JP2010024506A - Method for producing boron-doped diamond, boron-doped diamond, and electrode - Google Patents
Method for producing boron-doped diamond, boron-doped diamond, and electrode Download PDFInfo
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- 239000010432 diamond Substances 0.000 title claims abstract description 180
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 179
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 84
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 31
- 239000010937 tungsten Substances 0.000 claims abstract description 31
- 230000003746 surface roughness Effects 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 20
- 229910052796 boron Inorganic materials 0.000 claims description 16
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 15
- 238000005229 chemical vapour deposition Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 63
- 238000000034 method Methods 0.000 description 29
- 239000000446 fuel Substances 0.000 description 24
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 238000005259 measurement Methods 0.000 description 14
- 238000000151 deposition Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 238000010298 pulverizing process Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229920000557 Nafion® Polymers 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 229910021397 glassy carbon Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 150000007661 iron cyano complex Chemical class 0.000 description 5
- 238000009832 plasma treatment Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000004570 mortar (masonry) Substances 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 235000011164 potassium chloride Nutrition 0.000 description 4
- 239000001103 potassium chloride Substances 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012490 blank solution Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000002484 cyclic voltammetry Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 239000008213 purified water Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- 239000012085 test solution Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002336 sorption--desorption measurement Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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- Carbon And Carbon Compounds (AREA)
- Chemical Vapour Deposition (AREA)
- Inert Electrodes (AREA)
Abstract
Description
本発明は、例えば、電極等に適用できるホウ素ドープダイヤモンドの製造方法、ホウ素ドープダイヤモンド、及び電極に関する。 The present invention relates to a method for producing boron-doped diamond that can be applied to, for example, an electrode, a boron-doped diamond, and an electrode.
ホウ素をドープしたダイヤモンド(以下、ホウ素ドープダイヤモンドとする)は、導電性があり、工業電解や電気化学センサー等の電極に利用できる。また、ホウ素ドープダイヤモンドは、絶縁体のダイヤモンドよりも電子放出しやすく、電界電子放出デバイスへの応用も検討されている。特に、粉体(粒子状)のホウ素ドープダイヤモンドは、成形し易く大表面積となることから、応用範囲が広くなる。粉体のホウ素ドープダイヤモンドを製造する方法として、以下の方法が考えられる。
(1)ダイヤモンド砥粒の製造方法と同じように、高温高圧法によって作製したダイヤモンドの塊を粉砕して導電性ダイヤモンド粒子を得る方法(特許文献1〜3参照)。具体的には、ホウ素を0.5wt%以上15wt%以下含む黒鉛と、ダイヤモンド転換金属触媒とを、1200℃以上の温度及び4.5GPa以上の圧力の高温高圧下で共存させ、黒鉛をダイヤモンドに変換すると、20〜30μmの微粒子が集合した7mm径のダイヤモンド集合体が得られる。そのダイヤモンド集合体を乳鉢で擦りつぶしてダイヤモンド粒子を製造する。
(2)マイクロ波プラズマCVD(Chemical Vapor Deposition)法によって、粒子状材料の表面に直接ダイヤモンドを成膜する方法。流動層を用いたバッチ式(特許文献4〜5参照)や、回転反応容器の回転と勾配を利用した方式(特許文献6参照)が開示されている。具体的には、タングステンやモリブデン等の耐熱金属の粉末や、シリコンカーバイド、タングステンカーバイド、ダイヤモンド等のセラミックスの粉末をダイヤモンド析出材料として、プラズマ発生室に入れる。流動法、振動床法、移動床法等の粉体流動手段によって、該ダイヤモンド析出材料を流動状態に保ち、流動層中にプラズマを励起することで、ダイヤモンド析出材料の表面に導電性ダイヤモンドを析出させて成る粉体を得る。
(3)核付け処理したシリコンウェハにダイヤモンドを成膜し、次に、フッ化水素酸等によってシリコンを溶解し、自立ダイヤモンドを得た後、乳鉢等による粉砕を行って、導電性ダイヤモンド粒子を製造する方法。
(1) A method for obtaining conductive diamond particles by pulverizing a lump of diamond produced by a high-temperature and high-pressure method, as in the method for producing diamond abrasive grains (see Patent Documents 1 to 3). Specifically, graphite containing boron in an amount of 0.5 wt% or more and 15 wt% or less and a diamond conversion metal catalyst are allowed to coexist at a temperature of 1200 ° C. or higher and a pressure of 4.5 GPa or higher at a high temperature and a high pressure. When converted, a diamond aggregate having a diameter of 7 mm in which fine particles of 20 to 30 μm are aggregated is obtained. The diamond aggregate is crushed with a mortar to produce diamond particles.
(2) A method of directly forming a diamond film on the surface of a particulate material by a microwave plasma CVD (Chemical Vapor Deposition) method. A batch system using a fluidized bed (see Patent Documents 4 to 5) and a system (see Patent Document 6) using rotation and gradient of a rotating reaction vessel are disclosed. Specifically, a heat-resistant metal powder such as tungsten or molybdenum, or a ceramic powder such as silicon carbide, tungsten carbide, or diamond is placed in the plasma generation chamber as a diamond deposition material. Conductive diamond is deposited on the surface of the diamond deposition material by maintaining the diamond deposition material in a fluidized state by powder flow means such as a fluidized bed method, a vibrating bed method, and a moving bed method, and exciting the plasma in the fluidized bed. To obtain a powder.
(3) Diamond is deposited on the nucleated silicon wafer, then silicon is dissolved with hydrofluoric acid or the like to obtain self-supporting diamond, and then pulverized with a mortar or the like to obtain conductive diamond particles. How to manufacture.
上記(1)の方法では、得られた導電性ダイヤモンド粒子中に、金属触媒である鉄やコバルト等の不純物が混在するため、王水等の強酸による洗浄が後処理として必要となり、粉体の導電性ダイヤモンドを製造するための工程が煩雑となる。 In the method (1), impurities such as iron and cobalt, which are metal catalysts, are mixed in the obtained conductive diamond particles, so that washing with a strong acid such as aqua regia is required as a post-treatment, The process for producing the conductive diamond becomes complicated.
