JP2009038532A - Piezoelectric oscillator - Google Patents

Abstract

An object of the present invention is to provide a piezoelectric oscillator that does not cause a malfunction due to malfunction of an electronic element constituting an electronic circuit provided on a circuit forming surface of an integrated circuit element, or damage of the electronic circuit.
A piezoelectric vibrator portion including a first container body having a first recess and a piezoelectric vibration element, an integrated circuit element including a first bump on a container body connection electrode pad, and a second In the second recess, a plurality of recesses are provided corresponding to the formation positions of the first bumps, and integrated circuit element connection electrode terminals are provided in the recesses. The integrated circuit element is disposed in the second recess, the first bump is inserted into the recess, and the first bump, the electrode terminal for connecting the integrated circuit element, and And a piezoelectric oscillator in which a piezoelectric vibrator portion is placed on and joined to the integrated circuit element portion, and a protrusion is formed on the main surface portion of the integrated circuit element on the mounting side. Piezoelectric oscillator provided.
[Selection] Figure 2

Description

  The present invention relates to a piezoelectric oscillator.

  Conventionally, a piezoelectric oscillator is used as one of electronic components mounted in an electronic device such as a portable communication device. This piezoelectric oscillator is used as a clock signal generation source or a reference signal generation source for an electronic device mounted thereon.

  FIG. 5 is a sectional view showing an embodiment of a conventional piezoelectric oscillator. The piezoelectric oscillator 500 is generally composed of a container body 501, a piezoelectric vibration element 502, an integrated circuit element 503, and a lid body 504. The container body 501 is a plan view of the same material as the substrate 501a provided on the outer peripheral edge of each main surface of the substrate 501a and a rectangular substrate 501a formed of an insulating material such as ceramic. It is comprised by the cyclic | annular 1st frame 501b and the 2nd frame 501c. The substrate 501a, the first frame body 501b, and the second frame body 501c form a first recess 505 and a second recess 506 on both main surfaces of the substrate 301a, respectively.

  On one main surface of the substrate 501a in the first recess 505, a piezoelectric vibration element 502 in which excitation electrodes and container body connection electrodes are formed on the front and back main surfaces of the piezoelectric element plate is disposed and mounted. The opening of the first recess 505 on which the piezoelectric vibration element 502 is mounted is covered with a metal lid 504, and the lid 504 and the first recess 505 surrounding the first recess 505 are covered. The inside of the first recess 505 is hermetically sealed by joining the first recess 505 opening side top of the frame 501b.

  An integrated circuit element 503 is arranged and mounted on the other main surface of the substrate 501a in the second recess 506. In the integrated circuit element 503, a plurality of container body connection electrode pads 507 are provided on the main surface on the mounting side facing the other main surface of the substrate 501a. Metal bumps 508 are provided. It should be noted that the container body connection electrode pad 507 shown in FIG. 3 is exaggerated in thickness for the sake of clarity. The actual container body connection electrode pad 507 is very thin, and the main surface of the container body connection electrode pad 507 and the mounting-side main surface of the integrated circuit element 503 are substantially in the same plane.

  Further, depressions 509 are respectively provided at predetermined positions corresponding to the positions of the plurality of bumps 508 provided on the integrated circuit element 503 on the other main surface of the substrate 501a in the second recess 506. The diameter of the opening of the recess 509 is larger than the diameter of the bump 508, and the depth of the recess 509 is deeper than the height of the bump 508. An integrated circuit element connection electrode terminal 510 is provided on the bottom surface of the recess 509. In the recess 509 including the integrated circuit element connection electrode terminal 510, a solder paste or a conductive adhesive is provided. A conductive bonding material 511 such as the above is filled.

  In the integrated circuit element 503, the bump 508 provided on the container body connection electrode pad 507 is inserted into the recess 509, and the main surface on the mounting side of the integrated circuit element 503 is in direct contact with the other main surface of the substrate 501a. Thus, the bump 508 and the integrated circuit element connecting electrode terminal 510 are mounted in the second recess 506 by conducting and fixing them via the conductive bonding material 511. Predetermined terminals of the integrated circuit element connection electrode terminals 510 are the piezoelectric vibration element 502 and the second recess 506 of the second frame body 501c by a conductive wiring or via hole formed in or on the surface of the container body 501. It is electrically connected to external connection electrode terminals 512 provided at four corners on the opening side top (see, for example, Patent Document 1).

