JP2010100825A - 照明用青色−緑色及び緑色蛍光体 - Google Patents
照明用青色−緑色及び緑色蛍光体 Download PDFInfo
- Publication number
- JP2010100825A JP2010100825A JP2009188805A JP2009188805A JP2010100825A JP 2010100825 A JP2010100825 A JP 2010100825A JP 2009188805 A JP2009188805 A JP 2009188805A JP 2009188805 A JP2009188805 A JP 2009188805A JP 2010100825 A JP2010100825 A JP 2010100825A
- Authority
- JP
- Japan
- Prior art keywords
- phosphor
- light
- phosphors
- application publication
- patent application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/7721—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/77214—Aluminosilicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
- F21K2/06—Non-electric light sources using luminescence; Light sources using electrochemiluminescence using chemiluminescence
- F21K2/08—Non-electric light sources using luminescence; Light sources using electrochemiluminescence using chemiluminescence activated by an electric field, i.e. electrochemiluminescence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/06102—Disposition the bonding areas being at different heights
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【解決手段】蛍光体22は一般式((Sr1-zMz)1-(x+w)AwCex)3(Al1-ySiy)O4+y+3(x-w)F1-y-3(x-w)(I)を有する系を含んでおり、ここで、0<x≦0.10、0≦y≦0.5、0≦z≦0.5、0≦w≦xであり、AはLi、Na、K、Rb若しくはAg又はこれらの任意の組合せであり、MはCa、Ba、Mg、Zn若しくはSn又はこれらの任意の組合せである。有利なことに、これらの配合に従って作成される蛍光体22は広範囲の温度にわたって発光強度を維持し得る。これらの蛍光体は、特に、青色及び青色/緑色光を生成するLED10及び蛍光管のような照明系に使用できる。さらに、これらの蛍光体は、照明に適した白色光を生成するために、他の蛍光体とのブレンドに、又は組合せ照明系に使用できる。
【選択図】図1
Description
上に開示した蛍光体、及びこれらの蛍光体と共にブレンドを作成するのに使用する他の蛍光体は、適切な金属の酸素含有化合物の粉末及びフッ化物種を混合した後、この混合物を還元性雰囲気下で焼成することによって製造することができる。例えば、代表的な蛍光体(Sr0.75Ca0.23Na0.01Ce0.01)(Al0.75Si0.25)O4.25F0.75(後述の実施例でさらに詳細に述べる)は、適当な量のストロンチウム、カルシウム、ナトリウム、セリウム、アルミニウム、及びケイ素の酸素含有化合物を適当な量のフッ素含有化合物と混合した後、この混合物を還元性雰囲気下で焼成することによって製造することができる。焼成後、蛍光体をボールミルその他で粉砕して、焼成手順中に形成された可能性がある集塊を壊すことができる。粉砕は、全焼成工程が完了した後に実施してもよいし、又は追加の焼成工程を間に挟んでもよい。
本発明の蛍光体は他の蛍光体とブレンドして照明用の白色光のような他の色を作り出すことができる。その他のブレンドを用いて、黄色、緑色、赤色、などのようないろいろな色を作り出すことができる。青色又は青色/緑色光を生成する本発明の蛍光体を用いた照明系を、赤色光を生成する他の蛍光体を用いる照明系と組み合わせて白色光源を形成することができる。例えば、考えられる実施形態において、赤色光を放出する、Mn4+をドープした複合フッ化物(例えば(Na,K,Rb,Cs,NH4)2[(Ti,Ge,Sn,Si,Zr,Hf)F6]:Mn4+など)を、本発明の蛍光体とブレンドして白色光を得ることができる。Mn4+をドープした複合フッ化物の非限定例は、以下で述べる幾つかの具体的なブレンド例に使用されるK2[SiF6]:Mn4+(PFS)である。本発明の蛍光体とのブレンドに使用できる蛍光体のその他の非限定例として次のものがある。Yellow(Ba,Sr,Ca)5(PO4)3(Cl,F,Br,OH):Eu2+,Mn2+;(Ba,Sr,Ca)BPO5:Eu2+,Mn2+;(Sr,Ca)10(PO4)6 *xB2O3:Eu2+(0<x≦1);Sr2Si3O8 *2SrCl2:Eu2+; Ca,Sr,Ba)3MgSi2O8:Eu2+,Mn2+;BaAl8O13:Eu2+;2SrO*0.84P2O5 *0.16B2O3:Eu2+;(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+;(Ba,Sr,Ca)Al2O4:Eu2+;(Y,Gd,Lu,Sc,La)BO3:Ce3+,Tb3+;(Ba,Sr,Ca)2Si1-xO4-2x:Eu2+(0≦x≦0.2)(SASI);(Ba,Sr,Ca)2(Mg,Zn)Si2O7:Eu2+;(Sr,Ca,Ba)(Al,Ga,In)2S4:Eu2+;(Y,Gd,Tb,La,Sm,Pr,Lu)3(Sc,Al,Ga)5-aO12-3/2a:Ce3+(0≦a≦0.5);(Lu,Sc,Y,Tb)2-x-yCeyCa1+xLizMg2-zPz(Si,Ge)3-zO12-x/2(0.5≦x≦1、0<y≦0.1、0≦z≦0.2);(Ca,Ba,Sr)Si2O2N2:Eu2+,Ce3+;(Ca,Sr)8(Mg,Zn)(SiO4)4Cl2:Eu2+,Mn2+;Na2Gd2B2O7:Ce3+,Tb3+;(Sr,Ca,Ba,Mg,Zn)2P2O7:Eu2+,Mn2+;(Gd,Y,Lu,La)2O3:Eu3+,Bi3+;(Gd,Y,Lu,La)2O2S:Eu3+,Bi3+;(Gd,Y,Lu,La)VO4:Eu3+,Bi3+;(Ca,Sr)S:Eu2+,Ce3+;ZnS:Cu+,Cl-;ZnS:Cu+,Al3+;ZnS:Ag+,Cl-;ZnS:Ag+,Al3+;SrY2S4:Eu2+;CaLa2S4:Ce3+;(Ba,Sr,Ca)MgP2O7:Eu2+,Mn2+;(Y,Lu)2WO6:Eu3+,Mo6+;(Ba,Sr,Ca)xSiyNz:Eu2+,Ce3+(2x+4y=3z);Ca3(SiO4)Cl2:Eu2+;(Y,Lu,Gd)2-xCaxSi4N6+xC1-x:Ce3+(0≦x≦0.5);(Lu,Ca,Li,Mg,Y)アルファ−SiAlON:Eu2+,Ce3+;3.5MgO*0.5MgF2 *GeO2:Mn4+(Mg−フルオロゲルマネート);Ca1-x-yCexEuyAl1+xSi1-xN3(0<x≦0.2、0≦y≦0.2);Ca1-x-yCexEuyAl1-x(Mg,Zn)xSiN3(0<x≦0.2、0≦y≦0.2);Ca1-2x-yCex(Li,Na)xEuyAlSiN3(0≦x≦0.2、0≦y≦0.2、x+y>0);Ca1-x-y-zCex(Li,Na)yEuzAl1+x-ySi1-x+yN3(0≦x≦0.2、0<y≦0.4、0≦z≦0.2);又はこれらの任意の組合せ。ここに掲げた一般式は各々上記他の一般式と独立である。具体的には、式中で数値の代替物として使用され得るx、y、z、及びその他の変数は他の式又は組成中に見られるx、y、z及びその他の変数のいかなる用法とも関連がない。
