JP2010232349A - Substrate processing apparatus and substrate delivery method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can improve throughput, and to provide a substrate delivery method. <P>SOLUTION: A hand 9 has, on upper and lower surfaces thereof, four support projections 23 and four pinching members 24 for holding a wafer W respectively. The wafer W is received from and delivered to a spin chuck by the hand 9 through four operation steps (1) to (4) of: (1) moving the hand 9 forward to a position opposed to the spin chuck in a state that the wafer W is held on the four support projections 23; (2) receiving the wafer W to the four pinching members 24 from the spin chuck by holding the wafer W, supported by the spin chuck, by the four pinching members 24; (3) delivering the wafer W from the four support members 23 to the spin chuck before or after the wafer W is received by the four pinching members 24; and (4) retracting the hand from the position opposed to the spin chuck. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus used for processing a substrate and a substrate delivery method in the substrate processing apparatus. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photo A mask substrate is included.

Substrate processing equipment used in the manufacture of semiconductor devices, etc., adopts a single wafer processing method for processing substrates one by one as a processing method and a batch processing method that processes a plurality of substrates at once. There is.
A substrate processing apparatus adopting a single wafer type has a configuration in which an indexer unit is coupled to an apparatus main body. The indexer unit is provided with a placement portion on which a carrier capable of accommodating a plurality of substrates is placed, and an indexer robot that conveys the substrate to the carrier. The apparatus main body is provided with a processing chamber for processing a substrate and a center robot for transporting the substrate to the processing chamber.

  A plurality of unprocessed substrates are accommodated in the carrier placed on the placement unit. The indexer robot takes out unprocessed substrates one by one from the carrier and delivers the taken out substrates to the center robot. When the center robot receives the substrate from the indexer robot, the center robot transfers the substrate to a spin chuck provided in the processing chamber. When the processing on the substrate in the processing chamber is completed, the center robot receives the processed substrate from the spin chuck and transfers the substrate to the indexer robot. The processed substrate transferred to the indexer robot is returned to the carrier by the indexer robot.

  The center robot employs a so-called double hand configuration including a first hand for transporting a processed substrate and a second hand for transporting an unprocessed substrate. Then, the substrate is received and delivered to the spin chuck by the center robot (the substrate is carried out and carried into the processing chamber) continuously. That is, when the processing on the substrate in the processing chamber is completed, the center robot receives and transfers the substrate to and from the spin chuck according to the following operation steps 1 to 5.

1. An empty first hand not holding the substrate is inserted between the substrate and the spin chuck.
2. The first hand is raised and the substrate is received from the spin chuck by the first hand.
3. While the first hand is pulled back, the second hand holding the unprocessed substrate is pushed out above the spin chuck.

4). The second hand is lowered, and the substrate is transferred from the second hand to the spin chuck.
5). The second hand is pulled back.
On the other hand, when the center robot has a single hand, the processed substrate is unloaded from the spin chuck by the hand, the processed substrate is transferred to the indexer robot, and then the empty hand is not processed from the indexer robot. The unprocessed substrate must be transferred to the spin chuck. Therefore, it takes a long time from the end of the processing for the substrate in the processing chamber to the start of the processing for the next substrate. Therefore, the center robot has a double-hand configuration, and the substrate is received and delivered continuously to the spin chuck, thereby shortening the time from the end of processing for the previous substrate to the start of processing for the next substrate. can do.

JP 2007-53203 A

However, since the five operation steps 1 to 5 are required for receiving and transferring the substrate to and from the spin chuck, it takes a long time from the end of the processing for the previous substrate to the start of the processing for the next substrate. Therefore, there is a problem that the throughput cannot be improved.
Therefore, an object of the present invention is to provide a substrate processing apparatus and a substrate delivery method that can improve throughput.

  The substrate processing apparatus according to claim 1, for achieving the above object, has a support mechanism for supporting a substrate, and is provided so as to be able to advance and retreat with respect to the support mechanism, and has an upper surface and a lower surface. And a first holding mechanism for holding the substrate on one of the lower surfaces, a hand having a second holding mechanism for holding the substrate on the other of them, and the substrate held by the first holding mechanism. In this state, the hand advances to a position facing the support mechanism, the substrate supported by the support mechanism is held by the second holding mechanism, the substrate is received from the support mechanism, and the first holding mechanism And a hand control unit for controlling the operation of the hand so that the hand is retracted from a position facing the support mechanism after releasing the holding of the substrate by the substrate and delivering the substrate to the support mechanism. .

In this substrate processing apparatus, a first holding mechanism and a second holding mechanism for holding a substrate are provided in one hand. Therefore, the substrate can be received and delivered to the support mechanism by the hand according to the four operation steps 1 to 4, which is one less in number than the substrate processing apparatus adopting the double-hand configuration.
1. While the substrate is held by the first holding mechanism, the hand is advanced to a position facing the support mechanism.

2. The substrate supported by the support mechanism is held by the second holding mechanism, and the substrate is received from the support mechanism by the second holding mechanism.
3. Before and after receiving the substrate by the second holding mechanism, the substrate is transferred from the first holding mechanism to the support mechanism.
4). The hand is withdrawn from a position facing the support mechanism.

Therefore, the time required for receiving and transferring the substrate to and from the support mechanism by the hand can be shortened, and thereby the throughput of the substrate processing apparatus can be improved.
The first holding mechanism may be provided on the upper surface of the hand, and the second holding mechanism may be provided on the lower surface of the hand.

  In this case, as described in claim 3, the substrate processing apparatus further includes a substrate holding and rotating mechanism for holding and rotating the substrate, and the substrate holding and rotating mechanism is centered on a rotation axis extending in the vertical direction. A rotatable base, a plurality of chuck pins that are erected on the upper surface of the base and hold / release the substrate in cooperation, and are provided on the upper surface of the base so as to be movable up and down. A plurality of lift pins for raising and lowering the substrate to and from the lift position, the support mechanism is the substrate holding rotation mechanism, the first holding mechanism delivers the substrate to the plurality of lift pins, and the second holding mechanism May receive a substrate from the plurality of chuck pins.

The time required for receiving and transferring the substrate to and from the substrate holding and rotating mechanism by the hand can be shortened, and thereby the throughput of the substrate processing apparatus can be improved.
According to a fourth aspect of the present invention, the substrate processing apparatus further includes a multi-substrate support mechanism that includes a plurality of support members that are provided at regular intervals in the vertical direction and each support a peripheral portion of the substrate from below. The plurality of support members are composed of a first support portion composed of a predetermined number of support member groups that are vertically continuous and a group of the remaining support members, and are arranged in a vertical direction with respect to the first support portion. The support mechanism is a multi-substrate support mechanism, and the first holding mechanism is a substrate in order from the top with respect to the support member of the first support portion or the second support portion disposed relatively above. The second holding mechanism may receive the substrate from a support member positioned below the support member to which the substrate has been transferred by the first holding mechanism.

It is possible to reduce the time required for receiving and delivering the substrate to and from the multiple substrate support mechanism by the hand, thereby improving the throughput of the substrate processing apparatus.
The first holding mechanism may be provided on the lower surface of the hand, and the second holding mechanism may be provided on the upper surface of the hand.

