JP2009081009A - Micro coaxial harness, wiring board connector, wiring board module, and electronic equipment - Google Patents

Abstract

An ultra-fine coaxial harness capable of connectorless connection with a board in a narrow space while ensuring work reliability and speed.
A micro coaxial harness H includes a multi-core micro coaxial wire 10 in which a plurality of micro coaxial wires 11 having a central conductor 12 with an exposed end portion connected in parallel and a through-hole conductive layer 34. And an intermediate connector 30 having a first conductive layer 32 and a second conductive layer 33 to be connected. When mounting on the PCB 50 (mother board), the flat second conductive layer 33 and the ground second conductive layer 33a are simply and reliably connected to the wiring 52 of the PCB 50 as the mother board while pushing the intermediate connector 30 with the heater chip. Can be connected to.
[Selection] Figure 1

Description

  The present invention relates to a micro coaxial harness, a connection method thereof, a wiring board connector, a wiring board module, and an electronic device.

2. Description of the Related Art Conventionally, as disclosed in Patent Document 1, for example, a connector for connecting a plurality of ultrafine coaxial wires to a wiring on a substrate is known.
As shown in FIG. 8, the connector 100 is fitted into a receptacle (not shown) to electrically connect the multi-core micro coaxial wire 101 to the substrate. The connector 100 includes an insulating housing 102 made of plastic or the like, a plurality of conductive terminals 103 disposed at a predetermined pitch along the width direction of the housing 102, and a shield plate 104 that covers the upper surface of the housing 102. have. Each conductive terminal 103 is positioned and disposed in a housing recess 105 formed adjacent to each other at a predetermined pitch along the width direction of the housing. A multi-core micro coaxial cable 101 connected to the conductive terminal 103 includes a central conductor 107 connected to the conductive terminal 103 with solder, an intermediate insulator 108 covering the central conductor 107, and an outer side of the intermediate insulator 108. The outer conductor 109 formed and the outer skin 110 covering the outer conductor 109 are provided. Each multi-core micro coaxial wire 101 is connected to each conductive terminal 103 to which each central conductor 107 corresponds, and each outer conductor 109 is collectively connected by a caulking member 111.

JP-A-2005-302604

  By the way, as for the micro coaxial line used for a mobile phone etc., cables or a cable and a board | substrate etc. are connected via the connector. On the other hand, in the connector 100 of Patent Document 1, the multi-conductor micro coaxial cable 101 is caulked and connected by a caulking member 111 which is a common connecting metal plate without soldering the outer conductor 109 to each of the multi-core micro coaxial wires 101. Yes. As a result, even if the outer conductor 109 is impregnated with solder, the flexibility of the multi-core micro coaxial wire 101 is not impaired, and the workability at a narrow connection point of the cable is improved.

  However, the space that can be secured as the connection location is becoming smaller along with the miniaturization of equipment, and cables having a small diameter of, for example, AWG (American Wire Gauge) 40-45 are used. Under such circumstances, it has become difficult to adopt a connection structure via a connector as in Patent Document 1. Therefore, in order to reduce the connection space as much as possible, it is expected to realize a connectorless connection such as connecting the central conductor of each cable directly to the circuit of the device without using a connector.

  An object of the present invention is to provide an ultra-fine coaxial harness capable of performing connectorless connection with a board in a narrow space, a wiring board connection body using the same, and the like while ensuring work reliability and speed. is there.

The micro coaxial harness of the present invention is an intermediate connector for electrically connecting the center conductor of the micro coaxial line to the wiring on the mother board, and is connected to the center conductor of the micro coaxial line on the upper surface side of the base film. One conductive layer is provided, and a second conductive layer provided on the lower surface side and a connection conductive layer that connects the first conductive layer and the second conductive layer are provided.
The connection between the center conductor and the first conductive layer may be made by solder or via an anisotropic conductive film.

  As a result, the flat second conductive layer of the intermediate connector may be connected to the wiring of the mother board, so that the second conductive layer and the wiring on the mother board are soldered while pushing the intermediate connector with the heater chip. Can be connected easily and securely. Further, since the structure of the intermediate connection body is simple, the required area is very small, and the connection can be performed even in a narrow space.

  By using an FPC having a commonly used double-sided through-hole circuit structure as the intermediate connection body, further cost reduction can be achieved.

  A grounding member for connecting the outer conductors of each of the micro coaxial cables, a first conductive layer for grounding formed on the upper surface side of the base film and connected to the grounding member, and a grounding first electrode formed on the lower surface side of the base film. By further including two conductive layers and a ground connection conductive layer that connects the first ground conductive layer and the second ground conductive layer, the ground line can be connected smoothly.

