JP2009135195A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which can be easily manufactured, uses a light emitting element such as an LED chip and to which a cup member can be fixed by a fixation method having higher reliability than a conventional method using an adhesive etc. <P>SOLUTION: The light emitting device is characterized in that at least one or more light emitting elements are disposed on a substrate, a solder pattern is formed on the substrate at a periphery of the light emitting elements, and the cup member is soldered and fixed onto the solder pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device in which a light emitting element such as a light emitting diode (hereinafter referred to as LED) chip is arranged on a substrate.

  For display devices and lighting fixtures using LEDs, cup shapes are often used for the purpose of improving the light extraction efficiency and storing the resin used to seal the LED elements (reserving the resin liquid before curing). For example, the techniques disclosed in Patent Documents 1 and 2 may be mentioned.

  FIG. 1 is a diagram illustrating an illuminating device described in an embodiment of Patent Document 1. In FIG. In this lighting device, an insulating layer 2 is provided on a circuit board 1, a wiring 3 is provided on the insulating layer 2, and an LED chip 5 is mounted on a portion where the wiring 3 is provided so as to surround the LED chip 5. A base 4 having a cup shape is joined to the base 4, and a cover 6 is provided in the opening of the base 4.

FIG. 2 is a diagram illustrating the illumination device described in the example of Patent Document 2. In this lighting device, a wiring layer 7 is provided on an insulating substrate 8, an LED chip 9 is mounted on the upper wiring layer 7, and an upper electrode of the LED chip 9 is connected to another wiring layer 7 by a conductive wire 10. The frame 11 is arranged around the LED chip 9.
JP 2003-347601 A JP 2004-311917 A

However, the conventional techniques disclosed in Patent Documents 1 and 2 have the following problems.
In Patent Document 1, although there is no particular description about the material of the base 4, it is considered to be an insulating layer because it is installed immediately above the wiring 3. Further, there is no particular description about the fixing method of the base 4. Generally, it is considered that an adhesive or the like is used. In that case, anxiety arises in the reliability of a junction part. Further, the process such as application and curing of the adhesive becomes complicated, and the productivity is low.

  Moreover, in the Example of patent document 2, the insulation base | substrate 8 is made by the ceramic green sheet lamination | stacking method. The frame 11 is made of metal, and is fitted for the purpose of reflecting light from the LED chip 9 and efficiently extracting light to the outside. The insulating base 8 that forms the base and the insulating base 8 that forms the LED housing can be firmly bonded by firing, but the frame 11 is only fitted and may be lost due to vibration or the like. Moreover, since it is necessary to make a fitting structure, it cannot be said that productivity is also good.

  The present invention is made in view of the above circumstances, and uses a light emitting element such as an LED chip that can be easily manufactured and can fix a cup member by a fixing method that is more reliable than fixing by a conventional method such as an adhesive. An object is to provide a light-emitting device.

  In order to achieve the above object, according to the present invention, at least one light emitting element is disposed on a substrate, a solder pattern is formed on a substrate around the light emitting element, and a cup member is formed on the solder pattern by soldering. Provided is a light-emitting device that is fixed.

  According to the present invention, at least one light emitting element is disposed on the substrate, a solder pattern is formed on the substrate so as to surround the light emitting element, and there is a notch in at least one position of the solder pattern. One is a light-emitting device characterized in that at least one wiring pattern passes and a cup member is fixed on the solder pattern by solder.

  According to the present invention, at least one light emitting element is disposed on the substrate, a solder pattern is formed on the substrate so as to surround the light emitting element, and there is a notch in at least one portion of the solder pattern. A light emitting device, wherein at least one wiring pattern passes through at least one of the wiring patterns, an insulating layer is provided on at least a part of the wiring pattern, and a cup member is fixed on the solder pattern by solder. provide.

  In the light emitting device, it is preferable that the notches are arranged at an equal angle and the divided solder patterns have the same shape.

  In the present invention, at least one light emitting element is disposed on a substrate, a solder pattern is provided on the substrate, at least a part of the wiring pattern is covered with an insulating layer, and at least a part is over the insulating layer. Thus, a light emitting device is provided in which a solder pattern is formed and a cup member is fixed on the solder pattern with solder.

  In the light emitting device of the present invention, it is preferable that a solder reservoir is provided in the solder pattern.

