JP2008004604A - Wireless ic tag and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wireless IC tag which has a long communication range and is inexpensive. <P>SOLUTION: Patterns are formed on two substrates so that the ends of both patterns may coincide with each other respectively when one substrate is vertically overlapped over the other one. Through-holes are formed at positions hitting the two ends of one pattern, on the upper side of one substrate wherein the pattern is formed, and they are covered with an insulation film having a thickness larger than an IC chip, and they are fixed. Solder, a thermoplastic conductive resin or a thermosetting conductive adhesive resin is applied to the pattern hitting the two ends of the pattern. After covering fixing step, the IC chip is provided to one of the two through-holes covered with the insulation film, and the other substrate is overlapped on the insulation film as it is. While keeping its state, the entire body is pressed and heated to make a united film, and both patterns are electrically connected with the respective IC chips at one end thereof and they are electrically connected with each other at the other end thereof. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wireless IC tag and a manufacturing method thereof, and more particularly to a wireless IC tag in which an antenna is formed by dividing an insulating film into upper and lower portions and a manufacturing method thereof.

In recent years, the amount of information that can be recorded is much larger than that of barcodes and identification tags, and it is possible to freely write new information. Therefore, a wireless IC tag (wireless IC card) equipped with an antenna and an IC can be used. Hereinafter, in principle, “IC tag” is widely used.
In particular, planar IC tags are widely used because they are convenient to carry in a wallet or the like or to be attached to an article.

From the standpoint of mass production, flat type IC tags are usually formed by forming a very thin copper or aluminum thin film foil on the surface of an insulating resin film and removing unnecessary parts by etching or plating. Coil antenna pattern (coiled antenna pattern; hereinafter referred to as “coil pattern” or wiring jumper pattern that appears later, when there is no risk of misunderstanding or need not be distinguished In some cases, a planar coil antenna (hereinafter, also referred to as “antenna” in principle) is formed.
In addition, an invention has been made in which a pattern is formed by printing using a conductive resin (conductive paste) (Patent Document 1).

  In the IC tag itself, the IC chip is mounted on the resin film in a state where it is electrically connected to both ends of the antenna formed as a coil pattern on the surface of the resin, and then the antenna and the IC chip are mounted on the upper surface of the resin film. It is manufactured by covering with a resin film that compensates for the thickness, and finally attaching a thick cosmetic film that also serves as a protective film up and down by heat fusion (Patent Documents 2 and 3).

Japanese Patent Laid-Open No. 62-198196 JP 2005-94319 A JP 2005-346684 A

  However, it is necessary to form a pattern by forming a thin film (foil) of copper or aluminum on the surface of an insulating resin and then etching or depositing a copper thin film by plating. In addition, the accompanying work such as pretreatment and waste disposal becomes troublesome, the manufacturing equipment becomes complicated and large, and the usable base material is limited, which hinders cost reduction.

  Moreover, in the method of forming a coil pattern by printing using conductive resin or nano metal particles, the coil pattern made of conductive resin, nano metal particles, or an extremely thin metal film is formed by vapor deposition or plating. Compared with a metal thin film antenna, the conductivity is inferior, and if it is left as it is, the power consumed by the resistance increases and the communication distance becomes short. For this reason, it is necessary to increase the line width of the coil pattern, and thus it is necessary to increase the opening area of the coil antenna, which may hinder downsizing and cost reduction of the wireless IC tag.

Whatever method is used to form the coil pattern, in order to electrically connect both ends of the formed coil pattern to the IC chip, the IC chip is attached to one end of the already formed coil pattern. It is necessary to connect and connect the other end and the IC chip while ensuring insulation from the coil pattern. Therefore, after forming the coil pattern, additional steps such as forming an insulating layer and an overbridge wiring at a necessary location, or forming a through-hole electrode to form a back surface wiring are necessary.
Further, when forming the back surface wiring, it is necessary to accurately align the coil patterns on the front surface and the back surface, and the work becomes complicated.

  In this way, the state in which the coil pattern is formed on the base material and the IC chip is connected is usually called an inlet. However, the IC chip and the coil pattern may be peeled off from the base material due to impact or bending as it is. In order to compensate for the difference in thickness between the coil pattern and the IC chip, it is necessary to reinforce the resin film on which the IC chip is formed on the resin film on which these are formed and attached. Additional steps such as coating were also required.

  In addition, there are IC chip types in which terminals for electrical connection at two locations to the antenna are formed at the upper part and the lower part, and IC chip types that are formed only at the upper part, for example. It has also been desired to develop a manufacturing method that can be easily applied to any type of IC chip.

For these reasons, it has been desired to develop an IC tag that allows easy formation of a coil pattern and simple manufacturing equipment.
Further, there has been a demand for the development of an IC tag that does not require an additional process for connecting both ends of the coil pattern and the IC tag, or compensating for the difference in thickness between the coil pattern and the IC tag.
In addition, even if the coil pattern is formed of a material having low conductivity, development of an IC tag having good performance has been desired.

  The present invention has been made for the purpose of solving the above problems. The invention of each claim will be described below.

The invention described in claim 1
A method of manufacturing a wireless IC tag in which a pattern is formed on an upper surface side and a lower surface side of an insulating film,
A pattern forming step of forming a pattern on two substrates so that both ends of both patterns coincide when the other substrate is superimposed on one substrate;
A cover for covering and fixing an insulating film having a thickness equal to or greater than that of the IC chip on the upper side of one substrate on which the pattern is formed, each having a through hole formed at a position corresponding to two ends of the pattern A fixed step;
An application step of applying either solder, thermoplastic conductive adhesive resin or thermosetting conductive adhesive resin on the pattern at a position corresponding to two ends of the pattern;
An installation step of installing an IC chip in one of the two through holes of the insulating film after the covering fixing step;
A stacking step of stacking the other substrate on the insulating film in the state in which the installation step has been performed;
In the state in which the overlapping step has been performed, the whole is pressed and heated to bond the one base material, the insulating film, and the other base material into an integrated film, and
After the overlapping step is performed, a connection step in which both patterns are electrically connected to the IC chip at one end thereof and electrically connected to each other at the other end, and
It is a manufacturing method of the wireless IC tag characterized by having.

