JP7376915B2 - card connector - Google Patents

Description

The present invention relates to a card connector. In particular, the present invention relates to the structure of a card connector that can radiate heat generated in a card in an energized state.

In recent years, electronic devices such as mobile phones, personal computers, televisions, video cameras, and digital cameras are equipped with card connectors to connect cards incorporating IC components such as CPUs or memory elements.

For example, a card connector has been disclosed that allows the card to be reliably inserted when the card is inserted correctly even if the thickness of the card varies, and that can prevent incorrect insertion of the card (for example, see Patent Document 1). .

The card connector according to Patent Document 1 includes a housing, a slide member, and a lock portion. The housing has a recess into which a card can be inserted. The slide member can slide inside the housing together with the card in the card insertion direction. The lock part engages with the slide member from the thickness direction of the housing, and can lock the slide of the slide member with respect to the housing.

Further, the card connector according to Patent Document 1 includes an insertion position regulating section and a bottom raised section. The insertion position regulating section allows the card to be inserted into a release position where the lock can be released by separating the lock section and the slide member by inserting the card when the card is inserted correctly in the card insertion direction, and prevents the card from being inserted incorrectly. It is possible to prevent the card from being inserted into the release position during insertion. In the release position, the bottom raising part can raise the position of the card in the thickness direction of the housing toward the locking part.

According to the configuration of the card connector according to Patent Document 1, when the card is inserted correctly, the card is allowed to be inserted into the release position, and when the card is inserted incorrectly, the card is prevented from being inserted into the release position, so that the card is not inserted into the release position. This can prevent incorrect insertion. In addition, when the card is inserted correctly, the position of the card in the thickness direction of the housing is raised at the release position, so even if the thickness of the card varies, the lock can be released by separating the lock part from the slide member. .

Japanese Patent Application Publication No. 2010-212057

In recent years, cards that can transmit electrical signals at high speed and have large memory capacities have appeared. In such a card, power consumption increases as electric signal transmission speed increases and memory capacity increases, and the card generates heat while energized. Distortion or abnormality of electrical signals can be suppressed by dissipating the heat generated in the card to the outside of the card.

However, in the card connector according to Patent Document 1, one side of the card is covered with a cover made of a stainless steel plate with low thermal conductivity, and the other side of the card is covered with a synthetic resin serving as a heat insulator through an air layer. Since they are facing each other, there is a problem in that the heat dissipation effect is low.

There is a need for a card connector with a high heat dissipation effect that can suppress distortion or abnormality of electrical signals by effectively dissipating heat generated in the card to the outside of the card. The above can be said to be the problem of the present invention.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a card connector with high heat dissipation effect, which effectively dissipates heat generated in the card to the outside of the card.

The present inventor has provided a housing having a recess into which a card can be inserted, a cover plate that covers the recess, a plurality of contacts that are arranged at the back of the recess and can be connected to connection terminals provided on the card, and at least a heat dissipating part on the bottom of the recess. A card connector is configured with a heat dissipating member placed on the card, and the heat dissipating section is placed opposite to the surface of the card through an air layer, and the heat dissipating piece extending from the heat dissipating section is soldered to the printed circuit board. Based on this idea, they came up with the following new card connector.

(1) A card connector according to the present invention includes a housing having a recess into which a card can be inserted, a cover plate that covers the recess of the housing, and a plurality of contacts arranged in the recess and connectable to connection terminals provided on the card. and a heat radiating member having at least a heat radiating portion, the heat radiating portion being arranged on the bottom surface of the recess, the heat radiating member arranging the heat radiating portion facing the surface of the card with an air layer interposed therebetween. ing.

(2) Preferably, the heat radiating section has a heat radiating piece extending from the heat radiating section, and the heat radiating piece is soldered to a printed circuit board.

(3) The housing is formed approximately parallel to the insertion direction of the card, and has a pair of opposing side walls, and is elevated from the bottom surface of the recess and is formed approximately parallel to the pair of side walls. , a pair of step portions capable of guiding the card, and the heat dissipation portion extends from the bottom surface of the recess to an inner wall of one of the side walls through the pair of step portions, and tightly contacts the inner surface of the housing. It may be covered freely.

(4) The heat radiating member may further include a facing part that is continuous with the heat radiating part and is arranged opposite to the heat radiating part, and the facing part is arranged so as to be able to freely come into contact with the inner wall of the cover plate. good.

