structure of the upper die 2 shown in fig. 1, the upper die guide 6d and the upper die groove guide 6e provided at the middle portion of the upper die frame 6 are removed, and the upper die groove unit 4 is replaced with a member for a larger-sized workpiece W. Further, an embodiment is shown in which, from the structure of the lower die 3 shown in fig. 1, the lower die guide 7d and the lower die groove guide 7e provided at the middle portion of the lower die frame 7 are removed, and the lower die groove unit 5 is replaced with a member for a larger-sized workpiece W. In this case, the upper die frame 6, the adjustment mechanism 8, and the lower die frame 7 can be shared.

In the case of fig. 12, since the pressing plate 8d is divided and two adjusting mechanisms 8 are provided, even in the case where the left and right thicknesses of the work W themselves are slightly different, or in the case where the amount of the resin supplied to the lower cavity chamber concave portion 3a is slightly different in the left and right supply, the die height can be adjusted by the adjusting mechanisms 8, as compared with the case where the pressing plate 8d is integrally configured as shown in fig. 13.

Fig. 14A is a plan view of the upper die 2 in the case of compression-molding a large rectangular plate of, for example, 300mm × 300mm as a workpiece W, and fig. 14B is a plan view of the lower die 3 in the case of compression-molding a large rectangular plate of, for example, 300mm × 300mm as a workpiece W. In fig. 14A, in the upper die 2, the same number (for example, 3) of chuck claws 4d are provided on the four sides of the workpiece W sucked to the upper die plate 4c, respectively. The upper guide 6d and the upper groove guide 6e are provided only at the left and right ends of the upper die frame 6. Upper die adjustment pins 4k are provided to protrude from a plurality of positions (for example, 4 positions on each side) in the outer peripheral edge portion of the upper die plate 4 c. In addition, illustration of the plurality of suction holes 2b formed in the workpiece W of the workpiece holding portion 2a is omitted.

In fig. 14B, in the lower mold movable jig 5e of the lower mold 3, the escape grooves 5e1 are provided in the periphery of the lower mold cavity recess 3a by the same number (for example, 3 places) corresponding to the chuck claws 4d of the upper mold 2. The lower mold guide 7d and the lower mold groove guide 7e are provided only at both left and right ends of the lower mold frame 7. The lower die adjustment pins 5p are provided to protrude from the outer peripheral edge of the lower die movable jig 5e at positions opposite to the upper die adjustment pins 4k (for example, 4 positions on each side). In addition, illustration of the plurality of suction holes 5e5, the peripheral groove 5e2, and the suction holes 5e3 provided in the groove bottom portion of the film suction groove 5e4 provided circumferentially in the lower mold movable jig 5e is omitted.

FIG. 15A shows the diameter of the workpiece W

The top view of the upper die 2 in the case of compression molding of the semiconductor wafer, the circular carrier, and the substrate, and fig. 15B is a plan view of the workpiece W, which is, for example, a diameter

A top view of the lower die 3 in the case of compression molding the semiconductor wafer, the circular carrier, and the substrate. In fig. 15A, in the upper die 2, chuck claws 4d are provided at equal intervals (for example, at 4 positions shifted in phase by 90 degrees) around the workpiece W sucked on the upper die plate 4 c. The upper guide 6d and the upper groove guide 6e are provided only at the left and right ends of the upper die frame 6. Upper die adjustment pins 4k are provided to protrude from a plurality of positions (for example, 4 positions on each side) in the outer peripheral edge portion of the upper die plate 4 c. In addition, illustration of the plurality of suction holes 2b formed in the workpiece W of the workpiece holding portion 2a is omitted.

