JP2008021774A - Chip-type solid electrolytic capacitor and manufacturing method thereof - Google Patents

Abstract

An object of the present invention is to further reduce the ESL of a chip-type solid electrolytic capacitor used in various electronic devices.
A capacitor element in which an anode body is separated into an anode electrode part and a cathode forming part by an insulating part, a solid electrolyte layer and a cathode layer are formed on the cathode forming part, and the cathode electrode part is provided; The anode / cathode terminals 7 and 8 joined to the anode / cathode electrode portion, and the exterior resin 9 covering the capacitor element 1 except for a part of the anode / cathode terminals 7 and 8 are formed. By making the thickness of the portion thinner than the thickness of the anode electrode portion, the thickness of the cathode electrode portion provided in the cathode forming portion can be made substantially the same as the thickness of the anode electrode portion. Even if 1 is mounted, it does not tilt, and it is possible to improve the workability and assembly accuracy with a simple configuration to reduce the cost, and further, ESL can be greatly reduced by eliminating unnecessary current paths.
[Selection] Figure 1

Description

  The present invention relates to a chip-type solid electrolytic capacitor using a conductive polymer as a solid electrolyte among capacitors used in various electronic devices.

  Along with the increase in frequency of electronic equipment, capacitors that are one of the electronic components have been required to have better impedance characteristics in the high frequency range than before. Various solid electrolytic capacitors using a highly conductive polymer as a solid electrolyte have been studied.

  In recent years, a solid electrolytic capacitor used around a CPU of a personal computer has been strongly demanded to have a small size and a large capacity. Further, not only a low ESR (equivalent series resistance) is reduced in response to a higher frequency but also a noise. There is a strong demand for low ESL (equivalent series inductance) excellent in removal and transient response, and various proposals have been made to meet such demand.

  FIG. 8 is a perspective view showing a configuration of a conventional chip-type solid electrolytic capacitor of this type, and FIG. 9 is a partially cutaway perspective view showing a configuration of a capacitor element used in the chip-type solid electrolytic capacitor. 8 and 9, reference numeral 31 denotes a capacitor element. The capacitor element 31 is insulated at a predetermined position of an anode body 32 having a dielectric oxide film layer formed on the surface by roughening an aluminum foil which is a valve action metal. The resist portion 33 is provided and separated into an anode electrode portion 34 and a cathode forming portion 35, and a solid electrolyte layer 36 made of a conductive polymer is formed on the dielectric oxide film layer of the cathode forming portion 35, from carbon and silver paste. A cathode electrode portion 38 is formed by sequentially laminating and forming cathode layers 37 to be formed.

  39 is an anode comb terminal, 39a is a connection portion provided on the connection surface of the anode comb terminal 39, and after placing the anode electrode portion 34 of the capacitor element 31 on the connection surface of the anode comb terminal 39, The connecting portion 39a is bent and both are joined by resistance welding.

  Reference numeral 40 denotes a cathode comb terminal, and 40a denotes a guide portion formed by bending a part of the connection surface of the cathode comb terminal 40, and a conductive silver paste (not shown) is connected to the connection surface of the cathode comb terminal 40. The cathode electrode portion 38 of the capacitor element 31 is placed to join them together.

  41, the capacitor element 31, the anode comb terminal 39, and the cathode comb terminal 40 are integrally covered with the anode comb terminal 39 and the cathode comb terminal 40 to which the capacitor element 31 is bonded as described above being exposed to the outer surface. The anode comb terminal 39 and the cathode comb terminal 40 exposed from the exterior resin 41 are bent from the side surface to the bottom surface along the exterior resin 41 to form external terminals. Thus, a chip-type solid electrolytic capacitor compatible with surface mounting is constructed.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2000-340463 A

  However, in the conventional chip-type solid electrolytic capacitor, the thickness of the cathode electrode portion 38 is larger than the thickness of the anode electrode portion 34 of the capacitor element 31 (the thickness of the anode body 32 made of aluminum foil (= the thickness of the anode electrode portion 34). ) Is 105 μm (as an example), and the thickness of the cathode electrode portion 38 formed by laminating the solid electrolyte layer 36 and the cathode layer 37 (as an example) is 185 μm as the mainstream). When the anode electrode portion 34 and the cathode electrode portion 38 of the capacitor element 31 are placed on the anode comb terminal 39 and the cathode comb terminal 40, respectively, the difference in thickness between the anode electrode portion 34 and the cathode electrode portion 38 (185 μm− (105 μm = 80 μm), there is a problem that the capacitor element 31 is inclined, and there is a configuration in which a plurality of capacitor elements 31 are stacked. In this case, the difference in thickness appears between the anode electrode portions 34 as gaps. Therefore, it is necessary to take measures such as disposing a spacer in order to eliminate the gap. As a result, workability, assembly accuracy, and It was wasteful in terms of cost.