また、導電性ダイヤモンド粒子を得るためには、7mm径のダイヤモンド集合体を粉砕しなければならないが、高硬度のダイヤモンドの粉砕には大変な労力が必要となり、粉砕できたとしても、大きさが様々なダイヤモンド粒子の混合物となるため、所定の粒径を有するダイヤモンド粒子を得るためには、煩雑な精製作業が必要となる。 In order to obtain conductive diamond particles, a diamond aggregate having a diameter of 7 mm must be pulverized. However, pulverizing high-hardness diamond requires a great amount of labor. Since it becomes a mixture of various diamond particles, a complicated refining operation is required to obtain diamond particles having a predetermined particle size.
上記(2)の方法では、プラズマ発生室の基板ホルダー上に置かれたダイヤモンド析出材料の上面からプラズマが照射されるため、そのままでは、ダイヤモンド析出材料の表面全面に導電性のダイヤモンド層を析出させることは困難である。これを解決する方法として、ダイヤモンド析出材料の流動層を用いる方法や、ダイヤモンド析出材料の粉体を連続供給する機構を盛り込んだ方法が考案されているが、粒径が数μm以下の粒子は凝集しやすく、均一にダイヤモンドを成膜することが難しい。さらに、反応容器を回転させたりすると、プラズマを安定に保持することが困難になり、また、プラズマに曝されるダイヤモンド析出材料の粉体が同一平面に位置するように調整する必要が生じる等、製造条件を整えることが困難になってしまう。 In the method (2), since the plasma is irradiated from the upper surface of the diamond deposition material placed on the substrate holder in the plasma generation chamber, a conductive diamond layer is deposited on the entire surface of the diamond deposition material as it is. It is difficult. As a method for solving this, a method using a fluidized bed of diamond deposition material and a method incorporating a mechanism for continuously supplying powder of diamond deposition material have been devised, but particles having a particle size of several μm or less are agglomerated. It is easy to form, and it is difficult to form a diamond film uniformly. Furthermore, if the reaction vessel is rotated, it becomes difficult to stably maintain the plasma, and it is necessary to adjust the powder of the diamond deposition material exposed to the plasma to be located on the same plane. It becomes difficult to adjust the manufacturing conditions.
上記(3)の方法では、基板となるシリコンを再生することができず、また、シリコンを溶解する操作に多大な時間を要する。さらに、シリコンの溶解にはフッ素系の強酸を使うので、環境負荷が大きくなってしまう。 In the method (3), silicon used as a substrate cannot be regenerated, and an operation for dissolving silicon takes a long time. Furthermore, since a strong fluorine-based acid is used for dissolving silicon, the environmental load increases.
本発明は、以上の点に鑑みなされたものであり、ホウ素ドープダイヤモンド粒子の製造を容易化することができる、ホウ素ドープダイヤモンドの製造方法、ホウ素ドープダイヤモンド及び電極を提供することを目的とする。 This invention is made | formed in view of the above point, and it aims at providing the manufacturing method of boron dope diamond, the boron dope diamond, and electrode which can make manufacture of boron dope diamond particle | grains easy.
(1)請求項1の発明は、
CVD法を用い、ホウ素ドープダイヤモンドを、タングステン又はその酸化物が少なくとも表面の一部に露出した基板上に成長させることを特徴とするホウ素ドープダイヤモンドの製造方法を要旨とする。
(1) The invention of claim 1
The gist of the present invention is a method for producing boron-doped diamond, characterized in that a CVD method is used to grow boron-doped diamond on a substrate on which tungsten or an oxide thereof is exposed at least at a part of the surface.
本発明では、基板の表面に、タングステン又はその酸化物が露出しているので、少なくともその部分において、ホウ素ドープダイヤモンドを成長させることができる。例えば、図2(a)に示すように、タングステンから成る基板101の表面に薄片状のホウ素ドープダイヤモンド103を成長させることができる。 In the present invention, since tungsten or its oxide is exposed on the surface of the substrate, boron-doped diamond can be grown at least in that portion. For example, as shown in FIG. 2A, flaky boron-doped diamond 103 can be grown on the surface of a substrate 101 made of tungsten.
この薄片状のホウ素ドープダイヤモンド103は、例えば、基板101を室温に冷却することで、基板101から容易に剥離させることができる。そして、薄片状のホウ素ドープダイヤモンド103は、それを容易に粉砕し、粒径の揃った粉体とすることができる。よって、本発明を用いれば、ホウ素ドープダイヤモンドの粉体を容易に製造することができる。
(2)請求項2の発明は、
前記基板の表面粗さが0.5μm以下であることを特徴とする請求項1記載のホウ素ドープダイヤモンドの製造方法を要旨とする。
The flaky boron-doped diamond 103 can be easily separated from the substrate 101 by, for example, cooling the substrate 101 to room temperature. The flaky boron-doped diamond 103 can be easily pulverized into a powder having a uniform particle size. Therefore, if this invention is used, the powder of boron dope diamond can be manufactured easily.
(2) The invention of claim 2
The gist of the method for producing boron-doped diamond according to claim 1, wherein the surface roughness of the substrate is 0.5 μm or less.
本発明では、基板の表面粗さ(Ra)が0.5μm以下であるので、基板上で成長したホウ素ドープダイヤモンドを基板から容易に剥離させることができる。そのため、ホウ素ドープダイヤモンド、及びその粉体の製造が一層容易になる。 In the present invention, since the surface roughness (Ra) of the substrate is 0.5 μm or less, the boron-doped diamond grown on the substrate can be easily separated from the substrate. Therefore, it becomes easier to produce boron-doped diamond and its powder.
基板の表面粗さ(Ra)の下限は、ホウ素ドープダイヤモンドの剥離し易さの点では、特に制限はない。基板の表面粗さ(Ra)が0.01μm以上であれば、基板の表面を仕上げることが容易になる。
(3)請求項3の発明は、
前記基板の表面において、タングステン又はその酸化物から成る領域と、タングステンを含まない領域とが混在することを特徴とする請求項1又は2に記載のホウ素ドープダイヤモンドの製造方法を要旨とする。
The lower limit of the surface roughness (Ra) of the substrate is not particularly limited in terms of ease of peeling of the boron-doped diamond. If the surface roughness (Ra) of the substrate is 0.01 μm or more, it is easy to finish the surface of the substrate.