ここで図を参照すると、図1は、本発明の蛍光体及び蛍光体ブレンドを組み込むことができる代表的なLED系ライト10を示す。LED系ライト10は発光ダイオード(LED)チップ12のような半導体UV又は可視光源を含んでいる。LEDチップ12に電気的に取り付けた電力導線14により、LEDチップ12に放射線を放出させる電流が供給される。導線14は、より太いパッケージ導線16上に支持された細い導線を含み得る。代わりに、パッケージ導線16をLEDチップ12に直接取り付けてもよい。
上記技術を使用して、一般式Iを有する5つの蛍光体を合成した。各蛍光体を生成するのに使用した化学成分を表1に示す。得られた式を表2に示す。
12 発光ダイオードチップ
14 導線
16 フレーム導線
18 シェル
20 カプセル材料
22 蛍光体
24 蛍光体からの光
26 チップからの放射線
28 反射性カップ
32 透明ケーシング
34 蛍光体粒子
36 ガス放電デバイス
38 排気ハウジング
40 口金
42 UV発生機
44 高エネルギー電子源
46 充填ガス/水銀蒸気
48 ピン
50 405nmにおける発光曲線
52 y−軸 相対的発光強度
54 x−軸 波長(nm)
56 (Sr0.98Na0.01Ce0.01)3AlO4F
58 (Sr0.98,Na0.01Ce0.01)(Al0.9Si0.1)O4.1F0.9
60 (Sr0.98,Na0.01Ce0.01)(Al0.8Si0.2)O4.2F0.8
62 (Sr0.75Ca0.23Na0.01Ce0.01)(Al0.75Si0.25)O4.25F0.75
Claims (10)
- 約250〜約550nmの波長にピーク強度を有する放射線を放出するように構成された光源(10)、及び
光源に放射結合されるように構成された蛍光体組成物(22)
を含んでなり、蛍光体組成物が一般式((Sr1-zMz)1-(x+w)AwCex)3(Al1-ySiy)O4+y+3(x-w)F1-y-3(x-w)からなる蛍光体を含む、照明装置
式中、0<x≦0.10、0≦y≦0.5、0≦z≦0.5、0≦w≦xであり、AはLi、Na、K、Rb又はこれらの組合せであり、MはCa、Ba、Mg、Zn若しくはSn又はこれらの任意の組合せである。 - 光源(10)が半導体発光ダイオード(LED)である、請求項1記載の照明装置。
- LED(10)が式IniGajAlkNで表される窒化物化合物半導体からなり、ここで0≦i、0≦j、0≦k、i+j+k=1である、請求項2記載の照明装置。
- 光源(10)が、約250〜約400nmの波長にピーク強度を有する光を放出するガス蒸気(46)放電からなる、請求項1記載の照明装置。
- 蛍光体組成物(22)が光源の表面にコートされている、請求項1記載の照明装置。
- 蛍光体組成物(22)が、光源及び蛍光体組成物を包囲するカプセル材料(20)内に分散している、請求項1記載の照明装置。
- 蛍光体組成物(22)が1種以上の追加の蛍光体を含む、請求項1記載の照明装置。
- 1種以上の追加の蛍光体が、Mn4+をドープした複合フッ化物、(Ba,Sr,Ca)5(PO4)3(Cl,F,OH):Eu2+、Ca2Si5N8:Ce3+,Eu2+、(Lu,Ca,Li,Mg,Y)1.5Al3Si9N16:Eu2+,Ce3+若しくは(Ba,Sr,Ca)2Si1-xO4-2x:Eu2+(0≦x≦0.2)又はこれらの組合せからなる、請求項7記載の照明装置。
- Alの少なくとも一部分がB、Ga、Sc若しくはY又はこれらの組合せで置き換えられている、請求項1記載の照明装置。
- Fの少なくとも一部分がCl、Br若しくはI又はこれらの組合せで置き換えられている、請求項1記載の照明装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/256,142 US8329060B2 (en) | 2008-10-22 | 2008-10-22 | Blue-green and green phosphors for lighting applications |
US12/256,142 | 2008-10-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010100825A true JP2010100825A (ja) | 2010-05-06 |
JP5535548B2 JP5535548B2 (ja) | 2014-07-02 |
Family
ID=41581121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009188805A Active JP5535548B2 (ja) | 2008-10-22 | 2009-08-18 | 照明用青色−緑色及び緑色蛍光体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8329060B2 (ja) |
EP (1) | EP2180032B1 (ja) |
JP (1) | JP5535548B2 (ja) |
KR (1) | KR101619520B1 (ja) |
CN (1) | CN101725847B (ja) |
ES (1) | ES2436659T3 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013137144A1 (ja) | 2012-03-15 | 2013-09-19 | 株式会社 東芝 | 白色照明装置 |
JP2015505327A (ja) * | 2011-09-30 | 2015-02-19 | ゼネラル・エレクトリック・カンパニイ | 蛍光体材料及び関連デバイス |
KR20170026602A (ko) * | 2014-07-02 | 2017-03-08 | 제네럴 일렉트릭 컴퍼니 | 옥시플루오라이드 인광체 조성물 및 이의 조명 장치 |
KR20170054464A (ko) * | 2013-09-09 | 2017-05-17 | 지이 라이팅 솔루션스, 엘엘씨 | Lag, 질화물, 및 pfs 형광체를 사용한 향상된 컬러 선호도 led 광원 |