  This is provided with a resist portion 33 at a predetermined position of one anode body 32, and is separated into an anode electrode portion 34 and a cathode forming portion 35 via the resist portion 33, and a solid electrolyte layer 36 is formed on the cathode forming portion 35. And the cathode layer 37 are sequentially laminated to form the cathode electrode portion 38, and cannot be solved as long as such a configuration is adopted.

  Further, as a performance problem, the shapes of the anode comb terminal 39 and the cathode comb terminal 40 joined to the anode electrode portion 34 and the cathode electrode portion 38 of the capacitor element 31 are complicated, and the anode comb terminal 39 and the cathode comb terminal 40 are combined. Since there is a long distance from the connection surface (the anode electrode portion 34 and the cathode electrode portion 38) to the mounting surface of the capacitor element 31, there is a problem that ESL (equivalent series inductance) characteristics are poor. Capacitors used in high-voltage, etc. are strongly desired to be small and large, and not only low ESR (equivalent series resistance) is required in response to higher frequencies, but also low ESL with excellent transient response is required. There was a problem that it could not be adopted in the current situation.

  The present invention solves such conventional problems, improves the assembly accuracy and workability with a simple structure, reduces the cost, and eliminates an unnecessary current path, thereby realizing low ESL. An object of the present invention is to provide a chip-type solid electrolytic capacitor and a manufacturing method thereof.

  In order to solve the above problems, the present invention provides an anode electrode portion and a cathode by providing an insulating portion at a predetermined position of an anode body made of a valve metal foil having a roughened surface and a dielectric oxide film layer formed thereon. A capacitor element in which a cathode electrode portion is formed by sequentially laminating a solid electrolyte layer made of a conductive polymer and a cathode layer made of carbon and silver paste on the cathode forming portion; Insulating exterior that integrally covers the capacitor element and the anode / cathode terminal except the anode terminal and cathode terminal joined to the anode electrode part and the cathode electrode part, and at least the bottom surface serving as the mounting surface of the anode / cathode terminal In a chip-type solid electrolytic capacitor made of a resin, the anode forming portion of the anode body is made thinner than the anode electrode portion.

  Further, as a manufacturing method according to the present invention, an anode body made of a valve metal is roughened, anodized to form a dielectric oxide film layer on the surface, and then an insulating portion is provided at a predetermined position. Separating the electrode part and the cathode forming part and pressing or etching the cathode forming part to make the thickness of the cathode forming part thinner than the thickness of the anode electrode part; Forming a cathode electrode part by sequentially laminating a solid electrolyte layer made of a conductive polymer and a cathode layer made of carbon and silver paste on the dielectric oxide film layer of the part, and an anode electrode part of the capacitor element, The manufacturing method includes a step of bonding an anode terminal and a cathode terminal to the cathode forming portion, and a step of integrally covering the capacitor element and the anode / cathode terminal with an insulating exterior resin.

  As described above, the chip-type solid electrolytic capacitor and the manufacturing method thereof according to the present invention are formed by sequentially laminating the solid electrolyte layer and the cathode layer on the cathode forming portion having a thickness smaller than the anode electrode portion of the anode body. Since the thickness of the cathode electrode portion can be made substantially the same as the thickness of the anode electrode portion, the thickness of the anode electrode portion and the cathode electrode portion of the capacitor element is substantially the same, and thus on the anode / cathode terminal. Even if the capacitor element is placed on the capacitor element, the capacitor element is not inclined, and the operability and assembly accuracy can be improved with a simple configuration, and the cost can be reduced.

  In addition, the anode terminal joined to the anode electrode part and cathode electrode part of the capacitor element and the bottom face of the cathode terminal joined directly to the substrate as the mounting surface eliminates unnecessary current paths and greatly reduces ESL. The effect that it can do is acquired.

(Embodiment 1)
In the following, the first aspect of the present invention will be described with reference to the first embodiment.