  In the present invention, when one substrate (for example, the substrate on the lower surface side) and the other substrate (for example, the substrate on the upper surface side) are stacked one above the other, they are formed on both substrates. Form the pattern so that both ends of the pattern match, overlap the two substrates with an insulating film in between, and then both sides of both patterns through the IC chip and the other directly Are connected to form a pattern for the wireless IC tag. For this reason, it is easy to form a pattern such as a wiring jumper on the back surface. As a result, it also leads to cost reduction when forming a pattern on the base material that will be on the front and back of the insulating film.

In addition, the IC chip can be arranged and connected simply by dropping the IC chip into an insulating film that is thicker than the IC chip and has a through-hole formed at a predetermined position. Can connect.
Further, it is not necessary to compensate for the height of the IC chip and the pattern.
Further, in order to electrically connect the upper and lower patterns in the through hole, for example, a conductive substance (for example, solder grains) is dropped into the through hole of the insulating film and the whole is pressed and heated. This eliminates the need for an additional process such as conventional overbridge wiring and facilitates the work.

In addition, “upper surface side, lower surface side” or “right, left, front side, back side” in other claims are described as such for convenience in order to explain the structure and manufacturing method of the IC tag in a document. When the actual IC tag is used, it becomes the upper surface side (empty side) or the lower surface side (ground side), the right side or the left side, the front surface (usually with a beautiful design) or the back surface ( It is irrelevant to becoming ordinary).
The “base material” may be made of any material as long as it can be used for pattern formation, folding, and pattern electrical connection. However, the paper is particularly glassine paper (paraffin paper) because of cost, disposal, etc. Etc.) is preferred.

  Furthermore, the pattern formation method is not limited, but it is preferable to employ printing, particularly screen printing using a conductive resin. Furthermore, depending on the application of the IC chip, the conductive pattern such as solder is further applied on the printed pattern. It is still more preferable to cover the metal layer to further reduce the electrical resistance. In this case, it is preferable to select a low-temperature (200 ° C. or lower) curable conductive resin as well as soldering as a conductive resin.

  In addition, “when one substrate overlaps the other substrate, the two ends of both patterns coincide with each other” means that the pattern of one substrate and the pattern of the other substrate are For example, if both patterns are formed on the left and right (including the top and bottom for the above reasons) of a single larger substrate, the reference line for folding and overlapping, in this case the center of the left and right It indicates that the line is symmetrical with respect to the line. If the upper and lower patterns are separately formed on two bases with a rectangular or circular planar shape, the periphery of the two upper and lower bases and their surroundings are aligned to produce an IC tag. However, when the layers are stacked in this way, the end portions of the patterns formed on the upper and lower substrates are overlapped in the vertical direction (in the front and back directions).

  Further, the “insulating film having a thickness equal to or greater than that of the IC chip” may be a film having a plurality of layers, in which an adhesive layer is formed on the upper and lower sides, regardless of the material as long as it can be bonded to the base material. . Since the thickness can be somewhat reduced if it is bonded to the substrate by heating and pressing, it is preferably thicker than the IC chip.

  Further, “covering and fixing an insulating film” means that an IC chip and a conductive material, such as solder particles, can be stably installed, and an adhesive step can be easily performed. It means that the circumference or four corners are heat-sealed. In order to make it easier for the internal gas to escape in the subsequent bonding step, it is preferable to leave a hole through which the internal gas escapes, although it does not adhere completely on the 4 laps, depending on the bonding method. I will.

In addition, the “connection step” is used in order to obtain a good electrical connection, in order to prevent the solder from being oxidized and hindering the electrical connection when heated and melted when using solder as the conductive material. It is desirable to perform heating in an inert gas atmosphere, a reducing gas atmosphere or a vacuum atmosphere. However, when the flux is previously contained or separately applied, the heating may be performed in a normal atmosphere. In addition, it is desirable that the flux used at that time is of a type that does not require cleaning later.
In addition, if pressure heating using local friction by ultrasonic pressure is used, the solder oxide film at the time of heating and melting can be forcibly removed by ultrasonic waves. Therefore, even in normal air, electric flux can be used without using flux. Connection is possible.

  Also, depending on the type of conductive material that forms the pattern, the conductive substance is any one (including a plurality) of solder, thermoplastic conductive adhesive resin, and thermosetting conductive adhesive resin for electrical connection. The conductive material which forms the pattern in the location may be brought into contact with each other by pressing the location to be connected with a soldering iron or the like, and may be heat-sealed. In this case, the pattern forming step also serves as the coating step.

Furthermore, as long as the heat fusion temperature is the same, it may be performed simultaneously with the “bonding step”.
In addition, the electrical connection between the end portions of the two antenna patterns on the upper and lower sides through the through hole may be thermally fused by installing a conductive substance in the through hole. The end of the pattern on the upper side may be pushed into the through-hole without using a sexual substance and heat-sealed with the end of the pattern on the lower side.

In addition, the “connection step” is preferably heated while giving a stroke, but may be simply brought into contact as long as the heating from the heating device is good.
Further, if ultrasonic pressure is used, local heating by ultrasonic waves can be obtained without using a heating device, and therefore, simple pressurization may be used.
In addition to the above, depending on the case, in order to cover the through-holes that have been electrically connected and to improve the appearance, a cosmetic film is stretched on the top and bottom, and a capacitor pattern is formed at the same time. As a result, the wireless IC tag as a product is completed.

The invention according to claim 2 is a method of manufacturing the wireless IC tag,
The pattern forming step includes
The antenna pattern is formed on both of the base materials so that the direction of the magnetic field coincides when both sides of the base material are stacked up or down, or
An antenna pattern is formed on one substrate, and a wiring jumper pattern is formed on the other substrate.
A method of manufacturing a wireless IC tag, which is any of the above.

