JP5756540B2 - 蛍光体及び発光装置 - Google Patents
蛍光体及び発光装置 Download PDFInfo
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- JP5756540B2 JP5756540B2 JP2014053989A JP2014053989A JP5756540B2 JP 5756540 B2 JP5756540 B2 JP 5756540B2 JP 2014053989 A JP2014053989 A JP 2014053989A JP 2014053989 A JP2014053989 A JP 2014053989A JP 5756540 B2 JP5756540 B2 JP 5756540B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
Description
以下の実施形態を用いて本発明を説明するが、本発明はこれに限定されるものではない。
(1)蛍光体の輝度及び色度座標:
蛍光体の輝度及び色度座標は、波長455nmの光を発するように設定した株式会社トプコンテクノハウスの輝度計(SR−3A)を用いて測定した。測定値の測定誤差は±0.3%以内とする。
主波長は、Jobin YVONのFluoro Max−3によって測定した。主波長とは、波長455nmの光によって励起される蛍光体の発光スペクトルにおいて発光強度最大の波長を意味する。
(3−1a)機器:
測定は、誘導結合プラズマ(ICP)原子発光分光計(ULTIMA−2型、Jobin Yvon Technology)を用いて行った。
0.1gのサンプルを正確に秤量し、白金坩堝内に入れた。1gのNa2CO3を白金坩堝に添加し、サンプルと均一に混合した。次いで、混合物を1200℃の高温炉によって融合させた(加熱条件:温度を室温から1200℃まで2時間かけて上昇させ、1200℃で5時間保持した)。次いで、融合生成物を冷却し、25mlのHCl(36%)等の酸性溶液中に添加した後、加熱して溶液が透明になるまで溶解させた。次いで、溶液を冷却後、100mL容のPFAメスフラスコ内に入れ、純水をフラスコの標線まで適量(quantitatively)添加した。
窒素/酸素分析装置(株式会社堀場製作所、EMGA−620W)。
20mgの蛍光体をSnカプセルに入れた後、カプセルを坩堝に入れ、測定した。
蛍光体を空気中に置き、高温で長時間焼成する(400℃、12時間)。
輝度保持率とは、信頼性試験後の輝度値に対する信頼性試験前の輝度値の比率を指し、(信頼性試験前の輝度値/信頼性試験後の輝度値)×100%に等しい。
Sr金属(3N7、99.97%)及びBa金属(2N、99%)を粉砕した後、純窒素雰囲気中それぞれ750℃及び700℃で24時間焼結して、それぞれSr3N2及びBa3N2を形成した。
実施形態1〜実施形態11及び比較例1〜比較例3の蛍光体を、Ba3N2、Sr3N2、Si3N4及びEu2O3の使用量が異なる以外は同様の方法で合成した。実施形態1の蛍光体の合成方法を例として以下に説明する。
Claims (10)
- 蛍光体であって、組成式(BaaSr1−a)2−zSi5ObNn:EuZ(0.03<a<0.75、a≠1−a、0<b<1、7<n<9、0.03<z<0.3である)の組成を有する、蛍光体。
- 0.3≦a≦0.7、0<b<1、7<n<9、0.04≦z≦0.2である、請求項1に記載の蛍光体。
- Ba:Sr:Euが0.1〜1.45:0.5〜1.7:0.05〜0.2である、請求項1〜2のいずれか1項に記載の蛍光体。
- Ba:Sr:Euが0.7〜1.25:0.62〜1.24:0.06〜0.13である、請求項1〜3のいずれか1項に記載の蛍光体。
- 前記蛍光体が波長455nmの励起光によって励起される場合、該蛍光体からの放出光のCIE 1931色度座標(x,y)が0.45≦x≦0.72、0.2≦y≦0.5である、請求項1〜4のいずれか1項に記載の蛍光体。
- 複数の蛍光体粒子を含む、請求項1〜5のいずれか1項に記載の蛍光体。
- 前記蛍光体粒子の平均粒径(D50)が6.2μmを超え乃至14.4μm未満である、請求項1〜6のいずれか1項に記載の蛍光体。
- 前記蛍光体粒子の10%粒径(D10)が3.4μmを超え乃至8.3μm未満である、請求項1〜7のいずれか1項に記載の蛍光体。
- 前記蛍光体粒子の各々が長軸及び短軸を有し、該長軸は該蛍光体粒子の表面上の任意の2点間の最も長い距離であり、該短軸は、該長軸と垂直に交差する、該蛍光体粒子の表面上の同一線上の任意の2点間の最も長い距離であり、該短軸に対する該長軸の比率が1.24を超え乃至4.1未満である、請求項1〜8のいずれか1項に記載の蛍光体。
- 発光装置であって、
半導体発光素子と、
請求項1〜9のいずれか1項に記載の蛍光体と、
を備え、前記蛍光体が前記半導体発光素子から放出される励起光によって励起され、該励起光を転換して、該励起光の励起波長とは異なる放出波長を有する放出光を発する、発光装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102110885A TWI464238B (zh) | 2013-03-27 | 2013-03-27 | 螢光體與發光裝置 |
TW102110885 | 2013-03-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014189796A JP2014189796A (ja) | 2014-10-06 |
JP5756540B2 true JP5756540B2 (ja) | 2015-07-29 |
Family
ID=51594867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014053989A Active JP5756540B2 (ja) | 2013-03-27 | 2014-03-17 | 蛍光体及び発光装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9397272B2 (ja) |
JP (1) | JP5756540B2 (ja) |
CN (1) | CN104073251A (ja) |
TW (1) | TWI464238B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6288061B2 (ja) * | 2015-12-10 | 2018-03-07 | 日亜化学工業株式会社 | 発光装置の製造方法 |
US10283933B1 (en) * | 2017-10-23 | 2019-05-07 | The Board Of Trustees Of The University Of Illinois | Transistor laser electrical and optical bistable switching |
JP6508368B2 (ja) * | 2018-02-07 | 2019-05-08 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (25)
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JP4009828B2 (ja) | 2002-03-22 | 2007-11-21 | 日亜化学工業株式会社 | 窒化物蛍光体及びその製造方法 |