  The wiring board connector of the present invention comprises the micro coaxial harness of the present invention and a mother board on which wiring connected to the second conductive layer of the micro coaxial harness is formed, thereby incorporating the micro coaxial harness. In addition, it is possible to provide a wiring board connector suitable for downsizing and thinning of a device to be manufactured.

  The wiring board module of the present invention is obtained by mounting an electronic component on the mother board of the wiring board connector, and the electronic device of the present invention includes this wiring board module. Also in these, it is possible to provide a wiring board module and an electronic device suitable for downsizing and thinning.

  According to the micro coaxial harness, the wiring board connector, the wiring board module, or the electronic device of the present invention, connectorless connection with the wiring on the board side can be performed in a narrow space while achieving quick and easy work.

(Embodiment 1)
FIG. 1 is a perspective view showing a structure of wiring board connector A according to Embodiment 1 of the present invention. FIG. 2 is a longitudinal sectional view of the micro coaxial harness H in the first embodiment. FIGS. 3A and 3B are a plan view and a cross-sectional view showing the structure of the intermediate connector 30 according to the first embodiment in order. Although not shown in FIG. 1, the wiring board connector A further includes a connected wiring board connected to the other end of the multi-core micro coaxial line.

  As shown in FIGS. 1 to 3, a wiring board connector A according to the present embodiment includes a hard printed wiring board (hereinafter abbreviated as PCB) 50 as a mother board and a multi-core micro coaxial on the mother board. An ultrafine coaxial harness H for joining the wire 10 is provided. The extra-fine coaxial harness H includes a multi-core extra-fine coaxial line 10 and an intermediate connector 30 using a flexible printed wiring board (hereinafter abbreviated as FPC).

  The multi-core micro coaxial line 10 is obtained by connecting a plurality of micro coaxial cables 11 in parallel. Each micro-coaxial wire 11 includes a center conductor 12 having a substantially circular cross section, an outer conductor 14 formed around the center conductor 12 with an intermediate insulator 13 interposed therebetween, and an outer sheath covering the entire members. And is composed of. The tip of the center conductor 12 is exposed. Further, the intermediate insulator 13, the outer conductor 14, and the outer skin are also sequentially exposed in a step shape.

  The lower ground member 21 (ground bar) and the upper ground member 22 (ground bar) that commonly connect the exposed portions of the outer conductor 14 are attached by soldering. As the ultrafine coaxial line 11, for example, an ultrafine diameter (AWG (American Wire Gauge) 40-46) is used. The central conductor 12 disposed at the center of the micro coaxial cable 11 is generally flexible and resistant to bending, so that a twisted wire made of a copper wire is generally preferred.

  On the other hand, the intermediate connector 30 includes a base film 31, a first conductive layer 32 formed on the upper surface side of the base film 31, a second conductive layer 33 formed on the lower surface side of the base film 31, and a first conductive material. A through-hole conductive layer 34 (connection conductive layer) that connects the layer 32 and the second conductive layer 33 is provided. Furthermore, as a grounding conductive layer, a grounding first conductive layer 32a formed on the upper surface side of the base film 31, a grounding second conductive layer 33a formed on the lower surface side of the base film 31, and a grounding first conductive layer 32a. A grounding through-hole conductive layer 34a for connecting the first conductive layer 32a and the second grounding conductive layer 33a is provided.

  In the present embodiment, a flexible printed wiring board (hereinafter abbreviated as FPC) having a double-sided through-hole circuit structure is used as the intermediate connection body 30. A polyimide film is mainly used as the base film of the FPC constituting the intermediate connector 30, but a polyester film (low temperature use), a glass epoxy laminate (thin plate), a liquid crystal polymer, PEEK (polyether ether ketone), etc. are also used. It is done. As a material for each of the conductive layers 32 and 33 and the through-hole conductive layer 34, a copper alloy is generally used, but is not limited thereto.

  9A and 9B are a plan view showing a state in which the central conductor 12 is connected to the first conductive layer 32 of the intermediate connector 30 in order, and a cross-sectional view taken along the line IX-IX. As shown in FIGS. 9A and 9B, the center conductor 12 of each of the fine coaxial wires 11 of the multi-core fine coaxial wire 10 is accommodated in the concave portion of the comb-like jig 25 and joined. In the region Rs, each central conductor 12 is joined to the first conductive layer 32 of the intermediate connector 30 by soldering. At the same time, the lower ground member 21 is joined to the ground first conductive layer 32a by solder. However, you may connect both using ACF (Anisotropic Conductive Film) (anisotropic conductive film) mentioned later. Although not shown in FIG. 1, the other end of the multi-core micro coaxial wire 10 of the wiring board connector A is electrically connected to the wiring of the connected wiring board. The multi-core micro coaxial cable 10 and the wiring of the connected wiring board may be connected by the intermediate connector 30 of the present embodiment, or may be connected directly or via another connector.