(5) The heat dissipation member may be constituted by a rectangular plate in which the heat dissipation portion is arranged on the bottom surface of the recess.

(6) Preferably, the heat dissipation member is made of a copper alloy plate.

A card connector according to the present invention includes a housing having a recess into which a card can be inserted, a cover plate that covers the recess, a plurality of contacts that are arranged in the recess and can be connected to connection terminals provided on the card, and at least a heat dissipating portion on the bottom of the recess. By arranging the heat radiating member to face the surface of the card with an air layer in between, the heat generated in the card can be effectively radiated to the outside of the card.

1(A) is a perspective view showing the configuration of a card connector according to a first embodiment of the present invention, FIG. 1(A) is a state diagram in which the housing is covered with a cover plate, and FIG. 1(B) is a diagram with the cover plate removed from the housing. FIG. 1 is a perspective exploded view showing the configuration of a card connector according to a first embodiment; FIG. 3(A) is a plan view of the card connector, and FIG. 3(B) is a cross-sectional view taken along the line AA in FIG. 3(A). FIG. It is. FIG. 3 is a perspective view showing the configuration of the card connector according to the first embodiment, with the cover plate removed. FIG. 2 is a perspective exploded view showing the configuration of the card connector according to the first embodiment, and a state diagram in which the housing and the heat dissipation member according to the first embodiment are disposed facing each other. 6A is a plan view and a vertical sectional view showing the configuration of the card connector according to the first embodiment, FIG. 6A is a state diagram when a card is being inserted into the card connector, and FIG. FIG. 7(A) is a perspective view showing the configuration of a card connector according to a second embodiment of the present invention, FIG. 7(A) is a state diagram in which the housing is covered with a cover plate, and FIG. 7(B) is a diagram with the cover plate removed from the housing. FIG. FIG. 7 is a perspective exploded view showing the configuration of a card connector according to a second embodiment. 9(A) is a plan view of the card connector, and FIG. 9(B) is a sectional view taken along the line AA in FIG. 9(A). FIG. It is. FIG. 7 is a perspective view showing the configuration of the card connector according to the second embodiment, with the cover plate removed. FIG. 7 is a perspective exploded view showing the configuration of a card connector according to a second embodiment, and a state diagram in which a housing and a heat dissipation member according to the second embodiment are disposed facing each other. FIG. 7 is a perspective view showing the configuration of a heat dissipation member provided in the card connector according to the second embodiment, and is a state diagram of the heat dissipation member viewed from the bottom side. 13(A) is a perspective view showing the configuration of a card connector according to a third embodiment of the present invention, FIG. 13(A) is a state diagram in which the housing is covered with a cover plate, and FIG. 13(B) is a diagram with the cover plate removed from the housing. FIG. 14(A) is a plan view of the card connector according to a third embodiment, and FIG. 14(B) is a sectional view taken along the line AA in FIG. 14(A). It is. It is a perspective view which shows the structure of the card connector by 3rd Embodiment, and is a state figure with the cover plate removed. FIG. 7 is a perspective exploded view showing the configuration of a card connector according to a third embodiment, and a state diagram in which a housing and a heat dissipation member according to the third embodiment are disposed facing each other.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
[First embodiment]
(Card connector configuration)
First, the configuration of the card connector according to the first embodiment of the present invention will be described.

(overall structure)
Referring to FIGS. 1 to 6, a card connector (hereinafter abbreviated as a connector) 10 according to a first embodiment of the present invention includes a housing 1 and a cover plate 2. As shown in FIG. Further, the connector 10 includes a plurality of contacts 3 and a heat radiation member 4.

Referring to FIGS. 1 to 6, the housing 1 has a recess 11 into which a card C can be inserted (see FIG. 2 or 5). The cover plate 2 covers the recess 11 of the housing 1. The plurality of contacts 3 are arranged on the inner side of the recess 11. These contacts 3 can be connected to connection terminals Tc provided at the ends of the card C (see FIG. 1).

Referring to FIGS. 1 to 6, the heat radiating member 4 has a rectangular heat radiating portion 41 with a large area. The heat radiating member 4 has a heat radiating part 41 disposed on the bottom surface of the recess 11. Referring to FIG. 6, when the card C is inserted into the housing 1, the heat radiating member 4 is arranged to face the surface of the card C with an air layer interposed therebetween. In this embodiment, heat is dissipated to the heat radiating member 4 only through the air layer, but by forming a contact piece on a part of the heat radiating part 41, the card C is brought into contact with the heat radiating member 4 from the contact piece together with the air layer. Heat may be transferred to 4.