  1A to 1C are a plan view, a front sectional view, and a bottom view showing a configuration of a chip-type solid electrolytic capacitor according to Embodiment 1 of the present invention, and FIGS. 2A to 2D are the same chip. 3 is a manufacturing process diagram showing a manufacturing process of a capacitor element used in a solid electrolytic capacitor. In FIGS. 1 and 2, reference numeral 1 indicates a capacitor element, and a method for manufacturing the capacitor element 1 will be described below.

  First, as shown in FIG. 2 (a), an anode body 2 (thickness: 105 μm) in which an aluminum foil which is one of valve action metals is used and the aluminum foil is roughened to form a dielectric oxide film layer on the surface. Prepare.

  Next, as shown in FIG. 2 (b), one end portion of the anode body 2 is used as an anode electrode portion 3, and a portion other than the anode electrode portion 3 is subjected to press processing or etching processing, whereby the anode electrode portion is formed. The cathode forming portion 4 having a thickness t2 (50 μm) thinner than the thickness 3 of t3 (105 μm) is formed.

  Next, as shown in FIG. 2C, an insulating resist portion 5 is provided between the cathode forming portion 4 and the anode electrode portion 3 to separate the anode electrode portion 3 and the cathode forming portion 4.

  Next, as shown in FIG. 2 (d), a solid electrolyte layer 6a made of a conductive polymer and a cathode layer 6b made of carbon and silver paste are sequentially stacked on the surface of the cathode forming portion 4 to form a cathode electrode portion. 6 is formed, and the thickness t3 (130 μm) of the cathode electrode part 6 thus produced is substantially equal to the thickness t1 (105 μm) of the anode electrode part 3. It is comprised so that it may become the same thickness.

  7 is a plate-like anode terminal in which a plurality of capacitor elements 1 (four in the present embodiment) are laminated and the anode electrode portion 3 of the lowermost capacitor element 1 is joined to the upper surface. 7 and the anode electrode part 3 are joined by resistance welding.

  8 is a flat cathode terminal in which a plurality of capacitor elements 1 are laminated and the cathode electrode portion 6 of the lowermost capacitor element 1 is bonded to the upper surface. The bonding between the cathode terminal 8 and the cathode electrode portion 6 is as follows. This is done with conductive silver paste.

  9, the capacitor element 1, the anode terminal 7, and the cathode terminal 8 are integrated with each other in such a state that the mounting surfaces of the anode terminal 7 and the cathode terminal 8 to which the plurality of capacitor elements 1 are joined are exposed on the outer surface. In this embodiment, an epoxy resin is used to form a chip-type solid electrolytic capacitor compatible with surface mounting.

  Since the chip-type solid electrolytic capacitor according to the present embodiment configured as described above can make the thickness of the capacitor element 1 substantially uniform, the capacitor element 1 is placed on the anode terminal 7 and the cathode terminal 8. In this case, the capacitor element 1 does not tilt, and even when a plurality of capacitor elements 1 are stacked, the gap generated between the anode electrode portions 3 can be extremely reduced. Thus, it is not necessary to take a measure such as disposing a spacer, and it is possible to improve the workability and the assembling accuracy with a simple configuration and to achieve a special effect of reducing the cost.

  In addition, since the plate-like anode terminal 7 and the bottom surface of the cathode terminal 8 respectively joined to the anode electrode part 3 and the cathode electrode part 6 of the capacitor element 1 are directly joined to the substrate as a mounting surface, an unnecessary current path is obtained. The ESL can be greatly reduced by eliminating the above-mentioned effect.

  In the present embodiment, the configuration in which four capacitor elements 1 are stacked and integrally joined has been described as an example, but the present invention is not limited to this, and the number of stacked layers can be changed, Alternatively, the capacitor element 1 may be constituted by only one piece without being laminated, and the effect according to the present invention can be similarly obtained regardless of the constitution.

  Further, in the present embodiment, the thickness t1 of the anode electrode portion 3 of the anode body 2 constituting the capacitor element 1 is 105 μm, the processed thickness t2 of the cathode forming portion 4 is 50 μm, and the solid electrolyte layer is formed on the cathode forming portion 4. The cathode electrode portion 6 in which the layer 6a and the cathode layer 6b are laminated has been described using an example in which the thickness t3 is 130 μm. However, the present invention is not limited to this, and the strength of the anode body 2 and the solid electrolyte layer 6a. By examining the thickness of the cathode layer 6b, it can be as close as possible to t1≈t3.

