JP2012009721A - Electronic apparatus - Google Patents

Abstract

An electronic device having high heat dissipation efficiency and high design freedom is provided.
An electronic apparatus according to the present invention includes a housing 1 and a substrate 21 accommodated in the housing 1, and a heating element 4 is mounted on a surface 21a of the substrate 21. Here, a flow path 50 having an inlet 501 and an outlet 502 is formed inside the housing 1 along the surface 21 a of the substrate 21, and the air in the flow path 50 is allowed to flow into the inlet 501 of the flow path 50. The air blowing mechanism 6 is provided to flow from the outlet toward the outlet 502. The flow path 50 extends on the surface 21a of the substrate 21 through the mounting area of the heating element 4, and the heating element 4 mounted in the mounting area is exposed in the flow path 50.
[Selection] Figure 2

Description

  The present invention relates to an electronic device in which a heating element such as an electronic device is mounted on a substrate.

  Conventionally, in order to prevent the temperature of the heating element from rising, the board is housed in a casing made of a metal such as aluminum, and the casing and the heating element are thermally connected to each other by a heat conducting member. Has been proposed to function as a heat radiating member that releases heat from the heating element to the outside (see, for example, Patent Document 1).

  In order to prevent the temperature of the heating element from rising, a ventilation mechanism such as a fan is provided in the casing, and the air in the casing is circulated by the ventilation mechanism to dissipate heat from the heating element to the outside of the casing. (For example, refer to Patent Document 2).

JP 2009-212236 A JP 2007-48930 A

  However, in the conventional electronic device (for example, refer to Patent Document 1) in which the casing functions as a heat dissipation member, the material constituting the casing is limited to a material having high thermal conductivity. Further, the heating element has to be disposed at a position where it can be connected to the housing via the heat conducting member. For this reason, the conventional electronic device has a problem of low design freedom.

  Further, in a conventional electronic device (for example, see Patent Document 2) in which a blower mechanism is provided in a housing, a viscous resistance is generated between the surface of the substrate and air. Further, irregularities are formed on the surface of the substrate through which air flows by a plurality of electronic devices mounted on the surface. Therefore, turbulence and vortices are generated in the air flowing on the surface of the substrate, and the air is diffused. For this reason, the air cannot be efficiently guided to the heating element. Therefore, it has been difficult to obtain high heat dissipation efficiency with conventional electronic devices. In particular, in an electronic device in which a plurality of substrates are arranged in parallel in a housing, since the gap between adjacent substrates is narrow, turbulence and vortices are likely to occur in the gap, and as a result, the heat dissipation efficiency is remarkably high. Will be reduced.

  Therefore, an object of the present invention is to provide an electronic device having high heat dissipation efficiency and high design freedom.

  An electronic device according to the present invention includes a housing and a substrate housed in the housing, and a heating element is mounted on the surface of the substrate. Here, a flow path having an inlet and an outlet is formed inside the housing along the surface of the substrate, and the air flowing in the flow path from the inlet to the outlet of the flow path A mechanism is provided, and the flow path extends on the surface of the substrate through a heating element mounting area, and the heating element mounted in the mounting area is exposed in the flow path.

  In the electronic device, air flows from the inlet to the outlet of the flow path along the flow path. For this reason, even when turbulent flow or vortex occurs in the air flowing in the flow path due to the electronic device mounted on the surface of the substrate or the viscous resistance between the surface of the substrate and the air, The air will flow along the flow path with little diffusion. Here, the flow path extends on the surface of the substrate through the heating element mounting area, and the heating element mounted in the mounting area is exposed in the flow path. Therefore, the air in the flow path is efficiently guided to the heating element. Therefore, according to the said electronic device, the heat | fever from a heat generating body can be collect | recovered efficiently, and it can discharge | release to the exterior of a housing | casing, As a result, high heat dissipation efficiency can be obtained.

