JP2010218955A - Card connector - Google Patents

Abstract

There is provided a card connector provided with a card heat radiation mechanism having a high heat radiation effect despite a simple structure without hindering the miniaturization of the card connector.
A first housing portion and a second housing portion are connected to each other via a hinge portion and can be folded, and an IC card having a heat radiating pad portion formed on the second housing portion is mounted. A connector base having a plurality of contacts to be connected to contact pads formed on the first housing portion of the IC card, a top plate and left and right side walls, and overlapping the connector base By combining, a card insertion slot into which the first housing portion of the IC card is inserted and a metal cover that forms a card housing space for housing a part of the first housing portion are provided. In a state where a part of the body part is accommodated in the card accommodation space, it is located between the first casing part and the second casing part, and is formed on the second casing part by the elastic contact piece formed on the metal cover. In contact with the heat dissipation pad
[Selection] Figure 2

Description

  The present invention relates to a card connector, and more particularly to a card connector including a card heat dissipation mechanism for a card to be mounted.

  2. Description of the Related Art Electronic devices such as mobile phones, portable music or video playback devices, digital cameras, and the like are equipped with memory cards with built-in integrated circuits and function expansion cards (hereinafter simply referred to as “IC cards”). Conventionally, a card connector for electrically connecting the IC card and an electronic device is known. Incidentally, in recent years, high-speed signal transmission between an electronic device and an IC card and an increase in memory capacity are required. As a result of high-speed signal transmission and large capacity, it is conceivable that power consumption increases and the IC card itself generates heat. The heat generated by the IC card itself may cause expansion, distortion or damage of the molded IC card itself, or poor electrical connection between the external contact of the IC card and the contact of the card connector. Therefore, as shown in Patent Document 1, in order to absorb the heat generated by the IC card, the IC card mounted on the card connector is brought into contact with the heat sink to dissipate the heat from the IC card, and the IC card is brought to a predetermined temperature or lower. Maintaining card heat dissipation mechanisms are known.

JP 2005-322498 A

  As shown in Patent Document 1, in the conventional card heat dissipation mechanism, a heat sink is brought into contact with the memory card from above the card after or along with the insertion of the card. Such a heat dissipation mechanism has a complicated structure, which makes it difficult to manufacture the card connector and increases the manufacturing cost. In addition, since a space for providing a card heat dissipation mechanism is required, the card connector is increased in size, which hinders downsizing of an electronic device to which the card connector is attached.

  In view of the above problems, an object of the present invention is to provide a card connector provided with a card heat radiation mechanism having a high heat radiation effect without obstructing the miniaturization of the card connector and having a simple structure.

  In order to achieve the above object, in the card connector according to the present invention, the first housing portion and the second housing portion are connected via the hinge portion, and can be folded. A card connector for mounting an IC card in which a front surface of the card portion and a back surface of the second housing portion are opposed to each other and a heat radiating pad portion is formed on the back surface of the second housing portion, the first housing of the IC card A connector base on which a plurality of contacts electrically connected to contact pads formed on the back surface of the unit are arranged; and at least a top plate and left and right side walls; A card insertion slot into which the first housing portion is inserted and a metal cover that forms a card housing space for housing at least a part of the first housing portion of the IC card. The metal cover includes the IC And the metal cover is positioned between the first housing part and the second housing part in a state in which the card is folded and a part of the first housing part is housed in the card housing space. The elastic contact piece formed on the top plate is in contact with the heat dissipating pad portion formed on the second housing portion.

  The card connector according to the present invention extends from the metal cover top plate to a connecting portion having a height greater than the thickness of the second housing portion of the IC card, and extends from the upper end of the connecting portion in parallel to the top plate. A holding member including an existing holding piece is further provided.

  Furthermore, the card connector according to the present invention is formed in a pair so that the connecting portions of the holding members face each other, and the holding pieces of the holding members hold the side portions of the second casing portion. Alternatively, it may be formed so as to come into contact with the rear end surface of the second casing portion, and the holding piece of the holding member may hold the rear end portion of the second casing portion.

  Moreover, it is preferable that the holding piece of the holding member is formed with an inclined surface that is inclined upward toward the card insertion slot at the rear end.