(3) The invention of claim 3
The gist of the boron-doped diamond manufacturing method according to claim 1, wherein a region made of tungsten or an oxide thereof and a region not containing tungsten are mixed on the surface of the substrate.
本発明によれば、ホウ素ドープダイヤモンドの粉体を一層容易に製造することができる。すなわち、図2(b)に示すように、タングステン又はその酸化物から成る領域と、タングステンを含まない領域とが混在する基板201(例えば、タングステンとチタンとの焼結体)上でホウ素ドープダイヤモンドを成長させると、主として、タングステン又はその酸化物から成る領域において、その領域の大きさに対応した、粒子状のホウ素ドープダイヤモンド203が局所的に成長する。粒子状のホウ素ドープダイヤモンド203は、基板を冷却することにより、基板201から剥離させることができる。 According to the present invention, boron-doped diamond powder can be more easily produced. That is, as shown in FIG. 2B, boron-doped diamond is formed on a substrate 201 (for example, a sintered body of tungsten and titanium) in which a region made of tungsten or its oxide and a region not containing tungsten are mixed. Is grown mainly in a region made of tungsten or an oxide thereof, and the particulate boron-doped diamond 203 corresponding to the size of the region grows locally. The particulate boron-doped diamond 203 can be separated from the substrate 201 by cooling the substrate.
よって、本発明によれば、ホウ素ドープダイヤモンドを粉砕する工程を省略するか、その工程を簡易化して、粒子状のホウ素ドープダイヤモンドを製造することができる。
前記タングステンを含まない領域を構成する物質としては、タングステン又はその酸化物に比べてホウ素ドープダイヤモンドの成長が生じ難い材質であれば広く用いることができ、例えば、銅、カーボン、チタン等が挙げられる。
(4)請求項4の発明は、
前記ホウ素ドープダイヤモンドを前記基板上で成長させた後、前記ホウ素ドープダイヤモンド及び前記基板の温度を、前記成長のときよりも下げる冷却工程を有し、
前記冷却工程のとき、又は前記冷却工程の後、前記基板のうち、前記ホウ素ドープダイヤモンドを成長させた面を水平方向に対し傾斜させることを特徴とする請求項1〜3のいずれかに記載のホウ素ドープダイヤモンドの製造方法を要旨とする。
Therefore, according to this invention, the process which grind | pulverizes a boron dope diamond can be abbreviate | omitted, or the process can be simplified, and a particulate boron dope diamond can be manufactured.
As the material constituting the region not containing tungsten, any material that does not easily grow boron-doped diamond compared to tungsten or its oxide can be used widely, and examples thereof include copper, carbon, and titanium. .
(4) The invention of claim 4
After the boron-doped diamond is grown on the substrate, the cooling step of lowering the temperature of the boron-doped diamond and the substrate than that during the growth,
The surface of the substrate on which the boron-doped diamond is grown is inclined with respect to a horizontal direction during the cooling step or after the cooling step. The gist is a method for producing boron-doped diamond.
本発明では、冷却工程のとき、基板とホウ素ドープダイヤモンドとが剥離すると、冷却工程のとき、又は冷却工程の後において、基板が水平方向に対し傾斜しているため、ホウ素ドープダイヤモンドが基板から滑り落ちる。 In the present invention, if the substrate and the boron-doped diamond are separated during the cooling step, the substrate is inclined with respect to the horizontal direction during the cooling step or after the cooling step, so that the boron-doped diamond slides down from the substrate. .
そのため、ホウ素ドープダイヤモンドの成長工程が終わるたびに、CVDチャンバーを開放し、基板からホウ素ドープダイヤモンドを取り外す工程が不要となり、連続してホウ素ドープダイヤモンドの合成を行うことができる。結果として、ホウ素ドープダイヤモンドの生産性が向上する。 Therefore, every time the growth process of boron-doped diamond is completed, the process of opening the CVD chamber and removing the boron-doped diamond from the substrate becomes unnecessary, and the boron-doped diamond can be continuously synthesized. As a result, the productivity of boron-doped diamond is improved.
前記冷却工程は、基板を室温にて放置する自然冷却であってもよいし、基板を公知の冷却手段を用いて冷却するものであってもよい。
前記基板は、常時傾斜していてもよいし、冷却工程のとき、又は冷却工程の後でのみ傾斜させてもよい。
(5)請求項5の発明は、
請求項1〜4のいずれかに記載のホウ素ドープダイヤモンドの製造方法で製造したホウ素ドープダイヤモンドを要旨とする。
The cooling step may be natural cooling in which the substrate is allowed to stand at room temperature, or may be one in which the substrate is cooled using a known cooling means.
The substrate may be always inclined, or may be inclined only during the cooling process or after the cooling process.
(5) The invention of claim 5
The gist of the boron-doped diamond produced by the method for producing boron-doped diamond according to claim 1.
本発明のホウ素ドープダイヤモンドは、薄片状とすることができるため、粉砕してホウ素ドープダイヤモンドの粉体とすることが容易である。また、粒径が揃ったホウ素ドープダイヤモンドの粉体を得ることができる。
(6)請求項6の発明は、
導電性物質から成る基材の表面に、請求項5記載のホウ素ドープダイヤモンドから成る粉体を担持した電極を要旨とする。
Since the boron-doped diamond of the present invention can be made into a flaky shape, it can be easily pulverized into a boron-doped diamond powder. Further, boron-doped diamond powder having a uniform particle size can be obtained.
(6) The invention of claim 6
The gist is an electrode in which a powder made of boron-doped diamond according to claim 5 is carried on the surface of a base material made of a conductive material.
本発明の電極は、請求項5記載のホウ素ドープダイヤモンドから成る粉体を用いることにより、電気化学特性において優れている。 The electrode of the present invention is excellent in electrochemical characteristics by using the powder made of boron-doped diamond according to claim 5.
本発明の実施形態を説明する。 An embodiment of the present invention will be described.
(1)ホウ素ドープダイヤモンドの製造
マイクロ波プラズマCVD法を用い、表1に示す条件A〜Rにて、ホウ素ドープダイヤモンドを、基板上に成長させた。
(1) Production of boron-doped diamond Boron-doped diamond was grown on the substrate under the conditions A to R shown in Table 1 using a microwave plasma CVD method.