In fig. 15B, in the lower mold movable jig 5e of the lower mold 3, the escape grooves 5e1 are provided at equal intervals (for example, 4 positions shifted in phase by 90 degrees) around the lower mold cavity recess 3a so as to correspond to the chuck claws 4d of the upper mold 2. The lower mold guide 7d and the lower mold groove guide 7e are provided only at both left and right ends of the lower mold frame 7. The lower die adjustment pins 5p are provided to protrude from the outer peripheral edge of the lower die movable jig 5e at positions opposite to the upper die adjustment pins 4k (for example, 4 positions on each side). In addition, illustration of the plurality of suction holes 5e5, the peripheral groove 5e2, and the suction holes 5e3 provided in the groove bottom portion of the film suction groove 5e4 provided circumferentially in the lower mold movable jig 5e is omitted. The workpiece W may be a circular carrier or substrate such as eWLB formed by die bonding a plurality of semiconductor chips T, in addition to a circular semiconductor wafer.

As shown in fig. 14A and 14B, and fig. 15A and 15B, the compression molding die 1 may include: an upper die 2 having a workpiece holding portion 2a for holding one workpiece W; and a lower die 3 having a lower die cavity recess 3a formed by a jig 5e and a cavity block 5d, the lower die cavity recess 3a being disposed opposite to the workpiece holding portion 2a, the jig 5e being for clamping the workpiece W, the cavity block 5d being inserted into the jig 5e and being capable of pressurizing the resin by relative movement, the upper die 2 having an adjustment mechanism 8 (not shown) for adjusting a deviation in a thickness direction at the time of die clamping. In this case, even for example, even if the large-sized workpieces W are not necessarily arranged side by side in the lateral direction, it is possible to perform compression molding with high accuracy by adjusting the variation in the die height corresponding to the large-sized workpieces W at the time of die clamping using the upper die 2 having the adjustment mechanism 8.

Fig. 16 is a diagram of the compression molding die 1 shown in fig. 1, in which the form of the chamber block 5d and the support plate 5c of the lower die pocket unit 5 are changed. That is, the support plate 5c is provided not to support the lower cavity block 5d but to support the lower movable jig 5e and the lower recessed plate 5 j. The lower cavity block 5d is directly supported by the plurality of support columns 5b, and the plurality of support columns 5b are formed upright on the lower base plate 5 a. In addition, illustration of the plurality of suction holes 5e5, the peripheral groove 5e2, and the suction holes 5e3 provided in the groove bottom portion of the film suction groove 5e4 provided circumferentially in the lower mold movable jig 5e is omitted.

In this case, since the plate thickness of the lower cavity block 5d can be made thick and the portion directly below the lower cavity block 5d can be supported by the support column 5b, the lower cavity block is less likely to be affected by warpage and the like, and therefore, the height adjustment by the support column 5b can be performed with higher accuracy.

In the left half of fig. 17, the lower mold holder 5e is supported by the support plate 5c and the lower cavity block 5d is connected to the drive mechanism 11 so as to be directly liftable, unlike the lower movable holder 5e of the lower cavity unit 5 in the compression molding die 1 shown in fig. 1. The drive mechanism 11 may be the servomotor 11a and the power transmission portion 11b, or may be a hydraulic actuator. In this case, the volume of lower mold cavity recess 3a can be controlled with high accuracy, and resin pressure can be easily applied to the molding resin supplied to lower mold cavity recess 3 a.

In the right half of fig. 17, the lower end of the pressing pin 5f is supported by the movable connecting plate 12, and the lower mold movable jig 5e is supported by the upper end of the pressing pin 5 f. The movable coupling plate 12 is provided in a horizontal posture by cutting the lower mold base plate 5 a. The movable connecting plate 12 is connected to the driving mechanism 13 so as to be directly movable up and down. The drive mechanism 13 may be the servomotor 13a and the power transmission portion 13b, or may be a hydraulic actuator. In addition, illustration of the plurality of suction holes 5e5, the peripheral groove 5e2, the suction holes 5e3, and the like provided in the groove bottom portion of the film suction groove 5e4 provided circumferentially in the lower mold movable jig 5e is omitted.

Thus, a conventional transfer drive mechanism (plunger drive mechanism) for transfer forming press of two workpieces can be used as the drive mechanism of the lower mold movable jig 5 e.