  The piezoelectric oscillator 500 as described above is used by being electrically and mechanically connected to an external wiring board such as a mother board of an electronic device by an external connection electrode terminal 512.

JP 2001-177055 A (3rd page, FIG. 3)

  In addition, other than the prior art documents specified by the prior art document information described above, no prior art documents related to the present invention have been found by the time of filing of the present application.

  However, in the above-described conventional piezoelectric oscillator 500, the integrated circuit element 503 is mounted in a state where the other main surface of the substrate 501a in the second recess 506 and the mounting-side main surface of the integrated circuit element 503 are in direct contact. ing. Therefore, for example, when the container body 501 is deformed due to scratches generated on the container body 501 or the influence of heat from the outside, the stress generated by the deformation is a contact between the substrate 501a of the container body 501 and the integrated circuit element 503. There is a risk that an electronic circuit such as an oscillation circuit or a temperature compensation circuit provided on the circuit forming surface near the mounting side main surface of the integrated circuit element 503 may be destroyed.

  Further, the actual surface of the substrate 501a has minute and sharp irregularities, and the film thickness that protects the circuit formation surface of the main surface on the mounting side of the integrated circuit element 503 in which the irregularities are in direct contact is 3 μm. There is a risk of damaging the insulating protective film. When this scratch is enlarged due to external vibration or the like and reaches the circuit formation surface protected by the insulating protective film, malfunction of the electronic elements constituting the electronic circuit formed on the circuit formation surface, short circuit or disconnection of the wiring May occur, and the integrated circuit element 503 may not operate normally.

  Therefore, in the present invention, the above-described problems are solved, stress generated by deformation of the container body is hardly transmitted to the integrated circuit element, and the integrated circuit element is not damaged by the irregularities on the surface of the container body. It is an object of the present invention to provide a piezoelectric oscillator that does not cause a malfunction due to malfunction of an electronic element constituting an electronic circuit provided on the circuit forming surface of the electronic circuit and a destruction of the electronic circuit itself.

  The piezoelectric oscillator according to the present invention includes a first container having a first recess composed of a first substrate and a first frame provided on one main surface edge of the first substrate. A piezoelectric vibrator portion comprising a body, a piezoelectric vibration element mounted in the first recess, a lid for hermetically sealing the first recess, and a plurality of portions provided on the mounting-side main surface An integrated circuit element having a first bump on each of the container connection electrode pads, a second substrate, and a second frame provided on one main surface edge of the second substrate. The second concave portion is configured, and one main surface of the second substrate in the second concave portion is provided with a plurality of hollow portions corresponding to the formation positions of the first bumps. The inner bottom surface of the hollow portion is composed of a second container body provided with an electrode terminal for connecting an integrated circuit element. An integrated circuit element portion having a configuration in which the first bump is inserted into the recess and the first bump and the integrated circuit element connection electrode terminal are conductively fixed. A piezoelectric oscillator in which piezoelectric vibrator portions are stacked and bonded to each other, wherein the substrate in the recess is formed on the mounting-side main surface portion of the integrated circuit element where the container body connection electrode pad and the first bump are not provided. The piezoelectric oscillator is characterized in that a convex protrusion is provided toward one main surface of the piezoelectric oscillator.

  Also, the substrate has a first recess composed of a substrate and a first frame provided on the edge of one main surface of the substrate, and is provided on the other main surface edge of the substrate. A container body having a second recess composed of the second frame body and a plurality of container body connection electrode pads provided on the mounting-side main surface, each having a first bump, An integrated circuit element mounted on the other main surface of the substrate in the recess, a piezoelectric vibration element mounted in the first recess and electrically connected to the integrated circuit element, and the first recess The other main surface of the substrate in the second recess is provided with a plurality of recesses corresponding to the formation position of the first bump, and the interior of the recess An electrode terminal for connecting an integrated circuit element is provided on the bottom surface, and the first bump is inserted into the recess so as to be integrated with the first bump. A piezoelectric oscillator in which an element connection electrode terminal is conductively fixed, and a substrate in a second recess is formed on a main surface portion of the integrated circuit element on which a container body connection electrode pad and a first bump are not provided. A piezoelectric oscillator characterized in that a convex protrusion is provided toward the other main surface of the piezoelectric oscillator.