マイクロ波プラズマCVD法において、炭素源及びホウ素源は、アセトンとメタノールとの混合溶媒に酸化ホウ素を溶解させた溶液(ホウ素溶液)を水素ガスでバブリングすることにより発生したガスを用いた。このホウ素溶液におけるB(ホウ素)/C(炭素)比は、10,000ppmとした。また、マイクロ波プラズマCVD法におけるその他の成膜条件は、以下のようにした。 In the microwave plasma CVD method, as the carbon source and the boron source, a gas generated by bubbling with hydrogen gas a solution obtained by dissolving boron oxide in a mixed solvent of acetone and methanol (boron solution) was used. The B (boron) / C (carbon) ratio in this boron solution was 10,000 ppm. Further, other film forming conditions in the microwave plasma CVD method were as follows.
マイクロ波の周波数:2.45GHz
マイクロ波プラズマ出力:8kW
圧力:120Torr
水素ガス:500sccm
基板温度:900℃
各条件において、基板は、上記表1における「基板」に記載された材質のものを用いた。表1における「表面粗さ」は基板の表面粗さ(Ra)であり、測定装置としてキーエンス社のレーザー顕微鏡を用い、非接触で面粗1を測定したものである。表1の「表面処理」における「酸素プラズマ」とは、タングステン基板の表面に酸素プラズマ照射を行い、酸化タングステン層を形成する処理である。
各条件において、ホウ素ドープダイヤモンドの成長は、6〜12時間行い、各条件におけるホウ素ドープダイヤモンドの膜厚を数μmから数十μmとした。ホウ素ドープダイヤモンドを成長させる工程の終了後、CVD装置を自然冷却した。その後、ホウ素ドープダイヤモンドの薄片を、基板から取り外した。
(2)ホウ素ドープダイヤモンドの評価
得られた試料について、走査型電子顕微鏡による表面観察、ラマン分光測定、X線回折測定、四端子法による電気抵抗率測定を用いて、ホウ素ドープダイヤモンドが成長したか否かを確認した。ホウ素ドープダイヤモンドが成長した場合は◎と評価し、成長しなかった場合は×と評価した。
Microwave frequency: 2.45 GHz
Microwave plasma output: 8kW
Pressure: 120 Torr
Hydrogen gas: 500sccm
Substrate temperature: 900 ° C
In each condition, the substrate used was the material described in “Substrate” in Table 1 above. “Surface roughness” in Table 1 is the surface roughness (Ra) of the substrate, and the surface roughness 1 is measured in a non-contact manner using a Keyence laser microscope as a measuring device. “Oxygen plasma” in “Surface treatment” in Table 1 is a treatment for forming a tungsten oxide layer by irradiating the surface of a tungsten substrate with oxygen plasma.
Under each condition, the boron-doped diamond was grown for 6 to 12 hours, and the film thickness of the boron-doped diamond under each condition was changed from several μm to several tens of μm. After completion of the step of growing boron-doped diamond, the CVD apparatus was naturally cooled. Thereafter, the boron-doped diamond flakes were removed from the substrate.
(2) Evaluation of boron-doped diamond Whether the boron-doped diamond has grown using the surface observation by scanning electron microscope, Raman spectroscopic measurement, X-ray diffraction measurement, and electrical resistivity measurement by four-terminal method. Confirmed no. When the boron-doped diamond grew, it was evaluated as “◎”, and when it did not grow, it was evaluated as “x”.
また、ホウ素ドープダイヤモンドと基板との剥離性を以下の基準で評価した。
◎:CVD装置の冷却終了時に、ホウ素ドープダイヤモンドと基板とが完全剥離
○:CVD装置の冷却終了時に、ホウ素ドープダイヤモンドと基板とがほぼ剥離
△:CVD装置の冷却終了時に、ホウ素ドープダイヤモンドと基板とが一部剥離
×:CVD装置の冷却終了時に、ホウ素ドープダイヤモンドと基板とが未剥離
評価結果を上記表1に示す。表1から明らかなように、基板がタングステンから成る場合、ホウ素ドープダイヤモンドの成長が見られた。また、基板の表面粗さが0.5μm以下のタングステン基板を用いた場合、ホウ素ドープダイヤモンドと基板との剥離性が良好であった。
また、基板に酸素プラズマ処理をした場合と、その処理をしていない場合とで、ホウ素ドープダイヤモンドの成長、及び剥離性において差は見られなかった。このことから、例えば、ホウ素ドープダイヤモンドを基板から除去するために、加熱処理や酸素プラズマ照射等の酸化処理を用い、それに伴って基板が酸化されても、基板を再利用することが可能であることが確認できた。
Further, the peelability between the boron-doped diamond and the substrate was evaluated according to the following criteria.
◎: Boron-doped diamond and substrate completely peeled off at the end of cooling of the CVD apparatus ○: Boron-doped diamond and substrate almost peeled off at the end of cooling of the CVD apparatus Δ: Boron-doped diamond and substrate at the end of cooling of the CVD apparatus Is partially peeled x: When the cooling of the CVD apparatus is finished, the boron-doped diamond and the substrate are unpeeled and the evaluation results are shown in Table 1 above. As is apparent from Table 1, when the substrate is made of tungsten, growth of boron-doped diamond was observed. Further, when a tungsten substrate having a surface roughness of 0.5 μm or less was used, the peelability between the boron-doped diamond and the substrate was good.
Moreover, there was no difference in the growth of boron-doped diamond and the releasability between the case where the substrate was subjected to oxygen plasma treatment and the case where the substrate was not treated. From this, for example, in order to remove boron-doped diamond from the substrate, it is possible to reuse the substrate even if the substrate is oxidized along with oxidation treatment such as heat treatment or oxygen plasma irradiation. I was able to confirm.
基本的には前記実施例1の条件と同様にして、ホウ素ドープダイヤモンドを製造した。ただし、本実施例2では、基板として、以下のものを用いた。
鏡面仕上げを施した多角錐(ピラミッド型)のカーボン材料の表面に、高周波マグネトロンスパッタリング装置を用い、タングステン層を形成させたものを基板とした。タングステン層の形成条件は、以下のものとした。
Basically, boron-doped diamond was produced in the same manner as in Example 1. However, in the present Example 2, the following were used as a board | substrate.