KR100961342B1 (ko) | 2002-03-22 | 2010-06-04 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 형광체와 그 제조 방법 및 발광 장치 |
JP2004018545A (ja) * | 2002-06-12 | 2004-01-22 | Konica Minolta Holdings Inc | 蛍光体 |
JP2004131583A (ja) | 2002-10-10 | 2004-04-30 | Fuji Photo Film Co Ltd | El蛍光体粉末およびel蛍光素子 |
MY149573A (en) * | 2002-10-16 | 2013-09-13 | Nichia Corp | Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor |
JP4207537B2 (ja) * | 2002-11-08 | 2009-01-14 | 日亜化学工業株式会社 | 蛍光体および発光装置 |
JP4511885B2 (ja) * | 2004-07-09 | 2010-07-28 | Dowaエレクトロニクス株式会社 | 蛍光体及びled並びに光源 |
US7671529B2 (en) * | 2004-12-10 | 2010-03-02 | Philips Lumileds Lighting Company, Llc | Phosphor converted light emitting device |
EP1878778A4 (en) * | 2005-03-31 | 2012-04-04 | Mitsubishi Chem Corp | FLUORESCENT, FLUORESCENT FIBER, AND METHOD FOR THE PRODUCTION THEREOF, AND FLUORESCENT RESIN-BASED LUMINESCENCE DEVICE |
CN101379164B (zh) * | 2006-02-10 | 2012-11-21 | 三菱化学株式会社 | 荧光体及其制造方法、含荧光体的组合物、发光装置、图像显示装置和照明装置 |
EP2036966B1 (en) * | 2006-07-05 | 2017-10-25 | Ube Industries, Ltd. | Sialon-base oxynitride phosphors and process for production thereof |
EP2060616A4 (en) | 2006-09-15 | 2010-08-04 | Mitsubishi Chem Corp | FLUORESCENT, MANUFACTURING METHOD, FLUORESCENT COMPOSITION, LIGHTING DEVICE, PICTURE INDICATOR AND LIGHTING DEVICE |
KR100946015B1 (ko) * | 2007-01-02 | 2010-03-09 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 lcd 백라이트용 광원모듈 |
JP5368985B2 (ja) * | 2007-07-09 | 2013-12-18 | シャープ株式会社 | 蛍光体粒子群およびそれを用いた発光装置 |
EP2246409B1 (en) * | 2008-01-21 | 2014-04-16 | Nichia Corporation | Light emitting apparatus |
KR101265030B1 (ko) * | 2008-08-13 | 2013-05-24 | 우베 고산 가부시키가이샤 | Li 함유 α-사이알론계 형광체와 그 제조방법, 조명 기구 및 화상 표시 장치 |
JP5641384B2 (ja) * | 2008-11-28 | 2014-12-17 | 独立行政法人物質・材料研究機構 | 表示装置用照明装置及び表示装置 |
WO2010087348A1 (ja) * | 2009-01-27 | 2010-08-05 | 電気化学工業株式会社 | α型サイアロン蛍光体、その製造法及び発光装置 |
KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
TWI393764B (zh) * | 2010-10-15 | 2013-04-21 | Chi Mei Corp | A phosphor and a light emitting device |
TW201213506A (en) * | 2010-09-30 | 2012-04-01 | Chi Mei Corp | Phosphor and luminous device |
KR101810234B1 (ko) * | 2010-12-01 | 2017-12-18 | 코닌클리케 필립스 엔.브이. | 적색 방출 발광 물질 |
TW201219543A (en) * | 2011-04-01 | 2012-05-16 | Chi Mei Corp | having the formula of Ii-Mm-Aa-Bb-Ot-Nn:Zr and providing the high luminance and durability |
US20130200425A1 (en) * | 2012-02-03 | 2013-08-08 | Shin-Etsu Chemical Co., Ltd | Phosphor-containing adhesive silicone composition sheet, and method of producing light-emitting device using same |
WO2014008970A1 (de) * | 2012-07-13 | 2014-01-16 | Merck Patent Gmbh | Verfahren zur herstellung von leuchtstoffen |
-
2013
- 2013-03-27 TW TW102110885A patent/TWI464238B/zh active
- 2013-08-08 CN CN201310342647.8A patent/CN104073251A/zh active Pending
- 2013-11-12 US US14/077,285 patent/US9397272B2/en not_active Expired - Fee Related
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2014
- 2014-03-17 JP JP2014053989A patent/JP5756540B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20140291712A1 (en) | 2014-10-02 |
US9397272B2 (en) | 2016-07-19 |
TWI464238B (zh) | 2014-12-11 |
JP2014189796A (ja) | 2014-10-06 |
CN104073251A (zh) | 2014-10-01 |
TW201437330A (zh) | 2014-10-01 |
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