  Further, the piezoelectric oscillator according to paragraph No. 0012 or paragraph No. 0013 is characterized in that the above-described protrusion is formed by a second bump.

  Furthermore, the material of the second bump is one of gold, copper, or an alloy containing at least one of them, and the height of the second bump is 10 to 10. The piezoelectric oscillator described in the previous paragraph is 20 μm.

  According to the piezoelectric oscillator of the present invention, the container body connection electrode of the integrated circuit element is provided between the substrate main surface in the recess in which the integrated circuit element of the container body is mounted and the mounting side main surface of the integrated circuit element. A gap is formed by the protrusion provided on the main surface of the mounting side where the pad and the first bump are not provided. Therefore, the stress generated by the deformation of the container body due to scratches or heat is not directly transmitted from the substrate main surface of the container body to the main surface of the integrated circuit element mounting side, and by the stress, the vicinity of the main surface of the integrated circuit element mounting side It is possible to prevent the electronic circuits such as the oscillation circuit and the temperature compensation circuit provided on the circuit formation surface from being destroyed.

  In addition, the projections and depressions on the main surface of the substrate of the container body do not come into contact with the insulating film that protects the circuit forming surface of the mounting-side main surface of the integrated circuit element, and the insulating film is not damaged. As a result, the integrated circuit element operates normally without causing malfunction of the electronic element formed on the circuit formation surface, short circuit or disconnection of the wiring, etc. caused by this scratch.

  Furthermore, by forming the protrusions with the second bumps, the second bumps as the protrusions can be formed in the same process for forming the first bumps, and the formation of the protrusions is simplified.

  Due to the above-described actions, the present invention is remarkably less likely that the stress generated by the deformation of the container body is transmitted to the integrated circuit element, and the integrated circuit element is not damaged by the irregularities on the surface of the container body. There is an effect that it is possible to provide a piezoelectric oscillator that does not cause a defect.

  Embodiments of a piezoelectric oscillator according to the present invention will be described below with reference to the drawings. In each of the drawings, a part of the structure is not shown, and some dimensions are exaggerated for the sake of clarity. In particular, the thickness dimension of each component is exaggerated.

(First embodiment)
FIG. 1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is an enlarged cross-sectional view in which a portion B in FIG. 2 is enlarged.

  As shown in FIGS. 1 and 2, the piezoelectric oscillator 100 according to the first embodiment of the present invention generally includes a piezoelectric vibrator unit 101 and an integrated circuit element unit 201. The piezoelectric oscillator 100 is formed on the second container body connection electrode terminal 108 formed on the first container body 102 constituting the piezoelectric vibrator portion 101 and the second container body 202 constituting the integrated circuit element portion 201. The piezoelectric container unit 101 is placed on the integrated circuit element unit 201 so that the surfaces of the predetermined electrode terminals are opposed to the first container body connecting electrode terminal 212, Each electrode terminal is configured by mechanically and electrically connecting and fixing with a conductive bonding material (not shown) such as a conductive adhesive or solder.

  The piezoelectric vibrator unit 101 will be described below. As shown in FIG. 1, the piezoelectric vibrator unit 101 is roughly composed of a first container body 102, a piezoelectric vibration element 103, and a lid body 104. The first container body 102 is configured by a first substrate 102a whose outer shape is a flat plate shape having a rectangular shape in plan view, and a first frame body 102b provided on one main surface of the first substrate 102a. ing. The first substrate 102a and the first frame body 102b form a first recess 105 surrounded by one main surface of the substrate 102a and the inner surface of the first frame body 102b. The first substrate 102a and the first frame body 102b constituting the first container body 102 are configured by firing a ceramic material such as glass-ceramic or alumina ceramic.