A substrate obtained by forming a tungsten layer on a surface of a polygonal pyramid (pyramid type) carbon material with a mirror finish using a high frequency magnetron sputtering apparatus was used. The conditions for forming the tungsten layer were as follows.
ターゲット:純度99.9999%
雰囲気:アルゴンガス
真空度:0.6Pa
出力:70W
成膜時間:1時間
タングステン層の膜厚:5μm
この基板は、ホウ素ドープダイヤモンドを成長させる面が、水平面に対し傾斜している。この基板を用いて前記実施例1の条件と同様にホウ素ドープダイヤモンドを合成したところ、CVD合成中は良好にホウ素ドープダイヤモンドが成長し、CVD合成終了後に基板が自然冷却されると同時に、ホウ素ドープダイヤモンド層が完全に基板から剥離し、多角錐の傾斜に沿って基板から流れ落ち、基板下端で回収することができた。
Target: Purity 99.9999%
Atmosphere: Argon gas Vacuum degree: 0.6 Pa
Output: 70W
Deposition time: 1 hour Tungsten layer thickness: 5 μm
In this substrate, the surface on which the boron-doped diamond is grown is inclined with respect to the horizontal plane. When this substrate was used to synthesize boron-doped diamond in the same manner as in Example 1, the boron-doped diamond grew well during the CVD synthesis, and the substrate was naturally cooled after the CVD synthesis was completed. The diamond layer completely peeled from the substrate, and flowed down from the substrate along the inclination of the polygonal pyramid, and could be recovered at the lower end of the substrate.
そのため、ホウ素ドープダイヤモンドの成長工程が終わるたびに、CVDチャンバーを開放し、基板からホウ素ドープダイヤモンドを取り外す工程が不要となり、連続してホウ素ドープダイヤモンドの合成を行うことができる。結果として、ホウ素ドープダイヤモンドの生産性が向上する。 Therefore, every time the growth process of boron-doped diamond is completed, the process of opening the CVD chamber and removing the boron-doped diamond from the substrate becomes unnecessary, and the boron-doped diamond can be continuously synthesized. As a result, the productivity of boron-doped diamond is improved.
基本的には前記実施例1の条件と同様にして、ホウ素ドープダイヤモンドを製造した。ただし、本実施例3では、基板として、タングステンとチタンとの焼結体を用いた。この焼結体から成る基板は、以下のようにして製造した。 Basically, boron-doped diamond was produced in the same manner as in Example 1. However, in Example 3, a sintered body of tungsten and titanium was used as the substrate. The substrate made of this sintered body was manufactured as follows.
タングステン粉末とカーボン粉末とを混合した後、炭化、粉砕し、タングステンカーバイドを得た。これにチタンカーバイドを混合、造粒し、プレスした後に焼結を行い、整形加工したものをラッピングして、焼結体から成る基板を得た。 After mixing tungsten powder and carbon powder, carbonization and pulverization were performed to obtain tungsten carbide. Titanium carbide was mixed with this, granulated, pressed, then sintered, and the shaped one was wrapped to obtain a substrate made of a sintered body.
この基板の表面を走査型電子顕微鏡とエネルギー分散型X線分析装置(SEM-EDX)とを用いて評価した。図1はホウ素ドープダイヤモンドを成膜する前における基板表面のEDXマッピング図である。10μmから20μm程度の大きさのタングステンの領域(図1において白く見える領域)が、チタンの領域(図1において黒く見える領域)の中で分散していることが確認できた。 The surface of this substrate was evaluated using a scanning electron microscope and an energy dispersive X-ray analyzer (SEM-EDX). FIG. 1 is an EDX mapping diagram of the substrate surface before the boron-doped diamond film is formed. It was confirmed that the tungsten region (region that appears white in FIG. 1) having a size of about 10 μm to 20 μm is dispersed in the titanium region (region that appears black in FIG. 1).
上述した基板を用い、前記実施例1の条件と同様にして、2時間ホウ素ドープダイヤモンドを成長させたところ、終了後にチャンバー内の基板を見ても全く変化は見られず、基板上にホウ素ドープダイヤモンドの膜が存在しなかった。ところが、基板周辺にはホウ素ドープダイヤモンドの粒子が多数散乱していることが確認された。これは、図2(b)に示すように、基板201のうち、タングステンの領域のみにホウ素ドープダイヤモンド203が形成され、CVD合成後に基板201が自然冷却されると同時に、粒子状のホウ素ドープダイヤモンド203が基板201から剥離し、飛散したためであると考えられる。よって、上述した方法によれば、粉砕工程を行わなくても、ホウ素ドープダイヤモンドの粉体を得ることができる。 Using the substrate described above and growing boron-doped diamond for 2 hours in the same manner as in Example 1, no change was seen even when the substrate in the chamber was viewed after completion, and boron-doped diamond was formed on the substrate. There was no diamond film. However, it was confirmed that many boron-doped diamond particles were scattered around the substrate. As shown in FIG. 2B, the boron-doped diamond 203 is formed only in the tungsten region of the substrate 201, and the substrate 201 is naturally cooled after the CVD synthesis. This is probably because 203 was peeled off from the substrate 201 and scattered. Therefore, according to the method described above, a boron-doped diamond powder can be obtained without performing a pulverization step.
また、上述した基板を用い、前記実施例1の条件と同様にして、10時間ホウ素ドープダイヤモンドを成長させたところ、CVD終了後に、完全剥離した自立ダイヤモンド薄膜を回収することができた。おそらく、成長時間が長いと、タングステンの領域に形成されたホウ素ドープダイヤモンドが水平方向にも成長したため膜状となり、最終的に自立ダイヤモンド薄膜として回収されたと推察される。 Further, when boron-doped diamond was grown for 10 hours using the above-described substrate in the same manner as in Example 1, a completely detached free-standing diamond thin film could be recovered after the completion of CVD. Presumably, when the growth time is long, the boron-doped diamond formed in the tungsten region also grows in the horizontal direction to form a film and is finally recovered as a free-standing diamond thin film.
