JP2009088197A - Method of manufacturing ceramic substrate - Google Patents

Abstract

An object of the present invention is to provide a method of manufacturing a ceramic substrate that enables an increase in the thickness and total number of internal conductors, and even in such a case, the problem of delamination does not easily occur.
A forming step of forming a conductor layer 2 on a plurality of supports 1, a coating step of applying a ceramic slurry 3a on each support 1 so as to cover the conductor layer 2, and a ceramic slurry 3a Height adjustment step of making the surface height of the substrate higher than that on the conductor layer, a drying step of drying the ceramic slurry 3a to form a ceramic green sheet, and laminating of the support 1 and the ceramic green sheet A peeling process for peeling the support 1 from the body, a laminating process for laminating a plurality of ceramic green sheets from which the support is peeled, and a firing process for firing the laminated ceramic green sheets.
[Selection] Figure 2

Description

  The present invention relates to a method for manufacturing a ceramic substrate such as a multilayer ceramic wiring substrate, and more particularly to a method for manufacturing a ceramic substrate having a step of applying a ceramic slurry onto a support having a conductor layer formed on the surface thereof.

  In recent years, with the miniaturization of electronic devices, miniaturization and high performance are also desired for electronic components made of ceramic substrates such as multilayer chip inductors and multilayer ceramic wiring substrates used in such electronic devices.

  For example, in a multilayer chip inductor, a thinner magnetic layer is required for miniaturization, and a larger inductance can be obtained by increasing the number of windings.

  Such an electronic component is made by adding an organic binder, a plasticizer and a solvent to ceramic powder to form a slurry, forming a ceramic green sheet (hereinafter also referred to as green sheet) with a doctor blade, etc., and then a conductor containing metal powder. After forming a conductor pattern layer on the green sheet by printing a paste, etc., and then stacking and pressing the green sheet on which a plurality of conductor pattern layers are formed, this laminate is obtained. Is obtained by firing.

  However, if the number of laminated green sheets on which the conductor pattern layer is formed is increased in response to the above-described requirements for electronic components, the thickness difference between the portion where the conductor pattern layer is formed and the other portion increases. . For this reason, when the laminated green sheets are pressed in the thickness direction, a sufficient pressing force is applied to the portion where the region where the conductor pattern layer is formed overlaps, but it is difficult to sufficiently apply the pressing force to the other portion. So, it tends to be insufficient crimping.

  And when the laminated body formed by such inadequate pressure bonding is baked, delamination (delamination) may occur in a portion where pressure bonding is insufficient.

  Further, in the above laminated body, it is necessary to increase the thickness of the conductor pattern in order to reduce the DC resistance value which is an important electrical characteristic. However, when a thick conductor pattern layer is formed, there is a problem that the delamination is more likely to occur.

  With respect to these problems, as described in Patent Document 1, a ceramic slurry is applied on a support having a conductor layer formed on the surface, and after drying, the support is peeled off to provide a flat conductor layer. A manufacturing method for forming a ceramic green sheet has been proposed.

According to this manufacturing method, since the conductive layer is buried in the green sheet, the surface of the green sheet on which the conductive layer is formed becomes flat. Thus, there is no difference in thickness in the non-exposed portions, and delamination can be prevented from occurring due to non-uniform pressure when the green sheets are laminated.
JP-A-9-283360

  However, even when the ceramic slurry is applied on the support having the conductor layer formed on the surface as described in Patent Document 1, if the conductor layer becomes thick, the difference in the thickness of the slurry depending on the location increases. Since the effect of drying shrinkage when the solvent volatilizes from the slurry is increased, a difference occurs in the amount of drying shrinkage between the slurry on the conductor layer and the slurry on the area where the conductor layer is not formed. A ceramic green sheet with a conductive layer could not be formed, leaving a difference in thickness and causing the above delamination.

  Further, when the ceramic slurry is thinly applied, there is a problem that a difference in thickness remains immediately after the application due to the surface tension of the support and the conductor layer.