  In the light emitting device of the present invention, it is preferable that the solder pattern to which the cup member is soldered is provided so as to protrude from the cup member to the light emitting element side.

  In the light-emitting device of the present invention, the cup member may be configured by bending a linear member and bringing both ends into close contact.

In the light emitting device of the present invention, it is preferable that a translucent resin is filled in the cup member.
Moreover, it is good also as a structure by which the light diffusing material or fluorescent substance is contained in this translucent resin.

In the light emitting device of the present invention, since the cup member is fixed by solder, the reliability is higher than the fixing method by a conventional method such as an adhesive.
In the light emitting device of the present invention, since the cup member is fixed by solder, deformation due to external force is reduced, and the influence on the structure inside the cup member is reduced.
In the light emitting device of the present invention, the cup member is fixed by solder, so that it is possible to perform solder paste printing and reflow mounting simultaneously with other electronic components, and a special process and equipment for fixing the cup can be omitted. Can do. As a result, the productivity of the light emitting device can be improved.
In addition, since the notch is provided in the solder pattern and the wiring is passed therethrough, the solder pattern for fixing the cup can be formed simultaneously with the wiring pattern by printing, etching or the like, and special equipment and processes for forming the cup structure. Is unnecessary. Thus, productivity of the light emitting device can be increased.
Moreover, by providing the notches in the solder pattern at equal angles, the surface tension of the solder applied to the cup member becomes uniform, and the joining position of the cup member becomes accurate.
Further, by making the individual solder patterns divided by the notches into the same shape, the surface tension of the solder applied to the cup member becomes uniform, and the joining position of the cup member becomes accurate.
Further, by providing a solder reservoir in the solder pattern, excess solder can be released to the solder reservoir, and the joining position of the cup member becomes accurate.
Further, since the solder pattern for fixing the cup and the wiring pattern are formed in different layers, the solder pattern for fixing the cup can be freely designed, and the cup member can be firmly joined.
In addition, by forming a solder pattern so that at least a part is on the insulating layer, the solder forms a curved surface on the inner wall of the cup member, and can efficiently reflect light from the light emitting element to the outside. it can.
Moreover, a manufacturing cost can be lowered | hung by bending a linear member and making both ends closely_contact | adhere and forming a cup member.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 3 is a cross-sectional view showing the first embodiment of the light-emitting device of the present invention. In the figure, reference numeral 12 denotes a substrate, 13 denotes an LED chip, 14 denotes a cup member, and 15 denotes solder.

  In this embodiment, the LED chip 13 is mounted on the substrate 12, and the cup member 14 is fixed on the substrate 12 with the solder 15 so as to surround the LED chip 13. The cup member 14 has an annular shape centering on the LED chip 13 and has a reflective surface that spreads obliquely and reflects light emitted from the LED chip 13 to the front (upward in FIG. 3). ing.

  Solder fixing is a joining method used for connecting metals, and has very high reliability. Solder fixing is a general method for fixing the member, but fixing of the cup member 14 in the lighting fixture using the LED chip 13 is not generally performed from the viewpoint of securing insulation from the wiring. However, fixing the cup member 14 by taking advantage of the solder fixing, such as being hardly affected by the external environment as compared with the adhesive, etc., if the solder fixing is performed by keeping the insulation property. Can do.

  FIG. 4 is a cross-sectional view showing a second embodiment of the light-emitting device of the present invention. The light emitting device of this embodiment includes the same components as the light emitting device of the first embodiment shown in FIG. 3, and further, the LED chip 13 and the electrical connection wire 16 are provided in the opening of the cup member 4. The light-transmitting resin 17 to be sealed is filled.

  When the cup member 14 is fixed on the substrate 12 with the solder 15, deformation due to external force is very small. Therefore, when the resin 17 is filled in the cup member 14 as shown in FIG. 4, the LED chip 13 and the wire 16 are connected. The influence of can be reduced.

  In the light emitting device of the present invention, the material of the cup member 14 is not particularly limited. However, considering that the light of the LED chip 13 is reflected, a metal one is desirable, and considering the joining property of the solder 15 as well. It is desirable that nickel plating or the like is applied so that the solder 15 can be easily applied. Even if it is not metal, it is good also as a structure which attached the metal pad for soldering to the cup member made from resin or ceramics, for example.