  In the electronic device, the shape of the flow path extending along the surface of the substrate can be designed according to the position of the heating element mounting region. Therefore, it is possible to set the mounting area of the heating element at various positions on the surface of the substrate and efficiently recover the heat from the heating element mounted in the mounting area. Therefore, the electronic device has a high degree of design freedom with respect to the formation of the flow path.

  In the specific configuration of the electronic device, a heating element is mounted at a plurality of locations on the surface of the substrate, and the flow path extends on the surface of the substrate through a plurality of mounting regions of the heating element. Yes.

  According to the specific configuration, despite the simple configuration, heat from a plurality of heating elements mounted on the surface of the substrate can be efficiently released to the outside of the housing.

  In another specific configuration of the electronic device, a flow path forming portion that forms the flow path is disposed inside the housing, and the flow path forming portion is arranged along the surface of the substrate with the surface. A first wall portion extending substantially in parallel, and a pair of second wall portions that are respectively connected to both side edges of the first wall portion and extend from the side edges toward the surface of the substrate; While a gap is formed between the leading edge of each second wall portion and the surface of the substrate, the flow path forming portion and / or the substrate is provided with a closing member that closes the gap.

  According to the specific configuration, the air in the flow path is prevented from leaking from the gap between the flow path forming portion and the substrate by the blocking member. Therefore, the air in the flow path efficiently flows from the inlet to the outlet of the flow path. Therefore, higher heat dissipation efficiency can be obtained in the electronic device.

  In the more specific configuration of the electronic device, the flow path forming portion is at least partially made of metal, and the substrate has a ground portion, and the metal portion of the flow path forming portion. Is electrically connected to the ground portion of the substrate, whereby a shield for removing radiation noise is constituted by the metal portion of the flow path forming portion.

  According to the specific configuration, at least a part of the radiation noise (electromagnetic wave) trying to pass through the flow path forming portion is blocked by the metal portion (shield) of the flow path forming portion. Therefore, radiation noise from the heating element mounted on the surface of the substrate is difficult to propagate to other electronic devices, and radiation noise from other electronic devices is difficult to propagate to the heating element. Therefore, it is difficult for abnormalities to occur in the operation of the heating element and other electronic devices.

  Another electronic device according to the present invention includes a housing and a substrate accommodated in the housing, and a heating element is mounted on the surface of the substrate, while the heating element is mounted on the back surface of the substrate. A thermally connected heat dissipating member is installed. Here, a flow path having an inlet and an outlet is formed inside the housing along the back surface of the substrate, and the air flowing in the flow path from the inlet to the outlet of the flow path A mechanism is provided, and the flow path extends on the back surface of the substrate through an installation area of the heat dissipation member, and the heat dissipation member installed in the installation area is exposed in the flow path.

  In the electronic device, air flows from the inlet to the outlet of the flow path along the flow path. For this reason, even when turbulence or vortex occurs in the air flowing in the flow path due to the electronic device mounted on the back surface of the substrate or the viscous resistance between the back surface of the substrate and the air, The air will flow along the flow path with little diffusion. Here, the flow path extends on the back surface of the substrate through the installation area of the heat dissipation member, and the heat dissipation member installed in the installation area is exposed in the flow path. Therefore, the air in the flow path is efficiently guided to the heat radiating member. Therefore, according to the electronic device, the heat propagated from the heating element to the heat radiating member can be efficiently recovered and released to the outside of the housing, and as a result, high heat radiating efficiency can be obtained.

  Moreover, in the said electronic device, the shape of the flow path extended along the back surface of a board | substrate can be designed according to the position of the installation area | region of a heat radiating member. Therefore, it is possible to set the installation area of the heat dissipation member at various positions on the back surface of the substrate, and to efficiently recover the heat from the heat dissipation member installed in the installation area. Therefore, the electronic device has a high degree of design freedom with respect to the formation of the flow path.

  In still another specific configuration of the electronic apparatus, the casing is provided with a first heat radiating portion and a second heat radiating portion that recover heat in the casing and release the heat to the outside of the casing. The flow path extends from a position near the first heat radiating portion to a position near the second heat radiating portion.