Referring to FIGS. 1 to 6, the heat radiation member 4 has a heat radiation piece 41s. The heat sink 41s extends from the heat sink 41 in a stepped manner. Further, the heat dissipation piece 41s is arranged on the front side of the recess 11. In the connector 10, the heat dissipating piece 41s is soldered to the printed circuit board 9p (see FIG. 3(B)).

Referring to FIGS. 1 to 6, the connector 10 according to the embodiment has a heat dissipation section 41 facing the surface of the card C via an air layer, and a heat dissipation piece 41s extending from the heat dissipation section 41 on the printed circuit board 9p. By soldering to the card C, the heat generated in the card C can be effectively radiated to the outside of the card C.

(Housing configuration)
Next, the configuration of the housing 1 according to the embodiment will be explained. The housing 1 has insulation properties. The insulating housing may be a housing made of a non-conductive material, and the housing 1 in a desired shape can be obtained by molding a non-conductive synthetic resin.

Referring to FIGS. 2 to 5, the housing 1 has a pair of opposing side walls 1a and 1b and a back wall 1c. One side wall 1a and the other side wall 1b are formed substantially parallel to each other along the card C insertion direction. The back wall 1c is orthogonal to one side wall 1a and the other side wall 1b. Further, the back wall 1c faces the leading edge of the card C.

Further, referring to FIG. 4 or 5, the housing 1 has a straight guide rail 1r. The guide rail 1r is arranged closer to the other side wall 1b. Further, the guide rail 1r is arranged substantially parallel to one side wall 1a. The guide rail 1r can slidably guide the other side of the card C, and can also slidably guide a slide member E1, which will be described later. A thin rectangular parallelepiped space surrounded by the pair of side walls 1a, the guide rail 1r, and the back wall 1c can be defined as "the recess 11 into which the card C is inserted and removed."

Referring to FIG. 2 or 5, the housing 1 has a rectangular cutout 1k cut out in front of the recess 11. The heat radiating piece 41s of the heat radiating member 4 can be placed in the notch 1k (see FIG. 1(B) or FIG. 4).

Referring to FIGS. 2 to 5, the housing 1 further forms a pair of stepped portions 1d and 1d. The pair of stepped portions 1d and 1d are elevated from the bottom surface of the recessed portion 11. The pair of step portions 1d and 1d are formed substantially parallel to each other along one side wall 1a and the guide rail 1r. The pair of stepped portions 1d and 1d can guide the card C in the insertion direction.

Referring to FIG. 1(B) or FIGS. 3 and 4, the heat dissipation section 41 extends from the bottom of the recess 11 to the inner wall of one side wall 1a via the pair of step portions 1d and 1d, and extends from the inner surface of the housing 1. Covers tightly.

(Configuration of eject mechanism)
Next, the configuration of the eject mechanism E according to the embodiment will be explained. Referring to FIGS. 1 to 4, the connector 10 includes a push-push type ejection mechanism E on the other side wall 1b.

Referring to FIGS. 1 to 4, the eject mechanism E has a strip-shaped slide member E1. The slide member E1 is movable along the other side wall 1b of the housing 1. The slide member E1 has an engaging claw En. The engagement claw En projects from the other end of the recess 11 toward the center of the recess 11 . Furthermore, the engaging claw En can come into contact with the leading edge of the card C (see FIG. 6(A)).

Referring to FIG. 3 or 4, the slide member E1 includes a cantilevered leaf spring E2. The base end of the leaf spring E2 is fixed to the slide member E1. The leaf spring E2 can move together with the slide member E1. Further, the leaf spring E2 forms a V-shaped bent portion that elastically biases the other side surface of the card C. This bent portion protrudes from the side surface of the slide member E1 so as to be able to enter and exit the groove Cd (see FIG. 1) formed on the other side surface of the card C.

3 or 4 and 6, when the card C is inserted into the recess 11, the bent portion of the leaf spring E2 is deformed and then returns to its original state, allowing the bent portion to enter the groove Cd of the card C (see FIG. (see 1). In the process of ejecting the card C from the recess 11, the bent portion of the leaf spring E2 engages with the groove Cd of the card C, thereby preventing the card C from flying out.

Referring to FIG. 3 or 4, the slide member E1 has a heart-shaped cam groove Ec formed on its surface side. Furthermore, the eject mechanism E further includes a compression coil spring E3 and a guide rod E4.