  A pair of piezoelectric vibration element connection electrode pads 106 are provided in the vicinity of one short side of one main surface of the first substrate 102a in the first recess 105 along the short side. The piezoelectric vibration element 103 is disposed on the piezoelectric vibration element connecting electrode pad 106. An electrode film (not shown) provided on the surface of the piezoelectric vibration element 103 and the piezoelectric vibration element connection electrode pad 106 are connected to each other. The conductive adhesive 107 is conductively fixed. As a result, the piezoelectric vibration element 105 is mounted in the first recess 105. The piezoelectric vibration element connecting electrode pads 106 are electrically connected to predetermined terminals of the second container connecting electrode terminals 108 formed at the four corners of the other main surface of the first substrate 102a. Yes.

  For the piezoelectric vibration element 103 mounted in the first recess 105, for example, quartz is used as a piezoelectric material. The piezoelectric vibrating element 103 is cut out from an artificial crystalline lens at a predetermined cut angle, and the outer shape of the quartz base plate is processed into a flat plate with a rectangular shape in plan view. It is configured by depositing and forming a container body connecting electrode film electrically connected from the electrode film through the lead electrode film. In the case of such a piezoelectric vibration element 103, when a fluctuation voltage from the outside is applied to the crystal element plate via the vibration electrodes on both main surfaces, the crystal element plate vibrates at a frequency of a predetermined vibration mode.

  Further, the first recess 105 in which the piezoelectric vibration element 103 is placed is provided on the top surface of the frame 102 b surrounding the first recess 103 on the opening side of the first recess 105. It is hermetically sealed by a lid body 104 that is arranged and fixed so as to cover the opening. The lid 104 is made of a metal such as 42 alloy, Kovar, or phosphor bronze. As described above, the piezoelectric vibrator unit 101 is constituted by the above-described components.

  The integrated circuit element unit 201 will be described below. As shown in FIG. 1, the integrated circuit element portion 201 is roughly composed of a second container body 202 and an integrated circuit element 203. The second container body 102 is configured by a second substrate 202a whose outer shape is a flat plate shape having a rectangular shape in plan view, and a second frame body 202b provided on one main surface of the second substrate 102a. ing. The second substrate 202a and the second frame body 202b form a second recess 204 surrounded by one main surface of the substrate 202a and the inner surface of the second frame body 102b. The second substrate 202a and the second frame body 202b constituting the first container body 202 are configured by firing a ceramic material such as glass-ceramic or alumina ceramic, and the second substrate. The main surface shape of 202a is the same as that of the first substrate 102a.

  An integrated circuit element 203 is disposed and mounted on one main surface of the second substrate 202 a in the second recess 204. A desired electronic circuit such as an oscillation circuit or a temperature compensation circuit is formed on the circuit formation surface of the integrated circuit element 203. A plurality of container body connection electrode pads 205 electrically connected to the electronic circuit in the integrated circuit element 203 are provided on the main surface on the mounting side facing the one main surface of the substrate 202a in the integrated circuit element 203. In addition, each container body electrode pad 205 is provided with a first bump 206 made of gold. Further, an electrically non-connected metal pad 207a is provided on the inner side of the mounting circuit main surface of the integrated circuit element 203 where the container body connection electrode pad 205 is provided. Further, the metal pad 207a is made of gold as a protruding portion 208 that protrudes from the main surface of the integrated circuit element 203 on the mounting side toward one main surface of the second substrate 202a in the second recess 204. A second bump 208a is provided.

  Here, the height of the second bump 208a is about 10 to 20 μm. By setting the height of the second bump 208a to 10 μm or more, it is possible to reliably prevent the mounting side main surface of the integrated circuit element 203 from coming into contact with the minute and sharp protrusions on the surface of the second substrate 202a. Furthermore, by setting the height of the second bumps 208a to 20 μm or less, the first bumps 206 can be reliably conductively fixed to the integrated circuit element connection electrode terminals 210 in the recesses 209 described later.

  The integrated circuit element 203 has a first corner formed on the top surface on the opening side of the second recess 204 of the frame 202b through a predetermined terminal of the electrode terminals 210 for connecting the integrated circuit element. The container body connection electrode terminal 212 is electrically connected. Furthermore, the integrated circuit element 203 is also electrically connected to external connection electrode terminals 213 formed at the four corners of the other main surface of the substrate 202a through predetermined terminals of the integrated circuit element connection electrode terminals 210. Has been. The external connection electrode terminals 213 are a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal, respectively, and function as terminals for connecting the piezoelectric oscillator 100 to a mounting circuit board such as a motherboard. Yes, when the piezoelectric oscillator 100 is mounted on the mounting circuit board, the piezoelectric oscillator 100 is electrically connected to the circuit wiring of the mounting circuit board via a conductive bonding material such as solder.