(1)導電性ダイヤモンド粒子の製造
前記実施例1〜3で得られたホウ素ドープダイヤモンドの薄片をメノー乳鉢で3時間粉砕し、ホウ素ドープダイヤモンドの粒子(導電性ダイヤモンドの粒子)を製造した。ホウ素ドープダイヤモンドの薄片の厚みは数μmから数十μm程度であるから、粉砕は容易であった。なお、粉砕には、遊星ボールミル等の粉砕機を用いてもよい。
(2)導電性ダイヤモンド粒子の評価(その1)
前記実施例1の条件で製造された、膜厚が10μmのホウ素ドープダイヤモンドを粉砕して得られた導電性ダイヤモンド粒子(以下、導電性ダイヤモンド粒子αとする)の形態を走査型電子顕微鏡で観察した。図3は導電性ダイヤモンド粒子αの形態を表す走査型電子顕微鏡写真である。導電性ダイヤモンド粒子αの粒径は、最大でも30μm×30μm×10μmであり、粒径は一様に揃っていた。このように、本実施例で製造した導電性ダイヤモンド粒子αは、微粒子化されており、均一な粒径を有することが分かった。
(1) Production of Conductive Diamond Particles The boron-doped diamond flakes obtained in Examples 1 to 3 were pulverized in a menor mortar for 3 hours to produce boron-doped diamond particles (conductive diamond particles). Since the thickness of the boron-doped diamond flakes is about several μm to several tens of μm, pulverization was easy. For the pulverization, a pulverizer such as a planetary ball mill may be used.
(2) Evaluation of conductive diamond particles (Part 1)
Observation of the morphology of conductive diamond particles (hereinafter referred to as conductive diamond particles α) obtained by pulverizing boron-doped diamond having a thickness of 10 μm manufactured under the conditions of Example 1 with a scanning electron microscope did. FIG. 3 is a scanning electron micrograph showing the morphology of the conductive diamond particles α. The particle diameter of the conductive diamond particles α was at most 30 μm × 30 μm × 10 μm, and the particle diameters were uniform. Thus, it was found that the conductive diamond particles α produced in this example were finely divided and had a uniform particle size.
また、レファレンスとして、厚みが0.8mmのダイヤモンド板を、メノー乳鉢を用いて同様に粉砕して得られた粒子(以下、ダイヤモンド粒子βとする)の形態を走査型電子顕微鏡で観察した。図4は導電性ダイヤモンド粒子βの形態を表す走査型電子顕微鏡写真である。その結果、ダイヤモンド粒子βには、0.3mm大の粒子塊が存在し、また、大小様々な粒径の存在が確認された。
(3)導電性ダイヤモンド粒子の評価(その2)
図5に示すような測定治具を用いて、導電性ダイヤモンド粒子α、及びダイヤモンド粒子βの電気抵抗率を測定した。測定方法は以下のとおりとした。
Further, as a reference, the form of particles (hereinafter referred to as diamond particles β) obtained by similarly pulverizing a diamond plate having a thickness of 0.8 mm using a menor mortar was observed with a scanning electron microscope. FIG. 4 is a scanning electron micrograph showing the morphology of the conductive diamond particles β. As a result, it was confirmed that the diamond particles β had a particle mass of 0.3 mm in size and had various particle sizes.
(3) Evaluation of conductive diamond particles (2)
The electrical resistivity of the conductive diamond particles α and diamond particles β was measured using a measuring jig as shown in FIG. The measurement method was as follows.
治具1の中心にある3mmφ×2mmの隙間3にダイヤモンド粒子を充填し、上下のSUS板5、7の間に10MPaの圧力をかけて押し固める。圧縮されてできた隙間3に再度、追加のダイヤモンド粒子を充填し、20MPaにて押し固める。最後に再び、圧縮されてできた隙間3にダイヤモンド粒子を充填し、30MPaで押し固め、上下のSUS板5、7間の電気抵抗をテスターにて測定する。なお、SUS板5、7は、ダイヤモンド粒子を充填した部分以外では、絶縁材9で隔てられている。 Diamond particles are filled in a gap 3 of 3 mmφ × 2 mm at the center of the jig 1 and pressed between the upper and lower SUS plates 5 and 7 to be pressed and hardened. The compressed gap 3 is again filled with additional diamond particles and pressed at 20 MPa. Finally, the compressed gap 3 is filled with diamond particles and pressed at 30 MPa, and the electrical resistance between the upper and lower SUS plates 5 and 7 is measured with a tester. Note that the SUS plates 5 and 7 are separated by an insulating material 9 except for portions filled with diamond particles.
このようにして測定した電気抵抗は、導電性ダイヤモンド粒子αでは4.5kΩであり、ダイヤモンド粒子βでは60kΩであった。つまり、導電性ダイヤモンド粒子αは、良好な導電性を示していた。
(4)電極の製造
導電性ダイヤモンド粒子αを用いて電極を製造した。電極の製造は以下のように行った。
The electrical resistance measured in this way was 4.5 kΩ for the conductive diamond particles α and 60 kΩ for the diamond particles β. That is, the conductive diamond particles α showed good conductivity.
(4) Production of electrode An electrode was produced using conductive diamond particles α. The electrode was manufactured as follows.
20%ナフィオン原液(アルドリッチ製)を精製水で0.1%に希釈し、0.1%ナフィオン溶液を調製した。この0.1%ナフィオン溶液1.2mLに、8mgの導電性ダイヤモンド粒子αを混合した後、超音波により十分に攪拌し、粒子懸濁液を調製した。 A 20% Nafion stock solution (manufactured by Aldrich) was diluted to 0.1% with purified water to prepare a 0.1% Nafion solution. 8 mg of conductive diamond particles α were mixed with 1.2 mL of this 0.1% Nafion solution, and then sufficiently stirred by ultrasonic waves to prepare a particle suspension.
10mm×10mmの大きさのグラッシーカーボンを鏡面研磨し、その表面を酸素プラズマ処理によって親水化させた。なお、酸素プラズマ処理は、グラッシーカーボン表面を粗にするのではなく、酸素原子を導入して親水化させるに十分な条件で行えばよく、例えば、出力70Wで1分間程度行えば十分であった。 Glassy carbon having a size of 10 mm × 10 mm was mirror-polished, and the surface was hydrophilized by oxygen plasma treatment. The oxygen plasma treatment may be performed under conditions sufficient for introducing oxygen atoms and making them hydrophilic, for example, without roughening the glassy carbon surface. For example, it may be performed for about 1 minute at an output of 70 W. .