JP2017529425A (ja) * | 2014-09-09 | 2017-10-05 | ジーイー・ライティング・ソルーションズ,エルエルシー | Lag、窒化物及びpfs蛍光体を用いた色嗜好度の向上したled光源 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8703016B2 (en) | 2008-10-22 | 2014-04-22 | General Electric Company | Phosphor materials and related devices |
TWI385834B (zh) * | 2009-02-06 | 2013-02-11 | Yu Nung Shen | Light emitting diode chip package and manufacturing method thereof |
JP2012530383A (ja) * | 2009-06-16 | 2012-11-29 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | オキシフッ化物蛍光体および固体照明用途のためのオキシフッ化物蛍光体を含む白色発光ダイオード |
KR101055762B1 (ko) * | 2009-09-01 | 2011-08-11 | 서울반도체 주식회사 | 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치 |
DE102009030205A1 (de) * | 2009-06-24 | 2010-12-30 | Litec-Lp Gmbh | Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore |
CN102597161A (zh) * | 2009-10-30 | 2012-07-18 | 加利福尼亚大学董事会 | 用于固态白光照明应用的基于氧氟化物的固溶体磷光体和包括所述磷光体的白光发光二极管 |
CN102652166B (zh) | 2009-12-17 | 2015-04-29 | 皇家飞利浦电子股份有限公司 | 具有光源和波长转换元件的照明设备 |
WO2011073871A2 (en) | 2009-12-17 | 2011-06-23 | Koninklijke Philips Electronics N.V. | Light emitting diode device with luminescent material |
US8593062B2 (en) * | 2010-04-29 | 2013-11-26 | General Electric Company | Color stable phosphors for LED lamps and methods for preparing them |
EP2402648A1 (en) * | 2010-07-01 | 2012-01-04 | Koninklijke Philips Electronics N.V. | TL retrofit LED module outside sealed glass tube |
KR101142758B1 (ko) * | 2010-07-22 | 2012-05-08 | 한국세라믹기술원 | 유리 형광 렌즈를 이용한 발광다이오드 램프 및 그 제조방법 |
US20130143334A1 (en) * | 2011-12-01 | 2013-06-06 | Hung Ta Trading Co., Ltd. | Method of enhancing color rendering index of a white led |
TW201324875A (zh) * | 2011-12-01 | 2013-06-16 | Hung Ta Trading Co Ltd | 增強白光發光二極體演色性之方法 |
US20130178001A1 (en) * | 2012-01-06 | 2013-07-11 | Wen-Lung Chin | Method for Making LED LAMP |
KR101405596B1 (ko) * | 2012-03-15 | 2014-06-10 | 엘지이노텍 주식회사 | 알루미늄 실리케이트계 형광체 및 이의 제조방법 |
KR101430585B1 (ko) * | 2012-06-12 | 2014-08-18 | 한국화학연구원 | Rare earth가 첨가된 oxy-fluoride계 형광체 및 상기 형광체가 적용된 백색 발광소자 |
US9515230B2 (en) * | 2012-07-25 | 2016-12-06 | National Institute For Materials Science | Fluorophore, method for producing same, light-emitting device, and image display device |
KR102259343B1 (ko) | 2012-11-07 | 2021-06-09 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 형광체를 펌핑하는 iii-족 질화물계 레이저 다이오드를 채용한 백색 광원 |
US20160152891A1 (en) * | 2012-12-21 | 2016-06-02 | Merk Patent Gmbh | Phosphors |
US20140327023A1 (en) * | 2013-05-02 | 2014-11-06 | General Electric Company | Phosphor assembly for light emitting devices |
US20150123153A1 (en) * | 2013-11-06 | 2015-05-07 | General Electric Company | Led package with red-emitting phosphors |
US9328878B2 (en) | 2014-07-02 | 2016-05-03 | General Electric Company | Phosphor compositions and lighting apparatus thereof |
US10193030B2 (en) | 2016-08-08 | 2019-01-29 | General Electric Company | Composite materials having red emitting phosphors |
US12129413B2 (en) * | 2016-11-22 | 2024-10-29 | Honeywell International Inc. | Luminescent taggant compositions, luminescent materials including the same, and articles including the same |
US10720554B2 (en) * | 2017-09-20 | 2020-07-21 | General Electric Company | Green-emitting phosphors and devices thereof |