  In the specific configuration, the air in the housing is cooled by the first heat radiating section, and the cooled air flows into the flow path from the inlet of the flow path. Therefore, heat is more efficiently recovered from the heating element or the heat radiating member. On the other hand, the air heated by collecting heat from the heating element or the heat radiating member flows out from the outlet of the flow path and then flows into the second heat radiating portion. And heat is efficiently collect | recovered from air by the 2nd thermal radiation part, and this heat is discharge | released to the exterior of a housing | casing. Therefore, according to the specific configuration, higher heat dissipation efficiency can be obtained.

  In the electronic device, an air inlet and an air outlet may be provided in the housing, and the inlet of the flow path may be directed to the air inlet, while the outlet of the flow path may be directed to the exhaust port. As a result, cold air is sucked from the intake port, and the cold air flows in the flow channel from the inlet to the outlet of the flow channel, while air warmed in the flow channel is discharged from the exhaust port. become. Therefore, according to the specific configuration, the heat from the heating element or the heat radiating member can be recovered more efficiently, and the heat can be released from the exhaust port to the outside of the housing, resulting in higher heat dissipation efficiency. Will be obtained.

  The electronic device according to the present invention has high heat dissipation efficiency and high design freedom.

FIG. 1 is a vertical sectional view of an electronic apparatus according to an embodiment of the present invention. 2 is a cross-sectional view taken along line AA shown in FIG. 3 is a cross-sectional view taken along the line CC shown in FIG. FIG. 4 is a cross-sectional view showing a configuration in which a metal film is formed on the inner surface of the flow path forming portion shown in FIG. FIG. 5 is a cross-sectional view showing another example of the closing member shown in FIG. FIG. 6 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the first modification of the electronic apparatus. FIG. 7 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the second modification of the electronic apparatus. FIG. 8 is a cross-sectional view showing another example of the electronic apparatus according to the second modification. FIG. 9 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the third modification of the electronic apparatus. FIG. 10 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the fourth modified example of the electronic apparatus. FIG. 11 is an enlarged view of a main part of a cross section obtained along the same line as the AA line shown in FIG. 1 for the fifth modification of the electronic apparatus. FIG. 12 is an enlarged view of a main part of a cross section obtained along the same line as the AA line shown in FIG. 1 for the sixth modification of the electronic apparatus. FIG. 13: is the figure which expanded and showed the principal part of the cross section obtained along the same line as the AA line shown by FIG. 1 about the 7th modification of the said electronic device. FIG. 14 is a diagram illustrating another example of the electronic apparatus according to the seventh modification. FIG. 15 is a vertical sectional view showing an eighth modification of the electronic apparatus. 16 is a cross-sectional view taken along the line DD shown in FIG.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. Various configurations of the electronic device according to the present embodiment can be applied to a base station for a wireless communication terminal.
FIG. 1 is a vertical cross-sectional view of an electronic apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA shown in FIG. FIG. 1 is a cross-sectional view obtained along BB shown in FIG. As shown in FIG. 1, the electronic device of this embodiment includes a housing (1) having a waterproof structure, and a first substrate (21) and a second substrate (22) housed in the housing (1). And has. Here, the first substrate (21) is placed on the second substrate (22) in a state where the front surface (21a) faces the back surface (22b) of the second substrate (22) and is separated from the back surface (22b). On the other hand, it is fixed substantially parallel to this. A column (3) is used to fix the first substrate (21) to the second substrate (22). The second substrate (22) has a surface (22a) directed toward the inner peripheral bottom surface (111) of the housing (1) while being spaced apart from the bottom surface (111). It is fixed substantially parallel to the wall (11). The column (3) is also used for fixing the second substrate (22) to the housing (1).