  In this case, as described in claim 6, the substrate processing apparatus further includes a substrate holding and rotating mechanism for holding and rotating the substrate, and the substrate holding and rotating mechanism is centered on a rotation axis extending in the vertical direction. A rotatable base, a plurality of chuck pins that are erected on the upper surface of the base and hold / release the substrate in cooperation, and are provided on the upper surface of the base so as to be movable up and down. A plurality of lift pins for raising and lowering the substrate to and from the lift position, the support mechanism is a substrate holding rotation mechanism, the first holding mechanism delivers the substrate to the plurality of chuck pins, and the second holding mechanism May receive a substrate from the plurality of lift pins.

The time required for receiving and transferring the substrate to and from the substrate holding and rotating mechanism by the hand can be shortened, and thereby the throughput of the substrate processing apparatus can be improved.
According to a seventh aspect of the present invention, the substrate processing apparatus further includes a multi-substrate support mechanism that includes a plurality of support members that are provided at regular intervals in the vertical direction and each support a peripheral portion of the substrate from below. The plurality of support members are composed of a first support portion composed of a predetermined number of support member groups that are vertically continuous and a group of the remaining support members, and are arranged in a vertical direction with respect to the first support portion. The support mechanism is a multiple substrate support mechanism, and the first holding mechanism is a substrate in order from the bottom with respect to the support member of the first support portion or the second support portion that is disposed relatively below. The second holding mechanism may receive the substrate from a support member positioned above the support member to which the substrate has been transferred by the first holding mechanism.

It is possible to reduce the time required for receiving and delivering the substrate to and from the multiple substrate support mechanism by the hand, thereby improving the throughput of the substrate processing apparatus.
According to the eighth aspect of the present invention, the substrate processing apparatus is provided for a rotation mechanism that switches the vertical positions of the first support portion and the second support portion, and all support members of the first support portion or the second support portion. It is preferable to further include a rotation control unit that drives the rotation mechanism in response to the transfer of the substrate from the first holding mechanism.

In response to the transfer of the substrate from the first holding mechanism to all the support members of the first support part or the second support part, the vertical positions of the first support part and the second support part are switched. As a result, the substrate can be continuously transferred from the first holding mechanism to the support member.
In addition, before the rotation mechanism is driven in response to the substrate being transferred from the first holding mechanism to all the support members of the first support part or the second support part, the substrate processing apparatus It is preferable to include a substrate batch transport mechanism that batch transports all the substrates from the first support portion or the second support portion full of the substrates.

By providing this substrate batch transport mechanism, the time required for transporting the substrate from the first support portion or the second support portion can be shortened. As a result, the throughput of the substrate processing apparatus can be further improved.
The substrate delivery method according to claim 9 is provided with a support mechanism for supporting a substrate, and is provided so as to be movable back and forth with respect to the support mechanism, and has an upper surface and a lower surface. A first holding mechanism for holding the substrate and a hand having a second holding mechanism for holding the substrate on the other side of the first holding mechanism, wherein the substrate is transferred to the first holding mechanism. In the state where the hand is held, the advancing step for moving the hand to a position facing the support mechanism, and after the advancing step, the substrate supported by the support mechanism is held by the second holding mechanism. A receiving step for receiving a substrate from the support mechanism; a delivery step for releasing the holding of the substrate by the first holding mechanism after the advancing step and delivering the substrate to the supporting mechanism; and the receiving step; After fine the delivery step, and a retracting step for retracting the hand from a position facing the support mechanism.

  By this substrate delivery method, the same effect as that described in relation to claim 1 can be obtained.

FIG. 1 is a schematic plan view showing a layout of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2A is a schematic plan view of the hand of the center robot shown in FIG. FIG. 2B is a schematic side view of the hand of the center robot shown in FIG. FIG. 3 is a schematic plan view of a spin chuck provided in the processing chamber shown in FIG. FIG. 4 is a perspective view of the buffer shown in FIG. FIG. 5 is a block diagram showing an electrical configuration of the substrate processing apparatus. FIG. 6A is a schematic side view showing the operation at the time of receiving and delivering a wafer to and from the spin chuck by the hand of the center robot. FIG. 6B is a schematic side view showing the next operation of FIG. 6A. FIG. 6C is an illustrative side view showing the next operation of FIG. 6B. FIG. 6D is a schematic side view showing the next operation of FIG. 6C. FIG. 6E is a schematic side view showing the next operation of FIG. 6D. FIG. 6F is a schematic side view showing the next operation of FIG. 6E. FIG. 6G is an illustrative side view showing the next operation of FIG. 6F. FIG. 7A is an illustrative side view showing an example of an operation at the time of receiving and delivering a wafer to / from a buffer by the hand of the center robot. FIG. 7B is a schematic side view showing the next operation of FIG. 7A. FIG. 7C is a schematic side view showing the next operation of FIG. 7B. FIG. 7D is a schematic side view showing the next operation of FIG. 7C. FIG. 8A is an illustrative side view showing an example of the operation when the vertical positions of the first support portion and the second support portion of the buffer are switched. FIG. 8B is an illustrative side view showing the next operation of FIG. 8A. FIG. 8C is an illustrative side view showing the next operation of FIG. 8B. FIG. 8D is an illustrative side view showing the next operation of FIG. 8C. FIG. 8E is a schematic side view showing the next operation of FIG. 8D. FIG. 9A is an illustrative side view showing another example of the operation at the time of receiving and delivering a wafer to and from the spin chuck by the hand of the center robot. FIG. 9B is a schematic side view showing the next operation of FIG. 9A. FIG. 9C is an illustrative side view showing the next operation of FIG. 9B. FIG. 9D is a schematic side view showing the next operation of FIG. 9C. FIG. 9E is an illustrative side view showing the next operation of FIG. 9D. FIG. 9F is a schematic side view showing the next operation of FIG. 9E. FIG. 9G is a schematic side view showing the next operation of FIG. 9F. FIG. 10A is an illustrative side view showing another example of operations at the time of receiving and delivering a wafer to / from a buffer by the hand of the center robot. FIG. 10B is a schematic side view showing the next operation of FIG. 10A. FIG. 10C is an illustrative side view showing the next operation of FIG. 10B. FIG. 10D is an illustrative side view showing the next operation of FIG. 10C. FIG. 11A is an illustrative side view showing another example of the operation when the vertical positions of the first support portion and the second support portion of the buffer are switched. FIG. 11B is an illustrative side view showing the next operation of FIG. 11A. FIG. 11C is a schematic side view showing the next operation of FIG. 11B. FIG. 11D is a schematic side view showing the next operation of FIG. 11C. FIG. 11E is a schematic side view showing the next operation of FIG. 11D. FIG. 12 is a perspective view showing another structure of the buffer.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view showing a layout of a substrate processing apparatus according to an embodiment of the present invention.
The substrate processing apparatus 1 is installed, for example, in a semiconductor device manufacturing factory or the like, and is used for processing a semiconductor wafer (hereinafter simply referred to as “wafer”) W. The processing method in the substrate processing apparatus 1 is a single wafer processing method for processing the wafers W one by one.

The substrate processing apparatus 1 has a configuration in which an indexer unit 2 is coupled to an apparatus body 3.
The indexer unit 2 includes a carrier mounting table 4 on which a plurality of carriers C can be mounted side by side, and an indexer robot 5 for transporting the wafer W to each carrier C.