  On one main surface of the second substrate 202a in the second recess 204 on which the integrated circuit element 203 is mounted, a predetermined number corresponding to the formation positions of the plurality of first bumps 206 provided on the integrated circuit element 203 is provided. The recesses 209 are respectively provided at the positions. The diameter of the opening of the recess 209 is larger than the diameter of the first bump 206. Further, the depth of the recess 209 is formed deeper than the height of the first bump 206. Further, an integrated circuit element connection electrode terminal 210 is provided on the bottom surface inside the recess 209, and in the recess 209 including the integrated circuit element connection electrode terminal 210, a solder paste or a conductive adhesive is provided. A conductive bonding material 211 such as, for example, is filled. Further, one main surface of the second substrate 202a in the second recess 204 is electrically connected to a predetermined position corresponding to the position where the second bump 208a provided in the integrated circuit element 203 is formed. A non-connected metal pad 207b is provided.

  In the integrated circuit element 203, the first bump 206 provided on the container body connection electrode pad 205 is inserted into the recess 209 while the tip of the second bump 208a is in contact with the metal pad 207b. The bump 206 and the integrated circuit element connection electrode terminal 210 are mounted in the second recess 204 by conducting and fixing them through the conductive bonding material 211. With such a structure, a gap is formed between one main surface of the second substrate 202a and the mounting-side main surface of the integrated circuit element 203 in the second recess 204 by the second bump 208a. Is done. Therefore, the stress generated by the deformation of the piezoelectric oscillator 100 due to scratches or heat is not directly transmitted from one main surface of the second substrate 202a of the second container body 202 to the mounting-side main surface of the integrated circuit element 203. The stress prevents the electronic circuit such as the oscillation circuit and the temperature compensation circuit provided on the circuit forming surface near the mounting-side main surface of the integrated circuit element 203 from being destroyed.

(Second embodiment)
FIG. 4 is a schematic sectional view showing a piezoelectric oscillator according to a second embodiment of the present invention. The piezoelectric oscillator according to the second embodiment of the present invention is different from the first embodiment in the structure of the container body on which the piezoelectric vibration element and the integrated circuit element are mounted.

  The container body 401 of the piezoelectric oscillator 400 according to the second embodiment of the present invention includes a substrate 401a having a rectangular shape in plan view formed of an insulating material such as ceramic, and outer peripheries of both main surfaces of the substrate 401a. It is comprised by the 1st frame 401b and the 2nd frame 401c of the cyclic | annular view cyclic view of the same raw material as the board | substrate 401a provided in the edge part. A first recess 402 is formed by one main surface of the substrate 401a and the first frame body 401b, and a second recess 403 is formed by the other main surface of the substrate 401a and the second frame body 401c.

  The same piezoelectric vibration element 103 as that shown in the first embodiment is disposed and mounted on one main surface of the substrate 401 a in the first recess 402. The opening of the first recess 402 on which the piezoelectric vibration element 103 is mounted is covered with a metal lid 404, and the lid 404 and the first recess 402 surrounding the first recess 402 are covered. The inside of the first recess 402 is hermetically sealed by joining the first recess 402 opening side top of the frame 401b.

  An integrated circuit element 203 having the same structure as that shown in the first embodiment is mounted on the other main surface of the substrate 401 a in the second recess 403. That is, a plurality of container body connections electrically connected to the electronic circuit in the integrated circuit element 203 are also mounted on the main surface on the mounting side facing the other main surface of the substrate 401a of the integrated circuit element 203 in the second embodiment. Electrode pads 205 are provided, and each container body electrode pad 205 is provided with a first bump 206 made of gold. Further, an electrically non-connected metal pad 207a is provided on the inner side of the mounting circuit main surface of the integrated circuit element 203 where the container body connection electrode pad 205 is provided. Further, the metal pad 207a is provided with a second bump 208a made of gold. The second bump 208a is formed on the substrate 401a in the second recess 403 from the main surface of the integrated circuit element 203 on the mounting side. A convex protrusion is formed toward the other main surface. Note that the height of the second bump 208a is about 10 to 20 μm for the same reason as in the first embodiment.