  As shown in FIGS. 1 and 2, a heating element (4) is mounted on one or a plurality of locations on the surface (21a) of the first substrate (21). In the present embodiment, the heating elements (4) are mounted at four locations on the surface (21a) of the first substrate (21). Here, each heating element (4) is an electronic device such as an IC (Integrated Circuit) that easily generates heat when driven. In the present embodiment, the heating element (4) is also mounted on the surface (22a) of the second substrate (22). Although not shown, the surface (21a) (22a) of the first substrate (21) and the second substrate (22) are various electronic devices such as a resistor and a capacitor in addition to the heating element (4). Is installed.

  As shown in FIGS. 1 and 2, the side wall portion (12) of the housing (1) has a first radiating fin (15) and a second radiating fin (16) facing the inside of the housing (1). Is protruding. Here, the first radiating fin (15) and the second radiating fin (16) collect the heat of the air in the casing (1) and release it to the outside of the casing (1). It is to be cooled.

  A flow path extending along the surface (21a) of the first substrate (21) from the position near the first radiation fin (15) to the position near the second radiation fin (16) is provided inside the housing (1). 50) is formed. Here, the flow path (50) has an inlet (501) and an outlet (502). The inlet (501) is directed to the first radiating fin (15), while the outlet (502) is the first. Two are directed to the heat dissipating fins (16). The flow path (50) extends on the surface (21a) of the first substrate (21) through the four mounting areas of the heating elements (4), and the heating elements (4) mounted in the mounting areas flow. It is exposed in the road (50).

  3 is a cross-sectional view taken along the line CC shown in FIG. As shown in FIG. 3, a flow path forming part (5) for forming a flow path (50) between the first substrate (21) and the second substrate (22) is provided inside the housing (1). The flow path forming portion (5) includes a first wall portion (51) extending substantially parallel to the surface (21a) along the surface (21a) of the first substrate (21), and the first substrate (21). A pair of second wall portions (52) and (52) which are respectively provided on both side edges of the wall portion (51) and extend from the both side edges toward the surface (21a) of the first substrate (21). Has been. Here, the flow path forming portion (5) is fixed on the surface (21a) of the first substrate (21) by fixing means (not shown) such as screwing.

  The flow path forming portion (5) is at least partially made of metal, and a ground portion (not shown) is formed on the first substrate (21). ) Is electrically connected to the ground portion of the first substrate (21). Specifically, the first wall part (51) and the pair of second wall parts (52) (52) of the flow path forming part (5) are each made of metal, and the flow path forming part (5) It is electrically connected to the ground portion of the first substrate (21). Alternatively, as shown in FIG. 4, a metal film (8) is formed on the inner surface of the flow path forming part (5), and the metal film (8) is electrically connected to the ground part of the first substrate (21). Has been. In FIG. 4, the metal film (8) is formed only on the inner surface of the flow path forming portion (5), but it may be formed only on the outer surface of the flow path forming portion (5), or the flow path forming portion may be formed. It may be formed on both the inner surface and the outer surface of the part (5).

  Thereby, the shield which removes radiation noise is comprised by the metal part of a flow-path formation part (5). For electrical connection between the metal portion of the flow path forming portion (5) and the ground portion of the first substrate (21), fixing means for fixing the flow path forming portion (5) to the first substrate (21). For example, a metal screw member or the like can be used.

  As shown in FIG. 3, a gap G is formed between the leading edge (52a) of each second wall portion (52) and the surface (21a) of the first substrate (21), while the flow path forming portion. Each second wall portion (52) of (5) is provided with a closing member (7) for closing the gap G. Here, the closing member (7) is made of an electrically insulating material having elasticity, such as resin or urethane rubber. The closing member (7) may be provided on the surface (21a) of the first substrate (21). Further, as shown in FIG. 5, a blocking member (7) is interposed between the leading edge (52a) of each second wall portion (52) and the surface (21a) of the first substrate (21). The gap G may be closed by the closing member (7).