Referring to FIG. 3, FIG. 4, and FIG. 6, the compression coil spring E3 is held by the housing 1 and biases the slide member E1 in the direction in which the card C is ejected. The guide rod E4 has one end connected to the heart-shaped cam groove Ec. Further, the other end of the guide rod E4 is rotatably supported by the housing 1.

Referring to FIG. 3, FIG. 4, and FIG. 6, the heart-shaped cam groove Ec forms a V-shaped groove that is recessed in a V-shape at the branch point of the forward stroke trajectory and the return stroke trajectory. When one end of the guide rod E4 is locked in the V-shaped groove, it is biased by the compression coil spring E3, and the slide member E1 can be locked at the card C mounting position (see FIG. 6(B)). A cam device constituted by a heart-shaped cam groove Ec and a guide rod E4 defines one stop position of the slide member E1.

When the card C is pushed toward the back wall 1c from the state shown in FIG. 6(B), the engagement between the V-shaped groove of the heart-shaped cam groove Ec and one end of the guide rod E4 is released. Thereby, the compression coil spring E3 biases the card C via the slide member E1, so that the card C can be ejected from the connector 10.

(Configuration of cover plate)
Next, the configuration of the cover plate 2 according to the embodiment will be explained. Referring to FIG. 1 or 2, the cover plate 2 is made of a thin metal plate, and the cover plate 2 in a desired shape can be obtained by molding the developed thin metal plate. The cover plate 2 is preferably made of a conductive metal thin plate, and for example, a stainless steel plate can be used. By covering the housing 1 with the cover plate 2, a shielding (electromagnetic shielding) effect can be obtained.

Referring to FIG. 1 or 2, the cover plate 2 has both ends of the main surface plate 21 bent at approximately right angles. The cover plate 2 has a plurality of substantially rectangular holes 22h opened in the pair of bent pieces 22. These substantially rectangular holes 22h can be engaged with a plurality of lances 11r protruding from one side wall 1a and the other side wall 1b of the housing 1 (see FIG. 2).

Further, referring to FIG. 1 or 2, the cover plate 2 is provided with a plurality of lead pieces 2r that are soldered to the printed circuit board 1p (see FIG. 3(B)). By soldering these lead pieces 2r to the printed circuit board 1p, the bonding strength with the printed circuit board 1p can be reinforced, and these lead pieces 2r can also be grounded to the ground pattern of the printed circuit board 1p.

Referring to FIG. 2, the cover plate 2 has a one-to-one pair of leaf spring pieces 2a, 2a on the main surface plate 21. The leaf spring piece 2a biases the card C toward the bottom surface of the recess 11 of the housing 1. The leaf spring piece 2a biases the surface of the card C with a relatively weak force so as not to damage the surface of the card C.

Further, referring to FIG. 2, the cover plate 2 has a leaf spring piece 2b on the main surface plate 21. As shown in FIG. The leaf spring piece 2b applies a force directed toward the bottom surface of the cam groove Ec formed in the slide member E1 by the guide rod E4 (see FIG. 3 or FIG. 4).

(Contact configuration)
Next, the configuration of the contact 3 according to the embodiment will be explained. Referring to FIGS. 1 to 5, a plurality of contacts 3 are arranged in parallel on the back side of the recess 11 of the housing 1. As shown in FIG. These contacts 3 can electrically connect the printed circuit board 1p on which the connector 10 is mounted and the connection terminal Tc provided on the card C (see FIG. 1(B) or FIG. 3(B)).

Referring to FIGS. 1 to 5, the contact 3 uses a cantilever contact in which the action of the spring is a cantilever beam. The contact 3 is composed of an elastic arm and a fixed arm, and the elastic arm is arranged facing the recess 11 and is provided with a contact point that contacts the connection terminal Tc formed on the card C. The fixing arm is press-fitted into the back wall 1c that partitions the recess 11 and is fixed. The fixing portion of the contact 3 and the housing 1 may be integrally molded.

Referring to FIG. 3(B), the contact 3 has a lead portion 3r formed at the end of the fixed arm. By soldering the lead portion 3r to the printed circuit board 1p, the connector 10 according to the embodiment can be used as a surface mounting connector (see FIG. 1).