  The present invention has been completed in order to solve the above-described problems, and enables an increase in the thickness of the internal conductor layer and the increase in the number of laminated green sheets, and even in that case, the problem of delamination hardly occurs. An object of the present invention is to provide a method for manufacturing a ceramic substrate.

  The method for producing a ceramic substrate of the present invention includes a forming step of forming a conductor layer on a plurality of supports, and a coating step of applying a ceramic slurry on each of the supports so as to cover the conductor layer. A step of adjusting the height of the surface of the ceramic slurry on the support to be higher than the height of the surface of the ceramic slurry on the conductor layer; and drying the ceramic slurry to obtain a ceramic green sheet. A drying step to be formed, a peeling step for peeling the support from the laminate of the support and the ceramic green sheet, and a plurality of the ceramic green sheets from which the support has been peeled are stacked. A lamination step and a firing step of firing the laminated ceramic green sheets. Hereinafter, this method for producing a ceramic green sheet is referred to as “first production method”.

  Preferably, in the first manufacturing method, the coating step and the height adjusting step are simultaneously performed. Hereinafter, this ceramic green sheet manufacturing method is referred to as a “second manufacturing method”.

  Preferably, in the first or second manufacturing method, the ceramic slurry has magnetism, and in the height adjusting step, a magnetic field is applied to the ceramic slurry, whereby the ceramic slurry is formed on the support. The height of the surface of the ceramic slurry is set higher than the height of the surface of the ceramic slurry on the conductor layer. Hereinafter, this ceramic green sheet manufacturing method is referred to as a “third manufacturing method”.

  Preferably, in any one of the first to third manufacturing methods, before the height adjustment step, the support is on the side opposite to the conductor layer with respect to the support, via the support. A disposing step of disposing a magnet in a region other than the region facing the conductor layer; Hereinafter, this method for producing a ceramic green sheet is referred to as a “fourth production method”.

  Preferably, in any one of the first to third manufacturing methods, before the height adjusting step, the ceramic slurry is located above the ceramic slurry and faces the conductor layer with the ceramic slurry interposed therebetween. An arrangement step of arranging the magnet in a region other than the region to be performed.

  According to the method for manufacturing a ceramic substrate of the present invention, it is possible to increase the thickness of the internal conductor layer and increase the number of green sheets to be stacked, and even in such a case, it is possible to manufacture a ceramic substrate that hardly causes a problem of delamination. .

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a diagram showing an example of a method for manufacturing a ceramic substrate according to an embodiment of the present invention. In FIG. 1, 1 is a support, 2a is a conductor paste, 2 is a conductor layer formed by drying the conductor paste 2a, 3a is a ceramic slurry having magnetism, and 3 is formed by drying a ceramic slurry 3a. The ceramic green sheet 4 is a ceramic green sheet laminate formed by laminating ceramic green sheets 3.

  First, as shown in FIG. 1A, a conductor layer 2 is formed by applying a conductor paste 2a on a support 1 and drying it.

  The support 1 is in the form of a film made of an organic resin such as polyolefin, polyester, polyamide, polyimide, or vinyl chloride.

  In consideration of the peelability of the conductor layer 2 and the ceramic green sheet 3 to be formed later (hereinafter collectively referred to as “ceramic green sheet with a conductor layer”) on the surface of the support 1, a release agent or an antistatic agent is used. It is preferable to form a surface treatment layer such as an agent. In particular, a surface treatment layer of a release agent is formed on the surface of the support 1 in order to prevent the ceramic green sheet with a conductor layer from being deformed such as stretching when peeled from the support 1. Is more preferable.

  As a kind of mold release agent, silicone type, fluorine type, long chain alkyl group containing type, alkyd resin type, polyolefin resin type, etc. can be roughly classified. In particular, a silicone system is more desirable from the viewpoints of heat resistance, peelability, and cost.