  A card connector according to the present invention is a card connector in which a first housing portion and a second housing portion are connected via a hinge portion, and the IC card is mounted on a heat dissipation pad portion of a foldable IC card. It is comprised so that the elastic contact piece formed in the metal cover may contact. Accordingly, the card connector of the present invention has a simple structure, and can effectively dissipate heat generated from the IC card through the metal cover of the card connector, thereby suppressing deformation due to expansion of the IC card itself. In addition, the electrical contact between the IC card and the contact is reliably maintained.

1A and 1B show an IC card mounted on a card connector according to the present invention, in which FIG. 1A is a perspective view of the IC card in an open state, and FIG. 2B is a perspective view of the IC card in a closed state. . The card connector which concerns on the 1st Example of this invention is shown, (a) is a perspective view of the card connector in the state in which the IC card is not mounted | worn, (b) is the IC card of FIG. It is a perspective view of the card connector in the state of being. The card connector which concerns on 2nd Example of this invention is shown, (a) is a perspective view of the card connector in the state in which the IC card is not mounted | worn, (b) is the IC card of FIG. It is a perspective view of the card connector in the state of being. The card connector which concerns on the 3rd Example of this invention is shown, (a) is a perspective view of the card connector of the state in which the IC card of FIG. 1 is mounted | worn, (b) is an IC card mounted | worn. It is a perspective view of the card connector of the state which is not. The card connector which concerns on the 4th Example of this invention is shown, (a) is a perspective view of the card connector in the state in which the IC card is not mounted | worn, (b) is the IC card of FIG. It is a perspective view of the card connector in the state of being.

  Several preferred embodiments of the card connector according to the present invention will be described with reference to FIGS.

  1A and 1B show an IC card mounted on a card connector according to the present invention. FIG. 1A is a perspective view of an IC card in an open state, and FIG. 1B is an IC card in a closed state. It is a perspective view. FIG. 2 shows a card connector according to the first embodiment of the present invention, wherein (a) is a perspective view of the card connector in a state where the IC card of FIG. 1 is mounted, and (b) is an IC. It is a perspective view of a card connector in the state where a card is not inserted. 3 to 5 show the card connectors according to the second to fourth embodiments of the present invention, respectively, and (a) is a perspective view of the card connector in a state where no IC card is mounted. (B) is a perspective view of the card connector in a state where the IC card of FIG. 1 is mounted.

  As shown in FIGS. 1A and 1B, an IC card 10 attached to a card connector according to the present invention is a foldable IC card. The IC card 10 according to this embodiment includes a first housing portion 11 and a second housing portion 12 that is foldably connected to the first housing portion 11 via a hinge portion 14. When the IC card 10 according to this embodiment is attached to the card connector 20, as shown in FIG. 1B, the IC card 10 is in a closed state, that is, a folded state. At this time, the IC card 10 has the first housing part 11 positioned below and the second housing part 12 positioned above. The second housing portion 12 of the IC card 10 is folded so that the front surface 12a faces upward and the back surface 12b faces downward. Therefore, the back surface 12b of the second housing portion 12 is the first housing. It is in a state of facing the surface 11 a of the part 11. When the IC card 10 is folded, the front surface 11a of the first housing portion 11 and the back surface 12b of the second housing portion 12 that are in a state of facing each other are at least the top plate 41 of the metal cover 40 of the card connector 20. It is preferable to be arranged so as to be spaced apart by a thickness. Further, the rear end surface 19 of the second housing portion 12 of the IC card 10 faces rearward when the IC card 10 shown in FIG. 1A is in an open state. As shown in (b), when folded, it is in a state of facing forward.

  The first casing 11 is provided with a notch 16, a write protect switch 17, and a card lock recess 18 for preventing erroneous insertion, as in the conventional IC card. Although not shown in FIGS. 1A and 1B, a plurality of contact pads (external contacts) are parallel to the front end surface 15 on the back surface of the first housing portion 11 of the IC card 10. It is arranged.

  When a configuration in which heat is radiated from the upper surface of the IC card 10 (in this embodiment, the surface 12a of the second housing 12 in the present embodiment) to the foldable IC card 10 via a heat sink is applied to the card connector, Thus, the height of the entire electronic device is increased. Further, since the height of the IC card 10 is increased due to the folding, the heat transfer path is lengthened, the heat hardly escapes, and the heat dissipation effect is inferior.