(Configuration of heat dissipation member)
Next, the configuration of the heat radiating member 4 according to the embodiment will be explained. Referring to FIGS. 1 to 5, the heat dissipation member 4 is made of a metal plate with high thermal conductivity. For example, the heat dissipation member 4 is preferably made of a copper alloy plate with high thermal conductivity. By molding a metal expansion plate with high thermal conductivity, the heat dissipation member 4 in a desired shape can be obtained.

Referring to FIG. 2 or 5, the heat radiating member 4 has a first bent piece 411 formed at one end of the heat radiating portion 41 via a stepped portion 41d. Further, the heat radiating member 4 has a second bent piece 412 formed at the other end of the heat radiating portion 41 .

Referring to FIG. 2 or 5, the heat dissipation section 41 includes a stepped portion 41d, a first bent piece 411, and a second bent piece 412. The heat dissipating section 41 covers the inner surface of the housing 1 from the bottom surface of the recessed section 11 to the inner wall of one side wall 1a via the pair of stepped sections 1d and 1d, so as to freely adhere to the inner surface of the housing 1.

(Function of card connector)
Next, the functions and effects of the connector 10 according to the embodiment will be explained. Referring to FIGS. 1 to 5, the connector 10 includes a housing 1 having a recess 11 into which a card C can be inserted, a cover plate 2 covering the recess 11, and a connecting terminal Tc arranged on the back side of the recess 11 and provided on the card C. It is provided with a plurality of contacts 3 that can be connected to a plurality of contacts 3, and a heat radiating member 4 in which a heat radiating portion 41 is arranged on the bottom surface of the recess 11.

Referring to FIGS. 1 to 5, the heat dissipation member 4 is made of a metal plate with high thermal conductivity, and the heat dissipation part 41 is disposed opposite to the surface of the card C with an air layer interposed therebetween, and extends from the heat dissipation part 41. By soldering the heat dissipating piece 41s to the printed circuit board 9p, the heat generated in the card C while it is energized can be effectively dissipated to the printed circuit board 9p having a large heat capacity.

[Second embodiment]
(Card connector configuration)
Next, the configuration of a card connector according to a second embodiment of the present invention will be described. Note that components denoted by the same reference numerals as those used in the first embodiment have the same functions, so the description thereof may be omitted below.

(overall structure)
Referring to FIGS. 7 to 12, a card connector (hereinafter abbreviated as a connector) 20 according to a second embodiment of the present invention includes a housing 1 and a cover plate 2. As shown in FIG. The connector 20 also includes a plurality of contacts 3 and a heat dissipating member 5 in the shape of a rectangular tube.

Referring to FIGS. 7 to 11, the housing 1 has a recess 11 into which a card C can be inserted (see FIG. 8 or FIG. 11). The cover plate 2 covers the recess 11 of the housing 1. The plurality of contacts 3 are arranged on the inner side of the recess 11. These contacts 3 can be connected to connection terminals Tc provided at the ends of the card C (see FIG. 7).

Referring to FIGS. 7 to 12, the heat radiating member 5 has a rectangular heat radiating portion 51 with a large area. The heat radiating member 5 has a heat radiating part 51 disposed on the bottom surface of the recess 11. When the card C is inserted into the housing 1, the heat radiating member 5 is placed opposite to the surface of the card C with an air layer in between.

Referring to FIGS. 7 to 12, the heat radiation member 5 has a heat radiation piece 51s. The heat sink 51s extends from the heat sink 51 in a stepped manner. Further, the heat dissipation piece 51s is arranged on the front side of the recess 11. In the connector 20, the heat dissipating piece 51s is soldered to the printed circuit board 9p (see FIG. 9(B)).

Referring to FIGS. 7 to 12, the heat radiating member 5 further includes a facing portion 52 whose side surface is continuous with the heat radiating portion 51 and which is disposed to face the heat radiating portion 51. The facing portion 52 is arranged so as to be able to come into contact with the inner wall of the cover plate 2 . The heat radiating member 5 is open at both ends thereof. A card C can be introduced between the heat dissipation section 51 and the opposing section 52.

Referring to FIGS. 7 to 12, the connector 20 according to the embodiment has a heat dissipation section 51 facing the surface of the card C via an air layer, and a heat dissipation piece 51s extending from the heat dissipation section 51 on the printed circuit board 9p. By soldering to the card C, the heat generated in the card C can be effectively radiated to the outside of the card C.