In the invention of this claim, if the antenna pattern is formed on both of the base materials, the length of the antenna can be doubled, the electromotive force by the antenna is increased, and the communication distance is increased. However, it is possible to make it longer.
Therefore, an antenna with sufficient electromotive force can be formed without using an expensive high-conductivity material or a conductive resin, without having to widen the line width of the pattern.

If the antenna pattern is formed on one substrate and the wiring jumper pattern is formed on the other substrate, not only the wiring pattern on the back surface can be easily formed, but only the wiring jumper is provided on one surface. Therefore, the free space can be used for other purposes.
Further, when the communicable distance may be short, it is not necessary to form many complex antenna patterns, leading to cost reduction.

Invention of Claim 3 is a manufacturing method of the said wireless IC tag, Comprising:
The pattern forming step is to form a pattern of each base material on both the left and right sides of the one large base material in a state where the one base material and the other base material are a single large base material. A method for manufacturing a wireless IC tag is provided.

In the invention of this claim, in the state where the IC chip is completed, the patterns of the two base materials that will be above and below the insulating film in between are both at the same time, and both the base materials are integrated. Therefore, since it is formed on an integral large base material, it can be formed with high accuracy without causing a deviation. Thereafter, the integral large base material is bent at the center line, or once separated and aligned and overlapped.
Here, “the left and right sides of an integral large substrate” includes both the upper and lower sides of the integral large substrate as described above.

Invention of Claim 4 is a manufacturing method of the said wireless IC tag, Comprising:
In the pattern forming step, the one base material and the other base material are bent on the left and right sides of a large base material in a state where the one base material and the other base material are integrated into a large base material, The pattern is formed so that both ends of both patterns coincide when the side is overlapped with the other side,
In the method of manufacturing a wireless IC tag, the superimposing step is to superimpose the other base material on the insulating film in the state in which the installation step has been performed by folding the predetermined straight line. .

In the invention of this claim, the left and right sides of the large base material in a state where one base material and the other base material are integrated into a large base material are bent with a predetermined straight line as an axis. Is manufactured by folding an insulating film on the other side. Accordingly, it is possible to match both the upper and lower patterns simultaneously formed on a single base material without any deviation by a simple operation of folding.
The “predetermined straight line” refers to a line that folds the left and right (including top and bottom) of a single large base material in a state where a pattern is formed. In principle, it is a center line, but there is an insulating film between them. If this is taken into consideration, it is not always strictly at the center of the substrate.

  In addition, if a concave portion (groove) is formed at a predetermined straight line position of a single large base material, for example, the center of the left and right, for example, by embossing, a precise folding at the center line is performed. And cutting becomes easy. At this time, the processing may be performed on the surface of an integral large base material, or may be performed on the back surface.

Invention of Claim 5 is a manufacturing method of the said wireless IC tag, Comprising:
In the pattern forming step, the one base material and the other base material are bent on the left and right sides of a large base material in a state where the one base material and the other base material are integrated into a large base material, The pattern is formed so that both ends of both patterns coincide when the side is overlapped with the other side,
The superimposing step is a method of separating the other base material from the predetermined straight line, turning it over, aligning and superimposing on the insulating film in a state where the installation step has been performed. It is a manufacturing method of an IC tag.

In the invention of this claim, the left side and the right side of the single large substrate on which the coil pattern is formed are not folded, but are separated from each other, and the back side film having the pattern formed on the upper surface is separated. Half of the substrate is covered with an insulating film, fixed, and an IC chip with a conductive material attached to the through hole of the insulating film is placed. It is pasted after the material is turned over. Thereby, it becomes possible to match | combine the pattern of both the upper and lower sides formed at the same time on the single large base material, hardly producing a shift | offset | difference.
Further, since there is no “bending”, there is no limitation on the thickness of the base material, and a base material that is very difficult to be bent can be used.
In addition, the time before and after the cutting in the “overlap step” and the “cover fixing step” or the “installation step” is not limited.

The invention described in claim 6
A method of manufacturing a wireless IC tag in which a first pattern and a second pattern are formed on one of an upper surface side and a lower surface side of an insulating film, and a third pattern is formed on the other.
Each on the left and right sides of the substrate,
The first pattern and the second pattern are formed on either side (left side or right side) so that the IC chip can be electrically connected between both ends,
The third pattern is formed on the other side (the right side or the left side), and the first pattern and the second pattern formed on the base material on the one side when both ends are overlapped on the one side. Formed to match each end of the pattern that is not electrically connected to the IC chip,
One of the first pattern and the third pattern is an antenna pattern, the other is an antenna or wiring jumper pattern, and the second pattern is a wiring jumper pattern,
Furthermore, if the first pattern and the third pattern formed on the left side and the right side of the substrate are both antenna patterns, a pattern forming step is performed so that the direction of the magnetic field is the same.
On one side of the base material, a position where the IC chip is electrically connected and a position where the IC chip of the first pattern and the second pattern are not electrically connected to each other A covering fixing step of covering and fixing an insulating film having a total of three through-holes and having a thickness equal to or greater than that of the IC chip;
An application step of applying either solder, thermoplastic conductive adhesive resin or thermosetting conductive adhesive resin on the pattern at a position corresponding to the two ends of each pattern;
An installation step of installing an IC chip in a through-hole corresponding to a location where the first and second patterns of the insulating film after the covering and fixing step are electrically connected to the IC chip;
A step of superimposing the other side (right side or left side) of the base material on the insulating film in the state in which the installation step has been performed;
In the state in which the overlapping step has been performed, the whole is pressed and heated, and an adhesion step to form a film having a structure in which one side of the substrate, the insulating film, and the other side of the substrate are integrated,
After the overlapping step is performed, the ends of the first pattern and the second pattern, the IC chip, and the ends of the pattern positioned above and below through the two through holes are electrically connected to each other. A wireless IC tag manufacturing method comprising a connection step of connecting.