  Further, by fixing the cup member 14 with solder, it becomes possible to perform solder paste printing / reflow mounting simultaneously with other electronic products, and a special process / equipment for fixing the cup member can be omitted. . As a result, the productivity of the light emitting device can be improved.

5 to 7 show various shapes of the cup member used in the present invention.
FIG. 5 shows a case where an annular (or cylindrical) cup member 19A is fixed on the substrate 18 with solder.
FIG. 6 shows a case where a square annular (or square cylindrical) cup member 19B is fixed on the substrate 18 with solder.
FIG. 7 shows a case where a hollow star-shaped cup member 19C is fixed on the substrate 18 with solder.
Thus, the shape of the cup member is not particularly limited.

  8 and 9 are views showing a third embodiment of the light-emitting device of the present invention. In the present embodiment, when the cup member 19A is fixed on the substrate 18 with solder, the electric wiring 20 is passed under the cup member 19A. An insulating layer 22 is formed on the electric wiring 20 so as not to cause a short circuit by the cup member 14. The solder pattern 21 for fixing the cup member in the portion through which the electric wiring 20 passes is cut as shown in FIG. By adopting such a structure, power can be supplied to the LED chip inside the cup member.

  Further, since the solder pattern 21 for fixing the cup can be formed simultaneously with the electric wiring pattern by printing or etching, no special equipment or process for forming the cup structure is required. This can increase the productivity of the light emitting device.

  FIG. 10 is a plan view of a principal part showing a fourth embodiment of the light emitting device of the present invention. In this embodiment, it is a case where the notch 23 is made in two places of the solder pattern 21 (a) and a case where the notch 23 is made in three places (b). Thus, by making two or three notches 23 at equal angles in the solder pattern 21, when soldering the cup member 19A, the surface tension of the solder applied to the cup member 19A becomes uniform, and the cup member 19A Can be fixed in the correct place.

  The shape of the solder pattern 21 is not particularly limited, but for the same reason as described above, it is desirable that the solder pattern 21 divided by the notch 23 has the same shape, for example, a circle. The number of notches 23 to be put in the solder pattern 21 is not particularly limited.

  FIG. 11 is a plan view of a principal part showing a fifth embodiment of the light-emitting device of the present invention. In the present embodiment, a solder reservoir 24 is provided in the solder pattern 21. If there is the solder reservoir 24, excess solder escapes to the solder reservoir 24, so that the cup member 19A can be fixed at an accurate location.

  FIG. 12 is a cross-sectional view showing a sixth embodiment of the light-emitting device of the present invention. In the light emitting device of this embodiment, a circuit pattern 25 to be the electrical wiring 20 is provided on the substrate 12, and the insulating layer 22 is provided on the circuit pattern 25 other than the LED chip 13 mounting position and its vicinity. The solder pattern 21 for fixing the cup member is provided on the insulating layer 22, the cup member 14 is fixed on the solder pattern 21 with the solder 15, and the one circuit pattern 25 exposed in the cup of the cup member 14 is The LED chip 13 is mounted to the other circuit pattern 25 and electrically connected to the other circuit pattern 25 by the wire 16.

  In this embodiment, since no break is made in the solder pattern 21 for fixing the cup member, the cup member 14 can be fixed more firmly. In the case of the present embodiment, since the solder pattern 21 for fixing the cup member and the circuit pattern 25 are not the same layer, the number of times of printing increases, but the solder pattern 21 for fixing the cup can be freely designed, and the cup member 14 is strengthened. Can be joined.

  FIG. 13 is a cross-sectional view showing a seventh embodiment of the light-emitting device of the present invention. The light emitting device of this embodiment is configured to include the same components as those of the sixth embodiment shown in FIG. 12, and the solder pattern 21 protrudes toward the inside of the cup of the cup member 14 so that the inside of the cup of the cup member 14 It is characterized in that the solder 15 is raised on the side surface. According to this embodiment, a curved surface is formed on the inner side surface of the cup member 14 by the solder 15, and light from the LED chip 13 can be more efficiently reflected to the front surface.