  Further, the PCB 50 as a mother board includes a rigid board 51, a wiring 52 formed on the upper surface side of the rigid board 51, and a grounding wiring 52a. The rigid substrate 51 serving as the base material for the PCB 50 is not limited to a glass epoxy plate, but may be a paper phenol plate, a paper epoxy plate, a fluororesin plate, an alumina plate, or the like. As a material for the wiring 52, a copper alloy is generally used, but the material is not limited to this.

In this embodiment, the second conductive layer 33 of the intermediate connector 30 of the micro coaxial harness H is soldered to the wiring 52 of the PCB 50, and the second conductive layer 33a for grounding is soldered to the grounding wiring 52a of the PCB 50, respectively. It is joined.
The pitch of the central conductor 12 and the first and second conductive layers 32 and 33 in the present embodiment is about 0.2 mm to 0.4 mm, and the width dimension of the intermediate connector 30 is about 17 mm to 25 mm and the length dimension. (Dimension in the length direction of the wiring in FIG. 3A) is about 3 mm.

  According to the micro coaxial harness H according to the present embodiment, each central conductor 12 of the multi-core micro coaxial wire 10 is connected to the intermediate connector 30 to form a unit, so that on the mother board such as the PCB 50 for the following reason. Connection to wiring becomes easy.

  By aligning and fixing the central conductors 12 of the multi-core micro coaxial cable 10 with a frame or the like, the central conductors can be collectively connected to the wiring of the mother board. However, since the center conductor 12 is an extra fine wire and has a circular cross section, when the center conductor 12 is soldered to the wiring on the mother board, it is necessary to press the round center conductor 12 with a heater chip or the like. It takes time and effort.

  On the other hand, in the intermediate connector 30 of the present embodiment, the flat second conductive layer 33 and the grounding second conductive layer 33a provided on the planar base film 31 are formed on the wiring 52 of the PCB 50 which is a mother board, Therefore, the second conductive layers 33 and 33a can be easily and surely connected to the wirings 52 and 52a on the PCB 50 by soldering or the like while pushing the intermediate connector 30 with the heater chip. Further, since the required area of the intermediate connection body 30 is extremely small, the connection can be made even in a narrow space such as a mobile phone.

  When assembling such a micro coaxial harness H, considerable equipment and techniques are required to align the center conductor 12 at a predetermined pitch interval and connect it to the first conductive layers 32 and 32a of the intermediate connector 30. is there. Therefore, by assembling the ultrafine coaxial harness H intensively on the supplier side, the second conductive layers 33 and 33a of the intermediate connector 30 and the mother board are formed on each user side having different mother board specifications. Therefore, the wiring board connection body A can be reduced in total cost.

  In particular, by using an FPC having a widely used double-sided through-hole circuit structure as the intermediate connector 30, further cost reduction can be achieved.

(Modification)
FIG. 4 is a perspective view showing a structure of a wiring board connector B according to a modification of the first embodiment. In FIG. 4, the same members as those of the wiring board connector A according to Embodiment 1 shown in FIG.

In the intermediate connector 30 in the present modification, as shown in the enlarged sectional view, the first conductive layer 32 and the second conductive layer 33 are formed at positions where the upper surface and the lower surface of the base film 31 are different. In other words, the first conductive layer 32 and the second conductive layer 33 overlap in a region in the vicinity of the through-hole conductive layer 34 in plan view, but the first conductive layer 32 and the second conductive layer 33 have the first conductive layer 33 above the second conductive layer 33. A blank region R in which the conductive layer 32 does not exist is provided. Although not shown, the grounding second conductive layer extends on the lower surface side of the base film 31 from a position facing the lower grounding member 21 of the multi-core micro coaxial line 10 to a position below the blank region R. Yes.
The pitch of the central conductor 12 and the first and second conductive layers 32 and 33 in this modification is about 0.2 mm to 0.4 mm, and the width dimension of the intermediate connector 30 is about 17 mm to 25 mm and the length dimension ( The dimension in the length direction of the wiring of the base film 31 in FIG. 4 is about 4.5 mm.

  According to the wiring board connector B of the present modification, the area of the intermediate connector 30 is larger than that of the wiring board connector A of the first embodiment, but when the micro coaxial harness H is mounted on the PCB 50 (mother board). Since the wide blank region R exists above the second conductive layer 33, the second conductive layer 33 (and 33a) of the intermediate connector 30 is moved to the PCB 50 by pressing the blank region R with a heater chip having a general structure. A process such as soldering to the upper wiring 52 (and 52a) can be performed more easily and quickly.

(Embodiment 2)
FIG. 5 is a longitudinal sectional view showing the structure of the wiring board connector C according to the second embodiment. 5, the same members as those of the wiring board connector A according to Embodiment 1 shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

  In the present embodiment, an anisotropic conductive film 40 (ACF (Anisotropic Conductive Film)) is provided between the second conductive layers 33 and 33a of the intermediate connector 30 and the wirings 52 and 52a of the PCB 50 (mother substrate). Is different from the first embodiment. In the present embodiment, the anisotropic conductive film 40 is bonded in advance to the upper surface of the PCB 50.

  FIG. 6 is a perspective view schematically showing the structure of the anisotropic conductive film 40. The anisotropic conductive film 40 is obtained by dispersing conductive particles 47 in an adhesive resin film 42 such as an epoxy resin. The conductive particles 47 are composed of a resin 47b and an Au layer 47a covering the resin 47b, and the diameter is about 5 μm.

  By using such an anisotropic conductive film 40, the second conductive layers 33 and 33a of the intermediate connector 30 are electrically connected to the wirings 52 and 52a of the PCB 50 (mother board) without causing a short circuit. It will be.

  In the present embodiment, when the micro coaxial harness H is mounted on the PCB 50, the anisotropic conductive film 40 is heated and pressed by the heater chip, whereby the conductive particles 47 are formed on the intermediate connector 30. The conductive layers 33 and 33a are brought into contact with the electrodes of the wirings 52 and 52a of the PCB 50 to be deformed. Accordingly, the second conductive layers 33 and 33a of the intermediate connector 30 are electrically connected to the wirings 52 and 52a of the PCB 50.

  In particular, when the conductive layers (wirings) have a narrow pitch, there is no need to use solder in the second embodiment, so that the possibility of causing a short circuit between terminals is reduced compared to the structure of the first embodiment. Is done. Therefore, the wiring board connector C of the present embodiment has a structure that is advantageous for reducing the pitch.

  In the present embodiment, the anisotropic conductive film 40 is mounted in advance on the PCB 50 by bonding or the like. However, even if an ultra-fine coaxial harness in which the anisotropic conductive film 40 is bonded in advance to the intermediate connector 30 is configured. Good.

  In the first and second embodiments, since the lower ground member 21 is connected to the ground first conductive layer 32a of the intermediate connector 30, the ground line can be connected smoothly. However, the connection method of the ground line is not limited to the structure of each of the above embodiments, and can take various forms.

—Structure of Wiring Board Module and Electronic Device— FIG. 7 is a perspective view showing various wiring board modules built in an electronic device functioning as a mobile phone using the first and second embodiments and the connection relationship between the wiring board modules. It is.
The wiring board module built in the electronic device of the present embodiment includes a main display 61 that displays a screen of a mobile phone equipped with the LED 90, a first sub PCB 62 and a main PCB 63 that are responsible for main control in the electronic device, An integrated sub-display 64 for displaying secondary information of a mobile phone, a second sub-PCB 65, an in-camera control PCB 66 for controlling the in-camera 91, and an attached circuit PCB 67 connected by FPC. It is a module. In the first sub PCB 62 and the main PCB 63, a built-in memory, a baseband LSI, a power supply control IC, a sound source IC, an RF reception LSI, an RF transmission LSI, a power amplifier, a switch IC, and the like are allocated and arranged.
Although not included in the integrated module, an out camera 93 and a control circuit 94 for controlling the out camera 93 are also arranged in the electronic device.

  The first sub PCB 62 and the main PCB 63 are connected by a micro coaxial line 83. An intermediate connection body to which a ground bar and a center conductor of the fine coaxial line are connected is directly connected to the connection portion between the fine coaxial line 83 and the first sub PCB 62. The micro coaxial line 83 and the main PCB 63 are connected by fitting a connector plug 77a attached to the tip of the micro coaxial line and a receptacle 77b provided on the main PCB.

  The main display 61 and the first sub PCB 62 are electrically connected by two FPCs 81a and 81b. The two FPCs 81 a and 81 b are divided into a liquid crystal panel side and an LED 90 side in the main display 61, but are connected to a common connector 71 on the first sub PCB 62.

  The first sub PCB 62 and the sub display 64 are connected to each other via the connector 72 by the FPC 82. The first sub PCB 62 and the in-camera control PCB 66 are connected via the connector 74 by the FPC 84. The first sub PCB 62 and the attached circuit PCB 67 are connected by the FPC 85 via the connectors 75 and 76. The main PCB 63 and the antenna 65 are connected via the connector 78 by the FPC 86.

  As a rigid board of each PCB, not only a glass epoxy board but a paper phenol board, a paper epoxy board, a fluororesin board, an alumina board, etc. are used. As a wiring material, a copper alloy is generally used, but is not limited thereto. As a flexible substrate, not only a polyimide board but a polyester board (low temperature use), a glass epoxy board (thin board), etc. are used.

As described above, the work of mounting the micro coaxial harness on the wiring board by incorporating the micro coaxial harness of the present embodiment into the wiring board module that is an integrated module, and thus the electronic device including the wiring board module, It can be done accurately and quickly without connectors.
Electronic devices include mobile phones, cameras such as digital cameras and video cameras, portable audio players, portable DVD players, and portable notebook computers.

  The structure of the embodiment of the present invention disclosed above is merely an example, and the scope of the present invention is not limited to the scope of these descriptions. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  The present invention can be used for electronic devices such as mobile phones, cameras such as digital cameras and video cameras, portable audio players, portable DVD players, and portable notebook computers.

1 is a perspective view showing a structure of a wiring board connector according to Embodiment 1. FIG. 1 is a longitudinal sectional view of an ultrafine coaxial harness in a first embodiment. (A), (b) is the top view and sectional drawing which show the structure of the intermediate | middle connection body in Embodiment 1 in order. FIG. 10 is a perspective view showing a structure of a wiring board connector B according to a modification of the first embodiment. 6 is a longitudinal sectional view showing a structure of a wiring board connector C according to Embodiment 2. FIG. It is a perspective view which shows roughly the structure of the anisotropic conductive film 40 in Embodiment 2. FIG. It is a perspective view which shows the connection relation of the various wiring board modules built in the electronic device which functions as a mobile telephone, and a wiring board module. It is sectional drawing which shows the connection structure of the conventional micro coaxial line currently disclosed by patent document 1. FIG. (A), (b) is a top view which shows the state which has connected the center conductor to the 1st conductive layer of the intermediate | middle connection body in order, and sectional drawing in the IX-IX line.

Explanation of symbols

A, B, C Wiring board connector H Micro coaxial harness R Blank area 10 Multi-core micro coaxial cable 11 Micro coaxial cable 12 Center conductor 13 Intermediate insulator 14 Outer conductor 21 Lower ground member 22 Upper ground member 30 Intermediate connector 31 Base film 32 First conductive layer 32a Grounding first conductive layer 33 Second conductive layer 33a Grounding second conductive layer 34 Through-hole conductive layer 34a Grounding through-hole conductive layer 40 Anisotropic conductive film 50 PCB (hard printed wiring) Board)
51 Rigid board 52 Wiring 52a Grounding wiring

Claims (6)

A plurality of micro coaxial wires having a center conductor with an exposed tip and an outer conductor provided outside the center conductor;
An ultra-fine coaxial harness comprising an intermediate connector for electrically connecting a central conductor of the ultra-fine coaxial line to a wiring on a mother board,
The intermediate connector is
A base film,
A plurality of first conductive layers provided on an upper surface side of the base film on which the fine coaxial lines are mounted and connected to the central conductors;
A plurality of second conductive layers provided on the lower surface side facing the upper surface side of the base film;
A plurality of connection conductive layers connecting the first conductive layers and the second conductive layers to each other;
Ultra-fine coaxial harness equipped with The micro coaxial harness according to claim 1,
The intermediate connector is
An ultra-fine coaxial harness configured using a flexible printed wiring board having a double-sided through-hole circuit structure. The ultrafine coaxial harness according to claim 1 or 2,
A grounding member for connecting the outer conductors of each of the micro coaxial cables;
A first conductive layer for grounding formed on the upper surface side of the base film and connected to the grounding member;
A second conductive layer for grounding formed on the lower surface side of the base film;
A ground connection conductive layer connecting the first ground conductive layer and the second ground conductive layer;
An extra fine coaxial harness. The ultrafine coaxial harness according to any one of claims 1 to 3,
A mother board on which a plurality of wirings respectively connected to the plurality of second conductive layers of the micro coaxial harness are formed;
Wiring board connector comprising: The wiring board connector according to claim 4,
Electronic components mounted on the mother board;
Wiring board module equipped with.   An electronic apparatus comprising the wiring board module according to claim 5.

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