  On the other main surface of the substrate 401a in the second recess 403 on which the integrated circuit element 203 is mounted, a predetermined position corresponding to the formation position of the plurality of first bumps 206 provided on the integrated circuit element 203 is provided. Each of the recesses 405 is provided. The diameter of the opening of the recess 405 is larger than the diameter of the first bump 206. Further, the depth of the recess 405 is formed deeper than the height of the first bump 206. Further, an integrated circuit element connection electrode terminal 406 is provided on the bottom surface inside the recess 405, and in the recess 405 including the integrated circuit element connection electrode terminal 406, a solder paste or a conductive adhesive is provided. A conductive bonding material 407 such as is filled. In addition, the other main surface of the substrate 401a in the second recess 403 is electrically non-connected to a predetermined position corresponding to the position where the second bump 208a provided in the integrated circuit element 203 is formed. A metal pad 408 is provided.

  In the integrated circuit element 203, the first bump 206 provided on the container body connection electrode pad 205 is inserted into the recess 405, while the tip of the second bump 208a is in contact with the metal pad 408. The bump 206 and the integrated circuit element connecting electrode terminal 406 are mounted in the second recess 403 by conducting and fixing them through the conductive bonding material 407.

  The integrated circuit element 203 is electrically connected to the piezoelectric vibration element 103 mounted in the first recess 402 via a predetermined terminal of the integrated circuit element connection electrode terminals 406. Further, the integrated circuit element 203 is provided at four corners on the top of the second recess 401 in the second frame 401c via a predetermined terminal of the integrated circuit element connection electrode terminals 406. The piezoelectric oscillator 400 is configured by the above-described constituent elements that are electrically connected to the external connection electrode terminal 409.

  According to the piezoelectric oscillator 400 according to the second embodiment of the present invention as described above, the other main surface of the substrate 401a in the second recess 403 is formed by the second bump 208a as in the first embodiment. And a gap is formed between the main surface of the integrated circuit element 203 and the mounting side. Therefore, the stress generated by the deformation of the container body 401 due to scratches or heat is not directly transmitted from the other main surface of the substrate 401a of the container body 401 to the mounting side main surface of the integrated circuit element 203, and the integrated circuit is caused by the stress. Electronic circuits such as an oscillation circuit and a temperature compensation circuit provided on the circuit formation surface in the vicinity of the main surface on the mounting side of the element 203 are not destroyed. In addition, the second bump 208a prevents the minute and sharp convex portion on the other main surface of the substrate 401a from coming into contact with the insulating film that protects the circuit forming surface of the mounting-side main surface of the integrated circuit element. Does not damage the membrane. Thus, the integrated circuit element can operate normally without causing malfunction of the electronic element formed on the circuit formation surface, short circuit or disconnection of the wiring, etc. caused by this scratch.

  In addition to the above, various changes and improvements can be made without departing from the scope of the present invention. For example, each of the above embodiments discloses a mode in which bumps are used as means for forming a gap between the main surface exposed in the recess in which the integrated circuit element is mounted and the mounting-side main surface of the integrated circuit element 203. However, the present invention is not limited to the bump as a means for forming the gap, and other protrusions made of metal, resin, ceramic, or the like are provided on the main surface of the integrated circuit element 203 on the mounting side. May be used as means for forming a gap between the main surface exposed in the recess in which the integrated circuit element is mounted and the mounting-side main surface of the integrated circuit element 203.

  In each of the above embodiments, gold is used as the material of the first bump. However, copper, gold, or an alloy containing copper may be used as the material. Furthermore, solder may be used as the material of the first bump, but in that case, it is not necessary to fill the recess with a conductive bonding material, and the depth of the recess is higher than that of the first bump. It is desirable to form it shallower than the dimension. Furthermore, even when gold, copper, or an alloy containing at least one of these is used as the material of the first bump, the conductive bonding material to be filled in advance in the recess is omitted, A solder bump may be provided so as to overlap with one bump, and the solder bump may be used to perform conductive fixation between the integrated circuit element connecting electrode terminal in the recess and the first bump.