  According to the present invention, the antenna pattern and the wiring jumper pattern (first and second patterns) are provided on either the upper surface side or the lower surface side of the insulating film, and the antenna or wiring jumper pattern (third pattern) is provided on the other side. Of the wireless IC tag in which the pattern is formed) because the IC chip is electrically connected to either the upper surface side or the lower surface side. Thinner IC tags can be manufactured.

The invention according to claim 7 is a method of manufacturing the wireless IC tag,
The pattern forming step is such that when the one side is folded on the left side and the right side of the base material about a predetermined straight line and one side is overlapped with the other side, both ends of both patterns coincide. To form a pattern,
The method of manufacturing a wireless IC tag, wherein the superposing step comprises superposing the other side of the base material on the insulating film in the state in which the installation step has been performed by folding the predetermined straight line. It is.

  The invention of this claim is the wireless IC tag according to claim 4, wherein an antenna pattern and a wiring jumper pattern are formed on one of the upper surface side and the lower surface side of the insulating film, and an antenna pattern is formed on the other side. It is an invention of a manufacturing method corresponding to the invention.

The invention according to claim 8 is a method of manufacturing the wireless IC tag,
The pattern forming step is such that when the one side is folded on the left side and the right side of the base material about a predetermined straight line and one side is overlapped with the other side, both ends of both patterns coincide. To form a pattern,
The stacking step is characterized in that the other side of the base material is cut off from the predetermined straight line, turned over, and aligned and stacked on the insulating film in the state in which the installation step has been performed. A method of manufacturing a wireless IC tag.

  The invention of claim 5 is a wireless IC tag according to claim 5, wherein an antenna pattern and a wiring jumper pattern are formed on one of the upper surface side and the lower surface side of the insulating film, and an antenna pattern is formed on the other side. It is an invention of a manufacturing method corresponding to the invention.

The invention according to claim 9 is a method of manufacturing the wireless IC tag,
The wireless IC tag manufacturing method is characterized in that the substrate is made of paper.

In the invention of this claim, a paper base is used, but paper is more easily soaked with a material applied at the time of pattern formation than a chemical resin film (a paste-like conductive resin at the time of application) For this reason, the adhesiveness is also improved, and the flow and bleeding of the pattern forming material hardly occur. For this reason, there is no need to bother roughing the printed surface. Furthermore, cutting and bending are easy, and material costs are low. For these reasons, the manufacturing of the product is facilitated and the cost is reduced.
Also, disposal does not cause a problem.
Furthermore, if paper is used, and a slightly thicker paper having waterproof properties is used as a base material, it is easy to use the base material as it is as a decorative plate or protective plate on the outer surface of the IC chip.

In addition, as a means for forming a pattern on a paper substrate, printing, particularly screen printing, can be mentioned, but printing such as gravure, offset, and ink jet is not excluded.
Examples of the paper include heat-resistant paper such as glassine paper (paraffin paper), particularly heat-resistant paper obtained by applying silicon processing to the surface called baking paper.
In addition, if the paper has water resistance such as phenol paper, the resin pattern layer formed by printing may be coated with a metal layer by plating.
Examples of the ink used for printing include a thermoplastic conductive adhesive resin that cures at a temperature of about 200 ° C. or a thermosetting conductive adhesive resin.
Further, if the pattern of the antenna or the like is formed by printing using a conductive paint, the operation is simplified, and no large-scale equipment is required as compared with other forming methods.

The invention according to claim 10 is:
A wireless IC tag manufactured by the method according to any one of claims 1 to 9.

  The invention of the present claim captures any of the methods described in claims 1 to 9 as a product invention.

The invention according to claim 11
A wireless IC tag having a front side film, an insulating film, a back side film, an antenna pattern located on the front side and the back side of the insulating film, and an IC chip installed in a through hole of the insulating film,
The film on the front side and the film on the back side are bonded together with the insulating film in between,
The antenna pattern located on the front side of the insulating film and the antenna pattern located on the back side have the same magnetic field direction,
Furthermore, both ends are electrically connected to the IC chip,
The other end is electrically connected to each other in a through hole formed in the insulating film.

The invention of the present claim is the invention of the manufacturing method, and the invention in which the antennas are formed on the upper and lower sides is taken as the invention of the manufactured product.

The invention according to claim 12
The front side film, the insulation film, the back side film, the antenna pattern located on the front side of the insulation film, the wiring jumper pattern located on the back side, and the IC chip installed in the through hole of the insulation film A wireless IC tag comprising:
The film on the front side and the film on the back side are bonded together with the insulating film in between,
One end of each of the antenna pattern located on the front side of the insulating film and the wiring jumper pattern located on the back side is electrically connected to the IC chip,
The other end is electrically connected to each other in a through hole formed in the insulating film.

  The invention of this claim is the invention of the manufacturing method, and the invention having the antenna on one side and the wiring jumper on the other is regarded as the invention of the manufactured product.

The invention according to claim 13
Installed in the through hole of the front side film, the insulating film, the back side film, the first pattern and the second pattern located on the back side of the insulating film, the third pattern located on the front side and the insulating film A wireless IC tag having an IC chip,
One of the first pattern and the third pattern is an antenna pattern, the other is an antenna or wiring jumper pattern, and the second pattern is a wiring jumper pattern,
The film on the front side and the film on the back side are bonded together with the insulating film in between,
One end of each of the first pattern and the second pattern located on the back side of the insulating film is electrically connected to the IC chip,
The other end is a wireless IC tag characterized in that the other end is electrically connected to the third pattern formed on the front side of the insulating film within the through hole.

  The invention of the present claim is based on the invention of claim 6 which is an invention of a manufacturing method as an invention of a manufactured product.