  Therefore, in the present embodiment, as shown in FIG. 1A, heat dissipating pad portions 13 a and 13 b for dissipating heat generated from the IC card 10 are provided on the back surface 12 b of the second housing portion 12. . In this embodiment, the heat dissipating pad portions 13a and 13b are provided in pairs on the left and right side portions of the back surface 12b of the second housing portion 12 as shown in FIG. It is not limited. For example, the heat dissipating pad part may be provided in a pair at the center part of the back surface 12b of the second housing part 12, or may be provided only one or two or more. Also good. By disposing the heat dissipating pad portions 13a and 13b on the back surface 12b of the second housing portion 12, it is possible to efficiently dissipate heat generated from the folding IC card 10 as in this embodiment. That is, as described later, the metal cover 40 of the card connector 20 is interposed between the first housing part 11 and the second housing part 12 of the folded IC card 10. Therefore, the first housing portion 11 of the IC card 10 comes into contact with the metal cover 40 of the card connector 20 from the lower surface side, and the second housing portion 12 comes into contact with the metal cover 40 of the card connector 20 from the upper surface side via the heat radiation pad portions 13a and 13b. Thereby, heat is conducted to the electronic device to which the card connector 20 is attached through the metal cover 40, and the heat generated from the IC card 10 can be radiated to the electronic device.

  FIGS. 2A and 2B show an example of a card connector 20 according to the present invention suitable for mounting the foldable IC card 10.

  As shown in FIG. 2A, the card connector 20 is roughly composed of a connector base 30 and a metal cover 40 made of synthetic resin. In the card connector 20 according to the present embodiment, a card accommodation space that can accommodate at least a part of the first housing portion 11 of the IC card 10 by overlapping the metal cover 40 so as to cover the connector base 30 from above. Is formed. The rear end of the card accommodation space is open toward the rear, and the card on which the front end face 15 of the first casing 11 is guided so that the first casing 11 of the IC card 10 can be accommodated. It is formed as an insertion port 25.

  Although not shown in FIG. 2A in front of the connector base 30, a plurality of contacts held in a cantilever shape are arranged in parallel to each other in the front-rear direction, as in the conventional example. The plurality of contacts respectively correspond to the plurality of contact pads formed on the back surface of the first housing part 11 of the IC card 10 and are electrically connected to the contact pads. Although not shown, the connector base 30 is provided with a lock mechanism for preventing the IC card 10 from being removed together with the card lock recess 18 and a detecting means for detecting the position of the write protect switch 17. ing. The connector base 30 may further be provided with a card eject mechanism for helping to remove the IC card 10 from the card connector 10.

  The metal cover 40 in this embodiment is made of, for example, a copper alloy such as beryllium copper, and roughly includes a top plate 41 and left and right side walls 42a and 42b. As described above, the metal cover 40 is overlapped with the connector base 30 to constitute the card connector 20. Further, as shown in FIG. 1B, the metal cover 40 has a first housing portion 11 of the IC card 10 in which the top plate 41 is folded when the IC card 10 is attached to the card connector 20. And the second casing portion 12.

  In the present embodiment, the top plate 41 has a pair of elastic contact pieces 43 a and 43 b formed corresponding to the heat radiation pad portions 13 a and 13 b formed on the back surface 12 b of the second housing portion 12 of the IC card 10. Is formed. In addition, a pair of holding pieces 45 a and 45 b that constitute a holding member for holding the second housing portion 12 of the folded IC card 10 on the top plate 41 is formed.

  The pair of elastic contact pieces 43a and 43b are cut and raised forward from the top plate 41 in a cantilever shape. That is, each of the pair of elastic contact pieces 43 a and 43 b is formed so that the front end can be displaced in the vertical direction with the free end as a free end, and the rear end is connected to the top plate 41. The pair of elastic contact pieces 43a and 43b are formed corresponding to the pair of heat radiation pad portions 13a and 13b provided on the back surface 12b of the second housing portion 12 of the IC card 10 to be mounted. The pair of elastic contact pieces 43a and 43b are preferably formed such that, when the IC card 10 is mounted, the free end sides thereof are in surface contact with the heat radiation pads 13a and 13b. However, the pair of elastic contact pieces 43a and 43b are designed so that the free end sides of the contact pieces 43a and 43b do not enter the card accommodation space when they are in surface contact with the corresponding heat radiation pads 13a and 13b. There is a need. As described above, the heat dissipating pad portions 13a and 13b provided on the IC card 10 are not limited to being provided in pairs. Therefore, the elastic contact pieces 43a and 43b are also provided in pairs. It is not limited to. That is, the elastic contact piece formed on the top plate 41 may be formed corresponding to the heat dissipating pad formed on the IC card 10.