Family Cites Families (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US478395A (en) * | 1892-07-05 | Half to james m | ||
GB8615202D0 (en) | 1986-06-21 | 1986-07-23 | Emi Plc Thorn | Inorganic phosphors |
US4748395A (en) | 1987-08-07 | 1988-05-31 | General Motors Corporation | Dual voltage electrical system |
US5874491A (en) * | 1994-06-09 | 1999-02-23 | Anders; Irving | Phosphorescent highway paint composition |
US6005024A (en) * | 1994-06-09 | 1999-12-21 | Anders; Irving | Phosphorescent epoxy overlay |
EP0812896B1 (en) * | 1995-03-01 | 2001-02-07 | Morii, Toshihiro | Colored composites exhibiting long afterglow characteristics and colored articles exhibiting long afterglow characteristics |
GB9508065D0 (en) * | 1995-04-20 | 1995-06-07 | Saf T Glo Ltd | Emergency lighting |
US6362548B1 (en) * | 1997-04-14 | 2002-03-26 | Donnelly Corporation | Housing with integral gasket components for a rearview mirror actuator assembly |
US6375864B1 (en) | 1998-11-10 | 2002-04-23 | M.A. Hannacolor, A Division Of M.A. Hanna Company | Daylight/nightglow colored phosphorescent plastic compositions and articles |
US6123871A (en) * | 1999-01-11 | 2000-09-26 | Carroll; Michael Lee | Photoluminescence polymers, their preparation and uses thereof |
US6190577B1 (en) * | 1999-07-20 | 2001-02-20 | Usr Optonix Inc. | Indium-substituted aluminate phosphor and method for making the same |
JP3511083B2 (ja) * | 1999-08-06 | 2004-03-29 | 独立行政法人産業技術総合研究所 | 高輝度応力発光材料、その製造方法及びそれを用いた発光方法 |
US6696126B1 (en) * | 1999-08-12 | 2004-02-24 | The United States Of America As Represented By The Secretary Of The Navy | Visual-tactile signage |
KR100396340B1 (ko) * | 2000-12-19 | 2003-09-02 | 주식회사 글로얀 | 축광특성을 갖는 합성섬유사 및 이의 제조방법 |
EP1116755A1 (en) | 2000-01-10 | 2001-07-18 | Sicpa Holding S.A. | Coating composition, preferably printing ink for security applications, method for producing a coating composition and use of glass ceramics |
US6911159B2 (en) * | 2000-06-22 | 2005-06-28 | Nite-Glo Innovations Pty Ltd | Phosphorescent pigments |
US6720799B2 (en) * | 2001-01-11 | 2004-04-13 | Broadcom Corporation | Replica network for linearizing switched capacitor circuits |
KR100715943B1 (ko) * | 2001-01-29 | 2007-05-08 | 삼성전자주식회사 | 액정표시장치 및 그 제조방법 |
US6685852B2 (en) * | 2001-04-27 | 2004-02-03 | General Electric Company | Phosphor blends for generating white light from near-UV/blue light-emitting devices |
CA2451837A1 (en) * | 2001-06-28 | 2003-01-09 | Essential Therapeutics, Inc. | Structure-based drug design methods for identifying d-ala-d-ala ligase inhibitors as antibacterial drugs |
DE10210009B3 (de) * | 2002-03-07 | 2004-01-08 | Fresenius Medical Care Deutschland Gmbh | Verfahren zur Bestimmung des Hämatokrit und/oder Blutvolumens und Vorrichtung zur extrakorporalen Blutbehandlung mit einer Einrichtung zur Bestimmung des Hämatokrit und/oder Blutvolumens |
US6761837B2 (en) * | 2002-06-12 | 2004-07-13 | General Electric Company | Europium-activated phosphors containing oxides of rare-earth and group-IIIB metals and method of making the same |
US7022263B2 (en) * | 2002-06-12 | 2006-04-04 | General Electric Company | Europium-activated phosphors containing oxides of rare-earth and group-IIIB metals and method of making the same |