In the present invention, since the patterns on the left and right sides of the substrate are formed at the same time, alignment is easy at the time of pattern formation, which leads to cost reduction at the time of formation.
In addition, the IC chip can be arranged and connected simply by dropping the IC chip into an insulating film that is thicker than the IC chip and has a through-hole formed at a predetermined position. Can connect.
Further, it is not necessary to compensate for the height of the IC chip and the pattern.
Further, in order to electrically connect the upper and lower patterns in the through hole, for example, a conductive substance (for example, solder grains) is dropped into the through hole of the insulating film and the whole is pressed and heated. This eliminates the need for an additional process such as conventional overbridge wiring and facilitates the work.

  Hereinafter, the present invention will be described based on the best mode. Note that the present invention is not limited to the following embodiments. Various modifications can be made to the following embodiments within the same and equivalent scope as the present invention.

(First embodiment)
In this embodiment, an antenna coil pattern is formed on each of the left and right halves of a base material, and an insulating film is interposed therebetween, and the IC chip and the antenna are connected vertically. Hereinafter, it demonstrates, referring drawings.

  FIG. 1 is a diagram showing a main part of an IC tag manufacturing process in the present embodiment. In this figure, reference numeral 10 denotes a base material in a state in which two base materials that overlap the upper and lower sides of the IC chip are integrated (a base material corresponding to the “integrated large base material” in claim 3. In the embodiment, 11 is the left half of the substrate, 21 is the coil pattern of the (total) half formed on the surface (the front side of the paper surface) of the left half of the substrate, and 23 Is an end located at the top in the drawing in the left half of the base material (hereinafter referred to as “upper side end”. The same applies to other patterns), and 25 is also the left side of the base material. The half is an end located on the lower side in the drawing (hereinafter referred to as “lower end”. The same applies to other patterns). 12 is the right half of the substrate 10, 22 is the (entire) half coil pattern formed on the surface (the front side of the drawing in the figure) in the right half of the substrate, and 24 is the upper end of the coil pattern. 26 is an end portion on the lower side, and 50 is a connection portion of the upper end portion. Reference numeral 19 denotes a recess formed by embossing at the center of the surface of the substrate 10. Reference numerals 31 and 33 are through holes for accommodating the solder grains and the IC chip respectively formed in the insulating film 30. Reference numeral 40 denotes an IC chip.

  However, the drawing is conceptually drawn so that the technical features of each part are easy to understand because it is difficult to see if drawn strictly. For this reason, the figure is not a proportional scale, and the two end portions 23, 24, 25, and 26 of the two coil patterns 21 and 22 are actually less likely to be subjected to bending stress. In addition, it is located near the outer periphery of the IC tag.

  As shown in (1) of FIG. 1, coil patterns 21 and 22 were formed by screen printing on the left half 11 and the right half 12 of the base material on which the concave portion 19 of the surface was formed, respectively. At this time, the two end portions 23 and 25 of the left half coil pattern 21 and the two end portions 24 and 26 of the right half coil pattern 22 are symmetrical with respect to the longitudinal center line of the substrate 10 in the drawing. The coil pattern 21 and the coil pattern 22 are not symmetrical at other positions.

In addition, the base material 10 is a heat-resistant paper having insulating properties in which the surface of glassine paper called baking paper is subjected to silicon processing, and has dimensions of 48 mm × 64 mm and a thickness of 100 μm. Note that the surface of the baking paper is peelable due to silicon processing. For this reason, the coil pattern was formed in the back surface. Therefore, the surface of the base material 10 is the back surface of the baking paper as a material.
The coil patterns 21 and 22 on the right half and the left half of the base material 10 are commercially available conductive paints, screen-printed using a 250-mesh stainless steel printing mask coated with 10 μm of emulsion, and in an atmosphere at 160 ° C. And was cured by heating for 30 minutes.

The formed coil patterns 21 and 22 have both line widths and intervals of 200 μm and thicknesses of 15 μm, both of which make five turns around the outer peripheral side of the left and right half base materials 11 and 12 (however, for the above reasons, In FIG. 1, it is drawn 2-3 times).
Since the used conductive paint can be soldered, a solder having a thickness of 7 μm was applied to the entire surface with a horizontal solder coater (not shown), thereby setting the electric resistance value to about 1/10. The solder used was lead-free solder of 96.5% tin and 3.5% silver.

As shown in (2) of FIG. 1, an insulating film 30 made of PET was placed on the upper surface of the left half base material 11, and four sides were thermocompression bonded using a hot sealer (electric iron). Note that the coil pattern 21 located below the insulating film 30 is indicated by a dotted line in FIG.
The insulating film 30 was made of a film having a thickness of 500 μm as a material in consideration of the thickness of the IC chip 40 placed on the coil pattern having a thickness of 15 μm being 400 μm and crushing at the time of thermocompression bonding. It should be noted that through holes 31 are formed in advance on the insulating film 30 at locations located on the upper and lower ends 23 and 25 of the coil pattern 21 formed on the surface of the left half base material 11 by punching. , 33 are formed. For this reason, in the state shown in FIG. 1 (2), a hole is formed in the portion of the insulating film 30.

As shown in FIG. 1 (3), after applying a conductive adhesive to the lower hole 33, the IC chip 40 is inserted into the upper hole 31, and solder grains (not shown) are inserted into the upper hole 31, On the insulating film 30 attached to the surface of the left half base material 11, the right half base material 12 is folded over and covered with the concave portion 19, and the whole is further removed using a hot roller in a reducing gas atmosphere. Was thermocompression bonded. In addition, since it turned up according to the recessed part 19, the up-and-down positioning was easy and accurate.
Next, the IC chip 40 is positioned up and down (through the direction perpendicular to the paper surface) and the lower and upper end portions 25 and 26 of the left and right coil patterns 21 and 22 located above and below the solder chips. The upper end portions 23 and 24 of the left and right coil patterns 21 and 22 were electrically connected to each other at a temperature that is locally solderable and lower than the heat-resistant temperature of the substrate 10.