(Configuration of heat dissipation member)
Next, the configuration of the heat radiating member 5 according to the embodiment will be described. Referring to FIGS. 7 to 12, the heat dissipation member 5 is made of a metal plate with high thermal conductivity. For example, the heat dissipation member 5 is preferably made of a copper alloy plate with high thermal conductivity. By molding a metal expansion plate with high thermal conductivity, a square tubular heat dissipating member 5 can be obtained.

Referring to FIG. 11 or 12, the heat radiating member 5 has a first side surface 511 formed at one end of the heat radiating portion 51 via a stepped portion 51d. Further, the heat radiating member 5 has a second side surface 512 formed at the other end of the heat radiating portion 51 via the stepped portion 51d.

Referring to FIG. 11 or 12, the heat dissipation section 51 includes a pair of step portions 51d, a first side surface 511, and a second side surface 512. The heat dissipation section 51 covers the inner surface of the housing 1 in close contact with the bottom surface of the recessed section 11 to the inner wall of one side wall 1a via the pair of stepped sections 1d and 1d (see FIG. 10).

Referring to FIG. 10 or 11, the facing portion 52 has a plurality of escape holes 52a through which the one-to-one pair of leaf spring pieces 2a formed on the cover plate 2 can escape. Thereby, the one-to-one pair of leaf spring pieces 2a, 2a can bias the surface of the card C without being obstructed by the facing portion 52.

(Function of card connector)
Next, the functions and effects of the connector 20 according to the embodiment will be explained. Referring to FIGS. 7 to 12, the connector 20 includes a housing 1 having a recess 11 into which a card C can be inserted, a cover plate 2 covering the recess 11, and a connecting terminal Tc arranged on the back side of the recess 11. It is provided with a plurality of contacts 3 that can be connected to a plurality of contacts 3, and a rectangular cylindrical heat dissipating member 5 in which at least a heat dissipating portion 51 is arranged on the bottom surface of the recess 11.

Referring to FIGS. 7 to 12, the heat dissipation member 5 is made of a metal plate with high thermal conductivity, and the heat dissipation part 51 is disposed opposite to the surface of the card C with an air layer interposed therebetween, and extends from the heat dissipation part 51. By soldering the heat dissipating piece 51s to the printed circuit board 9p, the heat generated in the card C while it is energized can be effectively dissipated to the printed circuit board 9p having a large heat capacity.

Referring to FIGS. 7 to 12, the connector 20 according to the embodiment has a special effect of being able to conduct heat generated on the surface of the card C to the heat dissipation piece 51s via the opposing portion 52.

[Third embodiment]
(Card connector configuration)
Next, the configuration of a card connector according to a third embodiment of the present invention will be described. Note that components denoted by the same reference numerals as those used in the first embodiment and the second embodiment have the same functions, so the description thereof may be omitted below.

(overall structure)
Referring to FIGS. 13 to 16, a card connector (hereinafter simply referred to as a connector) 30 according to a third embodiment of the present invention includes a housing 1 and a cover plate 2. As shown in FIG. The connector 30 also includes a plurality of contacts 3 and a heat dissipation member 6 made up of a rectangular plate.

Referring to FIGS. 13 to 16, the housing 1 has a recess 11 into which a card C can be inserted (see FIG. 16). The cover plate 2 covers the recess 11 of the housing 1. The plurality of contacts 3 are arranged on the inner side of the recess 11. These contacts 3 can be connected to connection terminals Tc provided at the ends of the card C (see FIG. 13).

Referring to FIGS. 13 to 16, the heat radiating member 6 is composed of a rectangular heat radiating portion 61 having a large area. The heat radiating member 6 has a heat radiating part 61 disposed on the bottom surface of the recess 11. When the card C is inserted into the housing 1, the heat radiating member 6 is placed opposite to the surface of the card C with an air layer in between.

Referring to FIGS. 13 to 16, the heat radiating member 6 has a heat radiating piece 61s. The heat sink 61s extends from the heat sink 61 in a stepped manner. Further, the heat dissipating piece 61s is arranged on the front side of the recess 11. In the connector 30, the heat dissipating piece 51s is soldered to the printed circuit board 9p (see FIG. 14(B)).

Referring to FIGS. 13 to 16, the connector 30 according to the embodiment arranges the heat dissipation section 61 to face the surface of the card C via an air layer, and also connects the heat dissipation piece 61s extending from the heat dissipation section 61 to the printed circuit board 9p. By soldering to the card C, the heat generated in the card C can be effectively radiated to the outside of the card C.