The carrier C can accommodate a plurality of (for example, 25) wafers W in a stacked arrangement state with a predetermined interval therebetween. As such a carrier C, FOUP (Front Opening Unified Pod), SMIF (Standard Mechanical InterFace) pod, OC (Open Cassette), etc. can be used.
The indexer robot 5 is disposed on the apparatus main body 3 side with respect to the carrier mounting table 4. The indexer robot 5 travels in the robot traveling area A extending along the carrier mounting table 4 in the direction in which the carriers C are arranged, and can move to a position facing each carrier C. Further, the indexer robot 5 has the same number of hands 6 as the number of wafers W that can be accommodated in the carrier C, an arm (not shown) that moves the hands 6 back and forth in the horizontal direction, and raises and lowers the hands 6 and the arms. Mechanism. Further, the indexer robot 5 can rotate around the vertical axis to change the forward / backward direction of the hand 6. At a position where the indexer robot 5 faces each carrier C, the hand 6 is moved back and forth and raised and lowered with respect to the carrier C, and all the unprocessed wafers W accommodated in the carrier C are collectively taken out by the hand 6. The number of processed wafers W that can be accommodated in the carrier C can be collectively accommodated in the carrier C.

A transfer chamber 7 is formed in the apparatus body 3. The transfer chamber 7 extends from the center of the robot travel area A in a direction orthogonal to the travel direction of the indexer robot 5 in plan view.
A center robot 8 is disposed at the center of the transfer chamber 7. The center robot 8 includes a hand 9 capable of simultaneously holding two wafers W, a hand advance / retreat mechanism 10 (see FIG. 2A) including an arm (not shown) for moving the hand 9 in the horizontal direction, the hand 9 and the arm. The hand raising / lowering mechanism 11 (refer FIG. 2A) which raises / lowers is provided. Further, the center robot 8 can rotate around the vertical axis.

  A buffer 12 capable of supporting two (for example, 50) wafers W of the carrier C is provided at a connection portion of the transfer chamber 7 with the robot travel area A. Both the indexer robot 5 side and the center robot 8 side of the buffer 12 are open so that the indexer robot 5 and the center robot 8 can access the buffer 12.

  The apparatus body 3 is provided with four processing chambers 13. The four processing chambers 13 are arranged so as to surround the center robot 8. Specifically, the two processing chambers 13 are arranged adjacent to each other in the direction along the transfer chamber 7 on one side in a direction orthogonal to the longitudinal direction of the transfer chamber 7. Then, the remaining two processing chambers 13 are arranged at positions facing each other across the two processing chambers 13 and the transfer chamber 7. Each processing chamber 13 is formed with an opening (not shown) with a shutter on the surface facing the transfer chamber 7. The center robot 8 can carry in / out the wafer W to / from each processing chamber 13 through the opening by moving the hand 9 forward / backward with the advancing / retreating direction of the hand 9 toward each processing chamber 13 side. .

In the processing chamber 13, processing for the wafer W is performed. As processing for the wafer W, cleaning processing for cleaning the wafer W, etching processing for removing a thin film on the surface of the wafer, heat processing for heating / cooling the wafer W, and formation of a film on the surface of the wafer W are performed. Examples of the film forming process are as follows.
FIG. 2A is a schematic plan view of a center robot hand.

The hand 9 of the center robot 8 is formed in a bifurcated fork shape having a base portion 21 connected to an arm (not shown) and a pair of extending portions 22 extending from the base portion 21 in the advancing direction of the hand 9. ing. The upper and lower surfaces of the hand 9 are flat surfaces extending substantially horizontally.
The length of the extending portion 22 is larger than the diameter R of the wafer W. Further, in the direction in which the pair of extending portions 22 face each other, the distance between the outer edge of one extending portion 22 and the outer edge of the other extending portion 22 is the diameter of the wafer W. The distance between the inner edge of one extension portion 22 and the inner edge of the other extension portion 22 is larger than the width of the chuck pin 33 described later.

  Two support protrusions 23 are provided on the upper surface 22 </ b> A of each extension portion 22. One support protrusion 23 is disposed at the distal end of the extension part 22, and the other support protrusion 23 is disposed at the base end part of the extension part 22. Although not shown, each support protrusion 23 has a support surface that supports the peripheral portion of the lower surface of the wafer W from below, and a restriction surface that faces the end surface of the wafer W and restricts the movement of the wafer W in the horizontal direction. is doing.

  In this embodiment, the four holding projections 23 constitute a first holding mechanism or a second holding mechanism for holding a wafer W that is an example of a substrate. That is, the wafer W is supported by the support surfaces of the four support protrusions 23, and is held on the upper side of the hand 9 in a state where movement in the horizontal direction is restricted by the restriction surfaces of the support protrusions 23. In a state where the wafer W is held on the upper side of the hand 9, a gap through which the chuck pins 33 can be inserted is formed between the wafer W and the base portion 21 of the hand 9.

FIG. 2B is an illustrative side view of the center robot hand.
A pair (two) of clamping members 24 are provided on the lower surface 22 </ b> B of each extending portion 22. One clamping member 24 is disposed at the distal end of the extension 22, and the other clamping member 24 is disposed at the proximal end of the extension 22. A total of four clamping members 24 are arranged on the circumference corresponding to the outer peripheral shape of the wafer W. Each clamping member 24 is formed with an end surface clamping portion 25 having a V-shaped cross section at a portion facing the clamping member 24 that is paired with each other.

Each pair of the clamping members 24 is coupled with a contact / separation mechanism 26 for bringing the two clamping members 24 that are paired with each other into proximity / separation in the opposing direction. The contact / separation mechanism 26 includes, for example, a cylinder and is built in the hand 9.
In a state where the wafer W is disposed in the region surrounded by the four clamping members 24, the four clamping members 24 move in the direction in which the two clamping members 24 that are paired with each other approach each other (hereinafter simply referred to as “ The wafer W is held on the lower side of the hand 9 by the peripheral edge of the wafer W entering and contacting the end face clamping portion 25 of each clamping member 24. Further, the four clamping members 24 are moved (hereinafter simply referred to as “separation”) in a direction in which the two clamping members 24 that are paired with each other are moved away from each other in the opposing direction. Thus, the wafer W can be released. In this embodiment, the four holding members 24 and the contact / separation mechanism 26 constitute a second holding mechanism or a first holding mechanism for holding a wafer W that is an example of a substrate. In a state where the wafers W are held on both the upper and lower sides of the hand 9, the wafers W face each other with their centers aligned.

FIG. 3 is a schematic plan view of a spin chuck provided in the processing chamber.
The processing chamber 13 is provided with a spin chuck 31 for holding and rotating the wafer W in a substantially horizontal posture.
The spin chuck 31 includes a disk-shaped spin base 32, six chuck pins 33 erected on the upper surface of the spin base 32, and three lift pins 34 disposed in the vicinity of every other chuck pin 33. I have.

  The spin base 32 is attached to the upper end of a spin axis (not shown) arranged along the vertical direction. The spin shaft is configured coaxially with a rotation shaft (not shown) of the motor, and is provided so as to be rotatable about its central axis. Further, the spin base 32 and the spin axis are coupled so that the central axis of the spin axis passes through the center of the spin base 32. Thereby, when the motor is driven, the spin base 32 rotates about the axis extending in the vertical direction together with the spin axis.

  The six chuck pins 33 are arranged at substantially equal angular intervals on the circumference corresponding to the outer peripheral shape of the wafer W. Each chuck pin 33 is provided so as to be rotatable about a vertical axis. Although not shown, each chuck pin 33 includes a support portion that supports the peripheral portion of the lower surface of the wafer W from below, a contact surface that can contact the end surface of the wafer W, and the wafer W more than the contact surface. And a separation surface that can be opposed to the end surface of the wafer W with a space therebetween. The six chuck pins 33 are coupled to a chuck drive mechanism 35 that links the chuck pins 33 to reciprocate and rotate. The chuck drive mechanism 35 includes, for example, a cylinder and is built in the spin base 32.