At this time, since the film thickness of the insulating film 30 is originally 500 μm and the thickness of the IC chip 40 is only 400 μm, a light stroke, that is, a stroke is given so that reliable electrical contact is made. Then, thermocompression bonding was performed. Further, the connection portions 50 between the upper end portions 23 and 24 of the left and right half coil patterns 21 and 22 were similarly subjected to thermocompression bonding by giving a stroke.
When the crimping part was cooled and compared with a commercially available wireless IC tag of the same size, it showed excellent characteristics and communication distance.

(Second Embodiment)
In this embodiment, in the state shown in FIG. 1B in the first embodiment, an IC chip coated with a flux (paste) is applied to the lower hole 33, and a flux is applied to the upper hole 31. For example, a cut end (not shown) of thread solder is inserted, and for this reason, the lower end 25 of the left and right coil patterns 21 and 22 positioned above and below the IC chip. , 26 and the upper and lower end portions 23, 24 of the left and right coil patterns 21, 22 located above and below via the solder grains are connected to each other in the air in the first embodiment. Different.
In this embodiment, electrical connection is performed in the atmosphere. However, a good electrical connection can be obtained because the IC chip and solder grains are coated with a flux, as in the first embodiment. Excellent characteristics and communication distance were demonstrated.

(Third embodiment)
In this embodiment, in the state shown in FIG. 1 (1) in the first embodiment, the base material 10 without the concave portion 19 and having the left half and right half coil patterns 21 and 22 formed thereon, The left half base material 11 and the right half base material 12 are separated, and in the state shown in FIG. 1 (3), the right half base material 12 separated on the insulating film 30 is turned over and pasted. Different from the first embodiment.
Also in this embodiment, excellent characteristics and communication distance were exhibited.

(Fourth embodiment)
In this embodiment, the antenna has only one layer, and a wiring jumper is formed on the other half of the base material and the half of the half that is not cured to the electrical connection between the ends of the antenna and the wiring jumper. The point which utilizes indentation of a base material is different from the first embodiment.
FIG. 2 is a diagram showing the main part of the manufacturing process of the IC tag and the main part of the electrical connection in the present embodiment. In this figure, even if there is a slight difference in the configuration (things, structures, etc.) shown in FIG. 1 in the first embodiment and the formation position, shape, etc., the same components are basically given the same reference numerals. Therefore, the description thereof will be omitted, and only the characteristic part of the present embodiment will be described.

In FIG. 2, 27 is a wiring jumper, 28 is an upper end portion thereof, and 29 is an lower end portion thereof. Reference numerals 48 and 49 denote two connection terminals of the IC chip, and reference numeral 50 denotes a connection portion between the upper end 23 of the left coil pattern 21 and the upper end 28 of the wiring jumper 27. Reference numeral 60 denotes an ultrasonic vibration iron.
(1) and (3) in FIG. 2 correspond to (1) and (3) in FIG. 1, respectively. As shown in FIG. 2A, in the present embodiment, a wiring jumper 27 is formed on the right half of the base material in place of the antenna pattern 22 on the right half. Further, the upper end portion 28 and the lower end portion 29 of the wiring jumper 27 are located on the left half when the right half 12 is folded on the left half 11 of the substrate 10 with the left and right center lines being folded. The upper end portion 23 and the lower end portion 25 of the coil pattern 21 are formed so as to overlap each other. For this reason, the position of the upper end 23 of the coil pattern 21 in the left half 11 of the substrate 10 is different from that in the first embodiment.

As in (2) of FIG. 1 of the first embodiment, the left half 11 of the base material 10 is covered with the insulating film 30 from the state of (1) of FIG. The IC chip 40 was disposed in the lower hole among the two holes formed at the positions where two through-holes were fixed. However, no solder particles are arranged in the upper hole.
In this state, the right half 12 of the substrate 10 is folded on the insulating film 30, and the electrical connection of the IC chip 40 and the like and the thermocompression bonding of the three layers of film are the same as in the first embodiment. It is. This state is shown in the upper diagram of (3) in FIG.

  Further, as shown in the detail of the cross section of the A section shown on the left side of the lower side of (3) in FIG. 2, the IC chip 40 and two patterns above and below it, that is, the lower side of the coil pattern 21 and the wiring jumper 27 The electrical connection with the end portions 25 and 29 is the same as that of the first embodiment. That is, the IC chip 40 is electrically connected to the lower end portions 29 and 25 of the two patterns 27 and 21 through the two connection terminals 48 and 49 on the ceiling and bottom thereof.

However, as shown in the right B section cross-sectional view, the connection method between the upper end 23 of the left coil pattern 21 and the upper end 28 of the wiring jumper 27 is different. That is, as shown in the figure, the through hole 31 of the insulating film 30 is heated while the contact portion is locally heated by friction using the ultrasonic vibrating iron 60 from above the right half base material 12 by folding. Is pushed together with the wiring jumper 27 formed on the inner surface thereof, and the upper end portion 28 of the wiring jumper 27 is placed on the upper side of the coil pattern 21 below it. Electrical connection is made to the end 23 by thermal fusion.
Also in this embodiment, excellent characteristics and communication distance were exhibited.

(Fifth embodiment)
This embodiment is the same as the first embodiment in that the antenna has two upper and lower layers, but the electrical connection with the IC chip is only one of the upper and lower sides, or the left and right half base materials Therefore, not only the antenna but also the wiring jumper pattern is formed on the half of the base material on the side where electrical connection is made, and there are a total of three through-holes formed in the insulating film. This is different from the previous embodiments.

FIG. 3 is a diagram showing the main part of the manufacturing process of the IC tag and the main part of electrical connection in the present embodiment. In this figure as well, even if there are some differences in the configuration (things, structures, etc.) shown in FIG. 1 in the first embodiment and in FIG. Specifically, the description of the same configuration is omitted by assigning the same reference numeral, and only the characteristic part of the present embodiment will be described.
(1) and (3) in FIG. 3 correspond to FIG. 1 or (1) and (3) in FIG. 2, respectively. Further, the left and right views under (3) in FIG. 3 correspond to the left and right views under (3) in FIG.
In FIG. 3, reference numeral 41 denotes an IC chip having two connection terminals 48 and 49 only on either one (lower side in the drawing), and 59 is a conductive resin inside the through hole.