表面を親水化したグラッシーカーボンに、上述した粒子懸濁液を80μL塗布し、室温で一晩乾燥させた後、80℃にて1時間加熱処理して乾固させ、電極αを完成した。
また、導電性ダイヤモンド粒子αの代わりに、同量のダイヤモンド粒子βを用い、上記と同様の方法で、電極βを製造した。
80 μL of the above-described particle suspension was applied to glassy carbon whose surface was hydrophilized, dried at room temperature overnight, and then heat-treated at 80 ° C. for 1 hour to dry the electrode α.
In addition, instead of the conductive diamond particles α, the same amount of diamond particles β was used to produce an electrode β by the same method as described above.
また、導電性ダイヤモンド粒子αの代わりに、同量のカーボンブラック(ホルベイン工業製)を用い、上記と同様の方法で、電極γを製造した。
(5)電極の評価
電極α、β、γを、通常の三極式ガラスセルに組み込んで、それぞれ、電気化学特性の試験を行った。試験はサイクリックボルタンメトリーで行い、鉄シアノ錯体に対する応答を調べた。酸化還元種の濃度を1mMとし、0.1Mの塩化カリウムに溶解した試験液を用いて、走査速度を100mV/sに設定して測定を行った。なお、電流密度は、BET比表面積にて算出した各々のカーボン粒子の表面積に対する実効表面積で換算した。
Moreover, instead of the conductive diamond particles α, the same amount of carbon black (manufactured by Holbein Kogyo) was used, and an electrode γ was manufactured by the same method as described above.
(5) Evaluation of electrodes The electrodes α, β, and γ were incorporated into a normal tripolar glass cell, and each was tested for electrochemical characteristics. The test was conducted by cyclic voltammetry, and the response to the iron cyano complex was examined. Using a test solution in which the concentration of the redox species was 1 mM and dissolved in 0.1 M potassium chloride, the scanning speed was set to 100 mV / s, and the measurement was performed. The current density was converted by the effective surface area relative to the surface area of each carbon particle calculated by the BET specific surface area.
電極αに関する測定結果を図6中の実線で示し、ブランク溶液である0.1M塩化カリウムの結果を破線で示す。電極αは、低い残余電流を示し、鉄シアノ錯体に対する電気化学応答が観察された。また、鉄シアノ錯体の酸化と還元に対応するピークが鋭く明瞭に観察されており、電極αは優れた電気化学特性を有することが分かった。 The measurement result regarding the electrode α is shown by a solid line in FIG. 6, and the result of 0.1 M potassium chloride as a blank solution is shown by a broken line. Electrode α showed a low residual current and an electrochemical response to the iron cyano complex was observed. In addition, peaks corresponding to oxidation and reduction of the iron cyano complex were observed sharply and clearly, and it was found that the electrode α had excellent electrochemical characteristics.
電極βに関する測定結果を図7中の実線で示し、ブランク溶液である0.1M塩化カリウムの結果を破線で示す。電極βは、電気抵抗率の結果からも明らかなように、粒子間の接触面積が小さく、高い電気抵抗を示していた。そのため、鉄シアノ錯体に対する応答が遅く、電極としての特性も劣っていることが分かった。 The measurement result regarding the electrode β is shown by a solid line in FIG. 7, and the result of 0.1 M potassium chloride as a blank solution is shown by a broken line. As is apparent from the results of the electrical resistivity, the electrode β had a small contact area between the particles and exhibited a high electrical resistance. Therefore, it turned out that the response with respect to an iron cyano complex is slow, and the characteristic as an electrode is also inferior.
電極γに関する測定結果を図8中の実線で示し、ブランク溶液である0.1M塩化カリウムの結果を破線で示す。電極βは、残余電流が大きく、鉄シアノ錯体の反応が全く観察されなかった。 The measurement result regarding the electrode γ is shown by a solid line in FIG. 8, and the result of 0.1 M potassium chloride which is a blank solution is shown by a broken line. The electrode β had a large residual current, and no reaction of the iron cyano complex was observed.
(1)燃料電池用電極の製造
導電性ダイヤモンド粒子αを用いて燃料電池用電極α2を製造した。燃料電池用電極α2は、高分子固体電解質型燃料電池(PEFC)に用いることができるものである。
(1) Production of Fuel Cell Electrode Fuel cell electrode α2 was produced using conductive diamond particles α. The fuel cell electrode α2 can be used for a polymer solid oxide fuel cell (PEFC).
燃料電池用電極α2の製造は以下のように行った。まず、濃度を50mMに調整した塩化白金酸水溶液1.93mLに対し、導電性ダイヤモンド粒子αを30mg分散させ、そこに水素化ホウ素ナトリウム0.2mgを添加し、そのまま12時間攪拌し、白金を還元させて導電性ダイヤモンド粒子αの表面に固定化した。この結果、導電性ダイヤモンド粒子αに貴金属触媒である白金が担持された白金担持ダイヤモンド粉体が製造された。 The fuel cell electrode α2 was manufactured as follows. First, 30 mg of conductive diamond particles α are dispersed in 1.93 mL of a chloroplatinic acid aqueous solution whose concentration is adjusted to 50 mM, 0.2 mg of sodium borohydride is added thereto, and the mixture is stirred for 12 hours to reduce platinum. And immobilized on the surface of the conductive diamond particles α. As a result, a platinum-carrying diamond powder in which platinum as a noble metal catalyst was carried on the conductive diamond particles α was produced.
次に、20%ナフィオン原液(アルドリッチ製)を精製水で0.1%に希釈し、0.1%ナフィオン溶液を調製した。この0.1%ナフィオン溶液1.2mLに、先に製造した白金担持ダイヤモンド粉体8mgを混合した後、超音波により十分に攪拌し、粒子懸濁液を調製した。 Next, a 20% Nafion stock solution (manufactured by Aldrich) was diluted to 0.1% with purified water to prepare a 0.1% Nafion solution. After mixing 8 mg of the previously prepared platinum-supported diamond powder with 1.2 mL of this 0.1% Nafion solution, the mixture was sufficiently stirred by ultrasonic to prepare a particle suspension.