  The conductor paste 2a is prepared by adding an organic binder, an organic solvent, and a dispersant as necessary to the metal conductor powder, and mixing and kneading them by a kneading means such as a ball mill, a three-roll mill, or a planetary mixer. The

  The metal conductor powder is tungsten (W), molybdenum (Mo), manganese (Mn), copper (Cu), silver (Ag), gold (Au), platinum (Pt), aluminum (Al), silver-lead (Ag). -Pd) alloy and silver-platinum (Ag-Pt) alloy, among which Cu, Ag, Au, Pt, Al, Ag-, which are metal powders sintered at the temperature at which the magnetic material is fired Pd alloy and Ag—Pt alloy are more preferable.

  As the organic binder of the conductive paste 2a, those conventionally used for the conductive paste can be used. For example, acrylic (acrylic acid, methacrylic acid or their homopolymers or copolymers, specifically acrylic Acid ester copolymer, methacrylic acid ester copolymer, acrylic acid ester-methacrylic acid ester copolymer, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, cellulose, etc. These homopolymers or copolymers may be mentioned. In selecting the organic binder, acrylic and alkyd organic binders are more preferable in consideration of decomposition and volatility in the firing step.

  The organic solvent of the conductor paste 2a may be any one that can disperse and mix the conductor powder and the organic binder, and terpineol, butyl carbitol acetate, phthalic acid, or the like can be used.

  For example, the conductor paste 2a is formed by adding and kneading 3 to 15 parts by mass of an organic binder and 10 to 30 parts by mass of an organic solvent with respect to 100 parts by mass of the metal conductor powder raw material. In this case, a surface wiring conductor can be formed by printing the conductor paste 2a. Further, it is desirable that the metal paste 2a has a viscosity that does not cause bleeding after the surface layer wiring conductor is formed, specifically, a viscosity of about 10,000 to 20000 cps.

  The method for printing the conductor paste 2a on the surface of the support 1 is not particularly limited, and a conventionally known screen printing method or gravure printing method can be used.

  Next, as shown in FIG. 1B, a ceramic green sheet with a conductor layer is formed by applying a magnetic ceramic slurry 3a on the support 1 on which the conductor layer 2 is formed.

Examples of magnetic ceramic slurry powder include Ni—Zn ferrite, Mn—Zn ferrite, Mg—Zn ferrite, and Ni—Co ferrite, which are ferromagnetic ferrites, but X—Fe 2 O 4 ( X is Cu, Ni, Ni-Zn ferrite which is a solid solution of the inverse spinel structure is preferable to obtain a sufficiently high magnetic permeability in a high frequency band indicated as Zn), in particular Fe ₂ O the composition ratio of the sintered body ₃ is 63 to 73% by mass, CuO is 5 to 10% by mass, NiO is 5 to 12% by mass, and ZnO is 10 to 23% by mass. The sintered density is 5.0 g / cm ³ or more at a low temperature of 1000 ° C. or less. Can be fired at a high density, and a sufficiently high magnetic permeability can be obtained in a high frequency band.

Here, Fe ₂ O ₃ is a basic component of ferrite, and sufficient magnetic permeability can be obtained when the Ni—Zn-based ferrite is contained in an amount of 63% by mass or more. On the other hand, in the case of 73% by mass or less, since the sintered density can be sufficiently maintained, it is possible to more effectively suppress the mechanical strength from being lowered.

CuO is an important component for lowering the sintering temperature, and CuO has an effect of promoting sintering by forming a liquid layer at a low temperature. It can be fired at a low temperature. When this CuO is contained in the Ni—Zn-based ferrite in an amount of 5% by mass or more, a sufficient sintered density can be obtained when firing at a low temperature region simultaneously with the conductor paste 2a, and the mechanical strength is lowered. This can be suppressed more effectively. Also, in the case of 10 wt% or less, it is possible to more effectively suppress the loss of magnetic properties due to the low percentage of CuFe ₂ O ₄ magnetic properties is increased.