  The pair of holding pieces 45a and 45b are cut inward from the top plate 41 (in FIG. 2A, the right holding piece 45a is directed to the left and the left holding piece 45b is directed to the right). It has been awakened. The pair of holding pieces 45a and 45b are provided behind the pair of elastic contact pieces 43a and 43b so as to face each other. By providing the holding pieces 45a and 45b behind the elastic contact pieces 43a and 43b, the IC card 10 can be accurately guided with respect to the elastic contact pieces 43a and 43b. Thereby, the contact reliability between the elastic contact pieces 43a and 43b and the heat radiation pads 13a and 13b can be improved. As shown in FIG. 2A, the pair of holding pieces 45a and 45b is a second piece of the IC card 10 that is folded so that the IC card 10 is securely attached to and held by the card connector 20. A holding member for holding the casing 12 with respect to the top plate 41 is configured. In order to facilitate the passage of the folded IC card 10 through the second housing portion 12, the pair of left and right holding pieces 45a and 45b have inclined surfaces whose rear end portions are inclined obliquely upward toward the rear. It is preferable to provide.

  More specifically, the right holding piece 45a includes a right connecting portion 44a cut and raised from the top plate 41 so as to be perpendicular to the top plate 41, and is directed inward from the upper end of the right connecting portion 44a. And is bent so as to extend parallel to the top plate 41. The left holding piece 45b includes a left connecting portion 44b cut and raised from the top plate 41 so as to be perpendicular to the top plate 41. The left holding portion 45b faces the top plate 41 inward from the upper end of the left connecting portion 44b. In parallel with the right holding piece 45a, it is bent so as to extend symmetrically. The left and right connecting portions 44a and 44b also form a pair and constitute a holding member together with the left and right holding pieces 45a and 45b. The interval between the left and right connecting portions 44a and 44b is set slightly larger than the width (the length in the left and right direction) of the second housing portion 12 of the IC card 10 to be mounted, and the height of each of the left and right connecting portions 44a and 44b. Is set to be slightly larger than the thickness of the second housing portion 12 of the IC card 10. In order to guide the second housing portion 12 of the folded IC card 10, the left and right connecting portions 44a and 44b may be parallel to each other, but expand in a tapered shape toward the rear. It may be formed so as to.

  By configuring the holding member including the connecting portions 44a and 44b and the pair of holding pieces 45a and 45b in this way, the left and right side portions of the second housing portion 12 of the folded IC card 10 are placed on the top plate 41. Retained. Thereby, it is possible to guide the heat dissipating pad portions 13a and 13b of the second housing portion to predetermined positions on the pair of elastic contact pieces 43a and 43b, and to reliably bring them into surface contact.

  An operation of attaching the foldable IC card 10 to the card connector 20 according to the present embodiment will be briefly described.

  The IC card 10 is preferably folded in advance as shown in FIG. 1B before being attached to the card connector 20. With the first housing part 11 of the folded IC card 10 facing down, the front end face 15 of the first housing part 11 is inserted into the card receiving space from the card insertion opening 25 of the card connector 20 toward the front. . By pushing the hinge portion 14 of the IC card 10 forward, the first housing portion 11 of the IC card 10 enters the card accommodation space from the card insertion opening 25 of the card connector 20. As the first case portion 11 of the IC card 10 enters the card accommodation space, the rear end surface 19 of the second case portion 12 where the IC card 10 is folded is moved from the rear end of the top plate 41 to the top plate 41. It reaches between the pair of connecting portions 44a and 44b cut and raised. Subsequently, the folded second casing 12 of the IC card 10 passes between the pair of connecting portions 44a and 44b and at the same time passes under the pair of holding pieces 45a and 45b. When the front end surface 15 of the first housing part 11 of the IC card 10 abuts against the front wall (not shown) of the contact base 30, the entry of the first housing part 11 into the card accommodation space stops, and the IC By releasing the pushing of the card 10, the mounting of the IC card 10 to the card connector 20 is completed as shown in FIG.