Fig. 18 illustrates a case where the compression molding die 1 can be used to compression-mold not only a single large-sized workpiece W such as the rectangular plate member shown in fig. 14A and 14B, or the circular semiconductor wafer shown in fig. 15A and 15B, but also 1 strip-shaped substrate.

Fig. 19 shows a compression molding die 1 for 3 strip-shaped substrates instead of the compression molding die 1 for 2 strip-shaped substrates shown in fig. 1. The following is illustrated: the mold structure is the same as that of fig. 1, and the number of mold groove units (upper mold groove units 4 and lower mold groove units 5) that can be inserted into and removed from the common mold frame (upper mold frame 6 and lower mold frame 7) is 3 sets. In addition, 4 or more sets of the die-cavity units may be provided.

Fig. 20A and 20B show another configuration of the adjustment mechanism 8. In fig. 1, a spring mechanism using a coil spring 8e is provided as the adjusting mechanism 8, but the wedge mechanism 14 may be used. In fig. 20A and 20B, between the upper mold base portion 6a of the upper mold frame 6 and the upper cavity plate 4a of the upper cavity unit 4, the movable slide plate 14a and the wedge plate 14B are stacked with the slope surfaces 14c overlapping each other. The wedge plate 14b is assembled to the upper cavity plate 4a in a stacked manner with the height adjustment plate 14d interposed therebetween.

As shown in fig. 20B, a screw shaft 14e and a servomotor 14f are attached to the side portion on the depth side of the rectangular frame-shaped upper mold base side portion 6B. The threaded shaft 14e is screwed to a nut provided on the movable slide plate 14 a. The movable slide plate 14a is moved in the horizontal direction along the upper die base portion 6a by driving the servomotor 14f to rotate by a predetermined amount in a predetermined direction. At this time, the height position of the upper cavity block 4 is adjusted by the wedge plate 14b laminated via the slope surface 14 c. That is, as shown in fig. 20A, the gap in the die opening and closing direction of the step portion 6f locked by the support block 4b of the concave-upper-die unit 4 may absorb the difference in the plate thickness of the workpiece W.

Fig. 21 is a plan view showing an example of a resin molding apparatus in which any of the compression molding dies 1 described above is mounted. The workpiece W is a rectangular substrate of 100mm × 300mm, and the molding resin may be any of a tablet resin (solid resin), a sheet resin, a granular resin, a powder resin, and a liquid resin, and the granular resin may be used as an example. The press portion 15 on which the compression molding die 1 is mounted is provided at 3. For each 1 press portion 15, a total of 6 workpieces W can be compression-molded by 1 press operation. In addition, when the time for supply, forming by pressing, storage, and the like is taken into consideration, the respective presses may be formed in sequence when the number of presses is large in order to improve productivity.

A workpiece supply and storage unit 16 is provided on the left end side of the 3 press portions 15 arranged in parallel, and the workpiece supply and storage unit 16 is used to supply the workpiece W and is stored in a magazine after forming. The work conveying mechanism 17 reciprocates between the work supply and storage portion 16 and the press portion 15, and performs an operation of taking out the work W after forming and the work W before supply and forming when moving forward and backward with respect to the open compression molding die 1. The work loading portion 17 that enters the press portion 15 receives the formed work W (formed product) in a pair of two pieces, and delivers the work W before forming to the compression forming die 1 (the work holding portion 2a of the upper die 2: see fig. 1) in a pair of two pieces.

A film resin supply portion 18 is provided on the right end side of the punching portion 15. The film resin supply unit 18 supplies and cuts the respective films in correspondence with the respective strip-shaped substrates, thereby forming the individual films 9. The target resin amount is calculated based on the result sensed by the work supply/storage unit 16, and for example, the particulate resin is spread flatly on the single film 9 in a shape substantially equal to the size of the chamber in a plan view. Then, the resin and the single-sheet film 9 are conveyed from the film resin supply unit 18 to the punching unit 15 by the resin conveying mechanism 19, and only the molded single-sheet film 9 is collected.