NiO is contained in order to ensure the magnetic permeability in the high frequency region of the magnetic layer formed by firing the ceramic green sheet. NiFe ₂ O ₄ does not cause the attenuation of the magnetic permeability due to resonance up to the high frequency region, and can maintain the magnetic permeability in the high frequency region at a relatively high value, but has a characteristic that the initial magnetic permeability is low. Here, when 5 mass% or more is contained in Ni-Zn system ferrite, it can suppress more effectively that the magnetic permeability in a 10 MHz thru | or higher frequency area falls. Also, if it is 12 mass% or less, it is possible to proportion of NiFe ₂ O ₄ is the initial permeability becomes too much to more effectively suppress a decrease.

  ZnO is an important component for improving the magnetic permeability of the magnetic layer formed by firing the ceramic green sheet. When the main component of ferrite is contained in an amount of 10% by mass or more, the magnetic permeability is more effective. On the other hand, if it is 23 mass or less, the magnetic properties can be kept good.

The ferromagnetic ferrite powder is a ferrite powder prepared by pre-calcining Fe ₂ O ₃ and CuO, ZnO, or NiO, and has an average particle diameter of 0.1 μm to 0.9 μm and uniform. The grain shape is preferably close to a spherical shape.

  This is because when the average particle size is 0.1 μm or more, it is easy to uniformly disperse the ferrite powder in the production of the ceramic green sheet, and when the average particle size is 0.9 μm or less, the sintering temperature of the ceramic green sheet It is because it can suppress more effectively that becomes high.

  Moreover, a uniform sintered state can be obtained because the particle diameter is uniform and nearly spherical. For example, when ferrite powder has a small grain size, the crystal grain growth is reduced only in that part, and the magnetic permeability of the magnetic layer obtained after sintering tends to be difficult to stabilize.

  As the organic binder of the ceramic green sheet, those conventionally used can be used, for example, acrylic (a homopolymer or copolymer of acrylic acid, methacrylic acid or an ester thereof, specifically an acrylic ester. Copolymer, methacrylic acid ester copolymer, acrylic acid ester-methacrylic acid ester copolymer, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, or cellulose alone A polymer or a copolymer is mentioned. In particular, an acrylic binder is more preferable in consideration of decomposition in the firing step and volatility.

  The organic solvent of the ceramic slurry 3a may be any one that can satisfactorily disperse and mix the ferrite powder and the organic binder, and examples thereof include organic solvents such as toluene, ketones, or alcohols, and water.

  Among these, solvents having a high evaporation coefficient such as toluene, methyl ethyl ketone, and isopropyl alcohol are more preferable because the drying step after slurry application can be performed in a short time.

  The slurry for producing the ferrite green sheet 3 is obtained by adding 5 to 20 parts by mass of an organic binder and 15 to 50 parts by mass of an organic solvent with respect to 100 parts by mass of the ferrite composition powder, and mixing them by a mixing means such as a ball mill. It is prepared to have a viscosity of 3 to 100 cps.

  The magnetic ceramic slurry is applied by a doctor blade method, a lip coater method, a die coater method, or the like. In particular, when an extrusion method such as a die coater method, a slot coater method, or a curtain coater method is used, since these are non-contact coating methods, the conductor layer 2 is not mixed by a physical force. It is more preferable because a ceramic green sheet with a conductor layer can be formed.

  FIG. 2 is a diagram showing a height adjusting step of adjusting the height of the surface of the ceramic slurry 3a by applying a magnetic field to the ceramic slurry 3a in the method for manufacturing a ceramic substrate according to the present embodiment.