US7391148B1 (en) * | 2002-06-13 | 2008-06-24 | General Electric Company | Phosphor blends for high-CRI fluorescent lamps |
US6809471B2 (en) * | 2002-06-28 | 2004-10-26 | General Electric Company | Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same |
US7024781B1 (en) * | 2002-08-27 | 2006-04-11 | Johnson Level & Tool Mfg. Co., Inc. | Vial illumination feature for a tool such as a level |
US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US7768189B2 (en) * | 2004-08-02 | 2010-08-03 | Lumination Llc | White LEDs with tunable CRI |
KR100622209B1 (ko) * | 2002-08-30 | 2006-09-19 | 젤코어 엘엘씨 | 개선된 효율을 갖는 코팅된 발광다이오드 |
US7800121B2 (en) * | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
US6809781B2 (en) * | 2002-09-24 | 2004-10-26 | General Electric Company | Phosphor blends and backlight sources for liquid crystal displays |
US6969475B2 (en) * | 2002-11-22 | 2005-11-29 | Kb Alloys | Photoluminescent alkaline earth aluminate and method for making the same |
US6867536B2 (en) * | 2002-12-12 | 2005-03-15 | General Electric Company | Blue-green phosphor for fluorescent lighting applications |
US6965193B2 (en) | 2002-12-12 | 2005-11-15 | General Electric Company | Red phosphors for use in high CRI fluorescent lamps |
US20040113539A1 (en) * | 2002-12-12 | 2004-06-17 | Thomas Soules | Optimized phosphor system for improved efficacy lighting sources |
DE10259946A1 (de) * | 2002-12-20 | 2004-07-15 | Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. | Leuchtstoffe zur Konversion der ultravioletten oder blauen Emission eines lichtemittierenden Elementes in sichtbare weiße Strahlung mit sehr hoher Farbwiedergabe |
US6844671B2 (en) * | 2003-01-31 | 2005-01-18 | General Electric Company | High luminosity phosphor blends for generating white light from near-UV/blue light-emitting devices |
US6936857B2 (en) * | 2003-02-18 | 2005-08-30 | Gelcore, Llc | White light LED device |
US6847162B2 (en) * | 2003-04-29 | 2005-01-25 | General Electric Company | Light source with organic layer and photoluminescent layer |
US7635203B2 (en) * | 2003-05-05 | 2009-12-22 | Lumination Llc | Method and apparatus for LED panel lamp systems |
CN1802533B (zh) * | 2003-05-05 | 2010-11-24 | 吉尔科有限公司 | 基于led的灯泡 |
WO2005004202A2 (en) * | 2003-06-24 | 2005-01-13 | Gelcore Llc | Full spectrum phosphor blends for white light generation with led chips |
US7088038B2 (en) * | 2003-07-02 | 2006-08-08 | Gelcore Llc | Green phosphor for general illumination applications |
US7026755B2 (en) * | 2003-08-07 | 2006-04-11 | General Electric Company | Deep red phosphor for general illumination applications |
US7488432B2 (en) | 2003-10-28 | 2009-02-10 | Nichia Corporation | Fluorescent material and light-emitting device |
US7252787B2 (en) * | 2003-10-29 | 2007-08-07 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
US7442326B2 (en) | 2003-10-29 | 2008-10-28 | Lumination Llc | Red garnet phosphors for use in LEDs |
US7094362B2 (en) * | 2003-10-29 | 2006-08-22 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
US7128849B2 (en) * | 2003-10-31 | 2006-10-31 | General Electric Company | Phosphors containing boron and metals of Group IIIA and IIIB |
TWI250664B (en) * | 2004-01-30 | 2006-03-01 | South Epitaxy Corp | White light LED |