(Configuration of heat dissipation member)
Next, the configuration of the heat radiating member 6 according to the embodiment will be explained. Referring to FIGS. 13 to 16, the heat dissipation member 6 is made of a metal plate with high thermal conductivity. For example, the heat dissipation member 6 is preferably made of a copper alloy plate with high thermal conductivity. The flat heat dissipating member 6 can be obtained by molding a metal expansion plate with high thermal conductivity. The heat radiating portion 61 covers the bottom surface of the recess 11 of the housing 1 in a manner that allows it to adhere tightly (see FIG. 15).

(Function of card connector)
Next, the functions and effects of the connector 20 according to the embodiment will be explained. Referring to FIGS. 13 to 16, the connector 30 includes a housing 1 having a recess 11 into which a card C can be inserted, a cover plate 2 covering the recess 11, and a connecting terminal Tc arranged on the back side of the recess 11. It is provided with a plurality of contacts 3 that can be connected to a plurality of contacts 3, and a heat dissipation member 6 arranged on the bottom surface of the recess 11 and made of a rectangular plate.

Referring to FIGS. 13 to 16, the heat dissipation member 6 is made of a metal plate with high thermal conductivity, and the heat dissipation part 61 is arranged opposite to the surface of the card C with an air layer interposed therebetween, and extends from the heat dissipation part 61. By soldering the heat dissipating piece 61s to the printed circuit board 9p, the heat generated in the card C while it is energized can be effectively dissipated to the printed circuit board 9p having a large heat capacity. The connector 30 according to the embodiment has a special effect in that the heat dissipation member 6 is simply configured.

The card connector according to the present invention can provide the following effects.
(1) Since the heat dissipation member has a heat dissipation portion that covers the card with a large area, a high heat dissipation effect can be expected.
(2) Since the heat dissipation member is placed inside the card connector, a metal member that is rigid but has low thermal conductivity can be used for the cover plate.
(3) Since the heat dissipation member covers the card on many sides, it can provide a shielding effect when transmitting electrical signals at high speed.
(4) Since the insulating housing is disposed between the conductive heat dissipation member and the printed circuit board, the printed circuit board can secure an area on the bottom surface of the housing in which a signal pattern is formed.

The present invention discloses a card connector that can connect a card with the connection terminal provided on the card facing downward (so-called normal state), but it connects a card with the connection terminal facing upward (so-called reverse state). Applicable to card connectors that can be used.

In the present invention, the cover plate may be insert molded into the housing. Further, the present invention may be configured such that the heat dissipation piece extending from the heat dissipation part is not soldered to the printed circuit board, but the heat dissipation piece is brought into contact with a ground pattern formed on the printed circuit board. Furthermore, in the present invention, a biasing spring piece that biases the card from the bottom surface side can be provided in the heat radiation section.

1 Housing 2 Cover plate 3 Contact 4 Heat dissipation member 9p Printed circuit board 10 Connector (card connector)
11 Recess 41 Heat dissipation part 41s Heat dissipation piece C card Tc connection terminal

Claims (4)

a housing having a recess into which a card can be inserted;
a cover plate that covers the recessed portion of the housing;
a plurality of contacts arranged in the recess and connectable to connection terminals provided on the card;
a heat radiating member having at least a heat radiating part, the heat radiating part being arranged on the bottom surface of the recess,
The heat dissipation member has the heat dissipation part disposed opposite to the surface of the card with an air layer interposed therebetween,
The housing includes:
a pair of side walls formed substantially parallel to each other along the insertion direction of the card and arranged to face each other;
a pair of stepped portions rising from the bottom surface of the recessed portion, formed substantially parallel to each other along the pair of side walls, and capable of guiding the card;
The heat dissipation part covers the inner surface of the housing from the bottom surface of the recessed part to the inner wall of one of the side walls via the pair of stepped parts, and freely covers the inner surface of the housing,
The heat radiating member further includes a facing part continuous with the heat radiating part and facing the heat radiating part,
The card connector is arranged such that the facing portion can freely come into contact with an inner wall of the cover plate . The heat radiating part has a heat radiating piece extending from the heat radiating part,
The card connector according to claim 1, wherein the heat dissipation piece is soldered to a printed circuit board. 3. The card connector according to claim 2 , wherein the heat radiating member is constituted by a rectangular plate with the heat radiating portion disposed on the bottom surface of the recess. 4. The card connector according to claim 1, wherein the heat dissipation member is made of a copper alloy plate.

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