As shown in FIG. 3 (1), a coil pattern 21 and a wiring jumper pattern 27 are formed on the left half 11 of the substrate 10. At this time, the distance between the lower end 25 of the coil pattern 21 and the upper end 28 of the wiring jumper 27 matches the dimension between the two connection terminals 48 and 49 of the IC chip.
Further, the upper end 24 and the lower end 26 of the coil pattern 22 formed on the right half 12 of the base 10 are respectively connected to the right half 12 of the base 10 and the recesses 19 at the left and right centers of the base 10. When the sheet is folded on the left half 11 of the substrate, the upper end 23 of the coil pattern 21 and the lower end 29 of the wiring jumper 27 are overlapped with each other.

In the same manner as shown in FIG. 1 (2) of the first embodiment, the insulating film 30 is aligned and covered on the left half 11 of the base material, and the left half 11 and the four circumferences of the base material are heat-sealed. To do. After that, an anisotropic conductive resin is applied in a hole formed by a through hole located between the lower end portion 25 of the coil pattern 21 and the upper end portion 28 of the wiring jumper pattern 27. The IC chip 41 having the connection terminals 48 and 49 on the same side is aligned and fixed, and the remaining two holes are filled with the conductive resin 59.
Under this, similarly to the first embodiment, the lower end 25 of the IC chip 41 and the left half coil pattern 21, the upper end 28 of the wiring jumper 27, and the through hole are provided above and below. Electrical connection between the ends of the pattern is performed, and three layers of resin are heat-sealed.

FIG. 3 (3) shows this state. As shown in the left cross-sectional detail view of the A section below (3) in FIG. 3, the electrical connection of the two connection terminals 48 and 49 of the IC chip 41 is on the lower side (on the left half). A lower end 25 of the coil pattern 21 formed on the substrate 11 and an upper end 28 of the wiring jumper pattern 27 are formed.
Also, as shown in the detailed cross-sectional view of the B section on the right below (3) in FIG. 3, the upper and lower patterns are connected to each other through the through hole of the insulating film 30 by the conductive material filled in the through hole. It is made of a sex substance 59.

(Sixth embodiment)
This embodiment is a wireless IC tag as a product.
The wireless IC tags of the first to fifth embodiments are only for explaining the portions related to the present invention, and may not necessarily be sufficient as an IC tag as a product or a product. It is completed through several steps as necessary. FIG. 4 shows the wireless IC tag in this state. The upper diagram of FIG. 4 is a diagram conceptually showing a cross section of the wireless IC tag manufactured by the method described in the first embodiment, while the wiring diagram and the like are different.

In FIG. 4, 55 is a capacity (condenser), 71 is a front decorative plate, and 72 is a back decorative plate.
This wireless IC tag has a capacitor 55 on the front and back sides of the central insulating film 30 so that the antenna has a resonance frequency in conformity with the standard. The pattern of the capacitor 55 is formed on the left and right sides 11 and 12 of the substrate 10 by printing simultaneously with the antenna patterns 21 and 22.

The front and back decorative plates 71 and 72 are each made of a hard resin having a thickness of about 0.3 mm. In the first to fifth embodiments, three layers of films are bonded to each other, and an IC chip or an electric The wireless IC tag at the stage where the general connection is completed, that is, is adhered to the upper and lower surfaces of the wireless IC tag at the stage shown in FIG. 1 to FIG.
However, in the upper diagram of FIG. 4, a picture pattern for imparting aesthetics is omitted, and an internal antenna and a capacity are indicated by dotted lines or the like.

It is a figure which shows the principal part of the manufacturing process of the IC tag in the 1st Embodiment of this invention. It is a figure which shows the principal part of the manufacturing process of the IC tag in the 4th Embodiment of this invention, and the principal part of electrical connection. It is a figure which shows the principal part of the manufacturing process of the IC tag in the 5th Embodiment of this invention, and the principal part of electrical connection. It is a figure which shows notionally the completion state as a product of the IC tag in the 1st Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Base material 11 Left half base material 12 Right half base material 19 Concave (embossed) part 21 Left half coil pattern 22 Right half coil pattern 23 Upper end 24 of left half coil pattern Right half coil Upper end 25 of the pattern Lower end 26 of the left half coil pattern Lower end 27 of the right half coil pattern Wiring jumper pattern 28 Upper end 29 of the wiring jumper Lower wiring jumper Side end 30 Insulating film 31 Through hole (hole)
33 Through hole (hole)
40 IC chip (up / down connection)
41 IC chip (one side connection)
48 IC chip connection terminal 49 IC chip connection terminal 50 Connection portion 55 at the upper end 55 Capacitance 59 Conductive resin 60 Ultrasonic vibrating iron 71 Decorative plate (front side)
72 Decorative plate (back side)

Claims (13)