  The peripheral portion of the lower surface of the wafer W can be supported by the support portions of the six chuck pins 33. Then, by rotating each chuck pin and bringing each contact surface into contact with the end surface of the wafer W, the wafer W can be held (clamped) by the cooperation of the six chuck pins 33, and each separation surface. By making the wafer face the end face of the wafer W, the holding of the wafer W can be released.

  Of the six chuck pins 33, only every other three chuck pins may be movable pins that can rotate, and the remaining three chuck pins 33 may be fixed pins that cannot rotate. When the three chuck pins 33 are fixed pins, the chuck pins 33 include a support portion that supports the peripheral portion of the lower surface of the wafer W from below, and a separation surface that faces the end surface of the wafer W with a space therebetween. Have.

Each lift pin 34 is provided so as to be able to appear and retract from the upper surface of the spin base 32. Specifically, three fan-shaped holes 36 are formed on the upper surface of the spin base 32, and each lift pin 34 projects from the upper surface of the spin base 32 through the holes 36, and 32 is provided so as to be able to go in and out.
Each lift pin 34 is integrally provided with a shaft 37 extending in the vertical direction and a lift arm 38 extending in the horizontal direction from the upper end portion of the shaft 37.

A lift pin elevating mechanism 39 for elevating and lowering the shaft 37 is coupled to the shaft 37. The lift pin lifting mechanism 39 includes, for example, a cylinder and is built in the spin base 32. As the shaft 37 is moved up and down, the lift pins 34 appear and disappear from the upper surface of the spin base 32.
The shaft 37 is coupled to a lift pin rotating mechanism 40 for rotating (reciprocating) the shaft 37 within a predetermined angle range. The lift pin rotating mechanism 40 includes, for example, a cylinder and is built in the spin base 32. When the shaft 37 is rotated within a predetermined angle range, the lift arm 38 is positioned so that the tip of the lift arm 38 faces the peripheral edge of the lower surface of the wafer W held by the chuck pins 33 and the entire lift arm 38 is chucked. It swings between a position not facing the lower surface of the wafer W held by the pins 33.

In FIG. 3, for simplification of the drawing, the chuck driving mechanism 35 is coupled to only one chuck pin 33 and the lift pin lifting mechanism 39 and the lift pin rotating mechanism 40 are coupled to only one lift pin 34. Illustrated schematically.
Further, the two lift pins 34 are arranged so that the distance D between the shafts 37 is larger than the diameter of the wafer W. In the substrate processing apparatus 1, when the spin base 32 is stopped from rotating, the rotation of the spin base 32 is stopped so that the two lift pins 34 face openings (not shown) formed in the processing chamber 13. The position is controlled.

FIG. 4 is a perspective view of the buffer.
The buffer 12 includes eight lifting guide plates 41. The eight elevating guide plates 41 have two positions spaced apart from each other by a distance larger than the diameter R of the wafer W in the horizontal direction perpendicular to the direction facing the center robot 8 (see FIG. 1) (hereinafter referred to as “access direction”). Are divided into four each. Each lifting guide plate 41 extends in the vertical direction and the horizontal direction orthogonal to the access direction. And the four raising / lowering guide plates 41 of each position are arrange | positioned in parallel at intervals in the access direction. Further, the four lifting guide plates 41 at one position and the four lifting guide plates 41 at the other position face each other in a horizontal direction orthogonal to the access direction.

Hereinafter, for convenience of description, the four lifting guide plates 41 at one position are referred to as lifting guide plates 41RA, 41RB, 41RC, 41RD in order from the end in the access direction, and the four lifting guide plates at the other position. The plate 41 is referred to as lifting guide plates 41LA, 41LB, 41LC, 41LD in the same order.
Slide plates 42RA and 42RB are arranged to face each other on the surfaces of the elevation guide plates 41RA and 41RB facing each other. The slide plates 42RA and 42RB are attached to the lift guide plates 41RA and 41RB, respectively, so that they can be lifted and lowered while being parallel to the lift guide plates 41RA and 41RB. The slide plates 42RA and 42RB are formed such that their vertical sizes (heights) are smaller than half the vertical sizes of the lifting guide plates 41RA and 41RB, respectively.

  Comb-like members 43RA and 43RB are arranged on the slide plates 42RA and 42RB so as to be opposed to the lifting guide plates 41RA and 41RB, respectively. The comb-shaped members 43RA and 43RB have the same configuration, and a substantially square columnar slide portion 44 that is slidable in a horizontal direction orthogonal to the access direction with respect to the slide plates 42RA and 42RB, and a lift guide from the slide portion 44. And a plurality of support members 45 that extend horizontally toward the plates 41LA and 41LB and are provided at regular intervals in the vertical direction. The number of support members 45 is the same as the number of wafers W that can be accommodated in one carrier C (see FIG. 1).

  Slide plates 42RC and 42RD are arranged to face each other on the surfaces of the elevation guide plates 41RC and 41RD facing each other. The slide plates 42RC and 42RD are attached to the lift guide plates 41RC and 41RD, respectively, so that the slide plates 42RC and 42RD can be lifted and lowered while being parallel to the lift guide plates 41RC and 41RD. The slide plates 42RC and 42RD are formed such that their vertical sizes are smaller than half of the vertical sizes of the lifting guide plates 41RC and 41RD, respectively.

Comb members 43RC and 43RD are arranged on the slide plates 42RC and 42RD so as to be opposed to the lifting guide plates 41RC and 41RD, respectively. The comb-shaped members 43RC and 43RD have the same configuration as the comb-shaped member 43RA (43RB), and a description of the configuration is omitted.
Slide plates 42LA and 42LB are arranged to face each other on the surfaces of the elevation guide plates 41LA and 41LB facing each other. The slide plates 42LA and 42LB are attached to the lift guide plates 41LA and 41LB, respectively, so that they can be lifted and lowered while being parallel to the lift guide plates 41LA and 41LB. The slide plates 42LA and 42LB are formed such that their vertical sizes (heights) are smaller than half the vertical sizes of the lifting guide plates 41LA and 41LB, respectively.

Comb members 43LA and 43LB are arranged on the slide plates 42LA and 42LB so as to be opposed to the lift guide plates 41LA and 41LB, respectively. The comb-shaped members 43LA and 43LB are symmetric with respect to the comb-shaped member 43RA (43RB) with respect to the vertical line, and a description thereof is omitted.
Slide plates 42LC and 42LD are arranged to face each other on the surfaces of the elevation guide plates 41LC and 41LD that face each other. The slide plates 42LC and 42LD are attached to the lift guide plates 41LC and 41LD, respectively, so that they can be lifted and lowered while being parallel to the lift guide plates 41LC and 41LD. The slide plates 42LC and 42LD are formed such that their vertical sizes are smaller than half the vertical sizes of the lifting guide plates 41LC and 41LD, respectively.

Comb members 43LC and 43LD are arranged on the slide plates 42LC and 42LD so as to be opposed to the lifting guide plates 41LC and 41LD, respectively. The comb-shaped members 43LC and 43LD have the same configuration as the comb-shaped member 43LA (43LB), and description of the configuration is omitted.
FIG. 5 is a block diagram showing an electrical configuration of the substrate processing apparatus.