  In this step, as shown in FIG. 2 (a), the magnetic ceramic slurry 3a is moved by applying an attractive force by a magnetic field to the magnetic ceramic slurry 3a, so that the conductor layer 2 is formed. The height of the portion of the ceramic slurry on the support 1, which is not present, is made higher than the height of the surface of the ceramic slurry on the conductor layer 2. In this way, when the ceramic slurry 3a is dried and contracted, the portion where the surface on the support 3 is formed is highly contracted in the thickness direction as compared with the conductor layer 2, so that FIG. A flat ceramic green sheet with a conductor as shown in FIG.

  In this step, as shown in FIG. 2 (a), the thickness is the difference between the surface height of the ceramic slurry on the conductor layer 2 and the surface height of the ceramic slurry on the support 1 where the conductor layer 2 is not formed. d1 is calculated by the equation d2 × (1−α) ÷ α expressed using the conductor layer thickness d2 and the ratio α that shrinks when the ceramic slurry dries. This is obtained because the dried dimension α × d3 of the slurry thickness d3 on the conductor layer 2 and the dried thickness α × (d1 + d2 + d3) of the slurry on the support 1 are equal. Here, the drying shrinkage rate α is calculated by the thickness of the green sheet after drying ÷ the thickness of the ceramic slurry before drying, and is a value substantially equal to the solid content ratio in the slurry, that is, the content ratio of the powder and binder in the slurry. It becomes.

  As a method for forming a magnetic field, as shown in FIG. 2A, a magnet is formed in a region other than the region opposite to the conductor layer 2 with respect to the support 1 and facing the conductor layer 2 through the support 1. 5 may be arranged. By doing so, it is possible to form the ceramic slurry 3a in which the portion where the conductor layer 2 is not formed has a higher surface position than the portion where the conductor layer 2 is formed.

  In addition, as a formation method of a magnetic field, it can form in any case of using a permanent magnet and using an electromagnet such as a coil.

  Further, if the magnetic field can be effectively formed, the magnet 5 may be disposed in a region other than the region facing the conductor layer 2a above the ceramic slurry 3a with the ceramic slurry 3a interposed therebetween.

  Further, the time when the magnetic field is applied to the ceramic slurry 3a may be the same as the time when the ceramic slurry 3a is applied or after the ceramic slurry 3a is completely applied.

  Drying of the ceramic slurry 3a coated on the support 1 lowers the vapor pressure of the solvent in addition to those using radiant heat or heat transfer such as hot air dryers and far-infrared dryers conventionally used. You may carry out by using dryers, such as a vacuum dryer to volatilize.

  The ceramic green sheet 3 may be formed with through conductors such as via-hole conductors and through-hole conductors for connecting the conductor layers 2 between the upper and lower layers as necessary. These through conductors may be formed by embedding means such as printing or press filling, after forming through holes in the ceramic green sheet with a conductor layer by punching with a mold or laser processing.

  When processing the through hole in the ceramic green sheet with the conductor layer, the ceramic green sheet with the conductor layer may be peeled off from the support 1, but if the ceramic green sheet with the conductor layer is held on the support 1, It is more preferable because deformation can be prevented.

  Moreover, the conductor paste for through conductors is produced in the same manner as the conductor paste 2a, and is adjusted to about 15000 cps to 40000 cps depending on the amount of the solvent and the organic binder.

  In addition, it is good also as an inorganic component which added the powder of glass or ceramics to the metal conductor powder in order to adjust the sintering behavior of the conductor paste for through conductors. The amount of the organic binder is preferably in the range of 3 to 15 parts by mass with respect to 100 parts by mass of the inorganic component. If it is 3 parts by weight or more, it becomes easy to adjust to a paste form, and if it is less than 15 parts by weight, the amount of organic components in the paste is moderate, so the sintered conductor becomes porous or shrinks excessively. Thus, it is possible to effectively suppress the formation of a gap between the inside of the through conductor or between the through conductor and the inner wall of the through hole.

  Next, as shown in FIG.1 (c), the ceramic green sheet laminated body 4 is produced by aligning, stacking, and crimping | bonding the ceramic green sheets with a conductor layer.