  In each of the above embodiments, the case where quartz is used as the piezoelectric material of the piezoelectric vibration element has been described. However, in addition to quartz, piezoelectric materials such as lithium tantalate, lithium niobate, or piezoelectric ceramics can be used.

1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention. Sectional drawing in AA of FIG. The expanded sectional view which expanded the B section of FIG. Sectional drawing which showed the piezoelectric oscillator which concerns on 2nd embodiment of this invention. Sectional drawing which showed the conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100,400 ... Piezoelectric oscillator 101 ... Piezoelectric vibrator part 102 ... 1st container body 102a ... 1st board | substrate 102b, 401b ... 1st frame body 103 ... Piezoelectric vibration Element 104, 404 ... Lid 105, 402 ... First recess 106 ... Electrode pad for connecting piezoelectric vibration element 107 ... Conductive adhesive 108 ... Second container body connecting electrode Terminal 201 ... Integrated circuit element portion 202 ... Second container body 202a ... Second substrate 202b, 401c ... Second frame body 203 ... Integrated circuit element 204, 403 ... 2nd recessed part 205 ... Electrode pad for container body connection 206 ... 1st bump 207a, 207b, 408 ... Metal pad 208 ... Projection part 208a ... 2nd bump 209, 405 ..Indented part 2 0, 406 ... Integrated circuit element connection electrode terminals 211, 407 ... Conductive bonding material 212 ... First container body connection electrode terminals 213, 409 ... External connection electrode terminals 401 ...・ Container body 401a ... Substrate

Claims (4)

A first container body having a first recess composed of a first substrate and a first frame body provided on one main surface edge of the first substrate;
A piezoelectric vibration element mounted in the first recess;
A piezoelectric vibrator portion comprising a lid for hermetically sealing the first recess;
A plurality of container body connection electrode pads provided on the mounting side main surface, each having a first bump, and an integrated circuit element mounted on one main surface of the substrate in the recess;
A second recess composed of a second substrate and a second frame provided on one main surface edge of the second substrate; and the second recess in the second recess. A plurality of depressions corresponding to the formation positions of the first bumps are provided on one main surface of the second substrate, and integrated circuit element connection electrode terminals are provided on the inner bottom surface of the depressions. A second container body,
The integrated circuit element is disposed in the second recess, the first bump is inserted into the recess, and the first bump and the integrated circuit element connection electrode terminal are conductively fixed. An integrated circuit element portion,
A piezoelectric oscillator in which the piezoelectric vibrator unit is placed on and joined to the integrated circuit element unit,
A protruding portion convex toward one main surface of the substrate in the recess on the mounting-side main surface portion of the integrated circuit element where the container body connection electrode pad and the first bump are not provided. A piezoelectric oscillator comprising: A substrate,
A second frame provided on the other main surface edge portion of the substrate, the first frame having a first recess formed on the first frame surface edge portion of the substrate; A container body having a second recess composed of a body;
An integrated circuit element mounted on the other main surface of the substrate in the second recess, each having a first bump on a plurality of container body connection electrode pads provided on the mounting side main surface;
A piezoelectric vibration element mounted in the first recess and electrically connected to the integrated circuit element;
A lid that hermetically seals the first recess,
The other main surface of the substrate in the second recess is provided with a plurality of depressions corresponding to the formation position of the first bump,
An integrated circuit element connection electrode terminal is provided on the inner bottom surface of the recess,
A piezoelectric oscillator in which the first bump is inserted into the recess and the first bump and the integrated circuit element connection electrode terminal are conductively fixed;
Convex shape toward the other main surface of the substrate in the second recess in the mounting-side main surface portion of the integrated circuit element where the container body connection electrode pad and the first bump are not provided A piezoelectric oscillator, characterized by being provided with a protrusion.   The piezoelectric oscillator according to claim 1, wherein the protrusion is formed of a second bump.   The material of the second bump is gold, copper, or an alloy containing at least one of them, and the height of the second bump is 10 to 20 μm. Item 4. The piezoelectric oscillator according to Item 3.

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