The substrate processing apparatus 1 includes a control unit 51 configured with a microcomputer. The control unit 51 is connected with a hand advance / retreat mechanism 10, a hand elevating mechanism 11, a contact / separation mechanism 26, a chuck driving mechanism 35, a lift pin elevating mechanism 39, a lift pin rotating mechanism 40, and a rotation driving mechanism 52 as control targets. .
The rotation drive mechanism 52 includes slide plates 42RA, 42RB, 42RC, 42RD, 42LA, 42LB, 42LC, and 42LD (hereinafter collectively referred to as “slide plate 42”) and comb-shaped members 43RA, 43RB, and FIG. This is a mechanism for sliding 43RC, 43RD, 43LA, 43LB, 43LC, and 43LD (hereinafter collectively referred to as “comb member 43”).

  The slide plates 42RA, 42RC, 42LB, and 42LD are moved up and down in synchronization by the control of the rotation drive mechanism 52 by the control unit 51, and the comb-shaped members 43RA, 43RC, 43LB, and 43LD are slid in synchronization. Accordingly, the four comb-shaped members 43RA, 43RC, 43LB, and 43LD are always at the same height in the vertical direction. When the comb-shaped members 43RA, 43RC, 43LB, and 43LD are slid to the innermost side in the horizontal direction orthogonal to the access direction, the interval between the four support members 45 at the same height position is determined by the diameter R of the wafer W. Becomes smaller. Therefore, one wafer W can be supported by the four support members 45 at the same height. Therefore, the comb-shaped members 43RA, 43RC, 43LB, and 43LD are the first supports that can be supported in a state where the same number of wafers W as the number of wafers W that can be accommodated in one carrier C (see FIG. 1) are stacked vertically. Part 46 is configured.

  Further, the slide plates 42RB, 42RD, 42LA, and 42LC are moved up and down in synchronization by the control of the rotation drive mechanism 52 by the control unit 51, and the comb-shaped members 43RB, 43RD, 43LA, and 43LC are slid in synchronization. Accordingly, the four comb-shaped members 43RB, 43RD, 43LA, and 43LC are always at the same height in the vertical position. When the comb-shaped members 43RB, 43RD, 43LA, and 43LC are slid to the innermost side in the horizontal direction orthogonal to the access direction, the interval between the four support members 45 at the same height position is larger than the diameter R of the wafer W. Becomes smaller. Therefore, one wafer W can be supported by the four support members 45 at the same height. Accordingly, the comb-shaped members 43RB, 43RD, 43LA, and 43LC are second supports that can be supported in a state where the same number of wafers W as the number of wafers W that can be accommodated in one carrier C (see FIG. 1) are stacked. Part 47 is configured.

6A to 6G are schematic side views showing an example of operations at the time of wafer reception and delivery to the spin chuck by the hand of the center robot.
As shown in FIG. 6A, a processed wafer W is held on the six chuck pins 33 of the spin chuck 31. The three lift pins 34 are immersed in the spin base 32. On the other hand, an unprocessed wafer W is held on the upper side of the hand 9 of the center robot 8. In this state, the hand 9 is advanced toward a position above the spin chuck 31 in the processing chamber 13.

As shown in FIG. 6B, the hand 9 advances to a position where the unprocessed wafer W held by the hand 9 matches the processed wafer W held by the chuck pins 33 in plan view, and stops at that position. Is done.
Subsequently, as shown in FIG. 6C, the hand 9 is lowered to a position where the wafer W is arranged in an area surrounded by the four clamping members 24 of the hand 9. Then, after the hand 9 is lowered, the four clamping members 24 are brought close to each other, and the wafer W is held below the hand 9 by the four clamping members. On the other hand, the chuck pins 33 are rotated, and the holding of the wafer W by the chuck pins 33 is released. Thereby, the reception of the wafer W from the chuck pins 33 by the hand 9 is achieved.

  Further, the lift arm 38 of each lift pin 34 is rotated to a position facing the peripheral edge of the lower surface of the wafer W. Then, each lift pin 34 is advanced (raised) upward. In the middle of this advancement, the lift arm 38 comes into contact with the peripheral edge of the lower surface of the wafer W held on the upper side of the hand 9. Thereafter, when the lift pins 34 are further advanced, the wafer W is lifted to a lift position higher than the holding position of the wafer W by the hand 9 as shown in FIG. 6D. Thereby, delivery of the wafer W to the lift pins 34 by the hand 9 is achieved.

Thereafter, as shown in FIG. 6E, the hand 9 is slightly raised.
Then, as shown in FIG. 6F, the hand 9 is retracted from the processing chamber 13.
After the hand 9 is retracted, the lift pin 34 is lowered until it is immersed in the spin base 32. In the middle of the lowering of the lift pins 34, the peripheral edge portion of the lower surface of the wafer W supported by the lift arm 38 contacts the chuck pins 33, and the wafer W is transferred from the lift arms 38 onto the chuck pins 33. Thereafter, the chuck pins 33 are rotated, and the wafer W is held by the chuck pins 33.

  As described above, in the substrate processing apparatus 1, the four support protrusions 23 (first holding mechanism) and the four clamping members 24 (second holding mechanism) for holding the wafer W are respectively provided on the upper and lower surfaces of one hand 9. ) Is provided. Therefore, the wafer 9 can be received and delivered to the spin chuck 31 by the hand 9 according to the four operation steps 1 to 4 in which the number of steps is one less than that of the substrate processing apparatus adopting the double-hand configuration. it can.

1. With the wafer W held by the four support protrusions 23 (first holding mechanism), the hand 9 is advanced to a position facing the spin chuck 31.
2. The wafer W supported by the spin chuck 31 is held by the four clamping members 24 (second holding mechanism), and the wafer W is received by the four clamping members 24 from the spin chuck 31.

3. The wafer W is transferred from the four support protrusions 23 to the spin chuck 31 before and after the reception of the wafer W by the four clamping members 24.
4). The hand 9 is retracted from a position facing the spin chuck 31.
Therefore, the time required for receiving and transferring the wafer W to and from the spin chuck 31 can be shortened, whereby the throughput of the substrate processing apparatus 1 can be improved.

7A to 7D are schematic side views showing an example of operations at the time of receiving and delivering a wafer to and from the buffer by the hand of the center robot.
7A to 7D show a state in which the first support portion 46 is disposed relatively upward and the second support portion 47 is disposed relatively downward. The first support portion 46 shows a state where four unprocessed wafers W are supported by a total of 16 support members 45 in the first to fourth stages from the top. Hereinafter, on the assumption of the states shown in FIGS. 7A to 7D, operations when the wafer 9 is received and delivered to the buffer 12 by the hand 9 of the center robot 8 will be described.

  After the wafer W is received and delivered to the spin chuck 31 (chuck pins 33), the processed wafer W is held below the hand 9 as shown in FIGS. 6F and 7A. The hand 9 advances toward the second support portion 47 of the buffer 12. Specifically, as shown in FIG. 7A, the wafer W enters between the lowermost support member 45 that does not support the wafer W in the second support portion 47 and the support member 45 directly above the lower support member 45. Hand 9 advances. At this time, the four holding members 24 holding the processed wafer W function as the first holding mechanism, and the four support protrusions 23 function as the second holding mechanism.