In the resin molding apparatus, in each press portion 15, a plurality of (for example, a set of two) strip-shaped substrates, and a single film 9 and a resin for each substrate are supplied to the die groove units arranged in parallel, so that compression molding can be performed separately while absorbing variations in the plate thickness and variations in the amount of resin of the workpiece W, and productivity and handling properties are improved. The number of the pressed portions 15 is not limited to three, and may be more or less than three.

For example, the compression molding apparatus may be one in which either the upper mold 2 or the lower mold 3 is movable and the other is fixed, or both may be movable. Various driving mechanisms such as a servo motor and a screw shaft, a servo motor and a toggle lever, or a hydraulic driving mechanism can be used as the mold opening and closing mechanism for opening and closing the compression molding mold 1.

Further, in the compression molding die 1, the cavity recess 3a is formed in the lower die 3 and the work holding portion 2a is formed in the upper die 2, but the work holding portion may be formed in the lower die 3 and the cavity recess may be formed in the upper die 2. In this case, the lower die frame 7 may be integrally provided with an adjusting mechanism 8, and a single film 9 may be sucked and held in the upper die groove unit 4. In this case, the mold resin is not supplied onto the single film 9, but is supplied onto the work W. Further, although this embodiment uses a single film 9, a long film may be used.

In addition, although this embodiment is an embodiment using a thin film, the thin film may not be used.

The compression molding die 1 is exemplified for one workpiece W or for two workpieces W, but may be molded for three or more workpieces W.

Other configurations of the compression molding apparatus will be described.

As shown in fig. 22, for example, a plurality of compression molding dies 1 for one workpiece W may be mounted in a row in the lateral direction and may be opened and closed by a common press drive mechanism 20 (die opening and closing mechanism). In fig. 22, a guide post 20b stands on each corner of a rectangular press base 20 a. The upper end of the guide column 20b is connected to the fixed platen 20c, and the movable platen 20d is slidably connected to the middle portion of the guide column 20 b. The movable platen 20d is configured to be movable up and down by a servo motor 21a and a power transmission unit 21b provided in the press base 20 a. The upper dies 2 are supported on the fixed platen 20c so as to be aligned in the lateral direction, and the lower dies 3 are supported on the movable platen 20d so as to be aligned in the lateral direction. An upper cavity unit constituting the upper mold 2 is provided with an adjusting mechanism 8 (not shown) similar to that of fig. 9.

Fig. 23 is a view showing another configuration of the compression molding apparatus. The compression molding die 1 for one workpiece W may be mounted in a stacked manner in multiple stages (two stages in the present embodiment) in the height direction, and may be opened and closed by a common press drive mechanism 20 (die opening and closing mechanism). In fig. 23, guide posts 20b are erected at respective corners of a rectangular press base 20 a. The upper end of the guide column 20b is connected to the fixed platen 20c, and the movable platen 20d and the intermediate platen 20e are slidably connected to the intermediate portion of the guide column 20 b. The movable platen 20d is configured to be movable up and down by a servo motor 21a and a power transmission unit 21b provided in the press base 20 a. The intermediate platen 20e is connected to be moved up and down by different strokes (for example, a movement ratio of 2: 1 between the movable platen 20d and the intermediate platen 20 e) via a rack and pinion mechanism (not shown) or the like which is interlocked with the movement of the movable platen 20 d.

The upper mold 2 is supported on the lower surfaces of the fixed platen 20c and the intermediate platen 20e, respectively, and the lower mold 3 is supported on the upper surfaces of the movable platen 20d and the intermediate platen 20e, respectively. The upper cavity units constituting the upper mold 2 are provided with the same adjustment mechanisms 8 (not shown) as those in fig. 9, respectively.

Accordingly, even with a single workpiece W such as a large-sized workpiece, for example, productivity can be improved by performing compression molding simultaneously for a plurality of workpieces, and variation in mold height at the time of mold clamping for each of the mold-pocket units arranged in parallel or in multiple stages can be absorbed by the adjustment mechanism 8, so that compression molding can be performed with high accuracy without inclining the mold.