  The lamination method is a method in which heat and pressure are applied to the stacked ceramic green sheets with the conductor layer, a method in which an adhesive made of an organic binder, a plasticizer, a solvent, etc. is applied between the sheets, and a method in which the pressure is applied. Can be adopted.

  The conditions of heating and pressurization during lamination vary depending on the type and amount of the organic binder used, but are generally 30 to 100 ° C. and 2 to 20 MPa.

  The laminated body 12 is debindered at a temperature of 400 to 600 ° C. in the air or in a humidified nitrogen atmosphere, and then fired at a temperature of 800 to 1000 ° C. to obtain a wiring board.

  It should be noted that the surface layer wiring conductor formed by firing the conductive paste 2 such as a mounting electrode for mounting a semiconductor chip or a chip component or an electrode pad for connecting the coil built-in substrate to the external wiring substrate is soldered or the like. In order to strengthen the bonding between the semiconductor chip and the chip component by the above method, it is preferable to sequentially deposit a nickel layer and a gold layer on the surface by a plating method or the like.

  The ceramic substrate manufactured by the above method has high electrical characteristics required for electronic components because it has no delamination inside and can be formed in multiple layers and thicker conductor layers than conventional products. Is obtained.

  EXAMPLES Hereinafter, although the Example is given and the manufacturing method of the wiring board of this invention is demonstrated in detail, this invention is not limited only to a following example.

  First, an internal wiring conductor paste 2 was applied to a thickness of 80 μm by a screen printing method on a film-like support 1 made of PET, and dried at 70 ° C. for 30 minutes to form a wiring conductor 2. Here, since the inner conductor layer is 80 μm or more and greatly exceeds the typical thickness of 30 μm, it can be said that the inner conductor layer is thick in the wiring board in this example.

  As a paste for a wiring conductor, 10 parts by mass of an acrylic resin and 1 part by mass of α-terpineol as an organic solvent are added to 100 parts by mass of Ag powder, and after sufficiently mixing with a stirring deaerator, three rolls are sufficient. A kneaded product was used.

  Next, in the step of applying the magnetic ceramic slurry 3a, the magnet 5 was installed in a region other than the region facing the conductor paste 2a with the support 1 interposed therebetween. The arrangement of the magnet 5 was formed by opening a hole in a porous table that holds the support 1 by suction.

Subsequently, a ceramic slurry 3a having magnetism was applied to form a thickness of 100 μm on the conductor layer. The ceramic slurry 3a having magnetism is composed of 700 g of Fe ₂ O ₃ powder, 60 g of CuO powder, 60 g of NiO powder, and 180 g of ZnO powder in a ball mill of 7000 cm ³ using 4000 cm ³ of pure water and zirconia balls for 24 hours. And then mixing the dried mixed powder in a zirconia crucible and heating in the atmosphere at 730 ° C. for 1 hour to prepare a ferromagnetic ferrite calcined powder. On the other hand, 10 parts by mass of butyral resin as a binder and 45 parts by mass of IPA as an organic solvent were added and mixed by a ball mill method.

  After coating, the ceramic slurry 3a was moved by leaving it in a magnetic field for 1 minute, so that the surface of the ceramic slurry on the support 1 was made higher than the surface of the ceramic slurry on the conductor layer 2. And after drying until the fluidity | liquidity of a slurry was lose | eliminated, the organic solvent was volatilized by making it dry at 70 degreeC for 30 minutes, and the green sheet with a conductor was formed.

  Next, as a result of measuring the thickness of the conductor-attached green sheet, the difference between the thickness of the conductor layer 2 and the thickness of the green sheet on the conductor layer 2 and the thickness of the green sheet on the support 1 is 1 μm or less. It was confirmed that there was.

  In a state where no magnetic field is applied, the difference between the sum of the thickness of the conductor layer 2 and the thickness of the green sheet on the conductor layer 2 and the thickness of the green sheet on the support 1 is 40 μm or more. It has been clarified that the flatness of the green sheet with a conductor layer produced by using is improved.