Thereafter, as shown in FIG. 7B, the hand 9 is lowered to a position where the wafer W held on the lower side of the hand 9 contacts the support member 45. After the hand 9 is lowered, the four clamping members 24 are separated, and the holding of the wafer W by the four clamping members is released. Thereby, delivery of the wafer W to the support member 45 of the 2nd support part 47 by the hand 9 is achieved.
Next, as shown in FIG. 7C, the hand 9 is raised. In the middle of ascending of the hand 9, the four support protrusions 23 of the hand 9 come into contact with the peripheral edge portion of the lower surface of the lowermost wafer W supported by the first support portion 46.

  The hand 9 is raised from a position where the support protrusion 23 is in contact with the lower surface of the wafer W to a position slightly above. Thereby, as shown in FIG. 7D, the wafer W is separated from the support member 45 of the first support portion 46, and reception of the wafer W from the support member 45 of the first support portion 46 by the hand 9 is achieved. Then, the hand 9 is retracted from the buffer 12 and advanced again toward the processing chamber 13 (spin chuck 31).

8A to 8E are schematic side views showing an example of the operation when the vertical positions of the first support portion and the second support portion of the buffer are switched.
In the following, the vertical positions of the first support part 46 and the second support part 47 from the state where the first support part 46 is disposed relatively upward and the second support part 47 is disposed relatively downward are described. The operation will be described by taking the case of replacement as an example.

By repeating the operations shown in FIGS. 7A to 7D, the processed wafers W are successively transferred from the hand 9 of the center robot 8 to the second support unit 47, and the unprocessed wafers W are transferred to the first support unit. 46 is received by the hand 9.
When the transfer of the wafer W to the second support portion 47 proceeds, the maximum number of wafers W are supported on the second support portion 47 (full load state) as shown in FIG. 8A.

  When the maximum number of wafers W are supported by the second support part 47, all the wafers W supported by the second support part 47 are unloaded by the indexer robot 5 (see FIG. 1). Therefore, as shown in FIG. 8B, the second support portion 47 is in an empty state in which no wafer W is supported. The wafer W transferred by the indexer robot 5 is accommodated in the carrier C (see FIG. 1).

Next, as shown in FIG. 8C, the four comb-like members 43RB, 43RD, 43LA, and 43LC constituting the second support portion 47 are slid toward the outside in the horizontal direction orthogonal to the access direction.
Thereafter, as shown in FIG. 8D, the comb-shaped members 43RB, 43RD, 43LA, and 43LC are raised together with the slide plates 42RB, 42RD, 42LA, and 42LC, respectively. On the other hand, the four comb-like members 43RA, 43RC, 43LB, and 43LD constituting the first support portion 46 are lowered.

8E, when the four comb-like members 43RB, 43RD, 43LA, and 43LC are slid to the innermost side in the horizontal direction orthogonal to the access direction, the first support portion 46 and the second support portion 47 Swapping of the upper and lower positions is achieved.
Thereafter, the transfer of the wafers W to the first support unit 46 by the hand 9 is continued until the maximum number of wafers W are supported by the first support unit 46 disposed relatively below. When the maximum number of wafers W are supported by 46, the vertical positions of the first support part 46 and the second support part 47 are switched again by the same operation as described above.

Further, the unprocessed wafer W is delivered to the first support unit 46 and the second support unit 47 by the indexer robot 5 at an appropriate timing.
As described above, in the substrate processing apparatus 1, the four support protrusions 23 (second holding mechanism) and the four clamping members 24 (first holding mechanism) for holding the wafer W are respectively provided on the upper and lower surfaces of one hand 9. ) Is provided. Therefore, the wafer 9 can receive and transfer the wafer W to and from the buffer 12 according to the four operation steps 1 to 4, which has one fewer step than the substrate processing apparatus adopting the double-hand configuration. .

In a state where the wafer W is held by the four clamping members 24 (first holding mechanism), the hand 9 is advanced to a position facing the support member 45 of the buffer 12.
2. The wafer W supported by the support member 45 of the buffer 12 is held by the four support protrusions 23 (second holding mechanism), and the wafer W is received by the four support protrusions 23 from the support member 45 of the buffer 12.

3. Before and after the reception of the wafer W by the four support members 23, the wafer W is delivered from the four clamping members 23 to the support member 45 of the buffer 12.
4). The hand 9 is retracted from a position facing the support member 45 of the buffer 12.
Therefore, the time required for receiving and transferring the wafer W to and from the buffer 12 can be shortened, whereby the throughput of the substrate processing apparatus 1 can be improved.

Further, since the indexer robot 5 can collectively transfer the maximum number of wafers W that can be supported by the first support unit 46, it is necessary to transfer the wafers W from the first support unit 46 and the second support unit 47. Time can be shortened. As a result, the throughput of the substrate processing apparatus 1 can be further improved.
FIGS. 9A to 9G are schematic side views showing another example of operations at the time of wafer reception and delivery to the spin chuck by the hand of the center robot.

  As shown in FIG. 9A, the processed wafer W is held on the six chuck pins 33 of the spin chuck 31. The three lift pins 34 are immersed in the spin base 32. On the other hand, an unprocessed wafer W is held below the hand 9 of the center robot 8. In this state, the hand 9 is advanced toward a position above the spin chuck 31 in the processing chamber 13.

  Prior to the advancement of the hand 9, the chuck pins 33 are rotated, and the holding of the wafer W by the chuck pins 33 is released. Further, the lift arm 38 of each lift pin 34 is rotated to a position facing the peripheral edge of the lower surface of the wafer W. Then, each lift pin 34 is advanced (raised) upward. In the middle of this advancement, the lift arm 38 comes into contact with the peripheral edge of the lower surface of the wafer W. Thereafter, when the lift pins 34 are further advanced, the wafer W is lifted to a lift position above the holding position of the wafer W by the chuck pins 33 as shown in FIG. 9B.

Thereafter, as shown in FIG. 9B, the hand 9 is advanced to a position where the unprocessed wafer W held by the hand 9 and the processed wafer W held by the chuck pins 33 coincide with each other in plan view.
Subsequently, as shown in FIG. 9C, the hand 9 is lowered to a position where the lower surface of the wafer W held by the hand 9 contacts the six chuck pins 33.

After the hand 9 is lowered, as shown in FIG. 9D, the four clamping members 24 are separated, and the holding of the wafer W by the four clamping members is released. Thereby, the delivery of the wafer W to the chuck pins 33 by the hand 9 is achieved. Thereafter, the chuck pins 33 are rotated, and the wafer W is held by the chuck pins 33.
The lift pins 34 are lowered until they are immersed in the spin base 32. As shown in FIG. 9E, the peripheral portion of the lower surface of the wafer W supported by the lift arm 38 abuts on the four support protrusions 23 of the hand 9 while the lift pins 34 are being lowered, and the wafer W is placed on the lift arm 38. To the chuck pin 33. Thereby, the delivery of the wafer W to the chuck pins 33 by the hand 9 is achieved.

Thereafter, as shown in FIG. 9F, the hand 9 is slightly raised.
Then, as shown in FIG. 9G, the hand 9 is retracted from the processing chamber 13.
As described with reference to FIGS. 9A to 9G, in another example of the operation at the time of receiving and transferring the wafer W, the number of steps is one less than that of the substrate processing apparatus adopting the double-hand configuration. According to the four operation steps 1 to 4, the wafer 9 can be received and delivered to the spin chuck 31 by the hand 9.