  FIG. 14 is a cross-sectional view showing an eighth embodiment of the light-emitting device of the present invention. The light emitting device of the present embodiment is configured to include substantially the same components as those of the sixth embodiment shown in FIG. 12, and uses a bent wire material 26 having a circular cross section instead of the cup member 14. It is characterized by. In the present embodiment, by adjusting the solder pattern 21 and the amount of solder, a curved surface can be formed on the side surface of the wire rod 26, and light from the LED chip 13 can be reflected more efficiently on the front surface. Further, by using the wire 26 instead of the cup member 14, a cup structure can be formed easily and at low cost.

  FIG. 15 is a sectional view showing a ninth embodiment of the light emitting device of the present invention. The light emitting device of the present embodiment is configured to include substantially the same components as those of the sixth embodiment shown in FIG. 12, and has a configuration in which the cup of the cup member 14 is filled with a translucent resin 17. This sealing structure by the resin 17 can be applied to any of the above cup structures. The translucent resin 17 may contain a material that diffuses light, a phosphor that converts a wavelength, or the like.

It is sectional drawing which shows an example of the conventional light-emitting device. It is sectional drawing which shows the other example of the conventional light-emitting device. It is sectional drawing which shows 1st Embodiment of the light-emitting device of this invention. It is sectional drawing which shows 2nd Embodiment of the light-emitting device of this invention. It is a perspective view which shows the 1st example of the shape of the cup member which can be used by this invention. It is a perspective view which shows the 2nd example of the shape of the cup member which can be used by this invention. It is a perspective view which shows the 3rd example of the shape of the cup member which can be used by this invention. It is a principal part perspective view which shows 3rd Embodiment of the light-emitting device of this invention. It is a principal part top view which shows 3rd Embodiment of the light-emitting device of this invention. It is a principal part top view which shows 4th Embodiment of the light-emitting device of this invention. It is a principal part top view which shows 5th Embodiment of the light-emitting device of this invention. It is sectional drawing which shows 6th Embodiment of the light-emitting device of this invention. It is sectional drawing which shows 7th Embodiment of the light-emitting device of this invention. It is sectional drawing which shows 8th Embodiment of the light-emitting device of this invention. It is sectional drawing which shows 9th Embodiment of the light-emitting device of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 12 ... Board | substrate, 13 ... LED chip, 14 ... Cup member, 15 ... Solder, 16 ... Wire, 17 ... Translucent resin, 18 ... Board | substrate, 19A-19C ... Cup member, 20 ... Electric wiring, 21 ... Solder pattern, 22 ... Insulating layer, 23 ... Notch, 24 ... Solder reservoir, 25 ... Circuit pattern, 26 ... Wire.

Claims (11)

  At least one light emitting element is disposed on a substrate, a solder pattern is formed on a substrate around the light emitting element, and a cup member is fixed on the solder pattern by solder. .   At least one light emitting element is disposed on the substrate, a solder pattern is formed on the substrate so as to surround the light emitting element, and at least one of the solder patterns has a notch, and at least one of the notches has at least one A light-emitting device characterized in that one wiring pattern passes and a cup member is fixed on the solder pattern by solder.   At least one light emitting element is disposed on the substrate, a solder pattern is formed on the substrate so as to surround the light emitting element, and at least one portion of the solder pattern has a notch, and at least one of the notches A light emitting device characterized in that at least one wiring pattern passes, an insulating layer is provided on at least a part of the wiring pattern, and a cup member is fixed on the solder pattern by solder.   4. The light emitting device according to claim 2, wherein the notches are arranged at an equal angle, and the divided solder patterns have the same shape.   At least one or more light emitting elements are disposed on the substrate, the solder pattern is on the substrate, at least a part of the wiring pattern is covered with an insulating layer, and the solder pattern is over the at least part of the insulating layer. A light-emitting device formed and having a cup member fixed on the solder pattern with solder.   The light emitting device according to claim 1, wherein a solder reservoir is provided in the solder pattern.   The light emitting device according to claim 1, wherein a solder pattern to which the cup member is soldered is provided so as to protrude from the cup member to the light emitting element side.   The light-emitting device according to claim 1, wherein a linear member is bent and both ends are brought into close contact to form a cup member.   The light emitting device according to claim 1, wherein a translucent resin is filled in the cup member.   The light-emitting device according to claim 9, wherein a light diffusing material is contained in the translucent resin.   The light-emitting device according to claim 9, wherein a phosphor is contained in the translucent resin.

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