EP1718715B1 (en) * | 2004-02-20 | 2010-09-08 | Lumination, LLC | Rules for efficient light sources using phosphor converted leds |
US7573072B2 (en) | 2004-03-10 | 2009-08-11 | Lumination Llc | Phosphor and blends thereof for use in LEDs |
US7327078B2 (en) * | 2004-03-30 | 2008-02-05 | Lumination Llc | LED illumination device with layered phosphor pattern |
US7229573B2 (en) * | 2004-04-20 | 2007-06-12 | Gelcore, Llc | Ce3+ and Eu2+ doped phosphors for light generation |
US20070040502A1 (en) * | 2004-04-20 | 2007-02-22 | Gelcore Llc | High CRI LED lamps utilizing single phosphor |
US7077980B2 (en) * | 2004-05-03 | 2006-07-18 | General Electric Company | Phosphors containing oxides of alkaline-earth and group-13 metals, and light sources incorporating the same |
US7077978B2 (en) * | 2004-05-14 | 2006-07-18 | General Electric Company | Phosphors containing oxides of alkaline-earth and group-IIIB metals and white-light sources incorporating same |
US8324640B2 (en) * | 2004-07-02 | 2012-12-04 | GE Lighting Solutions, LLC | LED-based edge lit illumination system |
US7453195B2 (en) * | 2004-08-02 | 2008-11-18 | Lumination Llc | White lamps with enhanced color contrast |
US20060181192A1 (en) * | 2004-08-02 | 2006-08-17 | Gelcore | White LEDs with tailorable color temperature |
US20070241657A1 (en) * | 2004-08-02 | 2007-10-18 | Lumination, Llc | White light apparatus with enhanced color contrast |
US7601276B2 (en) * | 2004-08-04 | 2009-10-13 | Intematix Corporation | Two-phase silicate-based yellow phosphor |
US7265493B2 (en) * | 2004-10-04 | 2007-09-04 | General Electric Company | Mercury-free compositions and radiation sources incorporating same |
US7321191B2 (en) * | 2004-11-02 | 2008-01-22 | Lumination Llc | Phosphor blends for green traffic signals |
US7497973B2 (en) * | 2005-02-02 | 2009-03-03 | Lumination Llc | Red line emitting phosphor materials for use in LED applications |
US7358542B2 (en) * | 2005-02-02 | 2008-04-15 | Lumination Llc | Red emitting phosphor materials for use in LED and LCD applications |
US7648649B2 (en) | 2005-02-02 | 2010-01-19 | Lumination Llc | Red line emitting phosphors for use in led applications |
DE102005005263A1 (de) | 2005-02-04 | 2006-08-10 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Gelb emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
US7253675B2 (en) * | 2005-03-08 | 2007-08-07 | Texas Instruments Incorporated | Bootstrapping circuit capable of sampling inputs beyond supply voltage |
US7274045B2 (en) * | 2005-03-17 | 2007-09-25 | Lumination Llc | Borate phosphor materials for use in lighting applications |
US20060222757A1 (en) * | 2005-03-31 | 2006-10-05 | General Electric Company | Method for making phosphors |
WO2006106883A1 (ja) | 2005-03-31 | 2006-10-12 | Dowa Electronics Materials Co., Ltd. | 蛍光体、蛍光体シートおよびその製造方法、並びに当該蛍光体を用いた発光装置 |
US7329371B2 (en) * | 2005-04-19 | 2008-02-12 | Lumination Llc | Red phosphor for LED based lighting |
AU2006237373A1 (en) * | 2005-04-20 | 2006-10-26 | Etech Ag | Novel materials used for emitting light |
KR100704492B1 (ko) | 2005-05-02 | 2007-04-09 | 한국화학연구원 | 형광체를 이용한 백색 발광 다이오드의 제조 방법 |
US7319246B2 (en) * | 2005-06-23 | 2008-01-15 | Lumination Llc | Luminescent sheet covering for LEDs |