1. With the wafer W held by the four clamping members 24 (first holding mechanism), the hand 9 is advanced to a position facing the spin chuck.
2. The wafer W supported by the spin chuck 31 is held by the four support protrusions 23 (second holding mechanism), and the wafer W is received by the four support protrusions 23 from the spin chuck 31.

3. Before and after receiving the wafer W by the four support protrusions 23, the wafer W is transferred from the four clamping members 24 to the spin chuck 31.
4). The hand 9 is retracted from a position facing the spin chuck 31.
Therefore, the time required for receiving and transferring the wafer W to and from the spin chuck 31 can be shortened, whereby the throughput of the substrate processing apparatus 1 can be improved.

FIGS. 10A to 10D are schematic side views showing another example of operations at the time of receiving and delivering a wafer to and from the buffer by the hand of the center robot.
10A to 10D show a state in which the first support portion 46 is disposed relatively upward and the second support portion 47 is disposed relatively downward. Hereinafter, on the assumption of the state shown in FIGS. 10A to 10D, operations at the time of receiving and delivering the wafer W to the buffer 12 by the hand 9 of the center robot 8 will be described.

  After the wafer W is received and delivered to the spin chuck 31 (chuck pins 33), the processed wafer W is held on the upper side of the hand 9, as shown in FIGS. 9G and 10A. The hand 9 advances toward the first support portion 46 of the buffer 12. Specifically, as shown in FIG. 10A, the wafer W is arranged at a position slightly spaced upward with respect to the uppermost support member 45 that does not support the wafer W in the first support portion 46. Then, the hand 9 is advanced. At this time, the four support protrusions 23 holding the processed wafer W function as the first holding mechanism, and the four holding members 24 function as the second holding mechanism.

Thereafter, the hand 9 is lowered. In the middle of the lowering, as shown in FIG. 10B, the support member 45 comes into contact with the peripheral edge of the lower surface of the wafer W held by the hand 9, and the wafer W is transferred from the hand 9 to the support member 45. Thereby, delivery of the wafer W to the support member 45 of the 1st support part 46 by the hand 9 is achieved.
As shown in FIG. 10C, the hand 9 is lowered to a position where the wafer W is disposed in an area surrounded by the four clamping members 24 of the hand 9. Then, after the hand 9 is lowered, the four clamping members 24 are brought close to each other, and the wafer W is held below the hand 9 by the four clamping members.

Thereafter, as shown in FIG. 10D, the hand 9 is slightly raised. Thereby, the wafer W is separated from the support member 45, and the wafer 9 is received from the support member 45 by the hand 9. Then, the hand 9 is retracted from the buffer 12 and advanced again toward the processing chamber 13 (spin chuck 31).
11A to 11E are illustrative side views illustrating another example of the operation when the vertical positions of the first support portion and the second support portion of the buffer are switched.

In the following, the vertical positions of the first support part 46 and the second support part 47 from the state where the first support part 46 is disposed relatively upward and the second support part 47 is disposed relatively downward are described. The operation will be described by taking the case of replacement as an example.
By repeating the operations shown in FIGS. 10A to 10D, the processed wafers W are successively transferred from the hand 9 of the center robot 8 to the first support unit 46, and the unprocessed wafers W are transferred to the second support unit. It is received by hand 9 from 47.

When the transfer of the wafer W to the first support 46 proceeds, the maximum number of wafers W are supported on the first support 46 as shown in FIG. 11A.
When the maximum number of wafers W are supported on the first support unit 46, all the wafers W supported by the first support unit 46 are unloaded by the indexer robot 5 (see FIG. 1). Therefore, as shown in FIG. 11B, the first support unit 46 is in an empty state in which no wafer W is supported. The wafer W transferred by the indexer robot 5 is accommodated in the carrier C (see FIG. 1).

Next, as shown in FIG. 11C, the four comb-like members 43RA, 43RC, 43LB, and 43LD that constitute the first support portion 46 are slid toward the outside in the horizontal direction orthogonal to the access direction.
Thereafter, as shown in FIG. 11D, the comb-shaped members 43RA, 43RC, 43LB, and 43LD are lowered together with the slide plates 42RA, 42RC, 42LB, and 42LD, respectively. On the other hand, the four comb-like members 43RB, 43RD, 43LA, and 43LC constituting the second support portion 47 are raised.

11E, when the four comb-shaped members 43RA, 43RC, 43LB, and 43LD are slid to the innermost side in the horizontal direction orthogonal to the access direction, the first support portion 46, the second support portion 47, Swapping of the upper and lower positions is achieved.
Thereafter, the transfer of the wafers W to the second support unit 47 by the hand 9 is continued until the maximum number of wafers W are supported by the second support unit 47 disposed relatively upward. When the maximum number of wafers W are supported by 47, the vertical positions of the first support part 46 and the second support part 47 are switched again by the same operation as described above.

As described with reference to FIGS. 10A to 10D, in another example of the operation at the time of receiving and delivering the wafer, the number of steps is one less than that of the substrate processing apparatus adopting the double hand configuration 4. According to two operation steps 1 to 4, the reception and transfer of the wafer W to the buffer 12 by the hand 9 can be achieved.
In a state where the wafer W is held by the four support protrusions 23 (first holding mechanism), the hand 9 is advanced to a position facing the support member 45 of the buffer 12.

2. The wafer W supported by the support member 45 of the buffer 12 is held by the four holding members 24 (second holding mechanism), and the wafer W is received by the four holding members 24 from the support member 45 of the buffer 12.
3. Before and after the reception of the wafer W by the four clamping members 24, the wafer W is delivered from the four support protrusions 23 to the support member 45 of the buffer 12.

4). The hand 9 is retracted from a position facing the support member 45 of the buffer 12.
Therefore, the time required for receiving and transferring the wafer W to and from the buffer 12 can be shortened, whereby the throughput of the substrate processing apparatus 1 can be improved.
FIG. 12 is a perspective view showing another structure of the buffer.

The buffer 70 shown in FIG. 12 can be employed in the substrate processing apparatus 1 shown in FIG. 1 instead of the buffer 12 shown in FIG.
The buffer 70 includes four belt units 71. The four belt units 71 are provided in two portions at two positions spaced apart in the horizontal direction orthogonal to the access direction. The two belt units 71 at each position are arranged side by side with an interval in the access direction.

  Each belt unit 71 includes a pair of pulleys 72 facing in the vertical direction, an endless belt 73 wound between the pair of pulleys 72, and a plurality of standing on the outer surface of the belt 73 at regular intervals. The support plate 74 is provided. The upper pulleys 72 of the four belt units 71 are arranged at the same height position so that the rotation shaft 75 extends in the access direction. Further, the lower pulleys 72 of the four belt units are arranged at the same height position so that the rotation shaft 75 extends in the access direction. A rotational driving force is input from a motor (not shown) included in the rotation driving mechanism 52 (see FIG. 5) to the rotating shaft 75 of one pulley 72 on the upper side or the lower side of each belt unit 71. ing.

  The four belt units 71 travel so that the four support plates 74 are always included in the same horizontal plane set between them by the rotational driving force input to the rotating shaft 75 of the pulley 72. The size of the support plate 74 is designed so that the distance between the support plates 74 of the belt units 71 facing each other is smaller than the diameter R of the wafer W in the horizontal direction orthogonal to the access direction. Therefore, one wafer W can be supported by the four support plates 74 included in the same horizontal plane.