  As shown in FIGS. 1 and 2, the inside of the flow path (50) is further provided inside the housing (1) between the first heat dissipating fin (15) and the inlet (501) of the flow path (50). There is provided a fan (6) for flowing the air from the inlet (501) to the outlet (502) of the flow path (50). Here, in FIG.1 and FIG.2, the flow of the air in a flow path (50) is shown by the solid line arrow. The fan (6) may be provided between the second radiating fin (16) and the outlet (502) of the flow path (50). In addition, in the housing (1), air in the flow path (50) flows from the inlet (501) to the outlet (502) of the flow path (50) instead of the fan (6). Other air blowing mechanisms capable of performing the above may be provided.

  In the electronic device, air flows along the flow path (50) from the inlet (501) to the outlet (502) of the flow path (50). For this reason, the electronic device mounted on the surface (21a) of the first substrate (21), the viscous resistance between the surface (21a) of the first substrate (21) and the air, etc. cause the flow. Even when a turbulent flow or vortex is generated in the air flowing in the channel (50), the air flows along the channel (50) with almost no diffusion. Here, the flow path (50) extends on the surface (21a) of the first substrate (21) through the mounting area of the heating element (4), and the heating element (4) mounted in the mounting area flows. It is exposed in the road (50). Therefore, the air in the flow path (50) is efficiently guided to each heating element (4).

  In the electronic device, a gap G between the tip edge (52a) of each second wall portion (52) of the flow path forming portion (5) and the surface (21a) of the first substrate (21) is It is blocked by a blocking member (7). Thereby, the air in the flow path (50) is prevented from leaking from the gap G by the closing member (7). Accordingly, the air in the channel (50) efficiently flows from the inlet (501) to the outlet (502) of the channel (50).

  In addition to these, in the electronic device, air cooled by the first heat radiation fin (15) flows into the flow path (50) from the inlet (501) of the flow path (50). Therefore, heat is efficiently recovered from each heating element (4).

  On the other hand, the air heated by the recovery of heat from each heating element (4) flows out from the outlet (502) of the flow path (50) and then flows into the second radiating fin (16). Then, heat is efficiently recovered from the air by the second radiating fin (16), and the heat is released to the outside of the casing (1).

  Therefore, according to the electronic device, high heat dissipation efficiency can be obtained. As a result, even when each heating element (4) is driven to generate heat, the temperature of each heating element (4) is excessively increased. There is no.

  Further, in the electronic device, the flow path (50) extends on the surface (21a) of the first substrate (21) through the four mounting regions of the heating element (4). Therefore, according to the electronic device, despite the simple configuration, the housing (efficiently) heat from the plurality of heating elements (4) mounted on the surface (21a) of the first substrate (21). It can be discharged to the outside of 1).

  In the electronic device, the shape of the flow path (50) extending along the surface (21a) of the first substrate (21) can be designed according to the position of the mounting area of the heating element (4). Accordingly, it is possible to set the mounting area of the heating element (4) at various positions on the surface (21a) of the first substrate (21), and from the heating element (4) mounted in the mounting area. Can be efficiently recovered. Therefore, the electronic device has a high degree of design freedom regarding the formation of the flow path (50).

  In the electronic device, a shield for removing radiation noise is configured by the metal portion of the flow path forming portion (5). Therefore, at least a part of the radiation noise (electromagnetic wave) trying to pass through the flow path forming part (5) is blocked by the metal part (shield) of the flow path forming part (5). Therefore, radiation noise from the heating element (4) mounted on the surface (21a) of the first substrate (21) is difficult to propagate to other electronic devices, and radiation noise from other electronic devices is not generated by the heating element ( It becomes difficult to propagate to 4). For this reason, it is difficult for abnormalities to occur in the operation of the heating element (4) and other electronic devices.