Here, another example of the compression mold 1 will be described with reference to fig. 24 and 25. The compression molding dies 1 simultaneously perform compression molding while clamping a plurality of workpieces W arranged in parallel in the transverse direction. The same reference numerals are given to the same components as those of the first embodiment and the description is referred to.

Referring to fig. 24, the structure of the upper mold 2 (first mold) will be described. The figure schematically illustrates the minimum structure. An adjustment mechanism 8 (coil spring 8e) is provided for each of the plurality of works W in an upper die base portion 6a constituting a bottom portion of the upper die frame 6 (first base portion). The upper die plate 4c holding the workpiece W is suspended and supported in a lateral direction by the adjustment mechanism 8. The upper die plate 4c is formed with workpiece holding portions 2a for holding the workpieces W by suction. In the upper mold base portion 6a, the upper mold base side portion 6b (first base side portion), the upper mold guide 6d (first guide) partitioning the upper mold space portion 6c (first mold space portion), the suction mechanism, and the decompression mechanism are not illustrated, but these may be provided.

The structure of the lower mold 3 (second mold) will be described. A lower cavity block 5d is supported and fixed in a lateral direction on a lower die base part 7a constituting the bottom part of the lower die frame 7 (second base part), and the lower cavity block 5d is disposed to face the workpiece holding part 2 a. The lower die movable jig 5e for clamping the work W is supported by the coil spring 5g so as to be independently floating around the lower die chamber block 5d for each work. A lower cavity recess 3a is formed by the lower cavity block 5d and the lower movable jig 5 e. The lower cavity block 5d pressurizes the resin by being relatively moved while being inserted into the lower movable jig 5 e. The lower base side portion 7b (second base side portion), the lower guide 7d (second guide) that partitions the lower mold space portion 7c (second mold space portion), and the like may be provided upright on the lower base portion 7 a.

With the above configuration, when clamping a plurality of workpieces W by the upper die 2 and the lower die 3, the deviation in die height when clamping each workpiece W by the upper die plate 4c (the first upper die plate and the second upper die plate) and the lower die movable jig 5e, the upper die plate 4c having the workpiece holding portions 2a provided in a lateral direction on the upper die base portion 6a, and the lower die movable jig 5e having the lower die cavity recesses 3a (the first lower die cavity recess and the second lower die cavity recess) arranged to face the upper die plate 4c, is absorbed by the adjustment mechanism 8 and the coil spring 5g, and thus clamping can be performed without tilting the die.

Fig. 25 is a view showing still another example of the compression molding die 1. The compression molding dies 1 simultaneously perform compression molding while clamping a plurality of workpieces W arranged in parallel in the transverse direction. The same reference numerals are given to the same components as those of the first embodiment and the description is referred to.

Referring to fig. 25, the structure of the upper mold 2 (first mold) will be described. The figure schematically illustrates the minimum structure. An upper die plate 4c (a first upper die plate and a second upper die plate) is supported in a horizontal line on an upper die base part 6a (a first base part) constituting a bottom part of an upper die frame 6 (a first die frame), and the upper die plate 4c holds a plurality of workpieces W independently. The upper die plate 4c is formed with workpiece holding portions 2a for holding the workpieces W by suction. In the upper mold base portion 6a, the upper mold base side portion 6b (first base side portion), the upper mold guide 6d (first guide) partitioning the upper mold space portion 6c (first mold space portion), the suction mechanism, and the decompression mechanism are not illustrated, but these may be provided.

The structure of the lower die 3 will be described. A lower mold cavity recess portion 3a (a first lower cavity recess portion and a second lower cavity recess portion) is supported in a lateral direction in a lower mold base portion 7a (a second base portion) constituting a bottom portion of a lower mold base 7 (a second mold base), the lower mold cavity recess portion 3a is formed by a lower mold movable jig 5e and a lower mold cavity block 5d, the lower mold movable jig 5e is disposed so as to face the work holding portion 2a and clamps the work W, and the lower mold cavity block 5d pressurizes the resin by moving relatively in a state of being inserted into the lower mold movable jig 5 e.