Further, in the region surrounded by the four belt units 71, the belt 73 has the same number of support plates 74 as the number of wafers W that can be accommodated in the two carriers C in the linearly extending portion of the belt 73. The perimeter and the spacing between the support plates 74 are designed. As a result, two wafers W of the carrier C can be supported on the buffer 70.
In the support plate 74 provided on the linearly extending portion of the belt 73, the same number of support plates 74 as the number of wafers W that can be accommodated in one carrier C from the top are defined as the first support portions 76, and the first support portions are provided. The remaining support plate 74 below 76 is used as the second support portion 77, and one of the first support portion 76 and the second support portion 77 is supported by the operation of the hand 9 (see FIG. 1) similar to the case of the buffer 12. The wafer W can be delivered from the hand 9 to the plate 74. Further, the wafer 9 can be received by the hand 9 from the support plate 74 below or above the support plate 74 to which the wafer W has been transferred.

  For example, when the maximum number of processed wafers W are supported on the first support part 76, the belt 73 is transported after all the wafers W supported on the first support part 76 are unloaded. The second support part 77 can be lifted by running the second support part 77, and a new second support plate 74 comprising the same number of support plates 74 as the number of wafers W that can be accommodated in one carrier C is provided below the second support part 77. One support 76 can be provided.

  Further, when the maximum number of processed wafers W are supported on the second support part 77, all the wafers W supported on the second support part 77 are unloaded and then the belt 73. , The first support portion 76 can be lowered, and a new second support plate 74 comprising the same number of support plates 74 as the number of wafers W that can be accommodated in one carrier C can be lowered above the first support portion 76. Two support portions 77 can be provided.

Therefore, according to this configuration, it is possible to achieve switching of the vertical positions of the first support portion 76 and the second support portion 77 with a simple configuration.
The description of the embodiment of the present invention is as described above, but various modifications can be made to the above-described embodiment within the scope of the matters described in the claims.
For example, in the above-described embodiment, the first holding mechanism and the second holding mechanism of the hand 9 may be a mechanism that holds the wafer W by suction.

1 Substrate processing equipment 5 Indexer robot (substrate batch transfer mechanism)
9 hand 12 buffer (support mechanism, multiple substrate support mechanism)
23 Support protrusion (first holding mechanism or second holding mechanism)
24 Nipping member (second holding mechanism or first holding mechanism)
26 Contact / separation mechanism (second holding mechanism or first holding mechanism)
31 Spin chuck (support mechanism, substrate holding rotation mechanism)
32 Spin base 33 Chuck pin 34 Lift pin 45 Support member 46 1st support part 47 2nd support part 51 Control part (hand control part, rotation control part)
52 Rotation drive mechanism (rotation mechanism)
70 Buffer (support mechanism, multiple substrate support mechanism)
72 pulley (rotation mechanism)
73 Belt (rotation mechanism)
74 Support plate (support member)
76 1st support part 77 2nd support part W Wafer

Claims (9)

A support mechanism for supporting the substrate;
A first holding mechanism for holding the substrate on one of the upper surface and the lower surface, the first holding mechanism for holding the substrate on the other of the upper surface and the lower surface; A hand comprising a second holding mechanism;
With the substrate held by the first holding mechanism, the hand advances to a position facing the support mechanism, the substrate supported by the support mechanism is held by the second holding mechanism, and After receiving the substrate from the support mechanism, releasing the holding of the substrate by the first holding mechanism, and delivering the substrate to the support mechanism, the hand is retracted from a position facing the support mechanism. A substrate processing apparatus including a hand control unit for controlling operation. The first holding mechanism is provided on the upper surface of the hand,
The substrate processing apparatus according to claim 1, wherein the second holding mechanism is provided on a lower surface of the hand. A substrate holding and rotating mechanism for holding and rotating the substrate;
The substrate holding and rotating mechanism includes a base that is rotatable about a rotation axis extending in the vertical direction, a plurality of chuck pins that are erected on the upper surface of the base and that hold and release the substrate in cooperation, and the upper surface of the base A plurality of lift pins for raising and lowering the substrate between a position where the substrate is held by the chuck pins and a lift position above the chuck pin,
The support mechanism is the substrate holding and rotating mechanism,
The first holding mechanism delivers the substrate to the plurality of lift pins,
The substrate processing apparatus according to claim 2, wherein the second holding mechanism receives a substrate from the plurality of chuck pins. A plurality of substrate support mechanisms each having a plurality of support members provided at regular intervals in the vertical direction, each supporting a peripheral edge of the substrate from below;
The plurality of support members are composed of a first support portion made up of a predetermined number of support member groups that are continuous in the vertical direction and the remaining support member groups, and are arranged in the vertical direction with respect to the first support portion. A second support part,
The support mechanism is the multiple substrate support mechanism,
The first holding mechanism delivers the substrate in order from the top to the support member of the first support part or the second support part disposed relatively above,
The substrate processing apparatus according to claim 2, wherein the second holding mechanism receives a substrate from the support member positioned below the support member to which the substrate has been transferred by the first holding mechanism. The first holding mechanism is provided on the lower surface of the hand,
The substrate processing apparatus according to claim 1, wherein the second holding mechanism is provided on an upper surface of the hand. A substrate holding and rotating mechanism for holding and rotating the substrate;
The substrate holding and rotating mechanism includes a base that is rotatable about a rotation axis extending in the vertical direction, a plurality of chuck pins that are erected on the upper surface of the base and that hold and release the substrate in cooperation, and the upper surface of the base A plurality of lift pins for raising and lowering the substrate between a position where the substrate is held by the chuck pins and a lift position above the chuck pin,
The support mechanism is the substrate holding and rotating mechanism,
The first holding mechanism delivers the substrate to the plurality of chuck pins,
The substrate processing apparatus according to claim 5, wherein the second holding mechanism receives a substrate from the plurality of lift pins. A plurality of substrate support mechanisms each having a plurality of support members provided at regular intervals in the vertical direction, each supporting a peripheral edge of the substrate from below;
The plurality of support members are composed of a first support portion made up of a predetermined number of support member groups that are continuous in the vertical direction and the remaining support member groups, and are arranged in the vertical direction with respect to the first support portion. A second support part,
The support mechanism is the multiple substrate support mechanism,
The first holding mechanism delivers the substrate in order from the bottom to the support member of the first support part or the second support part disposed relatively below,
The substrate processing apparatus according to claim 5, wherein the second holding mechanism receives a substrate from the support member positioned above the support member to which the substrate has been transferred by the first holding mechanism. A rotation mechanism for switching the vertical positions of the first support part and the second support part;
A rotation control unit that drives the rotation mechanism in response to the transfer of the substrate from the first holding mechanism to all the support members of the first support unit or the second support unit; The substrate processing apparatus of Claim 4 or 7 containing. A support mechanism for supporting the substrate, a first holding mechanism for holding the substrate on one of the upper surface and the lower surface, which is provided so as to be able to advance and retreat with respect to the support mechanism and has an upper surface and a lower surface. , A method of delivering a substrate to and from a hand having a second holding mechanism for holding the substrate on the other of them,
An advancing step of advancing the hand to a position facing the support mechanism in a state where the substrate is held by the first holding mechanism;
A receiving step of receiving the substrate from the support mechanism by holding the substrate supported by the support mechanism by the second holding mechanism after the advancement step;
After the advance step, the step of releasing the holding of the substrate by the first holding mechanism and delivering the substrate to the support mechanism;
A substrate delivery method comprising: a step of retracting the hand from a position facing the support mechanism after the receiving step and the delivering step.

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