JP2009203373A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009203373A5 JP2009203373A5 JP2008047956A JP2008047956A JP2009203373A5 JP 2009203373 A5 JP2009203373 A5 JP 2009203373A5 JP 2008047956 A JP2008047956 A JP 2008047956A JP 2008047956 A JP2008047956 A JP 2008047956A JP 2009203373 A5 JP2009203373 A5 JP 2009203373A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008047956A JP2009203373A (en) | 2008-02-28 | 2008-02-28 | Thermoconductive silicone composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008047956A JP2009203373A (en) | 2008-02-28 | 2008-02-28 | Thermoconductive silicone composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009203373A JP2009203373A (en) | 2009-09-10 |
| JP2009203373A5 true JP2009203373A5 (en) | 2011-04-14 |
Family
ID=41145957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008047956A Pending JP2009203373A (en) | 2008-02-28 | 2008-02-28 | Thermoconductive silicone composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009203373A (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5103364B2 (en) * | 2008-11-17 | 2012-12-19 | 日東電工株式会社 | Manufacturing method of heat conductive sheet |
| JP2017088685A (en) * | 2015-11-05 | 2017-05-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermally conductive polysiloxane composition |
| US11254849B2 (en) | 2015-11-05 | 2022-02-22 | Momentive Performance Materials Japan Llc | Method for producing a thermally conductive polysiloxane composition |
| CN108350183B (en) * | 2015-11-05 | 2021-05-07 | 迈图高新材料日本合同公司 | Manufacturing method of thermally conductive polysiloxane composition |
| EP3489306A4 (en) * | 2016-07-22 | 2020-01-08 | Momentive Performance Materials Japan LLC | HEAT-CONDUCTIVE POLYORGANOSILOXAN COMPOSITION |
| US11118056B2 (en) | 2016-07-22 | 2021-09-14 | Momentive Performance Materials Japan Llc | Thermally conductive polysiloxane composition |
| CN118931196A (en) | 2016-07-22 | 2024-11-12 | 迈图高新材料日本合同公司 | Method for producing thermally conductive polysiloxane composition |
| CN110234711B (en) * | 2017-01-27 | 2022-02-11 | 迈图高新材料日本合同公司 | Thermally conductive polysiloxane composition |
| JP6383885B2 (en) * | 2017-01-27 | 2018-08-29 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermally conductive polyorganosiloxane composition |
| JP2018118940A (en) * | 2017-01-27 | 2018-08-02 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Surface treatment agent for thermally conductive polysiloxane composition |
| US20200157350A1 (en) * | 2017-05-31 | 2020-05-21 | Momentive Performance Materials Japan Llc | Thermally conductive polyorganosiloxane composition |
| US11359124B2 (en) | 2017-05-31 | 2022-06-14 | Momentive Performance Materials Japan Llc | Thermally conductive polysiloxane composition |
| WO2019216190A1 (en) | 2018-05-08 | 2019-11-14 | 富士高分子工業株式会社 | Heat-conductive sheet, mounting method using same and bonding method using same |
| EP4039750A4 (en) * | 2020-07-07 | 2023-01-25 | Fuji Polymer Industries Co., Ltd. | Thermally conductive silicone gel composition and thermally conductive silicone gel sheet and method for producing same |
| WO2022264715A1 (en) * | 2021-06-16 | 2022-12-22 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermally-conductive polysiloxane composition |
| EP4357419A1 (en) * | 2021-06-16 | 2024-04-24 | Momentive Performance Materials Japan LLC | Thermally-conductive polysiloxane composition |
| WO2023092255A1 (en) * | 2021-11-23 | 2023-06-01 | Dow Global Technologies Llc | Curable thermally conductive composition containing diamond particles |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4727017B2 (en) * | 1999-11-15 | 2011-07-20 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone rubber composition |
| JP4646357B2 (en) * | 2000-06-08 | 2011-03-09 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone rubber composition |
| JP4646496B2 (en) * | 2003-02-13 | 2011-03-09 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone composition |
| JP4745058B2 (en) * | 2003-09-29 | 2011-08-10 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermally conductive silicone composition |
| JP4937494B2 (en) * | 2003-12-05 | 2012-05-23 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermally conductive silicone composition |
| JP4460433B2 (en) * | 2004-12-15 | 2010-05-12 | 信越化学工業株式会社 | Method for producing heat-dissipating silicone grease composition |
| JP4803365B2 (en) * | 2006-02-22 | 2011-10-26 | 信越化学工業株式会社 | Thermally conductive silicone composition, thermally conductive silicone molded article and method for producing the same |
-
2008
- 2008-02-28 JP JP2008047956A patent/JP2009203373A/en active Pending