KR100612962B1 (ko) | 2005-06-29 | 2006-08-16 | 한국화학연구원 | 삼파장 형광체를 이용한 백색 발광 다이오드 |
US7707810B2 (en) * | 2005-07-15 | 2010-05-04 | Cnh America Llc | Apparatus and method to vary the reel speed versus ground speed of an agricultural windrower |
KR100927154B1 (ko) * | 2005-08-03 | 2009-11-18 | 인터매틱스 코포레이션 | 실리케이트계 오렌지 형광체 |
US7859182B2 (en) * | 2005-08-31 | 2010-12-28 | Lumination Llc | Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor |
US7262439B2 (en) * | 2005-11-22 | 2007-08-28 | Lumination Llc | Charge compensated nitride phosphors for use in lighting applications |
US7501753B2 (en) * | 2005-08-31 | 2009-03-10 | Lumination Llc | Phosphor and blends thereof for use in LEDs |
US20070114561A1 (en) * | 2005-11-22 | 2007-05-24 | Comanzo Holly A | High efficiency phosphor for use in LEDs |
TWI317756B (en) * | 2006-02-07 | 2009-12-01 | Coretronic Corp | Phosphor, fluorescent gel, and light emitting diode device |
KR100735453B1 (ko) | 2006-02-22 | 2007-07-04 | 삼성전기주식회사 | 백색 발광 장치 |
US7449129B2 (en) | 2006-03-07 | 2008-11-11 | Osram Sylvania Inc. | Ce,Pr-coactivated strontium magnesium aluminate phosphor and lamp containing same |
CN100590173C (zh) * | 2006-03-24 | 2010-02-17 | 北京有色金属研究总院 | 一种荧光粉及其制造方法和所制成的电光源 |
US20070236956A1 (en) | 2006-03-31 | 2007-10-11 | Gelcore, Llc | Super bright LED power package |
KR100785492B1 (ko) * | 2006-04-17 | 2007-12-13 | 한국과학기술원 | 새로운 조성의 황색 발광 Ce3+부활 실리케이트황색형광체, 그 제조방법 및 상기 형광체를 포함하는 백색발광 다이오드 |
US20070273282A1 (en) * | 2006-05-25 | 2007-11-29 | Gelcore Llc | Optoelectronic device |
US7842960B2 (en) * | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
US7648650B2 (en) * | 2006-11-10 | 2010-01-19 | Intematix Corporation | Aluminum-silicate based orange-red phosphors with mixed divalent and trivalent cations |
CN101182416B (zh) | 2006-11-13 | 2010-09-22 | 北京有色金属研究总院 | 含二价金属元素的铝酸盐荧光粉及制造方法和发光器件 |
EP2843716A3 (en) | 2006-11-15 | 2015-04-29 | The Regents of The University of California | Textured phosphor conversion layer light emitting diode |
US20080171229A1 (en) * | 2007-01-17 | 2008-07-17 | General Electric Company | Method of producing a palette of colors for persistent phosphors and phosphors made by same |
US8003012B2 (en) * | 2007-01-17 | 2011-08-23 | General Electric Company | Method for producing a palette of colors for persistent phosphors and phosphors made by same |
US8168085B2 (en) * | 2008-01-03 | 2012-05-01 | University Of South Carolina | White light phosphors for fluorescent lighting |
US8163203B2 (en) * | 2008-02-27 | 2012-04-24 | The Regents Of The University Of California | Yellow emitting phosphors based on Ce3+-doped aluminate and via solid solution for solid-state lighting applications |
CN101270286B (zh) | 2008-05-21 | 2011-07-20 | 中国科学院长春应用化学研究所 | 一种紫外及近紫外激发的白光led用荧光粉及其制备方法 |
US8168086B2 (en) | 2008-06-03 | 2012-05-01 | University Of South Carolina | Inorganic luminescent phosphor materials for lighting |
-
2008
- 2008-10-22 US US12/256,142 patent/US8329060B2/en active Active
-
2009
- 2009-08-14 ES ES09167926.6T patent/ES2436659T3/es active Active
- 2009-08-14 EP EP09167926.6A patent/EP2180032B1/en active Active
- 2009-08-18 JP JP2009188805A patent/JP5535548B2/ja active Active