Specifically, the lower die chamber block 5d is supported and fixed to a lower die plate 5r (die plate) independently for each workpiece W. The lower die movable jig 5e is supported by the lower die plate 5r independently for each workpiece W via a coil spring 5 g. An adjustment mechanism 8 (coil spring 8e) independent for each workpiece W is provided between the lower die plate 5r and the lower die base portion 7 a.

In the lower die base portion 7a, the lower die base side portion 7b (second base side portion), the lower die guide 7d (second guide) that partitions the lower die space portion 7c (second die space portion), and the like are not illustrated, but these may be provided.

Thus, when a plurality of workpieces W are clamped by the upper die 2 and the lower die 3, respectively, the upper die 2 having the upper die plate 4c having the workpiece holding portion 2a arranged in the upper die base portion 6a in the lateral direction and the lower die 3 having the lower die cavity recess portion 3a arranged in the lower die base portion 7a in the lateral direction so as to face the workpiece holding portion 2a, the deviation in die height is absorbed for each workpiece W by the coil spring 5g of the lower die movable jig 5e and the adjustment mechanism 8 provided between the lower die plate 5r and the lower die base portion 7a, and therefore, clamping can be performed without inclining the die.

Claims (13)

1. A compression molding die for simultaneously compression molding a plurality of workpieces by clamping the workpieces arranged in parallel in a transverse direction,

the compression molding die comprises:

a first die in which first groove units having work holding portions for holding the plurality of works are arranged in parallel in a lateral direction on a first die frame, the first groove units being suspended and supported by coil springs, respectively; and

a second die for forming a plurality of cavity recesses arranged opposite to the work holding portion by a jig for clamping the work and arranged independently for each work, and a cavity block for pressurizing a resin by relatively moving the cavity block while being inserted into the jig,

the first mold includes an adjusting mechanism for adjusting a variation in mold height when clamping the molds of the plurality of first cavity units arranged in parallel on the first mold frame.

2. The mold for compression molding according to claim 1,

the second die is provided with second groove units having the cavity recesses arranged in parallel in a transverse direction on a second die frame, and each second groove unit is supported by the second die frame in such a manner that a cavity block forming a bottom of the cavity recess and the jig forming a side portion of the cavity recess around the cavity block can move relative to each other.

3. The mold for compression molding according to claim 2,

a film covering the lower die clamping surface including the cavity recess can be suction-held by each of the second groove units.

4. The mold for compression molding according to claim 2 or 3,

the first die carrier is an upper die carrier,

the first recess unit has a plurality of upper recess units detachably assembled to the upper die frame via an adjustment mechanism, the upper recess units having a work holding portion on an upper clamping surface,

the second mold frame is a lower mold frame which is arranged opposite to the upper mold frame,

the second groove unit includes a plurality of lower die groove units that are removably assembled to the lower die frame, and the lower die groove units form lower die cavity recesses by lower die cavity blocks disposed to face the workpiece holding portion and jigs supported to be movable relative to each other so as to surround the lower die cavity blocks.

5. The mold for compression molding according to claim 4,

a pair of upper cavity units which are arranged in the horizontal direction and are detachably supported by the upper die frame through the adjusting mechanism,

the upper cavity unit includes a first upper die plate and a second upper die plate which are assembled to the adjustment mechanism in an overlapping manner and each of which has a workpiece holding portion,

a pair of lower die groove units arranged in a transverse direction opposite to the pair of upper die groove units and detachably provided to the lower die frame,

the lower die cavity unit includes a first lower cavity recess formed by the lower cavity block disposed opposite the first upper die plate and a relatively movably supported jig surrounding the lower cavity block, and a second lower cavity recess formed by the lower cavity block disposed opposite the second upper die plate and a relatively movably supported jig surrounding the lower cavity block.