A method of manufacturing a wireless IC tag in which a pattern is formed on an upper surface side and a lower surface side of an insulating film,
A pattern forming step of forming a pattern on two substrates so that both ends of both patterns coincide when the other substrate is superimposed on one substrate;
A cover for covering and fixing an insulating film having a thickness equal to or greater than that of the IC chip on the upper side of one substrate on which the pattern is formed, each having a through hole formed at a position corresponding to two ends of the pattern A fixed step;
An application step of applying either solder, thermoplastic conductive adhesive resin or thermosetting conductive adhesive resin on the pattern at a position corresponding to two ends of the pattern;
An installation step of installing an IC chip in one of the two through holes of the insulating film after the covering fixing step;
A stacking step of stacking the other substrate on the insulating film in the state in which the installation step has been performed;
In the state in which the overlapping step has been performed, the whole is pressed and heated to bond the one base material, the insulating film, and the other base material into an integrated film, and
After the overlapping step is performed, a connection step in which both patterns are electrically connected to the IC chip at one end thereof and electrically connected to each other at the other end, and
A method of manufacturing a wireless IC tag, comprising: The pattern forming step includes
The antenna pattern is formed on both of the base materials so that the direction of the magnetic field coincides when both sides of the base material are stacked up or down, or
An antenna pattern is formed on one substrate, and a wiring jumper pattern is formed on the other substrate.
The method of manufacturing a wireless IC tag according to claim 1, wherein the method is any one of the above.   The pattern forming step is to form a pattern of each base material on both the left and right sides of the one large base material in a state where the one base material and the other base material are a single large base material. 3. The method of manufacturing a wireless IC tag according to claim 1, wherein the wireless IC tag is provided. In the pattern forming step, the one base material and the other base material are bent on the left and right sides of a large base material in a state where the one base material and the other base material are integrated into a large base material, The pattern is formed so that both ends of both patterns coincide when the side is overlapped with the other side,
4. The wireless IC according to claim 3, wherein in the superimposing step, the other base material is superposed on the insulating film in a state where the installation step is performed by folding the predetermined straight line. 5. Tag manufacturing method. In the pattern forming step, the one base material and the other base material are bent on the left and right sides of a large base material in a state where the one base material and the other base material are integrated into a large base material, The pattern is formed so that both ends of both patterns coincide when the side is overlapped with the other side,
The stacking step is characterized in that the other base material is separated from the predetermined straight line, turned upside down, aligned and stacked on the insulating film in the state in which the installation step has been performed. Item 4. A method for manufacturing a wireless IC tag according to Item 3. A method of manufacturing a wireless IC tag in which a first pattern and a second pattern are formed on one of an upper surface side and a lower surface side of an insulating film, and a third pattern is formed on the other.
Each on the left and right sides of the substrate,
The first pattern and the second pattern are formed on either side (left side or right side) so that the IC chip can be electrically connected between both ends,
The third pattern is formed on the other side (the right side or the left side), and the first pattern and the second pattern formed on the base material on the one side when both ends are overlapped on the one side. Formed to match each end of the pattern that is not electrically connected to the IC chip,
One of the first pattern and the third pattern is an antenna pattern, the other is an antenna or wiring jumper pattern, and the second pattern is a wiring jumper pattern,
Furthermore, if the first pattern and the third pattern formed on the left side and the right side of the substrate are both antenna patterns, a pattern forming step is performed so that the direction of the magnetic field is the same.
On one side of the base material, a position where the IC chip is electrically connected and a position where the IC chip of the first pattern and the second pattern are not electrically connected to each other A covering fixing step of covering and fixing an insulating film having a total of three through-holes and having a thickness equal to or greater than that of the IC chip;
An application step of applying either solder, thermoplastic conductive adhesive resin or thermosetting conductive adhesive resin on the pattern at a position corresponding to the two ends of each pattern;
An installation step of installing an IC chip in a through-hole corresponding to a location where the first and second patterns of the insulating film after the covering and fixing step are electrically connected to the IC chip;
A step of superimposing the other side (right side or left side) of the base material on the insulating film in the state in which the installation step has been performed;
In the state in which the overlapping step has been performed, the whole is pressed and heated, and an adhesion step to form a film having a structure in which one side of the substrate, the insulating film, and the other side of the substrate are integrated,
After the overlapping step is performed, the ends of the first pattern and the second pattern, the IC chip, and the ends of the pattern positioned above and below through the two through holes are electrically connected to each other. A wireless IC tag manufacturing method comprising: a connecting step of connecting. The pattern forming step is such that when the one side is folded on the left side and the right side of the base material about a predetermined straight line and one side is overlapped with the other side, both ends of both patterns coincide. To form a pattern,
The said superimposing step is to superimpose the other side of the base material on the insulating film in a state where the installation step has been performed by folding the predetermined straight line. A method of manufacturing a wireless IC tag. The pattern forming step is such that when the one side is folded on the left side and the right side of the base material about a predetermined straight line and one side is overlapped with the other side, both ends of both patterns coincide. To form a pattern,
The stacking step is characterized in that the other side of the base material is cut off from the predetermined straight line, turned over, and aligned and stacked on the insulating film in the state in which the installation step has been performed. A method of manufacturing a wireless IC tag according to claim 6.   9. The method of manufacturing a wireless IC tag according to claim 1, wherein the base material is made of paper.   A wireless IC tag manufactured by the method according to claim 1. A wireless IC tag having a front side film, an insulating film, a back side film, an antenna pattern located on the front side and the back side of the insulating film, and an IC chip installed in a through hole of the insulating film,
The film on the front side and the film on the back side are bonded together with the insulating film in between,
The antenna pattern located on the front side of the insulating film and the antenna pattern located on the back side have the same magnetic field direction,
Furthermore, both ends are electrically connected to the IC chip,
The other end is electrically connected to each other in a through-hole formed in the insulating film. The front side film, the insulation film, the back side film, the antenna pattern located on the front side of the insulation film, the wiring jumper pattern located on the back side, and the IC chip installed in the through hole of the insulation film A wireless IC tag comprising:
The film on the front side and the film on the back side are bonded together with the insulating film in between,
One end of each of the antenna pattern located on the front side of the insulating film and the wiring jumper pattern located on the back side is electrically connected to the IC chip,
The other end is electrically connected to each other in a through-hole formed in the insulating film. Installed in the through hole of the front side film, the insulating film, the back side film, the first pattern and the second pattern located on the back side of the insulating film, the third pattern located on the front side and the insulating film A wireless IC tag having an IC chip,
One of the first pattern and the third pattern is an antenna pattern, the other is an antenna or wiring jumper pattern, and the second pattern is a wiring jumper pattern,
The film on the front side and the film on the back side are bonded together with the insulating film in between,
One end of each of the first pattern and the second pattern located on the back side of the insulating film is electrically connected to the IC chip,
The other end is electrically connected to the third pattern formed on the front side of the insulating film within the through hole.

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