  At this time, the back surface 12b of the second housing portion 12 is held by the pair of holding pieces 45a and 45b so as to have a predetermined interval with respect to the upper surface of the top plate 41. The pair of holding pieces 45a and 45b may be arranged such that the back surface 12b of the second housing portion 12 contacts the top surface of the top plate 41, but the back surface 12b of the second housing portion 12 and the top plate It is preferable that a slight gap be formed between the upper surface of 41. In addition, the pair of heat radiation pad portions 13a and 13b formed on the back surface 12b of the second housing portion 12 of the mounted IC card 10 is fixed to the pair of elastic contact pieces 43a and 43b of the corresponding top plate 41. Surface contact with contact pressure. Furthermore, the surface 11a of the first housing part 11 of the IC card 10 also comes into contact with the metal cover 40 from the lower surface side. Thereby, the heat generated from the IC card 10 is effectively dissipated through the metal cover 40 to the electronic device to which the card connector 20 is attached.

  Next, another embodiment of the card connector according to the present invention shown in FIGS. 3 (a), 3 (b), 4 (a), 4 (b) and 5 (a), 5 (b) will be described. To do.

  The card connector 220 according to the embodiment shown in FIGS. 3A and 3B is a holding member for the second housing portion 12 as compared with the card connector 20 shown in FIGS. 2A and 2B. The other configuration is the same except that the installation position of the holding piece 247 on the top plate 241 is different. That is, in the card connector 220 in this embodiment, the contact base 230 and the metal cover 240 also form a card accommodation space in which at least a part of the first housing portion 11 of the IC card 10 is accommodated.

  In this embodiment, the holding piece 247 as a holding member is located between a pair of elastic contact pieces 243a and 243b formed corresponding to the pair of heat radiation pads 13a and 13b of the IC card 10, and the top plate It is cut and raised from 241 to the rear. The holding piece 247 in this embodiment is suitable when the heat dissipating pads 13a and 13b of the IC card 10 are symmetrically arranged on the left and right sides as understood from the installation position. That is, it is suitable when the corresponding elastic contact pieces 243a and 243b are symmetrically arranged on the left and right sides of the top plate 241. However, the holding piece 247 in the present embodiment is not limited to the case where the heat dissipating pads 13a and 13b of the IC card 10 are symmetrically arranged on the left and right sides.

  More specifically, the holding piece 247 constituting the holding member includes a connecting portion 246 cut and raised from the top plate 41, and extends in parallel to the top plate 41 from the upper end of the connecting portion 246 toward the rear. It is bent to exist. The connecting portion 246 constituting the holding member is cut and raised so as to be perpendicular to the top plate 241 at a position slightly ahead of the free ends of the pair of elastic contact pieces 243a and 243b and to extend in the left-right direction. In other words, the connecting portion 246 is cut and raised so that the rear end face 19 of the second housing portion 12 can come into contact when the folded IC card 10 is attached to the card connector 220. Therefore, the holding piece 247 in the present embodiment can hold the center of the rear end portion of the second housing portion 12 of the folded IC card 10. Also in the present embodiment, in order to facilitate the passage of the folded IC card 10 through the second housing portion 12, the holding piece 247 has an inclined surface 247a whose rear end portion is inclined obliquely upward toward the rear. It is preferable to provide.

  In the present embodiment, the holding member including the connecting portion 246 and the holding piece 247 is configured in this manner, so that the second housing portion 12 of the folded IC card 10 is paired with a pair of elastic contact pieces on the top plate 241. It can be held in the vicinity of 243a and 243b. Thereby, the heat radiating pad portions 13a and 13b of the second housing portion can be guided to predetermined positions on the pair of elastic contact pieces 243a and 243b, and the two can be reliably brought into surface contact. In the present embodiment, the holding pieces 247 provided on the top plate 241 are formed as a single member, but the present invention is not limited to this. For example, a plurality of holding pieces 247 divided into left and right are provided. Also good.

  The card connector 320 according to the embodiment shown in FIGS. 4A and 4B is shown in the card connector 20 shown in FIGS. 2A and 2B and FIGS. 3A and 3B. The card connector 220 is combined. That is, the card connector 320 according to the present embodiment also has the above-described embodiment in that the contact base 330 and the metal cover 340 form a card accommodation space in which at least a part of the first housing portion 11 of the IC card 10 is accommodated. Same as example.