  FIG. 6 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the first modification of the electronic apparatus. As shown in FIG. 6, in the electronic device, the heat radiation fin (40) is installed on the back surface (21b) of the first substrate (21), and the heat radiation fin (40) and the surface (21a) of the first substrate (21). The heating element (4) mounted on the first substrate (21) is thermally connected to each other through the thermal via (41) formed on the first substrate (21), and the flow path (50) is connected to the first substrate (21). ) On the back surface (21b) of the first heat radiating fin (15) from the position near the first heat radiating fin (15) to the position near the second heat radiating fin (16). The radiating fin (40) may be exposed in the flow path (50). Note that another heat radiating member may be provided on the back surface (21b) of the first substrate (21) instead of the heat radiating fin (40).

  In the electronic device of the first modification, air flows from the inlet (501) to the outlet (502) of the flow path (50) along the flow path (50), as in the electronic apparatus shown in FIGS. It will be. For this reason, the electronic device mounted on the back surface (21b) of the first substrate (21), the viscous resistance between the back surface (21b) of the first substrate (21) and the air, etc. Even when a turbulent flow or vortex is generated in the air flowing in the channel (50), the air flows along the channel (50) with almost no diffusion. Here, the flow path (50) extends on the back surface (21b) of the first substrate (21) through the installation area of the radiation fin (40), and the radiation fin (40) installed in the installation area is the flow path. (50) is exposed. Therefore, the air in the flow path (50) is efficiently guided to the radiating fin (40).

  Further, when no electronic device is mounted on the back surface (21b) of the first substrate (21), or when the number of electronic devices mounted on the back surface (21b) is small, it flows in the flow path (50). Turbulence and vortices are less likely to occur in the air. Therefore, the air in the flow path (50) is more efficiently guided to the radiating fin (40).

  Therefore, according to the electronic device of the first modification, the heat propagated from the heating element (4) to the radiating fin (40) can be efficiently recovered and released to the outside of the housing (1). As a result, high heat dissipation efficiency can be obtained.

  Furthermore, in the electronic device of the first modified example, the shape of the flow path (50) extending along the back surface (21b) of the first substrate (21) is designed according to the position of the installation area of the radiating fin (40). I can do it. Accordingly, it is possible to set the installation area of the radiation fins (40) at various positions on the back surface (21b) of the first substrate (21), and from the radiation fins (40) installed in the installation area. Can be efficiently recovered. Therefore, the electronic device of the first modification has a high degree of design freedom with respect to the formation of the flow path (50).

  FIG. 7 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the second modification of the electronic apparatus. As shown in FIG. 7, in the electronic device, the flow path forming part (5) is provided between the back surface (22b) of the second substrate (22) and between the first substrate (21) and the second substrate (22). And a pair of side wall portions (54) and (54) arranged on the wall.

  In the electronic device of the second modification, a gap G1 is formed between each side wall portion (54) of the flow path forming portion (5) and the first substrate (21), while the side wall portion (54) and Alternatively, a closing member (71) that closes the gap G1 may be provided on the first substrate (21). Further, a gap G2 is formed between each side wall portion (54) of the flow path forming portion (5) and the second substrate (22), while the side wall portion (54) and / or the second substrate (22). ) May be provided with a closing member (72) for closing the gap G2. Thereby, the blocking members (71), (72) prevent the air in the flow path (50) from leaking from the gaps G1, G2.

  FIG. 8 is a cross-sectional view showing another example of the electronic apparatus according to the second modification. As shown in FIG. 8, the heating element (4) mounted on the second substrate (22) passes through the flow path (50) in the back surface (22b) of the second substrate (22). It may be provided in the area. Thereby, it becomes possible to collect | recover the heat | fever from the heat generating body (4) mounted in a 2nd board | substrate (22).

  FIG. 9 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the third modification of the electronic apparatus. As shown in FIG. 9, the electronic device may have a configuration without the blocking member (7).