(Embodiment 2)
The second aspect of the present invention will be described below with reference to the second embodiment.

  In the present embodiment, the anode body constituting the capacitor element of the chip-type solid electrolytic capacitor described in the first embodiment is partially different, and the other configurations are the same as those of the first embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  FIGS. 3A to 3C are a plan view, a front sectional view and a bottom view showing the configuration of the chip-type solid electrolytic capacitor according to the second embodiment of the present invention, and FIGS. 4A to 4D are the same chip. FIG. 5 is a manufacturing process diagram showing a manufacturing process of a capacitor element used for a solid electrolytic capacitor. In FIGS. 3 and 4, reference numeral 10 denotes a capacitor element. A method for manufacturing the capacitor element 10 will be described below.

  First, as shown in FIG. 4 (a), an anode body 11 (thickness: 105 μm) having an aluminum foil which is one of valve metals, roughened and formed with a dielectric oxide film layer on the surface thereof. Prepare.

  Next, as shown in FIG. 4B, both end portions of the anode body 11 are used as anode electrode portions 12, and the portions other than the anode electrode portions 12 are subjected to press working or etching processing, whereby the anode electrode portions are formed. The cathode forming portion 13 having a thickness t2 (50 μm) thinner than the thickness t1 (105 μm) of 12 is formed.

  Next, as shown in FIG. 4C, an insulating resist portion 14 is provided between the cathode forming portion 13 and the anode electrode portion 12, thereby separating the anode electrode portion 12 and the cathode forming portion 13.

  Next, as shown in FIG. 4 (d), a solid electrolyte layer 15a made of a conductive polymer and a cathode layer 15b made of carbon and silver paste are sequentially laminated on the surface of the cathode forming portion 13 to form a cathode electrode portion. 15 is formed, and the thickness t3 (130 μm) of the cathode electrode portion 15 thus manufactured is substantially equal to the thickness t1 (105 μm) of the anode electrode portion 12. It is comprised so that it may become the same thickness.

  Reference numeral 16 denotes a plate-like anode in which a plurality of capacitor elements 10 (four in the present embodiment) are stacked and the anode electrode portions 12 provided at both ends of the lowermost capacitor element 10 are joined to the upper surface. The anode terminal 16 and the anode electrode portion 12 are joined by resistance welding.

  Reference numeral 17 denotes a flat cathode terminal in which a plurality of the capacitor elements 10 are stacked and the cathode electrode portion 15 of the lowermost capacitor element 10 is bonded to the upper surface. The bonding between the cathode terminal 17 and the cathode electrode portion 15 is as follows. This is done with conductive silver paste.

  The capacitor element 10, the anode terminal 16, and the cathode terminal 17 are integrated with each other in such a state that the bottom surfaces serving as the mounting surfaces of the anode terminal 16 and the cathode terminal 17 to which the plurality of capacitor elements 10 are bonded are exposed on the outer surface. In this embodiment, an epoxy resin is used to form a chip-type solid electrolytic capacitor compatible with surface mounting.

  The chip-type solid electrolytic capacitor according to the present embodiment configured as described above can make the thickness of the capacitor element 10 substantially uniform, similarly to the effect obtained by the chip-type solid electrolytic capacitor according to the first embodiment. Therefore, in addition to the effect that the workability and assembly accuracy can be improved with a simple configuration to reduce costs, and a significant reduction in ESL can be realized, the anode terminals 16 are arranged at both ends, Since the distance between the anode terminal 16 and the cathode terminal 17 can be shortened by the three-terminal structure in which the cathode terminal 17 is disposed between the anode terminals 16, the ESL can be further reduced. Is.

  In the present embodiment, the configuration in which four capacitor elements 10 are stacked and integrally joined has been described as an example, but the present invention is not limited to this, and the number of stacked layers can be changed, Alternatively, the capacitor element 10 may be composed of only one piece without being laminated, and the effect of the present invention can be obtained similarly regardless of the constitution.

(Embodiment 3)
In the following, the third aspect of the present invention will be described with reference to the third and sixth aspects of the present invention.