- 2009-08-19 KR KR1020090076547A patent/KR101619520B1/ko active Active
- 2009-08-21 CN CN200910167355.9A patent/CN101725847B/zh active Active
Non-Patent Citations (1)
Title |
---|
JPN6013044867; Journal of Solid Sate Chemistry Vol.172(2003), pp.89-94, 2003 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015505327A (ja) * | 2011-09-30 | 2015-02-19 | ゼネラル・エレクトリック・カンパニイ | 蛍光体材料及び関連デバイス |
WO2013137144A1 (ja) | 2012-03-15 | 2013-09-19 | 株式会社 東芝 | 白色照明装置 |
US8907558B2 (en) | 2012-03-15 | 2014-12-09 | Kabushiki Kaisha Toshiba | White light emitting device with red and green-yellow phosphor |
EP3188262A1 (en) | 2012-03-15 | 2017-07-05 | Kabushiki Kaisha Toshiba | White light emitting device |
KR20170054464A (ko) * | 2013-09-09 | 2017-05-17 | 지이 라이팅 솔루션스, 엘엘씨 | Lag, 질화물, 및 pfs 형광체를 사용한 향상된 컬러 선호도 led 광원 |
US10240087B2 (en) | 2013-09-09 | 2019-03-26 | GE Lighting Solutions, LLC | Enhanced color-preference LED light sources using lag, nitride, and PFS phosphors |
KR102483038B1 (ko) | 2013-09-09 | 2022-12-29 | 사반트 테크놀로지스 엘엘씨 | Lag, 질화물, 및 pfs 형광체를 사용한 향상된 컬러 선호도 led 광원 |
KR20170026602A (ko) * | 2014-07-02 | 2017-03-08 | 제네럴 일렉트릭 컴퍼니 | 옥시플루오라이드 인광체 조성물 및 이의 조명 장치 |
JP2017527639A (ja) * | 2014-07-02 | 2017-09-21 | ゼネラル・エレクトリック・カンパニイ | オキシフッ化物蛍光体組成物及びその照明装置 |
KR102503519B1 (ko) | 2014-07-02 | 2023-02-23 | 제네럴 일렉트릭 컴퍼니 | 옥시플루오라이드 인광체 조성물 및 이의 조명 장치 |
JP2017529425A (ja) * | 2014-09-09 | 2017-10-05 | ジーイー・ライティング・ソルーションズ,エルエルシー | Lag、窒化物及びpfs蛍光体を用いた色嗜好度の向上したled光源 |
Also Published As
Publication number | Publication date |
---|---|
EP2180032B1 (en) | 2013-10-16 |
EP2180032A3 (en) | 2010-11-10 |
EP2180032A2 (en) | 2010-04-28 |
KR101619520B1 (ko) | 2016-05-10 |
KR20100044691A (ko) | 2010-04-30 |
CN101725847A (zh) | 2010-06-09 |
JP5535548B2 (ja) | 2014-07-02 |
ES2436659T3 (es) | 2014-01-03 |
US20100096974A1 (en) | 2010-04-22 |
CN101725847B (zh) | 2014-09-17 |
US8329060B2 (en) | 2012-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5535548B2 (ja) | 照明用青色−緑色及び緑色蛍光体 | |
US7274045B2 (en) | Borate phosphor materials for use in lighting applications | |
JP6200891B2 (ja) | 蛍光体材料及び関連デバイス | |
US6765237B1 (en) | White light emitting device based on UV LED and phosphor blend | |
US8703016B2 (en) | Phosphor materials and related devices | |
US7026755B2 (en) | Deep red phosphor for general illumination applications | |
JP5188687B2 (ja) | 蛍光体及びその製造法並びに発光装置 | |
US7906790B2 (en) | Full spectrum phosphor blends for white light generation with LED chips | |
TWI547545B (zh) | 磷光體 | |
TWI502051B (zh) | 螢光材料及使用彼之發光裝置 | |
EP1735816A2 (en) | Phosphor and blends thereof for use in leds | |
CN101151348A (zh) | 用于具有改善的色彩品质的发光应用的氧氮化物磷光体 | |
US8440104B2 (en) | Kimzeyite garnet phosphors | |
JP5756540B2 (ja) | 蛍光体及び発光装置 | |
JP6640753B2 (ja) | 蛍光体組成物及びそれからなる照明器具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120815 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130903 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130910 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131022 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140325 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140423 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5535548 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |