JP2009047877A - Chip-on glass type display module and its mounting inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce man-hours by simultaneously performing mounting inspection of a driving IC and mounting inspection of an FPC in a COG type display module. <P>SOLUTION: The driving IC 13 includes first and second dummy terminals 13c1 and 13c2 electrically connected to each other in the inner part of the driving IC 13. A glass substrate 11 includes: first and second fixing electrodes 11c1 and 11c2 to which the first and the second dummy terminals 13c1 and 13c2 of the driving IC 13 are electrically connected, respectively; and third and fourth fixing electrodes 11e1 and 11e2 electrically connected to the first and the second fixing electrodes 11c1 and 11c2, respectively. The FPC 14 includes: third and fourth dummy terminals 14e1 and 14e2 electrically connected to the third and the fourth fixing electrodes 11e1 and 11e2, respectively; and first and second electrodes 14g1 and 14g2 for inspection electrically connected to the third and the fourth dummy terminals 14e1 and 14e2, respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention provides a chip-on-glass display module in which a driving IC and a flexible printed circuit board are mounted on a glass substrate with an anisotropic conductive material, etc., and external connection to the terminals of the driving IC is performed by the flexible printed circuit board. The present invention relates to a chip-on-glass display module capable of inspecting the quality of electrical connection by an anisotropic conductive material or the like and a mounting inspection method thereof.

Liquid crystal display panels and EL are characterized by light weight, thinness, and low power consumption, and are used in many electronic devices. In these display panels, a display element is sandwiched between glass substrates, and an IC for driving the display element and a flexible printed circuit board are electrically connected to the glass substrate by protruding metal electrodes (bumps) made of an anisotropic conductive material. Yes. This flexible printed circuit board is connected to the display control board of the electronic device, and the output signal of the display control board is input to the input terminal of the driving IC via the flexible printed circuit board and connected to the output terminal of the driving IC. The display element is turned ON / OFF. Thus, disposing the IC on the glass substrate is referred to as “Chip On Glass”. Although the driving IC can be disposed on the flexible printed circuit board, the chip-on-glass can simplify the wiring.

In chip-on-glass, pressure and heat are applied when the driving IC and the flexible printed circuit board are electrically connected to the glass substrate with bumps. Inadequate pressure and heat will result in poor connections. It is necessary to check the quality of this connection. However, the terminal of the driving IC is the driving I
Since it is located between C and the glass substrate, the inspection lead cannot be brought into direct contact with the terminal of the driving IC.

Therefore, as in Patent Document 1, a method of providing a pair of dummy terminals and conducting an energization inspection (for example, measuring a resistance value) has been considered. FIG. 8 is FIG. 3 of Patent Document 1. In FIG. The driving IC 112 and the flexible printed circuit board 113 are electrically connected to the glass substrate 111 by bumps.

In the driving IC 112, two pairs of dummy terminals 112a1, 112a2, 112b1, and 112b2 that are electrically connected to each other inside the driving IC 112 are provided at both ends of the driving IC 112, and the IC fixing electrodes 111a1 of the glass substrate 111 are respectively provided. , 111a2, 111b1,
111b2 is electrically connected by a bump. Each of the IC fixing electrodes 111a1 and 111a
2, 111b1 and 111b2 are IC inspection electrodes 111c1, 111c2, 111d1, 1
11d2 and patterns 111e1, 111e2, 111f1, and 111f2 are electrically connected.

With this configuration, by performing a connection inspection between the inspection electrode 111c1 and the inspection electrode 111c2, the bump connection of the left dummy terminals 112a1 and 112a2 of the driving IC 112 is inspected, and the connection between the inspection electrode 111d1 and the inspection electrode 111d2 is performed. By performing the inspection, the bump connection of the dummy terminals 112b1 and 112b2 on the right side of the driving IC 112 is inspected. If both ends are good, the left and right dummy terminals 112a1, 112a2, 112b1, 11
It is determined that the electrical connection of the plurality of terminals 112g and 112h located between 2b2 is good.

The flexible printed circuit board is also provided with two pairs of dummy terminals 113i1, 113i2, 113j1, and 113j2 that are electrically connected inside the flexible printed circuit board. Like the driving IC 112, the FPC inspection electrodes 111k1 and 111k2, respectively. 111m
By performing a connection inspection of 1,111 m2, dummy terminals 113i1, 113i2, 11
The quality of the electrical connection of the regular terminal 113n between 3j1 and 113j2 is determined. In this way, the connection at the bump can be inspected by the pair of terminals connected to each other.
JP 2006-163012 A

However, in Patent Document 1, the mounting inspection of the driving IC and the mounting inspection of the flexible printed circuit board are separate, and the inspection takes time. In addition, a total of 4 mounting inspections for the driving IC and 2 mounting inspections for the flexible printed circuit board were required. Therefore, there has been a request to reduce these inspection man-hours.

The present invention reduces the number of inspection steps by simultaneously performing the mounting inspection of the driving IC and the mounting inspection of the flexible printed circuit board.

In order to solve the above problems, a transflective liquid crystal display panel according to the present invention includes a driving IC having terminals aligned at least on one end side, and a first to which the terminals of the driving IC are electrically connected.
Chip-on-glass type display module comprising a glass substrate having an electrode, a second electrode electrically connected to the first electrode, and a flexible printed board having a terminal electrically connected to the second electrode Because
The driving IC includes first and second dummy terminals electrically connected to each other inside the driving IC, and the glass substrate is electrically connected to the first and second dummy terminals of the driving IC. First and second fixing electrodes and third and fourth fixing electrodes electrically connected to the first and second fixing electrodes, and the flexible printed circuit board includes the third and fourth fixing electrodes. Third and fourth dummy terminals electrically connected to the electrodes for use, and first and electrically connected to the third and fourth dummy terminals,
A second inspection electrode.

By inspecting the energization between the first inspection electrode and the second inspection electrode having this configuration, the driving I
C mounting inspection and flexible printed circuit board mounting inspection can be performed simultaneously. Also,
In the present invention, the mounting inspection of the driving IC is inspected with the inspection electrode on the flexible printed circuit board, and the inspection electrode can be widened. This makes the drive IC very narrow
Even for the output terminals, the mounting inspection of the bumps can be performed manually.

Also, the first and second dummy terminals of the driving IC are disposed adjacent to one end of the aligned terminals,
Further, the driving IC has fifth and sixth dummy terminals electrically connected to each other inside the driving IC, and is disposed adjacent to the other end of the aligned terminals, and the glass substrate is the driving IC. The fifth and sixth dummy terminals to which the fifth and sixth dummy terminals are electrically connected, respectively, and the fifth and sixth electrodes
A flexible printed circuit board having seventh and eighth dummy terminals electrically connected to the seventh and eighth fixing electrodes; and seventh and eighth fixing electrodes electrically connected to the fixing electrodes. , The seventh
And third and fourth inspection electrodes electrically connected to the eighth dummy terminal.

By inspecting the energization between the first inspection electrode and the second inspection electrode having this configuration, the driving I
Mounting inspection of one end of C and mounting inspection of one end of the flexible printed circuit board can be performed at the same time, and the driving IC can be checked by inspecting the energization between the third inspection electrode and the fourth inspection electrode.
The mounting inspection of the other end of the flexible printed circuit board and the mounting inspection of the other end of the flexible printed circuit board can be performed simultaneously. As a result, it is possible to predict whether the mounting is good or not for the regular terminal between the driving IC and the flexible printed circuit board.

Further, the first and second dummy terminals of the driving IC are disposed at both ends of the aligned terminals. Thereby, the mounting inspection of both ends of the driving IC and the flexible printed circuit board can be simultaneously performed in one inspection.

The first and second dummy terminals of the driving IC are electrically connected by a GND line. Thereby, generation | occurrence | production of the noise by the exposed electrode for a test | inspection can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment shown below exemplifies a chip-on-glass display module for embodying the technical idea of the present invention, and is intended to specify the present invention as this chip-on-glass display module. And other embodiments within the scope of the claims are equally applicable.

FIG. 1 is a plan view showing a main part of a chip-on-glass display module according to Embodiment 1 of the present invention. FIG. 2 is an enlarged view of the vicinity of one IC in FIG. 3 is a cross-sectional view taken along the line AA in FIG. 4 is a rear view of FIG.

As shown in FIG. 1, the chip-on-glass display module 1 includes a liquid crystal panel 11, one gate driving IC 12, three source driving ICs 13, 13, and 13, and a flexible printed board 14.

Although not shown, the liquid crystal panel 11 includes a first glass substrate 11a in the front surface direction and a second glass surface in the rear surface direction.
The liquid crystal is sandwiched between the glass substrate 11b and pixels arranged in a matrix by horizontal gate lines and vertical source lines provided on the glass substrate 11b in the back surface direction, and voltage is applied to the gate lines and the source lines. An image is displayed by changing the transmittance of the liquid crystal of each pixel when applied.

The gate driving IC 12 has at least a plurality of aligned input terminals and a plurality of output terminals,
A voltage is selectively applied to the gate line connected to the output terminal based on the input signal input to the input terminal. The source driving IC 13 also has at least a plurality of input terminals and a plurality of output terminals, and selectively applies a voltage to the source line connected to the output terminal based on an input signal input to the input terminal. The gate driving IC 12 and the source driving IC 13 are the second glass substrate 11.
It is electrically connected to the electrode b by a bump 15.

The flexible printed circuit board 14 includes an input terminal of the gate driving IC 12 and a source driving IC.
13 input terminals are connected to an external control board 50. The flexible printed board 14 has a plurality of patterns 14a, both ends of which have a first terminal 14b and a second terminal (not shown), and the first terminals 14b are aligned. The first terminals 14 b are electrically connected to the pattern of the liquid crystal panel 11 by bumps 15. As a result, the first terminal 14b becomes the gate driving I.
It is electrically connected to the input terminal of C12 and the input terminal of the source driving IC 13. The second terminal is connected to the connector 51 of the external control board 50.

With this configuration, the output from the external control board 50 is input to the gate driving IC 12 and the source driving IC 13, and the gate driving IC 12 applies a voltage to the selected gate line, and the source driving IC 13 is selected. Apply voltage to the source line. The transmittance of the pixels corresponding to the selected gate line and source line changes to display an image.

As described above, the gate driving IC 12, the source driving IC 13 and the flexible printed circuit board 14 are fixed to the glass substrate pattern with the bumps 15. The bump 15 is a projecting metal electrode made of an anisotropic conductive material, and a terminal with a bump 15 (BUMP) such as FC (Flip Chip) or BGA (Ball Grid Array) is brought into contact with the electrode of the pattern. A terminal is electrically connected to an electrode by applying pressure and predetermined heat. The bump 15 is a conductive particle dispersed in an insulating resin. The terminals of the gate driving IC 12, the source driving IC 13 and the flexible printed circuit board 14 are long aligned, and the pressure and heat applied to both ends of the terminals may be different. In particular, when inclined, the pressure is different, and the resistance of the connection at both ends is different, resulting in a failure. Therefore, mounting inspection of the part connected by the bump 15 is necessary, but since the connection part is in a hidden state, the lead of the inspection instrument cannot be brought into direct contact with the terminal.

In the present invention, the connection of terminals is inspected for energization such as resistance measurement with less man-hours, and this will be described. 2 to 4, a pair of IC input dummy terminals 13c1, 13c2, 13d1, and 13d2 are provided at both ends of the aligned input terminals 13a of the source driving IC 13, respectively.
A pair of FPC dummy terminals 14e1, 14e2, 14f1, and 14f2 are provided at both ends of the plurality of first terminals 14b arranged on the flexible printed circuit board 14, respectively. Further, inspection electrodes 14g1, 14g2, 14h1, and 14h2 are provided on the flexible printed circuit board 14, and the FPC dummy terminals 14e1 are formed by dummy patterns 14i1, 14i2, 14j1, and 14j2, respectively.
, 14e2, 14f1, and 14f2. Inspection electrodes 14g1, 14g2,
14h1, 14h2 are FPC dummy terminals 14e1, 14e2, 14f as shown in FIG.
It is exposed on the surface opposite to 1,14f2.

IC input dummy terminals 13c1, 13c2, 13d1, and 13d2 are connected by bumps 15 to IC fixing electrodes 11c1, 11c2, 11d1, and 11d2, and an FPC dummy terminal 14e.
FPC fixing electrode 11e1 in which 1,14e2,14f1,14f2 are connected by a bump 15
, 11e2, 11f1, 11f2 at both ends, dummy patterns 11i1, 11i2, 1
1j1 and 11j2 are provided on the liquid crystal panel 11.

With this configuration, the inspection electrode 14g1 and the inspection electrode 1 of the flexible printed circuit board 14 are provided.
Between 4g2, the bump 15 between the FPC dummy terminal 14e1 of the flexible printed circuit board 14 and the FPC fixing electrode 11e1 of the second glass substrate 11b, and the I of the second glass substrate 11b.
The bump 15 between the C fixing electrode 11c1 and the IC input dummy terminal 13c1 of the source driving IC 13, and the IC input dummy terminal 13c2 of the source driving IC 13 and the second glass substrate 11
b, the bump 15 between the IC input dummy terminals 11c2, and the FPC of the second glass substrate 11b.
The fixing electrode 11e2 and the FPC dummy terminal 14e2 of the flexible printed circuit board 14 are connected via four bumps 15 including a bump 15 between the fixing electrode 11e2.

Thereby, the inspection electrode 14g1 and the inspection electrode 14g of the flexible printed circuit board 14 are provided.
By conducting a continuity test between the two, one end side of the source driving IC 13 on the input terminal 13a side (
The connection inspection at the bump 15 on the left end side in FIG. 2 and the mounting inspection on the bump 15 on the one end side (left end side in FIG. 2) of the first terminal 14a of the flexible printed circuit board 14 can be performed simultaneously.

Similarly, between the inspection electrode 14h1 and the inspection electrode 14h2 of the flexible printed circuit board 14, the FPC dummy terminal 14f1 of the flexible printed circuit board 14 and the second glass substrate 11b.
The bump 15 between the FPC fixing electrode 11f1 and the bump 15 between the IC fixing electrode 11d1 of the second glass substrate 11b and the IC input dummy terminal 13d1 of the source driving IC 13 and the IC input dummy terminal 13d2 of the source driving IC 13 IC of the second glass substrate 11b
Bumps 15 between the input dummy terminals 11d2 and bumps 15 between the FPC fixing electrodes 11f2 of the second glass substrate 11b and the FPC dummy terminals 14f2 of the flexible printed board 14
The four bumps 15 are connected.

As a result, the inspection electrode 14h1 and the inspection electrode 14h of the flexible printed circuit board 14 are obtained.
2, the other end of the source driving IC 13 on the input terminal 13a side (
The mounting inspection on the bump 15 on the right end side in FIG. 2 and the mounting inspection on the bump 15 on the other end side (right end side in FIG. 2) of the first terminal 14a of the flexible printed circuit board 14 can be performed simultaneously.

By performing these two inspections, the bump connection state of the input terminal 13a of the source driving IC 13 located between the IC input dummy terminal 11c2 and the IC input dummy terminal 11d2, and the FPC dummy terminal 14e2 and the FPC dummy terminal The connection state of the first terminal 14a of the flexible printed circuit board 14 located between 14f2 at the bump 15 can be predicted. The drive IC and the bump 15 of the flexible printed circuit board with such a small inspection man-hour
It is possible to perform mounting inspection at

Note that the chip-on-glass display module 1 includes all driving ICs (gate driving ICs 12
And the three source driving ICs 13) are provided with the above-described configuration of energization inspection.

FIG. 5 is a plan view showing the main part of the second embodiment of the present invention. FIG. 5 is a modification of FIG. 2 of the first embodiment. Differences from FIG. 2 will be described. The same reference numerals as those in FIG. 1 are assigned to the configurations in FIG. 5 that are the same as those in FIG.

In the second embodiment, the leftmost IC input dummy terminal 13c2 and the FPC dummy terminal 14e of the first embodiment are used.
2, inspection electrode 14g2, dummy pattern 14i2, IC fixing electrode 11c2, FPC fixing electrode 11e2, dummy pattern 11i2, and rightmost IC input dummy terminal 13d2, F
The PC dummy terminal 14f2, the inspection electrode 14h2, the dummy pattern 14j2, the IC fixing electrode 11d2, the FPC fixing electrode 11f2, and the dummy pattern 11j2 are deleted. And
The IC input dummy terminal 13c1 at the left end and the IC input dummy terminal 13d1 at the right end are connected to the IC.
Electrical connection inside. The IC input dummy terminal 13c1 and the IC input dummy terminal 13d1 are connected via the GND of the IC.

With the above configuration, the inspection electrode 14g1 and the inspection electrode 1 of the flexible printed circuit board 14 are provided.
Between 4h1, the bump 15 between the FPC dummy terminal 14e1 of the flexible printed circuit board 14 and the FPC fixing electrode 11e1 of the second glass substrate 11b, and the I of the second glass substrate 11b.
The bump 15 between the C fixing electrode 11c1 and the IC input dummy terminal 13c1 of the source driving IC 13, and the IC input dummy terminal 13d1 of the source driving IC 13 and the second glass substrate 11
bump 15 between the IC input dummy terminals 11d1, and the FPC of the second glass substrate 11b
The fixing electrodes 11f1 and the bumps 15 between the FPC dummy terminals 14f1 of the flexible printed circuit board 14 are connected via four bumps 15.

As a result, the inspection electrode 14g1 and the inspection electrode 14h of the flexible printed circuit board 14 are obtained.
By conducting the current-inspection between the two, the mounting inspection at the bumps 15 at both ends of the source driving IC 13 and the mounting inspection at the bumps 15 at both ends of the flexible printed circuit board 14 can be performed in one inspection. Also, GND at the center of the IC is connected to the IC input dummy terminals 13c1 at both ends.
And the IC input dummy terminal 13d1 are extended, and noise generation can be reduced.

FIG. 6 is a plan view showing a main part of the third embodiment of the present invention. FIG. 6 is a modification of FIG. 5 of the second embodiment. Differences from FIG. 5 will be described. 6 that is the same as the configuration in FIG. 5 is assigned the same reference numeral as in FIG.

In the third embodiment, the right ends of the plurality of input terminals 13a of the source driving IC 13 are GND input terminals 13a1. For this purpose, an inspection electrode 14m1 is provided on the pattern 14k1 of the flexible printed circuit board 14 electrically connected to the input terminal 13a1 of the rightmost GND.
This is used in place of the inspection electrode 14h1 of the second embodiment.

As described above, when the end of the existing terminal is GND, the mounting inspection with the bump 15 with less noise generation can be performed without adding a dummy terminal or a pattern to the end.

FIG. 7 is a plan view showing an essential part of Embodiment 4 of the present invention. FIG. 7 is a modification of FIG. 5 of the second embodiment. Differences from FIG. 5 will be described. The same reference numerals as those in FIG. 5 are assigned to the configurations in FIG. 7 that are the same as those in FIG.

In the fourth embodiment, IC output dummy terminals 13p1 and 13q1 are provided at both ends of a plurality of output terminals 13b in which the source driving ICs 13 are aligned. In the source driving IC 13, the IC output dummy terminal 13 p 1 and the IC input dummy terminal 13 c 1 are electrically connected, and the IC output dummy terminal 13 is connected.
q1 and the IC input dummy terminal 13d1 are electrically connected.

IC is located at the position of the second glass substrate 11b facing the IC output dummy terminals 13p1 and 13q1.
The fixing electrodes 11p1 and 11q1 are provided, and the IC fixing electrode 11p1 and the IC fixing electrode 11q are provided.
1 are electrically connected by a dummy pattern 11r1.

With the above configuration, the inspection electrode 14g1 and the inspection electrode 1 of the flexible printed circuit board 14 are provided.
Between 4h1, the bump 15 between the FPC dummy terminal 14e1 of the flexible printed circuit board 14 and the FPC fixing electrode 11e1 of the second glass substrate 11b, and the I of the second glass substrate 11b.
The bump 15 between the C fixing electrode 11c1 and the IC input dummy terminal 13c1 of the source driving IC 13, and the IC output dummy terminal 13p1 of the source driving IC 13 and the second glass substrate 11
b, the bump 15 between the IC fixing electrodes 11p1, the bump 15 between the IC fixing electrode 11q1 of the second glass substrate 11b and the IC output dummy terminal 13q1 of the source driving IC 13, and the IC input dummy terminal of the source driving IC 13. IC of 13d1 and second glass substrate 11b
Bumps 15 between the input dummy terminals 11d1 and bumps 15 between the FPC fixing electrodes 11f1 of the second glass substrate 11b and the FPC dummy terminals 14f1 of the flexible printed board 14
The four bumps 15 are connected.

As a result, the inspection electrode 14g1 and the inspection electrode 14h of the flexible printed circuit board 14 are obtained.
By conducting an energization inspection between the input terminal 13a and the output terminal 1 of the source driving IC 13
The mounting inspection at the bumps 15 at both ends of 3b and the mounting inspection at the bumps 15 at both ends of the flexible printed circuit board 14 can be performed by one inspection.

In addition, the inspection electrodes 14g1 and 14h1 are made wider than those in FIG. 5 so that the current-carrying inspection leads can be manually contacted with the inspection electrodes 14g1 and 14h1. In the present invention, the mounting inspection of the driving IC is inspected with the inspection electrode on the flexible printed circuit board, and the inspection electrode can be widened. Thereby, even if it is the output terminal 13b of very narrow drive IC, the mounting inspection of the bump can be performed manually.

It is a top view which shows the structure of the principal part of the chip-on-glass type display module of this invention. It is the elements on larger scale which show the IC part for a source drive of FIG. It is AA sectional drawing of FIG. It is a back surface part of FIG. FIG. 10 is a partial enlarged view showing a source driving IC portion in Embodiment 2. FIG. 10 is a partial enlarged view showing a source driving IC portion in Embodiment 3. FIG. 10 is a partial enlarged view showing a source driving IC portion in Embodiment 4. It is a top view which shows a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip on glass type display module 11 Liquid crystal panel 11b 2nd glass substrate 11c1, 11c2, 11d1, 11d2, 11p1, 11q1 IC fixation electrode (liquid crystal panel)
11e1, 11e2, 11f1, 11f2 FPC fixing electrode (liquid crystal panel)
11i1, 11i2, 11j1, 11j2, 11r1 dummy pattern (liquid crystal panel)
12 Gate drive IC
13 Source drive IC
13a Input terminal (source drive IC)
13b Output terminal (source drive IC)
13c1, 13c2, 13d1, 13d2 IC input dummy terminal (source driving IC)
13p1, 13q1 IC output dummy terminal (source drive IC)
14 flexible printed circuit board 14a first terminal 14e1, 14e2, 14f1, 14f2 FPC dummy terminal 14g1, 14g2, 14h1, 14h2, 14m1 inspection electrode 14i1, 14i2, 14j1, 14j2 dummy pattern 15 bump 50 control board

Claims (5)

A driving IC having terminals aligned at least on one end side; a first electrode to which the terminal of the driving IC is electrically connected; and a second electrode to be electrically connected to the first electrode. A chip-on-glass type display module having a glass substrate and a flexible printed circuit board having a terminal electrically connected to the second electrode,
The driving IC includes first and second dummy terminals electrically connected to each other inside the driving IC, and the glass substrate is electrically connected to the first and second dummy terminals of the driving IC. First and second fixing electrodes and third and fourth fixing electrodes electrically connected to the first and second fixing electrodes, and the flexible printed circuit board includes the third and fourth fixing electrodes. Third and fourth dummy terminals electrically connected to the electrodes for use, and first and electrically connected to the third and fourth dummy terminals,
A chip-on-glass display module comprising a second inspection electrode. Arranging the first and second dummy terminals of the driving IC adjacent to one end of the aligned terminals;
Further, the driving IC has fifth and sixth dummy terminals electrically connected to each other inside the driving IC, and is disposed adjacent to the other end of the aligned terminals, and the glass substrate is the driving IC. The fifth and sixth dummy terminals to which the fifth and sixth dummy terminals are electrically connected, respectively, and the fifth and sixth electrodes
A flexible printed circuit board having seventh and eighth dummy terminals electrically connected to the seventh and eighth fixing electrodes; and seventh and eighth fixing electrodes electrically connected to the fixing electrodes. , The seventh
The chip-on-glass display module according to claim 1, further comprising third and fourth inspection electrodes electrically connected to the eighth dummy terminal. 2. The chip-on-glass display module according to claim 1, wherein the first and second dummy terminals of the driving IC are disposed at both ends of the aligned terminals. 4. The chip-on-glass display module according to claim 3, wherein the first and second dummy terminals of the driving IC are electrically connected by a GND line. A driving IC having terminals aligned at least on one end side; a first electrode to which the terminal of the driving IC is electrically connected; and a second electrode to be electrically connected to the first electrode. A chip-on-glass type display module having a glass substrate and a flexible printed circuit board having a terminal electrically connected to the second electrode,
The driving IC includes first and second dummy terminals electrically connected to each other inside the driving IC, and the glass substrate is electrically connected to the first and second dummy terminals of the driving IC. First and second fixing electrodes and third and fourth fixing electrodes electrically connected to the first and second fixing electrodes, and the flexible printed circuit board includes the third and fourth fixing electrodes. Third and fourth dummy terminals electrically connected to the electrodes for use, and first and electrically connected to the third and fourth dummy terminals,
A second inspection electrode;
A mounting inspection method for a chip-on-glass type display module, wherein an energization inspection is performed between the first and second inspection electrodes.

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