  Next, a through hole having a diameter of 150 μm was formed in the ceramic green sea with conductor 3 by punching with a mold.

  The through hole was filled with a through conductor paste by screen printing and dried at 70 ° C. for 30 minutes to form a through conductor composition to be a through conductor. As a paste for through conductors, 100 parts by mass of Ag powder, 10 parts by mass of glass powder as a sintering aid, 12 parts by mass of acrylic resin and 2 parts by mass of α-terpineol as an organic solvent are added, and stirring defoaming is performed. After thoroughly mixing with a machine, the one kneaded sufficiently with three rolls was used.

  Next, the green sheets with conductors were stacked and heat-pressed at a pressure of 2 MPa and a temperature of 50 ° C. to produce a laminate 4.

  Next, this laminate 4 was fired in an air atmosphere at 500 ° C. for 3 hours to remove organic components, and fired in an air atmosphere at 900 ° C. for 1 hour to produce a coil built-in substrate. .

  Here, delamination was confirmed at the end of the conductor layer 2 after firing in the laminate in which the ceramic green sheet with conductor produced in a state where no magnetic field was applied was heated and pressure-bonded under the same conditions. As a result, it has been clarified that the manufacturing method of this example can manufacture a ceramic substrate in which the problem of delamination hardly occurs even when the inner conductor layer is thick.

  In the above embodiment, the ceramic slurry having magnetism is used, but the present invention is not limited to this. Even if it is another kind of ceramic slurry, the same effect can be obtained if the surface height of the slurry on the support is made higher than the surface height of the slurry on the conductor layer and dried. Moreover, although the magnetic field was acted in order to adjust the surface height of a ceramic slurry, you may adjust height not only by this but by another method.

It is a figure which shows an example of the manufacturing method of the ceramic substrate by embodiment of this invention. It is a figure which shows the process of adjusting the height of the surface of a ceramic slurry by making a magnetic field act on a ceramic slurry in the manufacturing method of the ceramic substrate by embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support body 2 ... Conductor layer 2a ... Conductor paste 3 ... Ceramic green sheet 3a ... Ceramic slurry 4 ... Ceramic green sheet laminated body 5 ... Magnet d1 ... Make a magnetic field act Thickness amount d2 of the ceramic slurry adjusted by: .. Thickness amount d3 of the conductor layer .. Thickness amount of the ceramic slurry on the conductor layer

Claims (5)

Forming a conductor layer on a plurality of supports;
On each of the supports, an application step of applying a ceramic slurry so as to cover the conductor layer,
A height adjusting step for making the height of the surface of the ceramic slurry on the support higher than the height of the surface of the ceramic slurry on the conductor layer;
Drying step of drying the ceramic slurry to form a ceramic green sheet;
A peeling step of peeling the support from a laminate of the support and the ceramic green sheet;
A laminating step of laminating a plurality of the ceramic green sheets from which the support has been peeled;
A method for producing a ceramic substrate, comprising: a firing step for firing the laminated ceramic green sheets.   The method for manufacturing a ceramic substrate according to claim 1, wherein the coating step and the height adjusting step are performed simultaneously. The ceramic slurry has magnetism,
2. The height adjustment step, wherein a magnetic field is applied to the ceramic slurry so that the height of the surface of the ceramic slurry on the support is higher than the height of the surface of the ceramic slurry on the conductor layer. A method for manufacturing a ceramic substrate according to claim 2.   Prior to the height adjustment step, the method includes an arrangement step of arranging a magnet in a region opposite to the conductor layer with respect to the support and other than a region facing the conductor layer via the support. 3. A method for producing a ceramic substrate according to 3.   4. The ceramic according to claim 3, further comprising an arrangement step of arranging a magnet in a region above the ceramic slurry and other than a region facing the conductor layer with the ceramic slurry interposed therebetween before the height adjusting step. A method for manufacturing a substrate.

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