  FIG. 10 is a cross-sectional view obtained along the same line as the CC line shown in FIG. 2 for the fourth modified example of the electronic apparatus. As shown in FIG. 10, in the electronic device, the flow path forming portion (5) has a first wall portion extending substantially parallel to the surface (21a) along the surface (21a) of the first substrate (21). 51) and a pair of second wall portions (52) that extend from the both side edges toward the surface (21a) of the first substrate (21) and are connected to both side edges of the first wall portion (51). ) (52) and a third wall portion (53) connected to the leading edges (52a) and (52a) of the pair of second wall portions (52) and (52). Here, the third wall (53) is located closer to the surface (21a) of the first substrate (21) than the first wall (51) along the surface (21a) of the first substrate (21). The third wall (53) has an opening (530) that exposes the heating element (4) into the flow path (50) while extending substantially parallel to the surface (21a).

  FIG. 11 is an enlarged view of a main part of a cross section obtained along the same line as the AA line shown in FIG. 1 for the fifth modification of the electronic apparatus. As shown in FIG. 11, when the flow path (50) is bent, the corner (55) of the flow path forming part (5) forming the flow path (50) is curved with a predetermined curvature. A curved portion (550) may be formed. Thereby, it is possible to prevent the air from staying at the corner (55) of the flow path forming part (5).

  FIG. 12 is an enlarged view of a main part of a cross section obtained along the same line as the AA line shown in FIG. 1 for the sixth modification of the electronic apparatus. As shown in FIG. 12, the width dimension L of the flow path (50) may be small in a part of the area, specifically, in the area R that passes through the mounting area of the heating element (4). Thereby, in the area | region R of a flow path (50), the flow velocity of the air in a flow path (50) becomes large, As a result, the collection | recovery efficiency of the heat | fever from a heat generating body (4) improves.

  In the electronic device of the sixth modification, the width dimension L of the flow path (50) may be reduced stepwise from the inlet (501) to the outlet (502) of the flow path (50). As a result, the temperature of the air in the flow path (50) rises every time it passes through the mounting region of the heating element (4), while the flow velocity of the air becomes closer to the outlet (502) of the flow path (50). growing. Therefore, the heat from the heating element (4) provided in the downstream area of the flow path (50) can also be efficiently recovered.

  FIG. 13: is the figure which expanded and showed the principal part of the cross section obtained along the same line as the AA line shown by FIG. 1 about the 7th modification of the said electronic device. FIG. 14 is a diagram showing another example of the electronic apparatus according to the seventh modification. As shown in FIGS. 13 and 14, in order to improve the efficiency of collecting heat from the heating element (4), it depends on the shape of the heating element (4) and the posture of the heating element (4) with respect to the direction of air flow. The width dimension L of the flow path (50) may be adjusted, and the flow rate of air in the flow path (50) may be adjusted.

  FIG. 15 is a vertical sectional view showing an eighth modification of the electronic apparatus, and FIG. 16 is a sectional view taken along the line DD shown in FIG. FIG. 15 is a cross-sectional view obtained along the line EE shown in FIG. As shown in FIGS. 15 and 16, the electronic device has an intake port (13) in place of the first heat dissipating fin (15) on the side wall (12) of the housing (1). Instead of the two heat dissipating fins (16), an exhaust port (14) may be provided. In this configuration, the inlet (501) of the flow path (50) is directed to the intake port (13), while the outlet (502) of the flow path (50) is directed to the exhaust port (14). Then, by the blowing operation of the fan (6), cold air is sucked from the intake port (13), and the cold air passes through the flow path (50) from the inlet (501) to the outlet (502). ), While the air warmed in the flow path (50) is discharged from the exhaust port (14).

  Therefore, according to the electronic device of the eighth modified example, the heat from each heating element (4) can be efficiently recovered, and the heat can be released from the exhaust port (14) to the outside of the housing (1). As a result, high heat dissipation efficiency can be obtained. In the electronic device of this modification, a waterproof structure may be formed in the housing (1) by providing some waterproof means at the intake port (13) and the exhaust port (14).