  In the present embodiment, the anode body constituting the capacitor element of the chip-type solid electrolytic capacitor described in the first embodiment is partially different, and the other configurations are the same as those of the first embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  5A to 5D are a plan view, a front view, a bottom view, and a side view showing the configuration of the chip-type solid electrolytic capacitor according to Embodiment 3 of the present invention, and FIGS. Manufacturing process diagram showing the manufacturing process of the chip-type solid electrolytic capacitor, FIGS. 7A to 7F are manufacturing process diagrams showing the manufacturing process of the capacitor element used in the chip-type solid electrolytic capacitor, 5-7, 19 shows a capacitor | condenser element and the manufacturing method of this capacitor | condenser element 19 is demonstrated below.

  First, as shown in FIG. 7A, an anode body 20 (thickness: 105 μm) in which an aluminum foil which is one of valve action metals is used, and the aluminum foil is roughened to form a dielectric oxide film layer on the surface. Prepare. As shown in FIG. 7 (e), which is a plan view of FIG. 7 (a), this anode body 20 has an anode electrode portion (substantially the same shape and area) at one end which is a diagonal position of the opposing sides. The details will be described later) 21 are provided so as to protrude asymmetrically.

  Next, as shown in FIG. 7 (b), a portion provided asymmetrically projecting at one end portion of the opposite side of the anode body 20 is defined as an anode electrode portion 21, and this anode electrode portion 21. The cathode forming part 22 having a thickness t2 (50 μm) thinner than the thickness t1 (105 μm) of the anode electrode part 21 is formed by pressing or etching the other part.

  Next, as shown in FIG. 7C, an insulating resist portion 23 is provided between the cathode forming portion 22 and the anode electrode portion 21 to separate the anode electrode portion 21 and the cathode forming portion 22.

  Next, as shown in FIG. 7D, a solid electrolyte layer 24a made of a conductive polymer and a cathode layer 24b made of carbon and silver paste are sequentially stacked on the surface of the cathode forming portion 22 to form a cathode electrode portion. In this way, the capacitor element 19 is produced by forming the electrode 24, and the thickness t3 (130 μm) of the cathode electrode part 24 thus produced is substantially equal to the thickness t1 (105 μm) of the anode electrode part 21. It is comprised so that it may become the same thickness. FIG. 7F is a plan view showing the capacitor element 19 manufactured as described above.

  Reference numeral 25 denotes a plate-like anode terminal in which the anode electrode portion 21 of the capacitor element 19 is joined to the upper surface, and 26 denotes a plate-like cathode terminal in which the cathode electrode portion 24 of the capacitor element 19 is joined to the upper surface. The cathode terminals 26 are formed so as to become independent by punching one base material 27. The anode terminal 25 and the anode electrode part 21 are joined by resistance welding (welding mark 25a), and the cathode terminal 26 and the cathode electrode part 24 are joined by a conductive silver paste (not shown).

  Further, a plurality of the capacitor elements 19 are laminated and joined. In this laminated state, the anode elements 21 of the overlapping capacitor elements 19 are not overlapped at the same position. 19 are alternately laminated, and this will be described in more detail. As shown in FIG. 6B, the first capacitor element 19 is placed on the anode terminal 25 and the cathode terminal 26. After that, as shown in FIG. 6C, the second capacitor element 19 is placed 90 degrees out of position so that the anode electrode portions 21 of the overlapping capacitor elements 19 do not overlap at the same position. It is what you are doing.

  Reference numeral 28 denotes a plurality of capacitor elements 19, anode terminals 25, and cathodes in a state in which at least a part of the bottom surface that becomes the mounting surface of the anode terminal 25 and the cathode terminal 26 to which the capacitor element 19 is bonded is exposed to the outer surface. Insulating exterior resin that covers terminal 26 integrally (in FIG. 5 (a), in order to make the internal structure easier to understand, the exterior resin 28 is removed), the surface This is a chip-type solid electrolytic capacitor that can be mounted.

  In the chip-type solid electrolytic capacitor according to the present embodiment configured as described above, the thickness of the capacitor element 19 can be made substantially uniform, similarly to the effect obtained by the chip-type solid electrolytic capacitor according to the first embodiment. Therefore, in addition to the effect of improving workability and assembly accuracy with a simple configuration and reducing costs, and achieving a significant reduction in ESL, each side of the bottom surface that becomes the mounting surface is provided. A multi-terminal structure in which the anode terminal 25 and the cathode terminal 26 are arranged close to each other can be realized, and furthermore, the current flowing between the anode terminal 25 and the cathode terminal 26 cancels each other to further reduce the ESL. It has a special effect of being able to do it.