10mm×10mmの大きさのグラッシーカーボンを鏡面研磨し、その表面を酸素プラズマ処理によって親水化させた。なお、酸素プラズマ処理は、グラッシーカーボン表面を粗にするのではなく、酸素原子を導入して親水化させるに十分な条件で行えばよく、例えば、出力70Wで1分間程度行えば十分であった。 Glassy carbon having a size of 10 mm × 10 mm was mirror-polished, and the surface was hydrophilized by oxygen plasma treatment. The oxygen plasma treatment may be performed under conditions sufficient for introducing oxygen atoms and making them hydrophilic, for example, without roughening the glassy carbon surface. For example, it may be performed for about 1 minute at an output of 70 W. .
表面を親水化したグラッシーカーボンに、上述した粒子懸濁液を80μL塗布し、室温で一晩乾燥させた後、80℃にて1時間加熱処理して乾固させ、燃料電池用電極α2を完成した。 Applying 80 μL of the above-mentioned particle suspension to glassy carbon whose surface is hydrophilized, drying at room temperature overnight, and then heat-treating at 80 ° C. for 1 hour to complete the fuel cell electrode α2. did.
また、導電性ダイヤモンド粒子αの代わりに、同量のダイヤモンド粒子βを用い、上記と同様の方法で、燃料電池用電極β2を製造した。
また、導電性ダイヤモンド粒子αの代わりに、同量のカーボンブラック(ホルベイン工業製)を用い、上記と同様の方法で、燃料電池用電極γ2を製造した。
(2)燃料電池用電極の評価
メタノールを水素に改質せずに直接セルに供給して反応させることができるダイレクトメタノール型燃料電池(DMFC)を想定して以下の評価を行った。
In addition, the same amount of diamond particles β was used instead of the conductive diamond particles α, and a fuel cell electrode β2 was produced by the same method as described above.
In addition, the same amount of carbon black (manufactured by Holbein Kogyo) was used in place of the conductive diamond particles α, and a fuel cell electrode γ2 was produced in the same manner as described above.
(2) Evaluation of Fuel Cell Electrode The following evaluation was performed on the assumption of a direct methanol fuel cell (DMFC) in which methanol can be directly supplied to the cell and reacted without being reformed into hydrogen.
燃料電池用電極α2、β2、γ2を、通常の三極式ガラスセルに組み込んで、それぞれ電気化学特性の試験を行った。なお、電流密度は、製造した燃料電池用電極を硫酸中で電気化学測定したときの水素の吸脱着ピーク面積から算出し、白金の単位面積あたりに換算して表記した。 The fuel cell electrodes α2, β2, and γ2 were incorporated into a normal tripolar glass cell, and the electrochemical characteristics were tested. The current density was calculated from the hydrogen adsorption / desorption peak area when the produced fuel cell electrode was electrochemically measured in sulfuric acid, and expressed per unit area of platinum.
図9は、メタノール濃度が1Mとなるように0.5M硫酸で調整した試験液を用いて測定したサイクリックボルタモグラムである。図9における太実線は燃料電池用電極α2の測定結果であり、太破線は燃料電池用電極β2の測定結果であり、細実線は燃料電池用電極γ2の測定結果である。 FIG. 9 is a cyclic voltammogram measured using a test solution adjusted with 0.5M sulfuric acid so that the methanol concentration becomes 1M. In FIG. 9, the thick solid line is the measurement result of the fuel cell electrode α2, the thick broken line is the measurement result of the fuel cell electrode β2, and the thin solid line is the measurement result of the fuel cell electrode γ2.
燃料電池用電極α2の測定結果と、燃料電池用電極γ2の測定結果とを比べると、反応電流は、一見、ほぼ同等に見えるが、燃料電池用電極γ2では残余電流が大きいことを考慮すれば、燃料電池用電極α2の方が反応電流が大きい。 When the measurement results of the fuel cell electrode α2 and the measurement results of the fuel cell electrode γ2 are compared, the reaction currents seem to be almost the same, but if the fuel cell electrode γ2 has a large residual current, The reaction current of the fuel cell electrode α2 is larger.
また、燃料電池用電極α2を用いると、メタノールに対する酸化電位が80mV低く抑えられるという優れた結果を示した。これは、燃料電池として大きな起電力を生み出すことを意味する。 Further, when the fuel cell electrode α2 was used, an excellent result was obtained that the oxidation potential with respect to methanol could be suppressed to 80 mV. This means that a large electromotive force is generated as a fuel cell.
また、燃料電池用電極β2を用いた場合、メタノールに対する反応電流が小さい結果となった。
以上より、燃料電池用電極α2は、ダイヤモンドを担体にしているため担体の腐食の心配がなく、耐食性があり残余電流が小さいため、触媒担持電極に好適で、燃料電池用電極や工業電解用電極に適することが実証できた。
In addition, when the fuel cell electrode β2 was used, the reaction current with respect to methanol was small.
From the above, since the fuel cell electrode α2 is made of diamond as a carrier, there is no concern about the corrosion of the carrier, and it is suitable for a catalyst-carrying electrode because it has corrosion resistance and a small residual current. It was proved to be suitable for
尚、本発明は前記実施例になんら限定されるものではなく、本発明を逸脱しない範囲において種々の態様で実施しうることはいうまでもない。 Needless to say, the present invention is not limited to the above-described embodiments, and can be implemented in various modes without departing from the scope of the present invention.
1・・・治具、3・・・隙間、5、7・・・SUS板、9・・・絶縁材、
101、201・・・基板、103、203・・・ホウ素ドープダイヤモンド、
105・・・粉体
DESCRIPTION OF SYMBOLS 1 ... Jig, 3 ... Gap, 5, 7 ... SUS board, 9 ... Insulating material,
101, 201 ... substrate, 103, 203 ... boron-doped diamond,
105 ... powder
Claims (6)
前記冷却工程のとき、又は前記冷却工程の後、前記基板のうち、前記ホウ素ドープダイヤモンドを成長させた面を水平方向に対し傾斜させることを特徴とする請求項1〜3のいずれかに記載のホウ素ドープダイヤモンドの製造方法。 After the boron-doped diamond is grown on the substrate, the cooling step of lowering the temperature of the boron-doped diamond and the substrate than that during the growth,
The surface of the substrate on which the boron-doped diamond is grown is inclined with respect to a horizontal direction during the cooling step or after the cooling step. A method for producing boron-doped diamond.
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