  Specifically, in this embodiment, a pair of left and right elastic contact pieces corresponding to the heat radiation pads 13a and 13b of the second housing portion 12 of the IC card 10 are applied to the top plate 341 of the metal cover 340 of the card connector 320. 343a and 343b are cut and raised in a cantilever shape facing forward. Further, in this embodiment, the holding piece 347 is cut back and raised between the pair of left and right elastic contact pieces 343a and 343b provided on the top plate 341 and in the vicinity thereof via the connecting portion 346. ing. Further, a pair of left and right holding pieces 345a and 345b are cut and raised through the respective connecting portions 344a and 344b so as to face each other toward the rear of the top plate 341.

  In this embodiment, the second portion of the folded IC card 10 is thus provided by providing the connecting portion 346, the holding piece 347, the pair of connecting portions 344a and 344b, and the pair of holding pieces 345a and 345b as holding members. The housing part 12 can be held more reliably. Further, the heat radiating pad portions 13a and 13b of the second housing portion can be guided to predetermined positions on the pair of elastic contact pieces 343a and 343b, and both can be surely brought into surface contact.

  The card connector 420 according to the embodiment shown in FIGS. 5A and 5B is different from the above three embodiments in that all the holding pieces formed on the metal cover are omitted. However, the card connector 420 in the present embodiment also has the above-described implementation in that the contact base 430 and the metal cover 440 form a card accommodation space in which at least a part of the first housing portion 11 of the IC card 10 is accommodated. It is not different from the example.

  Specifically, in this embodiment, a pair of left and right elastic contacts are made on the top plate 441 of the metal cover 440 of the card connector 420 corresponding to the heat radiation pad portions 13a and 13b of the second housing portion 12 of the IC card 10. The pieces 443a and 443b are merely cut and raised in a cantilever shape facing forward. When the folded IC card 10 is held against the metal cover 440 of the second housing 12, that is, the card connector 420 presses the pair of heat dissipation pad portions 13 a and 13 b against the corresponding pair of elastic contact pieces 443 a and 443 b. Use attached electronic equipment. Alternatively, the folded IC card 10 may be held on the metal cover 441 of the second casing 12 with respect to the hinge 14 of the IC card 10 and the second casing 12 of the IC card 10 against the first casing 11. Alternatively, a biasing member (not shown) that is biased to the bent state may be provided. By configuring as in the present embodiment, the manufacture of the card connector 420 is facilitated.

DESCRIPTION OF SYMBOLS 10 IC card 11 1st housing | casing part 12 2nd housing | casing part 13a, 13b Radiation pad part 14 Hinge part 19 (End of 2nd housing | casing part) 20,220,320,429 Card connector 30,230,330, 430 Connector base 40, 240, 340, 440 Metal cover 43a, 43b Elastic contact piece 44a, 44b Connection part 45a, 45b Holding piece 247 Holding piece 247a Inclined surface

Claims (6)

The first housing part and the second housing part are connected via the hinge part and can be folded, and when folded, the front surface of the first housing part and the back surface of the second housing part face each other, A card connector for mounting an IC card having a heat radiating pad portion formed on the back surface of the second housing portion;
A connector base on which a plurality of contacts electrically connected to contact pads formed on the back surface of the first housing portion of the IC card are arranged;
A card insertion slot into which the first housing part of the IC card is inserted and at least a part of the first housing part of the IC card by including at least a top plate and left and right side walls and overlapping with the connector base A metal cover that forms a card receiving space for storing;
With
The metal cover is positioned between the first housing portion and the second housing portion in a state where the IC card is folded and a part of the first housing portion is housed in the card housing space. The card connector is in contact with a heat dissipating pad portion formed on the second housing portion by an elastic contact piece formed on the top plate of the metal cover.   A holding member including a connecting portion having a height larger than the thickness of the second housing portion of the IC card from the metal cover top plate, and a holding piece extending in parallel to the top plate from the upper end of the connecting portion; The card connector according to claim 1, further comprising:   The connection part of the said holding member is formed in a pair so that it may mutually oppose, The holding piece of the said holding member hold | maintains the side part of the said 2nd housing | casing part. Card connector.   The card connector according to claim 3, wherein the holding member is provided closer to the insertion port of the connector than the elastic contact piece.   The connecting portion of the holding member is formed so as to contact the rear end surface of the second casing portion, and the holding piece of the holding member holds the rear end portion of the second casing portion. The card connector according to claim 2.   6. The card connector according to claim 2, wherein the holding piece of the holding member is formed with an inclined surface inclined upward toward the card insertion slot at a rear end portion thereof. .

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