  In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim. For example, in the above electronic device, when the heating elements (4) are mounted at a plurality of locations on the surface (21a) of the first substrate (21), the current flows according to the heating temperature and rating of each heating element (4). The order of the mounting area of the heating element (4) through which the path (50) passes can be determined (designed). Specifically, the flow path (50) can be designed so that the heating element (4) having a higher heat generation temperature is positioned on the upstream side of the flow path (50). The flow path (50) can be designed so that the heat generating element (4) having low heat resistance is positioned on the upstream side of the flow path (50). The flow path (50) can be designed so that the heating element (4) with severe rated conditions is located upstream of the flow path (50).

  The various configurations employed in the above electronic device include an electronic device in which only the first substrate (21) is housed in the housing (1), or in addition to the first substrate (21) and the second substrate (22). Furthermore, the present invention can be applied to an electronic device in which another board is accommodated in the housing (1). The various configurations employed in the electronic device can be applied not only to the base station but also to various electronic devices such as a personal computer.

(1) Case
(11) Bottom wall
(12) Side wall
(13) Air intake
(14) Exhaust port
(15) First radiating fin (first radiating part)
(16) Second radiating fin (second radiating part)
(21) First board
(21a) Surface
(21b) Back side
(22) Second board
(22a) Surface
(22b) Back side
(3) Prop
(4) Heating element
(40) Heat radiation fin (heat radiation member)
(41) Thermal via
(5) Flow path forming part
(50) Flow path
(501) Entrance
(502) Exit
(51) First wall
(52) Second wall
(52a) Tip edge
(53) Third wall
(530) Opening
(54) Side wall
(55) Corner
(550) Curved part
(6) Fan (Blower mechanism)
(7) Closure member
(8) Metal film G Gap L Width dimension

Claims (7)

In an electronic device comprising a housing and a substrate housed in the housing, and a heating element mounted on the surface of the substrate,
A flow path having an inlet and an outlet is formed inside the housing along the surface of the substrate, and a blower mechanism is provided for flowing air in the flow path from the inlet to the outlet of the flow path. The electronic apparatus is characterized in that the flow path extends on the surface of the substrate through a heating element mounting area, and the heating element mounted in the mounting area is exposed in the flow path.   2. The electronic device according to claim 1, wherein a heating element is mounted on the surface of the substrate at a plurality of locations, and the flow path extends on the surface of the substrate via a plurality of mounting regions of the heating element. .   A flow path forming portion that forms the flow path is disposed inside the housing, and the flow path forming portion includes a first wall portion that extends substantially parallel to the surface along the surface of the substrate, and Each of the first wall portions includes a pair of second wall portions that are connected to both side edges of the first wall portion and extend from the both side edges toward the surface of the substrate. The electronic device according to claim 1, wherein a gap is formed between the surface and the flow path forming part and / or the substrate is provided with a closing member that closes the gap.   The flow path forming portion is at least partially composed of metal, and the substrate has a ground portion, and the metal portion of the flow path forming portion is electrically connected to the ground portion of the substrate. The electronic device according to claim 3, wherein a shield that removes radiation noise is configured by the metal portion of the flow path forming portion. The housing includes a housing and a substrate housed in the housing, and a heating element is mounted on the surface of the substrate, and a heat radiating member thermally connected to the heating element is installed on the back surface of the substrate In electronic devices
A flow path having an inlet and an outlet is formed inside the casing along the back surface of the substrate, and a blower mechanism is provided for flowing air in the flow path from the inlet to the outlet of the flow path. The electronic apparatus is characterized in that the flow path extends on the back surface of the substrate through an installation area of the heat dissipation member, and the heat dissipation member installed in the installation area is exposed in the flow path.   The housing is provided with a first heat radiating portion and a second heat radiating portion for collecting heat in the housing and releasing the heat to the outside of the housing, and the flow path is positioned near the first heat radiating portion. The electronic device according to any one of claims 1 to 5, wherein the electronic device extends to a position near the second heat radiation portion.   6. An intake port and an exhaust port are formed in the housing, and an inlet of the flow path is directed to the intake port, while an outlet of the flow path is directed to the exhaust port. The electronic device according to Crab.

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