6. A compression molding die having a plurality of dies arranged in a transverse direction and mounted thereon for compression molding a resin by clamping a single workpiece, the compression molding die being opened and closed by a common die opening and closing mechanism,

the compression molding die comprises:

a first die having a workpiece holding portion for holding the workpiece; and

a second die for forming a cavity concave portion arranged opposite to the work holding portion by a jig for clamping the work and a cavity block inserted into the jig and pressurizing a resin by a relative movement,

a first cavity unit of the first mold having the work holding portion in a first mold frame is suspended and supported by a coil spring, the first mold has an adjusting mechanism for adjusting a variation in mold height when the first cavity unit disposed in the first mold frame is clamped,

the second mold is provided with a second groove unit having the cavity recess at a second mold frame, and the second groove unit is supported by the second mold frame via a coil spring in such a manner that a cavity block forming a bottom of the cavity recess and the jig forming a side portion of the cavity recess around the cavity block can move relatively.

7. A compression molding die for simultaneously compression molding a plurality of workpieces by clamping the workpieces arranged in parallel in a transverse direction,

the compression molding die comprises:

a first die having a first base part and a workpiece holding part arranged in a lateral direction and supporting the workpiece holding part; and

a second die which is disposed on a second base section of the second die frame so as to support cavity recesses arranged in a lateral direction, the cavity recesses being disposed so as to face the workpiece holding section and formed by a jig for clamping the workpiece and a cavity block which pressurizes the resin by moving relative to the jig while being inserted into the jig,

the first die has a first die base part on which first pocket units are arranged in parallel, each of the first pocket units having the work holding part and being arranged in a lateral direction, and an adjustment mechanism for adjusting a variation in die height when clamping the die, the adjustment mechanism being provided for each of the first pocket units arranged in parallel on the first die base part,

in the second die, the cavity block is supported and fixed to a die plate independently for each workpiece, the jig is supported by the die plate independently for each workpiece, and an adjustment mechanism for adjusting the height is provided independently for each workpiece between the die plate and the second base portion.

8. A compression molding apparatus comprising the compression molding die according to claim 1, 6 or 7.

9. A die carrier to be applied to the compression molding die according to claim 1, 6 or 7, wherein a pair of die carriers detachably support a plurality of die cavity units arranged in parallel, individually or in a lateral direction,

the mold frame comprises:

a first groove guide provided on the side of the mold opening/closing surface of the first guide block adjacent to the first guide block, the first guide block being provided to hang down from the first mold frame; and

a second groove guide provided on the side of the open/close die surface of the second guide block adjacent to the second guide block provided upright from the second die frame,

the first guide block and the first groove guide are used for respectively forming the step parts for plugging and unplugging the first groove unit of the mould groove unit on two sides, the second guide block and the second groove guide are used for respectively forming the step parts for plugging and unplugging the second groove unit of the mould groove unit on two sides,

an adjusting mechanism is provided integrally with the base part of any one of the die holders, and the adjusting mechanism can absorb the variation of the die height at the time of die clamping caused by the total variation of the plate thickness of the workpiece clamped by each die recess unit, the resin amount of the molding resin, and the film thickness covering the clamping surface.

10. The scaffold of claim 9, wherein,

a frame-shaped first base side part vertically arranged from the first base part and a frame-shaped second base side part vertically arranged from the second base part are arranged oppositely,

a first guide block for partitioning a first mold space surrounded by the first base side portion and a second guide block for partitioning a second mold space surrounded by the second base side portion are arranged to face each other.

11. The scaffold of claim 10,

the first base side portion is rotatably connected to the first base portion at a deep side in a first pocket unit insertion/extraction direction by a hinge, and the second base side portion is rotatably connected to the second base portion at a deep side in a second pocket unit insertion/extraction direction by a hinge.

12. The scaffold of claim 9, wherein,

the adjusting mechanism has a spring unit that applies a force to the first recess plate with respect to the first die frame in the die opening and closing direction or applies a force to the second recess plate with respect to the second die frame in the die opening and closing direction.

13. The scaffold of claim 9, wherein,

the adjusting mechanism is provided with sliding plates with mutually overlapped slope surfaces in a sliding mode between the first die carrier and the first groove plate and between the second die carrier or the second groove plate.

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