  The chip-type solid electrolytic capacitor according to the present invention has an effect that it is possible to improve workability and assembly accuracy with a simple configuration to reduce costs, and to realize a significant reduction in ESL. This is useful as a field where responsiveness is required.

(A) The top view which showed the structure of the chip-type solid electrolytic capacitor by Embodiment 1 of this invention, (b) The front sectional drawing, (c) The bottom view (A)-(d) Manufacturing process figure which showed the manufacturing process of the capacitor | condenser element used for the same chip type solid electrolytic capacitor (A) The top view which showed the structure of the chip-type solid electrolytic capacitor by Embodiment 2 of this invention, (b) The front sectional drawing, (c) The bottom view (A)-(d) Manufacturing process figure which showed the manufacturing process of the capacitor | condenser element used for the same chip type solid electrolytic capacitor (A) The top view which showed the structure of the chip-type solid electrolytic capacitor by Embodiment 3 of this invention, (b) The front view, (c) The bottom view, (d) The side view (A)-(e) Manufacturing process diagram showing the manufacturing process of the chip-type solid electrolytic capacitor (A)-(f) Manufacturing process figure which showed the manufacturing process of the capacitor | condenser element used for the same chip type solid electrolytic capacitor The perspective view which showed the composition of the conventional chip type solid electrolytic capacitor Partially cutaway perspective view showing the configuration of a capacitor element used in the chip-type solid electrolytic capacitor

Explanation of symbols

1, 10, 19 Capacitor element 2, 11, 20 Anode body 3, 12, 21 Anode electrode part 4, 13, 22 Cathode formation part 5, 14, 23 Resist part 6, 15, 24 Cathode electrode part 6a, 15a, 24a Solid electrolyte layer 6b, 15b, 24b Cathode layer 7, 16, 25 Anode terminal 8, 17, 26 Cathode terminal 9, 18, 28 Exterior resin 27 Base material

Claims (7)

An insulating part is provided at a predetermined position of an anode body made of a valve-acting metal foil having a roughened surface and a dielectric oxide film layer formed thereon, and separated into an anode electrode part and a cathode forming part. Capacitor element having a cathode electrode portion formed by sequentially laminating a solid electrolyte layer made of a conductive polymer, a cathode layer made of carbon and silver paste, and joined to the anode electrode portion and the cathode electrode portion of this capacitor element A chip-type solid electrolytic capacitor comprising an anode terminal and a cathode terminal, and an insulating exterior resin integrally covering the capacitor element and the anode / cathode terminal except for at least a bottom surface serving as a mounting surface of the anode / cathode terminal. A chip-type solid electrolytic capacitor in which the thickness of the cathode forming portion of the anode body is made thinner than the thickness of the anode electrode portion. The chip-type solid electrolytic capacitor according to claim 1, wherein a pair of anode electrode portions are provided on at least opposing sides of the anode body. 3. The chip-type solid electrolytic capacitor according to claim 2, wherein the pair of anode electrode portions provided on at least opposite sides of the anode body are provided with protrusions having substantially the same shape and the same area. The thickness of the cathode electrode part formed by laminating | stacking sequentially a solid electrolyte layer and a cathode layer in the cathode formation part of an anode body was made into the thickness substantially the same as the thickness of an anode electrode part. The chip type solid electrolytic capacitor as described in any one of the above. The chip-type solid electrolytic capacitor according to claim 1, wherein a plurality of capacitor elements are laminated and joined. 4. The chip-type solid electrolytic capacitor according to claim 3, wherein a plurality of capacitor elements are laminated and joined so that anode electrodes having substantially the same shape and the same area do not overlap at the same position. After roughening the anode body made of a valve metal and anodizing this to form a dielectric oxide film layer on the surface, an insulating portion is provided at a predetermined position to separate the anode electrode portion and the cathode formation portion, The cathode forming portion is pressed or etched to make the thickness of the cathode forming portion thinner than the thickness of the anode electrode portion, and the conductive material is formed on the dielectric oxide film layer of the cathode forming portion of the anode body. A step of forming a cathode electrode part by sequentially laminating a solid electrolyte layer made of a conductive polymer, a cathode layer made of carbon and silver paste, and an anode terminal and a cathode terminal on the anode electrode part and the cathode forming part of the capacitor element A method of manufacturing a chip-type solid electrolytic capacitor, comprising a step of bonding, and a step of integrally covering a capacitor element and an anode / cathode terminal with an insulating exterior resin.

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